Batch automatic testing method and device and computer equipment

Abstract

The invention provides a batch automatic testing method and device and computer equipment. According to the method and the device, the target binary file in the target format is obtained by performing format processing on the original file, then the target binary file is processed based on the preset tool program, so that the target file which can be identified by the aging equipment is obtained, and finally the target file is directly imported into the preset aging equipment, so that the aging test level signal set can be directly generated; according to the invention, the aging test level signal set is automatically generated, and then the aging test level signal set is imported into the digital waveform field input type aging test platform for automatic test, so that batch automatic test is realized. According to the method, manual operation is not needed, the preset burn-in equipment can be directly imported based on the generated target file, the burn-in test level signal set is automatically generated, then batch automatic testing is achieved, and manpower and time are greatly saved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip burn-in test, and in particular to a batch automatic test method and device and computer equipment. BACKGROUND

[0002] With the rise of artificial intelligence, a processor NPU dedicated to accelerating neural network and deep learning tasks has emerged as the times require. The high-parallel operation unit needs to process a large amount of data, which also brings challenges to chip testing. In the test, a large amount of data needs to be fed to the chip for simulation test, which puts higher requirements on the chip test system.

[0003] In the traditional method, the data provided to the chip is a repetitive square wave signal, which can be quickly generated by manual editing. However, in the NPU chip test process, the data used is non-repetitive and has a large data depth. The time and error rate required for manual editing will increase rapidly. Taking a 10K vector depth as an example, a person can edit 30 vectors (2 seconds each) in 1 minute. It will take nearly 6 hours to edit all the vectors. The error rate will also increase exponentially with the increase of time. If 32-way vectors and vector depth are increased to 1M, the editing time needs to be multiplied by 32 and then by 100. Therefore, the error risk is unacceptable.

[0004] Therefore, there is an urgent need to provide a batch test automation test method to solve the technical problems in the prior art that the data used in the NPU chip test process is non-repetitive and has a large data depth, and the time and error rate required for manual editing will increase rapidly. SUMMARY

[0005] In view of the deficiencies in the prior art, the present application provides a batch automatic test method and device and computer equipment, which solves the problem that in the prior art each vector waveform needs to be manually edited, and when large-scale testing of chips is performed, each device needs to be set up repeatedly. The method is very time-consuming and laborious when used for chip burn-in test.

[0006] According to an embodiment of the present application, a batch automatic testing method based on a digital waveform field entry type burn-in test platform, the digital waveform field entry type burn-in test platform comprising a plurality of burn-in devices, the method comprising: performing format processing on an original file to obtain a target binary file in a target format; processing the target binary file based on a preset tool program to obtain a target file recognizable by a burn-in device; wherein the preset tool program is established based on a burn-in test requirement input by a user; importing the target file into a preset burn-in device to generate a burn-in test level signal set; and importing the burn-in test level signal set into the digital waveform field entry type burn-in test platform to perform automatic testing.

[0007] In an alternative manner, the original file is in a text format; the step of performing format processing on the original file to obtain a binary file in a target format further comprises: importing the original file into a preset software to obtain a hexadecimal file in which a text format is converted into a digital signal format; performing binary conversion on the hexadecimal file in the preset software to obtain an initial binary file; and modifying the number of bytes in each line of the initial binary file based on the preset software to obtain a target binary file in a target format.

[0008] In an alternative manner, the step of processing the target binary file based on a preset tool program to obtain a target file recognizable by a burn-in device further comprises: in response to the burn-in test requirement input by the user, compiling the burn-in test requirement using a preset language to obtain a requirement program file; storing the requirement program file into a head folder in an installation path corresponding to the preset language to obtain a target requirement program file; creating a preset tool file in a preset language environment and referencing the target requirement program file in the preset tool file to compile a preset tool program.

[0009] In an alternative manner, the step of processing the target binary file based on a preset tool program to obtain a target file recognizable by a burn-in device further comprises: reading each binary data in the target binary file using a preset tool program to obtain a target array; and performing waveform editing on the target array based on a preset editing rule to obtain a target file recognizable by a burn-in device.

[0010] In an alternative manner, the step of reading each binary data in the target binary file using a preset tool program to obtain a target array further comprises: returning the total length of the target array read and the values corresponding to the high bits and low bits in each binary data in the target array.

[0011] In an alternative manner, the step of performing waveform editing on the target array based on the preset editing rule to obtain a target file recognizable by the burn-in device further comprises: sequentially reading the values corresponding to the high bits and the low bits in each binary data in the target array to obtain a high bit value group and a low bit value group; performing high or low setting on the TMS pin based on the preset editing rule and the high bit value group to obtain a waveform file of the TMS pin; performing high or low setting on the TDI pin based on the preset editing rule and the low bit value group to obtain a waveform file of the TDI pin; and obtaining the target file recognizable by the burn-in device according to the waveform file of the TMS pin and the waveform file of the TDI pin.

[0012] In an alternative manner, the step of performing high or low setting on the TMS pin based on the preset editing rule and the high bit value group to obtain a waveform file of the TMS pin further comprises: sequentially reading the values in the high bit value group, and performing high setting on the TMS pin if the value corresponding to the high bit is 1, or performing low setting on the TMS pin if the value corresponding to the high bit is 0, to obtain the waveform file of the TMS pin.

[0013] In an alternative manner, the step of performing high or low setting on the TDI pin based on the preset editing rule and the low bit value group to obtain a waveform file of the TDI pin further comprises: sequentially reading the values in the low bit value group, and performing high setting on the TDI pin if the value corresponding to the low bit is 1, or performing low setting on the TDI pin if the value corresponding to the low bit is 0, to obtain the waveform file of the TDI pin.

[0014] In another aspect, according to an embodiment of the present application, there is also provided a batch automatic testing device, which comprises: a format processing module configured to perform format processing on an original file to obtain a target binary file in a target format; wherein the original file is a waveform signal file; a file processing module configured to process the target binary file based on a preset tool program to obtain a target file recognizable by a burn-in device; wherein the preset tool program is established based on a burn-in test requirement input by a user; a signal set generation module configured to import the target file into a preset burn-in device to generate a burn-in test level signal set; and an automatic testing module configured to import the burn-in test level signal set into a digital waveform field entry type burn-in test platform to perform automatic testing.

[0015] According to another aspect of an embodiment of the present application, there is provided a computer device, which comprises: a controller; and a memory configured to store one or more programs, which, when executed by the controller, cause the controller to implement the batch automatic testing method described above.

[0016] The technical principle of the present application is that: by performing format processing on the original file, a target binary file in a target format is obtained, and then the target binary file is processed based on a preset tool program, so that a target file recognizable by the burn-in device is obtained, and finally the target file is directly imported into the preset burn-in device, so that the burn-in test level signal set can be directly generated, thereby realizing automatic generation of the burn-in test level signal set.

[0017] Compared with the prior art, the present application has the following beneficial effects: by performing format processing on the original file, a target binary file in a target format is obtained, and then the target binary file is processed based on a preset tool program, so that a target file recognizable by the burn-in device is obtained, and finally the target file is directly imported into the preset burn-in device, so that the burn-in test level signal set can be directly generated, thereby realizing automatic generation of the burn-in test level signal set. Compared with the prior art, which requires manual editing of the relevant level signal vector waveforms on the burn-in test device, the present application solves the technical problem of time-consuming and labor-intensive chip burn-in testing using the prior art, which requires manual editing of each vector waveform and repeated setting on each device when large-scale testing of chips is performed. The present application does not require manual editing and can directly import the preset burn-in device based on the generated target file to automatically generate the burn-in test level signal set, greatly saving manpower and time.

[0018] At the same time, since some vector waveforms are not regular fluctuations but are set according to a specific level sequence, the difficulty of manual setting will gradually increase with the depth of the vector, and the accuracy will also decrease rapidly. In the embodiment of the present application, the target file is directly imported into the preset burn-in device to directly generate the burn-in test level signal set without manual setting, which greatly improves the accuracy of chip burn-in vector setting and reduces errors caused by manual setting.

[0019] Furthermore, since the entire process is performed by a computer device, the depth of vector setting can be deepened when the original file and the user input burn-in test requirements are input, without considering the complexity and error-prone situation of manual editing, thereby improving the depth of chip burn-in vector setting and meeting the burn-in requirements of complex chips. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 The flowchart of the batch automatic test method in the embodiment of the present application.

[0021] Figure 2 The interface diagram before waveform input in the digital waveform field input type burn-in test platform in the embodiment of the present application.

[0022] Figure 3Interface diagram after waveform entry in the digital waveform field entry type burn-in test platform in the embodiment of the present application.

[0023] Figure 4 Flow chart of a batch automatic test method in another embodiment of the present application.

[0024] Figure 5 Flow chart of a batch automatic test method in another embodiment of the present application.

[0025] Figure 6 Flow chart of a batch automatic test method in another embodiment of the present application.

[0026] Figure 7 Flow chart of a batch automatic test method in another embodiment of the present application.

[0027] Figure 8 Structural block diagram of a batch automatic test device in the embodiment of the present application.

[0028] Figure 9 Structural schematic diagram of a computer device in the embodiment of the present application. DETAILED DESCRIPTION

[0029] The technical solutions in the present application are further described below in combination with the drawings and embodiments.

[0030] Traditional chip testing includes electrical performance, burn-in test, etc. The electrical performance test has mainstream ATE manufacturers to provide corresponding vector conversion tools for the test platform, and the professional barrier is high. The current situation of the burn-in test is that there are many platform brands and the designs are similar, and the burn-in test vectors are mostly periodic signals, which are generally generated by manual editing, and the automation degree is not high. In the test of AI chips, it will become the bottleneck of the whole project, so it is necessary and urgent to develop a vector conversion tool for burn-in test.

[0031] It should be noted that the execution subject of the present application is a computer device.

[0032] As Figure 1As shown, the embodiment of the present application provides a batch automatic test method based on a digital waveform field entry type burn-in test platform, the digital waveform field entry type burn-in test platform comprises a plurality of burn-in devices, wherein each burn-in device is the same, and each burn-in device is independently connected with the burn-in test platform. But each burn-in device can test different types of chips, because chip burn-in test is not only data test, but also includes temperature, humidity, pressure and other environment simulation, and the single burn-in device itself cannot provide environment simulation, so the burn-in device is in the box for environment simulation in the burn-in test platform, by setting the environment parameters of the burn-in test platform, and then the environment in the box meets the prediction requirements, so as to realize the environment simulation of the test chip in the burn-in device. The specific method comprises: Step S11: performing format processing on the original file to obtain a target binary file in a target format.

[0033] Wherein, the original file is in text format.

[0034] Specifically, the original file is in txt format, the original file is opened by WinHex.exe software, a hexadecimal file in digital signal format is obtained in WinHex.exe software, and then the hexadecimal file is converted into a binary file, and the binary file is modified in WinHex.exe software. Byte, the target binary file in the target format can be obtained.

[0035] Step S12: processing the target binary file based on a preset tool program to obtain a target file recognizable by the burn-in device.

[0036] Wherein, the preset tool program is established based on the burn-in test requirement input by the user.

[0037] Specifically, the preset tool program is Convert tool, and the Convert tool is established by the host computer device according to the burn-in test requirement input by the user, so the preset tool program can be changed according to the user's demand.

[0038] Step S13: importing the target file into the preset burn-in device to generate a burn-in test level signal set.

[0039] Specifically, a new device is built on the burn-in device, the signal depth is configured, and then the target file is imported into the burn-in device for opening, and the burn-in test level signal set is generated based on the edited digital waveform on the burn-in device. In the prior art, when a chip is tested on a large scale, each device needs to be set repeatedly once, and in the embodiment of the present application, the target file is only imported into each burn-in device, and the corresponding burn-in test level signal set can be generated, without manual repeated setting of each device as in the prior art, greatly reducing the processing complexity, saving labor cost, and improving efficiency. At the same time, since some vector waveforms are not regular fluctuations, but are set according to a specific level sequence, the difficulty of manual setting will gradually increase with the depth of the vector, and the accuracy will also decrease rapidly, while in the embodiment of the present application, the target file is directly imported into the preset burn-in device, and the burn-in test level signal set is directly generated in the burn-in device, without manual setting, improving the accuracy of chip burn-in vector setting, reducing errors caused by manual setting, and at the same time, since it is automatically generated, the depth of chip burn-in vector setting is improved, meeting the burn-in requirements of complex chips.

[0040] Step S14: Importing the burn-in test level signal set into the digital waveform field recording type burn-in test platform for automatic testing.

[0041] Specifically, the burn-in test level signal set is imported into the digital waveform field recording type burn-in test platform, so that automatic testing can be realized based on the digital waveform field recording type burn-in test platform.

[0042] As shown in Figure 2 and Figure 3 , the interfaces before and after waveform recording in the digital waveform field recording type burn-in test platform are correspondingly displayed.

[0043] Working principle: Currently, the basic logic behind the digital waveform field recording type burn-in test platform is to store the edited signal data in SRAM, and in use, the required digital signal waveform is output from SRAM by setting the address signal and dividing by hardware, so that batch automatic testing can be realized by this method. Among them, SRAM, Static Random-Access Memory, is a storage device that does not need to be periodically refreshed and has extremely fast read-write speed, mainly used for CPU cache.

[0044] Through experiments, it is determined that the method of the embodiment can generate a level vector file (i.e. a level signal set) within 30 minutes, and the related levels can be output according to the file requirements after calling the burn-in box, which can save a lot of time, labor and equipment cost.

[0045] Beneficial effects: the embodiment of the present application obtains a target binary file of a target format by performing format processing on the original file, and then processes the target binary file based on a preset tool program, so as to obtain a target file recognizable by the burn-in device. Finally, the target file is directly imported into the preset burn-in device, so that a burn-in test level signal set can be directly generated, thereby realizing automatic generation of the burn-in test level signal set. The burn-in test level signal set is imported into the digital waveform field entry type burn-in test platform for automatic testing, thereby realizing batch automatic testing. Compared with the prior art in which a person manually edits a vector waveform of a relevant level signal on a burn-in test device, the technical problem of the prior art that the data used in the NPU chip test process is non-repetitive and the data depth is large, and the time required for manual editing and the error rate are rapidly increased is solved. The present application does not require manual editing, but can directly import the generated target file into the preset burn-in device to automatically generate the burn-in test level signal set, thereby greatly saving manpower and time. At the same time, since some vector waveforms are not regular fluctuations, but are set according to a specific level sequence, the difficulty of manual setting gradually increases with the depth of the vector, and the accuracy also rapidly decreases. In the embodiment of the present application, the target file is directly imported into the preset burn-in device to directly generate the burn-in test level signal set in the burn-in device, without manual setting. Since manual editing is not required, the accuracy of the chip burn-in vector setting is greatly improved, and errors caused by manual setting are reduced. Furthermore, since the whole process is performed by a computer device, the depth of the vector setting can be deepened when the original file and the user input burn-in test requirement are input, without considering the complexity of manual editing and the possibility of errors, thereby improving the depth of the chip burn-in vector setting and meeting the burn-in requirements of complex chips.

[0046] In some embodiments, a batch automatic test method is provided, as shown in Figure 4 As shown in step S11, the step further includes: Step S111: importing the original file into a preset software to obtain a hexadecimal file in which a text format is converted into a digital signal format.

[0047] Specifically, the preset software is WinHex.exe software, which is a powerful hexadecimal editor and professional data recovery tool, mainly used in fields such as file analysis, disk editing, data recovery and computer forensics. The original file is imported into the WinHex.exe software to open it, and the original file is converted from a text format into a hexadecimal file in a digital signal format. The original file can be various binary systems, such as binary, ternary, decimal, etc. The binary system of the original file is equal to the number of pins connected between the chip to be burned in and the burn-in device.

[0048] Step S112: converting the hexadecimal file into a binary file in a preset software.

[0049] Specifically, the hexadecimal file is converted into a binary file in the WinHex.exe software.

[0050] Step S113: modifying the number of bytes in each line of the initial binary file based on the preset software to obtain a target binary file in a target format.

[0051] Specifically, the number of bytes in each line of the initial binary file is 1 in the WinHex.exe software, and thus the target binary file in the target format is obtained. In some embodiments, because the number of pins connected between different chips and burn-in devices is different, the number of bits of the level signal set file that can be implemented by the corresponding chip for detection tests is different, such as binary, ternary, decimal, and the like. However, regardless of the number of bits of the binary file, the final underlying presentation is a binary file, and thus the target format is a binary file.

[0052] Beneficial effects: The format conversion of the original file is realized based on the preset software, and the target binary file in the target format is quickly obtained, which greatly improves the processing speed and accuracy of the original file compared with manual operation.

[0053] In some embodiments, a batch automatic testing method is provided, as shown in Figure 5 Before step S12, the method further includes: Step S21: in response to a burn-in test requirement input by a user, compiling the burn-in test requirement in a preset language to obtain a requirement program file.

[0054] The preset language is a programming language, and the go language is preferably used, and other languages such as the Python language can also be used. However, because the go language has stronger data processing capability, the go language is preferably used as the preset language.

[0055] Specifically, the user can input the burn-in test requirement according to the actual situation. The host computer device responds to the burn-in test requirement input by the user, and directly compiles the burn-in test requirement in the preset language, and thus a compiled requirement program file is obtained. If the go language is used, the requirement program file obtained after compilation is in the spic.go format.

[0056] Step S22: storing the requirement program file into a head folder in a preset installation path corresponding to the preset language to obtain a target requirement program file.

[0057] Specifically, the requirement program file is placed in a head folder of an installation path corresponding to the preset language, so as to obtain a target requirement program file.

[0058] Step S23: creating a preset tool file in a preset language environment, and referencing the target requirement program file in the preset tool file to compile a preset tool program.

[0059] Specifically, the preset tool file is created in the preset language environment, and if the preset language is the go language, the preset tool file is "Convert tool.go", and the requirement program file, i.e., the "spic.go" file, is referenced, and after being compiled based on the "go language", an executable file "Convert tool.exe" is generated.

[0060] Beneficial effects: the embodiment of the present application responds to the user inputted burn-in test requirement, compiles the burn-in test requirement by using a preset language to obtain a requirement program file, stores the requirement program file into a head folder of an installation path corresponding to the preset language to obtain a target requirement program file, creates a preset tool file in a preset language environment, and references the target requirement program file in the preset tool file to compile a preset tool program. Thus, the user inputted burn-in test requirement and the preset tool program compiled based on the preset language are realized, which is used for subsequent processing of a target binary file.

[0061] In some embodiments, a batch automatic test method is provided, as shown in Figure 6 As shown in the figure, step S12 further includes: Step S121: reading each binary data in the target binary file by using the preset tool program to obtain a target array.

[0062] The preset tool program is the program compiled based on the user inputted burn-in test requirement and the preset language in the above-mentioned embodiments.

[0063] Specifically, each binary data in the target binary file is read by using the damaged tool program in sequence, so that a plurality of binary arrays are obtained to form the target array.

[0064] Step S122: performing waveform editing on the target array based on a preset editing rule to obtain a target file recognizable by a burn-in device.

[0065] The preset editing rule is that if the value of the low bit (the rightmost bit) of the binary data is 1, the TDI pin is set high, if the value of the low bit (the rightmost bit) of the binary data is 0, the TDI pin is set low, if the value of the high bit (the leftmost bit) of the binary data is 1, the TMS pin is set high, and if the value of the high bit (the leftmost bit) of the binary data is 0, the TMS pin is set low.

[0066] Specifically, the TMS pin is a test mode select (Test Mode Select), and the TDI pin is a test data input (Test Data In). The TMS determines the current operation type (such as loading an instruction or transmitting data) through a state machine, and the TDI completes data input in a specific state. According to the preset editing rule, combined with the values of the high bits and the low bits in the target array, waveform editing is performed, and a waveform file can be obtained, and the waveform file is a target file that can be recognized by the burn-in device. In actual application, the target file is a file format with a.sg suffix.

[0067] Beneficial effects: The embodiment of the present application further refines the step of processing the target binary file based on the preset tool program to obtain the target file recognizable by the burn-in device. By using the preset tool program to read each binary data in the target binary file to obtain a target array, and based on the preset editing rule, the target array is waveform edited to obtain the target file recognizable by the burn-in device. The technical means realizes waveform editing of the target binary file using the preset tool program to obtain the target file recognizable by the burn-in device. The technical effect further refines and enriches the present application scheme, and by using the damaged tool program operation, compared with the manual operation of the prior art, the file conversion accuracy and efficiency are greatly improved.

[0068] In some embodiments, a batch automatic test method is provided, and after step S121, the total length of the read target array and the values of the high bits and the low bits in each binary data in the target array are returned.

[0069] Specifically, the target array is composed of multiple arrays, and after reading, the total length of the read target array needs to be determined to prepare for subsequent waveform editing based on the values in each array in the target array. At the same time, the values of the high bits and the low bits in each binary data in the read target array need to be obtained, so as to further determine whether the TMS pin and the TDI pin should be set high or low based on the preset editing rule.

[0070] Beneficial effects: the embodiment of the present application further refines the step of processing the target binary file based on the preset tool program to obtain the target file recognizable by the old exercise device. The total length of the target array read and the values corresponding to the high bits and low bits in each binary data in the target array are returned to prepare for the subsequent step of performing waveform editing on the target array based on the preset editing rule to obtain the target file recognizable by the old exercise device. Thus, the present application scheme is further refined and enriched.

[0071] In some embodiments, a batch automated testing method is provided, as shown in Figure 7 As shown in step S122 further comprises: Step S31: sequentially reading the values corresponding to the high bits and low bits in each binary data in the target array to obtain a high bit value group and a low bit value group.

[0072] Specifically, since the high bits and low bits correspond to different pins, the high bits and low bits in the target array need to be separated, and the high bit value group corresponding to each high bit in the target array and the low bit value group corresponding to each low bit are obtained by sequentially reading.

[0073] Step S32: based on the preset editing rule and the high bit value group, the TMS pin is set high or low to obtain the waveform file of the TMS pin.

[0074] Wherein, the preset editing rule is: if the value of the high bit (the leftmost bit) of the binary data is 1, the TMS pin is set high, and if the value of the high bit (the leftmost bit) of the binary data is 0, the TMS pin is set low. The TMS pin is defined in the foregoing embodiments and will not be repeated here.

[0075] Specifically, according to the specific high bit value group of the preset editing rule, the TMS pin can be sequentially set high or low according to the value order of the high bit value group, so as to obtain the waveform file corresponding to the TMS pin.

[0076] Step S33: based on the preset editing rule and the low bit value group, the TMS pin is set high or low to obtain the waveform file of the TMS pin.

[0077] Wherein, the preset editing rule is: if the value of the low bit (the rightmost bit) of the binary data is 1, the TDI pin is set high, and if the value of the low bit (the rightmost bit) of the binary data is 0, the TDI pin is set low. The TDI pin is defined in the foregoing embodiments and will not be repeated here.

[0078] Specifically, according to the preset editing rule and the low bit value group, it can be determined that the TDI pin is sequentially set high or low according to the numerical order of the low bit value group, so as to obtain the waveform file corresponding to the TDI pin.

[0079] Step S34: obtaining a target file recognizable by the burn-in device according to the waveform file of the TMS pin and the waveform file of the TDI pin.

[0080] Specifically, the waveform file of the TMS pin and the waveform file of the TDI pin are merged into one file, and the obtained file is the target file recognizable by the burn-in device.

[0081] Beneficial effects: The embodiment of the present application further refines the step of performing waveform editing on the target array based on the preset editing rule to obtain the target file recognizable by the burn-in device. By using the high bit and low bit corresponding values in the target array to obtain the high bit value group and the low bit value group, and then based on the preset editing rule and the high bit value group and the low bit value group, the TMS pin and the TDI pin are set high or low respectively to obtain the waveform file of the TMS pin and the waveform file of the TDI pin, and then the target file is obtained by merging. The technical effect of performing waveform editing on the target array based on the preset editing rule to obtain the target file is achieved. Thus, the present application scheme is further refined and enriched.

[0082] In some embodiments, a batch automatic test method is provided, and step S32 further includes: sequentially reading the values in the high bit value group, if the high bit corresponding value is 1, the TMS pin is set high, and if the high bit corresponding value is 0, the TMS pin is set low to obtain the waveform file of the TMS pin.

[0083] Specifically, since the preset editing rule corresponding to the TMS pin is that if the value of the high bit (the leftmost bit) of the binary data is 1, the TMS pin is set high, and if the value of the high bit (the leftmost bit) of the binary data is 0, the TMS pin is set low. Therefore, in step S32, the values in the high bit value group are sequentially read, if the high bit corresponding value is 1, the TMS pin is set high, and if the high bit corresponding value is 0, the TMS pin is set low to obtain the waveform file of the TMS pin. Before waveform editing, the depth of the waveform vector needs to be set to determine the height difference between the high and low of the pin in the waveform file.

[0084] Beneficial effects: The embodiment of the present application further refines the step of setting the TMS pin high or low based on the preset editing rule and the high bit value group to obtain the waveform file of the TMS pin. Thus, the present application scheme is further refined and enriched.

[0085] In some embodiments, the batch automatic testing method further comprises: sequentially reading the values in the high bit value group, and setting the TDI pin high if the value corresponding to the low bit is 1, or setting the TDI pin low if the value corresponding to the low bit is 0, to obtain the waveform file of the TDI pin.

[0086] Specifically, since the preset editing rule corresponding to the TDI pin is that the TDI pin is set high if the value of the low bit (the rightmost bit) of the binary data is 1, or the TDI pin is set low if the value of the low bit (the rightmost bit) of the binary data is 0. Therefore, in step S33, the values in the high bit value group are sequentially read, and the TDI pin is set high if the value corresponding to the low bit is 1, or the TDI pin is set low if the value corresponding to the low bit is 0, to obtain the waveform file of the TDI pin. Before waveform editing, the depth of the waveform vector also needs to be set to determine the height difference between the high and low of the TDI pin in the waveform file.

[0087] Beneficial effects: The embodiments of the present application further refine the step of obtaining the waveform file of the TDI pin based on the preset editing rule and the low bit value group, corresponding to setting the TDI pin high or low. The present application further refines and enriches the scheme.

[0088] In some embodiments, after step S13, the method further comprises: determining a plurality of preset positions in the original file and obtaining the corresponding level values at the preset positions; determining the level signals corresponding to the preset positions in the burn-in test level signal set based on the correspondence between the original file and the burn-in test level signal set; detecting whether the corresponding level values and the level signals at the preset positions match; and determining whether the burn-in test level signal set is accurate according to the detection result.

[0089] The correspondence between the original file and the burn-in test level signal set is a position correspondence.

[0090] Specifically, the method provided by the present application is realized based on a format conversion tool. Different from manual input, if the format conversion tool makes a mistake, it is generally a batch offset problem. Therefore, the levels at different positions of the original file are selected, and the positions are jumped to on the old training platform for comparison and confirmation, so that the correctness of the conversion result can be confirmed. Here, the matching is that the format of the normal original file is converted into the target binary, and then the format of the level signal is generated. If it is matched, the value before the format conversion can correspond to the last generated level signal. If it cannot correspond, it is not matched. If the corresponding level value and the level signal at any preset position do not match, it is determined that the old training test level signal set is inaccurate, that is, the conversion is abnormal. If the corresponding level value and the level signal at any preset position are matched, it is determined that the old training test level signal set is accurate, that is, the format conversion has no problem, so that the accuracy of the generated old training test level signal set can be ensured.

[0091] Beneficial effects: by selecting multiple preset positions and the correspondence between the original file and the old training test level signal set, it is further detected whether the corresponding level value and the level signal at the preset position are matched, and finally the accuracy of the generated old training test level signal set can be quickly determined according to the detection result.

[0092] In some embodiments, the batch automatic test method can also be applied across platforms. Specifically, if cross-platform application is required, another platform-callable format can be generated in the manner of the above-mentioned embodiments. Only the related development environment including a 64-bit WIN10 operating system needs to be built, the open source LiteIDE compilation software and the Winhex free version 16 hexadecimal editor are installed, the corresponding executable file is generated, and the file is imported into the original file to generate the platform-callable file.

[0093] As shown in Figure 8 , the embodiment of the present application provides a batch automatic test device 400, the device comprises: a format processing module 410, configured to perform format processing on an original file to obtain a target binary file in a target format; wherein the original file is a waveform signal file; a file processing module 420, configured to process the target binary file based on a preset tool program to obtain a target file recognizable by an old training device; wherein the preset tool program is established based on old training test requirements input by a user; a signal set generation module 430, configured to import the target file into a preset old training device to generate an old training test level signal set; an automatic test module 440, configured to import the old training test level signal set into a digital waveform field entry type old training test platform to perform automatic test.

[0094] Beneficial effects: the embodiment of the present application obtains a target binary file of a target format by performing format processing on an original file, and then processes the target binary file based on a preset tool program, so as to obtain a target file recognizable by a burn-in device, and finally directly imports the target file into a preset burn-in device, so that a burn-in test level signal set can be directly generated, thereby realizing automatic generation of the burn-in test level signal set, and then importing the burn-in test level signal set into the digital waveform field entry type burn-in test platform for automatic testing, thereby realizing batch automatic testing. Compared with the prior art in which a person manually edits a vector waveform of a relevant level signal on a burn-in test device, the technical problem of the prior art that the data used in the NPU chip test process is non-repetitive and has a large data depth, and the time required for manual editing and the error rate will rapidly increase is solved. The present application does not require manual editing, but can directly import a preset burn-in device based on a generated target file to automatically generate a burn-in test level signal set, thereby greatly saving manpower and time. Meanwhile, since some vector waveforms are not regular fluctuations, but are set according to a specific level sequence, the difficulty of manual setting will gradually increase with the depth of the vector, and the accuracy will rapidly decrease. In the embodiment of the present application, a target file is directly imported into a preset burn-in device to directly generate a burn-in test level signal set in the burn-in device, without manual setting, and since manual setting is not required, the accuracy of chip burn-in vector setting is greatly improved, and errors caused by manual setting are reduced. Furthermore, since the whole process is performed by a computer device, the depth of vector setting can be deepened when an original file and a user input burn-in test requirement are input, without considering that manual setting is too complex and prone to errors, thereby improving the depth of chip burn-in vector setting and meeting the burn-in requirements of complex chips.

[0095] Figure 9 The structure schematic diagram of the embodiment of the computer device of the present application is shown, which shows the structure schematic diagram of the computer system of the computer device suitable for realizing the embodiment of the present application, and the embodiment of the present application does not limit the specific implementation of the computer device.

[0096] Please refer to Figure 9 As shown in the figure, the computer device comprises a controller, a memory for storing one or more programs, when the one or more programs are executed by the controller, to execute the batch automatic test method described above.

[0097] Please continue to refer to Figure 9As shown, the computer system 500 of the computer device includes a central processing unit (CPU) 501 which can perform various appropriate actions and processes in accordance with a program stored in a read-only memory (ROM) 502 or a program loaded from the storage section 508 into a random access memory (RAM) 503, such as executing the method in the above-described embodiments. In the RAM 503, various programs and data required for the operation of the system are also stored. The CPU 501, the ROM 502, and the RAM 503 are connected to each other through a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0098] Connected to the I / O interface 505 are an input section 506 including a keyboard, a mouse, etc.; an output section 507 including a display such as a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 508 including a hard disk, etc.; and a communication section 509 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 509 performs communication processing via a network such as the Internet. A drive 510 is also connected to the I / O interface 505 as necessary. A removable recording medium 511 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc. is attached to the drive 510 as necessary, so that a computer program read therefrom is installed in the storage section 508 as necessary.

[0099] In particular, the processes described above with reference to the flowcharts can be implemented as a computer software program according to embodiments of the present application. For example, embodiments of the present application include a computer program product comprising a computer program carried on a computer readable medium, the computer program containing instructions for performing the methods illustrated by the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via the communication section 509, and / or installed from the removable recording medium 511. When the computer program is executed by the central processing unit (CPU) 501, various functions defined in the system of the present application are performed.

[0100] Another aspect of the present application also provides a computer readable storage medium having stored therein at least one executable instruction, which, when executed on a computer device, causes the computer device to perform the batch automated testing method as in any one of the above embodiments.

[0101] Beneficial effects: the embodiment of the present application obtains the target binary file of the target format by performing format processing on the original file, and then processes the target binary file based on the preset tool program, so as to obtain the target file recognizable by the burn-in device. Finally, the target file is directly imported into the preset burn-in device, so that the burn-in test level signal set can be directly generated, thereby realizing automatic generation of the burn-in test level signal set. The burn-in test level signal set is imported into the digital waveform field entry type burn-in test platform for automatic testing, thereby realizing batch automatic testing. Compared with the prior art which needs manual editing of the vector waveform of the relevant level signal on the burn-in test device, the technical problems of the prior art that the data used in the NPU chip test process is non-repetitive and the data depth is large, and the time and error rate required for manual editing will rapidly increase are solved. The present application does not need manual editing, and can directly import the preset burn-in device based on the generated target file to automatically generate the burn-in test level signal set, thereby greatly saving manpower and time. At the same time, since some vector waveforms are not regular fluctuations, but are set according to a specific level sequence, the difficulty of manual setting will gradually increase with the depth of the vector, and the accuracy will also rapidly decrease. In the embodiment of the present application, the target file is directly imported into the preset burn-in device to directly generate the burn-in test level signal set in the burn-in device, without the need for manual setting. Since manual editing is not needed, the accuracy of the chip burn-in vector setting is greatly improved, and the errors caused by manual setting are reduced. Furthermore, since the whole process is performed by the computer device, the depth of the vector setting can be deepened when the original file and the user input burn-in test requirement are input, without the need to consider the complexity of manual editing and the possibility of errors, thereby improving the depth of the chip burn-in vector setting and meeting the burn-in requirements of complex chips.

[0102] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the purpose and scope of the present application, and they should be covered in the scope of the claims of the present application.

Claims

1. A method of batch automated testing, characterized by, The method is based on a digital waveform field entry type burn-in test platform, the digital waveform field entry type burn-in test platform comprises a plurality of burn-in devices, and the method comprises the following steps: The original file is format-processed to obtain a target binary file in a target format; The target binary file is processed based on a preset tool program to obtain a target file recognizable by the burn-in device; wherein the preset tool program is established based on a burn-in test requirement input by a user; The target file is imported into the burn-in device to generate a burn-in test level signal set; The burn-in test level signal set is imported into the digital waveform field entry type burn-in test platform for automatic testing.

2. The method of claim 1, wherein, The original file is in a text format; the step of format-processing the original file to obtain a binary file in a target format further comprises the following steps: The original file is imported into a preset software to obtain a hexadecimal file in which a text format is converted into a digital signal format; The hexadecimal file is converted in the preset software to obtain an initial binary file; The number of bytes in each line of the initial binary file is modified based on the preset software to obtain a target binary file in a target format.

3. The method of claim 1, wherein, Before the step of processing the target binary file based on the preset tool program to obtain a target file recognizable by the burn-in device, the following steps are further included: In response to the burn-in test requirement input by the user, the burn-in test requirement is compiled using a preset language to obtain a requirement program file; The requirement program file is stored in a head folder of an installation path corresponding to the preset language to obtain a target requirement program file; A preset tool file is created in the preset language environment, and the target requirement program file is referenced in the preset tool file to compile a preset tool program.

4. The method according to claim 1 or 3, characterized in that, The step of processing the target binary file based on the preset tool program to obtain a target file recognizable by the burn-in device further comprises the following steps: Each binary data in the target binary file is read using the preset tool program to obtain a target array; The target array is waveform-edited based on a preset editing rule to obtain a target file recognizable by the burn-in device.

5. The method of claim 4, wherein, After the step of reading each binary data in the target binary file using the preset tool program to obtain a target array, the following steps are further included: The total length of the target array read and the values corresponding to the high bits and the low bits in each binary data in the target array are returned.

6. The method of claim 5, wherein, The step of waveform-editing the target array based on a preset editing rule to obtain a target file recognizable by the burn-in device further comprises the following steps: The values corresponding to the high bits and the low bits in each binary data in the target array are read in sequence to obtain a high bit value group and a low bit value group; Based on the preset editing rule and the high bit value group, the TMS pin is set high or low to obtain a waveform file of the TMS pin; Based on the preset editing rule and the low bit value group, the TDI pin is set high or low to obtain a waveform file of the TDI pin; According to the waveform file of the TMS pin and the waveform file of the TDI pin, a target file recognizable by the burn-in device is obtained.

7. The method of claim 6, wherein, The step of obtaining the waveform file of the TMS pin based on the preset editing rule and the high-bit value group and corresponding setting the TMS pin to high or low further comprises: The values in the high-bit value group are read in sequence, if the value corresponding to the high bit is 1, the TMS pin is set to high, if the value corresponding to the high bit is 0, the TMS pin is set to low, so as to obtain the waveform file of the TMS pin.

8. The method according to claim 6, characterized in that, The step of obtaining the waveform file of the TDI pin based on the preset editing rule and the low-bit value group and corresponding setting the TDI pin to high or low further comprises: The values in the low-bit value group are read in sequence, if the value corresponding to the low bit is 1, the TDI pin is set to high, if the value corresponding to the low bit is 0, the TDI pin is set to low, so as to obtain the waveform file of the TDI pin.

9. A batch automated test device, characterized by, The device comprises: a format processing module, configured to perform format processing on an original file to obtain a target binary file in a target format; a file processing module, configured to process the target binary file based on a preset tool program to obtain a target file recognizable by a burn-in device, wherein the preset tool program is established based on a burn-in test requirement input by a user; a signal set generation module, configured to import the target file into the burn-in device to generate a burn-in test level signal set; an automatic test module, configured to import the burn-in test level signal set into a digital waveform field entry type burn-in test platform to perform automatic test.

10. A computer device, comprising: comprise: a controller; a memory, configured to store one or more programs, when the one or more programs are executed by the controller, the controller is caused to implement the batch automatic test method in any one of claims 1 to 8.

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