Integrated input module
By integrating the display layer, touch layer, writing layer, and haptic feedback layer, the integrated input module solves the problem of diverse input methods in electronic devices within a limited space, and realizes a multifunctional operating experience.
Patent Information
- Application Number
- CN202510053479.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-06-06
- Filing Date
- 2025-01-14
- Publication Date
- 2025-12-09
AI Technical Summary
Existing electronic devices' input devices are limited by the limited operating space, making it difficult to provide diverse input methods and meet the development needs of miniaturization and multifunctionality.
Design an integrated input module comprising a display layer, a touch layer, a writing layer, and a haptic feedback layer. By overlaying these layers, haptic feedback, writing, display, and touch functions are integrated, allowing users to perform multiple operations within a single action area.
Within a limited operating space, it provides more diverse input methods, supports active or passive pen operation, enhances the user experience, and realizes the development trend of miniaturization and multi-functionality.
Smart Images
Figure CN121091981A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a user instruction input module, and more particularly to an integrated input module allowing a user to perform multiple functions in a single action area. BACKGROUND
[0002] With the rapid development of technology, people have higher and higher requirements for the quality of life, and various information terminals or electronic devices such as desktop computers and notebook computers are developing towards diversification of functions, thereby driving the development of various input devices such as touchpads and handwriting pads. However, various input devices of electronic devices have the need to provide a user with an action area for operation, and therefore, in order to meet the development trend of miniaturization and multifunctionalization of electronic devices, how to provide more diversified input methods in limited operation space is a problem that needs to be solved by those skilled in the art at present. SUMMARY
[0003] The embodiments of the present application provide an integrated input module capable of providing more diversified input methods in limited operation space to provide a user with good operation experience.
[0004] In order to solve the above technical problems, the present application is implemented as follows: The present application provides an integrated input module, which comprises a display layer, a touch layer, a writing layer and a haptic feedback layer. The display layer comprises a light-out side and a back light side; the touch layer is arranged on the light-out side of the display layer, and the touch layer generates a touch signal according to a touch operation of a user on the touch layer; the writing layer generates a writing signal according to a writing operation of the user on the writing layer; and the haptic feedback layer generates a vibration feedback according to the touch signal or the writing signal. The writing layer is arranged between the light-out side of the display layer and the touch layer, and the haptic feedback layer is arranged on the back light side of the display layer, or the writing layer is arranged between the back light side of the display layer and the haptic feedback layer.
[0005] In the integrated input module of the embodiments of the present application, the haptic feedback function, the writing function, the display function and the touch function are integrated by stacking the display layer, the touch layer, the writing layer and the haptic feedback layer, so that a user can perform multiple function operations in a single action area to meet the development trend of miniaturization and multifunctionalization, and more diversified input methods can be provided in limited operation space to provide a user with good operation experience. In addition, by stacking the touch layer, the writing layer, the display layer and the haptic feedback layer in order from top to bottom or by stacking the touch layer, the display layer, the writing layer and the haptic feedback layer in order from top to bottom, the integrated input module can support the operation of an active pen or a passive pen, and the execution of functions between the layers will not affect each other. BRIEF DESCRIPTION OF DRAWINGS
[0006] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings: Figure 1 A schematic diagram of the appearance of a computer host using the integrated input module of the present invention; Figure 2 A schematic diagram of the appearance of a laptop computer using an integrated input module of the present invention; Figure 3 This is a cross-sectional schematic diagram of the first embodiment of the integrated input module of the present invention; Figure 4 for Figure 3 A top view of the haptic feedback circuit board; Figure 5 This is a top view of an embodiment of the haptic feedback circuit board of the present invention; Figure 6 A cross-sectional schematic diagram of a second embodiment of the integrated input module of the present invention; Figure 7 for Figure 6 A top view of the haptic feedback circuit board; Figure 8 This is a cross-sectional schematic diagram of a third embodiment of the integrated input module of the present invention; and Figure 9 This is a cross-sectional schematic diagram of the fourth embodiment of the integrated input module of the present invention. Detailed Implementation
[0007] The embodiments of the present invention will be described below with reference to the accompanying drawings. Directional terms used in the following embodiments, such as up, down, left, right, front, and back, are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the invention. In these drawings, the same reference numerals denote the same or similar elements or method flows.
[0008] It must be understood that the use of terms such as "comprising" or "including" in this specification is intended to indicate the presence of specific technical features, values, method steps, work processes and / or components, but does not preclude the addition of more technical features, values, method steps, work processes, components, or any combination thereof.
[0009] It is important to understand that when a component is described as "connected" or "coupled" to another component, it can be a direct connection or coupling to another component, and intermediate components may be present. Conversely, when a component is described as "directly connected" or "directly coupled" to another component, there are no intermediate components. Additionally, the term "thickness" in this specification refers to the length in the vertical direction (i.e., direction Z) of the accompanying diagram.
[0010] Figure 1 An embodiment of the appearance of a computer host applying the integrated input module of the present application, Figure 2 An embodiment of the appearance of a notebook computer applying the integrated input module of the present application. As shown in Figures 1 to 2 , the integrated input module 100 can be applied to electronic devices (for example: Figure 1 a computer host 10 and Figure 2 a notebook computer 20, and this is not limited herein), wherein the integrated input module 100 and the electronic device can be electrically connected to each other through a bus or a wire, and the processor (not drawn) of the integrated input module 100 and the electronic device can communicate with each other through the bus or the wire.
[0011] Figure 3 A cross-sectional view of the first embodiment of the integrated input module of the present application, Figure 4 A top view of the haptic feedback circuit board of Figure 3 . As shown in Figure 3 and Figure 4 , the integrated input module 100 includes a display layer 110, a touch layer 120, a writing layer 130, and a haptic feedback layer 140, wherein the display layer 110 includes a light-emitting side 110a (i.e., a display side) and a back light side 110b corresponding to each other; the touch layer 120 is arranged on the light-emitting side 110a of the display layer 110, and the touch layer 120 generates a touch signal according to the touch operation of a user on the touch layer 120; the writing layer 130 is arranged between the light-emitting side 110a of the display layer 110 and the touch layer 120, and the writing layer 130 generates a writing signal according to the writing operation of a user on the writing layer 130; and the haptic feedback layer 140 is arranged on the back light side 110b of the display layer 110, and the haptic feedback layer 140 generates corresponding vibration feedback according to the touch signal or the writing signal. By stacking the display layer 110, the touch layer 120, the writing layer 130, and the haptic feedback layer 140, the functions of haptic feedback, writing, display, and touch are integrated, so that a user can perform operations of multiple functions in the action area 11 (as shown in Figure 1 ).
[0012] In an embodiment, the touch layer 120 and the writing layer 130 are light-transmitting structures, so that the touch layer 120 and the writing layer 130 do not affect the image display of the display layer 110; the touch layer 120 and the writing layer 130 can be made of transparent conductive materials. The writing layer 130 can detect the user's writing operation with the active pen 12 (as shown in Figure 1The writing operation is performed by the mobile trajectory shown in the figure to generate a corresponding writing signal, so the writing signal can comply with at least one of Microsoft Pen Protocol (MPP), Universal Stylus Initiative (USI) protocol, and Huawei Pen Protocol (HPP). The display layer 110 can include at least one of a Liquid-Crystal Display (LCD), an organic light emitting diode (OLED) display, and an e-paper display (EPD). The thickness of the display layer 110 can be greater than or equal to 1.22 mm, but is not limited thereto. In order to avoid the thickness of the integrated input module 100 being too large and to avoid the vibration feedback of the tactile feedback layer 140 being not obvious, the thickness of the display layer 110 needs to be less than or equal to 1.5 mm. In other words, the thickness of the display layer 110 can be greater than or equal to 1.22 mm and less than or equal to 1.5 mm.
[0013] In an embodiment, when the writing layer 130 is arranged between the display layer 110 and the touch layer 120, the touch layer 120 and the writing layer 130 can be integrated into one. Specifically, the touch layer 120 and the writing layer 130 can be integrated into an integrated input layer 50.
[0014] In another embodiment, the integrated input module 100 further includes a protective layer 150, a cover 160, a support 170, and a buffer 180. The protective layer 150 is arranged on the touch layer 120 to cover the touch layer 120. The support 170 is combined with the cover 160 to form a containing space S1. The support 170 can be provided with at least one opening 170a. The cover 160 has an opening 160a, and the at least one opening 170a of the support 170 and the opening 160a of the cover 160 communicate with the containing space S1. Specifically, when the integrated input module 100 is applied to an electronic device (for example, a computer host 10), the display layer 110, the touch layer 120, the protective layer 150, the writing layer 130, and the tactile feedback layer 140 are arranged in the containing space S1. The surface 150a of the protective layer 150 (i.e., the surface of the protective layer 150 away from the touch layer 120) is exposed to the opening 160a of the cover 160. The buffer 180 is arranged on the tactile feedback layer 140 and can contact or not contact the support 170 to buffer the vibration feedback of the tactile feedback layer 140 through the buffer 180. Figure 1
[0015] In an embodiment, the support body 170 can be a metal piece, and the support body 170 can be combined with the cover body 160 by means of screw locking, tenon locking, glue bonding, ultrasonic welding, or the like. The material of the buffer member 180 can include rubber, silicone, foam, or a combination thereof. The buffer member 180 can act as a shock absorber, and effectively prevent the elements (e.g., the tactile feedback layer 140) disposed in the accommodation space S1 from colliding with the support body 170, thereby achieving the effect of noise reduction. In addition, the size, shape, thickness, number, and arrangement position of the buffer member 180 can be adjusted and designed according to actual needs (e.g., the vibration size of the tactile feedback layer 140 or the heat dissipation requirement). Furthermore, the size, shape, number, and arrangement position of at least one opening 170a of the support body 170 can be adjusted and designed according to actual needs (e.g., the heat dissipation requirement of the display layer 110 and the tactile feedback layer 140 or the connection requirement of the elements disposed in the accommodation space S1 and the elements disposed outside the accommodation space S1). In an embodiment, the protective layer 150 and the cover body 160 can be integrally formed (i.e., the protective layer 150 and the cover body 160 are combined into a single structure), and the material of the protective layer 150 and the cover body 160 can include, but is not limited to, glass, plastic, or a combination thereof. The thickness of the protective layer 150 can be, but is not limited to, 1.1 millimeters.
[0016] In an embodiment, the tactile feedback layer 140 can have a corresponding first surface 140a and a second surface 140b. The tactile feedback layer 140 can include a tactile feedback circuit board 141 and at least one vibrator 142. The display layer 110 is attached to the first surface 140a of the tactile feedback layer 140. The at least one vibrator 142 is disposed on the second surface 140b of the tactile feedback layer 140. The at least one vibrator 142 generates corresponding vibration feedback according to touch signals or writing signals.
[0017] In an embodiment, the number and arrangement position of the vibrator 142 can be adjusted according to actual needs. For example, as shown in FIG. 1A, when the number of the vibrator 142 is one, the vibrator 142 can be disposed at the center position of the tactile feedback circuit board 141, so that the vibration generated by the vibrator 142 can be transmitted to each position of the action area 11 (as shown in FIG. 1A). Figure 4 For example, as shown in FIG. 1B, when the number of the vibrator 142 is multiple, the vibrators 142 can be dispersedly arranged on the second surface 140b of the tactile feedback layer 140 (e.g., four vibrators 142 are dispersedly arranged at four corners of the second surface 140b), so as to vibrate the user action area 11 (as shown in FIG. 1B). Figure 1 Figure 5 Figure 1 When a touch or writing operation is performed (as shown), vibration feedback is generated simultaneously. In order to ensure that the vibration magnitude transmitted to each position of the motion area 11 is the same, the haptic feedback layer 140 may also include a metal guide plate 143 disposed at the center of the second surface 140b of the haptic feedback layer 140. The metal guide plate 143 is used to transmit the vibration generated by the vibrators 142 so that the user feels the same vibration magnitude when performing touch or writing operations at different positions of the motion area 11. The shape of the metal guide plate 143 may be, but is not limited to, rectangular, and the material of the metal guide plate 143 may be, but is not limited to, iron.
[0018] In one embodiment, such as Figure 3 As shown, the vibrator 142 may include a piezoelectric ceramic actuator, wherein the thickness of the piezoelectric ceramic actuator may be, but is not limited to, 0.5 mm. In another embodiment, Figure 6 This is a cross-sectional schematic diagram of a second embodiment of the integrated input module of the present invention. Figure 7 for Figure 6 A top view of the haptic feedback circuit board. Figure 6 and Figure 7 Implementation examples and Figure 3 and 4 The embodiments are largely the same, so the similarities will not be repeated. For example... Figure 6 and Figure 7 As shown, the vibrator 142 may include a linear resonant actuator, wherein the thickness of the linear resonant actuator may be, but is not limited to, 2.11 mm. Due to the relatively thick thickness of the linear resonant actuator, one end of the linear resonant actuator may protrude from the opening 170a of the support 170. In other words, the vibrator 142 may include at least one of a piezoelectric ceramic actuator and a linear resonant actuator.
[0019] In one embodiment, the material of the haptic feedback circuit board 141 may be, but is not limited to, FR-4, ceramic substrate or Teflon board; the first surface 140a of the haptic feedback layer 140 may be attached to the display layer 110 by an adhesive layer 40, wherein the adhesive layer 40 may be a base adhesive and the thickness of the adhesive layer 40 may be, but is not limited to, 0.05 mm.
[0020] In one embodiment, the integrated input module 100 may further include: a first adhesive layer 61 and a second adhesive layer 62; the first adhesive layer 61 is disposed between the protective layer 150 and the integrated input layer 50, connecting the protective layer 150 and the integrated input layer 50; the second adhesive layer 62 is disposed between the integrated input layer 50 and the display layer 110, connecting the integrated input layer 50 and the display layer 110. The first adhesive layer 61 and the second adhesive layer 62 are light-transmitting adhesive layers, ensuring that they do not affect the image display of the display layer 110; the material of the first adhesive layer 61 and the second adhesive layer 62 may include at least one of acrylic resin, silicone resin, polyurethane resin, and epoxy resin; the thickness of the first adhesive layer 61 may be, but is not limited to, 0.075 mm; the thickness of the second adhesive layer 62 may be, but is not limited to, 0.15 mm.
[0021] In one embodiment, such as Figure 3 As shown, the integrated input module 100 may further include: a first electronic component 81 and a second electronic component 82. The first electronic component 81 is disposed on the second surface 140b of the haptic feedback layer 140 and electrically connected to the display layer 110 to control the display layer 110; the second electronic component 82 is disposed on the second surface 140b of the haptic feedback layer 140 and electrically connected to the integrated input layer 50 to control the integrated input layer 50. The first electronic component 81 and the second electronic component 82 may be, but are not limited to, integrated circuits (ICs), and the thickness of the first electronic component 81 may be, but is not limited to, 1.2 mm, and the thickness of the second electronic component 82 may be, but is not limited to, 0.8 mm.
[0022] In addition, the integrated input module 100 can further include a first connector 91, a second connector 92, a first signal transmission element 31, and a second signal transmission element 32. The display layer 110 can include a display connector 112. The first signal transmission element 31 can be, but is not limited to, a flexible flat cable (FFC). The second signal transmission element 32 can be, but is not limited to, a flexible printed circuit (FPC). The first connector 91 and the second connector 92 are disposed on the second surface 140b of the tactile feedback layer 140 and are electrically connected to the tactile feedback circuit board 141, so as to electrically connect the first electronic element 81 and the second electronic element 82 through the tactile feedback circuit board 141. The first connector 91 and the display connector 112 can be, but are not limited to, FFC connectors. The second connector 92 can be, but is not limited to, an FPC connector. The first electronic element 81 is electrically connected to the display layer 110 through the first connector 91, the first signal transmission element 31, and the display connector 112. The second electronic element 82 is electrically connected to the integrated input layer 50 through the second connector 92 and the second signal transmission element 32. The thicknesses of the first connector 91, the second connector 92, and the display connector 112 can be, but are not limited to, 1.1 millimeters.
[0023] In an embodiment, the thickness of the integrated input module 100 is greater than or equal to 3.5 millimeters and less than or equal to 4 millimeters, so as to realize miniaturization of the integrated input module 100.
[0024] In Figure 3 In the integrated input module 100, the thicknesses of the elements are in a relationship as follows: the thickness of the display layer 110 can be greater than the thickness of the first electronic element 81. The thickness of the first electronic element 81 can be greater than the thickness of the protection layer 150. The thickness of the protection layer 150 can be equal to the thicknesses of the first connector 91 and the second connector 92. The thickness of the protection layer 150 can be greater than the thickness of the second electronic element 82. The thickness of the second electronic element 82 can be greater than the thickness of the support body 170. The thickness of the support body 170 can be greater than the thickness of the buffer 180. The thickness of the buffer 180 can be greater than the thickness of the tactile feedback layer 140. The thickness of the tactile feedback layer 140 can be greater than the thickness of the second adhesive layer 62. The thickness of the second adhesive layer 62 can be greater than the thickness of the first adhesive layer 61. The thickness of the first adhesive layer 61 can be greater than the thickness of the integrated input layer 50. The thickness of the integrated input layer 50 can be greater than the thickness of the adhesive layer 40. The thickness of the support body 170 can be, but is not limited to, 0.7 millimeters. It should be noted that Figure 3 The thicknesses of the elements in the diagram are not drawn according to actual proportions.
[0025] In Figure 6In the integrated input module 100, the thickness relationships of the components are as follows: the thickness of the linear resonant actuator 142 (acting as the vibrator) can be greater than the thickness of the display layer 110; the thickness of the display layer 110 can be greater than the thickness of the first electronic component 81; the thickness of the first electronic component 81 can be greater than the thickness of the protective layer 150; the thickness of the protective layer 150 can be equal to the thickness of the first connector 91 and the thickness of the second connector 92; the thickness of the protective layer 150 can be greater than the thickness of the second electronic component 82; the thickness of the second electronic component 82 can be greater than the thickness of the support body 170; the thickness of the support body 170 can be greater than the thickness of the haptic feedback circuit board 141; the thickness of the haptic feedback circuit board 141 can be greater than the thickness of the second adhesive layer 62; the thickness of the second adhesive layer 62 can be greater than the thickness of the first adhesive layer 61; the thickness of the first adhesive layer 61 can be greater than the thickness of the integrated input layer 50; and the thickness of the integrated input layer 50 can be greater than the thickness of the adhesive layer 40. The thickness of the support body 170 can be, but is not limited to, 0.5 mm. It should be noted that... Figure 6 The thickness of each component in the drawing is not drawn according to the actual scale.
[0026] Figure 8 This is a cross-sectional schematic diagram of a third embodiment of the integrated input module of the present invention. Figure 8 As shown, the integrated input module 200 includes: a display layer 210, a touch layer 220, a writing layer 230, and a haptic feedback layer 240. The display layer 210 includes a light-emitting side 210a (i.e., the display side) and a backlight side 210b. The touch layer 220 is disposed on the light-emitting side 210a of the display layer 210, and generates touch signals based on user touch operations on the touch layer 220. The writing layer 230 is disposed between the backlight side 210b of the display layer 210 and the haptic feedback layer 240, and generates writing signals based on user writing operations on the writing layer 230. The haptic feedback layer 240 generates corresponding vibration feedback based on the touch signal or writing signal. By superimposing the display layer 210, touch layer 220, writing layer 230, and haptic feedback layer 240, haptic feedback, writing, display, and touch functions are integrated, allowing the user to interact with the input in the action area 21 (e.g., ...). Figure 2 (As shown) Performs multiple functions.
[0027] In one embodiment, the touch layer 220 is a light-transmitting structure, so that the touch layer 220 does not affect the image display of the display layer 210; the touch layer 220 may be made of a transparent conductive material. The writing layer 230 can detect the user's use of a passive pen 22 (e.g., ...). Figure 2The writing operation of the electromagnetic pen or the iron pen generates a corresponding writing signal. The display layer 210 can include at least one of a liquid crystal display (LCD), an organic light emitting diode (OLED) display, and an e-paper display (EPD), and the thickness of the display layer 210 can be greater than or equal to 1.22 mm, but is not limited thereto. In order to avoid the thickness of the integrated input module 200 being too large, the vibration feedback of the tactile feedback layer 240 being not obvious, and the touch layer 220 and the writing layer 230 interfering with each other during operation, the thickness of the display layer 210 needs to be less than or equal to 1.5 mm. In other words, the thickness of the display layer 210 can be greater than or equal to 1.22 mm and less than or equal to 1.5 mm.
[0028] In an embodiment, the writing layer 230 can include an electro magnetic resonance (EMR) circuit board 231 and a magnetic conductive plate 232. The EMR circuit board 231 can be attached to the back light side 210b of the display layer 210, and the magnetic conductive plate 232 can be arranged between the EMR circuit board 231 and the tactile feedback layer 240 to make the magnetic distribution of the writing layer 230 uniform. The thickness of the EMR circuit board 231 can be, but is not limited to, 0.2 mm, and the material of the EMR circuit board 231 can include, but is not limited to, polyimide (PI). The thickness of the magnetic conductive plate 232 can be, but is not limited to, 0.3 mm, and the material of the magnetic conductive plate 232 can be, but is not limited to, a silicon alloy steel such as a silicon steel sheet. In addition, the EMR circuit board 231 can be attached to the back light side 210b of the display layer 210 through an adhesive layer 42, and the thickness of the adhesive layer 42 can be, but is not limited to, 0.05 mm.
[0029] In an embodiment, the integrated input module 200 further includes a protective layer 250, a cover 260, a support 270, and a buffer 280. The protective layer 250 is arranged on the touch layer 220 to cover the touch layer 220. The support 270 is combined with the cover 260 to form a containing space S2. The support 270 can be provided with at least one opening 270a, the cover 260 has an opening 260a, and the at least one opening 270a of the support 270 and the opening 260a of the cover 260 communicate with the containing space S2. Specifically, when the integrated input module 200 is applied to an electronic device (for example: Figure 2When the laptop computer 20 is used, the display layer 210, touch layer 220, protective layer 250, writing layer 230 and haptic feedback layer 240 are disposed in the accommodating space S2, and the surface 250a of the protective layer 250 is exposed in the opening 260a of the cover 260; the buffer 280 is disposed on the haptic feedback layer 240 and may or may not contact the support 270, so as to buffer the vibration feedback of the haptic feedback layer 240 through the buffer 280.
[0030] In one embodiment, the support 270 may be a metal component, and the connection between the support 270 and the cover 260 may include screw fastening, latch fastening, adhesive bonding, or ultrasonic welding. The buffer 280 may be made of rubber, silicone, foam, or a combination thereof. The buffer 280 can act as a shock absorber and effectively prevent components (e.g., the haptic feedback layer 240) located within the accommodating space S2 from impacting the support 270, thereby achieving noise reduction. Furthermore, the size, shape, thickness, quantity, and location of the buffer 280 can be adjusted and designed according to actual needs (e.g., the vibration magnitude or heat dissipation requirements of the haptic feedback layer 240). Moreover, the size, shape, quantity, and location of at least one opening 270a of the support 270 can be adjusted and designed according to actual needs (e.g., the heat dissipation requirements of the display layer 210 and the haptic feedback layer 240, or the connection requirements between components located within the accommodating space S2 and components located outside the accommodating space S2). In one embodiment, the protective layer 250 and the cover 260 may be integrally formed (i.e., the protective layer 250 and the cover 260 are combined into a single structure), and the materials of the protective layer 250 and the cover 260 may include, but are not limited to, glass, plastic or a combination thereof, and the thickness of the protective layer 250 may be, but is not limited to, 1.1 mm.
[0031] In one embodiment, the haptic feedback layer 240 may have corresponding first surface 240a and second surface 240b. The haptic feedback layer 240 may include a haptic feedback circuit board 241 and at least one vibrator 242. The writing layer 230 is attached to the first surface 240a of the haptic feedback layer 240, and at least one vibrator 242 is disposed on the second surface 240b of the haptic feedback layer 240. The at least one vibrator 242 generates corresponding vibration feedback according to the touch signal or the writing signal.
[0032] In one embodiment, the number and placement of the vibrators 242 can be adjusted according to actual needs. For example, the number and placement of the vibrators 242 can be adjusted according to... Figure 4 or Figure 5 The vibrator 142 is the same as or similar to that of the vibrator 142, and will not be described in detail here.
[0033] In one embodiment, such as Figure 8As shown, the vibrator 242 may include a piezoelectric ceramic actuator, wherein the thickness of the piezoelectric ceramic actuator may be, but is not limited to, 0.5 mm. In another embodiment, Figure 9 This is a cross-sectional schematic diagram of the fourth embodiment of the integrated input module of the present invention, and this embodiment is similar to... Figure 8 The embodiments are largely the same, so the similarities will not be repeated. For example... Figure 9 As shown, the vibrator 242 may include a linear resonant actuator, wherein the thickness of the linear resonant actuator may be, but is not limited to, 2.11 mm. Due to the relatively thick thickness of the linear resonant actuator, one end of the linear resonant actuator may protrude from the opening 270a of the support 270. In other words, the vibrator 242 may include at least one of a piezoelectric ceramic actuator and a linear resonant actuator.
[0034] In one embodiment, the material of the haptic feedback circuit board 241 may be, but is not limited to, FR-4, ceramic substrate or Teflon board; the first surface 240a of the haptic feedback layer 240 may be attached to the writing layer 230 by an adhesive layer 40, wherein the adhesive layer 40 may be a base adhesive and the thickness of the adhesive layer 40 may be, but is not limited to, 0.05 mm.
[0035] In one embodiment, the integrated input module 200 may further include: a third adhesive layer 63 and a fourth adhesive layer 64; the third adhesive layer 63 is disposed between the protective layer 250 and the touch layer 220, and the third adhesive layer 63 connects the protective layer 250 and the touch layer 220; the fourth adhesive layer 64 is disposed between the touch layer 220 and the display layer 210, and the fourth adhesive layer 64 connects the light-emitting side 210a of the touch layer 220 and the display layer 210. The third adhesive layer 63 and the fourth adhesive layer 64 are light-transmitting adhesive layers, so that the third adhesive layer 63 and the fourth adhesive layer 64 do not affect the image display of the display layer 210; the material of the third adhesive layer 63 and the fourth adhesive layer 64 may include at least one of acrylic resin, silicone resin, polyurethane resin, and epoxy resin; the thickness of the third adhesive layer 63 may be, but is not limited to, 0.075 mm; the thickness of the fourth adhesive layer 64 may be, but is not limited to, 0.15 mm.
[0036] In an embodiment, the integrated input module 200 can further comprise a third electronic element 83, a fourth electronic element 84 and a fifth electronic element 85. The third electronic element 83 is disposed on the second surface 240b of the tactile feedback layer 240 and electrically connected to the display layer 210 to control the display layer 210. The fourth electronic element 84 is disposed on the second surface 240b of the tactile feedback layer 240 and electrically connected to the touch control layer 220 to control the touch control layer 220. The fifth electronic element 85 is disposed on the second surface 240b of the tactile feedback layer 240 and electrically connected to the writing layer 230 to control the writing layer 230. The third electronic element 83, the fourth electronic element 84 and the fifth electronic element 85 can be, but are not limited to, integrated circuits (ICs). The thickness of the third electronic element 83 can be, but is not limited to, 1.2 mm. The thickness of the fourth electronic element 84 can be, but is not limited to, 0.8 mm. The thickness of the fifth electronic element 85 can be, but is not limited to, 1.2 mm.
[0037] In addition, the integrated input module 200 can further comprise a third connector 93, a fourth connector 94, a fifth connector 95, a third signal transmission element 33, a fourth signal transmission element 34 and a fifth signal transmission element 35. The display layer 210 can comprise a display connector 212. The third signal transmission element 33 can be, but is not limited to, a flexible flat cable (FFC). The fourth signal transmission element 34 and the fifth signal transmission element 35 can be, but are not limited to, flexible printed circuits (FPCs). The third connector 93, the fourth connector 94 and the fifth connector 95 are disposed on the second surface 240b of the tactile feedback layer 240 and electrically connected to the tactile feedback circuit board 241 to electrically connect the third electronic element 83, the fourth electronic element 84 and the fifth electronic element 85 through the tactile feedback circuit board 241. The third connector 93 and the display connector 212 can be, but are not limited to, FFC connectors. The fourth connector 94 and the fifth connector 95 can be, but are not limited to, FPC connectors. The third electronic element 83 is electrically connected to the display layer 210 through the third connector 93, the third signal transmission element 33 and the display connector 212. The fourth electronic element 84 is electrically connected to the touch control layer 220 through the fourth connector 94 and the fourth signal transmission element 34. The fifth electronic element 85 is electrically connected to the writing layer 230 through the fifth connector 95 and the fifth signal transmission element 35. The thickness of the third connector 93, the fourth connector 94, the fifth connector 95 and the display connector 212 can be, but is not limited to, 1.1 mm.
[0038] In an embodiment, the thickness of the integrated input module 200 is greater than or equal to 3.5 mm and less than or equal to 4 mm to realize the miniaturization of the integrated input module 200.
[0039] exist Figure 8 In the integrated input module 200, the thickness relationships of the components are as follows: the thickness of the display layer 210 can be greater than the thickness of the third electronic component 83; the thickness of the third electronic component 83 can be equal to the thickness of the fifth electronic component 85; the thickness of the fifth electronic component 85 can be greater than the thickness of the protective layer 250; the thickness of the protective layer 250 can be equal to the thickness of the third connector 93, the fourth connector 94, and the fifth connector 95; the thickness of the protective layer 250 can be greater than the thickness of the fourth electronic component 84; the thickness of the fourth electronic component 84 can be greater than the thickness of the support body 270; the support body 270... The thickness of the support 270 can be greater than the thickness of the buffer 280, the thickness of the buffer 280 can be greater than the thickness of the haptic feedback layer 240, the thickness of the haptic feedback layer 240 can be greater than the thickness of the magnetic conductive plate 232, the thickness of the magnetic conductive plate 232 can be greater than the thickness of the electromagnetic resonant circuit board 231, the thickness of the electromagnetic resonant circuit board 231 can be greater than the thickness of the touch layer 220, the thickness of the touch layer 220 can be greater than the thickness of the fourth adhesive layer 64, the thickness of the fourth adhesive layer 64 can be greater than the thickness of the third adhesive layer 63, and the thickness of the third adhesive layer 63 can be greater than the thickness of the adhesive layer 40 and the adhesive layer 42. The thickness of the support 270 can be, but is not limited to, 0.7 mm. It should be noted that... Figure 8 The thickness of each component in the drawing is not drawn according to the actual scale.
[0040] exist Figure 9 In the integrated input module 200, the thickness relationships of the components are as follows: the thickness of the linear resonant actuator 242, which serves as the vibrator, can be greater than the thickness of the display layer 210; the thickness of the display layer 210 can be greater than the thickness of the third electronic component 83; the thickness of the third electronic component 83 can be equal to the thickness of the fifth electronic component 85; the thickness of the third electronic component 83 can be greater than the thickness of the protective layer 250; the thickness of the protective layer 250 can be equal to the thickness of the third connector 93, the fourth connector 94, and the fifth connector 95; the thickness of the protective layer 250 can be greater than the thickness of the fourth electronic component 84; the thickness of the fourth electronic component 85 can be greater than the thickness of the fourth connector 93; the thickness of the fourth electronic component 94 can be greater than the thickness of the fifth electronic component 85 ... The thickness of sub-component 84 can be greater than the thickness of support 270, the thickness of support 270 can be greater than the thickness of haptic feedback circuit board 241, the thickness of haptic feedback circuit board 241 can be greater than the thickness of magnetic plate 232, the thickness of magnetic plate 232 can be greater than the thickness of electromagnetic resonance circuit board 231, the thickness of electromagnetic resonance circuit board 231 can be greater than the thickness of touch layer 220, the thickness of touch layer 220 can be greater than the thickness of fourth adhesive layer 64, the thickness of fourth adhesive layer 64 can be greater than the thickness of third adhesive layer 63, and the thickness of third adhesive layer 63 can be greater than the thickness of adhesive layer 40 and adhesive layer 42. The thickness of support 270 can be, but is not limited to, 0.5 mm. It should be noted that... Figure 9 The thickness of each component in the drawing is not drawn according to the actual scale.
[0041] In summary, the haptic feedback function, the writing function, the display function and the touch control function can be integrated by the design of the superimposed display layer, the touch control layer, the writing layer and the haptic feedback layer, so that the integrated input module can allow the user to perform the operation of multiple functions in a single action area, to meet the development trend of miniaturization and multifunction, to provide more diversified input methods in the limited operation space, and to provide the user with good operation experience. In addition, the integrated input module can support the operation of the active pen or the passive pen by sequentially stacking the touch control layer, the writing layer, the display layer and the haptic feedback layer from top to bottom or sequentially stacking the touch control layer, the display layer, the writing layer and the haptic feedback layer from top to bottom, and the execution of the functions between the layers will not affect each other.
[0042] Although the present application has been described with reference to the above embodiments, it is noted that these descriptions are not intended to limit the present application. On the contrary, the present application covers modifications and similar arrangements as would be apparent to one skilled in the art. It is therefore intended that the protection granted by letters patent extend to all such modifications and similar arrangements.
Claims
1. An integrated input module, characterized in that, include: The display layer includes a corresponding light-emitting side and a backlight side; A touch layer is disposed on the light-emitting side of the display layer, and the touch layer generates touch signals according to the user's touch operation on the touch layer; The writing layer generates writing signals based on the user's writing operations on the writing layer. as well as The haptic feedback layer generates corresponding vibration feedback based on the touch signal or the writing signal. The writing layer is disposed between the light-emitting side of the display layer and the touch layer, and the tactile feedback layer is disposed between the backlight side of the display layer, or the writing layer is disposed between the backlight side of the display layer and the tactile feedback layer.
2. The integrated input module according to claim 1, characterized in that, When the writing layer is disposed between the display layer and the touch layer, the touch layer and the writing layer are integrated into one unit.
3. The integrated input module according to claim 1, characterized in that, When the writing layer is disposed on the backlight side of the display layer, the writing layer includes an electromagnetic resonant circuit board and a magnetic plate. The electromagnetic resonant circuit board is attached to the backlight side of the display layer, and the magnetic plate is disposed between the electromagnetic resonant circuit board and the tactile feedback layer, so that the magnetism of the writing layer is uniformly distributed.
4. The integrated input module according to claim 1, characterized in that, The tactile feedback layer has corresponding first and second surfaces, and includes a tactile feedback circuit board and at least one vibrator. The backlight side of the display layer or the writing layer is attached to the first surface of the tactile feedback layer, while the at least one vibrator is disposed on the second surface of the tactile feedback layer and generates corresponding vibration feedback according to the touch signal or the writing signal.
5. The integrated input module according to claim 4, characterized in that, The at least one vibrator includes at least one of a piezoelectric ceramic actuator and a linear resonant actuator.
6. The integrated input module according to claim 4, characterized in that, When the writing layer is disposed between the display layer and the touch layer, and the writing layer and the touch layer are integrated into an integrated input layer, the integrated input module further includes: A first electronic component, disposed on the second surface of the haptic feedback layer and electrically connected to the display layer, for controlling the display layer; and A second electronic component is disposed on the second surface of the haptic feedback layer and electrically connected to the integrated input layer to control the integrated input layer.
7. The integrated input module according to claim 4, characterized in that, When the writing layer is disposed on the backlight side of the display layer, the integrated input module further includes: A third electronic component is disposed on the second surface of the tactile feedback layer and electrically connected to the display layer to control the display layer; A fourth electronic component, disposed on the second surface of the haptic feedback layer and electrically connected to the touch layer, for controlling the touch layer; and A fifth electronic component is disposed on the second surface of the tactile feedback layer and electrically connected to the writing layer to control the writing layer.
8. The integrated input module according to claim 1, characterized in that, Also includes: A protective layer is disposed on the touch layer to cover the touch layer; The lid has an opening; A support body, combined with the cover body to form an accommodating space, such that the display layer, the touch layer, the protective layer, the writing layer and the haptic feedback layer are disposed within the accommodating space, and the surface of the protective layer is exposed through the opening of the cover body; as well as A buffer is disposed on the tactile feedback layer and may or may not be in contact with the support body to buffer the vibration feedback generated by the tactile feedback layer.
9. The integrated input module according to claim 8, characterized in that, The protective layer and the cover are integrally formed.
10. The integrated input module according to claim 8, characterized in that, When the writing layer is disposed between the display layer and the touch layer, and the writing layer and the touch layer are integrated into an integrated input layer, the integrated input module further includes: A first adhesive layer is disposed between the protective layer and the integrated input layer, the first adhesive layer connecting the protective layer and the integrated input layer; and A second adhesive layer is disposed between the integrated input layer and the display layer, and the second adhesive layer connects the integrated input layer and the display layer.
11. The integrated input module according to claim 8, characterized in that, When the writing layer is disposed on the backlight side of the display layer, the integrated input module further includes: A third adhesive layer is disposed between the protective layer and the touch layer, the third adhesive layer connecting the protective layer and the touch layer; and A fourth adhesive layer is disposed between the touch layer and the display layer, and the fourth adhesive layer connects the touch layer and the display layer.