Ceramic capacitance type temperature and pressure sensor
By optimizing the connection relationship of the ceramic capacitive temperature and pressure sensor, and adopting a design without ceramic capacitor perforation, layered support of NTC pillars and V-shaped guide grooves, flexible PFC circuit board and triple sealing structure, the problem of sensor connection design was solved, achieving high-precision temperature and pressure signal acquisition and transmission, and improving vibration resistance and anti-interference ability.
Patent Information
- Application Number
- CN202511555557.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-29
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2045-10-29
AI Technical Summary
Existing ceramic capacitive temperature and pressure sensors suffer from problems in their connection design, such as damage to the ceramic capacitor structure, failure of the temperature sensing component support, poor rigidity of the PFC circuit board, and insufficient anti-interference capability, which leads to a decrease in detection accuracy and stability.
By optimizing the connection between the pressure port holder, base, ceramic capacitor, temperature sensing component, NTC adapter board, and PFC circuit board, and adopting a ceramic capacitor-free through-hole design, NTC pillar layered support and V-shaped guide groove for short circuit prevention, flexible PFC circuit board, and triple sealing structure, the reliability of signal transmission and vibration resistance are ensured.
It achieves high-precision temperature and pressure signal acquisition and transmission, improves the sensor's anti-vibration and anti-interference capabilities, enhances assembly and maintenance convenience, and adapts to high-pressure and vibration conditions.
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Figure CN121048818A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of sensor technology, and in particular to a ceramic capacitive temperature and pressure sensor. Background Technology
[0002] The core requirement of ceramic capacitive temperature and pressure sensors is to achieve accurate acquisition and reliable transmission of both pressure and temperature signals. Their performance depends on the coordinated operation of three main modules: pressure sensing (ceramic capacitor), temperature sensing (NTC component), and signal processing (circuit board). The connection relationships between these modules directly determine the sensor's accuracy, stability, and lifespan. Existing technologies suffer from the following key defects, all related to unreasonable connection design: 1. Ceramic Capacitor Structure Destruction and Pressure Transmission Loss: To achieve the connection between the NTC and the circuit board, a traditional solution, such as the patent application with publication number CN223077765U, discloses a temperature and pressure sensor for a new refrigerant. This sensor includes a housing with a built-in pressure-sensing component, an electrical connector connected to the pressure-sensing component outside the housing, and an NTC thermistor built into the housing. The pressure-sensing component is a five-pin ceramic capacitor, with two pins serving as temperature-sensing pins that penetrate the ceramic capacitor body and connect to the NTC thermistor. A pressure-resistant protective ring is pressed between the pressure-sensing component and the housing, surrounding the temperature-sensing pins. This patent application uses a five-pin ceramic capacitor as the pressure-sensing component, with the two temperature-sensing pins featuring a straight-through design and a double-layer pressure-resistant protective ring to improve the pressure resistance of the temperature and pressure sensor. This solution requires creating through holes in the ceramic capacitor (the pressure-sensing core, which relies on an intact ceramic substrate to ensure uniform stress), which disrupts its structural integrity, leading to an imbalance in the stress distribution of the pressure-sensing diaphragm and a decrease in the linearity of pressure detection. At the same time, the pressure channels are mostly designed with bends or have gaps with other components, which can easily cause pressure hysteresis or leakage, further reducing the detection accuracy.
[0003] 2. Risk of temperature sensing component support failure and signal short circuit: The NTC temperature sensing needle lacks targeted guiding support and is only fixed by simple plug-in connection. Under vibration conditions, it is easy to shift and bend, which will cause the NTC thermistor to be misaligned and the temperature detection deviation will be amplified. More seriously, the V-shaped connection between the temperature sensing needle and the NTC has no isolation structure, and the two needles are prone to contact and short circuit, which will directly cause the temperature signal to be interrupted and the sensor to fail.
[0004] 3. Insufficient rigidity and interference resistance of PFC circuit board connection: The circuit board and ceramic capacitors and NTC components are mostly rigidly connected. Small deviations during assembly can easily lead to bending of capacitor pins and poor contact of the pin body. At the same time, the grounding structure relies on wire welding. Under vibration environment, the desoldering rate is high and the grounding resistance fluctuates greatly. Electromagnetic interference in industrial scenarios (such as frequency converter and motor noise) can directly invade the signal circuit, causing the temperature and pressure detection error to double.
[0005] Therefore, a new technical solution is urgently needed to solve the above-mentioned technical problems. Summary of the Invention
[0006] The purpose of this invention is to overcome the problems of the prior art and provide a ceramic capacitive temperature and pressure sensor. By optimizing the connection relationship between the pressure port holder, base, ceramic capacitor, temperature sensing component, NTC adapter board, electrical connector, and PFC circuit board, this invention solves problems such as ceramic capacitor perforation and damage, temperature sensing component support failure, poor rigidity adaptation of PFC circuit board, sealing leakage, and inefficient assembly in the prior art. Ultimately, this invention achieves high-precision acquisition and reliable transmission of temperature and pressure signals, while improving the sensor's vibration resistance, anti-interference ability, and ease of assembly and maintenance.
[0007] The above objectives are achieved through the following technical solutions: A ceramic capacitive temperature and pressure sensor, comprising: A pressure port holder has a base mounting groove on one side and a connector on the other side; the connector has a port annular groove, and the bottom wall of the port annular groove has a temperature sensing component channel and a pressure port channel that connect the base mounting groove; the pressure port holder is made of metal. A base is embedded in a base mounting groove. The upper surface of the base has a ceramic capacitor mounting groove, and the bottom wall of the ceramic capacitor mounting groove has a pressure base channel communicating with the pressure port channel. The bottom surface of the base has an NTC support column, and an NTC adapter plate recess is located adjacent to the NTC support column. An NTC adapter terminal channel communicating with the upper surface of the base and the NTC adapter plate recess is opened on the base side symmetrical to the ceramic capacitor mounting groove. An NTC adapter terminal is located within the NTC adapter terminal channel, and both ends of the NTC adapter terminal extend out to form an upper connection end and a lower connection end. A ceramic capacitor, wherein the ceramic capacitor is embedded in the ceramic capacitor mounting slot and has capacitor pins on its upper surface; A temperature sensing component, guided and supported by the NTC pillar, includes a temperature sensing needle and an NTC thermistor connected to the temperature sensing needle; NTC adapter board, wherein the NTC adapter board is embedded in the NTC adapter board groove; An electrical connector, the bottom end of which engages with the base to form a PFC circuit board mounting cavity (706). The PFC circuit board is placed in the PFC circuit board mounting cavity and includes an integrally formed upper connecting part, a lower connecting part, and an elastic flange connecting the two. The lower connecting part is provided with a flexible support arm, and the flexible support arm is provided with an NTC adapter terminal upper connecting end socket for the upper connecting end of the NTC adapter terminal to cooperate with. The lower connecting part is also provided with a lower connecting part socket for the capacitor pin to pass through.
[0008] Furthermore, the NTC support column is a cylinder, perpendicular to the base and integrally formed, with several NTC support column reinforcing ribs at the connection point; the NTC support column has symmetrically formed temperature-sensing needle slots, which are used to embed the temperature-sensing needles; the NTC support column has a conical extension section at its end, which has a V-shaped guide groove communicating with the temperature-sensing needle slots.
[0009] Furthermore, the base sidewall is symmetrically provided with grounding top blocks and symmetrically provided with sliding grooves, and the sliding grooves are provided with sliding buckles; the bottom end of the electrical connector is provided with a top block groove that matches the grounding top block and a sliding arm that matches the sliding groove, and the sliding arm is provided with a sliding buckle groove that engages with the sliding buckle.
[0010] Furthermore, the temperature sensing component also includes a temperature sensing sleeve that covers the temperature sensing needle and the NTC thermistor. An annular pressure sleeve is fitted onto the top of the temperature sensing sleeve, and the annular pressure sleeve is pressed against the lower port of the temperature sensing component channel. The NTC thermistor is located on the central axis of the NTC support, and the length of the NTC support is less than the length of the temperature sensing needle.
[0011] Furthermore, the NTC adapter board has an NTC adapter terminal lower connection end socket for inserting the lower connection end of the NTC adapter terminal, and a temperature sensing needle body socket for inserting the top end of the temperature sensing needle body; the recessed area of the NTC adapter board is smaller than that of the ceramic capacitor mounting slot, and is arranged parallel to the ceramic capacitor mounting slot.
[0012] Furthermore, the electrical connector includes an external connector and a connector terminal disposed therein, the bottom end of the connector terminal extending into the mounting cavity of the PFC circuit board; the bottom end of the electrical connector is sealed with environmental adhesive; the upper connecting part has an upper connecting part insertion hole for the connector terminal to be inserted.
[0013] Furthermore, the PFC circuit board uses a flexible substrate; the upper connection part is provided with a flexible grounding arm, the end of the flexible grounding arm is provided with a sleeve, the sleeve is sleeved on the bottom edge of the electrical connector, and is pressed against the inner wall of the pressure port seat under the action of the grounding top block and the inner wall of the base mounting groove.
[0014] Furthermore, the flexible grounding arm has one of two structures: Firstly, two are symmetrically arranged on both sides of the elastic flange; Secondly, it is located on the symmetrical side of the upper connecting portion corresponding to the elastic flange; The lower connecting part is octagonal and its shape is no larger than that of the ceramic capacitor; the upper surface of the lower connecting part is provided with electronic component mounting positions.
[0015] Furthermore, the electrical connections between the capacitor pin and the lower connection port, the upper connection terminal of the NTC adapter and the upper connection port of the NTC adapter, the lower connection terminal of the NTC adapter and the lower connection port of the NTC adapter, the temperature sensing needle and the temperature sensing needle port, and the connector terminal and the upper connection port are all soldered.
[0016] Furthermore, the bottom wall of the base mounting groove is provided with a pressure-sensitive sealing ring groove, and a pressure-sensitive sealing ring is embedded in the pressure-sensitive sealing ring groove; the bottom wall of the ceramic capacitor mounting groove is provided with a ceramic capacitor sealing groove, and a capacitor sealing ring is embedded in the ceramic capacitor sealing groove.
[0017] This invention provides a ceramic capacitive temperature and pressure sensor that eliminates the need for perforation of the ceramic capacitor, ensuring structural integrity and maintaining pressure sensing accuracy. The temperature sensing component is supported by NTC pillars in layers and protected against short circuits by V-shaped guide grooves, ensuring stable temperature detection without deviation. A triple-seal design prevents media leakage, making it suitable for high-pressure conditions. The flexible structure of the PFC circuit board adapts to confined spaces, and the elastic grounding arm effectively resists electromagnetic interference. The snap-fit design of the electrical connector improves assembly efficiency, and welding reinforcement at each electrical connection ensures reliable signal transmission. Overall, it balances high accuracy in temperature and pressure detection, long-term operational stability, and ease of maintenance, making it suitable for harsh applications such as high-pressure and vibration environments. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of a ceramic capacitive temperature and pressure sensor according to the present invention; Figure 2 This is a cross-sectional view of a ceramic capacitive temperature and pressure sensor according to the present invention; Figure 3 This is a schematic diagram of the assembly of the electrical connector and the base in a ceramic capacitive temperature and pressure sensor according to the present invention; Figure 4 This is a schematic diagram of the base structure in a ceramic capacitive temperature and pressure sensor according to the present invention; Figure 5 This is an assembly diagram of the NTC adapter terminal, base, temperature sensing component and pressure port seat in a ceramic capacitive temperature and pressure sensor according to the present invention. Figure 6 This is an assembly diagram of the PFC circuit board, ceramic capacitor, base, and pressure port seat in a ceramic capacitive temperature and pressure sensor according to the present invention. Figure 7 This is a schematic diagram of the electrical connections of the NTC adapter terminal, NTC adapter board, and temperature sensing component in a ceramic capacitive temperature and pressure sensor according to the present invention.
[0019] Illustration markings: 1-Pressure port seat, 101-Base mounting groove, 102-Connector, 103-Port annular groove, 104-Temperature sensing component channel, 105-Pressure port channel, 106-Temperature sensing sealing ring groove, 107-Pressure sensing sealing ring groove; 2-Base, 201-Ceramic capacitor mounting slot, 202-NTC support column, 203-NTC adapter plate recess, 204-NTC adapter terminal channel, 205-Pressure base channel, 206-Slide groove, 207-Slide buckle, 208-Temperature sensing needle recess, 209-Conical extension section, 210-V-shaped guide groove, 211-NTC support column reinforcing rib, 212-Ceramic capacitor sealing recess, 213-Grounding top block; 3-NTC adapter terminal, 301-NTC adapter terminal upper connection terminal, 302-NTC adapter terminal lower connection terminal; 4-Ceramic capacitors, 401-Capacitor pins; 5-Temperature sensing component, 501-Temperature sensing needle, 502-NTC thermistor, 503-Temperature sensing sleeve, 504-Annular pressure sleeve; 6-NTC adapter board, 601-NTC adapter terminal lower connection socket, 602-temperature sensing needle body socket; 7-Electrical connector, 701-Connector external connector, 702-Connector terminal, 703-Top block recess, 704-Slide arm, 705-Slide buckle slot, 706-PFC circuit board mounting cavity; 8-PFC circuit board, 801-Upper connection part, 802-Lower connection part, 803-Elastic flange, 804-Flexible support arm, 805-NTC adapter terminal upper connection end socket, 806-Electronic component mounting position, 807-Lower connection part socket, 808-Upper connection part socket, 809-Flexible grounding support arm, 810-Sleeve; 9-Temperature-sensing sealing ring; 10 - Pressure-sensitive sealing ring; 11-Capacitor sealing ring; 12-Environmental adhesives. Detailed Implementation
[0020] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. The described embodiments are merely some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0021] like Figure 1 and Figure 2As shown, a ceramic capacitive temperature and pressure sensor is suitable for scenarios requiring simultaneous high-precision detection of temperature and pressure, such as industrial automation control, automotive air conditioning refrigerant systems, and fluid monitoring in medical equipment. It can work stably under high pressure, vibration, and confined space conditions.
[0022] like Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, the connection structure between the pressure port seat 1 and the base 2 in this embodiment is as follows: The base mounting groove 101 of the pressure port seat 1 and the base 2 are fitted together, and the base 2 is fully embedded in the mounting groove to form circumferential positioning, so as to avoid the base from shifting and causing the pressure / temperature channel to be misaligned. The pressure port seat 1 is made of metal, which has both high strength and thermal conductivity, supporting the overall structure and assisting in heat dissipation.
[0023] The pressure port channel 105 (located on the bottom wall of the port annular groove 103 of the connector 102 and the pressure base channel 205 located on the bottom wall of the ceramic capacitor mounting groove 201) is in a "straight-through" connection, and the inner wall of the channel is smooth without steps. This design avoids the pressure loss of existing curved channels, ensures that the measured medium acts directly on the bottom surface of the ceramic capacitor 4, without pressure hysteresis, and guarantees the real-time performance and accuracy of pressure detection.
[0024] The bottom wall of the base mounting groove 101 has a temperature-sensing sealing ring groove 106 and a pressure-sensing sealing ring groove 107, into which temperature-sensing sealing ring 9 and pressure-sensing sealing ring 10 are respectively embedded. The temperature-sensing sealing ring 9 surrounds the mating gap between the temperature-sensing component channel 104 and the base 2 to prevent the medium from seeping in from the temperature-sensing channel. The pressure-sensing sealing ring 10 surrounds the mating gap between the pressure port channel 105 and the base 2 to block the leakage path of the pressure medium. The double seals provide separate protection for the two independent channels of "temperature" and "pressure", avoiding overall leakage caused by the failure of a single seal, and are suitable for high-pressure operating conditions.
[0025] It should be noted that the temperature-sensing sealing ring groove 106 described in this embodiment may also be without the temperature-sensing sealing ring 9, which is used to provide sufficient space for the vertical connection between the NTC support 202 and the bottom of the base 2, especially when the NTC support reinforcing rib 211 is provided at the connection.
[0026] like Figure 2 and Figure 5 As shown, the connection structure between the base 2 and the temperature sensing component 5 in this embodiment is as follows: The NTC support column 202 is perpendicular to the base 2 and integrally formed. This integrated structure avoids the weak connection problem of existing glue bonding or plug-in joints. In addition, the NTC support column reinforcing ribs 211 at the connection are distributed along the circumference of the support column, which can disperse vibration stress, prevent the support column from breaking, and improve long-term stability.
[0027] The temperature-sensing needle slot 208 on the NTC support 202 partially embeds the temperature-sensing needle 501, both wrapping a portion of the needle's length (this portion of the needle can be covered with an insulating layer) for guidance and not completely sealing the needle, ensuring heat exchange between the needle and the surrounding environment and avoiding temperature detection lag. The conical extension 209 and V-shaped guide groove 210 at the end of the support are designed for the V-shaped connection between the temperature-sensing needle 501 and the NTC thermistor 502: the V-shaped guide groove 210 is connected to the temperature-sensing needle slot 208, which just accommodates the V-shaped section of the needle, providing secondary support to this part to prevent the needle from shifting due to vibration, and isolating the two needles through the groove wall, structurally eliminating the risk of short circuit and solving the signal interruption problem caused by short circuit in the prior art.
[0028] The temperature-sensing sleeve 503 houses the temperature-sensing needle 501 and the NTC thermistor 502. Its top end is pressed against the lower port of the temperature-sensing component channel 104 via an annular pressure sleeve 504. The annular pressure sleeve 504 and the temperature-sensing sleeve 503 are pre-welded together. The pressing structure of the annular pressure sleeve 504 rigidly fixes the temperature-sensing sleeve 503 to the pressure port seat 1, preventing the sleeve from shifting during vibration. At the same time, the sleeve can isolate the medium from corrosion, extending the service life of the NTC thermistor 502. In addition, the NTC thermistor 502 is located on the central axis of the NTC support 202, ensuring that the thermistor is in a region with uniform medium temperature, improving the symmetry and accuracy of temperature detection.
[0029] like Figures 5-7 As shown, the connection structure between the base 2, the NTC adapter board 6, and the PFC circuit board 8 in this embodiment is as follows: The NTC adapter board 6 is embedded in the NTC adapter board slot 203 of the base 2, forming a precise positioning. The lower connection end socket 601 of the NTC adapter terminal on the adapter board is inserted into the lower connection end 302 of the NTC adapter terminal, and the temperature sensing needle socket 602 is inserted into the top of the temperature sensing needle 501. Then, it cooperates with the flexible support arm 804 of the PFC circuit board 8 through the upper connection end 301 of the NTC adapter terminal. This intermediate path of "temperature sensing component → adapter board → adapter terminal → circuit board" completely eliminates the need for drilling holes in the ceramic capacitor 4, fundamentally protecting the structural integrity of the ceramic capacitor, avoiding stress imbalance of the pressure sensing diaphragm, and ensuring the accuracy of pressure detection. At the same time, the presence of the adapter board makes the temperature sensing signal transmission path shorter and reduces signal attenuation.
[0030] The NTC adapter board slot 203 has a smaller area than the ceramic capacitor mounting slot 201 and is set in parallel. This avoids spatial interference with the ceramic capacitor 4 on the base 2 and allows the adapter board to maintain a reasonable distance from the ceramic capacitor. This prevents the local heating of the ceramic capacitor from affecting the temperature detection of the NTC thermistor 502 and reduces cross-interference.
[0031] like Figure 2 and Figure 3 As shown, the connection structure between the electrical connector 7, the base 2, and the PFC circuit board 8 in this embodiment is as follows: The sliding arm 704 at the bottom of the electrical connector 7 inserts into the sliding groove 206 of the base 2. During the sliding process, the sliding buckle 207 of the base 2 automatically engages with the sliding buckle groove 705 of the sliding arm 704, forming a firm fixation. Compared with existing threaded connections, this snap-fit structure can complete the assembly without tools, greatly improving efficiency. At the same time, the mating gap after snap-fit is sealed with environmental adhesive 12, which not only enhances the sealing performance but also further fixes the electrical connector 7, preventing it from loosening due to vibration.
[0032] The flexible grounding arm 809 of the PFC circuit board 8 has a sleeve 810 at its end that connects to the bottom edge of the electrical connector 7. During assembly, the grounding top block 213 of the base 2 and the inner wall of the base mounting groove 101 work together to press the sleeve 810 against the inner wall of the metal pressure port seat 1. This "sleeving + pressing" grounding structure eliminates the need for wire soldering, avoiding the risk of desoldering. The flexibility of the flexible grounding arm 809 can adapt to assembly deviations, ensuring that the sleeve 810 is always in close contact with the pressure port seat 1, resulting in stable grounding resistance, effectively shielding electromagnetic interference in the industrial environment, and reducing distortion of temperature and pressure signals.
[0033] The PFC circuit board 8 uses a flexible substrate. The upper connecting part 801 and the lower connecting part 802 are integrally formed by the elastic flange 803. The elastic flange 803 can absorb the stress during assembly and prevent the capacitor pin 401 from being bent due to rigid connection, thus solving the problem of pin breakage in existing circuit boards. The flexible support arm 804 of the lower connecting part 802 can deform slightly to adapt to the installation deviation of the upper connecting end 301 of the NTC adapter terminal and ensure reliable contact between the two. The lower connecting part 802 is octagonal and its shape is no larger than that of the ceramic capacitor 4, which can make full use of the space on the base 2, making the overall size of the sensor more compact and suitable for narrow installation scenarios.
[0034] like Figure 2 and Figure 6 As shown, the connection structure between the ceramic capacitor 4 and the PFC circuit board 8 in this embodiment is as follows: The capacitor pin 401 of the ceramic capacitor 4 passes directly through the lower connection hole 807 of the lower connection part 802 of the PFC circuit board 8, forming a direct signal path of "capacitor-circuit board", reducing intermediate transfer links and reducing contact resistance; the electronic component mounting position 806 on the upper surface of the lower connection part 802 can install a signal conditioning chip. The chip is close to the capacitor pin 401, which can quickly receive and process pressure signals, reducing signal transmission delay.
[0035] In addition, all electrical connections in this solution (capacitor pins and lower connector sockets, adapter terminals and flexible support arms, adapter terminals and adapter plates, temperature sensing needles and adapter plates, connector terminals and upper connector sockets) are soldered. Soldering eliminates gaps between connections, prevents poor contact caused by vibration, further improves the reliability of signal transmission, and ensures that the sensor can still work stably under long-term vibration conditions.
[0036] Work process: 1. Pressure signal acquisition and transmission: The measured medium enters the port annular groove 103 through connector 102. The annular groove can buffer the instantaneous impact of the medium and avoid damage to the ceramic capacitor 4 by the impact pressure. The medium then acts directly on the bottom surface of the ceramic capacitor 4 through the pressure port channel 105 and the pressure base channel 205. The straight-through channel has no pressure loss, and the medium pressure can be transmitted to the pressure-sensing diaphragm of the ceramic capacitor 4 in real time. The diaphragm deforms with the pressure, causing the capacitance value to change.
[0037] The change in capacitance is transmitted to the lower connection part 802 of the PFC circuit board 8 through the capacitor pin 401 on the upper surface of the ceramic capacitor 4. The signal conditioning chip on the electronic component mounting position 806 quickly receives the signal and performs amplification, filtering and linearization calibration. The direct connection between the capacitor pin 401 and the circuit board reduces signal attenuation, and the chip being close to the pin can reduce signal delay. The pressure detection accuracy can reach within ±0.5%FS.
[0038] 2. Temperature signal acquisition and transmission: The temperature of the measured medium is transmitted to the temperature sensing sleeve 503, which then uniformly conducts the temperature to the internal NTC thermistor 502. The sleeve isolates the medium from corrosion without hindering heat conduction, thus shortening the temperature transmission lag time.
[0039] The NTC thermistor 502 changes its resistance value with temperature. The resistance signal is transmitted to the NTC adapter board 6 through the temperature-sensing needle 501, then to the NTC adapter terminal 3, and finally to the flexible support arm 804 of the PFC circuit board 8 through the connection terminal 301 on the NTC adapter terminal. The temperature-sensing needle 501 does not shift under the support of the groove and the V-groove, and the signal transmission path is stable. The isolation effect of the V-groove ensures that there is no short circuit between the two needles and that the signal transmission is uninterrupted.
[0040] 3. Signal processing and output: The signal conditioning chip of PFC circuit board 8 combines the received pressure signal and temperature signal, performs temperature compensation on the pressure signal (eliminating the error caused by temperature change of ceramic capacitor), and finally generates an accurate temperature and pressure joint detection signal.
[0041] The detection signal is transmitted to the connector terminal 702 of the electrical connector 7 through the upper connector socket 808 of the upper connector 801, and then output to external equipment (such as automotive ECU, industrial controller) through the external connector 701. The reliable grounding of the flexible grounding arm 809 can shield electromagnetic interference, and the temperature detection error is controlled within ±0.2℃. The final output temperature and pressure signal meets the requirements of high-precision systems.
[0042] It should be noted that under vibration conditions, the reinforcing ribs of the NTC support 202 disperse stress and prevent the support from breaking; the layered support of the temperature sensing needle body 501 prevents displacement; the snap-fit and glue fixation of the electrical connector 7 prevents loosening; and the elastic flange 803 absorbs vibration stress and prevents the capacitor pin from bending. All the connection structures work together to ensure that the sensor can still work stably in a vibration environment.
[0043] Under high-pressure conditions, the triple seal (temperature-sensing sealing ring, pressure-sensing sealing ring, and capacitor sealing ring) prevents the medium from leaking into the PFC circuit board mounting cavity 706; the non-perforated structure of the ceramic capacitor 4 maintains its pressure resistance, and the straight-through design of the pressure channel avoids local stress concentration, enabling this sensor to be used for a long time under high-pressure conditions without leakage or structural damage risk.
[0044] The above description is merely illustrative of the embodiments of the present invention and is not intended to limit the present invention. For those skilled in the art, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A ceramic capacitive temperature and pressure sensor, characterized in that, include: A pressure port seat (1) is provided with a base mounting groove (101) on one side and a connector (102) on the other side; the connector (102) is provided with a port annular groove (103), and the bottom wall of the port annular groove (103) is provided with a temperature sensing component channel (104) and a pressure port channel (105) that connect the base mounting groove (101). The base (2) has a ceramic capacitor mounting groove (201) on its upper surface and a pressure base channel (205) communicating with the pressure port channel (105) on the bottom wall of the ceramic capacitor mounting groove (201). The base (2) has an NTC support column (202) on its bottom surface and an NTC adapter plate groove (203) near the NTC support column (202). An NTC adapter terminal channel (204) communicating with the NTC adapter plate groove (203) is opened on the side of the base symmetrical to the ceramic capacitor mounting groove (201). An NTC adapter terminal (3) is provided in the NTC adapter terminal channel (204). The two ends of the NTC adapter terminal (3) extend to form an upper connection end (301) and a lower connection end (302) of the NTC adapter terminal. A ceramic capacitor (4) is embedded in the ceramic capacitor mounting slot (201) and has capacitor pins (401) on its upper surface. The temperature sensing component (5) is guided and supported by the NTC support (202), and includes a temperature sensing needle (501) and an NTC thermistor (502) connected to the temperature sensing needle (501). NTC adapter board (6), the NTC adapter board (6) is embedded in the NTC adapter board groove (203). Electrical connector (7), the bottom end of which is snapped into the base (2) to form a PFC circuit board mounting cavity (706); PFC circuit board (8), the PFC circuit board (8) is placed in the PFC circuit board mounting cavity (706), including an integrally formed upper connecting part (801), a lower connecting part (802) and an elastic flange (803) connecting the two; the lower connecting part (802) is provided with a flexible support arm (804), the flexible support arm (804) is provided with an NTC adapter terminal upper connecting end socket (805) for the NTC adapter terminal upper connecting end (301) to cooperate, and the lower connecting part (802) is also provided with a lower connecting part socket (807) for the capacitor pin (401) to pass through.
2. A ceramic capacitive temperature and pressure sensor according to claim 1, characterized in that, The NTC support column (202) is a cylinder, perpendicular to the base (2) and integrally formed; the NTC support column (202) is symmetrically provided with temperature-sensing needle slots (208), and the temperature-sensing needle slots (208) are partially embedded in the temperature-sensing needle (501); the NTC support column (202) is provided with a conical extension section (209) at the end, and the conical extension section (209) is provided with a V-shaped guide groove (210) that communicates with the temperature-sensing needle slots (208).
3. A ceramic capacitive temperature and pressure sensor according to claim 1 or 2, characterized in that, The base (2) has symmetrically provided grounding top blocks (213) on its sidewalls, and also symmetrically provided sliding grooves (206). The sliding grooves (206) are provided with sliding buckles (207). The bottom end of the electrical connector (7) is provided with a top block groove (703) that matches the grounding top block (213), and a sliding arm (704) that matches the sliding groove (206). The sliding arm (704) is provided with a sliding buckle slot (705) that engages with the sliding buckle (207).
4. A ceramic capacitive temperature and pressure sensor according to claim 1, characterized in that, The temperature sensing component (5) further includes a temperature sensing sleeve (503) that covers the temperature sensing needle (501) and the NTC thermistor (502). The top of the temperature sensing sleeve (503) is fitted with an annular pressure sleeve (504), and the annular pressure sleeve (504) is pressed against the lower port of the temperature sensing component channel (104). The NTC thermistor (502) is located on the central axis of the NTC support (202), and the length of the NTC support (202) is less than the length of the temperature sensing needle (501).
5. A ceramic capacitive temperature and pressure sensor according to claim 1, characterized in that, The NTC adapter board (6) has an NTC adapter terminal lower connection end socket (601) for inserting the NTC adapter terminal lower connection end (302) and a temperature sensing needle body socket (602) for inserting the top of the temperature sensing needle body (501); the area of the NTC adapter board groove (203) is smaller than that of the ceramic capacitor mounting groove (201) and is arranged parallel to the ceramic capacitor mounting groove (201).
6. A ceramic capacitive temperature and pressure sensor according to claim 1, characterized in that, The electrical connector (7) includes an external connector (701) and a connector terminal (702) disposed therein, the bottom end of the connector terminal (702) extending into the PFC circuit board mounting cavity (706); the bottom end of the electrical connector (7) is sealed by environmental adhesive (12); the upper connecting part (801) has an upper connecting part socket (808) for the connector terminal (702) to be inserted.
7. A ceramic capacitive temperature and pressure sensor according to claim 1, characterized in that, The PFC circuit board (8) is made of a flexible substrate; the upper connecting part (801) is provided with a flexible grounding arm (809), and the end of the flexible grounding arm (809) is provided with a sleeve (810). The sleeve (810) is sleeved on the bottom edge of the electrical connector (7) and is pressed against the inner wall of the pressure port seat (1) under the action of the grounding top block (213) and the inner wall of the base mounting groove (101).
8. A ceramic capacitive temperature and pressure sensor according to claim 7, characterized in that, The flexible grounding arm (809) has one of two structures: Firstly, two are symmetrically arranged on both sides of the elastic flange (803); Secondly, it is located on the symmetrical side of the upper connecting part (801) corresponding to the elastic flange (803).
9. A ceramic capacitive temperature and pressure sensor according to claim 1, characterized in that, The capacitor pin (401) is soldered to the lower connection hole (807), the upper connection end (301) of the NTC adapter terminal is soldered to the upper connection end hole (805) of the NTC adapter terminal, the lower connection end (302) of the NTC adapter terminal is soldered to the lower connection end hole (601) of the NTC adapter terminal, the temperature sensing needle body (501) is soldered to the temperature sensing needle body hole (602), and the connector terminal (702) is soldered to the upper connection hole (808).
10. A ceramic capacitive temperature and pressure sensor according to claim 1, characterized in that, The bottom wall of the base mounting groove (101) is provided with a pressure-sensitive sealing ring groove (107), and a pressure-sensitive sealing ring (10) is embedded in the pressure-sensitive sealing ring groove (107); the bottom wall of the ceramic capacitor mounting groove (201) is provided with a ceramic capacitor sealing groove (212), and a capacitor sealing ring (11) is embedded in the ceramic capacitor sealing groove (212).
Citation Information
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