All-metal tab composite copper foil and preparation method thereof

Abstract

The invention relates to the technical field of lithium battery materials, in particular to an all-metal tab composite copper foil and a preparation method thereof.The preparation method of the all-metal tab composite copper foil comprises the following steps that S1, a pure copper foil tab is prepared, conductive adhesive is printed on the pure copper foil tab in a rolling mode, and a conductive coating is formed; s2, plating a copper seed layer on the conductive coating and the side edge of the pure copper foil tab; s3, the side, with the conductive coating, of the pure copper foil tab is attached to the preset tab area of the composite copper foil in an aligned mode; and S4, performing water plating copper layer treatment on the two surfaces of the composite copper foil, and forming an integrated copper layer with the pure copper foil tab. The integrated connection of the pure copper foil tab and the composite copper foil is realized, the welding process required by the traditional connection of the composite copper foil tab is avoided, the investment of welding equipment and the consumption of welding materials are reduced, the process time related to welding is also saved, in addition, the problem of edge curl caused by the traditional tab welding is also avoided, and the production efficiency is improved. And the flatness and the consistency of the product are improved.

Description

Technical Field

[0001] This invention relates to the field of lithium battery materials technology, and in particular to an all-metal tab composite copper foil and its preparation method. Background Technology

[0002] In recent years, with the rapid development of new energy vehicles and portable electronic devices, lithium batteries, as core energy storage components, have seen performance optimization and cost control become a focus of industry attention. Composite copper foil, due to its advantages such as lightweight, high energy density, high safety, and low cost, has gradually become an ideal alternative to traditional pure copper foil. Composite copper foil typically uses a polymer substrate as the intermediate layer, depositing copper layers on both sides of the substrate through magnetron sputtering and electroplating processes, forming a "metal-polymer-metal" sandwich structure. This structure not only reduces battery weight but also improves battery energy density and safety.

[0003] However, composite copper foil still faces certain technical bottlenecks in practical applications. Due to the insulating properties of the polymer substrate, the copper layers on both sides of the composite copper foil are independent and cannot be directly conductive. In the lithium battery electrode tab welding process, traditional methods require welding both copper layers separately, which not only increases process time and production costs but also makes it difficult to improve yield due to the complexity of the welding process. Furthermore, the thermal stress generated during welding may cause delamination between the copper layer and the polymer substrate, further affecting the reliability and consistency of the battery.

[0004] Therefore, there is an urgent need for a new type of composite copper foil structure and its preparation method, which can fundamentally solve the problem of electrode tab welding, simplify the production process, and improve battery manufacturing efficiency and product yield. Summary of the Invention

[0005] The purpose of this invention is to solve the problem that the existing composite copper foil production process involves an additional electrode tab welding process, which increases both the process time and the process cost. This invention provides an all-metal electrode tab composite copper foil and its preparation method. By using pure copper foil electrode tabs to bond with the composite copper foil through a conductive coating on the bottom, combined with the evaporated copper layer on the side and the water-plated copper layer on the composite copper foil, an integrated connection between the pure copper foil electrode tabs and the composite copper foil is achieved, avoiding the welding process required for the connection of electrode tabs in traditional composite copper foils.

[0006] To achieve the above objectives, the present invention proposes a method for preparing an all-metal tab composite copper foil, comprising the following steps: S1, preparing pure copper foil tabs and rolling conductive adhesive onto the pure copper foil tabs to form a conductive coating; S2, plating a copper seed layer onto the conductive coating and the sides of the pure copper foil tabs; S3, aligning and attaching the side of the pure copper foil tab with the conductive coating to the preset tab area of ​​the composite copper foil; S4, performing water-plating copper layer treatment on both sides of the composite copper foil to form an integral copper layer with the pure copper foil tab.

[0007] As a further description of the above technical solution: In step S2, a copper seed layer is deposited on the side of the conductive coating and the pure copper foil tab by vapor deposition to form a vapor-deposited copper layer.

[0008] As a further description of the above technical solution: In step S2, after a copper seed layer is plated on the side of the conductive coating and the pure copper foil tab, acid-resistant ink is flexographically printed onto the surface of the pure copper foil tab away from the conductive coating.

[0009] As a further description of the above technical solution: In step S3, an acid-resistant ink coating for subsequent copper growth is formed on the surface of the composite copper foil A, and a mesh-like blank area is formed on the acid-resistant ink coating.

[0010] As a further description of the above technical solution: In step S4, a mesh support structure layer connected to the copper seed layer is formed on the A side of the composite copper foil, and a water-plated copper layer connected to the pure copper foil tab is formed on the B side of the composite copper foil.

[0011] As a further description of the above technical solution: In step S4, the top of the mesh support structure layer and the top of the pure copper foil tab are on the same horizontal plane.

[0012] As a further description of the above technical solution: In step S3, the composite copper foil is first subjected to double-sided magnetron copper plating by a substrate roll film, and then double-sided water plating of a long copper layer.

[0013] A composite copper foil with all-metal tabs includes a composite copper foil and pure copper foil tabs. The bottom of the pure copper foil tabs is provided with a conductive coating that adheres to the composite copper foil. The sides of the pure copper foil tabs and the conductive coating are provided with vapor-deposited copper layers that are connected to the composite copper foil. A mesh-like support copper layer connected to the vapor-deposited copper layer is formed on the composite copper foil. The pure copper foil tabs are formed with a first water-plated copper layer that is connected to the conductive coating and the composite copper foil.

[0014] As a further description of the above technical solution: the composite copper foil includes a substrate layer, magnetron plating layers are formed on both sides of the substrate layer, and a second water-plated copper layer is formed on the side of the magnetron plating layers.

[0015] The above technical solution has the following advantages or beneficial effects:

[0016] This invention provides a pure copper foil tab that is bonded to a composite copper foil via a conductive coating on the bottom. Combined with a vapor-deposited copper layer on the side and a water-plated copper layer on the composite copper foil, this achieves an integrated connection between the pure copper foil tab and the composite copper foil. This avoids the welding process required for traditional composite copper foil tab connections. This not only reduces the investment in welding equipment and the consumption of welding materials, but also saves time associated with welding processes, significantly reducing production costs. The tab is directly bonded to the copper layer of the composite copper foil via a conductive coating, and then connected to the composite copper foil via a vapor-deposited copper layer, forming a double-sided low-resistance conductive structure. Compared to the welding process, the resulting tab is flat and bonded to the composite copper foil, improving product yield. In addition, it reduces interface contact resistance, thereby reducing battery internal resistance and improving energy conversion efficiency. Attached Figure Description

[0017] Figure 1 This is a flowchart illustrating a method for preparing an all-metal tab composite copper foil according to one embodiment of the present invention.

[0018] Figure 2 This is a flowchart illustrating the fabrication process of pure copper foil tabs in one embodiment of the present invention.

[0019] Figure 3 This is a flowchart illustrating the fabrication process of an all-metal tab composite copper foil in one embodiment of the present invention.

[0020] Figure 4 This is a schematic diagram of the structure of an all-metal tab composite copper foil in one embodiment of the present invention;

[0021] Figure 5 This is a comparative schematic diagram of an all-metal tab composite copper foil roll in one embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of the cutting of an all-metal tab composite copper foil roll in one embodiment of the present invention. Figure 1 ;

[0023] Figure 7 This is a schematic diagram of the cutting of an all-metal tab composite copper foil roll in one embodiment of the present invention. Figure 2 .

[0024] Legend:

[0025] 1. Composite copper foil; 101. Substrate layer; 102. Magnetron plating layer; 103. Second water-plated copper layer; 2. Pure copper foil tabs; 3. Conductive coating; 4. Evaporated copper layer; 5. Mesh support copper layer; 6. First water-plated copper layer; 7. Acid-resistant ink; 8. Acid-resistant ink coating; 9. Mesh support structure layer. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] In the description of this invention, it should be noted that the terms "vertical," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0028] Please see Figure 1-3 The present invention provides a technical solution: a method for preparing an all-metal tab composite copper foil, comprising the following steps: S1, preparing a pure copper foil tab 2, and roller printing conductive adhesive on the pure copper foil tab 2 to form a conductive coating 3; S2, depositing a copper seed layer on the side of the conductive coating 3 and the pure copper foil tab 2 to form a side-mounted copper layer 4; S3, aligning and attaching the side of the pure copper foil tab 2 with the conductive coating 3 to the preset tab area of ​​the composite copper foil 1; S4, performing water-plating copper layer treatment on both sides of the composite copper foil 1 to form an integral copper layer with the pure copper foil tab 2.

[0029] In the technical solution of this invention, the pure copper foil tab 2 is bonded to the composite copper foil 1 through the conductive coating 3 at the bottom, and combined with the evaporated copper layer 4 on the side and the water-plated copper layer on the composite copper foil 1, an integrated connection with the composite copper foil 1 is achieved, avoiding the welding process required for the connection of the traditional composite copper foil tab. This not only reduces the investment in welding equipment and the consumption of welding materials, but also saves the time of welding-related processes, and significantly reduces production costs. The tab is directly bonded to the copper layer of the composite copper foil 1 through the conductive coating 3, and then connected to the composite copper foil 1 through the evaporated copper layer 4, forming a double-sided low-resistance conduction. Compared with the welding process, the formed tab is flat and bonded to the composite copper foil, which improves the product yield. In addition, it also reduces the interface contact resistance, thereby reducing the internal resistance of the battery and improving the energy conversion efficiency.

[0030] Specifically, steps S1 to S4 are closely linked, forming a continuous production chain from the pretreatment of the pure copper foil tabs to the preparation of the side copper seed layer, and then to the integrated bonding and water plating. This reduces redundant operations during process transitions, significantly improves output efficiency per unit time, and lays the foundation for cost advantages in large-scale mass production. In S1, the roller-printed conductive coating 3 not only achieves the initial bonding between the pure copper foil tabs 2 and the composite copper foil 1, but also provides the basis for subsequent conductivity. In S2, the preparation of the side copper seed layer constructs a conductive bridge between the tabs and the composite copper foil. The double-sided water plating treatment in S4 forms a solid integrated copper layer through the mesh support structure layer 9 and the first water-plated copper layer 6. This "multi-level connection" avoids problems such as thermal stress damage and excessive contact resistance that may occur during welding processes, ensuring uniform and stable current conduction, reducing safety hazards caused by connection failures during battery use, and improving the long-term reliability of the product. From the uniform roller printing of the conductive coating in S1, to the precise deposition of the copper seed layer in S2, and then to the alignment and attachment of the tabs and composite copper foil in S3, each step can be precisely controlled through process parameters. In particular, the mesh support structure layer formed by double-sided water plating and the first water-plated copper layer in S4 can control the copper layer growth area through the preset pattern of the acid-resistant ink coating, ensuring the flatness of the tabs and composite copper foil surfaces. This avoids the problem of poor product consistency caused by manual operation or equipment errors in traditional processes, thus improving product yield.

[0031] like Figure 2 and Figure 3 As shown, in step S2, a copper seed layer is deposited on the sides of the conductive coating 3 and the pure copper foil tab 2 using vapor deposition, forming a vapor-deposited copper layer 4. Vapor deposition can form a uniform, dense, and strongly adherent vapor-deposited copper layer 4 on the sides of the conductive coating 3 and the pure copper foil tab 2. This copper layer has high purity and fine crystals, forming a stable bond with the substrate, providing a high-quality conductive substrate and connection foundation for subsequent water-plated long copper. The vapor deposition process can more precisely control the copper layer thickness, avoiding current conduction differences caused by uneven thickness, ensuring a continuous and stable conductive path between the subsequent water-plated copper layer and the tab and composite copper foil, significantly improving the overall structural connection reliability. The whole-roll furnace operation eliminates the need for frequent unwinding and rewinding operations, reducing time loss and equipment debugging frequency during process transitions, enabling continuous and efficient vapor deposition, and significantly improving operational efficiency. Simultaneously, whole-roll processing allows for simultaneous processing of large batches of materials, reducing energy consumption and labor costs per unit product, which is beneficial for large-scale production.

[0032] like Figure 2 and Figure 3As shown, in step S2, after a copper seed layer is plated on the sides of the conductive coating 3 and the pure copper foil tab 2, acid-resistant ink 7 is flexographically printed onto the surface of the pure copper foil tab 2 away from the conductive coating 3. Using the acid-resistant ink 7 as a shielding layer, the surface of the pure copper foil tab 2 away from the conductive coating 3 is precisely covered, preventing copper ions from depositing in this area during subsequent water plating processes. This avoids abnormal thickness increases on the surface of the pure copper foil tab due to extra copper, ensuring the dimensional accuracy and structural integrity of the tab itself. Simultaneously, it prevents stray conductive paths formed by excess copper layers, ensuring the directionality and stability of current conduction between the tab and the composite copper foil, and avoiding uneven resistance or overheating problems caused by excessively thick local copper layers.

[0033] like Figure 2 and Figure 3 As shown, in step S3, an acid-resistant ink coating 8 for subsequent copper growth is formed on surface A of the composite copper foil 1, and a mesh-like blank area is formed on the acid-resistant ink coating 8. In step S4, a mesh-like support structure layer 9 connected to the copper seed layer is formed on surface A of the composite copper foil 1, and a first water-plated copper layer 6 connected to the pure copper foil tab 2 is formed on surface B of the composite copper foil 1.

[0034] Specifically, the mesh support structure layer 9 on side A connects to the copper seed layer, precisely filling the height difference between the pure copper foil tab 2 and the composite copper foil 1, ensuring that their tops are on the same horizontal plane. This solves the problem of edge curling during winding due to height differences after traditional tab welding, avoiding potential wrinkles and damage during customer processing. It also enhances the overall flatness of the composite copper foil, ensuring consistency in subsequent battery assembly. Furthermore, the mesh structure reduces copper usage while maintaining support strength, further balancing the needs of lightweighting and cost control.

[0035] The first water-plated copper layer 6 on side B is directly connected to the pure copper foil tab 2, while simultaneously forming a continuous conductive path with the copper layer of the composite copper foil 1 itself. Compared to the potential problems of high contact resistance and unstable connections in traditional welding processes, this integrated copper layer formed by water plating eliminates interface gaps, allowing current to be efficiently conducted between the tab and the composite copper foil, reducing energy loss. At the same time, the first water-plated copper layer is tightly bonded to the pure copper foil tab, conductive coating, and composite copper foil, providing stronger resistance to mechanical stress and reducing the risk of connection failure due to vibration and temperature changes during long-term use, thus improving battery reliability. The mesh support structure layer on side A focuses on structural support and flatness adjustment, while the first water-plated copper layer on side B focuses on conductive connection and current conduction; their functions are clearly defined yet synergistic. This satisfies both the mechanical connection stability of the tab and the composite copper foil and ensures efficient electrical performance, enabling the all-metal tab composite copper foil to achieve a balance between conductivity and structural strength while maintaining lightweight and high safety.

[0036] Both the mesh support structure layer on side A and the first water-plated copper layer on side B are formed using a water-plating process. This allows for seamless integration with processes such as magnetron plating and vapor deposition, enabling roll-to-roll continuous production. During the water-plating process, the copper layer growth area (such as the mesh blank area on side A) is controlled by a pre-set acid-resistant ink coating, precisely achieving the formation of the target structure. This process offers high stability, improving product yield and mass production efficiency while reducing the cost of large-scale production.

[0037] Specifically, acid-resistant ink 8 of a specific shape is first printed on side A of the composite copper foil 1. After curing, a long copper mesh support structure layer 9 is formed in the blank area to achieve a support function. Then, the acid-resistant ink is removed by alkaline washing. The specific printed pattern is not limited.

[0038] In this design, the top of the mesh support structure layer 9 and the top of the pure copper foil tab 2 are on the same horizontal plane. For example... Figure 2 and Figure 3 As shown, in step S3, the composite copper foil 1 is formed by first performing double-sided magnetron copper plating on the substrate roll film, followed by double-sided water plating of long copper. Magnetron copper plating provides a high-quality substrate for subsequent water plating, ensuring the adhesion of the copper layer. Water plating of long copper efficiently thickens the copper layer, balancing conductivity and cost. The two copper plating processes are synergistically optimized to meet the requirements of all-metal tab connections. Both the double-sided magnetron copper plating and double-sided water plating of long copper on the substrate roll film can be carried out in a roll-to-roll continuous production mode, forming a continuous production line with subsequent processes such as attaching pure copper foil tabs and water plating. This process compatibility not only reduces material loss and time waste during process conversion, but also enables stable process parameter control through whole-roll operation, improving product yield and production efficiency, and providing strong support for large-scale mass production.

[0039] Specifically, the steps for manufacturing an all-metal electrode composite copper foil roll with a specification of 20mm electrode tabs and 260mm composite copper foil are as follows:

[0040] 1. Prepare two rolls of pure copper foil tabs, each 44mm wide and 4μm thick. Apply conductive adhesive to both sides using a roller coating machine, rolling them together. The conductive adhesive needs to have good adhesion to the copper foil and be stable in an electrochemical environment. Epoxy resin is recommended as the matrix, with copper powder and carbon nanotubes as the main conductive fillers, as these materials are relatively inexpensive and stable. Recommended parameters: conductivity less than 10⁻⁴ Ω / cm, adhesion greater than 10MPa, temperature range: -40℃~120℃, viscosity 2000-5000cps; roller coating speed 120m / min, unwinding tension 80N (adjustable rewinding tension by the machine), coating width 2mm, coating thickness 1μm.

[0041] 2. The pure copper foil roll with conductive adhesive on both sides is fed into a rotating umbrella frame evaporation coating machine for side copper evaporation. The evaporation method is electron beam heating evaporation. The crucible is made of graphite. The evaporation rate is 3nm / second, the voltage is 8KV, the current is 250mA, and the copper plating thickness is 1μm. After the A side is evaporated, the roll is reversed and the B side is evaporated.

[0042] 3. Take the pure copper foil roll with copper vapor-plated on both sides, roll it with acid-resistant ink on the non-conductive adhesive side, covering 100% of the area. The acid-resistant ink viscosity is 1500 cps, the linear speed is 30 m / min, the winding and unwinding tension is 100 N, and the UV curing energy is 8000 MJ / cm. 2 ;

[0043] 3. Prepare a roll of substrate with a width of 1350mm and a thickness of 4.5μm. Load the substrate into the roll-to-roll magnetron coating machine to perform copper plating on the A / B sides as a base. Each A / B side is plated with 50nm thick copper. The running speed is 20m / min. There are 14 copper targets on each side. The total power is controlled at 120kw. The ion source cleaning voltage is 700V.

[0044] 4. The copper-plated film roll is fed to the water plating line. The A / B sides are water-plated for the first time to quickly thicken the copper layer. The thickness of the A / B sides is increased to 300nm. The unwinding tension is 90N, the winding tension is 80N, the speed is 20m / min, and the total current of the rectifier is 5500A.

[0045] 5. Load the water-plated roll material into the roller coating machine, and apply acid-resistant ink to side A according to the required pattern. The printing thickness is 6μm, the linear speed is 15m / min, the winding and unwinding tension is 100N, and the UV curing energy is 10000MJ / cm. 2 ;

[0046] 6. Load the coated composite copper foil into the slitting machine. First, cut off the area where the pure copper foil tabs need to be attached. Then attach the pure copper foil tabs to the composite copper foil according to the corresponding size. The equipment running speed is 20m / min, the unwinding tension is 100N, and the winding tension can be adjusted adaptively by the equipment. The attachment roller temperature is 100℃.

[0047] 7. The attached composite copper foil is fed to the water plating line for secondary water plating. A second copper layer is applied to the A / B sides. The non-ink area of ​​the A side is thickened to 4μm. The thickness of the B side is increased by 600nm on top of the 300nm thickness from the first water plating. Adding the base layer thickness, the total thickness reaches 950nm. The power of each copper layer area needs to be adjusted according to actual requirements to ensure the copper layer on the A / B sides reaches the ideal thickness. The height of the A side should be as close as possible to the full-tab copper foil. After cleaning, the copper layer immediately enters the alkaline washing tank to remove the acid-resistant ink. A 5% sodium hydroxide aqueous solution is used as the alkaline washing solution. Immersion for 1-2 minutes at 60℃ is sufficient. The water plating line has an unwinding tension of 80N, a rewinding tension of 70N, a speed of 10m / min, and a total rectifier current of 4500A.

[0048] 8. Finally, feed the material into the precision slitting machine for slitting and winding. There are 5 slitting circular blades, each spaced 280mm apart. The cutting speed is 50m / min, the machine running speed is 80m / min, the unwinding tension is 100N, and the winding tension can be adjusted adaptively by the machine.

[0049] 9. Obtain 4 rolls of 20mm*260mm wide all-metal tab composite copper foil.

[0050] like Figure 4-5 As shown, an all-metal tab composite copper foil includes a composite copper foil 1 and a pure copper foil tab 2. The bottom of the pure copper foil tab 2 is provided with a conductive coating 3 that is attached to the composite copper foil 1. The sides of the pure copper foil tab 2 and the conductive coating 3 are provided with a vapor-plated copper layer 4 that is connected to the composite copper foil 1. A mesh support copper layer 5 connected to the vapor-plated copper layer 4 is formed on the composite copper foil 1. The pure copper foil tab 2 is formed with a first water-plated copper layer 6 that is connected to the conductive coating 3 and the composite copper foil 1.

[0051] Specifically, the pure copper foil tab 2 is bonded to the composite copper foil 1 through the conductive coating 3 at the bottom. Combined with the vapor-deposited copper layer 4 on the side, the mesh support copper layer 5 on the composite copper foil 1, and the first water-plated copper layer 6 formed by the pure copper foil tab 2, an integrated connection with the composite copper foil 1 is achieved. This completely avoids the welding process required for the connection of traditional composite copper foil tabs. This not only reduces the investment in welding equipment and the consumption of welding materials, but also saves the time of welding-related processes, greatly reducing production costs and improving production efficiency.

[0052] The multiple connections achieve a more stable bond, effectively preventing loosening or detachment of the connections and improving the overall structural reliability. Furthermore, the mesh-like support copper layer 5 precisely fills the height difference between the composite copper foil 1 and the pure copper foil tab 2, keeping the copper foil surface flat overall. This solves the problem of edge curling during winding due to height differences after traditional tab welding, facilitating subsequent processing by the client and ensuring consistency in battery production.

[0053] The vapor-deposited copper layer 4, the mesh-supported copper layer 5, and the first water-plated copper layer 6 form a continuous and unobstructed conductive path, ensuring efficient current conduction between the composite copper foil 1 and the pure copper foil tab 2. Simultaneously, the synergistic effect of each copper layer and the conductive coating 3 reduces contact resistance and avoids problems such as localized heating, contributing to stable energy output and lifespan of the lithium battery.

[0054] like Figure 1 and Figure 2 As shown, the composite copper foil 1 includes a substrate layer 101, with magnetron sputtering layers 102 formed on both sides of the substrate layer 101, and a second water-plated copper layer 103 formed on the side of the magnetron sputtering layers 102. The substrate layer 101 is made of a polymer material, which can significantly reduce the overall weight of the composite copper foil. At the same time, the polymer substrate itself has good insulation properties, which can effectively isolate the copper layers on both sides, avoid the risk of short circuit, and provide a basic guarantee for battery safety. The magnetron sputtering layer 102 formed by the magnetron sputtering process has a uniform thickness and high density, and can adhere tightly to the surface of the substrate layer 101, providing a good conductive substrate for subsequent water electroplating processes. Its uniform conductivity ensures that the current is evenly distributed in the composite copper foil. The second water-plated copper layer 103, formed by electroplating on the basis of the magnetron plating layer 102, can further increase the copper layer thickness, reduce the overall resistance of the composite copper foil, improve conductivity, and ensure efficient electron conduction during high-current charging and discharging of lithium batteries. The "substrate layer-magnetron plating layer-second water-plated copper layer" structure of the composite copper foil 1 achieves an organic combination of lightweight, high safety, excellent conductivity and structural stability. It not only retains the core advantages of composite copper foil compared with traditional pure copper foil, but also further optimizes its comprehensive performance through layered design, laying a solid foundation for the overall performance improvement of all-metal tab composite copper foil.

[0055] Specifically, the substrate layer 101 can be made of various non-polar or low surface energy polymer materials, such as PP, PE, PPS, PTFE, PMMA, PET, PA, PI, etc.

[0056] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0057] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A method for preparing an all-metal tab composite copper foil, characterized in that, Includes the following steps: S1. Prepare pure copper foil tabs and roll-print conductive adhesive onto the pure copper foil tabs to form a conductive coating; S2. A copper seed layer is plated on the sides of the conductive coating and the pure copper foil tabs. S3. Align and attach the side of the pure copper foil tab with the conductive coating to the preset tab area of ​​the composite copper foil. S4. Water-plating copper layer treatment is applied to both sides of the composite copper foil to form an integrated copper layer with the pure copper foil tabs.

2. The method for preparing the all-metal tab composite copper foil according to claim 1, characterized in that: In step S2, a copper seed layer is deposited on the side of the conductive coating and the pure copper foil tab by vapor deposition to form a vapor-deposited copper layer.

3. The method for preparing the all-metal tab composite copper foil according to claim 1, characterized in that: In step S2, after a copper seed layer is plated on the side of the conductive coating and the pure copper foil tab, acid-resistant ink is flexographically printed onto the surface of the pure copper foil tab away from the conductive coating.

4. The method for preparing the all-metal tab composite copper foil according to claim 1, characterized in that: In step S3, an acid-resistant ink coating for subsequent copper growth is formed on the surface of the composite copper foil A, and a mesh-like blank area is formed on the acid-resistant ink coating.

5. The method for preparing the all-metal tab composite copper foil according to claim 4, characterized in that: In step S4, a mesh support structure layer connected to the copper seed layer is formed on the A side of the composite copper foil, and a water-plated copper layer connected to the pure copper foil tab is formed on the B side of the composite copper foil.

6. The method for preparing the all-metal tab composite copper foil according to claim 5, characterized in that: In step S4, the top of the mesh support structure layer is on the same horizontal plane as the top of the pure copper foil tab.

7. The method for preparing the all-metal tab composite copper foil according to claim 1, characterized in that: In step S3, the composite copper foil is first subjected to double-sided magnetron copper plating by a substrate roll film, and then to double-sided water plating of a long copper layer.

8. A composite copper foil with all-metal tabs, characterized in that: The device includes composite copper foil and pure copper foil tabs. The bottom of the pure copper foil tab is provided with a conductive coating that adheres to the composite copper foil. The sides of the pure copper foil tab and the conductive coating are provided with a vapor-deposited copper layer that is connected to the composite copper foil. A mesh-like support copper layer connected to the vapor-deposited copper layer is formed on the composite copper foil. The pure copper foil tab forms a first water-plated copper layer that is connected to the conductive coating and the composite copper foil.

9. The all-metal tab composite copper foil according to claim 8, characterized in that: The all-metal tab composite copper foil is prepared by the preparation method described in any one of claims 1-7.

10. The all-metal tab composite copper foil according to claim 8, characterized in that: The composite copper foil includes a substrate layer, on both sides of the substrate layer a magnetron plating layer, and on the side of the magnetron plating layer a second water-plated copper layer.

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