Ceramic substrate structure, intelligent power module, controller and household appliance

Abstract

The invention discloses a ceramic substrate structure, an intelligent power module, a controller and a household appliance, and relates to the technical field of semiconductors. The copper-clad ceramic substrate comprises a first copper-clad ceramic substrate and at least one second copper-clad ceramic substrate, wherein the first copper-clad ceramic substrate comprises at least one first upper core area; the at least one second copper-clad ceramic substrate is connected with the first copper-clad ceramic substrate, an angle is formed between the at least one second copper-clad ceramic substrate and the first copper-clad ceramic substrate, and a second upper core area is arranged on the at least one second copper-clad ceramic substrate. Through the arrangement of the included angle between the first copper-clad ceramic substrate and the second copper-clad ceramic substrate, the intelligent power module can form a multi-surface three-dimensional structure. The chip located in the first upper chip area and the chip located in the second upper chip area can dissipate heat through other surfaces, except the mounting surface, of the intelligent power module, so that the heat dissipation efficiency of the chipset is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a ceramic substrate structure, a smart power module, a controller, and a home appliance. Background Technology

[0002] An Intelligent Power Module (IPM) is a power switching device widely used in controlling and driving high-power electronic devices. An IPM typically includes a power chip, a driver chip, and a main control chip. Because the IPM module has a planar structure, all these chips are mounted on the same plane. The IPM module can only dissipate heat through single-sided or double-sided cooling, resulting in low heat dissipation efficiency. Summary of the Invention

[0003] To address the problem that IPM modules, where all chips are mounted on the same plane, can only dissipate heat through single-sided or double-sided cooling, resulting in low heat dissipation efficiency, this invention is proposed to provide a ceramic substrate structure, intelligent power module, controller, and home appliance that overcomes or at least partially solves the aforementioned problems.

[0004] According to a first aspect of the present invention, a ceramic substrate structure is provided, the ceramic substrate structure comprising:

[0005] A first copper-clad ceramic substrate, the first copper-clad ceramic substrate including at least one first upper core area, the first upper core area for mounting chips in the chipset of the smart power module;

[0006] At least one second copper-clad ceramic substrate is provided, the second copper-clad ceramic substrate is connected to the first copper-clad ceramic substrate and is set at an angle to the first copper-clad ceramic substrate, wherein at least one second copper-clad ceramic substrate is provided with a second upper chip area, the second upper chip area is used for mounting chips in the chipset.

[0007] In one optional aspect of the invention, when at least three second copper-clad ceramic substrates are provided, the at least three second copper-clad ceramic substrates and the first copper-clad ceramic substrate are arranged to form an accommodating cavity, wherein the chipset is located within the accommodating cavity.

[0008] In one optional aspect of the invention, when two second copper-clad ceramic substrates are provided, one end of each of the two second copper-clad ceramic substrates is connected to the other.

[0009] In one optional embodiment, a first mounting hole is formed at the edge of the first copper-clad ceramic substrate near the first end face of the second copper-clad ceramic substrate, and a second mounting block is provided on the end face of the second copper-clad ceramic substrate near the first copper-clad ceramic substrate, the second mounting block being inserted into the first mounting hole; or,

[0010] A first mounting block is provided on the edge of the first end face of the first copper-clad ceramic substrate near the first end face of the second copper-clad ceramic substrate, and a second mounting hole is provided on the end face of the second copper-clad ceramic substrate near the first copper-clad ceramic substrate, and the first mounting block is inserted into the second mounting hole.

[0011] In one optional embodiment of the invention, the ceramic substrate structure further includes at least two limiting posts, wherein the at least two limiting posts are disposed at the end face edge of the first copper-clad ceramic substrate near the second copper-clad ceramic substrate.

[0012] The two limiting posts at adjacent positions cooperate to form a limiting groove, and the second copper-clad ceramic substrate is embedded in the limiting groove to limit the second copper-clad ceramic substrate.

[0013] In one optional embodiment, the second copper-clad ceramic substrate includes a first substrate portion and a second substrate portion, wherein the first substrate portion and the second substrate portion are disposed at an angle; wherein...

[0014] The second mounting block or the second mounting hole is provided on the second substrate portion, and the second substrate portion is in contact with the surface of the first copper-clad ceramic substrate.

[0015] In one optional aspect of the invention, when four second copper-clad ceramic substrates are provided, the first copper-clad ceramic substrate has a cuboid structure.

[0016] Four second copper-clad ceramic substrates are arranged on the same end face of the first copper-clad ceramic substrate to form the receiving cavity. The cross-sectional shape of the receiving cavity is rectangular, and each second copper-clad ceramic substrate is arranged perpendicularly to the first copper-clad ceramic substrate.

[0017] Based on a second aspect of the present invention, a smart power module is also provided, the smart power module comprising:

[0018] The ceramic substrate structure as described in any of the above invention descriptions;

[0019] A chipset, the chipset including at least one power chip, the at least one power chip being mounted in the second upper chip region.

[0020] In one optional embodiment, the chipset further includes a main control chip and a driver chip, wherein the main control chip and the driver chip are disposed in the first upper chip region, and all the power chips are disposed in the second upper chip region.

[0021] In one optional embodiment, the chipset further includes an intermediate chip located between the main control chip and the driver chip, and electrically connected to both the main control chip and the driver chip, wherein the main control chip is mounted on the first upper chip area.

[0022] In one optional embodiment, the intelligent power module further includes a pin unit disposed on the side of the second copper-clad ceramic substrate away from the first copper-clad ceramic substrate.

[0023] Based on a third aspect of the present invention, a controller is also provided, the controller comprising the intelligent power module as described in any one of the above-described inventions.

[0024] Based on a fourth aspect of the present invention, a household appliance is also provided, the household appliance including the controller as described in the above-described invention.

[0025] Compared with the prior art, the present invention includes a first copper-clad ceramic substrate and at least one second copper-clad ceramic substrate. The first copper-clad ceramic substrate includes at least one first upper core region for mounting chips in the chipset of the smart power module. At least one second copper-clad ceramic substrate is connected to the first copper-clad ceramic substrate and is angled relative to the first copper-clad ceramic substrate. A second upper core region is disposed on at least one second copper-clad ceramic substrate for mounting chips in the chipset. Thus, by setting the angle between the first and second copper-clad ceramic substrates, the smart power module can form a multi-faceted three-dimensional structure. Chips located in the first upper core region and chips located in the second upper core region can dissipate heat through the surfaces of the smart power module other than the mounting surface, thereby improving the heat dissipation efficiency of the chipset.

[0026] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0027] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings.

[0028] In the attached diagram:

[0029] Figure 1 This is a three-dimensional structural diagram of a ceramic substrate structure provided in an embodiment of this application;

[0030] Figure 2 This is a three-dimensional structural schematic diagram of a first copper-clad ceramic substrate provided in an embodiment of this application;

[0031] Figure 3 This is a three-dimensional structural schematic diagram of a second copper-clad ceramic substrate provided in an embodiment of this application;

[0032] Figure 4 This is a three-dimensional structural schematic diagram of the first second copper-clad ceramic substrate in a ceramic substrate structure provided in an embodiment of this application;

[0033] Figure 5 This is a three-dimensional structural schematic diagram of the second copper-clad ceramic substrate in a ceramic substrate structure provided in an embodiment of this application;

[0034] Figure 6 This is a three-dimensional structural schematic diagram of the third second copper-clad ceramic substrate in a ceramic substrate structure provided in an embodiment of this application;

[0035] Figure 7 This is a three-dimensional structural schematic diagram of the third second copper-clad ceramic substrate in a ceramic substrate structure provided in an embodiment of this application;

[0036] Figure 8 This is a three-dimensional structural diagram of an intelligent power module provided in an embodiment of this application;

[0037] Figure 9 This is a schematic diagram of a stacked structure of a main control chip and a driver chip provided in an embodiment of this application;

[0038] Figure label:

[0039] 1. Ceramic substrate structure; 101. Accommodating cavity; 11. First copper-clad ceramic substrate; 1101. First mounting hole; 12. Second copper-clad ceramic substrate; 121. First substrate portion; 122. Second substrate portion; 123. Second mounting block; 13. Limiting post; 2. Chipset; 21. Main control chip; 22. Driver chip; 23. Power chip; 24. Intermediate chip; 3. Pin unit; 4. Connecting wire; 5. Molded package. Detailed Implementation

[0040] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0041] An Intelligent Power Module (IPM) is a power switching device widely used in controlling and driving high-power electronic devices. An IPM typically includes a power chip, a driver chip, and a main control chip. Because the IPM module has a planar structure, all these chips are mounted on the same plane. The IPM module can only dissipate heat through single-sided or double-sided cooling, resulting in low heat dissipation efficiency.

[0042] Based on the aforementioned technical problems, this application proposes an embodiment that may include a first copper-clad ceramic substrate 11 and at least one second copper-clad ceramic substrate 12. The first copper-clad ceramic substrate 11 includes at least one first upper core region for mounting chips in the chipset 2 of the smart power module. At least one second copper-clad ceramic substrate 12 is connected to the first copper-clad ceramic substrate 11 and is angled relative to it. At least one second copper-clad ceramic substrate 12 has a second upper core region for mounting chips in the chipset 2. Thus, by setting the angle between the first and second copper-clad ceramic substrates 11 and 12, the smart power module can form a multi-faceted three-dimensional structure. Chips located in the first and second upper core regions can dissipate heat through surfaces of the smart power module other than the mounting surface, thereby improving the heat dissipation efficiency of the chipset 2.

[0043] Reference Figure 1-7 This application provides a ceramic substrate structure 1, which may include a first copper-clad ceramic substrate 11 and at least one second copper-clad ceramic substrate 12. The first copper-clad ceramic substrate 11 includes at least one first upper chip region, which is used for mounting chips in a chipset 2 of a smart power module. At least one second copper-clad ceramic substrate 12 is connected to the first copper-clad ceramic substrate 11 and is set at an angle to the first copper-clad ceramic substrate 11. At least one second copper-clad ceramic substrate 12 has a second upper chip region, which is used for mounting chips in the chipset 2.

[0044] In this embodiment, both the first copper-clad ceramic substrate 11 (CCCS) and the second copper-clad ceramic substrate 12 are electronic substrates with ceramic material as the insulating substrate and one or more layers of copper foil covering the surface. Conductive paths can be formed by processing conductive copper foil layers on the insulating substrate.

[0045] The first copper-clad ceramic substrate 11 includes at least one first upper-chip region, which can be understood as an area for chip mounting. For example, when the chip in the chipset 2 of the smart power module is mounted on the first upper-chip region, an electrical connection between the chip located on the first upper-chip region and other electronic devices can be formed through the conductive copper foil layer on the surface of the first copper-clad ceramic substrate 11.

[0046] The second copper-clad ceramic substrate 12 includes at least one second upper-chip region, which can be understood as a region for chip mounting. For example, when the chip in the chipset 2 of the smart power module is mounted in the second upper-chip region, an electrical connection between the chip located in the second upper-chip region and other electronic devices can be formed through the conductive copper foil layer on the surface of the second copper-clad ceramic substrate 12.

[0047] The second copper-clad ceramic substrate 12 is connected to the first copper-clad ceramic substrate 11 and forms a certain angle with the first copper-clad ceramic substrate 11. For example, the included angle can be an acute angle, a right angle, or an obtuse angle. Due to the angle between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12, the intelligent power module can form a multi-faceted three-dimensional structure. Furthermore, the chips of the chipset 2 can be mounted on different planes, forming a three-dimensional distribution. For example, some chips in the chipset 2 are mounted on the first copper-clad ceramic substrate 11, and other chips in the chipset 2 are mounted on the second copper-clad ceramic substrate 12. Therefore, the heat dissipation path of the chipset 2 can be along one or both sides of the first copper-clad ceramic substrate 11, and along one or both sides of the second copper-clad ceramic substrate 12. Heat dissipation occurs through the surfaces of the intelligent power module other than the mounting surface (the end face used to connect to the printed circuit board). This improves the heat dissipation efficiency of the chipset 2.

[0048] In one optional embodiment, when at least two second copper-clad ceramic substrates 12 are provided, the at least two second copper-clad ceramic substrates 12 and the first copper-clad ceramic substrate 11 are arranged to form an accommodating cavity 101, wherein the chipset 2 is located within the accommodating cavity 101.

[0049] In this embodiment, when at least two second copper-clad ceramic substrates 12 are provided, each of the at least two second copper-clad ceramic substrates 12 forms an angle with the first copper-clad ceramic substrate 11. This forms a receiving cavity 101, which can be an open cavity with an opening. Alternatively, the receiving cavity 101 can be a closed cavity. Therefore, the chips of the chipset 2 can be distributed in the upper chip regions on different planes within the receiving cavity 101. This not only reduces the mounting area required for the chips of the chipset 2 to be mounted on the same plane but also increases the heat dissipation path for the chips.

[0050] Compared to chips laid flat on a single plane or layered on at least two parallel planes, where heat dissipation is limited to single-sided cooling from bottom to top or a combination of bottom-up and top-down cooling, the chips in chipset 2 in this embodiment can achieve double-sided heat dissipation by combining the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12. This increases the chip integration density per unit area of ​​chipset 2 and improves the heat dissipation efficiency of chipset 2, thereby facilitating the miniaturization of intelligent power modules.

[0051] In one or more optional embodiments, two second copper-clad ceramic substrates 12 are provided. The first copper-clad ceramic substrate 11 and the two second copper-clad ceramic substrates 12 cooperate to form an accommodating cavity 101 with an opening. The two second copper-clad ceramic substrates 12 are located on the end face of the first copper-clad ceramic substrate 11 where the first upper chip region is provided. The first copper-clad ceramic substrate 11 and the two second copper-clad ceramic substrates 12 are respectively set at an angle. Thus, the end face of the second copper-clad ceramic substrate 12 near the first copper-clad ceramic substrate 11 can provide chip mounting, and the end face of the second copper-clad ceramic substrate 12 away from the first copper-clad ceramic substrate 11 can provide the arrangement of a heat sink for a smart power module.

[0052] One or more optional embodiments of the application are described below. Figure 1 As shown, four second copper-clad ceramic substrates 12 are provided. The first copper-clad ceramic substrate 11 has a cuboid structure. The four second copper-clad ceramic substrates 12 are arranged on the same end face of the first copper-clad ceramic substrate 11 to form the accommodating cavity 101, and the accommodating cavity 101 has a rectangular cross-sectional shape.

[0053] In this embodiment, the first copper-clad ceramic substrate 11 has a cuboid structure. For example, the cross-sectional shape of the first copper-clad ceramic substrate 11 can be rectangular, and the thickness of the first copper-clad ceramic substrate 11 extending along the height direction is relatively thin. Four second copper-clad ceramic substrates 12 are respectively located at the edges of the end faces of the first copper-clad ceramic substrate 11 where the first upper core area is located. The four second copper-clad ceramic substrates 12 and the first copper-clad ceramic substrate 11 enclose the accommodating cavity 101. For example, the first copper-clad ceramic substrate 11 can serve as the bottom wall of the accommodating cavity 101, and the second copper-clad ceramic substrates 12 can serve as the side walls of the accommodating cavity 101. Therefore, when four second copper-clad ceramic substrates 12 are provided, the four second copper-clad ceramic substrates 12 can provide a larger number of second upper core areas, facilitating the dispersed arrangement of the chips of the chipset 2 within the smaller accommodating cavity 101, which can greatly reduce the planar area required for chip mounting in the chipset 2. Furthermore, the packaged intelligent power module can be expanded to have five heat dissipation mounting surfaces, which can be used to arrange heat sinks. This increases the number of heat dissipation paths of the intelligent power module and greatly improves its heat dissipation efficiency.

[0054] In the above-described embodiments, the angle between the four second copper-clad ceramic substrates 12 and the first copper-clad ceramic substrate 11 allows the accommodating cavity 101 to form a trapezoid or cuboid.

[0055] In another embodiment or more, each of the second copper-clad ceramic substrates 12 is perpendicularly disposed to the first copper-clad ceramic substrate 11. That is, the packaged smart power module can be a cuboid structure. The perpendicular arrangement allows the accommodating cavity 101 to be a cuboid, i.e., the cross-sectional shape of the accommodating cavity 101 is rectangular. This facilitates the assembly and positioning of the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12, and improves the ease of connection between the second copper-clad ceramic substrate 12 and the first copper-clad ceramic substrate 11.

[0056] In summary, based on the above structural design, the three-dimensional structure of the intelligent power module can be formed by the ceramic substrate structure 1 of at least three copper-clad ceramic substrates, and at least two planes for arranging heat sinks can be provided on the basis of the formed three-dimensional structure, thereby greatly improving the heat dissipation efficiency of the intelligent power module.

[0057] An optional embodiment of the application, referring to... Figure 2 and Figure 3As shown, the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12 are inserted and fixed. The first copper-clad ceramic substrate 11 has a first mounting hole 1101 at the edge of the first end face of the second copper-clad ceramic substrate 12, and the second copper-clad ceramic substrate 12 has a second mounting block 123 at the end face of the first copper-clad ceramic substrate 11. The second mounting block 123 is inserted into the first mounting hole 1101.

[0058] In this embodiment, the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12 can be fixed together by an insertion method. For example, multiple first mounting holes 1101 can be provided on the edge of the first copper-clad ceramic substrate 11, and second mounting blocks 123 are provided on the second copper-clad ceramic substrate 12 at positions corresponding to the first mounting holes 1101, wherein the number of second mounting blocks 123 is consistent with the number of first mounting holes 1101. Thus, the second mounting blocks 123 are inserted into the first mounting holes 1101, thereby achieving a fixed connection between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12.

[0059] In one or more embodiments, a plurality of first mounting holes 1101 may be spaced apart along one edge of the first copper-clad ceramic substrate 11, thereby improving the connection strength between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12 through the insertion and engagement between the plurality of first mounting holes 1101 and the plurality of second mounting blocks 123.

[0060] In another optional embodiment, a first mounting block is provided on the edge of the first copper-clad ceramic substrate 11 near the first end face of the second copper-clad ceramic substrate 12, and a second mounting hole is provided on the end face of the second copper-clad ceramic substrate 12 near the first copper-clad ceramic substrate 11, and the first mounting block is inserted into the second mounting hole.

[0061] In this embodiment, multiple first mounting blocks can be provided on the edge of the first copper-clad ceramic substrate 11, and second mounting holes are provided on the second copper-clad ceramic substrate 12 corresponding to the positions of the first mounting blocks. The number of second mounting holes is consistent with the number of first mounting blocks. Thus, the first mounting blocks are inserted into the second mounting holes to achieve a fixed connection between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12.

[0062] Multiple first mounting blocks can be spaced apart along one edge of the first copper-clad ceramic substrate 11, thereby improving the connection strength between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12 through the insertion and engagement between the multiple first mounting blocks and the multiple second mounting holes.

[0063] An optional embodiment of the application, referring to... Figure 1 and Figure 2 As shown, the ceramic substrate structure 1 further includes at least two limiting posts 13, which are disposed at the end edge of the first copper-clad ceramic substrate 11 near the second copper-clad ceramic substrate 12. Two limiting posts 13 at adjacent positions cooperate to form a limiting groove, in which the second copper-clad ceramic substrate 12 is embedded to limit the movement of the second copper-clad ceramic substrate 12.

[0064] In this embodiment, the ceramic substrate structure 1 may further include at least two limiting posts 13. The number of limiting posts 13 is positively correlated with the number of second copper-clad ceramic substrates 12. The limiting posts 13 are disposed at the end face edge of the first copper-clad ceramic substrate 11 near the second copper-clad ceramic substrate 12. Two adjacent limiting posts 13 cooperate to form a limiting groove, in which the second copper-clad ceramic substrate 12 is embedded, thereby limiting the second copper-clad ceramic substrate 12 through the limiting posts 13.

[0065] For example, during the insertion process between the second copper-clad ceramic substrate 12 and the first copper-clad ceramic substrate 11, the limiting posts 13 located on both sides of the second copper-clad ceramic substrate 12 can be used to assemble and position the second copper-clad ceramic substrate 12, thereby achieving insertion positioning between the first copper-clad ceramic substrate 11 and the second ceramic substrate. This improves the assembly efficiency between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12.

[0066] In one or more embodiments, the limiting post 13 and the first copper-clad ceramic substrate 11 can be an integral structure. For example, the limiting post 13 and the first copper-clad ceramic substrate 11 can be integrally formed using a 3D printing process. When there are four second copper-clad ceramic substrates 12, there can be four corresponding limiting posts 13, each located at the edge vertex of the end face of the first copper-clad ceramic substrate 11. The limiting posts 13 can be arranged perpendicularly to the first copper-clad ceramic substrate 11.

[0067] An optional embodiment of the application, referring to... Figure 3 , Figure 4 , Figure 5 , Figure 6 as well as Figure 7As shown, the second copper-clad ceramic substrate 12 includes a first substrate portion 121 and a second substrate portion 122, with the first substrate portion 121 and the second substrate portion 122 being arranged at an angle. The second mounting block 123 or the second mounting hole is provided on the second substrate portion 122, and the second substrate portion 122 is in contact with the surface of the first copper-clad ceramic substrate 11.

[0068] In this embodiment of the application, the second copper-clad ceramic substrate 12 may include a second substrate portion 122 connected to the first substrate portion 121, wherein the first substrate portion 121 and the second substrate portion 122 are an integral structure. For example, the first substrate portion 121 and the second substrate portion 122 may be integrally formed using a 3D printing process.

[0069] The first substrate portion 121 and the second substrate portion 122 are arranged at an angle. The second substrate portion 122 is in surface contact with the first copper-clad ceramic substrate 11. That is, when the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12 are fixedly connected, the second substrate portion 122 moves from top to bottom and forms surface contact with the first copper-clad ceramic substrate 11, thus confirming that the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12 are assembled in place. The surface contact between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12 further improves the connection strength. Furthermore, the arrangement of the second substrate portion 122 increases the contact area between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12, thereby facilitating the setting of the second mounting block 123 or the second mounting hole.

[0070] The included angle formed by the first substrate portion 121 and the second substrate portion 122 is consistent with the included angle formed between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12.

[0071] In one or more embodiments, the second mounting block 123 and the second substrate portion 122 can be an integral structure. For example, the first substrate portion 121, the second substrate portion 122 and the second mounting block 123 can be integrally formed using 3D printing technology.

[0072] In summary, this application discloses a ceramic substrate structure, which may include a first copper-clad ceramic substrate 11 and at least one second copper-clad ceramic substrate 12. The first copper-clad ceramic substrate 11 includes at least one first upper core region, which is used for mounting chips in the chipset 2 of the smart power module. At least one second copper-clad ceramic substrate 12 is connected to the first copper-clad ceramic substrate 11 and is set at an angle to the first copper-clad ceramic substrate 11. At least one second copper-clad ceramic substrate 12 has a second upper core region, which is used for mounting chips in the chipset 2. Thus, by setting the angle between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12, the smart power module can form a multi-faceted three-dimensional structure. Chips located in the first upper core region and chips located in the second upper core region can dissipate heat through the surfaces of the smart power module other than the mounting surface, thereby improving the heat dissipation efficiency of the chipset 2.

[0073] Reference Figure 8 and Figure 9 As shown in the embodiments of this application, an intelligent power module is also disclosed. The intelligent power module may include a ceramic substrate structure 1 and a chipset 2 as described in any of the above application embodiments. The chipset 2 includes at least one power chip 23, and at least one power chip 23 is mounted in the second upper chip region.

[0074] In this embodiment of the application, the ceramic substrate structure 1 may include a first copper-clad ceramic substrate 11 and at least one second copper-clad ceramic substrate 12.

[0075] Both the first copper-clad ceramic substrate 11 (CCCS) and the second copper-clad ceramic substrate 12 are electronic substrates with ceramic material as the insulating substrate and one or more layers of copper foil covering the surface. Conductive paths can be formed by processing conductive copper foil layers on the insulating substrate.

[0076] The first copper-clad ceramic substrate 11 includes at least one first upper-chip region, which can be understood as an area for chip mounting. For example, when the chip in the chipset 2 of the smart power module is mounted on the first upper-chip region, an electrical connection between the chip located on the first upper-chip region and other electronic devices can be formed through the conductive copper foil layer on the surface of the first copper-clad ceramic substrate 11.

[0077] The second copper-clad ceramic substrate 12 includes at least one second upper-chip region, which can be understood as a region for chip mounting. For example, when the chip in the chipset 2 of the smart power module is mounted in the second upper-chip region, an electrical connection between the chip located in the second upper-chip region and other electronic devices can be formed through the conductive copper foil layer on the surface of the second copper-clad ceramic substrate 12.

[0078] The second copper-clad ceramic substrate 12 is connected to the first copper-clad ceramic substrate 11 and forms a certain angle with the first copper-clad ceramic substrate 11. For example, the included angle can be an acute angle, a right angle, or an obtuse angle. Due to the angle between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12, the intelligent power module can form a multi-faceted three-dimensional structure. In one or more embodiments, both the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12 can be obtained by copper-cladding an alumina ceramic substrate.

[0079] The chipset 2 refers to the collection of chips included in the intelligent power module. For example, the chipset 2 may include at least one power chip 23, which is responsible for power conversion and power output in the intelligent power module. Furthermore, the power chip 23 needs to perform high-frequency switching operations, and due to the conduction and switching losses it generates, the power chip 23 becomes the main heat-generating component in the intelligent power module.

[0080] At least one power chip 23 is mounted on the second upper chip area, that is, at least one power chip 23 is mounted on the second copper-clad ceramic substrate 12. A portion of the chips in the chipset 2 can be mounted on the second copper-clad ceramic substrate 12, thereby allowing the chips of the chipset 2 to be mounted on different planes, forming a three-dimensional distribution. Correspondingly, the heat dissipation path of the chipset 2 can be along one or both sides of the first copper-clad ceramic substrate 11, and along one or both sides of the second copper-clad ceramic substrate 12. Heat dissipation is achieved through surfaces of the intelligent power module other than the mounting surface (the end face used for connection to the printed circuit board), for example, by adding a mounting plane for mounting a heat sink to the intelligent power module, thereby improving the heat dissipation efficiency of the chipset 2.

[0081] An optional embodiment of the application, referring to... Figure 1 , Figure 2 as well as Figure 9 As shown, the chipset 2 may further include a main control chip 21 and a driver chip 22, which are disposed in the first upper chip area.

[0082] In this embodiment, the main control chip 21 outputs a low-voltage logic signal to control the operating state of the driver chip 22. The driver chip 22 converts the low-voltage logic signal input from the main control chip 21 into a control signal suitable for the power chip 23, for example, into a high-voltage drive signal that can drive the power chip 23. The main control chip 21 is electrically connected to the driver chip 22, and the driver chip 22 is electrically connected to the power chip 23.

[0083] The main control chip 21 and the driver chip 22 are both located in the first upper chip region. All the power chips 23 are located in the second upper chip region. Since the main control chip 21 and the driver chip 22 generate relatively little heat, their heat dissipation requirements are low. The structural design of mounting the main control chip 21 and the driver chip 22 on the first copper-clad ceramic substrate 11 and all the power chips 23 on the second copper-clad ceramic substrate 12 facilitates the arrangement of different heat sinks. For example, a heat sink with weak heat dissipation capacity can be provided on the end face of the first copper-clad ceramic substrate 11 away from the first upper chip region. A heat sink with strong heat dissipation capacity can be provided on the end face of the second copper-clad ceramic substrate 12 away from the second upper chip region. This allows for the installation of heat sinks adapted to the heat dissipation requirements of different types of chips in the chipset 2, based on their distribution on different planes. This significantly improves the heat dissipation power of the intelligent power module and reduces energy waste and cost associated with heat sinks.

[0084] In one or more embodiments, the main control chip 21 and the driver chip 22, and the driver chip 22 and the power chip 23, can be bonded together using metal connecting wires 4, which may include, but are not limited to, gold wires, silver wires, and copper wires.

[0085] An optional embodiment of the application, referring to... Figure 1 , Figure 2 as well as Figure 9 As shown, the chipset 2 also includes an intermediate chip 24, which is located between the main control chip 21 and the driver chip 22, and is electrically connected to the main control chip 21 and the driver chip 22 respectively. The main control chip 21 is mounted on the first upper chip area.

[0086] In this embodiment, the intermediary chip 24 is used for electrical connection between the main control chip 21 and the driver chip 22. The main control chip 21, the intermediary chip 24, and the driver chip 22 can be stacked. The intermediary chip 24 can have internal circuitry, thereby forming a signal transmission path between the main control chip 21 and the driver chip 22 through the circuit design of the intermediary chip 24.

[0087] During the stacking process of the main control chip 21, the intermediate chip 24, and the driver chip 22, solder balls are first implanted onto the main control chip 21, and the intermediate chip 24 is placed on top of the main control chip 21, forming an electrical connection between the main control chip 21 and the intermediate chip 24 through the solder balls. Then, solder balls are implanted onto the intermediate chip 24, and finally, the driver chip 22 is placed on top of the intermediate chip 24, thereby achieving the stacking and electrical connection of the main control chip 21, the intermediate chip 24, and the driver chip 22. Finally, the end face of the main control chip 21 furthest from the intermediate chip 24 is mounted on the first upper die area.

[0088] Compared to the bonding between the main control chip 21 and the driver chip 22 via connecting wire 4, the intermediate connection via the intermediary chip 24 allows the main control chip 21 and the driver chip 22 to form an electrical connection in the vertical direction, which can greatly shorten the signal transmission distance between the main control chip 21 and the driver chip 22 and reduce signal delay or attenuation. This optimizes the electrical performance of the chipset 2. Furthermore, the stacked design of the main control chip 21 and the driver chip 22 can further reduce the planar area required for the chips to be laid on the same plane, thereby improving the integration density of the intelligent power chip 23.

[0089] At least one driver chip 22 may be provided. For example, one, two, or three driver chips 22 may be provided. Those skilled in the art can determine the specific number of driver chips 22 according to actual design requirements, and no further limitations are made here. The stacked arrangement of the driver chips 22 and the main control chip 21, combined with the distributed arrangement of the power chips 23 on different planes, can integrate a greater number and variety of chips in a limited space while meeting the heat dissipation requirements of the intelligent power module.

[0090] An optional embodiment of the application, referring to... Figure 1 , Figure 4 , Figure 5 , Figure 6 as well as Figure 7 As shown, the intelligent power module further includes a pin unit 3, which is disposed on the side of the second copper-clad ceramic substrate 12 away from the first copper-clad ceramic substrate 11.

[0091] In this embodiment, the pin unit 3 is a metal conductive unit used to electrically connect the intelligent power module to an external circuit, such as a controller's printed circuit board. In one example, for the intelligent power module, the pin unit 3 may include power pins, signal pins, and ground pins. The pin unit 3 is disposed on the side of the second copper-clad ceramic substrate 12 away from the first copper-clad ceramic substrate 11. The pin unit 3 can be soldered to the copper layer on the second copper-clad ceramic substrate 12, thereby achieving an electrical connection between the pin unit 3 and the second copper-clad ceramic substrate 12. The second copper-clad ceramic substrate 12 and the power chip 23 can be bonded together via connecting wires 4, and the second copper-clad ceramic substrate 12 and the intermediate chip 24 can also be bonded together via connecting wires 4. (Refer to...) Figure 4 , Figure 5 , Figure 6 as well as Figure 7 As shown, the pins and copper layer shapes on each of the second copper-clad ceramic substrates 12 are different. Some of the second copper-clad ceramic substrates 12 may not have a second upper core area. Those skilled in the art can determine the specific structural layout according to actual design requirements, and no further limitations are made here.

[0092] After the intelligent power module is packaged with a molding compound 5, the molding compound 5 fills the accommodating cavity 101. When the intelligent power module is assembled with the printed circuit board of the controller, the first copper-clad ceramic substrate 11 can be located on the end face of the intelligent power module away from the controller, that is, the molding compound 5 is attached to the printed circuit board. This makes it easy to arrange a heat sink on the end face of the first copper-clad ceramic substrate 11 away from the first upper core area, and the distance between the heat sink on each side and the chip in the corresponding area is very short.

[0093] For example, the bottom heat dissipation path of the power chip 23 located on the second copper-clad ceramic substrate 12 is: chip – second copper-clad ceramic substrate 12 – heat sink. The bottom heat dissipation path of the driver chip 22 located on the first copper-clad ceramic substrate 11 is: driver chip 22 – intermediate chip 24 – main control chip 21 – first copper-clad ceramic substrate 11 – heat sink. The bottom heat dissipation path of the main control chip 21 located on the first copper-clad ceramic substrate 11 is: main control chip 21 – first copper-clad ceramic substrate 11 – heat sink. Furthermore, the second copper-clad ceramic substrate 12 can be distributed in different directions of the intelligent power module. This increases the number of heat dissipation paths of the intelligent power module and significantly improves its heat dissipation efficiency.

[0094] The power chip 23 is arranged around the periphery of the driver chip 22. Compared with the flat design of all chips, the embodiment of this application can also reduce the connection length of the connection line 4 between the driver chip 22 and the power chip 23, thereby optimizing the electrical performance of the smart power module.

[0095] This application also discloses a controller, which includes the intelligent power module as described in any of the above-described embodiments.

[0096] In this embodiment, the controller may include a first copper-clad ceramic substrate 11 and at least one second copper-clad ceramic substrate 12. The first copper-clad ceramic substrate 11 includes at least one first upper core region for mounting chips in the chipset 2 of the smart power module. At least one second copper-clad ceramic substrate 12 is connected to the first copper-clad ceramic substrate 11 and is angled relative to it. At least one second copper-clad ceramic substrate 12 has a second upper core region for mounting chips in the chipset 2. Thus, by setting the angle between the first and second copper-clad ceramic substrates 11 and 12, the smart power module can form a multi-faceted three-dimensional structure. Chips located in the first and second upper core regions can dissipate heat through surfaces of the smart power module other than the mounting surface, thereby improving the heat dissipation efficiency of the chipset 2.

[0097] Furthermore, a controller equipped with the intelligent power module described in any of the above embodiments can achieve high heat dissipation efficiency of the intelligent power module and improve the operational stability of the controller. The intelligent power module expands from a flat arrangement of chips to a distributed arrangement of chips on different copper-clad ceramic substrates. Besides increasing the number of heat dissipation paths and improving heat dissipation efficiency, it can also reduce the mounting area occupied by intelligent power modules with the same chip integration density on the controller's printed circuit board. This can improve the device integration density on a controller with the same planar area, or facilitate the miniaturization of the controller.

[0098] This application also discloses a household appliance, which includes a controller as described in the above application embodiments.

[0099] In this embodiment, the household appliance may include, but is not limited to, air conditioners, air purifiers, washing machines, refrigerators, fans, and vacuum cleaners. The household appliance may include a first copper-clad ceramic substrate 11 and at least one second copper-clad ceramic substrate 12. The first copper-clad ceramic substrate 11 includes at least one first upper core region, which is used for mounting chips in the chipset 2 of the intelligent power module. At least one second copper-clad ceramic substrate 12 is connected to the first copper-clad ceramic substrate 11 and is angled relative to it. At least one second copper-clad ceramic substrate 12 has a second upper core region, which is used for mounting chips in the chipset 2. Thus, by setting the angle between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12, the intelligent power module can form a multi-faceted three-dimensional structure. Chips located in the first upper core region and chips located in the second upper core region can dissipate heat through the surfaces of the intelligent power module other than the mounting surface, thereby improving the heat dissipation efficiency of the chipset 2. Furthermore, the household appliance including the above-mentioned controller has advantages such as high control stability and long service life.

[0100] In summary, this application discloses a ceramic substrate structure 1, a smart power module, a controller, and a home appliance. This application embodiment may include a first copper-clad ceramic substrate 11 and at least one second copper-clad ceramic substrate 12. The first copper-clad ceramic substrate 11 includes at least one first upper core region, which is used for mounting chips in the chipset 2 of the smart power module. At least one second copper-clad ceramic substrate 12 is connected to the first copper-clad ceramic substrate 11 and is angled relative to it. At least one second copper-clad ceramic substrate 12 has a second upper core region, which is used for mounting chips in the chipset 2. Thus, by setting the angle between the first copper-clad ceramic substrate 11 and the second copper-clad ceramic substrate 12, the smart power module can form a multi-faceted three-dimensional structure. Chips located in the first upper core region and chips located in the second upper core region can dissipate heat through the surfaces of the smart power module other than the mounting surface, thereby improving the heat dissipation efficiency of the chipset 2.

[0101] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0102] It will be readily apparent to those skilled in the art that any combination of the above embodiments is feasible, and therefore any combination of the above embodiments is an implementation scheme of the present invention. However, due to space limitations, this specification will not describe them in detail here.

[0103] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0104] Similarly, it should be understood that, in order to simplify the invention and aid in understanding one or more of the various aspects of the invention, in the description of exemplary embodiments of the invention above, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof.

[0105] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

Claims

1. A ceramic substrate structure, characterized in that, The ceramic substrate structure includes: A first copper-clad ceramic substrate, the first copper-clad ceramic substrate including at least one first upper core area, the first upper core area for mounting chips in the chipset of the smart power module; At least one second copper-clad ceramic substrate is connected to the first copper-clad ceramic substrate and is set at an angle to the first copper-clad ceramic substrate. A second upper chip region is provided on at least one second copper-clad ceramic substrate, and the second upper chip region is used for mounting chips in the chipset.

2. The ceramic substrate structure according to claim 1, characterized in that, When at least two second copper-clad ceramic substrates are provided, the at least two second copper-clad ceramic substrates and the first copper-clad ceramic substrate are arranged to form an accommodating cavity, wherein the chipset is located in the accommodating cavity.

3. The ceramic substrate structure according to any one of claims 1 or 2, characterized in that, A first mounting hole is formed on the edge of the first end face of the first copper-clad ceramic substrate near the first end face of the second copper-clad ceramic substrate, and a second mounting block is formed on the end face of the second copper-clad ceramic substrate near the first copper-clad ceramic substrate. The second mounting block is inserted into the first mounting hole; or... A first mounting block is provided on the edge of the first end face of the first copper-clad ceramic substrate near the first end face of the second copper-clad ceramic substrate, and a second mounting hole is provided on the end face of the second copper-clad ceramic substrate near the first copper-clad ceramic substrate, and the first mounting block is inserted into the second mounting hole.

4. The ceramic substrate structure according to claim 3, characterized in that, The second copper-clad ceramic substrate includes a first substrate portion and a second substrate portion, wherein the first substrate portion and the second substrate portion are disposed at an angle; wherein... The second mounting block or the second mounting hole is provided on the second substrate portion, and the second substrate portion is in contact with the surface of the first copper-clad ceramic substrate.

5. The ceramic substrate structure according to claim 1, characterized in that, The ceramic substrate structure further includes at least two limiting posts, which are disposed at the edge of the end face of the first copper-clad ceramic substrate near the second copper-clad ceramic substrate. The two limiting posts at adjacent positions cooperate to form a limiting groove, and the second copper-clad ceramic substrate is embedded in the limiting groove to limit the second copper-clad ceramic substrate.

6. The ceramic substrate structure according to claim 2, characterized in that, When four second copper-clad ceramic substrates are provided, the first copper-clad ceramic substrate has a cuboid structure. Four second copper-clad ceramic substrates are arranged on the same end face of the first copper-clad ceramic substrate to form the accommodating cavity. The accommodating cavity has a rectangular cross-sectional shape, and each second copper-clad ceramic substrate is arranged perpendicularly to the first copper-clad ceramic substrate.

7. A smart power module, characterized in that, The intelligent power module includes: The ceramic substrate structure as described in any one of claims 1-6; A chipset, the chipset including at least one power chip, the at least one power chip being mounted in the second upper chip region.

8. The intelligent power module according to claim 7, characterized in that, The chipset also includes a main control chip and a driver chip, the main control chip and the driver chip are disposed in the first upper chip area, and all the power chips are disposed in the second upper chip area.

9. The intelligent power module according to claim 8, characterized in that, The chipset also includes an intermediate chip, which is located between the main control chip and the driver chip and is electrically connected to the main control chip and the driver chip respectively. The main control chip is mounted on the first upper chip area.

10. The intelligent power module according to claim 7, characterized in that, The intelligent power module further includes a pin unit, which is disposed on the side of the second copper-clad ceramic substrate away from the first copper-clad ceramic substrate.

11. A controller, characterized in that, The controller includes the intelligent power module as described in any one of claims 7-10.

12. A household appliance, characterized in that, The household appliance includes the controller as described in claim 11.

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