Special test connecting plate for gas sensor array gas sensitive performance test device

Abstract

The invention discloses a special test connecting plate for a gas sensor array gas sensitive performance test device, and belongs to the technical field of gas sensor detection. The test connecting plate special for the gas sensor array gas sensitive performance test device comprises a sensor test external connecting plate (9), a sensor test internal connecting plate (18-1), a sensor array connecting module (18-2) and an ultraviolet light source LED array module (18-3). The special test connecting plate provided by the invention adopts a multi-level design, can provide a test connecting function for a plurality of sensors in a gas sensor array under the test conditions of room temperature work, heating work, excitation of ultraviolet light sources with different packages and the like, and is convenient to replace the sensors and the ultraviolet light sources; the system has the advantages of high integration level, high test efficiency, flexibility, convenience and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of gas sensor testing, in particular to a special test connection plate for a gas sensor array gas-sensitive performance testing device. BACKGROUND

[0002] The special test connection plate for a gas sensor array gas-sensitive performance testing device needs to be connected to the peripheral equipment of the test box body (such as a data acquisition system, a control system, etc.). Through the design of a reasonable interface and wiring scheme, the accurate transmission of test data and the timely execution of instructions can be ensured. At the same time, it aims to optimize the performance of the gas detection system, improve the detection accuracy and efficiency, and enhance the flexibility and maintainability of the system. In the test of the gas sensor array, the control problem of whether different sensors need heating conditions and whether the ultraviolet light source excitation condition exists is solved, and the convenience of replacing the gas sensor is improved.

[0003] In the test of the gas sensor array, different types of sensors have different needs for heating. For example, metal oxide semiconductor gas sensors usually need to work under heating conditions to improve their sensitivity and selectivity, but long-term heating will reduce the service life of the gas sensor; some sensors do not need heating conditions. Therefore, when designing a multi-level special test connection plate, independent heating switch control for each sensor in the array needs to be considered. This design not only improves the performance stability of the sensor, but also reduces the overall energy consumption and prolongs the service life of the sensor.

[0004] Ultraviolet light excitation technology is widely used in gas sensors to reduce the working temperature of the sensor and improve the selectivity. For example, by irradiating TiO2 and other photocatalytic materials with ultraviolet light, effective detection of various gases can be achieved at room temperature. When designing a multi-level special test connection plate, the switch control of the ultraviolet light source needs to be considered. The multi-level circuit board design can integrate the ultraviolet LED driving circuit and the switch to achieve flexible control of the ultraviolet light source, thereby improving the accuracy and reliability of the detection results.

[0005] Different ultraviolet light sources may also differ in packaging. For example, 254 nm and 369 nm ultraviolet light sources have significant differences in packaging structure. When designing a multi-level special test connection plate, the influence of these factors needs to be considered.

[0006] In the gas detection system, gas sensors often need to be replaced as the detection requirements change. When designing a multi-level special test connection plate, the convenience of replacing the gas sensor and the ultraviolet light source should be fully considered. By adopting modular design and plug-in interfaces, not only the maintenance cost and time cost are reduced, but also the maintainability and flexibility of the system are improved.

[0007] Therefore, the design of the gas sensor array gas sensitive performance testing device special test connecting plate not only improves the performance and reliability of the gas detection system, improves the detection precision and efficiency, but also enhances the flexibility and maintainability of the system. SUMMARY

[0008] The gas sensor array gas sensitive performance testing device special test connecting plate of the application mainly comprises a sensor test external connecting plate (9), a sensor test internal connecting plate (18-1), a sensor array connecting module (18-2), and an ultraviolet light source LED array module (18-3).

[0009] The sensor test external connecting plate (9) comprises a wiring terminal C (5), a 2P pin interface C (6), a 2P pin interface C (7), a backup pin interface C (8-1), a backup pin interface C (8-2), and a wiring terminal C (9). The 2P pin interface C (7), the backup pin interface C (8-1), and the wiring terminal C (9) are located on the side of the sensor test external connecting plate (9) facing outward of the box. The wiring terminal C (5), the 2P pin interface C (6), and the backup pin interface C (8-2) are located on the side of the sensor test external connecting plate (9) facing inward of the box. The wiring terminal C (5) is connected by a wire to the wiring terminal C (2) on the sensor test internal connecting plate (18-1), and the 2P pin interface C (6) is connected by a wire to the 2P pin interface C (3-2) on the sensor test internal connecting plate (18-1). The 2P pin interface C (7) is connected by a wire to the power module, and the wiring terminal C (9) is connected by a wire to the external measuring equipment. The backup pin interface C (8-2) and the backup pin interface C (8-1) are used for connecting the backup power-consuming equipment in the box. The edge of the sensor test external connecting plate (9) has four copper column interfaces C (21-1), C (21-2), C (21-3), and C (21-4).

[0010] The sensor test internal connecting plate (18-1) includes a terminal C (2), a 2P female interface C (3-1), a 2P male interface C (3-2), and a 4P female interface C (4); the terminal C (2) and the 2P male interface C (3-2) are located on the bottom surface of the sensor test internal connecting plate (18-1); the 2P female interface C (3-1) and the 4P female interface C (4) are located on the top surface of the sensor test internal connecting plate (18-1); the terminal C (2) is connected to the terminal C (5) on the sensor test external connecting plate (9) by a wire, the 2P male interface C (3-2) is connected to the 2P male interface C (6) on the sensor test external connecting plate (9) by a wire, the 2P female interface C (3-1) is connected to the 2P male interface C (12-2) on the sensor array connecting module (18-2), and the 4P female interface C (4) is connected to the 4P male interface C (13-2) on the sensor array connecting module (18-2); the sensor test internal connecting plate (18-1) has four copper column interfaces C (1-1), C (1-2), C (1-3), and C (1-4) on the edge.

[0011] The sensor array connecting module (18-2) includes a sensor placement area C (14), a 4P terminal C (13-1), a 2P male interface C (12-2), a 2P female interface C (12-1), and a 4P male interface C (13-2); the 2P female interface C (12-1), the sensor placement area C (14), and the 4P terminal C (13-1) are located on the top surface of the sensor array connecting module (18-2); the 2P male interface C (12-2) and the 4P male interface C (13-2) are located on the bottom surface of the sensor array connecting module (18-2); the sensor placement area C (14) has two data interfaces and two power interfaces, which are connected to the 4P terminal C (13-1); the 2P male interface C (12-2) is connected to the 2P female interface C (2-1) on the sensor test internal connecting plate (18-1), and the 4P male interface C (13-2) is connected to the 4P female interface C (4) on the sensor test internal connecting plate (18-1); the 2P female interface C (12-1) is connected to the ultraviolet light source LED array module (18-3).

[0012] The ultraviolet light source LED array module (18-3) can be composed of two modules, one is an ultraviolet light source LED array plate C (17-1) for substrate packaging ultraviolet light source LED, and the other is an ultraviolet light source LED array plate C (17-2) for patch packaging ultraviolet light source LED.

[0013] The ultraviolet light source LED array board C (17-1) comprises a switch C (16-1), an ultraviolet light source window C (19), a 2P pin interface C (20-1), a wiring port C (21-1), and a wiring port C (21-2). The switch C (16-1) is located on the top surface of the ultraviolet light source LED array board C (17-1). The 2P pin interface C (20-1) is located on the bottom surface of the ultraviolet light source LED array board C (17-1). The switch C (16-1) controls the power supply of the substrate packaging ultraviolet light source LED module C (22). The ultraviolet light source window C (19) is a square hole. The ultraviolet light source C (24) of the substrate packaging ultraviolet light source LED module C (22) can be embedded into the square hole of the ultraviolet light source window C (19) and face the gas sensor on the sensor array connection module (18-2). The positive electrode interface C (24-1) of the power supply of the substrate packaging ultraviolet light source LED module C (22) is connected to the wiring port C (21-1), and the negative electrode C (24-2) of the power supply is connected to the wiring port C (21-2). The 2P pin interface C (20-1) is connected to the 2P female pin interface C (12-1) of the sensor array connection module (18-2).

[0014] The ultraviolet light source LED array board C (17-2) comprises a switch C (16-2), a 2P pin interface C (20-2), a positive electrode pad C (21-3), and a negative electrode pad C (21-4). The 2P pin interface C (20-2), the positive electrode pad C (21-3), and the negative electrode pad C (21-4) are located on the bottom surface of the ultraviolet light source LED array board C (17-2). The switch C (16-2) is located on the top surface of the ultraviolet light source LED array board C (17-2). The switch C (16-2) controls the power supply of the ultraviolet light source lamp bead C (23). The ultraviolet light source lamp bead C (23) faces the gas sensor on the sensor array connection module (18-2). The positive electrode pin C (23-1) of the power supply of the ultraviolet light source lamp bead C (23) is connected to the positive electrode pad C (21-3), and the negative electrode pin C (23-2) of the power supply is connected to the negative electrode pad C (21-4). The 2P pin interface C (20-2) is connected to the 2P female pin interface C (12-1) of the sensor array connection module (18-2).

[0015] The material, shape, size and number of terminal of the circuit substrate used by the sensor test external connecting plate (9), the sensor test internal connecting plate (18-1), the sensor array connecting module (18-2), the ultraviolet light source LED array plate C (17-1) and the ultraviolet light source LED array plate C (17-2) can be adjusted; the circuit layout and wiring of the sensor test internal connecting plate (18-1), the sensor test external connecting plate (9), the sensor array connecting module (18-2), the ultraviolet light source LED array plate C (17-1) and the ultraviolet light source LED array plate C (17-2) can be adjusted.

[0016] Preferably, the gas sensor array gas sensitive performance testing device special test connecting plate tests three sensors at room temperature and under natural light conditions, and the steps are as follows:

[0017] Step one, install the sensor test internal connecting plate (18-1) in the test device, install the sensor test external connecting plate (9) on the side wall of the test device, and connect the wire on the side facing the test device to the sensor test internal connecting plate;

[0018] Step two, install three gas sensors to be tested in the sensor placement area C (14) of the sensor array connecting module (18-2), connect the two resistance electrode leads and the two heating electrode leads of each gas sensor to the 4P terminal C (13-1) respectively, and then connect the sensor array connecting module (18-2) to the sensor test internal connecting plate (18-1) through the pin socket;

[0019] Step three, connect the test equipment to the corresponding test interface of the three sensors to be tested through the wire on the sensor test external connecting plate (9).

[0020] Preferably, the gas sensor array gas sensitive performance testing device special test connecting plate tests two gas sensors under the condition of using patch packaging ultraviolet LED light and at 100°C, and the steps are as follows:

[0021] Step one, install the sensor test internal connecting plate (18-1) in the test device, install the sensor test external connecting plate (9) on the side wall of the test device, and connect the wire on the side facing the test device to the sensor test internal connecting plate;

[0022] Step two, install two gas sensors to be tested to the sensor placement area C (14) of the sensor array connection module (18-2), connect the two resistance electrode leads and the two heating electrode leads of each gas sensor to the 4P terminal C (13-1) respectively, and then connect the sensor array connection module (18-2) to the sensor test internal connection board (18-1) through the pin socket;

[0023] Step three, connect two ultraviolet light source LED array board C (17-2) modules to the top of the sensor array connection module (18-2) containing the gas sensors to be tested through the pin socket, and turn on the switches of the two ultraviolet light source LED array board modules above the two gas sensors.

[0024] Step four, connect the test equipment to the corresponding test interfaces of the two sensors to be tested through the wire on the sensor test external connection board (9), connect the power supply to the corresponding power supply interfaces of the two sensors to be tested, and provide a heating voltage of 100°C.

[0025] Preferably, a gas sensor array gas sensitive performance test device special test connection board is used for testing four gas sensors under room temperature conditions under the condition of a substrate packaged ultraviolet LED light source, and the steps are as follows:

[0026] Step one, install the sensor test internal connection board (18-1) inside the test device, and install the sensor test external connection board (9) on the side wall of the test device, and connect the sensor test internal connection board through the wire on the side wall of the test device facing the inside of the test device;

[0027] Step two, install four gas sensors to be tested to the sensor placement area C (14) of the sensor array connection module (18-2), connect the two resistance electrode leads and the two heating electrode leads of each gas sensor to the 4P terminal C (13-1) respectively, and then connect the sensor array connection module (18-2) to the sensor test internal connection board (18-1) through the pin socket;

[0028] Step three, connect four ultraviolet light source LED array board C (17-1) modules to the top of the sensor array connection module (18-2) containing the gas sensors to be tested through the pin socket, and turn on the switches of the four ultraviolet light source LED array board modules above the four gas sensors.

[0029] Step four, connect the test equipment to the corresponding test interfaces of the four sensors to be tested through the wire on the sensor test external connection board (9).

[0030] With the above technical scheme, the gas sensor array gas sensitive performance test device special test connection board has the following beneficial effects:

[0031] (1) The special test connection board described in the application realizes the connection of the internal gas sensor and the peripheral equipment of the test device (such as the data acquisition system, the control system, etc.) through a reasonable interface and wiring scheme design.

[0032] (2) The special test connection board meets the on-off control of the heating condition in the gas sensor test. In the multi-level design, the on-off control of the heating condition of each sensor in the gas sensor array is considered, which reduces the overall energy consumption, prolongs the service life of the sensor, and improves the stability of the sensor.

[0033] (3) The special test connection board meets the on-off control of the light excitation condition in the gas sensor test. The multi-level circuit board design integrates the ultraviolet LED light source connection line and the control switch, and realizes the on-off control of the ultraviolet light source condition in the test process.

[0034] (4) The multi-level design of the special test connection board improves the convenience of replacing the gas sensor and the ultraviolet light source, reduces the maintenance cost and time cost, and improves the maintainability and flexibility of the system by using modular design, mounting base, and plug-in interface.

[0035] (5) The multi-level structure of the special test connection board includes ultraviolet light sources that adapt to different packaging, and can also select whether the ultraviolet light source is needed for different gas sensors in the array according to the needs. This design improves the compatibility and flexibility of the system. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 The figure is a schematic diagram of the installation position of the sensor test external connection board (9), the sensor test internal connection board (18-1), the sensor array connection module (18-2), and the ultraviolet light source LED array module (18-3) in the test box.

[0037] Figure 2 The figure is a schematic diagram of the sensor test internal connection board.

[0038] Figure 3 The figure is a schematic diagram of the wiring diagram, one side of the box, and the other side of the box of the sensor test external connection board.

[0039] Figure 4 The figure is a schematic diagram of the wiring diagram, top surface, and bottom surface of the sensor array connection module.

[0040] Figure 5 The figure is a schematic diagram of the wiring diagram, top surface, and bottom surface of the ultraviolet light source LED array C (17-1) module based on the substrate packaging.

[0041] Figure 6The wiring diagram, top view and bottom view of the patch package based ultraviolet light source LED array C (17-2) module of the present application are shown. DETAILED DESCRIPTION

[0042] The present application will be described in detail below with reference to the embodiments and drawings, and it should be pointed out that the described embodiments are only intended to facilitate the understanding of the present application and do not limit the present application in any way.

[0043] Embodiment 1: Structure of each main component of the present application.

[0044] Figure 1 The installation position of the sensor test external connection board (9), the sensor test internal connection board (18-1), the sensor array connection module (18-2) and the ultraviolet light source LED array module (18-3) in the test box of the present application is shown. The sensor test external connection board (9) is installed on the side wall of the test box, and a circumferential sealing element is arranged between the sensor test external connection board (9) and the side wall of the test box. The sensor test external connection board (9) is connected to the sensor test internal connection board (18-1) inside the test box through a wire harness. The sensor array connection module (18-2) is connected to the sensor test internal connection board (18-1) through a pin socket, and the ultraviolet light source LED array module (18-3) is connected to the sensor array connection module (18-2) through a pin socket.

[0045] Figure 2 The sensor test internal connection board (18-1) of the present application is shown in the schematic diagram. The sensor test internal connection board (18-1) is installed inside the test device, and the top surface is provided with a pin socket for connecting the sensor array connection module (18-2). The bottom surface is provided with a base for connecting the sensor test external connection board (9) through a wire.

[0046] Figure 3 The sensor test external connection board (9) of the present application is shown in the schematic diagram. The sensor test external connection board (9) is installed on the side wall of the test device, and the side facing the outside of the test device is provided with a pin socket for connecting an external power supply and test equipment. The side facing the inside of the test device is provided with a base for connecting the sensor test internal connection board (18-1) through a wire.

[0047] Figure 4A schematic diagram of the sensor array connection module (18-2) of the present invention is provided. It can be connected to the internal connection board (18-1) of the sensor test via a pin header interface. As can be seen from the figure, each 4P terminal C (13-1) can be equipped with a 4P terminal, which connects to the two resistive electrode leads and two heating electrode leads of a gas sensor respectively. Any number of gas sensors can be installed simultaneously through the sensor array connection module (18-2) of the present invention. The internal connection board (18-1) of the sensor test of the device of the present invention is connected to the external connection board (9) of the sensor test, and multiple gas sensors can be tested simultaneously.

[0048] Figure 5 and Figure 6 Schematic diagrams of the UV LED array C(17-1) module for substrate packaging and the UV LED array C(17-2) module for surface mount packaging are provided respectively. These two modules can be arbitrarily combined to provide different packaged UV LED illumination test conditions for each sensor in the gas sensor array. Each module has independent switch control. If the UV LED is substrate packaged, the UV LED array board C(17-1) is selected; if the UV LED is surface mount packaged, the UV LED array board C(17-2) is selected.

[0049] Example 2: Three sensors were tested under room temperature and natural light conditions.

[0050] Step 1: Install the internal connection plate (18-1) of the sensor test inside the test device. Install the external connection plate (9) of the sensor test on the side wall of the test device, and connect the side facing the inside of the test device to the internal connection plate of the sensor test via a wire.

[0051] Step 2: Install the three gas sensors to be tested into the sensor placement area C (14) of the sensor array connection module (18-2). Connect the two resistance electrode leads and two heating electrode leads of each gas sensor to the 4P terminal C (13-1) respectively. Then connect the sensor array connection module (18-2) to the sensor test internal connection board (18-1) through the pin header socket.

[0052] Step 3: On the external connection board (9) for sensor testing, connect the test equipment to the corresponding test interfaces of the three sensors under test via ribbon cables.

[0053] Example 3: Two gas sensors were tested at 100 °C under surface-mount UV LED light conditions.

[0054] Step one, install the sensor test internal connection board (18-1) inside the test device. Install the sensor test external connection board (9) on the side wall of the test device, and connect it to the sensor test internal connection board through wires on the side facing the inside of the test device.

[0055] Step two, install the two gas sensors to be tested into the sensor placement area C (14) of the sensor array connection module (18-2), connect the two resistance electrode leads and two heating electrode leads of each gas sensor to the 4P terminal C (13-1) respectively, and then connect the sensor array connection module (18-2) to the sensor test internal connection board (18-1) through the pin socket.

[0056] Step three, connect the two ultraviolet light source LED array board C (17-2) modules to the top of the sensor array connection module (18-2) containing the gas sensors to be tested through the pin socket, and turn on the switches of the ultraviolet light source LED array board modules above the two gas sensors.

[0057] Step four, on the sensor test external connection board (9), connect the test equipment to the corresponding test interface of the two sensors to be tested through the wire, connect the power supply to the corresponding power supply interface of the two sensors to be tested, and provide a heating voltage of 100°C.

[0058] Example 4: Test four gas sensors at room temperature under the condition of using substrate packaged ultraviolet LED light.

[0059] Step one, install the sensor test internal connection board (18-1) inside the test device. Install the sensor test external connection board (9) on the side wall of the test device, and connect it to the sensor test internal connection board through wires on the side facing the inside of the test device.

[0060] Step two, install the four gas sensors to be tested into the sensor placement area C (14) of the sensor array connection module (18-2), connect the two resistance electrode leads and two heating electrode leads of each gas sensor to the 4P terminal C (13-1) respectively, and then connect the sensor array connection module (18-2) to the sensor test internal connection board (18-1) through the pin socket.

[0061] Step three, connect the four ultraviolet light source LED array board C (17-1) modules to the top of the sensor array connection module (18-2) containing the gas sensors to be tested through the pin socket, and turn on the switches of the ultraviolet light source LED array board modules above the four gas sensors.

[0062] Step four, on the sensor test external connection board (9), connect the test equipment to the corresponding test interface of the four sensors to be tested through the wire.

[0063] It should be pointed out finally that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the protection scope of the present application; the present application has been described in detail with reference to the above embodiments, and it is convenient for those skilled in the art to compare; on the basis of the above description, other different forms of changes or variations can be made, and it is not necessary or possible to exhaust all the embodiments here, and thus the changes and modifications derived therefrom should be regarded as the protection scope of the present application.

Claims

1. A test connection board for a gas sensor array gas sensitivity performance test device, characterized by: The sensor test external connecting plate (9) includes a terminal C (5), a 2P pin interface C (6), a 2P pin interface C (7), a backup pin interface C (8-1), a backup pin interface C (8-2), and a terminal C (9). The 2P pin interface C (7), the backup pin interface C (8-1), and the terminal C (9) are located on the side of the sensor test external connecting plate (9) facing outward from the box. The terminal C (5), the 2P pin interface C (6), and the backup pin interface C (8-2) are located on the side of the sensor test external connecting plate (9) facing inward from the box. The terminal C (5) is connected by a wire to the terminal C (2) on the sensor test internal connecting plate (18-1), and the 2P pin interface C (6) is connected by a wire to the 2P pin interface C (3-2) on the sensor test internal connecting plate (18-1). The 2P pin interface C (7) is connected by a wire to the power module, and the terminal C (9) is connected by a wire to the external measuring device. The backup pin interface C (8-2) and the backup pin interface C (8-1) are used for connecting to the backup power-consuming devices inside the box. The edges of the sensor test external connecting plate (9) have four copper column interfaces C (21-1), C (21-2), C (21-3), and C (21-4). The sensor test internal connecting plate (18-1) includes a terminal C (2), a 2P pin interface C (3-1), a 2P pin interface C (3-2), and a 4P pin interface C (4). The terminal C (2) and the 2P pin interface C (3-2) are located on the bottom surface of the sensor test internal connecting plate (18-1). The 2P pin interface C (3-1) and the 4P pin interface C (4) are located on the top surface of the sensor test internal connecting plate (18-1). The terminal C (2) is connected by a wire to the terminal C (5) on the sensor test external connecting plate (9), the 2P pin interface C (3-2) is connected by a wire to the 2P pin interface C (6) on the sensor test external connecting plate (9), the 2P pin interface C (3-1) is connected to the 2P pin interface C (12-2) on the sensor array connecting module (18-2), and the 4P pin interface C (4) is connected to the 4P pin interface C (13-2) on the sensor array connecting module (18-2). The edges of the sensor test internal connecting plate (18-1) have four copper column interfaces C (1-1), C (1-2), C (1-3), and C (1-4). ​ The sensor array connection module (18-2) comprises a sensor placement area C (14), a 4P terminal C (13-1), a 2P pin interface C (12-2), a 2P female interface C (12-1), and a 4P pin interface C (13-2); the 2P female interface C (12-1), the sensor placement area C (14), and the 4P terminal C (13-1) are located on the top surface of the sensor array connection module (18-2); the 2P pin interface C (12-2) and the 4P pin interface C (13-2) are located on the bottom surface of the sensor array connection module (18-2); the sensor placement area C (14) has two data interfaces and two power supply interfaces, which are connected to the 4P terminal C (13-1); the 2P pin interface C (12-2) is connected to the 2P female interface C (2-1) on the sensor test internal connection board (18-1), and the 4P pin interface C (13-2) is connected to the 4P female interface C (4) on the sensor test internal connection board (18-1); the 2P female interface C (12-1) is connected to the ultraviolet light source LED array module (18-3); The ultraviolet light source LED array module (18-3) can be composed of two modules, one of which is an ultraviolet light source LED array board C (17-1) for substrate packaging ultraviolet light source LED, and the other of which is an ultraviolet light source LED array board C (17-2) for patch packaging ultraviolet light source LED; The ultraviolet light source LED array board C (17-1) comprises a switch C (16-1), an ultraviolet light source window C (19), a 2P pin interface C (20-1), a wiring port C (21-1), and a wiring port C (21-2); the switch C (16-1) is located on the top surface of the ultraviolet light source LED array board C (17-1); the 2P pin interface C (20-1) is located on the bottom surface of the ultraviolet light source LED array board C (17-1); the switch C (16-1) controls the power supply of the substrate packaging ultraviolet light source LED module C (22); the ultraviolet light source window C (19) is a square hole, and the ultraviolet light source C (24) of the substrate packaging ultraviolet light source LED module C (22) can be embedded into the square hole of the ultraviolet light source window C (19) downward, and faces the gas sensor on the sensor array connection module (18-2); the positive electrode interface C (24-1) of the power supply of the substrate packaging ultraviolet light source LED module C (22) is connected to the wiring port C (21-1), and the negative electrode C (24-2) of the power supply is connected to the wiring port C (21-2); the 2P pin interface C (20-1) is connected to the 2P female interface C (12-1) of the sensor array connection module (18-2); The ultraviolet light source LED array board C (17-2) comprises a switch C (16-2), a 2P pin interface C (20-2), a positive electrode pad C (21-3), and a negative electrode pad C (21-4); the 2P pin interface C (20-2), the positive electrode pad C (21-3), and the negative electrode pad C (21-4) are located on the bottom surface of the ultraviolet light source LED array board C (17-2); the switch C (16-2) is located on the top surface of the ultraviolet light source LED array board C (17-2), and the switch C (16-2) controls the power supply on-off of the ultraviolet light source lamp bead C (23); the ultraviolet light source lamp bead C (23) is opposite to the gas sensor on the sensor array connecting module (18-2); the power supply positive electrode pin C (23-1) of the ultraviolet light source lamp bead C (23) is connected to the positive electrode pad C (21-3), and the power supply negative electrode pin C (23-2) is connected to the negative electrode pad C (21-4); the 2P pin interface C (20-2) is connected to the 2P female pin interface C (12-1) of the sensor array connecting module (18-2).

2. The test connection board for a gas sensor array gas sensitivity performance test device according to claim 1, characterized by, The material, shape, size, and number of wiring terminals of the circuit substrate used by the sensor test external connecting plate (9), the sensor test internal connecting plate (18-1), the sensor array connecting module (18-2), the ultraviolet light source LED array board C (17-1), and the ultraviolet light source LED array board C (17-2) can be adjusted; the circuit layout and wiring of the sensor test internal connecting plate (18-1), the sensor test external connecting plate (9), the sensor array connecting module (18-2), the ultraviolet light source LED array board C (17-1), and the ultraviolet light source LED array board C (17-2) can be adjusted.

3. The test connection board for a gas sensor array gas sensitivity test device according to claim 1, wherein The steps for testing three sensors under room temperature and natural light conditions are as follows: Step one, install the sensor test internal connecting plate (18-1) inside the test device, and install the sensor test external connecting plate (9) on the side wall of the test device, and connect the side facing the inside of the test device to the sensor test internal connecting plate through wires; Step two, install three gas sensors to be tested in the sensor placement area C (14) of the sensor array connecting module (18-2), connect the two resistance electrode leads and the two heating electrode leads of each gas sensor to the 4P wiring terminal C (13-1) respectively, and then connect the sensor array connecting module (18-2) to the sensor test internal connecting plate (18-1) through the pin socket; Step three, on the sensor test external connecting plate (9), connect the test equipment to the corresponding test interface of the three sensors to be tested through the wiring.

4. The test connection board for a gas sensor array gas sensitivity test device according to claim 1, wherein The steps for testing two gas sensors under the condition of using patch packaging ultraviolet LED light at 100°C are as follows: Step one, install the sensor test internal connecting plate (18-1) inside the test device, and install the sensor test external connecting plate (9) on the side wall of the test device, and connect the side facing the inside of the test device to the sensor test internal connecting plate through wires; Step two, install two gas sensors to be tested in the sensor placement area C (14) of the sensor array connecting module (18-2), connect the two resistance electrode leads and the two heating electrode leads of each gas sensor to the 4P wiring terminal C (13-1) respectively, and then connect the sensor array connecting module (18-2) to the sensor test internal connecting plate (18-1) through the pin socket; Step two, install two gas sensors to be tested to the sensor placement area C (14) of the sensor array connection module (18-2), connect the two resistance electrode leads and two heating electrode leads of each gas sensor to the 4P terminal C (13-1) respectively, then connect the sensor array connection module (18-2) to the sensor test internal connection board (18-1) through the pin socket; Step three, connect two ultraviolet light source LED array board C (17-2) modules to the top of the sensor array connection module (18-2) containing the gas sensors to be tested through the pin socket, turn on the switches of the two ultraviolet light source LED array board modules above the gas sensors; Step four, on the sensor test external connection board (9), connect the test equipment to the corresponding test interface of the two sensors to be tested through the wire, connect the power supply to the corresponding power supply interface of the two sensors to be tested to turn on, and provide a heating voltage of 100°C.

5. The test connection board for testing the gas sensing performance of a gas sensor array according to claim 1, wherein The steps for testing four gas sensors under room temperature conditions using substrate packaged ultraviolet LED light are as follows: Step one, install the sensor test internal connection board (18-1) inside the test device, and install the sensor test external connection board (9) on the side wall of the test device, with the side facing the inside of the test device connected to the sensor test internal connection board through the wire; Step two, install four gas sensors to be tested to the sensor placement area C (14) of the sensor array connection module (18-2), connect the two resistance electrode leads and two heating electrode leads of each gas sensor to the 4P terminal C (13-1) respectively, then connect the sensor array connection module (18-2) to the sensor test internal connection board (18-1) through the pin socket; Step three, connect four ultraviolet light source LED array board C (17-1) modules to the top of the sensor array connection module (18-2) containing the gas sensors to be tested through the pin socket, turn on the switches of the four ultraviolet light source LED array board modules above the gas sensors; Step four, on the sensor test external connection board (9), connect the test equipment to the corresponding test interface of the four sensors to be tested through the wire.

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