Chip assembly, camera module and electronic equipment

Abstract

The invention discloses a chip assembly, a camera module and electronic equipment, the chip assembly comprises a circuit board, the circuit board is provided with a first opening and a second opening, the first side of the circuit board is provided with a connecting part, and the connecting part and the second opening are oppositely arranged; the image sensor is arranged on the second side of the circuit board, the image sensor comprises a photosensitive area and a non-photosensitive area, the photosensitive area is arranged opposite to the first opening, at least one part of the non-photosensitive area is shielded by the bottom of the circuit board, and one part of the non-photosensitive area is arranged opposite to the second opening; the connecting line penetrates through the second opening, and the two ends of the connecting line are connected with the image sensor and the connecting part respectively.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a chip component, a camera module, and an electronic device. Background Technology

[0002] In related technologies, such as Figure 14 As shown, the camera module includes a circuit board 1', an image sensor 2', a base 5', and a lens 4' mounted on the base 5', wherein, as Figure 10 , Figure 11 , Figure 12 and Figure 13 As shown, the image sensor 2' is disposed on the side of the circuit board 1' facing the lens 4. The circuit board 1' has an electrical connection point 3'. The image sensor 2' is connected to the electrical connection point 3' on the circuit board 1' via a connecting wire 6', thus achieving encapsulation. Figure 15 As shown, the single-sided dimension chain of the camera module is: a1+a2+a3+a4+a5+a6+a7+a8+a9. It can be seen that the package size of the image sensor 2' in the related technology is relatively large, which leads to the excessive size of the camera module, resulting in extremely tight space when the electronic device is stacked; and finally affecting the appearance design of the electronic device. Summary of the Invention

[0003] This application aims to provide a chip component, camera module, and electronic device that solves the problem of excessively large package size of image sensors in related technologies.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows: In a first aspect, embodiments of this application propose a chip assembly, comprising: a circuit board having a first opening and a second opening, a connecting portion having a first side of the circuit board, the connecting portion being disposed opposite to the second opening; an image sensor disposed on a second side of the circuit board, the image sensor including a photosensitive area and a non-photosensitive area, the photosensitive area being disposed opposite to the first opening, at least a portion of the non-photosensitive area being blocked by the bottom of the circuit board, and a portion of the non-photosensitive area being disposed opposite to the second opening; and a connecting wire passing through the second opening, the two ends of the connecting wire being respectively connected to the image sensor and the connecting portion.

[0005] Secondly, embodiments of this application provide a camera module, including a chip component as described in any of the first aspects.

[0006] Thirdly, embodiments of this application provide an electronic device, including: a chip component as described in any of the first aspects or a camera module as described in the second aspect.

[0007] In embodiments of this application, the chip assembly includes a circuit board, an image sensor, and connecting lines. The circuit board has a first opening and a second opening. The image sensor is disposed on the second side of the circuit board, and the photosensitive area of ​​the image sensor is opposite to the first opening, allowing light to enter the photosensitive area of ​​the image sensor through the first opening to ensure image quality. Simultaneously, at least a portion of the non-photosensitive area of ​​the image sensor is blocked on the second side of the circuit board, thus fully utilizing the space occupied by the non-photosensitive area of ​​the image sensor, shortening the size of the circuit board, and reducing the overall volume of the chip assembly. The first side of the circuit board has a connecting portion, and a portion of the non-photosensitive area of ​​the image sensor is opposite to the second opening. The connecting lines can then connect the image sensor and the connecting portion through the second opening, achieving electrical connection between the image sensor and the circuit board without occupying additional horizontal space, thereby shortening the package size of the chip assembly and facilitating the layout of other components within the electronic device.

[0008] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0009] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is one of the schematic diagrams of a circuit board according to an embodiment of this application; Figure 2 This is a second schematic diagram of the circuit board structure according to an embodiment of this application; Figure 3 This is a third schematic diagram of the circuit board structure according to an embodiment of this application; Figure 4 This is one of the structural schematic diagrams of a chip assembly according to an embodiment of this application; Figure 5 This is a second schematic diagram of the structure of a chip assembly according to an embodiment of this application; Figure 6 This is the third schematic diagram of the chip assembly according to an embodiment of this application; Figure 7 This is the fourth schematic diagram of the chip assembly according to an embodiment of this application; Figure 8 This is one of the structural schematic diagrams of a camera module according to an embodiment of this application; Figure 9 This is a second schematic diagram of the structure of a camera module according to an embodiment of this application.

[0010] Figure label: 1. Circuit board; 10. First opening; 12. Second opening; 13. Connecting part; 14. First connecting part; 140. Analog signal connecting part; 16. Second connecting part; 160. Digital signal connecting part; 18. Groove; 2. Image sensor; 20. Photosensitive area; 22. Non-photosensitive area; 3. Connecting line; 30. First connecting line; 32. Second connecting line; 4. Lens; 5. Electronic component; 50. First electronic component; 52. Second electronic component; 6. Support plate; 7. Base.

[0011] Figure 10 This is one of the schematic diagrams of a circuit board in related technologies; Figure 11 This is the second schematic diagram of a circuit board structure in related technologies; Figure 12 This is the third schematic diagram of a circuit board structure in related technologies; Figure 13 This is one of the structural schematic diagrams of a camera module in related technologies; Figure 14 This is the second structural schematic diagram of a camera module in related technologies; Figure 15 This is the third structural schematic diagram of a camera module in related technologies.

[0012] Figure label: 1' Circuit board, 2' Image sensor, 3' Electrical connection point, 4' Lens, 5' Base, 6' Connecting wire, 7' Electronic components. Detailed Implementation

[0013] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0014] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "a plurality of" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects.

[0015] In the description of this application, it should be understood that the terms "length", "width", "thickness", "upper", "lower", "horizontal", "top", "bottom", "inner", "outer", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0016] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0017] The following is combined Figures 1-9 This application describes a chip assembly, a camera module, and an electronic device according to embodiments thereof.

[0018] like Figures 1 to 6 As shown, a chip assembly according to some embodiments of this application includes: a circuit board 1, which has a first opening 10 and a second opening 12, and a connecting portion 13 on a first side of the circuit board 1, the connecting portion 13 being disposed opposite to the second opening 12; an image sensor 2, disposed on a second side of the circuit board 1, the image sensor 2 including a photosensitive area 20 and a non-photosensitive area 22, the photosensitive area 20 being disposed opposite to the first opening 10, at least a portion of the non-photosensitive area 22 being blocked by the bottom of the circuit board 1, and a portion of the non-photosensitive area 22 being disposed opposite to the second opening 12; and a connecting line 3, passing through the second opening 12, the two ends of the connecting line 3 being connected to the image sensor 2 and the connecting portion 13, respectively.

[0019] In the embodiments of this application, the chip assembly includes a circuit board 1, an image sensor 2, and a connecting line 3. The circuit board 1 has a first opening 10 and a second opening 12. The image sensor 2 is disposed on the second side of the circuit board 1, and the photosensitive area 20 of the image sensor 2 is opposite to the first opening 10, so that light can enter the photosensitive area 20 of the image sensor 2 through the first opening 10 to ensure image quality. At the same time, at least a portion of the non-photosensitive area 22 of the image sensor 2 is blocked on the second side of the circuit board 1, thereby making full use of the space where the non-photosensitive area 22 of the image sensor 2 is located, shortening the size of the circuit board 1, and helping to reduce the overall volume of the chip assembly. The first side of the circuit board 1 has a connecting part 13, and a portion of the non-photosensitive area 22 of the image sensor 2 is opposite to the second opening 12. Thus, the connecting line 3 can connect the image sensor 2 and the connecting part 13 through the second opening 12 to realize the electrical connection between the image sensor 2 and the circuit board 1 without occupying additional horizontal space, thereby shortening the package size of the chip assembly and facilitating the layout of other components in the electronic device.

[0020] It is understood that the connection part 13 and the second opening 12 can be arranged opposite each other. The connection part 13 can be arranged on one side of the second opening 12, for example, the connection part 13 can be arranged on the side of the second opening 12 closer to the first opening 10, or the connection part 13 can be arranged on the side of the second opening 12 away from the first opening 10. The connection part 13 and the second opening 12 can also be arranged opposite each other. For example, the connection part 13 can be arranged on the side of the second opening 12 closer to the first opening 10, and on the side of the second opening 12 away from the first opening 10.

[0021] According to some embodiments of this application, optionally, the connecting portion 13 includes a first connecting portion 14 and a second connecting portion 16, the first connecting portion 14 and the second connecting portion 16 being located on opposite sides of the second opening 12; the connecting line 3 includes a first connecting line 30 and a second connecting line 32, both the first connecting line 30 and the second connecting line 32 passing through the second opening 12, the two ends of the first connecting line 30 being connected to the image sensor 2 and the first connecting portion 14 respectively, and the two ends of the second connecting line 32 being connected to the image sensor 2 and the second connecting portion 16 respectively.

[0022] In this embodiment, the first connecting part 14 and the second connecting part 16 are disposed on opposite sides of the second opening 12. The first connecting line 30 and the second connecting line 32 both pass through the second opening 12, and the first connecting line 30 and the second connecting line 32 are respectively connected to the first connecting part 14 and the second connecting part 16 on both sides of the second opening 12. Thus, when there are many electrical connection points, the first connecting line 30 and the second connecting line 32 do not need to overlap, reducing the density of the connecting lines and shortening the length of the first connecting line 30 and the second connecting line 32, thereby avoiding the problem of short circuit caused by the collapse of the first connecting line 30 and the second connecting line 32.

[0023] It is understandable that when the number of electrical connection points is small, the connection part 13 can be provided only on the side of the second opening 12 closest to the first opening 10, or on the side of the second opening 12 furthest from the first opening 10. For example... Figure 6 As shown, according to some embodiments of this application, optionally, one of the first connecting portion 14 and the second connecting portion 16 is an analog signal connecting portion 140 and the other is a digital signal connecting portion 160; or both the first connecting portion 14 and the second connecting portion 16 include an analog signal connecting portion 140 and a digital signal connecting portion 160.

[0024] In this embodiment, one of the first connecting portion 14 and the second connecting portion 16 is an analog signal connecting portion 140, and the other is a digital signal connecting portion 160. Thus, one of the first connecting line 30 and the second connecting line 32 is used to connect the analog signal connecting portion 140, and the other is used to connect the digital signal connecting portion 160. This allows the analog signal connecting portion 140 and the digital signal connecting portion 160 to be arranged separately, avoiding crosstalk between analog and digital signals, thereby improving the imaging quality of the chip assembly. Of course, both the first connecting portion 14 and the second connecting portion 16 can also include both the analog signal connecting portion 140 and the digital signal connecting portion 160; that is, the first connecting portion 14 includes both analog signal connecting portion 140 and the digital signal connecting portion 160, and the second connecting portion 16 also includes both analog signal connecting portion 140 and the digital signal connecting portion 160, to facilitate layout for different electrical requirements.

[0025] It is understandable that when one of the first connecting part 14 and the second connecting part 16 is an analog signal connecting part 140 and the other is a digital signal connecting part 160, the first connecting part 14 is an analog signal connecting part 140 and the second connecting part 16 is a digital signal connecting part 160, or the second connecting part 16 is an analog signal connecting part 140 and the first connecting part 14 is a digital signal connecting part 160.

[0026] like Figure 6 As shown, according to some embodiments of this application, optionally, the first connection part 14 is an analog signal connection part 140, and the second connection part 16 is a digital signal connection part 160.

[0027] In this embodiment, since the number of analog signals that the image sensor 2 needs to connect to is far less than the number of digital signals that it needs to connect to, the number of analog signal connection parts 140 is less than the number of digital signal connection parts 160. Therefore, the analog signal connection parts 140 are arranged on the side of the second opening 12 closer to the first opening 10, and the digital signal connection parts 160 are arranged on the side of the second opening 12 away from the first opening 10, so as to meet the wiring area requirements of the analog signal connection parts 140 and the digital signal connection parts 160.

[0028] like Figure 4 , Figure 5 , Figure 8 and Figure 9 As shown, according to some embodiments of this application, optionally, the chip assembly further includes: an electronic component 5 disposed on the circuit board 1 and disposed opposite to the non-photosensitive area 22, wherein the first connecting portion 14 and the second connecting portion 16 are both connected to the electronic component 5.

[0029] In this embodiment, the chip assembly further includes an electronic component 5, which is disposed on the circuit board 1 and connected to the first connection portion 14 and the second connection portion 16. The electronic component 5 is positioned opposite the non-photosensitive area 22, fully utilizing the non-photosensitive area 22 of the image sensor 2, reducing the size of the circuit board 1, and consequently reducing the overall size of the chip assembly.

[0030] like Figure 8 As shown, according to some embodiments of this application, the electronic component 5 may optionally include: a first electronic component 50, disposed on the circuit board 1, located between the first opening 10 and the second opening 12, the first electronic component 50 being connected to the first connecting portion 14; and a second electronic component 52, disposed on the circuit board 1, located on the side of the second opening 12 opposite to the first opening 10, the second electronic component 52 being connected to the second connecting portion 16.

[0031] In this embodiment, the electronic component 5 further includes a first electronic component 50 and a second electronic component 52. The first electronic component 50 is disposed between the first opening 10 and the second opening 12, that is, the first electronic component 50 is located on the side of the second opening 12 closer to the first opening 10, so that the first electronic component 50 is close to the corresponding first connecting portion 14. Correspondingly, the second electronic component 52 is disposed on the side of the second opening 12 away from the first opening 10, so that the second electronic component 52 is close to the corresponding second connecting portion 16, so as to meet the design requirements of electronic performance.

[0032] Optionally, the first electronic component 50 is an analog signal component, and the second electronic component 52 is a digital signal component.

[0033] According to some embodiments of this application, optionally, such as Figure 1As shown, the second opening 12 is disposed around the first opening 10 and spaced apart from the first opening 10, the first connecting part 14 is disposed on the side of the second opening 12 close to the first opening 10, and the second connecting part 16 is disposed on the side of the second opening 12 away from the first opening 10.

[0034] In this embodiment, the second opening 12 is disposed around and spaced apart from the first opening 10 to facilitate the arrangement of a connecting portion between the first opening 10 and the second opening 12. The first connecting portion 14 is disposed on the side of the second opening 12 closer to the first opening 10, and the second connecting portion 16 is disposed on the side of the second opening 12 away from the first opening 10. This arrangement ensures that the first connecting line 30 and the second connecting line 32 do not need to overlap, thus preventing short circuits in case the connecting lines collapse. Furthermore, the second opening 12 is disposed around the first opening 10, placing the first opening 10 in the middle region of the circuit board 1, allowing light to enter the image sensor 2 through the first opening 10.

[0035] In addition, since the first connecting part 14 is located on the side of the second opening 12 close to the first opening 10, and the second connecting part 16 is located on the side of the second opening 12 away from the first opening 10, compared with the related technology, the embodiment proposed in this application moves a portion of the electrical connecting part to the part corresponding to the non-photosensitive area 22 of the image sensor 2, that is, moves a portion of the electrical connecting part into the interior of the circuit board 1, thereby reducing the size of the circuit board 1 and further reducing the size of the chip assembly.

[0036] According to some embodiments of this application, optionally, the number of second openings 12 is one or more.

[0037] In this embodiment, the number of second openings 12 can be one or more to meet different electrical connection requirements.

[0038] like Figure 1 and Figure 4 As shown, according to some embodiments of this application, optionally, when there are multiple second openings 12, at least two second openings 12 are provided on both sides of the first opening 10 along the first direction and extend along the second direction, and at least one second opening 12 is provided on one side of the first opening 10 along the second direction and extends along the first direction; the first direction intersects the second direction.

[0039] In this embodiment, there are multiple second openings 12, wherein at least two second openings 12 are disposed on both sides of the first opening 10 along the first direction and extend along the second direction, and at least one second opening 12 is disposed on one side of the first opening 10 along the second direction and extends along the first direction, so that the second openings 12 are arranged in a strip shape and do not occupy more space on the circuit board 1.

[0040] Optionally, the first direction and the second direction are perpendicular.

[0041] like Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, according to some embodiments of this application, optionally, a groove 18 is provided on the second side of the circuit board 1, the groove 18 is recessed from the second side to the first side, the first opening 10 and the second opening 12 are provided on the bottom wall of the groove 18, and the image sensor 2 is at least partially provided in the groove 18.

[0042] In this embodiment, a groove 18 recessed from the second side to the first side is provided on the second side of the circuit board 1. A first opening 10 and a second opening 12 are provided on the bottom wall of the groove 18 to allow light to enter and for the image sensor 2 to be electrically connected to the circuit board 1. The image sensor 2 is at least partially disposed within the groove 18, reducing the overall thickness of the chip assembly. Furthermore, the chip assembly proposed in this application, through the arrangement of the groove 18, allows for different thicknesses at different locations on the circuit board 1, reducing the size of the circuit board 1 while also meeting the requirements of electrical wiring.

[0043] like Figure 5 , Figure 6 and Figure 9 As shown, according to some embodiments of this application, optionally, the chip assembly further includes: a support plate 6, disposed on the second side of the circuit board 1, and both the circuit board 1 and the image sensor 2 are connected to the support plate 6.

[0044] In this embodiment, the chip assembly also includes a support plate 6, which is disposed on the second side of the circuit board 1 to support the circuit board 1 and the image sensor 2, thereby improving the strength and flatness of the circuit board 1 and the image sensor 2.

[0045] According to some embodiments of this application, optionally, both the circuit board 1 and the image sensor 2 are bonded to the support plate 6; and / or the support plate 6 includes a metal plate.

[0046] In this embodiment, both the circuit board 1 and the image sensor 2 are bonded to the support plate 6, which improves the connection strength and packaging convenience between the circuit board 1 and the image sensor 2 and the support plate 6, and helps to reduce the height of the chip assembly. Optionally, the support plate 6 includes a metal plate. The metal plate can achieve greater support strength with a thinner size, and the metal plate has conductive properties, which helps to improve the grounding reliability of the chip assembly, thereby improving electrostatic protection performance and electromagnetic interference resistance performance.

[0047] Alternatively, the metal sheet may include a steel sheet.

[0048] like Figure 8 and Figure 9 As shown, according to some embodiments of this application, a camera module is also proposed, including: a chip component as proposed in any of the above claims.

[0049] like Figure 9 As shown, according to some embodiments of this application, optionally, the camera module further includes: a base 7, disposed on the first side of the circuit board 1, and the portion of the base 7 connected to the circuit board 1 is disposed opposite to the non-photosensitive area 22; and a lens 4, disposed on the base 7, and disposed opposite to the first opening 10.

[0050] In this embodiment, the camera module further includes a base 7 and a lens 4. The base 7 is disposed on the first side of the circuit board 1 and is used to support the lens 4. The lens 4 is disposed opposite to the first opening 10, so that light can enter the photosensitive area 20 of the image sensor 2 through the lens 4, ensuring the reliability of the imaging function. The base 7 is positioned on the circuit board 1 opposite to the non-photosensitive area 22 of the image sensor 2 to avoid the base 7 affecting the imaging. Furthermore, this arrangement allows the base 7 to move inward within the non-photosensitive area 22, which is beneficial for miniaturizing the size of the camera module.

[0051] Understandably, since the electronic component 5 can be placed directly above the non-photosensitive area 22 of the image sensor 2 and the overlapping area of ​​the circuit board 1, the base 7 can be placed directly and extremely close to the electronic component 5, thereby miniaturizing the size of the camera module.

[0052] According to some embodiments of this application, an electronic device is also proposed, comprising: a chip component as described in any of the preceding claims or a camera module as described in any of the preceding claims. Therefore, it possesses all the beneficial effects of the aforementioned chip component or camera module, which will not be elaborated further here.

[0053] According to some embodiments of this application, optionally, the camera module proposed in this application can achieve a miniaturized design of the camera module, meet the image hardware stacking requirements of smart terminals, and not affect the wiring area; at the same time, it improves the quality of the image output by the image sensor 2.

[0054] In this application, a double-sided single-layer gold wire (e.g., the first connecting wire 30 and the second connecting wire 32) electrical connection is used (that is, the first connecting wire 30 and the second connecting wire 32 are connected to the electrical connection parts on both sides of the second opening 12), which shortens the connection length of the gold wire and reduces the density of the gold wire, thereby improving the reliability of the electrical connection and avoiding the short circuit problem caused by the collapse of the gold wire.

[0055] Optionally, the circuit board 1 adopts a multi-window design, which can cover the image sensor 2, exposing only the photosensitive area 20 of the image sensor 2 to receive light, while the non-photosensitive area 22 is wired, so that the ineffective area can be effectively utilized.

[0056] Optionally, different areas of the circuit board 1 can be made of different thicknesses, so that while reducing the length and width of the circuit board 1, the design space of the circuit board 1 can meet the electrical wiring requirements.

[0057] The miniaturization and packaging process of the camera module is explained below: The camera module includes a circuit board 1, gold wires, electronic components 5, an image sensor 2, and a steel sheet (such as a support plate 6).

[0058] I. The assembly process is as follows: 1. First, attach the electronic component 5 to the upper surface of the circuit board 1 using a surface mount technology; 2. Apply a certain amount of adhesive to the surface of image sensor 2; 3. Cover the image sensor 2 with circuit board 1; 4. Apply conductive adhesive to the bottom of circuit board 1 and image sensor 2; 5. Attach the steel sheet to the bottom of circuit board 1 and image sensor 2; 6. Bake the above components to cure the adhesive; 7. The bottom of the circuit board 1 and the image sensor 2 are electrically connected by gold wire to complete the miniaturized packaging of the image sensor 2.

[0059] II. The miniaturization packaging dimension chain of image sensor 2 is described below: 1. When using packaging solutions from related technologies: like Figure 15 As shown, the first direction unilateral dimension chain is composed of: a1+a2+a3+a4+a5+a6+a7+a8+a9.

[0060] 2. When using the packaging scheme of the embodiments proposed in this application: like Figure 7 As shown, the first direction unilateral dimension chain is composed of: b1+b2+b3+b4+b5.

[0061] Where a9=b5, is the dimension from the center of the photosensitive area 20 of the image sensor 2 to the edge of the image sensor 2.

[0062] a8≥b4, where a8 is the process assembly required spacing from the electrical connection point 3' of circuit board 1' to the edge of image sensor 2', and b4 is the spacing from the electrical connection point (e.g., the second connection part 16) of circuit board 1 to the second opening 12. The two spacings are required to be the same in the process. The second opening 12 is located inside the edge of image sensor 2, close to the edge. Therefore, a8≥b4, which are basically equal.

[0063] a7=b3, where a7 and b3 are both electrical connection solder points designed on the surface of circuit board 1, and their values ​​are the same.

[0064] a2=b2, where a2 is the process assembly safety distance reserved between the electronic component 7' and the base 5' in the related technology, and b2 is the process assembly safety distance reserved between the electrical connection point (e.g., the second connection part 16) of the circuit board 1 proposed in the embodiment of this application and the base 7. The two are the same.

[0065] a1=b1, where a1 is the width of the base 5' mounted on the circuit board 1' in the related art, and b1 is the width of the base 7 mounted on the circuit board 1 in the embodiment proposed in this application.

[0066] Therefore, based on the above description, the packaging technology dimension chain of the embodiment proposed in this application reduces the size composition of a3+a4+a5+a6 compared to the packaging dimension chain in the related technology, thus enabling miniaturized design. In the related technology, a3 is the width occupied by the electronic component 7', a4 is the distance between the electronic component 7' and the electrical connection point 3', a5 is the width of the outer electrical connection point 3', and a6 is the spacing between the two rows of electrical connection points 3'.

[0067] According to some embodiments of this application, optionally, the signal lines connected to the image sensor 2 on the circuit board 1 include analog signal lines and digital signal lines; therefore, in conjunction with the multi-window design of the circuit board 1 proposed in this application, the analog signal lines and digital signal lines of the image sensor 2 are set in separate areas.

[0068] Optionally, since the number of analog signal lines that need to be connected to the image sensor 2 is much smaller than the number of digital signal lines that need to be connected, the number of electrical connection points for the analog signal lines that need to be designed is small, and the wiring area required is small. Therefore, the analog signal connection part 140 is set on the side of the second opening 12 close to the first opening 10, and the analog signal lines are arranged on the side of the second opening 12 close to the first opening 10. Then, the digital signal connection part 160 is set on the side of the second opening 12 away from the first opening 10, and the digital signal lines are arranged on the side of the second opening 12 away from the first opening 10, thereby realizing the analog-to-digital signal separation design.

[0069] In addition, based on the design requirements of electronic performance, electronic components 5 need to be close to the corresponding signal lines. That is, the electronic components 5 that need to be connected to the analog signal lines are located in the analog signal area; the electronic components 5 that need to be connected to the digital signal lines are located in the digital signal area. Therefore, analog electronic components (such as the first electronic component 50) need to be close to the analog signal lines (such as the first connecting line 30).

[0070] Since the circuit board 1 is covered by the image sensor 2, the electronic components 5 can be placed directly above the non-photosensitive area 22 of the image sensor 2 and the overlapping area of ​​the circuit board 1. Therefore, the base 7 can directly approach the electronic components 5 to the inner limit, so that the size of the camera module is minimized.

[0071] Optionally, in the embodiments proposed in this application, a steel sheet is provided at the bottom of the circuit board 1. Since the steel sheet is thinner, it is more advantageous to reduce the height of the camera module. The steel sheet is a conductor and has better surface flatness, thus providing better grounding reliability. Therefore, the embodiments proposed in this application are more conducive to the grounding design of the camera module in the overall device, resulting in superior electrostatic discharge protection and electromagnetic interference performance in the overall application. Furthermore, the assembly process does not involve new equipment, new processes, or new materials, therefore the embodiments proposed in this application have lower costs.

[0072] Alternatively, the camera module can be a camera with various functions such as focusing, image stabilization, and external attachment.

[0073] The embodiments proposed in this application utilize the non-imaging area of ​​the image sensor 2 to achieve a miniaturized design, while avoiding the problem of short circuits caused by excessively long gold wires collapsing. Electronic components 5 are also placed in the non-imaging area, further reducing the size of the image sensor 2 along the first and second directions. Furthermore, analog and digital signal lines are separated in the wiring design, thus achieving analog-to-digital separation and avoiding crosstalk between analog and digital signal lines, thereby improving the image quality output by the image sensor 2.

[0074] Alternatively, electronic devices include mobile phones, tablets, and other devices.

[0075] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0076] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A chip assembly, characterized in that, include: A circuit board having a first opening and a second opening, and a connecting portion on a first side of the circuit board, the connecting portion being disposed opposite to the second opening; An image sensor is disposed on the second side of the circuit board. The image sensor includes a photosensitive area and a non-photosensitive area. The photosensitive area is disposed opposite to the first opening. At least a portion of the non-photosensitive area is blocked by the bottom of the circuit board, and a portion of the non-photosensitive area is disposed opposite to the second opening. A connecting line is inserted through the second opening, and the two ends of the connecting line are respectively connected to the image sensor and the connecting part.

2. The chip assembly according to claim 1, characterized in that, The connecting portion includes a first connecting portion and a second connecting portion, wherein the first connecting portion and the second connecting portion are respectively located on opposite sides of the second opening; The connecting line includes a first connecting line and a second connecting line, both of which pass through the second opening. The two ends of the first connecting line are respectively connected to the image sensor and the first connecting part, and the two ends of the second connecting line are respectively connected to the image sensor and the second connecting part.

3. The chip assembly according to claim 2, characterized in that, One of the first connecting part and the second connecting part is an analog signal connecting part, and the other is a digital signal connecting part; or Both the first connection part and the second connection part include an analog signal connection part and a digital signal connection part.

4. The chip assembly according to claim 3, characterized in that, The first connection part is an analog signal connection part, and the second connection part is a digital signal connection part.

5. The chip assembly according to claim 2, characterized in that, Also includes: An electronic component is disposed on the circuit board and is positioned opposite to the non-photosensitive area. Both the first connecting portion and the second connecting portion are connected to the electronic component.

6. The chip assembly according to claim 5, characterized in that, The electronic components include: A first electronic component is disposed on the circuit board, located between the first opening and the second opening, and the first electronic component is connected to the first connecting portion; A second electronic component is disposed on the circuit board, located on the side of the second opening opposite to the first opening, and the second electronic component is connected to the second connecting portion.

7. The chip assembly according to claim 2, characterized in that, The second opening is disposed around the first opening and spaced apart from the first opening. The first connecting portion is disposed on the side of the second opening closer to the first opening, and the second connecting portion is disposed on the side of the second opening away from the first opening.

8. The chip assembly according to claim 7, characterized in that, The number of the second opening is one or more.

9. The chip assembly according to claim 8, characterized in that, When there are multiple second openings, at least two second openings are provided on both sides of the first opening along the first direction and extend along the second direction, and at least one second opening is provided on one side of the first opening along the second direction and extends along the first direction. The first direction intersects with the second direction.

10. The chip assembly according to any one of claims 1 to 9, characterized in that, The second side of the circuit board is provided with a groove, which is recessed from the second side to the first side. The first opening and the second opening are provided on the bottom wall of the groove, and the image sensor is at least partially disposed in the groove.

11. The chip assembly according to any one of claims 1 to 9, characterized in that, Also includes: A support plate is disposed on the second side of the circuit board, and both the circuit board and the image sensor are connected to the support plate.

12. The chip assembly according to claim 11, characterized in that, Both the circuit board and the image sensor are bonded to the support plate; and / or The support plate includes a metal plate.

13. A camera module, characterized in that, include: The chip assembly as described in any one of claims 1 to 12.

14. The camera module according to claim 13, characterized in that, Also includes: A base is disposed on the first side of the circuit board, and the portion of the base connected to the circuit board is disposed opposite to the non-photosensitive area; The lens is mounted on the base and positioned opposite the first opening.

15. An electronic device, characterized in that, include: The chip assembly as described in any one of claims 1 to 12; or The camera module as described in claim 13 or 14.

Images