Method for manufacturing a photovoltaic module, photovoltaic module

Abstract

The embodiment of the present disclosure relates to the photovoltaic field, and provides a manufacturing method of a photovoltaic module and the photovoltaic module. The manufacturing method comprises the following steps: providing a carrier plate; arranging an initial jumper wire extending along a first direction on the carrier plate, the initial jumper wire comprising at least two first segments and a second segment between the two first segments; bonding a first adhesive film to at least one side of the second segment close to the carrier plate; performing a bending treatment on the second segment and the first adhesive film along a second direction to bend the initial jumper wire into a jumper wire, and at least part of the second segment is bent into a lead-out segment protruding along the second direction, the first direction and the second direction intersecting; wherein the lead-out segment has a gap in the first direction, and at least part of the first adhesive film is accommodated in the gap; performing a laminating treatment to improve the flowability of the first adhesive film, so as to facilitate the first adhesive film to fill the gap, and at least to improve the yield of the photovoltaic module.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of photovoltaics, and in particular to a manufacturing method of a photovoltaic module and a photovoltaic module. BACKGROUND

[0002] A photovoltaic module is a core part of a solar power generation system. The photovoltaic module includes a plurality of photovoltaic cells connected in series or in parallel. The photovoltaic cells can convert light energy into electrical energy. The photovoltaic module collects electrical energy from the plurality of photovoltaic cells and outputs the electrical energy.

[0003] In the photovoltaic module, the photovoltaic cells are easily affected by local shadows formed by surrounding buildings and the like, thereby causing the power generation efficiency of the photovoltaic module to decrease. In addition, the photovoltaic cells affected by the shadows can also have a "hot spot effect" due to local overheating. As a result, the photovoltaic cells can be burned and the safety of the photovoltaic module can be affected. In order to reduce the negative effects of local shadows on the power generation efficiency and safety of the photovoltaic module, the most common measure is to configure a diode in the photovoltaic module.

[0004] However, when the diode and the photovoltaic cells in the photovoltaic module are electrically connected by means of a jumper or a bus bar, it is necessary to further study how to avoid unstable electrical connection caused by the jumper or the bus bar, and how to avoid the problem of air bubbles caused by the jumper or the bus bar during the lamination stage, so as to improve the yield of the photovoltaic module. SUMMARY

[0005] The present disclosure provides a manufacturing method of a photovoltaic module and a photovoltaic module, which at least improves the yield of the photovoltaic module.

[0006] According to some embodiments of the present disclosure, the present disclosure provides a manufacturing method of a photovoltaic module, which includes: providing a carrier plate; arranging an initial jumper extending along a first direction on the carrier plate, the initial jumper including at least two first segments and a second segment located between the two first segments; bonding a first adhesive film to at least one side of the second segment close to the carrier plate; and performing a bending process on the second segment and the first adhesive film along a second direction to bend the initial jumper into a jumper, and at least part of the second segment is bent into a lead-out segment protruding along the second direction, the first direction and the second direction intersecting; wherein the lead-out segment has a gap in the first direction, and the gap contains at least part of the first adhesive film; and performing a lamination process to improve the flowability of the first adhesive film to facilitate the first adhesive film to fill the gap.

[0007] In some embodiments, the carrier plate comprises a back plate and a second adhesive film stacked along the second direction, the jumper is located on a side of the second adhesive film away from the back plate, and part of the first adhesive film is located between the jumper and the second adhesive film; wherein the pre-crosslinking degree of the second adhesive film is greater than that of the first adhesive film; in the step of performing the laminating treatment, the second adhesive film is extruded against the first adhesive film, so as to cause more of the first adhesive film to flow into the gap, so that the gap is filled.

[0008] In some embodiments, after the bending treatment, before the laminating treatment, further comprising: arranging a third adhesive film at least on a side of the jumper away from the carrier plate, and the pre-crosslinking degree of the second adhesive film is greater than that of the third adhesive film.

[0009] In some embodiments, the carrier plate comprises a back plate and a second adhesive film stacked along the second direction, the jumper is located on a side of the second adhesive film away from the back plate; wherein the pre-crosslinking degree of the second adhesive film is less than or equal to that of the first adhesive film; in the step of performing the laminating treatment, the back plate is extruded against the second adhesive film, so as to cause part of the second adhesive film to flow into the gap, so that the gap is filled.

[0010] In some embodiments, the first adhesive film is adhered on a side of the first segment and the second segment close to the carrier plate, or only on a side of the second segment close to the carrier plate.

[0011] In some embodiments, the bending part is formed at the connection between the lead-out segment and the part of the jumper before the lead-out segment, and the initial jumper has a to-be-bent part corresponding to the bending part; before the bending treatment, further comprising: adhering a fourth adhesive film on a side of the to-be-bent part away from the carrier plate; wherein a single lead-out segment corresponds to two fourth adhesive films, and the distance between the two fourth adhesive films corresponding to the same lead-out segment along the first direction is less than the length of the second segment.

[0012] In some embodiments, the lead-out segment has an opening close to the bottom of the carrier plate, and after the bending treatment, before the laminating treatment, further comprising: inserting an adhesive strip into the opening along the second direction; or the carrier plate comprises a back plate and a second adhesive film stacked along the second direction, the jumper is located on a side of the second adhesive film away from the back plate, and the side of the second adhesive film facing the jumper has an extrusion area corresponding to the lead-out segment, and after the bending treatment, before the laminating treatment, further comprising: arranging the adhesive strip on the extrusion area, and causing the adhesive strip to be extruded from the opening into the gap in the laminating treatment.

[0013] In some embodiments, the first adhesive film has a first thickness along a direction perpendicular to a direction in which the first adhesive film extends before the bending process is performed; and the adhesive strip has a second thickness along a direction perpendicular to a direction in which the adhesive strip extends before the laminating process is performed, the second thickness being greater than or equal to the first thickness.

[0014] In some embodiments, the second thickness is 0.05mm-1mm; and / or, the first thickness is 0.05mm-0.8mm.

[0015] In some embodiments, the adhesive strip has an extension length along the second direction of 3mm-16mm.

[0016] In some embodiments, after the bending process is performed and before the laminating process is performed, the method further comprises: providing a third adhesive film on at least a side of the jumper wire away from the carrier board, the third adhesive film having opposite first and second faces along the second direction, at least one of the first and second faces having a depressed area corresponding to the lead-out segment; and providing a protrusion on the depressed area, the protrusion being made of a same material as the first adhesive film or the third adhesive film, and at least part of the protrusion being depressed into the gap in the laminating process.

[0017] In some embodiments, the lead-out segment has a length along the second direction of 15mm-23mm.

[0018] In some embodiments, the second segment is partially bent to form the lead-out segment protruding along the second direction, and the remaining second segment includes two extension segments respectively located at two ends of the lead-out segment, the extension segments each having a length along the first direction of 5mm-15mm.

[0019] In some embodiments, the lead-out segment has a top end away from the carrier board; and the method further comprises: providing a diode having a terminal for electrical connection; and welding the top end to the terminal.

[0020] According to some embodiments of the present disclosure, another aspect of the present disclosure provides a photovoltaic module formed by the method of manufacturing a photovoltaic module according to any one of the above.

[0021] The technical solutions provided by the embodiments of the present disclosure have at least the following advantages:

[0022] The first adhesive film is bonded in advance on the side of the second segment close to the carrier plate before the initial jumper wire is bent into a jumper wire, so that at least part of the first adhesive film is also bent when at least part of the second segment of the initial jumper wire is subsequently bent, thereby facilitating reduction in the size of the gap generated inside the jumper wire after bending, and the flowability of the first adhesive film is enhanced during the subsequent lamination process, so that the first adhesive film fills the gap with a smaller size, thereby reducing the time required for filling the gap and greatly reducing the risk of bubbles being formed after the gap is filled by the first adhesive film, i.e., bubbles are less likely to be formed at the bent part of the jumper wire, thereby greatly improving the yield of the photovoltaic module. BRIEF DESCRIPTION OF DRAWINGS

[0023] One or more embodiments are illustrated by way of example in the drawings that are for illustrative purposes only, and not for the purposes of limitation of the embodiments, unless otherwise explicitly stated herein, and any drawings herein are not necessarily to scale. In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or in the prior art, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can also be obtained from these drawings without creative effort.

[0024] Figure 1 A first partial cross-sectional view of an initial jumper wire before the initial jumper wire is subjected to a bending process in a manufacturing method of a photovoltaic module according to an embodiment of the present disclosure;

[0025] Figure 2 A first partial cross-sectional view of a jumper wire arranged relative to a carrier plate in a manufacturing method of a photovoltaic module according to an embodiment of the present disclosure;

[0026] Figure 3 A second partial cross-sectional view of a jumper wire arranged relative to a carrier plate in a manufacturing method of a photovoltaic module according to an embodiment of the present disclosure;

[0027] Figure 4 A partial cross-sectional view of a photovoltaic module after being subjected to a lamination process in a manufacturing method of a photovoltaic module according to an embodiment of the present disclosure;

[0028] Figure 5 A partial top view of a photovoltaic module formed in a manufacturing method of a photovoltaic module according to an embodiment of the present disclosure;

[0029] Figure 6 A second partial cross-sectional view of an initial jumper wire before the initial jumper wire is subjected to a bending process in a manufacturing method of a photovoltaic module according to an embodiment of the present disclosure;

[0030] Figure 7A third partial cross-sectional view of the initial jumper wire before the bending process in the manufacturing method of the photovoltaic module according to an embodiment of the present disclosure is provided;

[0031] Figure 8 A third partial cross-sectional view of the jumper wire after being arranged relative to the carrier plate in the manufacturing method of the photovoltaic module according to an embodiment of the present disclosure is provided;

[0032] Figure 9 A fourth partial cross-sectional view of the initial jumper wire before the bending process in the manufacturing method of the photovoltaic module according to an embodiment of the present disclosure is provided;

[0033] Figure 10 A fourth partial cross-sectional view of the jumper wire after being arranged relative to the carrier plate in the manufacturing method of the photovoltaic module according to an embodiment of the present disclosure is provided;

[0034] Figure 11 A partial cross-sectional view of the manufacturing method of the photovoltaic module according to an embodiment of the present disclosure is provided, in which a tape is arranged;

[0035] Figure 12 A partial cross-sectional view of the manufacturing method of the photovoltaic module according to an embodiment of the present disclosure is provided, in which a protruding part is arranged on the third adhesive film.

[0036] Explanation of reference signs:

[0037] 100, carrier plate; 110, back plate; 120, second adhesive film; 101, initial jumper wire; 111, first segment; 121, second segment; 102, first adhesive film; 103, jumper wire; 113, lead-out segment; 1131, top end; 123, extension segment; 104, gap; 105, third adhesive film; 115, first surface; 125, second surface; 135, pressing area; 145, protruding part; 106, fourth adhesive film; 107, tape; 108, diode; 118, terminal; 109, cover plate; 40, photovoltaic cell; 41, cell string; 42, busbar component. DETAILED DESCRIPTION

[0038] As known from the background, the yield of the photovoltaic module needs to be further improved.

[0039] The embodiments of the present disclosure provide a manufacturing method of a photovoltaic module and the photovoltaic module. In the manufacturing method, before the initial jumper wire is bent into a jumper wire, a first adhesive film is bonded to a side of a second section close to a carrier plate in advance, so that at least part of the first adhesive film is also bent when at least part of the second section of the initial jumper wire is subsequently bent, thereby facilitating reduction of the size of a gap generated inside the jumper wire after bending. In addition, in a subsequent lamination process, the flowability of the first adhesive film is enhanced, so that the first adhesive film fills the gap with a small size. As a result, the time required for filling the gap can be reduced, and the risk of bubbles being generated after the gap is filled by the first adhesive film can be greatly reduced, i.e., bubbles are less likely to be generated at the bent part of the jumper wire, thereby greatly improving the yield of the photovoltaic module.

[0040] In the description of the embodiments of the present disclosure, the technical terms "first", "second", and the like are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present disclosure, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0041] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present disclosure. The appearance of the phrase in various places in the specification does not necessarily all refer to the same embodiment, nor is it necessarily independent or alternative to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0042] In the description of the embodiments of the present disclosure, the term "and / or" is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of existence of A, existence of A and B, and existence of B. In addition, the character " / " herein generally represents an "or" relationship between the front and rear associated objects.

[0043] In the description of the embodiments of the present disclosure, the term "a plurality of" refers to two or more (including two), and similarly, "a plurality of groups" refers to two or more groups (including two groups), and "a plurality of pieces" refers to two or more pieces (including two pieces).

[0044] In the description of the embodiments of the present disclosure, the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present disclosure.

[0045] In the description of the embodiments of the present disclosure, unless otherwise explicitly specified and limited, the technical terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium, or can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0046] In the corresponding drawings of the embodiments of the present disclosure, in order to better understand and facilitate the description, the thickness and area of the layer are enlarged. When describing that a component (such as a layer, a film, a region or a substrate) is on or on the surface of another component, the component can be "directly" on the surface of the other component, or there can be a third component between the two components. On the contrary, when describing that a component is on the surface of another component or a component surface is formed or provided with another component, it means that there is no third component between the two components. In addition, when describing that a component is "formed" on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor is it formed on the edge of the entire surface.

[0047] In the description of the embodiments of the present disclosure, when a certain component "includes" another component, unless otherwise stated, other components are not excluded and other components can also be further included. In addition, when a layer, film, region or plate and the like component is referred to as "on / over" another component, it can be "directly on" another component (i.e. between the surface of another component and another component without other components), or another component can exist therebetween. In addition, when a layer, film, region, plate and the like component is "directly on" another component, or when a layer, film, region, plate and the like component is on the surface of another component, it means that there is no other component therebetween.

[0048] The terminology used in the description of the various described embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various embodiments and the appended claims, the phrase "the component" is intended to mean both "the component" and "at least one of the components" unless otherwise indicated. In other words, the phrases "the component" and "at least one of the components" are interchangeable with each other in this context.

[0049] Embodiments of the present disclosure will be described in detail below with reference to the drawings. However, those skilled in the art can understand that, in the embodiments of the present disclosure, many technical details are presented in order to enable the reader to better understand the embodiments of the present disclosure. However, the technical solutions claimed by the embodiments of the present disclosure can be implemented even without these technical details and based on various changes and modifications of the following embodiments.

[0050] An embodiment of the present disclosure provides a manufacturing method of a photovoltaic module, which will be described in detail below with reference to the drawings.

[0051] In conjunction with reference Figures 1 to 5 The manufacturing method of the photovoltaic module comprises: providing a carrier plate 100; providing an initial jumper 101 extending along a first direction X on the carrier plate 100, the initial jumper 101 comprising at least two first segments 111 and a second segment 121 located between the two first segments 111; bonding a first adhesive film 102 to at least one side of the second segment 121 close to the carrier plate 100; performing a bending process on the second segment 121 and the first adhesive film 102 along a second direction Y to bend the initial jumper 101 into a jumper 103, and at least part of the second segment 121 is bent into a lead-out segment 113 protruding along the second direction Y, the first direction X and the second direction Y intersecting; wherein the lead-out segment 113 has a gap 104 in the first direction X, and at least part of the first adhesive film 102 is accommodated in the gap 104; performing a lamination process to improve the flowability of the first adhesive film 102 to facilitate the first adhesive film 102 to fill the gap 104.

[0052] wherein, Figure 1 The first partial cross-sectional view of the manufacturing method of the photovoltaic module provided by an embodiment of the present disclosure before the initial jumper undergoes a bending process; Figure 2 The first partial cross-sectional view of the manufacturing method of the photovoltaic module provided by an embodiment of the present disclosure after the jumper is provided relative to the carrier plate; Figure 3 The second partial cross-sectional view of the manufacturing method of the photovoltaic module provided by an embodiment of the present disclosure after the jumper is provided relative to the carrier plate; Figure 4 The partial cross-sectional view of the photovoltaic module after the manufacturing method of the photovoltaic module provided by an embodiment of the present disclosure undergoes a lamination process; Figure 5 The partial top view of the photovoltaic module formed by the manufacturing method of the photovoltaic module provided by an embodiment of the present disclosure.

[0053] It should be noted that, in order to distinguish the first segment 111 and the second segment 121 in the initial jumper 101, and the jumper 103 is obtained after the initial jumper 101 is bent, the jumper 103 can also be regarded as including the first segment 111 and the second segment 121 which is at least partially bent, based on which, Figures 1 to 3 In FIGS. 1-3, different drawing methods are used to show the first segment 111 and the second segment 121; Figure 2 In FIGS. 1-3, the jumper 103 is shown in a dashed box to show the lead-out segment 113; Figure 3 In FIGS. 1-3, only two adjacent photovoltaic cells 40 between two adjacent cell strings 41 (see Figure 4 ) in the photovoltaic module are shown, and Figure 5 In FIGS. 1-3, the gap 104 (see Figure 4 or Figure 2 ) is filled with the first adhesive film 102 in the step of laminating; in addition, in order to show the relative position relationship between the jumper 103 and the photovoltaic cell 40, Figure 3 In FIGS. 1-3, the jumper 103 is located between two photovoltaic cells 40 belonging to two adjacent cell strings 41 (see Figure 4 ) in the photovoltaic module, for example, the jumper 103 can be hiddenly arranged on the back of the photovoltaic cell 40 close to the carrier plate 100, in actual application, the jumper 103 can also be located in the interval formed by the cell string 41 as shown in Figure 5 ; Figure 5 In FIGS. 1-3, the dashed circle frame A is approximately the position of the lead-out segment 113 shown in Figure 5 or Figure 2 . Figure 3

[0054] It is worth noting that, in addition to arranging the initial jumper 101 on the carrier plate 100 in the photovoltaic module, a plurality of photovoltaic cells are also arranged on the carrier plate 100, and a cover plate is arranged on the side of the photovoltaic cell away from the carrier plate 100 for protecting the photovoltaic cell, and the diode is arranged on the side of the cover plate away from the photovoltaic cell, so the diode and the photovoltaic cell are not in the same horizontal plane. Therefore, in order to realize the electrical connection between the diode and the photovoltaic cell, the initial jumper 101 needs to be bent into the jumper 103. However, after the initial jumper 101 is bent into the jumper 103, it is difficult for the encapsulating material to completely wrap the jumper 103 when the photovoltaic module is subsequently encapsulated and laminated, so air bubbles are easily generated near the jumper 103, and the air bubbles are difficult to overflow in the process of encapsulation and lamination, and thus remain in the photovoltaic module finally formed, which not only reduces the reliability of the photovoltaic module after long-term aging, but also increases the risk of water vapor entering the photovoltaic module and corroding the photovoltaic module.

[0055] ​On this basis, in the manufacturing method of the photovoltaic module provided by an embodiment of the present disclosure, before bending the initial jumper 101 into the jumper 103, the first adhesive film 102 is adhesively bonded to the side of the second section 121 close to the carrier plate 100 in advance, so that when at least part of the second section 121 of the initial jumper 101 is bent subsequently, at least part of the first adhesive film 102 is also bent, which is beneficial to reducing the size of the gap 104 generated inside the jumper 103 formed after bending. Moreover, in the subsequent lamination process step, the fluidity of the first adhesive film 102 is enhanced, prompting the first adhesive film 102 to fill the gap 104 with a smaller size. This can not only reduce the time required to fill the gap 104, but also greatly reduce the risk of forming air bubbles after the first adhesive film 102 fills the gap 104, that is, it is not easy to form air bubbles at the jumper 103, thereby greatly improving the yield of the photovoltaic module.

[0056] In addition, the jumper 103 formed by bending one initial jumper 101, that is, the jumper 103 with a cross-sectional profile presenting a "ji" shape, compared with the "L"-shaped conductive component used for electrically connecting the photovoltaic cell and the diode, on the one hand, the two ends of a single "ji"-shaped jumper 103 can be electrically connected to two different photovoltaic cells respectively. Compared with the design that the "L"-shaped conductive component can only be electrically connected to a single photovoltaic cell, the electrical connection method of a single "ji"-shaped jumper 103 is more flexible and efficient; on the other hand, compared with the "L"-shaped conductive component, the cross-sectional area of the lead-out section 113 formed by a single "ji"-shaped jumper 103 is larger, and without welding two "L"-shaped conductive components together, the electrical connection of two photovoltaic cells and the same diode can be achieved, reducing the welding process and avoiding problems such as false soldering or de-soldering caused by welding, thereby improving the electrical conductivity of the lead-out section 113. Subsequently, only the lead-out section 113 needs to be welded to the diode.

[0057] It should be noted that the carrier plate 100 is a carrier used to carry a plurality of arranged photovoltaic cells during the formation of the photovoltaic module. Specific film layers included in the carrier plate 100 will be exemplified later. In addition, after a plurality of photovoltaic cells are connected in series or in parallel, the initial jumper 101 is arranged on the carrier plate 100 to determine the position of the second section 121 in the initial jumper 101. Subsequently, the initial jumper 101 is bent based on the second section 121 to form the jumper 103. Then, the two ends in the jumper 103 are electrically connected to different photovoltaic cells respectively, and the lead-out section 113 of the jumper 103 is electrically connected to the diode. The positional relationships among the carrier plate 100, the photovoltaic cells, the jumper 103, the diode, etc. in the photovoltaic module will be exemplified later.

[0058] In addition, the initial jumper wire 101 can be regarded as a busbar which is not subjected to the bending treatment, and after the bending treatment, the initial jumper wire 101 is converted into the jumper wire 103 to realize the electrical connection of the photovoltaic cells and the diodes, so as to reduce the hot spot effect of the photovoltaic module.

[0059] In some embodiments, with reference to Figure 4 , the manufacturing method of the photovoltaic module can further include: providing the cell string 41 which is electrically connected by a plurality of photovoltaic cells 40; and providing the busbar component 42, and realizing the series connection or parallel connection between different cell strings 41 by means of the busbar component 42 and the jumper wire 103. It should be noted that Figure 4 In the above embodiment, only four cell strings 41 in the photovoltaic module are shown, and in actual applications, the number of cell strings contained in a single photovoltaic module is not limited, and the series connection or parallel connection relationship between a plurality of cell strings can be flexibly designed, and the layout position of the jumper wire can be flexibly designed.

[0060] Figure 1 The jumper wire 103 formed after the bending treatment of the initial jumper wire 101 shown in the above embodiment at least includes the following two cases: in some cases, with reference to Figure 1 and Figure 2 , only part of the second section 121 is bent to form the lead-out section 113, and the part of the second section 121 which is not bent serves as the extension section 123, and the extension section 123 extends along the first direction X like the first section 111, and the extension section 123, the extension section 123 and the first section 111 together constitute the jumper wire 103; in other cases, with reference to Figure 1 and Figure 3 , the entire second section 121 is bent to form the lead-out section 113, and the first section 111 and the lead-out section 113 which are not bent together constitute the jumper wire 103.

[0061] The following will provide a more detailed description of the carrier plate 100 provided by an embodiment of the present disclosure in combination with the accompanying drawings.

[0062] In some embodiments, with reference to Figure 1 , Figure 2 , Figure 4 and Figure 5 , the carrier plate 100 can include the back plate 110 and the second adhesive film 120 which are stacked along the second direction Y, the jumper wire 103 is located on the side of the second adhesive film 120 away from the back plate 110, and part of the first adhesive film 102 is located between the jumper wire 103 and the second adhesive film 120; wherein the pre-crosslinking degree of the second adhesive film 120 is greater than the pre-crosslinking degree of the first adhesive film 102; in the step of performing the laminating treatment, the second adhesive film 120 causes extrusion to the first adhesive film 102, so as to promote more of the first adhesive film 102 to flow into the gap 104, so that the gap 104 is filled up.

[0063] It is worth noting that the greater the pre-crosslinking degree of the adhesive film, the worse the flowability in the step of performing the lamination process. Based on this, the pre-crosslinking degree of the second adhesive film 120 is designed to be greater than that of the first adhesive film 102, so that the flowability of the second adhesive film 120 is worse than that of the first adhesive film 102 in the step of performing the lamination process. Therefore, the second adhesive film 120 can provide higher support force to the first adhesive film 102, and further provide greater extrusion force to the first adhesive film 102 under the pressure caused by the lamination process. As a result, more of the first adhesive film 102 is extruded into the gap 104 in the step of performing the lamination process, so as to ensure that the gap 104 is filled, thereby effectively reducing the risk of generating bubbles and further improving the yield of the photovoltaic module.

[0064] In some cases, the pre-crosslinking degree of the second adhesive film 120 can be greater than 0% and less than or equal to 25%, and the pre-crosslinking degree of the first adhesive film 102 can be close to 0%.

[0065] In some cases, in combination with reference to Figure 2 and Figure 4 After the bending process is performed, before the lamination process is performed, the method for manufacturing the photovoltaic module can further include: disposing a third adhesive film 105 at least on the side of the jumper wire 103 away from the carrier plate 100, and the pre-crosslinking degree of the second adhesive film 120 is greater than that of the third adhesive film 105.

[0066] It is worth noting that in the step of laminating, the third adhesive film 105 can be regarded as a front adhesive film, and the second adhesive film 120 can be regarded as a back adhesive film. Among them, the third adhesive film 105 is mainly used for downward flow to fill the gap formed by the plurality of photovoltaic cells, especially to fill the micro gap around the electrode in the photovoltaic cell or the micro gap around the jumper 103, so as to avoid the generation of bubbles; and can form a uniform, dense and stress-free protective layer, avoiding the mechanical stress of the cover plate located on the side of the third adhesive film 105 away from the photovoltaic cell on the photovoltaic cell, while playing the role of insulation and bonding; the second adhesive film 120 is part of the carrier plate 100, which is mainly used to support the photovoltaic cell in the step of laminating. Based on this, the pre-crosslinking degree of the second adhesive film 120 is designed to be greater than that of the third adhesive film 105. Compared with the second adhesive film 120, the flowability of the third adhesive film 105, on the one hand, is conducive to being extruded into the side of the photovoltaic cell and the gap by the third adhesive film 105 with better flowability, and being extruded into the vicinity of the jumper 103, so as to fully wrap the photovoltaic cell and avoid the generation of bubbles; on the other hand, the second adhesive film 120 with poor flowability can effectively block the excessive overflow of the extruded third adhesive film 105, so as to lock the adhesive around the photovoltaic cell and between the photovoltaic cell and the second adhesive film 120, and finally form a photovoltaic module with uniform thickness and flat surface. It should be noted that in the step of laminating, the gap 104 inside the lead-out section 113 can be filled with the first adhesive film 102, or can be filled with the first adhesive film 102 and the third adhesive film 105 together.

[0067] In some examples, the pre-crosslinking degree of the third adhesive film 105 can be consistent with the pre-crosslinking degree of the first adhesive film 102, for example, the material of the third adhesive film 105 can be the same as the material of the first adhesive film 102.

[0068] In another embodiment, continuing to combine reference Figures 1 to 5 The carrier plate 100 can include a back plate 110 and a second adhesive film 120 stacked along the second direction Y, and the jumper 103 is located on the side of the second adhesive film 120 away from the back plate 110; wherein the pre-crosslinking degree of the second adhesive film 120 is less than or equal to the pre-crosslinking degree of the first adhesive film 102; in the step of laminating, the back plate 110 extrudes the second adhesive film 120, prompting part of the second adhesive film 120 to flow into the gap 104, so that the gap 104 is filled.

[0069] It is worth noting that the second adhesive film 120 is designed to have a pre-crosslinking degree less than or equal to that of the first adhesive film 102. In the step of performing the lamination process, the second adhesive film 120 has the same flowability as the first adhesive film 102 or has better flowability than the first adhesive film 102. Thus, under the pressure caused by the lamination process, the backboard 110 provides greater extrusion force to the second adhesive film 120, and the backboard 110 further provides greater extrusion force to the second adhesive film 120. In the vicinity of the gap 104, the extruded second adhesive film 120 tends to flow into the gap 104 due to less flow resistance, and as shown in Figure 2 the second adhesive film 120 flows into the gap 104, it carries more first adhesive film 102 to flow into the gap 104, thereby ensuring that the gap 104 is filled to effectively avoid the generation of bubbles. It should be noted that in the step of performing the lamination process, the gap 104 inside the lead-out section 113 can be filled with the first adhesive film 102 or can be filled with the first adhesive film 102 and the second adhesive film 120 together.

[0070] The first adhesive film 102 provided by an embodiment of the present disclosure will be described in more detail below with reference to the accompanying drawings.

[0071] In some embodiments, referring to Figure 6 , Figure 6 the second partial cross-sectional view of the manufacturing method of the photovoltaic module provided by an embodiment of the present disclosure before the initial jumper wire undergoes the bending process, the first adhesive film 102 is attached to the side of the first section 111 and the second section 121 close to the carrier plate 100. In other words, the initial jumper wire 101 has the first adhesive film 102 attached to the side close to the carrier plate 100. When the second section 121 and the first adhesive film 102 are bent in the second direction Y, not only the gap 104 inside the lead-out section 113 has the first adhesive film 102, but also the jumper wire 103 and the carrier plate 100 have the first adhesive film 102. Therefore, in the subsequent step of performing the lamination process, the first adhesive film 102 between the jumper wire 103 and the carrier plate 100 can also flow into the gap 104 under the extrusion effect to ensure that no bubbles are formed inside the lead-out section 113.

[0072] In other embodiments, referring to Figure 1 , only the first adhesive film 102 is attached to the side of the second section 121 close to the carrier plate 100. Based on this, after the second section 121 and the first adhesive film 102 are bent in the second direction Y, the positional relationship between the first adhesive film 102 and the jumper wire 103 and the carrier plate 100 includes the following two cases:

[0073] In some cases, referring to Figure 1 and Figure 3In the step of the bending treatment, the whole second section 121 is bent, so that the whole second section 121 is converted into the lead-out section 113. Based on this, only when the first adhesive film 102 is adhered to the side of the second section 121 close to the carrier plate 100, after the bending treatment, the first adhesive film 102 is only located inside the lead-out section 113, that is, the part of the jumper 103 not subjected to the bending treatment does not have the first adhesive film 102 between the lead-out section 113 and the carrier plate 100. In this case, either the lead-out section 113 can be pressed during the bending treatment or the first adhesive film 102 can be heated during the laminating treatment, so that the first adhesive film 102 located inside the lead-out section 113 forms a good adhesion by itself, to avoid bubbles in the lead-out section 113, or the gap 104 inside the lead-out section 113 can be filled by the subsequent flow of the second adhesive film 120 or the third adhesive film 105, to effectively avoid bubbles.

[0074] In other cases, in combination with reference to Figure 1 and Figure 2 In the step of the bending treatment, only part of the second section 121 is bent, so that only part of the second section 121 is converted into the lead-out section 113. Based on this, the part of the second section 121 not subjected to the bending treatment also has the first adhesive film 102 between the lead-out section 113 and the carrier plate 100, and this part of the first adhesive film 102 can be further pressed during the step of the laminating treatment, so as to flow into the lead-out section 113, to ensure that the gap 104 is filled, to effectively avoid bubbles.

[0075] In the above two embodiments, in combination with reference to Figure 7 and Figure 8 , or in combination with reference to Figure 9 and Figure 10 , the lead-out section 113 and the part of the jumper 103 before the lead-out section 113 constitute a bending part at the connection, and the initial jumper 101 has a to-be-bent part corresponding to the bending part; before the bending treatment, the method for manufacturing the photovoltaic module can further include: adhering a fourth adhesive film 106 to the side of the to-be-bent part away from the carrier plate 100; wherein one lead-out section 113 corresponds to two fourth adhesive films 106, and the distance between the two fourth adhesive films 106 corresponding to the same lead-out section 113 along the first direction X is less than the length of the second section 121.

[0076] wherein, Figure 7 is a third partial cross-sectional view of the initial jumper before the bending treatment in the method for manufacturing the photovoltaic module provided by an embodiment of the present disclosure; Figure 8 is a third partial cross-sectional view of the jumper after being arranged relative to the carrier plate in the method for manufacturing the photovoltaic module provided by an embodiment of the present disclosure; Figure 9 is a fourth partial cross-sectional view of the initial jumper before the bending treatment in the method for manufacturing the photovoltaic module provided by an embodiment of the present disclosure; Figure 10This is a fourth partial cross-sectional view of a photovoltaic module manufacturing method provided in an embodiment of this disclosure, showing the jumper wires positioned relative to the carrier plate. Furthermore, Figure 8 and Figure 10 The jumper 103, enclosed in a dashed box, indicates the lead-out segment 113.

[0077] It is worth noting that, in jumper 103, only the portion before the lead-out section 113 continues to extend along the first direction X, while only the lead-out section 113 protrudes along the second direction Y. Therefore, at the connection point, or corner, i.e., the bend, the two form an angle. In the subsequent lamination process, a relatively uneven space is also created at the bend, where the third adhesive film 105 (see reference) is located. Figure 4 When the third adhesive film 105 flows downwards, its ability to fill the space near the bend is limited, making it prone to uneven filling in the uneven space formed by the bend. Therefore, if the flowability is insufficient or the lamination process is too short, air bubbles can easily form near the bend, meaning the bend is not completely enclosed. Based on this, before bending, a fourth adhesive film 106 is bonded to the bend portion corresponding to the bend portion in the initial jumper 101, specifically on the side of the bend portion away from the carrier plate 100. After bending, the fourth adhesive film 106 is already formed on the side of the bend portion away from the carrier plate 100. In the subsequent lamination process, even if the flowability of the third adhesive film 105 is insufficient or the lamination process is too short, the filling ability of the fourth adhesive film 106 can prevent air bubbles from forming near the bend portion. Furthermore, no additional processing of the jumper 103 is required, which helps ensure good conductivity of the jumper 103, thereby further improving the yield of the photovoltaic module.

[0078] In some examples, the pre-crosslinking degree of the fourth adhesive film 106 can be the same as that of the first adhesive film 102. For example, the material of the fourth adhesive film 106 can be the same as that of the first adhesive film 102.

[0079] It should be noted that, at least on the premise that the first adhesive film 102 is bonded to the side of the second segment 121 near the carrier plate 100, if it is not further ensured that there are no air bubbles in the lead-out segment 113, an adhesive strip can be set for the gap 104 in the lead-out segment 113. The following is a detailed description of the situation where an adhesive strip is set.

[0080] In some cases, refer to Figure 11 , Figure 11 This is a partial cross-sectional view of a photovoltaic module manufacturing method provided in an embodiment of the present disclosure, in which an adhesive strip is provided. The lead-out section 113 has an opening near the bottom of the carrier plate 100. After bending and before lamination, the photovoltaic module manufacturing method may further include: inserting the adhesive strip 107 into the opening along the second direction Y.

[0081] It is worth noting that after the bending process to form the jumper 103, the lead-out section 113 is not completely closed near the bottom of the carrier plate 100, and there is a small opening. In combination with reference to Figure 11 and Figure 4 , no matter whether it is the first adhesive film 102, the second adhesive film 120, the third adhesive film 105 or the fourth adhesive film 106, they can all flow into the gap 104 from the opening in the subsequent lamination process.

[0082] In addition, before the lamination process, the adhesive strip 107 can be inserted into the opening along the second direction Y, so as to reserve sufficient amount of adhesive in the gap 104 in advance, so that the gap 104 can be filled with sufficient adhesive film in the subsequent lamination process, so as to further reduce the risk of forming bubbles due to the gap 104 not being filled.

[0083] In other cases, continuing to refer to Figure 11 , the carrier plate 100 can include the back plate 110 and the second adhesive film 120 stacked along the second direction Y, and the jumper 103 is located on the side of the second adhesive film 120 away from the back plate 110. The side of the second adhesive film 120 facing the jumper 103 has a pressing area corresponding to the lead-out section 113. After the bending process, before the lamination process, the method for manufacturing the photovoltaic module can further include: providing the adhesive strip 107 on the pressing area, and promoting the adhesive strip 107 to be extruded from the opening into the gap 104 in the lamination process.

[0084] It is worth noting that the adhesive strip 107 can not be artificially inserted into the gap 104. The adhesive strip 107 can be provided on the pressing area corresponding to the lead-out section 113 in the second adhesive film 120 when the second adhesive film 120 is provided. Subsequently, in the lamination process, the adhesive strip 107 is extruded into the gap 104 by the pressure provided by the lamination process. In this way, not only can the labor be saved, but also sufficient amount of adhesive can be reserved in the gap 104 in advance before the lamination process, so that the gap 104 can be filled with sufficient adhesive film in the subsequent lamination process, so as to further reduce the risk of forming bubbles due to the gap 104 not being filled.

[0085] Providing the adhesive strip 107 on the pressing area corresponding to the lead-out section 113 in the second adhesive film 120 includes at least the following two examples: in some examples, the adhesive strip 107 can be bonded to the pressing area of the second adhesive film 120; in other examples, the adhesive strip 107 can be prepared simultaneously with the second adhesive film 120 when the second adhesive film 120 is prepared, that is, the adhesive strip 107 and the second adhesive film 120 are integrally formed.

[0086] In some examples, referring to Figure 11Before the bending process, the first adhesive film 102 has a first thickness along a direction perpendicular to the extending direction of the first adhesive film 102; before the laminating process, the adhesive strip 107 has a second thickness along a direction perpendicular to the extending direction of the adhesive strip 107, and the second thickness can be greater than or equal to the first thickness. In this way, it is further ensured that the gap 104 can be reserved with sufficient amount of adhesive by means of the adhesive strip 107, so as to further ensure that the gap 104 is at least filled with the first adhesive film 102 and the adhesive strip 107 in the step of the laminating process, so as to effectively avoid the generation of air bubbles.

[0087] In some examples, the second thickness of the adhesive strip 107 can be 0.05mm-1mm, for example, can be 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm, 0.8mm, 0.85mm, 0.9mm, 0.95mm or 1mm, etc. It is worth noting that the gap 104 formed inside the lead-out section 113 is smaller in size than the gap formed between the photovoltaic cells in the entire photovoltaic module, and the second thickness of the adhesive strip 107 is designed to be 0.05mm-1mm, which is not only conducive to ensuring that the adhesive strip 107 provides sufficient amount of adhesive, but also conducive to reducing the preparation cost of the adhesive strip 107 and the photovoltaic module.

[0088] In some examples, the first thickness of the first adhesive film 102 can be 0.05mm-0.8mm, for example, can be 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm or 0.8mm, etc. It is worth noting that the gap 104 formed inside the lead-out section 113 is smaller in size than the gap formed between the photovoltaic cells in the entire photovoltaic module, and the first thickness of the first adhesive film 102 is designed to be 0.05mm-0.8mm, which is not only conducive to ensuring that the first adhesive film 102 provides moderate amount of adhesive, but also conducive to reducing the preparation cost of the first adhesive film 102 and the photovoltaic module.

[0089] In some examples, with reference to Figure 11 In the second direction Y, the extending length of the adhesive strip 107 can be 3mm-16mm, for example, can be 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm or 16mm, etc.

[0090] It is worth noting that the extension length of the adhesive strip 107 along the second direction Y is related to the length of the lead-out section 113. In some examples, the extension length of the adhesive strip 107 along the second direction Y can be less than or equal to the length of the lead-out section 113, so that the adhesive strip 107 is completely accommodated in the gap 104 at the initial stage of the lamination process; in other examples, the extension length of the adhesive strip 107 along the second direction Y can be greater than the length of the lead-out section 113, so that the adhesive strip 107 is not only partially accommodated in the gap 104 at the initial stage of the lamination process, but also partially located outside the gap 104, which will be subsequently pressed between the carrier plate 100 and the jumper 103, or further pressed into the gap 104.

[0091] In some embodiments, with reference to Figure 12 , Figure 12 A partial cross-sectional view of the manufacturing method of the photovoltaic module provided by an embodiment of the present disclosure after the protruding portion is disposed on the third adhesive film, before the bending process is performed and before the lamination process is performed, the manufacturing method of the photovoltaic module can further include: disposing the third adhesive film 105 at least on the side of the jumper 103 away from the carrier plate 100, the third adhesive film 105 having opposite first and second surfaces 115 and 125 along the second direction Y, at least one of the first and second surfaces 115 and 125 having a depression area 135 corresponding to the lead-out section 113 (with reference to Figure 11 ); and disposing a protruding portion 145 on the depression area 135, the protruding portion 145 being made of the same material as the first adhesive film 102 or the third adhesive film 105 and being caused to flow downward at least partially into the gap 104 during the lamination process.

[0092] It is worth noting that, in the step of applying pressure to the third adhesive film 105 during the lamination process, the protruding portion 145 will be subjected to greater extrusion force due to its protruding topography compared to other portions of the third adhesive film 105, so as to cause the protruding portion 145 to flow downward more quickly and further into the gap 104 below to fill the gap 104, thereby further ensuring that no air bubbles are present in the lead-out section 113 to improve the yield of the photovoltaic module. Moreover, when the protruding portion 145 flows downward more quickly, the space near the bent portion can be filled in a shorter time to avoid air bubbles near the bent portion to improve the yield of the photovoltaic module. Figure 12 and Figure 4 After the lamination process, the lead-out section 113 (with reference to Figure 11 ) will protrude from the third adhesive film 105 and the cover plate 109 to be finally electrically connected to the diode 108.

[0093] The protruding part 145 is arranged on the pressing area 135. At least two examples are as follows: in some examples, the protruding part 145 can be bonded on the pressing area 135 of the third adhesive film 105; in other examples, the protruding part 145 can be prepared on the pressing area 135 at the same time when the third adhesive film 105 is prepared, that is, the protruding part 145 and the third adhesive film 105 are integrally formed, and the material of the third adhesive film 105 is the same as that of the first adhesive film 102 or the third adhesive film 105.

[0094] It should be noted that, Figure 12 In the embodiment, the second surface 125 of the third adhesive film 105 closer to the jumper 103 has the pressing area 135 corresponding to the lead-out segment 113 (for reference Figure 11 ) as an example. In actual application, the first surface of the third adhesive film can have the pressing area corresponding to the lead-out segment, or the first surface and the second surface of the third adhesive film can both have the pressing area corresponding to the lead-out segment.

[0095] In some embodiments, with reference to Figures 2 to 4 , Figure 8 , Figures 10 to 12 , the length of the lead-out segment 113 in the second direction Y can be 15 mm to 23 mm, for example, 15 mm, 16 mm, 17 mm, 18 mm, 19 mm, 20 mm, 21 mm, 22 mm or 23 mm, etc. It should be noted that before the lamination process, the cover plate 109 is arranged on the side of the third adhesive film 105 away from the photovoltaic cell, and the lead-out segment 113 needs to pass through the cover plate 109 to be electrically connected to the diode on the side of the cover plate 109 away from the third adhesive film 105. Therefore, the length of the lead-out segment 113 is at least related to the thickness of the cover plate 109, and the design of the length of the lead-out segment 113 as 15 mm to 23 mm is not only conducive to ensuring that the lead-out segment 113 can pass through the cover plate 109 and be electrically connected to the diode, but also conducive to avoiding that the lead-out segment 113 is too long and needs a large amount of the third adhesive film 105 to wrap the periphery of the lead-out segment 113 in the lamination process, thereby reducing the amount of the third adhesive film 105 and reducing the risk of bubbles near the lead-out segment 113.

[0096] In some embodiments, with reference to Figure 2 , Figure 8 or Figure 11, a partial bend of the second segment 121 forms a lead-out segment 113 protruding along the second direction Y, and the remaining second segment 121 includes two extension segments 123 respectively located at both ends of the lead-out segment 113. Along the first direction X, the length of the extension segment 123 can be 5 mm to 15 mm. For example, it can be 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm or 15 mm, etc. Thus, by only bonding the first adhesive film 102 on the side of the second segment 121 close to the carrier plate 100, the length of the first adhesive film 102 bonded on the extension segment 123 can be controlled. Not only can the gap 104 be further filled by the first adhesive film 102 bonded on the extension segment 123 during the lamination process, but it is also beneficial to reduce the total amount of the first adhesive film 102, so as to reduce the manufacturing cost of the photovoltaic module while improving the yield of the photovoltaic module.

[0097] In some embodiments, referring to Figure 2 and Figure 4 , the lead-out segment 113 has a top end 1131 away from the carrier plate 100; the manufacturing method of the photovoltaic module may further include: providing a diode 108, and the diode 108 has terminals 118 for electrical connection; welding the top end 1131 to the terminals 118.

[0098] In some cases, the diode 108 is disposed in a junction box, and the junction box has an opening for the terminals 118 of the diode 108 to pass through. Based on this, the top end 1131 of the lead-out segment 113 can be welded to the terminals 118.

[0099] It should be noted that the jumper 103 formed by bending an initial jumper 101, that is, the jumper 103 with a cross-sectional profile presenting a "ji" shape. The two ends of the jumper 103 except the lead-out segment 113 can be respectively electrically connected to two different photovoltaic cells, that is, a single jumper 103 can simultaneously achieve the electrical connection of two photovoltaic cells and the diode 108. Compared with the design that a single "L"-shaped conductive component can only electrically connect a single photovoltaic cell and a single diode, the electrical connection method of a single "ji"-shaped jumper 103 is more flexible and efficient. Moreover, compared with the "L"-shaped conductive component, the cross-sectional area of the lead-out segment 113 formed by a single "ji"-shaped jumper 103 is larger, which is beneficial to achieve the electrical connection between the photovoltaic cell and the diode 108 with a lower resistance. In addition, if an "L"-shaped conductive component is needed to achieve the electrical connection of two photovoltaic cells and the diode, two "L"-shaped conductive components need to be welded together, which not only increases an additional welding process, but also affects the resistance of the whole formed by the two "L"-shaped conductive components due to potential factors such as false welding, and cannot achieve the electrical connection between the photovoltaic cell and the diode 108 with a lower resistance like the "ji"-shaped jumper 103.

[0100] It should be noted that, in order to distinguish the first segment 111 and the second segment 121 in the initial jumper 101, and the jumper 103 is obtained after the initial jumper 101 is bent, the jumper 103 can also be regarded as including the first segment 111 and the second segment 121 which is at least partially bent, based on which, Figures 6 to 11 In the above figures, the first segment 111 and the second segment 121 are schematically shown in different drawing manners.

[0101] In some embodiments, in combination with reference to Figure 10 、 Figure 11 and Figure 4 , at least one of the first adhesive film 102, the second adhesive film 120, the third adhesive film 105, the fourth adhesive film 106 and the adhesive strip 107 can be an organic encapsulation adhesive film such as a polyvinyl butyral (PVB) adhesive film, an ethylene-vinyl acetate copolymer (EVA) adhesive film, a polyethylene octene copolymer elastomer (POE) adhesive film or a polyethylene terephthalate (PET) adhesive film; or, at least one of the first adhesive film 102, the second adhesive film 120, the third adhesive film 105, the fourth adhesive film 106 and the adhesive strip 107 can also be an EP adhesive film, an EPE adhesive film or a PVP adhesive film. The first adhesive film 102, the second adhesive film 120, the third adhesive film 105, the fourth adhesive film 106 and the adhesive strip 107 differ in that the degree of pre-crosslinking can be different.

[0102] The EP adhesive film refers to a co-extrusion adhesive film composed of the EVA adhesive film and the POE adhesive film which are arranged in layers, the EPE adhesive film refers to a co-extrusion adhesive film formed by sequentially arranging the EVA adhesive film + the POE adhesive film + the EVA adhesive film, and the PVP adhesive film refers to a co-extrusion adhesive film formed by sequentially arranging the POE adhesive film + the EVA adhesive film + the POE adhesive film. The co-extrusion adhesive film can be prepared by extruding one or more raw materials onto another adhesive film which has been prepared, or by bonding different kinds of adhesive films to each other during the adhesive film processing.

[0103] In some cases, at least the second adhesive film 120 and the third adhesive film 105 have a boundary line before the lamination process, and the boundary line between the second adhesive film 120 and the third adhesive film 105 in the laminated photovoltaic module formed after the lamination process can no longer be obvious, i.e., the second adhesive film 120 and the third adhesive film 105 have been formed into an integral encapsulation adhesive film.

[0104] In some embodiments, in combination with reference to Figure 4 , at least one of the back plate 110 and the cover plate 109 can be a glass cover plate, a plastic cover plate or the like cover plate having a light transmission function.

[0105] In some cases, the surface of at least one of the back plate 110 and the cover plate 109 facing the photovoltaic cell can be a concave-convex surface, thereby increasing the utilization rate of incident light.

[0106] In summary, before the initial jumper 101 is bent into the jumper 103, the first adhesive film 102 is bonded in advance on the side of the second section 121 close to the carrier plate 100, so that when the at least part of the second section 121 of the initial jumper 101 is subsequently bent, at least part of the first adhesive film 102 is also bent, thereby facilitating the reduction of the size of the gap 104 generated inside the jumper 103 after bending. Moreover, in the subsequent step of lamination processing, the flowability of the first adhesive film 102 is enhanced, prompting the first adhesive film 102 to fill the gap 104 with a smaller size. This not only reduces the time required to fill the gap 104, but also greatly reduces the risk of bubbles being formed after the first adhesive film 102 fills the gap 104, i.e., bubbles are less likely to be formed at the jumper 103, thereby greatly improving the yield of the photovoltaic module.

[0107] Another embodiment of the present disclosure also provides a photovoltaic module formed by the method for manufacturing a photovoltaic module provided by the foregoing embodiments. The photovoltaic module provided by another embodiment of the present disclosure will be described in detail below in combination with the accompanying drawings. It should be noted that the same or corresponding parts as the foregoing embodiments will not be described herein.

[0108] Reference Figure 4 The photovoltaic module includes the photovoltaic module formed by the method for manufacturing a photovoltaic module provided by the foregoing embodiments.

[0109] Those skilled in the art can understand that the above-mentioned embodiments are specific embodiments for implementing the present disclosure, and in actual applications, various changes can be made in form and details without departing from the spirit and scope of the embodiments of the present disclosure. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of the present disclosure, and therefore the protection scope of the embodiments of the present disclosure should be subject to the scope defined by the claims.

Claims

1. A method for manufacturing a photovoltaic module, characterized in that, include: Provide carrier board; An initial jumper wire extending in a first direction is provided on the carrier board, the initial jumper wire comprising at least two first segments and a second segment located between the two first segments; The first adhesive film is adhered to at least one side of the second segment near the carrier plate; The second segment and the first adhesive film are bent along the second direction to bend the initial jumper wire into a jumper wire, and at least a portion of the second segment is bent into a lead-out segment protruding along the second direction, wherein the first direction and the second direction intersect; wherein the lead-out segment has a gap inside in the first direction, and the gap accommodates at least a portion of the first adhesive film; A lamination process is performed to improve the fluidity of the first adhesive film, thereby enabling the first adhesive film to fill the gap.

2. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The carrier board includes a back plate and a second adhesive film stacked along the second direction, the jumper is located on the side of the second adhesive film away from the back plate, and a portion of the first adhesive film is located between the jumper and the second adhesive film; Wherein, the pre-crosslinking degree of the second adhesive film is greater than that of the first adhesive film; in the lamination process, the second adhesive film compresses the first adhesive film, causing more of the first adhesive film to flow into the gap, so that the gap is filled.

3. The method for manufacturing a photovoltaic module according to claim 2, characterized in that, After the bending process and before the lamination process, the following steps are also included: A third adhesive film is provided at least on the side of the jumper away from the carrier plate, and the pre-crosslinking degree of the second adhesive film is greater than that of the third adhesive film.

4. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The carrier board includes a back plate and a second adhesive film stacked along the second direction, and the jumper is located on the side of the second adhesive film away from the back plate; Wherein, the pre-crosslinking degree of the second adhesive film is less than or equal to the pre-crosslinking degree of the first adhesive film; in the lamination process, the backing plate compresses the second adhesive film, causing a portion of the second adhesive film to flow into the gap, thereby filling the gap.

5. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The first adhesive film is adhered to both the first and second segments on the side closest to the carrier plate, or the first adhesive film is adhered only to the side of the second segment closest to the carrier plate.

6. The method for manufacturing a photovoltaic module according to claim 5, characterized in that, The portion of the lead-out section and the jumper wire excluding the lead-out section forms a bend at the connection point, and the initial jumper wire has a bend-to-bend portion corresponding to the bend-out portion; Before performing the bending process, the method further includes: bonding a fourth adhesive film to the side of the part to be bent away from the carrier plate; In this embodiment, a single lead-out segment corresponds to two fourth adhesive films, and along the first direction, the distance between two fourth adhesive films corresponding to the same lead-out segment is less than the length of the second segment.

7. The method for manufacturing a photovoltaic module according to claim 5 or 6, characterized in that, The lead-out section has an opening near the bottom of the carrier plate. After the bending process and before the lamination process, the method further includes: inserting an adhesive strip into the opening along the second direction; or, The carrier plate includes a back plate and a second adhesive film stacked along the second direction. The jumper is located on the side of the second adhesive film away from the back plate. The side of the second adhesive film facing the jumper has an extrusion area corresponding to the lead-out section. After the bending process is performed and before the lamination process is performed, the plate further includes: setting the adhesive strip on the extrusion area, and causing the adhesive strip to be extruded from the opening into the gap during the lamination process.

8. The method for manufacturing a photovoltaic module according to claim 7, characterized in that, Before the bending process, the thickness of the first adhesive film along its extension direction is a first thickness; before the lamination process, the thickness of the adhesive strip along its extension direction is a second thickness, the second thickness being greater than or equal to the first thickness.

9. The method for manufacturing a photovoltaic module according to claim 8, characterized in that, The second thickness is 0.05mm to 1mm; and / or, the first thickness is 0.05mm to 0.8mm.

10. The method for manufacturing a photovoltaic module according to claim 7, characterized in that, Along the second direction, the extension length of the adhesive strip is 3mm to 16mm.

11. The method for manufacturing a photovoltaic module according to claim 5 or 6, characterized in that, After the bending process and before the lamination process, the following steps are also included: A third adhesive film is provided on at least one side of the jumper away from the carrier plate. The third adhesive film has a first surface and a second surface opposite to each other along the second direction. At least one of the first surface and the second surface has a pressure area corresponding to the lead-out section. A protrusion is provided on the pressing area, the material of the protrusion being the same as that of the first adhesive film or the third adhesive film, and at least a portion of the protrusion is pressed into the gap during the lamination process.

12. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, Along the second direction, the length of the lead-out section is 15mm to 23mm.

13. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The second segment is partially bent into a lead-out segment that protrudes along the second direction. The remaining second segment includes two extension segments located at both ends of the lead-out segment. The length of the extension segments along the first direction is 5mm to 15mm.

14. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The lead-out section has a top end that is away from the carrier plate; the method for manufacturing the photovoltaic module further includes: A diode is provided, the diode having terminals for electrical connection; The top end is soldered to the terminal.

15. A photovoltaic module, characterized in that, The photovoltaic module includes those manufactured by the method of manufacturing a photovoltaic module according to any one of claims 1 to 14.

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