Multi-image sensor architecture, imaging device, chip and electronic equipment

Abstract

The invention provides a multi-image sensor architecture, an imaging device, a chip and electronic equipment. The multi-image sensor framework comprises an image sensor matrix, at least two image sensor split bodies which share the same target surface with the image sensor matrix are carried on the image sensor matrix, and the central point of each image sensor split body is collinear with the central points of the other image sensor split bodies in a first direction or a second direction. The central point of the original image of the same shot object collected by each image sensor split body is the same point of the shot object; wherein the first direction is perpendicular to the second direction. The brand-new multi-image-sensor architecture provided by the invention not only can remarkably improve the imaging quality and the imaging efficiency, but also is more convenient to integrate and apply, and has good applicability.

Description

Technical Field

[0001] This invention relates to the field of image processing technology, and in particular to a multi-image sensor architecture, imaging device, chip, and electronic device. Background Technology

[0002] With the increasing demands for image and video quality in fields such as VR / AR panoramic photography, autonomous driving, autonomous navigation robots, unmanned aerial vehicles, geographic surveying, and 3D spatial environment detection and reconstruction, as well as the continuous improvement of chip computing power and algorithm optimization, the application of multi-view imaging devices is becoming increasingly widespread. For example, please refer to... Figure 1 , Figure 1 This is a schematic diagram showing the layout of image sensors in existing multi-view imaging devices. From... Figure 1 It can be seen that in the existing technology, multi-view imaging devices include two or more independent image sensors ( Figure 1 (Illustrated with two independent image sensors 110 and 120). During imaging, two or more independent image sensors at the front end (shown in the diagram) Figure 1 For example, image data is acquired by image sensor 110 and image sensor 120, and then processed by the back-end processor ( Figure 1 (Not shown in the text) The images are stitched, superimposed, and output to obtain a complete image. However, research has found that using two or more independent image sensors to acquire image data has the following drawbacks: (1) it is difficult for the center points of images acquired by multiple image sensors to coincide; (2) the consistency of AE (Automatic Exposure) of multiple image sensors is low; (3) the final image obtained after superimposing or processing images from multiple image sensors often has problems such as blurring, color cast, ghosting, and / or distortion. Therefore, how to improve the imaging quality of multi-view imaging devices has become one of the technical problems that urgently need to be solved by those skilled in the art.

[0003] It should be noted that the information disclosed in the background section of this invention is intended only to enhance the understanding of the general background of this invention, and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0004] This invention addresses the technical problem of poor imaging quality caused by the inability to fully fuse image data acquired by multiple independent image sensors in the prior art. It provides a multi-image sensor architecture, imaging device, chip, and electronic device. The novel multi-image sensor architecture provided by this invention can not only significantly improve imaging quality and imaging efficiency, but also facilitate integration and application, and has good applicability.

[0005] In order to achieve the above object, the present application is realized by the following technical scheme: a multi-image sensor architecture, comprising an image sensor matrix, the image sensor matrix carrying at least two image sensor splittings with a common target surface, the center point of each image sensor splitting being collinear with the center point of other image sensor splittings in a first direction or in a second direction, so that the center point of the original image of the same object collected by each image sensor splitting is the same point of the object; wherein the first direction and the second direction are perpendicular to each other.

[0006] Optionally, the plurality of image sensor splittings comprises a visible light wavelength image sensor, an invisible light wavelength image sensor, a depth of field sensor and / or a thermal imaging sensor.

[0007] Optionally, the visible light wavelength image sensor comprises an RGB image sensor, and / or the invisible light wavelength image sensor comprises an IR image sensor.

[0008] Optionally, the image sensor matrix is configured to fuse, picture-in-picture and / or splice a plurality of the original images to obtain a target image of the object.

[0009] Optionally, the image sensor matrix comprises an image processing layer, a data operation layer and an image output layer; the image processing layer is configured to process image data corresponding to each original image according to the quality requirement to obtain a first intermediate image; the data operation layer is configured to encode, align, superimpose, merge and / or combine a plurality of the first intermediate images to obtain a second intermediate image; and the image output layer is configured to process the second intermediate image according to the output requirement to obtain the target image.

[0010] Optionally, the image output layer is further configured to output the target image according to the encoding requirement; and / or output the target image of at least one frame size according to the compression requirement and / or the cropping requirement.

[0011] Optionally, the plurality of image sensor splittings do not overlap with each other.

[0012] In order to achieve the above object, the present application further provides an imaging device, comprising the multi-image sensor architecture according to any one of the above.

[0013] In order to achieve the above object, the present application further provides a chip, the chip being integrated with the multi-image sensor architecture according to any one of the above or the imaging device according to the above.

[0014] In order to achieve the above object, the application further provides an electronic device comprising the multi-image sensor architecture, the imaging device or the chip according to any one of the above.

[0015] Compared with the prior art, the multi-image sensor architecture, the imaging device, the chip and the electronic device provided by the application have the following advantages: the multi-image sensor architecture provided by the application comprises an image sensor matrix, and at least two image sensor splittings are carried on the image sensor matrix and share a common target surface, thereby, by adopting the design mode of the integrated layout of the plurality of image sensor splittings and the image sensor matrix sharing the common target surface, the AE consistency of the plurality of independent image sensors in the prior art and other bottleneck problems can be well solved, and a solid foundation is laid for the center points of the image sensor splittings to be collinear in the first direction or in the second direction (the first direction is perpendicular to the second direction); further, by adopting the design mode that the center point of each image sensor splitting is collinear with the center points of the other image sensor splittings in the first direction or in the second direction, the complete coincidence of the center points of the images collected respectively and all pixel points can be achieved, thereby the center points of the original images of the same object collected by each image sensor splitting are the same point of the object, and the problems of the difficulty of the coincidence of the center points of the images collected by the plurality of independent image sensors in the prior art and the blur, color deviation, ghosting and / or distortion of the final image obtained after the subsequent image superposition or processing are well solved. As can be seen, the new multi-image sensor architecture provided by the application can significantly improve the imaging quality and efficiency, and is more convenient for integration and application, and has good applicability.

[0016] Since the imaging device, the chip and the electronic device provided by the application belong to the same inventive concept as the multi-image sensor architecture provided by the application, the imaging device, the chip and the electronic device provided by the application at least have all the advantages of the multi-image sensor architecture provided by the application, and the details of the beneficial effects of the imaging device, the chip and the electronic device provided by the application are described above in relation to the beneficial effects of the multi-image sensor architecture provided by the application, which will not be described one by one here. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 A layout schematic diagram of the image sensor of the multi-view imaging device in the prior art.

[0018] Figure 2 A block structure schematic diagram of the multi-image sensor architecture provided by the application.

[0019] Figure 3A data processing flow diagram of a multi-image sensor structure according to an embodiment of the present application.

[0020] Wherein, the reference signs are as follows: image sensor-110, 120, image sensor matrix-210, image processing layer-211, data operation layer-212, image output layer-213; image sensor split-220. DETAILED DESCRIPTION

[0021] The present application provides a multi-image sensor architecture, imaging device, chip and electronic device. The advantages and features of the present application will be more apparent from the following description in conjunction with the accompanying drawings. It should be noted that the drawings are very simplified and all the proportions are not accurate, which are only used to facilitate and clarify the purpose of assisting the description of the embodiments of the present application. In order to make the purpose, features and advantages of the present application more apparent and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size and the like shown in the drawings are only used to cooperate with the content disclosed in the specification, so that those skilled in the art can understand and read, and are not used to limit the implementation of the present application. Any modification of structure, change of proportion relationship or adjustment of size, as long as it is the same or similar to the effect and purpose that can be achieved by the present application, should still fall within the scope of the technology disclosed by the present application. The specific design features of the present application disclosed herein include, for example, specific dimensions, directions, positions and shapes, which will be determined in part by the specific application and use environment. In the embodiments described below, the same reference signs are sometimes used in different drawings to represent the same parts or parts with the same function, and the repeated description is omitted. In this specification, similar signs and letters are used to represent similar items, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings. In addition, if the method described herein includes a series of steps, and the order of the steps presented herein is not necessarily the only order in which the steps can be performed, and some of the described steps can be omitted and / or some other steps not described herein can be added to the method.

[0022] It has to be noted that, in the present document, the terms "first", "second", etc. merely serve the purpose of differentiation and do not require or imply any kind of ordering or sequence of the entities or actions associated therewith. Furthermore, the terms "comprising", "containing", or any other similar term are intended to encompass non-exclusive inclusions, such that processes, methods, articles, or apparatuses that comprise a list of elements are not limited to those elements, but can include other elements not expressly listed or inherent to such processes, methods, articles, or apparatuses. Without further limitation, an element defined by an indefinite article "a" or "an" does not exclude the existence of more than one of such element in the process, method, article, or apparatus including the element. The singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. The term "or" is generally employed in its sense including "and / or", the term "several" is generally employed in its sense including "at least two", and the term "at least two" is generally employed in its sense including "two or more". Furthermore, the terms "first", "second", "third", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or an indicated number of technical features.

[0023] It should be understood that the orientation or positional relationship indicated by terms such as "central", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. In addition, in the present application, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or can include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "above", "over" and "on" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "under" and "under" of the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0024] The core idea of the present application is to provide a multi-image sensor architecture, an imaging device, a chip and an electronic device. The new multi-image sensor architecture provided by the present application not only can significantly improve the imaging quality and imaging efficiency, but also is more convenient for integration and application, and has good applicability.

[0025] It should be noted that the multi-image sensor architecture, the imaging device and the chip provided by the present application can be applied to the electronic device provided by the present application. It should be understood that the term "electronic device" or "electronic device" or other similar terms used herein include various devices and products manufactured using electronic technology, for example, including but not limited to cameras, camcorders, mobile phones, tablet computers, monitoring devices, learning machines and medical imaging devices, etc.

[0026] In order to realize the above idea, one embodiment of the present application provides a multi-image sensor architecture. Exemplarily, please refer to Figure 2 , Figure 2A block structure schematic diagram of the multi-image sensor architecture provided by the embodiment is schematically shown. Figure 2 As can be seen, the multi-image sensor architecture provided by the embodiment includes an image sensor matrix 210, and the image sensor matrix 210 carries at least two image sensor splittings 220 with a common target surface thereof. Figure 2 In the three image sensor splittings 220 with center points C1, C2 and C3, the center point of each image sensor splitting 220 is collinear with the center point of the other image sensor splitting 220 in the first direction or in the second direction, so that the center point of the original image of the same object acquired by each image sensor splitting 220 is the same point of the object.

[0027] The multi-image sensor architecture provided by the embodiment includes an image sensor matrix 210, and the image sensor matrix 210 carries at least two image sensor splittings 220 with a common target surface thereof. Figure 2 In the three image sensor splittings 220 with center points C1, C2 and C3, the center point of each image sensor splitting 220 is collinear with the center point of the other image sensor splitting 220 in the first direction or in the second direction, so that the center point of the original image of the same object acquired by each image sensor splitting 220 is the same point of the object. Figure 2 In the three image sensor splittings 220 with center points C1, C2 and C3, the center point of each image sensor splitting 220 is collinear with the center point of the other image sensor splitting 220 in the first direction or in the second direction, so that the center point of the original image of the same object acquired by each image sensor splitting 220 is the same point of the object.

[0028] It should be noted that those skilled in the art should understand that although Figure 2three image sensor split bodies 220 are shown, but it is obvious that this is not a limitation of the present application, and the present application does not limit the specific number of the image sensor split bodies 220. For example, in other embodiments, the number of the image sensor split bodies 220 can be two, four or more. Further, the present application does not limit the specific position of each of the image sensor split bodies 220, except that the center points of the image sensor split bodies 220 are collinear in the first direction or in the second direction with other image sensor split bodies 220. For example, as shown in Figure 2 the left image sensor split body 220 and the upper right image sensor split body 220 are collinear in the first direction (the left-right direction) shown, and the center point C2 of the upper right image sensor split body 220 and the center point C3 of the lower right image sensor split body 220 are collinear in the second direction (the up-down direction) shown. Figure 2 Figure 2

[0029] It should be further noted that those skilled in the art should understand that the present application does not limit the size of each of the image sensor split bodies 220, and the size of each of the image sensor split bodies 220 can be completely the same, completely different, or some of the image sensor split bodies 220 have the same size. For example, as shown in Figure 2 the sizes of the three image sensor split bodies 220 are all different.

[0030] For example, in some exemplary embodiments, the center point of each of the image sensor split bodies 220 and the center point of other image sensor split bodies 220 are collinear in the first direction or in the second direction, specifically including: two or more image sensor split bodies 220 can be implemented and are not limited to the center point of the collected image and all pixel points completely coincide, or the center point of the image collected by any one of the image sensor split bodies 220 is the same point.

[0031] It should be further noted that the present application does not limit the specific implementation of the image sensor mother body 210 and the image sensor split body 220. For example, in some embodiments, the image sensor mother body 210 can be a photosensitive (image sensor) mother chip, and each of the image sensor split bodies 220 is a photosensitive chip fission body (image sensor split chip) carried on the photosensitive mother chip.

[0032] For example, please continue to refer to Figure 3 , as shown in Figure 3 ​​As shown, in some of the exemplary embodiments, the plurality of image sensor split bodies 220 do not overlap with each other. In this way, by adopting the design of the plurality of image sensor split bodies 220 not overlapping with each other, on the one hand, the collection of multiple spectral images can be realized, and on the other hand, the mutual interference between the image sensor split bodies 220 caused by overlapping can be effectively avoided, which not only can effectively ensure the integrity of the collected images, but also can effectively ensure the quality of the collected images.

[0033] It needs to be further explained that the specific type of the image sensor split body 220 is not limited by the present application. For example, the plurality of image sensor split bodies 220 can be, but are not limited to, visible light wavelength image sensors, invisible light wavelength image sensors, depth sensors, and / or thermal imaging sensors. In this way, by adopting the image sensor split body 220 including but not limited to visible light wavelength image sensors, invisible light wavelength image sensors, depth sensors, and / or thermal imaging sensors, a good foundation is laid for collecting multiple spectral images to further improve the quality of the target image. When implementing the present application, visible light wavelength image sensors, invisible light wavelength image sensors, depth sensors, and / or thermal imaging sensors should be selected as the image sensor split body 220 according to actual needs.

[0034] For the imaging principle of the visible light wavelength image sensor, the invisible light wavelength image sensor, the depth sensor, and the thermal imaging sensor and the characteristics of the collected original image, please refer to the related technical understanding of the image sensor known to those skilled in the art. Due to the limited space, this paper will not expand the details.

[0035] Exemplarily, in some of the exemplary embodiments, the visible light wavelength image sensor can be, but is not limited to, an RGB image sensor. In this way, the visible light wavelength image sensor adopts the design of the RGB image sensor, which can fully utilize the advantages of the RGB image sensor that can independently capture the information of red, yellow, and blue color channels to effectively restore the rich colors in the natural scene and the color and brightness under different light conditions, thereby ensuring the image quality of the target image obtained finally.

[0036] Exemplarily, in some of the exemplary embodiments, the invisible light wavelength image sensor can be, but is not limited to, an IR (Infrared Sensor) image sensor. In this way, the invisible light wavelength image sensor adopts the design of the IR image sensor, which can fully utilize the advantages of the IR image sensor that is not disturbed by visible light and is suitable for specific scenes (such as night vision and temperature measurement), thereby further improving the applicability of the multi-image sensor architecture provided by the present application.

[0037] Exemplarily, in some exemplary embodiments, the image sensor matrix 210 is configured to perform fusion, picture-in-picture and / or stitching processing on the plurality of original images to obtain a target image of the object. Thus, the image sensor matrix 210 can perform fusion, picture-in-picture and / or stitching processing and other processing of multiple imaging modes on the plurality of original images, thereby further improving the processing capability of the multi-image sensor structure provided by the present application, not only ensuring the image quality of the obtained target image, but also greatly improving the integration of the multi-image sensor structure provided by the present application, further improving the applicability of the present application.

[0038] Exemplarily, please refer to Figure 3 , ​ a data processing flowchart of the multi-image sensor structure provided by one embodiment of the present application. From ​ it can be seen that, in some exemplary embodiments, the image sensor matrix 210 includes an image processing layer 211, a data operation layer 212 and an image output layer 213. Further, the image processing layer 211 is configured to process image data corresponding to each of the original images according to quality requirements to obtain a first intermediate image; the data operation layer 212 is configured to perform encoding, alignment, superposition, merging and / or combination processing on a plurality of first intermediate images to obtain a second intermediate image; and the image output layer 213 is configured to process the second intermediate image according to output requirements to obtain the target image. Thus, the image sensor matrix 210 adopts the modular design of the image processing layer 211, the data operation layer 212 and the image output layer 213, which not only effectively ensures the image quality of the obtained target image, but also has clear logic and is easy to implement.

[0039] Exemplarily, in some exemplary embodiments, the image processing layer 211 is configured to process image data corresponding to each of the original images according to quality requirements to obtain a first intermediate image, including but not limited to performing black level correction, focus pixel correction and other processing on each of the original images to obtain each of the first intermediate images.

[0040] Exemplarily, in some of the exemplary embodiments, the image output layer 213 is further configured to perform one or more of the following operations, including but not limited to: outputting the target image according to an encoding requirement, outputting the target image of at least one frame size according to a compression requirement, and outputting the target image of at least one frame size according to a cropping requirement. Thus, the image output layer 213 of the image sensor matrix 210 of the multi-image sensor architecture provided by the present application can output the target image according to an encoding requirement, output the target image of at least one frame size according to a compression requirement, and output the target image of at least one frame size according to a cropping requirement, which not only ensures the image quality of the obtained target image, but also further improves the applicability of the present application.

[0041] Another embodiment of the present application further provides an imaging device, which comprises the multi-image sensor architecture according to any one of the embodiments described herein.

[0042] It should be noted that, as can be understood by those skilled in the art, in addition to the multi-image sensor architecture described herein, the imaging device can further comprise, but is not limited to, a timing control module, a heat dissipation module, an image output interface and the like. For more details of the imaging device, please refer to the relevant technical adaptability of the imaging device known to those skilled in the art, which will not be described in detail herein due to the limited space.

[0043] Still another embodiment of the present application further provides a chip, which is integrated with the multi-image sensor architecture according to any one of the embodiments described herein or the imaging device described above.

[0044] The present application does not make any limitation on the process, application field and function of the chip, exemplarily, the chip can be, but is not limited to, a 7nm chip, a 14nm chip and a 28nm chip; the chip can be, but is not limited to, an image processing chip, a vehicle chip, a consumer electronics chip and a medical chip, etc.

[0045] Still another embodiment of the present application provides an electronic device, which comprises the multi-image sensor architecture according to any one of the embodiments described herein, or the imaging device according to the above embodiments or the chip according to the above examples. Since the electronic device provided by the present embodiment belongs to the same inventive concept as the imaging device or the chip or the multi-image sensor architecture provided by the present application, and the imaging device and the chip provided by the present application belong to the same inventive concept as the multi-image sensor architecture provided by the present application, the electronic device provided by the present embodiment at least has all the advantages of the multi-image sensor architecture provided by the present application, and the detailed content is described above in relation to the advantages of the multi-image sensor architecture, which will not be described one by one here.

[0046] Exemplarily, the electronic device can further include one or more of the following components: a processor component, a memory, a power supply component, a multimedia component, an audio component, an input / output (I / O) interface, and a communication component.

[0047] The processor component generally controls the overall operations of the electronic device, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processor component can include one or more processors to execute instructions.

[0048] The memory is configured to store various types of data to support the operations of the electronic device. Examples of such data include instructions for any application programs or methods operating on the electronic device, contact data, phonebook data, messages, pictures, videos, and the like. The memory can be implemented by any type of volatile or non-volatile memory device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, a magnetic disk or an optical disk.

[0049] The power supply component provides power to the various components of the electronic device. The power supply component can include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the electronic device.

[0050] In some embodiments, the multimedia component includes a screen providing an output interface between the electronic device and a user. In some embodiments, the screen can include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes the touch panel, the screen can be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense a touch, a slide, and a gesture on the touch panel. The touch sensor can not only sense a boundary of a touching or a sliding action, but also detect duration and pressure related to the touching or sliding action.

[0051] In some embodiments, the audio component is configured to output and / or input an audio signal. For example, the audio component includes a microphone (MIC) configured to receive an external audio signal when the electronic device is in an operational mode, such as a camera mode, a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory or transmitted via the communication component. In some embodiments, the audio component can further include a speaker for outputting an audio signal.

[0052] In some embodiments, the I / O interface provides an interface between the processor component and peripheral interface modules, which can be a keypad, click wheel, button, and the like. These buttons can include, but are not limited to, a home button, a volume button, a start button, and a lock button.

[0053] In some embodiments, the communication component is configured to facilitate wired or wireless communication between the electronic device and other devices. The electronic device can access a wireless network based on a communication standard, such as WiFi, 2G, or 3G, or a combination thereof. In an example embodiment, the communication component receives broadcast signals or broadcast-related information from external broadcast management systems via the broadcast channel. In an example embodiment, the communication component also includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on Radio Frequency Identification (RFID) techniques, infrared data association (IrDA) techniques, ultra-wideband (UWB) techniques, Bluetooth (BT) techniques, and other techniques. The communication component can include analog and digital input / output interface circuits and wireless communication circuitry based on radio frequency signals and / or light signals. The wireless communication circuitry in the communication component can include radio frequency transceiver circuitry, power amplifier circuitry, low noise amplifier, switches, filters, duplexers, and antennas. For example, the communication component can include a near field communication antenna and a near field communication transceiver, and can also include cellular telephone transceiver and antenna circuitry, wireless local area network transceiver circuitry and antenna, and the like.

[0054] Compared with the prior art, the multi-image sensor architecture, the imaging device, the chip and the electronic equipment provided by the application have the following advantages: the multi-image sensor architecture provided by the application comprises one image sensor matrix, and at least two image sensor split bodies are carried on the image sensor matrix and have a common target surface with the image sensor matrix, so that, by adopting the design mode of the integrated layout of the common target surface of the plurality of image sensor split bodies and the image sensor matrix, the bottleneck problems such as the low AE consistency of the plurality of independent image sensors in the prior art can be well solved, and a solid foundation is laid for the center points of the image sensor split bodies to be collinear in the first direction or in the second direction (the first direction is perpendicular to the second direction); further, by adopting the design mode that the center point of each image sensor split body is collinear with the center points of the other image sensor split bodies in the first direction or in the second direction, the complete coincidence of the center points of the images collected respectively and all pixel points can be realized, so that the center points of the original images of the same object collected by each image sensor split body are the same point of the object, and the problems such as the difficulty of the coincidence of the center points of the images collected by the plurality of independent image sensors, the blur, the color deviation, the ghosting and / or the distortion of the final image obtained after the image superposition or processing are well solved. In conclusion, the new multi-image sensor architecture provided by the application can significantly improve the imaging quality and the imaging efficiency, and is more convenient for integration and application, and has good applicability.

[0055] In addition, each functional module in each embodiment herein can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0056] The above description is only a description of the preferred embodiments of the multi-image sensor architecture, the imaging device, the chip and the electronic equipment provided by the application, and does not limit the scope of the application. Any modification and modification of the above disclosure by a person skilled in the art belongs to the protection scope of the application. Obviously, those skilled in the art can make various modifications and changes to the application without departing from the spirit and scope of the application. Thus, if these modifications and changes belong to the scope of the application and its equivalent technology, the application also intends to include these modifications and changes.

Claims

1. A multi-image sensor architecture, characterized in that, The image sensor includes a main image sensor body, on which at least two image sensor split bodies share a target surface. The center point of each image sensor split body is collinear with the center points of the other image sensor split bodies in a first direction or a second direction, such that the center point of the original image of the same subject acquired by each image sensor split body is the same point of the subject; wherein the first direction and the second direction are perpendicular to each other.

2. The multi-image sensor architecture according to claim 1, characterized in that, The plurality of image sensor splits include a visible light wavelength image sensor, an invisible light wavelength image sensor, a depth sensor, and / or a thermal imaging sensor.

3. The multi-image sensor architecture according to claim 2, characterized in that, The visible light wavelength image sensor includes an RGB image sensor, and / or the invisible light wavelength image sensor includes an IR image sensor.

4. The multi-image sensor architecture according to claim 1, characterized in that, The image sensor is configured to fuse, picture-in-picture, and / or stitch multiple original images to obtain a target image of the subject.

5. The multi-image sensor architecture according to claim 4, characterized in that, The image sensor matrix includes an image processing layer, a data processing layer, and an image output layer. The image processing layer is configured to process the image data corresponding to each of the original images according to image quality requirements to obtain a first intermediate image. The data processing layer is configured to encode, align, overlay, merge, and / or combine multiple first intermediate images to obtain a second intermediate image. The image output layer is configured to process the second intermediate image according to output requirements to obtain the target image.

6. The multi-image sensor architecture according to claim 5, characterized in that, The image output layer is also configured to output the target image according to encoding requirements; And / or output the target image in at least one aspect ratio according to compression and / or cropping requirements.

7. The multi-image sensor architecture according to any one of claims 1 to 6, characterized in that, The multiple image sensor splits do not overlap with each other.

8. An imaging device, characterized in that, Including the multi-image sensor architecture as described in any one of claims 1 to 7.

9. A chip, characterized in that, The chip integrates a multi-image sensor architecture as described in any one of claims 1 to 7 or an imaging device as described in claim 8.

10. An electronic device, characterized in that, Includes the multi-image sensor architecture as described in any one of claims 1 to 7, the imaging device as described in claim 8, or the chip as described in claim 9.

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