A machine vision-based BGA camera module testing device
By integrating a small-area positive electrode array and a large-area negative electrode capacitor into the BGA packaging testing equipment, combined with mineral oil dielectric and a passive adjustment support structure, automated leveling of the carrier platform is achieved, solving the problem of cumbersome manual leveling operations and improving the automation level and testing efficiency of the equipment.
CN121091044BActive Publication Date: 2026-06-09昆山瑞弘测控自动化设备有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 昆山瑞弘测控自动化设备有限公司
- Filing Date
- 2025-09-25
- Publication Date
- 2026-06-09
AI Technical Summary
Technical Problem
In existing BGA packaging and testing equipment, the manual leveling of the carrier angle is cumbersome, which affects the automation level and efficiency of the equipment.
Method used
A machine vision-based BGA-packaged camera module testing device automatically identifies and adjusts the tilt direction of the platform by integrating a capacitor consisting of a small-area positive electrode array and a large-area negative electrode, combined with a mineral oil dielectric and a passively adjustable support structure, thereby achieving automated leveling.
Benefits of technology
It has improved the automation level of the equipment, simplified the vehicle angle leveling operation, and improved the detection efficiency and ease of use of the equipment.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN121091044B_ABST
Abstract
The application relates to the field of electric inspection equipment, in particular to a BGA package camera module testing device based on machine vision, which comprises a three-axis bed body, Y-axis and Z-axis of the three-axis bed body, and X-axis moving along the Y-axis, and further comprises: a contact, the contact moves along the Z-axis, the contact is in an L shape, a contact pin is fixed at the end of the short side of the L shape, and is used for point contact with a chip pin; a vision module and a distance sensor are fixed on the three-axis bed body and are used for spatial positioning of the chip pin; and a carrier comprises a base, the top end of the base is slotted, and a round sheet-shaped negative electrode is arranged at the bottom of the slot and parallel to the plane where the X-axis and the Y-axis are located. The BGA package camera module testing device can automatically adjust the platform surface, improves the automation degree of the device, meets the convenience of equipment debugging and the improvement of equipment use efficiency, and effectively solves the problem that manual leveling operation is inconvenient for the angle of a BGA package product testing carrier.
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