Silicon wafer cutting device and method for photovoltaic panel manufacturing

Abstract

The invention discloses a silicon wafer cutting device and method for photovoltaic panel manufacturing, the silicon wafer cutting device comprises a pushing mechanism used for installing and pushing a silicon wafer block, a top plate, a bottom plate, four stand columns installed between the top plate and the bottom plate, and a cutting mechanism used for cutting, and the front end and the rear end of the two sides of the lower end face of the top plate are provided with a first side plate and a second side plate correspondingly; the pushing mechanism comprises a linkage plate, guide blocks fixedly installed on the two sides of the upper end of the linkage plate, hydraulic push rods fixed to the two sides of the lower end of the linkage plate, and a bottom frame fixed to the output ends of the lower ends of the two hydraulic push rods. According to the silicon wafer cutting device and method for photovoltaic panel manufacturing, the multiple pulley and motor combinations are included, the efficiency and stability of the cutting process are greatly improved, the cutting speed and distance can be accurately controlled, and the machining quality of silicon wafers is improved; and automatic downward pushing of the silicon crystal block is achieved through the hydraulic push rod, manual intervention is reduced, the automation degree of the cutting process is improved, and then the production efficiency and the working safety are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of silicon wafer cutting processing, in particular to a silicon wafer cutting device and method for photovoltaic panel manufacturing. BACKGROUND

[0002] The silicon wafer cutting device is a supporting equipment for silicon wafer cutting processing. Silicon wafer cutting is an important step in the semiconductor manufacturing process, mainly used for cutting large single crystal silicon ingots into thin slices, which will be further processed for manufacturing various electronic devices such as integrated circuits and photovoltaic cells. Temperature and cutting speed need to be controlled during the cutting process to ensure cutting efficiency and the integrity of the silicon wafer. With the continuous development of technology, people's requirements for the silicon wafer cutting device are also getting higher and higher.

[0003] The existing silicon wafer cutting device has certain drawbacks when in use. The prior art patent application No. CN202010553708.5 discloses a silicon wafer cutting and cleaning mechanism for LED, and the patent application No. CN201910777262.1 discloses a single crystal silicon wafer linear cutting device for LED. In these two cutting methods, the single crystal silicon is fixed and then moved to the cutting line area for fixed-point cutting. After cutting, the clamping seat needs to be moved out to disassemble the cut single crystal wafer. The unloading is not convenient, which brings certain adverse effects to the use process of people. Therefore, we propose a silicon wafer cutting device and method for photovoltaic panel manufacturing. SUMMARY

[0004] The technical problem solved by the present application is that, in view of the deficiencies of the prior art, the present application provides a silicon wafer cutting device and method for photovoltaic panel manufacturing, which includes a combination of multiple pulleys and motors, greatly improving the efficiency and stability of the cutting process, and can accurately control the cutting speed and spacing to improve the processing quality of the silicon wafer. The automatic pushing of the silicon crystal block is realized by the hydraulic push rod, reducing manual intervention and improving the automation level of the cutting process, thereby improving production efficiency and work safety. At the same time, the modular installation method is adopted, which facilitates the disassembly or replacement of parts during maintenance and operation, ensuring the reliability and convenience during long-term use. At the same time, the device can be applied to silicon crystal blocks of different specifications and sizes, meeting the diversified photovoltaic product demand and improving the manufacturing flexibility, which can effectively solve the problems in the background technology.

[0005] Technical solution: To achieve the above object, the technical scheme adopted by the present application is as follows: a silicon wafer cutting device for photovoltaic panel manufacturing, comprising a pushing mechanism for pushing silicon crystal blocks, a top plate, a bottom plate, four vertical columns installed between the top plate and the bottom plate, and a cutting mechanism for cutting, the lower end surface of the top plate is provided with a first side plate and a second side plate on both sides of the front and rear ends respectively, the pushing mechanism comprises a linkage plate, guide blocks fixedly installed on both sides of the upper end of the linkage plate, hydraulic push rods fixedly installed on both sides of the lower end of the linkage plate, a bottom frame fixedly installed on the output ends of the lower ends of the two hydraulic push rods, and adjusting mechanisms and fixing mechanisms installed on both sides of the inside of the bottom frame, wherein the adjusting mechanisms are used to control the fixing mechanisms to realize the opening and closing of the mounting grooves opened at the lower end of the bottom frame to complete the clamping and fixing of the silicon crystal blocks, the adjusting mechanisms provided in the bottom frame are used to adjust the contraction and opening of the fixing mechanisms, that is, the entire bottom frame is in an exposed state when it is opened and closed, at this time, the connecting plate installed with the silicon crystal block is embedded into the bottom frame, then the adjusting mechanism is used again to control the contraction of the fixing mechanism, so that the silicon crystal block is installed in the bottom frame, and the bottom frame realizes lifting movement under the action of the hydraulic push rods at the upper end, and continuously approaches the cutting mechanism during the lifting process to complete the cutting operation of the silicon crystal block.

[0006] As a preferred technical solution of the present application, the cutting mechanism comprises a first pulley, two first connecting shafts, a pay-off roller, a second pulley, a third pulley, a first motor, a fourth pulley, a fifth pulley, a second motor, a take-up roller, a linkage belt, two second connecting shafts, two main rollers, a diamond wire, and a sixth pulley. The pay-off roller and the take-up roller are respectively fixedly sleeved with the two first connecting shafts, and the two first connecting shafts are respectively installed on the two side columns. The first pulley, the second pulley, and the third pulley are rotationally installed on a first side plate. The fourth pulley, the fifth pulley, and the sixth pulley are rotationally installed on a second side plate. The two main rollers are respectively fixedly sleeved with the two second connecting shafts, and the two second connecting shafts are respectively rotationally arranged at the two sides of the opposite side of the two mounting plates fixed on the bottom plate. The tail end of the diamond wire is installed on the pay-off roller, and the head end is sequentially connected with the take-up roller after the second pulley, the third pulley, the first pulley, the two main rollers, the fourth pulley, the sixth pulley, and the fifth pulley, that is, the diamond wire is installed at the required position and is wound on the main rollers at equal intervals in a multi-group arrangement manner, so that the silicon crystal block can be cut into multiple silicon wafers at one time. When in use, the pay-off and take-up of the diamond wire are realized by starting the first motor and the second motor. The diamond wire rotates on the main rollers to perform the cutting operation. The front and rear ends of the two first connecting shafts are both rotationally connected with a support plate through bearings, and the support plate is fixed on the column. The rear end of the first connecting shaft connected with the take-up roller is provided with the second motor, and the output end of the second motor is fixedly connected with the first connecting shaft. The rotation of the take-up roller is driven by the starting of the second motor, so that the diamond wire wound in sequence is wound. The support plate is installed on the column and connected with the connecting shaft through bearings, so as to realize the stable rotation of the connecting shaft and the take-up roller. The rear end of one of the two second connecting shafts is fixedly provided with the first motor, and the output end of the first motor is connected. The rear ends of the two second connecting shafts are both fixedly sleeved with pulleys, and the two pulleys are connected through the linkage belt. That is, when the first motor is started, the two second connecting shafts are synchronously rotated under the action of the pulleys and the linkage belt. The first motor and the second motor are both operated through the control circuit board. They can be simultaneously operated and the rotating speed can be controlled under the control of the control circuit board.

[0007] As a preferred technical solution of the present application, the upper end face of the bottom plate is provided with two mounting plates at the front end and arranged in a front-rear vertical arrangement. The four columns are respectively fixed at the four corners of the bottom plate, so as to realize the stable installation effect of the cutting mechanism and ensure the stability of the frame body of the whole device.

[0008] As a preferred technical scheme of the present application, the lower end surface of the top plate is provided with a sliding groove on both sides, a threaded rod and a guide rod are rotatably arranged in the two sliding grooves respectively, a servo motor is fixedly connected to the rear end of the threaded rod, one of the two guide blocks is threadedly connected to the threaded rod and the other guide block is slidably connected to the guide rod, that is, when the servo motor is started, the threaded rod connected to the output end is rotated, the threaded rod drives the guide block connected to the outer side to move, since the two guide blocks are mounted on the linkage plate and the other guide block is slidably connected to the guide rod, the entire pushing mechanism cannot rotate, and the effect of horizontal forward and backward movement is realized under the action of the threaded rod, so that the front and rear positions of the silicon ingot mounted in the bottom frame can be adjusted.

[0009] As a preferred technical scheme of the present application, the adjusting mechanism includes a twisting block, an adjusting rod is fixedly arranged at the rear end of the twisting block, and an oval block is fixedly sleeved on the adjusting rod, the fixing mechanism includes two fixed plates, a connecting block is fixedly arranged on the upper end surface of each fixed plate, a connecting spring is fixedly arranged on one side of the connecting block, four connecting springs are arranged in two groups, and a pushing plate is fixedly arranged, the two pushing plates are located on the two sides of the oval block, a bearing is sleeved on the outer side of the twisting block to rotatably arrange it on the bottom frame and penetrate the front end surface of the bottom frame, and the adjusting rod and the oval block are rotatably arranged in the bottom frame, the lower end of the bottom frame is provided with a placing groove, and grooves are formed in the groove walls on both sides, the fixed plates are located in the grooves, the connecting block, the connecting spring and the pushing plate are located in the bottom frame, the adjusting rod rotates to drive the oval block to rotate, the oval block extrudes the pushing plates on both sides during rotation, thereby causing the connecting spring to shrink to drive the connecting block and the fixed plate to horizontally displace.

[0010] As a preferred technical scheme of the present application, the upper end surface of the silicon ingot is connected to a plastic plate through stick rod glue, the upper end surface of the plastic plate is connected to a connecting plate through stick plate glue, the connecting plate is located in the bottom frame and is located on the upper end surfaces of the two pushing plates, and the function of quickly installing and fixing the silicon ingot is completed.

[0011] As a preferred technical scheme of the present application, the inner side of the stand is positioned and mounted with a lifting cylinder, a lifting rod is movably arranged on the lifting cylinder, an infrared monitoring mechanism is mounted on the top of the lifting rod, a monitor is mounted at the front end of the infrared monitoring mechanism, and a monitoring probe is arranged at the front end of the monitor, the lifting cylinder drives the lifting rod and the monitor and the monitoring probe to move up and down, the horizontal direction of the monitor and the monitoring probe is adjusted according to the cutting position, and whether the cutting mechanism is on the cutting position is confirmed by the monitoring probe emitting infrared rays.

[0012] A silicon wafer cutting method for manufacturing photovoltaic panels, specifically comprising the following operation steps: S1: Silicon crystal block installation: Install the silicon crystal block on the connecting plate and install the connecting plate inside the bottom frame and clamp and fix it through the push plates on both sides; S2: Cutting debugging: Debug the cutting mechanism, including the adjustment of the rotating speed and the cutting interval, that is, the adjustment and control of the motor for control adjustment and the interval of the diamond wire distribution; S3: Cutting: Move the installed silicon crystal block to the upper end of the cutting mechanism, and then push the silicon crystal block down with the hydraulic push rod, and the cutting mechanism cuts the slowly pushed silicon crystal block.

[0013] Advantages: Compared with the prior art, the present application provides a silicon wafer cutting device and method for photovoltaic panel manufacturing, which has the following advantages: the silicon wafer cutting device and method for photovoltaic panel manufacturing includes a plurality of pulleys and motor combinations, greatly improving the efficiency and stability of the cutting process, and can accurately control the cutting speed and interval, improving the processing quality of the silicon wafer; the automatic pushing of the silicon crystal block is realized by the hydraulic push rod, reducing manual intervention, improving the automation degree of the cutting process, and thus improving the production efficiency and work safety; at the same time, the modular installation method is adopted, which facilitates disassembly or replacement of parts during maintenance and operation, ensuring the reliability and convenience during long-term use; at the same time, the device can be applied to silicon crystal blocks of different specifications and sizes, meeting the diversified photovoltaic product demand, improving the manufacturing flexibility, and the entire silicon wafer cutting device structure is simple, convenient to operate, and the use effect is better than that of the traditional way. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a whole structure schematic diagram of the present application of a silicon wafer cutting device and method for photovoltaic panel manufacturing.

[0015] Figure 2 It is a structure schematic diagram of the present application of a silicon wafer cutting device and method for photovoltaic panel manufacturing.

[0016] Figure 3 It is a structure schematic diagram of the present application of a silicon wafer cutting device and method for photovoltaic panel manufacturing.

[0017] Figure 4 It is a structure schematic diagram of the present application of a silicon wafer cutting device and method for photovoltaic panel manufacturing.

[0018] Figure 5 It is a structure schematic diagram of the present application of a silicon wafer cutting device and method for photovoltaic panel manufacturing.

[0019] Figure 6 It is a structure schematic diagram of the present application of a silicon wafer cutting device and method for photovoltaic panel manufacturing.

[0020] Figure 7It is a structure schematic view of the infrared monitoring mechanism in the silicon wafer cutting device and method for manufacturing photovoltaic panel.

[0021] In the figure: 1, the first side plate; 2, the pushing mechanism; 201, the guide block; 202, the linkage plate; 203, the hydraulic push rod; 204, the bottom frame; 3, the second side plate; 4, the top plate; 5, the column; 6, the mounting plate; 7, the bottom plate; 8, the cutting mechanism; 801, the first pulley; 802, the first connecting shaft; 803, the pay-off roller; 804, the second pulley; 805, the third pulley; 806, the first motor; 807, the fourth pulley; 808, the fifth pulley; 809, the second motor; 8010, the take-up roller; 8011, the linkage belt; 8012, the second connecting shaft; 8013, the main roller; 8014, the diamond wire; 8015, the sixth pulley; 9, the sliding groove; 10, the threaded rod; 11, the guide rod; 12, the adjusting mechanism; 1201, the twisting block; 1202, the adjusting rod; 1203, the oval block; 13, the fixing mechanism; 1301, the fixing plate; 1302, the connecting spring; 1303, the connecting block; 1304, the pushing plate; 14, the adhesive plate glue; 15, the connecting plate; 16, the adhesive stick glue; 17, the plastic plate; 18, the silicon crystal block; 19, the infrared monitoring mechanism; 20, the monitor; 21, the monitoring probe; 22, the lifting rod; 23, the lifting cylinder. DETAILED DESCRIPTION

[0022] The technical solutions of the present application will be described clearly and completely below in combination with the drawings and specific embodiments, but those skilled in the art will understand that the following described embodiments are part of the embodiments of the present application, not all the embodiments, and are only used to illustrate the present application, and should not be regarded as limiting the scope of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application. The specific conditions are not specified in the embodiments, and are carried out according to the conventional conditions or the conditions recommended by the manufacturer. The reagents or instruments used are not specified by the manufacturer, and are conventional products that can be purchased on the market.

[0023] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as limiting the devices or elements referred to have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "linking" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0025] As shown in Figures 1-7 A silicon wafer cutting device for photovoltaic panel manufacturing, comprising a pushing mechanism 2 for pushing a silicon crystal block 18, a top plate 4, a bottom plate 7, four vertical columns 5 mounted between the top plate 4 and the bottom plate 7, and a cutting mechanism 8 for cutting, the lower end surface of the top plate 4 is provided with a first side plate 1 and a second side plate 3 on both sides of the front and rear ends, the pushing mechanism 2 comprises a linkage plate 202, guide blocks 201 fixedly installed on both sides of the upper end of the linkage plate 202, hydraulic push rods 203 fixedly installed on both sides of the lower end of the linkage plate 202, a bottom frame 204 fixedly installed on the output ends of the lower ends of the two hydraulic push rods 203, and adjusting mechanisms 12 and fixing mechanisms 13 installed on both sides of the inside of the bottom frame 204, wherein the adjusting mechanisms 12 are used to control the fixing mechanisms 13 to realize the opening and closing of the mounting slot opened at the lower end of the bottom frame 204 to complete the clamping and fixing of the silicon crystal block 18, the adjusting mechanisms 12 provided in the bottom frame 204 are used to adjust the contraction and opening of the fixing mechanisms 13, that is, when the bottom frame 204 is in an exposed state during opening and closing, the connecting plate 15 with the silicon crystal block 18 installed is embedded into the bottom frame 204, and then the adjusting mechanisms 12 are used again to control the contraction of the fixing mechanisms 13, so that the silicon crystal block 18 is installed in the bottom frame 204, the bottom frame 204 is lifted and lowered under the action of the hydraulic push rods 203 at the upper end, and continuously approaches the cutting mechanism 8 during lifting and lowering to complete the cutting operation of the silicon crystal block 18, which comprises a plurality of pulleys and motor combinations, greatly improving the efficiency and stability of the cutting process, and can accurately control the cutting speed and distance, and improve the processing quality of the silicon wafer; the automatic pushing of the silicon crystal block is realized by the hydraulic push rod, reducing manual intervention, improving the automation degree of the cutting process, and further improving the production efficiency and work safety; at the same time, the modular installation method is adopted, which facilitates the disassembly or replacement of parts during maintenance and operation, ensuring the reliability and convenience during long-term use; at the same time, the device can be applied to silicon crystal blocks of different specifications and sizes, meeting the diversified demand of photovoltaic products, and improving the manufacturing flexibility.

[0026] Further, the cutting mechanism 8 comprises a first pulley 801, two first connecting shafts 802, a pay-off roller 803, a second pulley 804, a third pulley 805, a first motor 806, a fourth pulley 807, a fifth pulley 808, a second motor 809, a take-up roller 8010, a linkage belt 8011, two second connecting shafts 8012, two main rollers 8013, a diamond wire 8014, a sixth pulley 8015, the pay-off roller 803 and the take-up roller 8010 are fixedly sleeved with the two first connecting shafts 802, and the two first connecting shafts 802 are installed on the two side columns 5, respectively, the first pulley 801, the second pulley 804 and the third pulley 805 are rotationally installed on the first side plate 1, the fourth pulley 807, the fifth pulley 808 and the sixth pulley 8015 are rotationally installed on the second side plate 3, the two main rollers 8013 are fixedly sleeved with the two second connecting shafts 8012, and the two second connecting shafts 8012 are rotationally arranged at the two sides of the opposite surface of the two mounting plates 6 fixed on the bottom plate 7, the tail end of the diamond wire 8014 is installed on the pay-off roller 803, and the head end is connected with the take-up roller 8010 after the second pulley 804, the third pulley 805, the first pulley 801, the two main rollers 8013, the fourth pulley 807, the sixth pulley 8015 and the fifth pulley 808, that is, the diamond wire 8014 is installed at the required position and is wound on the main roller 8013 at equal intervals in a plurality of groups, so that the silicon crystal block 18 can be cut into a plurality of silicon wafers at one time, and in use, the pay-off and take-up of the diamond wire 8014 are realized by starting the first motor 806 and the second motor 809, the diamond wire 8014 rotates on the main roller 8013 to perform the cutting operation, the two first connecting shafts 802 are rotationally connected with the support plates at the front and rear ends, and the support plates are fixed on the columns 5, the rear end of the one of the two first connecting shafts 802 connected with the take-up roller 8010 is provided with the second motor 809, and the output end of the second motor 809 is fixedly connected with the first connecting shaft 802, the take-up roller 8010 is rotated by starting the second motor 809, so that the diamond wire 8014 wound in sequence is wound, the support plates are installed on the columns 5 and connected with the connecting shafts by bearings, so as to realize the stable rotation of the connecting shafts and the take-up roller 8010, the rear end of one of the two second connecting shafts 8012 is fixedly provided with the first motor 806 and connected with the output end of the first motor 806, the two second connecting shafts 8012 are fixedly sleeved with the pulleys at the rear ends and connected with each other by the linkage belt 8011, that is, when the first motor 806 is started, the two second connecting shafts 8012 are synchronously rotated under the action of the pulleys and the linkage belt 8011; the first motor 806 and the second motor 809 are operated by the control circuit board, and they can run and control the rotating speed at the same time under the control of the control circuit board.

[0027] Further, the upper end face of the bottom plate 7 is provided with two mounting plates 6 arranged vertically in front of and behind the front end, and four vertical columns 5 are respectively fixed at the four corners of the bottom plate 7, so as to realize stable mounting of the cutting mechanism 8 and ensure the stability of the frame body of the whole device.

[0028] Further, the lower end face of the top plate 4 is provided with two sliding grooves 9, and a threaded rod 10 and a guide rod 11 are respectively arranged in the two sliding grooves 9 in a rotating mode, wherein the rear end of the threaded rod 10 is fixedly connected with a servo motor, one of the two guide blocks 201 is threadedly connected with the threaded rod 10, and the other guide block 201 is slidably connected with the guide rod 11, that is, when the servo motor is started, the threaded rod 10 at the output end is rotated, the threaded rod 10 drives the guide block 201 on the outer side to move in a threaded mode, and since the two guide blocks 201 are both arranged on the linkage plate 202, and the other guide block 201 is slidably connected with the guide rod 11, the whole pushing mechanism 2 cannot rotate, and the front and back positions of the silicon crystal block 18 arranged in the bottom frame 204 can be adjusted under the action of the threaded rod 10.

[0029] Further, the adjusting mechanism 12 comprises a twisting block 1201, the rear end of the twisting block 1201 is fixedly provided with an adjusting rod 1202, the adjusting rod 1202 is fixedly sleeved with an oval block 1203, the fixing mechanism 13 comprises two fixed plates 1301, the upper end face of each of the two fixed plates 1301 is fixedly provided with a connecting block 1303, one side of the connecting block 1303 is fixedly provided with a connecting spring 1302, the four connecting springs 1302 are arranged in two groups, and the two groups of connecting springs 1302 are fixedly provided with two pushing plates 1304, the two pushing plates 1304 are respectively arranged on the two sides of the oval block 1203, the outer side of the twisting block 1201 is sleeved with a bearing, so that the twisting block 1201 is rotatably arranged on the bottom frame 204 and penetrates through the front end face of the bottom frame 204, and the adjusting rod 1202 and the oval block 1203 are rotatably arranged in the bottom frame 204, the lower end of the bottom frame 204 is provided with a placing groove, and the groove walls on the two sides are provided with grooves, the fixed plate 1301 is arranged in the groove, the connecting block 1303, the connecting spring 1302 and the pushing plate 1304 are arranged in the bottom frame 204, the adjusting rod 1202 drives the oval block 1203 to rotate when the adjusting rod 1202 rotates, the oval block 1203 extrudes the two pushing plates 1304 in the rotating process, so as to drive the connecting spring 1302 to contract and drive the connecting block 1303 and the fixed plate 1301 to move horizontally.

[0030] Further, the upper end face of the silicon crystal block 18 is connected with a plastic plate 17 through the stick glue 16, the upper end face of the plastic plate 17 is connected with a connecting plate 15 through the plate glue 14, and the connecting plate 15 is arranged in the bottom frame 204 and located at the upper end face of the two pushing plates 1304, so as to realize the quick mounting and fixing function of the silicon crystal block 18.

[0031] Further, the inner side of the column 5 is provided with a lifting cylinder 23, a lifting rod 22 is movably arranged on the lifting cylinder 23, an infrared monitoring mechanism 19 is arranged at the top of the lifting rod 22, a monitor 20 is arranged at the front end of the infrared monitoring mechanism 19, a monitoring probe 21 is arranged at the front end of the monitor 20, the lifting cylinder 23 drives the lifting rod 22 to move the monitor 20 and the monitoring probe 21 up and down, the horizontal direction of the monitor 20 and the monitoring probe 21 is adjusted according to the cutting position, and whether the cutting mechanism 8 is on the cutting position is confirmed by the infrared emitted by the monitoring probe 21.

[0032] A silicon wafer cutting method for photovoltaic panel manufacturing, specifically comprising the following operation steps: S1: Silicon crystal block installation: install the silicon crystal block on the connecting plate and install the connecting plate inside the bottom frame and clamp and fix it through the push plates on both sides; S2: Cutting debugging: debug the cutting mechanism, including speed adjustment and cutting interval adjustment, that is, adjust and control the motor and the spacing of the diamond wire distribution; S3: Cutting: move the installed silicon crystal block to the upper end of the cutting mechanism, then use the hydraulic push rod to push the silicon crystal block down, and the cutting mechanism cuts the slowly pushed silicon crystal block.

[0033] Working principle: install the silicon crystal block on the connecting plate and install the connecting plate inside the bottom frame and clamp and fix it through the push plates on both sides; debug the cutting mechanism, including speed adjustment and cutting interval adjustment, that is, adjust and control the motor and the spacing of the diamond wire distribution; move the installed silicon crystal block to the upper end of the cutting mechanism, then use the hydraulic push rod to push the silicon crystal block down, and the cutting mechanism cuts the slowly pushed silicon crystal block.

[0034] It should be noted that, in the present text, relational terms such as first and second and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover non-exclusive inclusions, so that a process, method, article, or apparatus that includes a list of elements does not only include those elements but also includes other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, an element defined by the phrase "comprises a" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0035] The above shows and describes the basic principles and main features of the present application and the advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.

Claims

1. A silicon wafer cutting device for photovoltaic panel manufacturing, comprising a pushing mechanism (2) for mounting and pushing silicon wafer blocks (18), a top plate (4), a bottom plate (7), four columns (5) installed between the top plate (4) and the bottom plate (7), and a cutting mechanism (8) for cutting, characterized in that: The top plate (4) has a first side plate (1) and a second side plate (3) installed on the front and rear ends of the lower end face of the top plate (4). The pushing mechanism (2) includes a linkage plate (202), guide blocks (201) fixedly installed on the upper end of the linkage plate (202) on both sides, hydraulic push rods (203) fixed on the lower end of the linkage plate (202) on both sides, and a bottom frame (204) fixed on the lower output end of the two hydraulic push rods (203). The bottom frame (204) has an adjustment mechanism (12) and a fixing mechanism (13) installed on both sides inside. The adjustment mechanism (12) is used to control the fixing mechanism (13) to realize the opening and closing of the mounting slot opened at the lower end of the bottom frame (204) to complete the mounting of the silicon block (18). The clamping and fixing mechanism (12) provided in the bottom frame (204) is used to adjust the contraction and opening of the fixing mechanism (13). When the bottom frame (204) is open and closed, the lower end of the entire bottom frame (204) is exposed. At this time, the connecting plate (15) on which the silicon block (18) is installed is embedded into the bottom frame (204). Then, the adjustment mechanism (12) is used again to control the contraction of the fixing mechanism (13), so that the silicon block (18) is installed in the bottom frame (204). The bottom frame (204) is lifted and lowered under the action of the hydraulic push rod (203) at the upper end. During the lifting and lowering process, it continuously moves closer to the cutting mechanism (8) to complete the cutting operation of the silicon block (18).

2. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 1, characterized in that: The cutting mechanism (8) includes a first pulley (801), two first connecting shafts (802), a feed roller (803), a second pulley (804), a third pulley (805), a first motor (806), a fourth pulley (807), a fifth pulley (808), a second motor (809), a take-up roller (8010), a linkage belt (8011), two second connecting shafts (8012), two main rollers (8013), diamond wire (8014), and a sixth pulley (8015). The feed roller (803) and the take-up roller (8010) are respectively fixedly sleeved with the two first connecting shafts (802), and the two first connecting shafts (802) are respectively installed on the columns (5) on both sides. The first pulley (801), the second pulley (804), the third pulley (805), the fourth pulley (807), the fifth pulley (808), the sixth motor (809), the take-up roller (8010), the second connecting shaft (8012), the third pulley (805), the fourth motor (806), the fifth pulley (807), the sixth motor (808), the seventh motor (809), the eighth pulley (8010), the ninth pulley (8010), the tenth pulley (8011), the tenth pulley (8012), the tenth pulley (8013), the tenth pulley (8014), the tenth pulley (8015 ... Pulleys 804 and 805 are rotatably mounted on side plate 1. Pulleys 807, 808, and 8015 are mounted on side plate 2. The main rollers 8013 are fixedly connected to the two connecting shafts 8012, which are rotatably positioned on opposite sides of the mounting plates 6 fixed on the base plate 7. The tail end of the diamond wire 8014 is mounted on the wire feeding roller 803, and the head end is sequentially mounted on pulleys 804, 805, 801, the two main rollers 8013, pulley 807, and pulley 8015. The diamond wire (8014) is installed in the required position and wound in multiple groups at equal intervals on the main roller (8013) after the pulley (808) and the take-up roller (8010). This allows the silicon block (18) to be cut into multiple silicon wafers at one time. In use, the diamond wire (8014) is taken up and put away by starting the first motor (806) and the second motor (809). The diamond wire (8014) rotates on the main roller (8013) to perform the cutting operation. The front and rear ends of the two first connecting shafts (802) are rotatably connected to the support plate through bearings and the support plate is fixed on the column (5). The first connecting shaft (802) connected to the take-up roller (8010) is the first connecting shaft. (802) A second motor (809) is installed at the rear end, and the output end of the second motor (809) is fixedly connected to the first connecting shaft (802). The second motor (809) starts and drives the take-up roller (8010) to rotate, so that the diamond wire (8014) wound in sequence is wound up. The support plate is installed on the column (5) and connected to the connecting shaft by bearings to achieve a stable rotation effect of the connecting shaft and the take-up roller (8010). A first motor (806) is fixedly installed at the rear end of one of the two second connecting shafts (8012) and connected to the output end of the first motor (806). A pulley is fixedly sleeved at the rear end of each of the two second connecting shafts (8012), and the two pulleys are connected by a linkage belt (8011).When motor 1 (806) starts, the two connecting shafts 2 (8012) rotate synchronously under the action of the pulleys and the linkage belt (8011). Both motor 1 (806) and motor 2 (809) are operated via a control circuit board; when they start simultaneously, they can run concurrently and their speeds can be controlled by the control circuit board.

3. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 1, characterized in that: Two mounting plates (6) are installed on the upper surface of the base plate (7) near the front end and are arranged vertically in front and back. The four columns (5) are fixed at the four corners of the base plate (7) respectively, so as to achieve a stable installation effect on the cutting mechanism (8) and ensure the stability of the frame of the entire equipment.

4. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 1, characterized in that: The top plate (4) has two sliding grooves (9) on both sides of its lower end face. A threaded rod (10) and a guide rod (11) are rotatably installed in the two sliding grooves (9). The threaded rod (10) is fixedly connected to a servo motor at its rear end. One of the two guide blocks (201) is threadedly connected to the threaded rod (10) and the other guide block (201) is slidably connected to the guide rod (11). When the servo motor starts, it drives the threaded rod (10) at the output end to rotate. The threaded rod (10) drives the guide block (201) connected to the outer thread to move. Since both guide blocks (201) are installed on the linkage plate (202) and the other guide block (201) is slidably connected to the guide rod (11), the entire push mechanism (2) will not rotate. Under the action of the threaded rod (10), it achieves the effect of moving laterally back and forth, and can realize the adjustment of the front and rear position of the silicon block (18) installed inside the bottom frame (204).

5. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 1, characterized in that: The adjusting mechanism (12) includes a torsion block (1201), an adjusting rod (1202) is fixedly mounted on the rear end of the torsion block (1201), and an elliptical block (1203) is fixedly sleeved on the adjusting rod (1202). The fixing mechanism (13) includes two fixing plates (1301), a connecting block (1303) is fixedly mounted on the front and rear ends of the upper end of the two fixing plates (1301), and a connecting spring (1302) is fixedly mounted on one side of the connecting block (1303). The four connecting springs (1302) are arranged in pairs and fixedly mounted on a push plate (1304). The two push plates (1304) are located on both sides of the elliptical block (1203). A bearing is sleeved on the outside of the torsion block (1201) to allow it to rotate on the bottom frame (204). It penetrates the front end of the bottom frame (204), and the adjusting rod (1202) and the elliptical block (1203) are rotatably set inside the bottom frame (204). The bottom frame (204) has a placement groove at the lower end and grooves on both sides of the groove wall. The fixing plate (1301) is located in the groove. The connecting block (1303), the connecting spring (1302) and the push plate (1304) are all located inside the bottom frame (204). When the adjusting rod (1202) rotates, it drives the elliptical block (1203) to rotate. During the rotation, the elliptical block (1203) squeezes the push plates (1304) on both sides, thereby causing the connecting spring (1302) to contract and drive the connecting block (1303) and the fixing plate (1301) to undergo lateral displacement.

6. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 1, characterized in that: The upper surface of the silicon block (18) is connected to a plastic plate (17) by adhesive stick (16), and the upper surface of the plastic plate (17) is connected to a connecting plate (15) by adhesive plate (14). The connecting plate (15) is located inside the bottom frame (204) and on the upper surface of the two push plates (1304), thus completing the function of quickly installing and fixing the silicon block (18).

7. The silicon wafer cutting device for photovoltaic panel manufacturing according to claim 1, characterized in that: A lifting cylinder (23) is installed on the inner side of the column (5). A lifting rod (22) is movably installed on the lifting cylinder (23). An infrared monitoring mechanism (19) is installed on the top of the lifting rod (22). A monitor (20) is installed at the front end of the infrared monitoring mechanism (19). A monitoring probe (21) is installed at the front end of the monitor (20). The lifting cylinder (23) drives the lifting rod (22) and moves the monitor (20) and the monitoring probe (21) up and down. The horizontal direction of the monitor (20) and the monitoring probe (21) is adjusted according to the cutting position. The infrared light emitted by the monitoring probe (21) is used to confirm whether the cutting mechanism (8) is in the cutting position.

8. A method for cutting silicon wafers for manufacturing photovoltaic panels, characterized in that: Specifically, the following steps are included: S1: Silicon block installation: Install the silicon block on the connecting plate and install the connecting plate inside the bottom frame, and clamp and fix it by the push plates on both sides; S2: Cutting and debugging: Debug the cutting mechanism, including adjusting the speed and cutting distance, that is, adjusting and controlling the motor and the spacing of the diamond wire distribution; S3: Cutting: Move the installed silicon block to the upper end of the cutting mechanism, and then use a hydraulic push rod to push the silicon block down, while the cutting mechanism cuts the slowly pushed silicon block.

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