Novel ultra-light and ultra-thin backlight source structure

Abstract

The invention relates to the technical field of semiconductor display, in particular to a novel ultra-light and ultra-thin backlight source structure which comprises an L-shaped carbon fiber back plate which is fixed in a U-fold attaching mode, and the L-shaped short end of the carbon fiber back plate is stuffed into a U fold; the One film covers the surface of the light guide plate; the thickness of the light guide plate is 0.25 to 0.5 mm; the reflector plate is arranged below the light guide plate; and the LED light bar is arranged along the side edge of the light guide plate. The ultra-thin and ultra-light performance of the backlight source is remarkably improved through innovative design. The carbon fiber back plate adopts an L-shaped U-fold fitting mode combined with a short end plugging design, so that the weight is greatly reduced, the structural strength is enhanced, and the durability is improved. The thickness of the ultrathin light guide plate is controlled to be 0.25-0.5 mm, an One film integrated optical film layer is matched, multi-layer stacking is simplified, optical uniformity and high brightness are guaranteed, and the thickness of the module is reduced. The reflector plate is made of a white or silver material, so that the reflection efficiency is optimized, and the light loss is reduced. And the low-power-consumption and high-brightness lighting effect is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor display, in particular to a novel ultra-thin and ultra-light backlight structure. BACKGROUND

[0002] Although the design technology of the existing backlight structure is relatively mature, the product development direction of the current industry is focused on ultra-thin and ultra-light. In order to effectively respond to this important trend, we hereby propose this scheme to seek a breakthrough solution.

[0003] In the structural design of the existing backlight, a plurality of key components must be integrated, including a back plate, a rubber frame, a light bar, a light guide plate, a reflective sheet, a plurality of optical films, and various adhesive tapes. This complex composition inevitably leads to higher requirements in terms of structural strength, overall weight, module thickness, and material cost.

[0004] The traditional backlight structure is limited by the inherent design concept and material application, and it is difficult to find an effective and reliable solution in terms of fundamental structural strength optimization or key size thickness reduction while maintaining basic performance. This limitation has become a major technical bottleneck restricting the continuous evolution of the backlight towards lighter and thinner, and it is difficult to meet the growing demand for extreme thinning development in the market. SUMMARY

[0005] In view of the deficiencies of the prior art, the present application discloses a novel ultra-thin and ultra-light backlight structure to solve the above problems.

[0006] The present application is realized by the following technical solutions:

[0007] The present application provides a novel ultra-thin and ultra-light backlight structure, comprising:

[0008] The carbon fiber back plate is an L-shaped carbon fiber back plate, which is fixed by U-fold lamination, and the L-shaped short end is inserted into the U-fold;

[0009] One film, covering the surface of the light guide plate;

[0010] The ultra-thin light guide plate has a thickness of 0.25-0.5mm;

[0011] The reflective sheet is arranged below the light guide plate;

[0012] The LED light bar is arranged along the side edge of the light guide plate.

[0013] Further, the carbon fiber back plate is a full back plate structure or a large hollow back plate structure.

[0014] Further, it contains a rubber frame or does not contain a rubber frame.

[0015] Further, the carbon fiber backboard is fixed by glue, and the U-shaped edge corner enhances the structural strength.

[0016] Further, the LED light bar adopts 3004 / 2604 / 2605 / 3006 type LED chips.

[0017] Further, the reflective sheet is a white reflective sheet or a silver reflective sheet.

[0018] Further, the One film film integrates multiple optical film layers.

[0019] The beneficial effects of the present application are:

[0020] The present application significantly improves the ultra-thin and ultra-light performance of the backlight source through innovative structural design. Specifically, the carbon fiber backboard adopts an L-shaped U-shaped edge bonding method, and the short end is designed to be inserted, which not only greatly reduces the overall weight, but also enhances the structural strength through the U-shaped edge corner, effectively resists external force impact, and improves product durability. The thickness of the ultra-thin light guide plate is controlled within the range of 0.25-0.5mm, and the One film film integrates multiple optical film layers (such as brightness enhancement film, diffusion film, etc.), which simplifies the traditional multi-layer film stacking, while ensuring optical uniformity and high brightness, further reducing the module thickness.

[0021] The reflective sheet of the present application is made of white or silver material, which optimizes the light reflection efficiency and reduces light loss. The LED light bar adopts 3004 / 2604 / 2605 / 3006 and other high-efficiency chip models to achieve low-power and high-brightness lighting effect. In addition, the flexible design of the glue frame provides configuration flexibility, which can further reduce weight and cost in the glue-free mode, and the full backboard or large hollow backboard structure adapts to different application scenarios. The overall scheme greatly reduces material cost and assembly complexity, improves production yield, and meets the urgent needs of the market for light and thin display devices. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0023] Figure 1 is a new type of ultra-light and ultra-thin backlight structure diagram;

[0024] Figure 2 is Figure 1 is the internal structure diagram of position A in

[0025] The numbers in the figure represent:

[0026] 1, U-fold; 2, carbon fiber backboard; 3, light guide plate; 4, One film film. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0028] In an embodiment, referring to FIGS. 1-2, Figure 1 and Figure 2 a new type of ultra-light and ultra-thin backlight structure is provided, comprising:

[0029] a carbon fiber backboard, which is an L-shaped carbon fiber backboard, is fixed by U-fold adhesion, and the L-shaped short plate is inserted into the U-fold;

[0030] a One film film covering the surface of the light guide plate;

[0031] an ultra-thin light guide plate with a thickness of 0.25-0.5 mm;

[0032] a reflective sheet arranged below the light guide plate;

[0033] an LED light bar arranged along the side edge of the light guide plate;

[0034] Further, the carbon fiber backboard is a full backboard structure or a large hollow backboard structure; the carbon fiber backboard is fixed by adhesive adhesion, and the U-fold edge angle enhances the structural strength.

[0035] In an embodiment, the new type of ultra-light and ultra-thin backlight structure contains a glue frame or does not contain a glue frame;

[0036] In this embodiment, the LED light bar adopts 3004 / 2604 / 2605 / 3006 type LED chips.

[0037] In this embodiment, the reflective sheet is a white reflective sheet or a silver reflective sheet.

[0038] In this embodiment, the One film film integrates multiple optical film layers.

[0039] Embodiment 1: full backboard structure + glue frame assembly

[0040] 1. Carbon fiber backboard preparation

[0041] Lightweight carbon fiber plate process (density 0.65-0.7 g / cm 3 ):

[0042] Raw materials: T700 carbon fiber prepreg (FAW 15g / m 2 ) and fast curing epoxy resin (HY103, curing condition 150℃ / 3-5min)

[0043] Process: Prepreg is stacked as `[0℃F / 90℃F / PMI core material / 90℃F / 0℃F]`, and is integrally molded by 200T-500T hot press, the backboard thickness is 0.05-0.5mm, and the U-folded edge angle is enhanced by the reverse deformation process.

[0044] 2. Assembly structure

[0045] The backboard is a full backboard without hollowing, and the U-folded edge angle height is 0.5-3.0mm;

[0046] The glue frame is bonded with the backboard by the glue paper bonding method; if the process is further optimized, the glue frame is integrated with the backboard by in-mold injection;

[0047] The layers are stacked in sequence: reflective sheet (0.05-0.2mm white / silver reflective) → ultrathin light guide plate (0.25-0.5mm) → Onefilm film (integrated brightening + diffusion layer), which is integrated with the ultrathin light guide plate LED light bar in this embodiment (3004 / 2604 / 2605 / 3006 type LED chip side-in type).

[0048] Example 2: full backboard structure + no glue frame assembly

[0049] 1. Carbon fiber backboard preparation

[0050] Lightweight carbon fiber plate process (density 0.65-0.7g / cm 3 ):

[0051] Raw materials: T700 carbon fiber prepreg (FAW 15g / m 2 ) and fast curing epoxy resin (HY103, curing condition 150℃ / 3-5min)

[0052] Process: Prepreg is stacked as `[0℃F / 90℃F / PMI core material / 90℃F / 0℃F]`, and is integrally molded by 200T-500T hot press, the backboard thickness is 0.05-0.5mm, and the U-folded edge angle is enhanced by the reverse deformation process.

[0053] 2. Assembly process

[0054] The backboard is a full backboard without hollowing, and the U-folded edge angle height is 0.5-3.0mm;

[0055] Backplane on the back of the stack: reflective sheet (0.05-0.2mm white / silver) → ultra-thin light guide plate (0.25-0.5mm) → One film film (integrated brightening + diffusion layer), this embodiment is integrated with ultra-thin light guide plate LED light bar (3004 / 2604 / 2605 / 3006 type LED chip side-in type).

[0056] Example 3: Large hollow backboard + glue frame assembly

[0057] 1. Hollow backboard design

[0058] Use lightweight carbon fiber plate process (density 0.65-0.7g / cm 3 ):

[0059] Raw materials: T700 carbon fiber prepreg (FAW 15g / m 2 ) and fast curing epoxy resin (HY103, curing condition 150℃ / 3-5min)

[0060] Process: Prepreg is stacked according to `[0℃F / 90℃F / PMI core material / 90℃F / 0℃F]`, and is integrally formed by 200T-500T hot press molding. The backboard thickness is 0.05-0.5mm. The backboard is integrally hot-pressed or laser-cut into a 3D complex structure. When optimizing the process, local convex structures (height 0.05-0.08mm) can be selected to improve rigidity. The U-shaped edge angle is enhanced by the reverse deformation process.

[0061] The hollow rate of the center area of the backboard is 30-95%. The frame reinforcing rib (width 2mm) can be reserved according to the actual needs of the customer, or the reinforcing rib can not be reserved.

[0062] 2. Glue frame integration

[0063] The backboard is a large hollow full backboard, and the U-shaped edge angle height is 0.5-3.0mm.

[0064] The glue frame and the backboard are bonded by adhesive paper. If the process is further optimized, the glue frame is integrated with the backboard by in-mold injection.

[0065] Stacked in order: reflective sheet (0.05-0.2mm white / silver) → ultra-thin light guide plate (0.25-0.5mm) → One film film (integrated brightening + diffusion layer), this embodiment is integrated with ultra-thin light guide plate LED light bar (3004 / 2604 / 2605 / 3006 type LED chip side-in type).

[0066] Example 4: Large hollow backboard + no glue frame assembly

[0067] 1. Hollow backboard design

[0068] Lightweight carbon fiber plate process (density 0.65-0.7 g / cm 3 ):

[0069] Raw materials: T700 carbon fiber prepreg (FAW 15 g / m 2 ) and fast curing epoxy resin (HY103, curing condition 150℃ / 3-5min)

[0070] Process: Prepreg is stacked according to `[0℃F / 90℃F / PMI core material / 90℃F / 0℃F]`, and is integrally molded by 200T-500T hot press, with a back plate thickness of 0.05-0.5mm. 3D complex structure integrally hot-pressed or laser cutting molding technology is used for hollowing processing. When optimizing the process, local convex structure (height 0.05-0.08mm) can be selected to improve rigidity; U-folded corner is enhanced by reverse deformation process.

[0071] The back plate center area is hollowed at a rate of 30-95%, and a frame reinforcing rib (width 2mm) can be reserved according to the actual needs of customers, or no reinforcing rib is reserved.

[0072] 2. Assembly process

[0073] The back plate is a large hollow full back plate, and the U-folded corner height is 0.5-3.0mm;

[0074] The back plate is sequentially stacked with: reflective sheet (0.05-0.2mm white / silver) → ultra-thin light guide plate (0.25-0.5mm) → One film (integrated brightness + diffusion layer), which is integrated with the ultra-thin light guide plate LED light bar in this embodiment (3004 / 2604 / 2605 / 3006 type LED chip side-in type).

[0075] Key points of carbon fiber back plate production process

[0076] 1. Material selection: Preferably use recycled carbon fiber + plant fiber composite plate (density 0.7 g / cm3), which meets the concept of sustainable development.

[0077] 2. Molding process:

[0078] One-piece hot pressing: complex U-fold structure is molded by in-mold hot pressing once, avoiding secondary CNC processing;

[0079] Resin system: halogen-free epoxy resin HY103 for consumer electronics, with fast curing speed (3-5min) and flame retardancy up to standard.

[0080] 3. Strength enhancement:

[0081] The U-folded corner adopts "in-mold secondary molding sealing structure", and toughening resin is injected at the corner to improve impact resistance;

[0082] The hollowed back plate is designed with continuous fiber of different thickness, the frame area is thickened to 0.05-0.8mm, and the center area is thinned to 0.05-0.3mm.

[0083] Technical effects

[0084] Comparison table of weight loss effect and characteristics of embodiments

[0085] Embodiment Weight loss effect Thickness Key advantages Embodiment 1 ↓ 36% compared to aluminum backboard Total thickness 0.6-1.5mm Strong backboard support, suitable for automatic machine assembly Embodiment 2 ↓37％ 0.6-1.5mm Ultra-narrow frame (≤1.5mm) realized without glue frame Embodiment 3 ↓68％ 0.6-1.5mm Hollow design + glue frame, balance light weight and strength Embodiment 4 ↓70％ 0.6-1.5mm Ultra-narrow frame (≤1.5mm) realized without glue frame

[0086] Stress comparison test scheme

[0087] 1. Test object

[0088] Comparison table of structure of experimental group and control group

[0089] Group Structure description Core difference Experimental group L-shaped carbon fiber backboard + U-folded edge Three-dimensional edge cladding, mechanical anchoring Control group Ordinary flat carbon fiber backboard Flat without strengthening structure

[0090] 2. Test items and indicators

[0091] Structure test items and mechanism analysis table

[0092]

[0093]

[0094] 3. Key verification points

[0095] Stress dispersion effect

[0096] The U-shaped structure converts the plane stress of the traditional back plate into a three-dimensional frame stress:

[0097] I U = I flat + 2Ad 2

[0098] Where:

[0099] I U : Total moment of inertia of U-shaped section (or cross-sectional moment of inertia, usually in mm 4 or m 4 ).

[0100] I flat : Moment of inertia of the flat part (U-shaped bottom web) about its own neutral axis (units are consistent with (I U ).

[0101] (A): Area of each side of the U-shaped (usually in mm 2 or m 2 ), corresponding to the "U-shaped side area" you described.

[0102] (d): Distance from overall neutral axis to the web's own centroidal axis (unit is usually mm or m), corresponds to what you described as "neutral axis to web distance".

[0103] Coefficient (2): indicates that U-shaped section has two symmetric side edges (flanges), so the contribution term is doubled.

[0104] By strain gauge data comparison: the edge stress concentration factor of the experimental group is expected to be reduced by 40%.

[0105] Bending stiffness is improved

[0106] The "I-beam effect" of U-fold enhances the cross-sectional moment of inertia:

[0107]

[0108] Where:

[0109] I total : Total moment of inertia of U-shaped section about its neutral axis (strong axis).

[0110] I web : Moment of inertia of the web (i.e. "flat plate" in user formula) about its own centroidal axis (due to symmetry, the web centroidal axis coincides with the overall neutral axis).

[0111] A f : Cross-sectional area of one flange (i.e. (A) in user formula).(d c ): Vertical distance from the section neutral axis to the centroid of one flange (i.e. (d) in user formula).

[0112] Edge failure suppression

[0113] Ordinary backplate is prone to micro-cracks (SEM observation) due to edge stress during assembly, while the mechanical wrapping of U-fold provides continuous support boundary, eliminating edge free deformation.

[0114] Test data expected comparison

[0115] Comparison table of carbon fiber backplate performance parameters

[0116] Performance parameters Ordinary carbon fiber backboard L-shaped + U-folded structure Improvement range Bending ultimate strength (MPa) 320 368 +15％ Torsional stiffness N·m / ° 15.2 18.6 +22％ Impact delamination area (mm 2 )]]> 120 62 -48％

[0117] Conclusion demonstration

[0118] U-fold structure realizes stress advantage through triple mechanical optimization:

[0119] 1. Load path reconstruction converts planar stress to three-dimensional frame bearing

[0120] 2. Edge constraint strengthening suppresses micro-crack initiation

[0121] 3. Failure mode upgrade from brittle fracture to progressive delamination.

[0122] In summary, the present application significantly improves the ultra-thin and ultra-light performance of the backlight source through innovative structural design. Specifically, the carbon fiber backboard adopts an L-shaped U-folded lamination method, combined with its short end plug-in design, which not only greatly reduces the overall weight, but also enhances the structural strength through the U-folded edge angle, effectively resisting external force impact and improving product durability. The thickness of the ultra-thin light guide plate is controlled within the range of 0.25-0.5mm, and the One film membrane is integrated with multiple optical film layers (such as brightness enhancement film, diffusion film, etc.), simplifying the traditional multi-layer film stacking, while ensuring optical uniformity and high brightness, further reducing the module thickness.

[0123] The reflective sheet of the present application is selected from white or silver materials, which optimizes the light reflection efficiency and reduces light loss; the LED light bar adopts 3004 / 2604 / 2605 / 3006 high-efficiency chip models to achieve low-power and high-brightness lighting effects. In addition, the flexible configuration provided by the optional design of the rubber frame can further reduce weight and cost in the no-rubber frame mode, while the full backboard or large hollow backboard structure adapts to different application scenarios. The overall scheme greatly reduces material costs and assembly complexity, improves production yield, and meets the urgent needs of the market for light and thin display devices.

[0124] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A novel ultra-thin backlight structure, characterized in that, Comprise: Carbon fiber backboard, L-shaped carbon fiber backboard, fixed by U-folded paste, its L-shaped short end is inserted into the U-folded; One film film, covering the surface of the light guide plate; Light guide plate, thickness is 0.25-0.5mm; Reflective sheet, arranged below the light guide plate; LED light bar, arranged along the side edge of the light guide plate.

2. The novel ultra-thin backlight structure of claim 1, wherein: The carbon fiber backboard is a full backboard structure or a large hollow backboard structure.

3. The novel ultra-thin backlight structure of claim 1, wherein: With or without glue frame.

4. The novel ultra-thin backlight structure of claim 1, wherein: The carbon fiber backboard is fixed by glue paste, and the U-folded edge angle enhances the structural strength.

5. The novel ultra-thin backlight structure according to claim 1, wherein: The LED light bar adopts 3004 / 2604 / 2605 / 3006 type LED chip.

6. The novel ultra-thin backlight structure according to claim 1, wherein: The reflective sheet is a white reflective sheet or a silver reflective sheet.

7. The novel ultra-thin backlight structure according to claim 1, wherein: The One film film integrates multiple optical film layers.

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