A milling apparatus for heat dissipating electronic components

Abstract

The application belongs to the technical field of fin milling equipment, in particular to a kind of milling equipment for heat dissipation electronic component, including fixed assembly, milling cutter and cooling conduit, heat dissipation component is placed on fixed assembly, fixed assembly includes placement block and two limit components installed in opposite position above placement block, two L-shaped clamping strips are symmetrically fed and installed on the both sides of placement block, through the structure of telescopic, moving blocking plate moves towards the direction of through groove, until through groove is blocked, that is, the position of the recess between fins, which is blocked by the whole blocking piece, can leak cooling liquid, so that the recess between fins can accumulate cooling liquid, and then assist cooling for milling cutter, in this case, the spraying amount of cooling conduit can be appropriately reduced, and then resource waste is reduced, when milling cutter needs to pass through a group of through grooves, moving blocking plate will be moved inside moving groove again, to avoid affecting milling of milling cutter.

Description

Technical Field

[0001] This invention belongs to the field of heat sink milling equipment, specifically a milling equipment for heat dissipation electronic components. Background Technology

[0002] Milling is usually required when machining electronic components with high dimensional accuracy or complex structures. When machining aluminum or copper alloy blocks into heat sinks, milling technology is required due to the fin structure of the heat sink and the need to maximize the surface area. The milling tool is used to machine grooves between the fins on the aluminum or copper alloy block by moving the milling tool back and forth on the aluminum or copper alloy block to form grooves.

[0003] In traditional techniques, a high-speed rotating milling cutter is used to machine interfinal grooves on an aluminum or copper alloy block. Combined with the multi-axis movement of the aluminum or copper alloy block, multiple interfinal grooves are machined, thus completing the heat sink machining. During this process, a large amount of coolant is sprayed onto the milling cutter to cool it. The sprayed coolant acts on the milling cutter, initially flowing into the narrow and deep interfinal grooves before continuing to flow. The milling cutter needs to make two or more cuts within the grooves to effectively remove material and achieve precise dimensions and surface roughness. However, traditional techniques do not effectively retain coolant within the interfinal grooves before and during milling to provide auxiliary cooling for the milling cutter. This results in a large flow rate of coolant sprayed onto the milling cutter, leading to resource waste.

[0004] Therefore, the present invention provides a milling machine for heat dissipation electronic components to solve the problems mentioned in the background art. Summary of the Invention

[0005] The technical solution adopted by the present invention to solve its technical problem is as follows: The present invention provides a milling device for heat dissipation electronic components, including a device frame and a milling cutter and a cooling conduit installed below the end of the device frame. The lower end of the cooling conduit faces the milling position of the milling cutter. A multi-axis moving platform is installed on one side of the lower part of the device frame. A fixing component is fixedly installed above the multi-axis moving platform. A heat dissipation element is placed on the fixing component. The multi-axis moving platform drives the fixing component and the heat dissipation element to perform multi-axis movement in conjunction with the high-speed rotating milling cutter to mill the heat dissipation fins.

[0006] The fixing component includes a placement block and two limiting components installed on opposite positions above the placement block. Two L-shaped clamping strips are symmetrically fed to both sides of the placement block. The two L-shaped clamping strips are synchronously and symmetrically fed around the heat dissipation element. A blocking component is slidably installed above the L-shaped clamping strips.

[0007] The barrier includes a fixed barrier plate and a through groove and a movable groove formed inside the fixed barrier plate, wherein a movable barrier plate is slidably installed inside the movable groove.

[0008] Preferably, the equipment frame includes a base connected to the bottom of the multi-axis moving platform and a lifting frame that is lifted and mounted above the base, with the milling cutter and cooling conduit mounted below the end of the lifting frame.

[0009] Preferably, the placement block has strip-shaped grooves on both sides, the ends of the two L-shaped clamps are located inside the strip-shaped grooves, and the horizontal height of the barrier is greater than the horizontal height of the heat dissipation element.

[0010] Preferably, the limiting component includes a fixing strip fixedly installed above the placement block and a displacement strip movably installed above the placement block, with a telescopic member installed between the displacement strip and the fixing strip.

[0011] Preferably, the placement block has a strip-shaped mounting groove inside, and the two L-shaped clamps are slidably installed inside the strip-shaped mounting groove. A pushing component is installed inside the strip-shaped mounting groove, and the two L-shaped clamps are synchronously and symmetrically fed around the heat dissipation element under the action of the pushing component.

[0012] Preferably, the pushing component is an electrically driven telescopic structure. When the pushing component is activated, the two L-shaped clamps and the barrier are synchronously and symmetrically fed around the heat dissipation element.

[0013] Preferably, driving blocks are fixedly installed on both sides of the L-shaped clamping strip, and a displacement groove is provided on the upper part of the L-shaped clamping strip. The blocking member slides under the pushing action of the driving blocks through the cooperation of the displacement groove.

[0014] Preferably, the displacement groove includes a sliding groove formed above the L-shaped clamp and the drive block, and a component groove formed inside the L-shaped clamp. The sliding groove and the component groove are connected, and the barrier is slidably installed above the L-shaped clamp through the sliding groove and the component groove.

[0015] Preferably, a movable strip and a pushing strip are fixedly installed below the fixed barrier plate. The movable strip is slidably installed inside the sliding groove, and the pushing strip is slidably installed inside the component groove. The height of the fixed barrier plate is greater than the height of the heat sink fins. The movable barrier plate moves inside the fixed barrier plate through a telescopic electric structure inside the fixed barrier plate.

[0016] Preferably, a telescopic motor is installed inside the drive block, and a multi-stage telescopic rod is installed at the end of the telescopic motor facing the push bar, and the multi-stage telescopic rod is connected to the side of the push bar.

[0017] The beneficial effects of this invention are as follows:

[0018] 1. The milling equipment for heat dissipation electronic components described in this invention uses a telescopic structure to move a movable baffle plate toward the through slot until the through slot is blocked. That is, the entire baffle seals the two ends of the groove between the fins where coolant would leak, allowing coolant to accumulate inside the groove between the fins, thereby providing auxiliary cooling for the milling tool. In this case, the amount of spray from the cooling pipe can be reduced appropriately, thereby reducing resource waste. When the milling tool needs to pass through a certain through slot, the movable baffle plate will move back into the movable slot to avoid affecting the milling of the milling tool.

[0019] 2. The milling equipment for heat dissipation electronic components described in this invention allows two blocking members to move while the milling cutter continues to mill other fin grooves. This ensures that the two through slots can continuously accumulate coolant inside the groove where the milling cutter is located. Furthermore, when the blocking members are in operation, the grooves between the first two fins that have just been milled are also blocked, allowing coolant to continue cooling the newly milled grooves. This improves the processing quality of the heat sink. In this way, the coolant can be fully utilized, and the coolant flow rate in the cooling pipes can be reduced, thus reducing resource consumption. Attached Figure Description

[0020] The invention will now be further described with reference to the accompanying drawings.

[0021] Figure 1 This is a perspective view of the entire invention;

[0022] Figure 2 This is a three-dimensional schematic diagram of the equipment rack in this invention;

[0023] Figure 3 This is a three-dimensional schematic diagram of the fixing component in this invention;

[0024] Figure 4 This is a three-dimensional schematic diagram of the limiting component in this invention;

[0025] Figure 5 This is a three-dimensional schematic diagram of the displacement groove in this invention;

[0026] Figure 6 This is a three-dimensional schematic diagram of the L-shaped clamping strip in this invention;

[0027] Figure 7 This is a three-dimensional schematic diagram of the barrier component in this invention.

[0028] In the diagram: 1. Equipment frame; 11. Base; 12. Lifting frame; 2. Milling cutter; 3. Cooling duct; 4. Heat dissipation element; 5. Fixing component; 51. Placement block; 511. Pushing component; 512. Strip mounting groove; 52. Strip groove; 53. Limiting component; 531. Fixing strip; 532. Displacement strip; 533. Telescopic component; 54. L-shaped clamping strip; 541. Drive block; 5411. Telescopic motor; 5412. Multi-stage telescopic rod; 542. Displacement groove; 5421. Sliding groove; 5422. Component groove; 55. Barrier component; 551. Fixed barrier plate; 552. Through groove; 553. Moving groove; 554. Moving barrier plate; 555. Moving strip; 556. Pushing strip; 6. Multi-axis moving platform. Detailed Implementation

[0029] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0030] Example 1: As Figures 1-7 As shown, a milling device for heat dissipation electronic components according to an embodiment of the present invention includes a device frame 1 and a milling cutter 2 and a cooling conduit 3 installed below the end of the device frame 1. The lower end of the cooling conduit 3 faces the milling position of the milling cutter 2. A multi-axis moving platform 6 is installed on the lower side of the device frame 1. A fixing component 5 is fixedly installed on the upper part of the multi-axis moving platform 6. A heat dissipation element 4 is placed on the fixing component 5. The multi-axis moving platform 6 drives the fixing component 5 and the heat dissipation element 4 to perform multi-axis movement in conjunction with the high-speed rotating milling cutter 2 to mill the heat dissipation fins.

[0031] The fixing component 5 includes a placement block 51 and two limiting components 53 installed on opposite positions above the placement block 51. Two L-shaped clamping strips 54 are symmetrically fed to both sides of the placement block 51. The two L-shaped clamping strips 54 are synchronously and symmetrically fed around the heat dissipation element 4. A blocking member 55 is slidably installed above the L-shaped clamping strips 54.

[0032] The barrier 55 includes a fixed barrier plate 551 and a through groove 552 and a movable groove 553 formed inside the fixed barrier plate 551. A movable barrier plate 554 is slidably installed inside the movable groove 553.

[0033] Specifically, the heat dissipation element 4 is placed above the fixing component 5. First, two L-shaped clamping strips 54 are fed synchronously and symmetrically, approaching each other at the same speed, thus initially fixing the heat dissipation element 4 above the placement block 51 and determining its lateral position. Then, two limiting components 53 are used to push the heat dissipation element 4 to the center position of the two limiting components 53, fixing the relative position of the heat dissipation element 4 and the placement block 51, thus determining the position of the heat dissipation element 4. At this point, the upper sides of the two L-shaped clamping strips 54 contact the lower sides of the heat dissipation element 4, and the highest height of the L-shaped clamping strips 54 is less than the horizontal height of the lowest point of the groove between the fins. The barrier 55 does not contact the position of the heat dissipation element 4 to be processed. The height of the barrier 55 is the same as the height of the interfin groove to be machined on the heat sink 4. The electrically driven multi-axis moving platform 6 drives the fixed component 5 and the heat sink 4 to move in multiple axes, so that the high-speed rotating milling cutter 2 can mill the interfin groove inside the heat sink 4. At this time, the cooling conduit 3 sprays a large amount of coolant to cool the milling cutter 2 during machining. When the milling cutter 2 mills out one interfin groove, it needs to make two or more cuts back and forth inside the same interfin groove, which can more effectively remove material and achieve precise dimensions and roughness. In the conventional technology, when the interfin groove is initially milled, the coolant sprayed by the cooling conduit 3 will flow into the interfin groove and then continue to flow to the outside of the heat sink 4. After milling the groove, the multi-axis moving platform 6 needs to move the heat dissipation element 4, allowing the milling cutter 2 to make two or more cuts back and forth within the groove between the fins. In traditional technology, it is difficult to retain the coolant flowing into the groove between the fins, ensuring that coolant is always present in the narrow and deep groove, thus providing auxiliary cooling for the milling cutter 2 inside the groove and reducing the flow rate of coolant sprayed by the cooling pipe 3. However, in this device, when milling is required, the two baffles 55 are first slid to the side of the heat dissipation element 4. At this time, the baffles 55 are higher than the heat dissipation element 4, and the moving baffle 554 is inside the moving groove 553. The high-speed rotating milling cutter 2 passes through the corresponding through groove 552 to mill the heat dissipation element 4. During milling, when the milling cutter 2 passes through the two through slots 552, a fin groove on the heat dissipation element 4 is initially milled. At this time, the coolant sprayed from the cooling conduit 3 flows into this fin groove. As the heat dissipation element 4 moves, the milling cutter 2 enters the fin groove again through another through slot 552 and moves back and forth. When the milling cutter 2 initially enters the fin groove, the telescopic structure moves the movable baffle 554 toward the through slot 552 until it blocks the through slot 552. That is, the entire baffle 55 seals the two ends of this fin groove where coolant might leak, allowing coolant to accumulate inside the fin groove, thereby providing auxiliary cooling for the milling cutter 2.In this scenario, the spray volume of the cooling duct 3 can be appropriately reduced, thereby minimizing resource waste. When the milling cutter 2 needs to pass through a set of through slots 552, the movable baffle 554 will reposition itself within the movable slot 553 to avoid affecting the milling of the milling cutter 2. As the milling cutter 2 continues to mill other inter-fin grooves, the two baffles 55 can move, ensuring that the two through slots 552 continuously accumulate coolant within the groove where the milling cutter 2 is located. Furthermore, when the baffles 55 are in operation, the first two inter-fin grooves that have just been milled are also blocked, allowing coolant to continue cooling the newly milled grooves, thus improving the processing quality of the heat sink. This method fully utilizes the coolant and reduces the coolant flow rate of the cooling duct 3, thereby reducing resource consumption.

[0034] like Figures 2-6 As shown, the equipment frame 1 includes a base 11 connected to the bottom of the multi-axis moving platform 6 and a lifting frame 12 that is lifted and mounted above the base 11. The milling cutter 2 and the cooling conduit 3 are mounted below the end of the lifting frame 12.

[0035] The placement block 51 has strip-shaped grooves 52 on both sides, and the ends of the two L-shaped clamps 54 are located inside the strip-shaped grooves 52. The horizontal height of the barrier 55 is greater than the horizontal height of the heat dissipation element 4.

[0036] The limiting component 53 includes a fixing strip 531 fixedly installed above the placement block 51 and a displacement strip 532 movably installed above the placement block 51. A telescopic member 533 is installed between the displacement strip 532 and the fixing strip 531.

[0037] The placement block 51 has a strip-shaped mounting groove 512 inside. Two L-shaped clamping bars 54 are slidably installed inside the strip-shaped mounting groove 512. A pushing component 511 is installed inside the strip-shaped mounting groove 512. Under the action of the pushing component 511, the two L-shaped clamping bars 54 are synchronously and symmetrically fed around the heat dissipation element 4.

[0038] The push assembly 511 is an electrically driven telescopic structure. When the push assembly 511 is started, the two L-shaped clamps 54 and the barrier 55 perform synchronous and symmetrical feeding work with the heat dissipation element 4 as the center.

[0039] Specifically, the lifting frame 12 can be raised and lowered inside the base 11 to change the horizontal height of the milling cutter 2 and the cooling conduit 3, in order to cooperate with the subsequent milling. When the heat dissipation element 4 is placed above the placement block 51, the two L-shaped clamping bars 54 move towards each other at the same speed by the drive of the pushing component 511, thereby clamping the heat dissipation element 4 and driving it to move, thus determining the lateral position of the heat dissipation element 4. Then, under the action of the two telescopic members 533, the two displacement bars 532 move towards each other at the same speed to push the heat dissipation element 4, thereby determining the vertical position of the heat dissipation element 4. At this time, the relative position of the heat dissipation element 4 and the placement block 51 is accurately determined.

[0040] like Figure 5 and Figure 7 As shown, drive blocks 541 are fixedly installed on both sides of the L-shaped clamping bar 54, and a displacement groove 542 is provided on the top of the L-shaped clamping bar 54. The blocking member 55 slides under the pushing action of the drive blocks 541 through the cooperation of the displacement groove 542.

[0041] The displacement groove 542 includes a sliding groove 5421 formed above the L-shaped clamp 54 and the drive block 541, and a component groove 5422 formed inside the L-shaped clamp 54. The sliding groove 5421 and the component groove 5422 are connected. The barrier 55 is slidably installed above the L-shaped clamp 54 through the sliding groove 5421 and the component groove 5422.

[0042] A movable strip 555 and a pusher strip 556 are fixedly installed below the fixed barrier plate 551. The movable strip 555 is slidably installed inside the sliding groove 5421, and the pusher strip 556 is slidably installed inside the component groove 5422. The height of the fixed barrier plate 551 is greater than the height of the heat sink fins. The movable barrier plate 554 moves inside the fixed barrier plate 551 through a telescopic electric structure inside the fixed barrier plate 551.

[0043] The drive block 541 is equipped with a telescopic motor 5411. A multi-stage telescopic rod 5412 is installed at the end of the telescopic motor 5411 facing the push bar 556. The multi-stage telescopic rod 5412 is connected to the side of the push bar 556.

[0044] Specifically, when the barrier 55 needs to slide above the L-shaped clamping bar 54, it is driven by two axially opposed telescopic motors 5411, which extend one set of multi-stage telescopic rods 5412 on both sides of the push bar 556, while the other set of multi-stage telescopic rods 5412 retracts, thereby completing the step of moving the barrier 55. Whenever the multi-axis moving platform 6 drives the heat dissipation element 4 to move, allowing the milling cutter 2 to mill the next set of grooves between fins, the two barrier 55 also move the same distance, always ensuring that the milling cutter 2 is within the distance between the two through slots 552.

[0045] Working principle: The heat dissipation element 4 is placed above the fixing component 5. First, two L-shaped clamping bars 54 are fed synchronously and symmetrically, approaching each other at the same speed, thus initially fixing the heat dissipation element 4 above the placement block 51 and determining its lateral position. Then, two limiting components 53 are set to push the heat dissipation element 4 to the center position of the two limiting components 53, thus fixing the relative position of the heat dissipation element 4 and the placement block 51, thereby determining the position of the heat dissipation element 4. When milling is required, the two blocking members 55 are first slid onto the heat dissipation element 4. From the side, the barrier 55 is higher than the heat dissipation element 4, and the movable barrier 554 is inside the movable slot 553. The high-speed rotating milling cutter 2 passes through the corresponding through slot 552 to mill the heat dissipation element 4. When the milling cutter 2 passes through two through slots 552, a fin groove on the heat dissipation element 4 is initially milled. At this time, the coolant sprayed from the cooling pipe 3 flows into this set of fin grooves. As the heat dissipation element 4 moves, the milling cutter 2 passes through another through slot 552 and enters this set of fin grooves again to make back-and-forth cuts. When the milling cutter 2... Upon initial entry into the fin groove, the telescopic structure moves the movable baffle 554 toward the through groove 552 until it blocks the through groove 552. This means the entire baffle 55 seals off the locations where coolant might leak from either end of the fin groove, allowing coolant to accumulate inside and thus provide auxiliary cooling for the milling cutter 2. In this case, the spray volume of the cooling duct 3 can be reduced, minimizing resource waste. When the milling cutter 2 needs to pass through a certain through groove 552, the movable baffle 554 will reposition itself within the movable groove 553 to avoid interfering with the milling process. As the milling tool 2 continues to mill other fin grooves, the two blocking members 55 can move, so that the two through slots 552 can continuously accumulate coolant inside the groove where the milling tool 2 is located. When the blocking member 55 blocks, the groove between the first two fins that have just been milled is also blocked by the blocking member 55, so that the coolant inside can continue to cool the groove that has just been milled, thereby improving the processing quality of the heat sink. In this way, the coolant can be fully utilized and the coolant flow rate of the cooling pipe 3 can be reduced, thus reducing resource consumption.

[0046] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A milling machine for heat dissipation electronic components, comprising a machine frame (1) and a milling cutter (2) and a cooling conduit (3) mounted below the end of the machine frame (1), the lower end of the cooling conduit (3) facing the milling position of the milling cutter (2), and a multi-axis moving platform (6) mounted on one side below the machine frame (1), characterized in that: A fixed component (5) is fixedly installed above the multi-axis moving platform (6), and a heat dissipation element (4) is placed on the fixed component (5). The multi-axis moving platform (6) drives the fixed component (5) and the heat dissipation element (4) to move in multiple axes in coordination with a high-speed rotating milling cutter (2) to mill the heat dissipation fins. The fixing component (5) includes a placement block (51) and two limiting components (53) installed on opposite positions above the placement block (51). Two L-shaped clamps (54) are symmetrically fed to both sides of the placement block (51). The two L-shaped clamps (54) are synchronously fed symmetrically with the heat dissipation element (4) as the center. A barrier (55) is slidably installed above the L-shaped clamps (54). The barrier (55) includes a fixed barrier plate (551) and a through groove (552) and a movable groove (553) formed inside the fixed barrier plate (551), wherein a movable barrier plate (554) is slidably installed inside the movable groove (553). Drive blocks (541) are fixedly installed on both sides of the L-shaped clamp (54), and a displacement groove (542) is provided on the top of the L-shaped clamp (54). The barrier (55) slides under the pushing action of the drive block (541) through the cooperation of the displacement groove (542). The displacement groove (542) includes a sliding groove (5421) formed above the L-shaped clamp (54) and the drive block (541) and a component groove (5422) formed inside the L-shaped clamp (54). The sliding groove (5421) and the component groove (5422) are connected. The barrier (55) is slidably installed above the L-shaped clamp (54) through the sliding groove (5421) and the component groove (5422). A movable strip (555) and a pusher strip (556) are fixedly installed below the fixed barrier plate (551). The movable strip (555) is slidably installed inside the sliding groove (5421), and the pusher strip (556) is slidably installed inside the component groove (5422). The height of the fixed barrier plate (551) is greater than the height of the heat sink fins. The movable barrier plate (554) moves inside the fixed barrier plate (551) through a telescopic electric structure inside the fixed barrier plate (551). The high-speed rotating milling cutter (2) mills the heat dissipation element 4 through the corresponding through groove (552). When the milling cutter (2) passes through the two through grooves (552), a fin groove on the heat dissipation element (4) is initially milled. When the milling cutter (2) initially enters the fin groove, the telescopic structure moves the movable baffle (554) toward the through groove (552) until the through groove (552) is blocked. That is, the entire baffle (55) seals the position where coolant would leak at both ends of this set of fin grooves.

2. The milling equipment for heat-dissipating electronic components according to claim 1, characterized in that: The equipment frame (1) includes a base (11) connected to the bottom of the multi-axis moving platform (6) and a lifting frame (12) mounted on the base (11). The milling cutter (2) and the cooling conduit (3) are mounted below the end of the lifting frame (12).

3. The milling equipment for heat-dissipating electronic components according to claim 1, characterized in that: The placement block (51) has strip grooves (52) on both sides, and the ends of the two L-shaped clamps (54) are located inside the strip grooves (52). The horizontal height of the barrier (55) is greater than the horizontal height of the heat dissipation element (4).

4. The milling equipment for heat-dissipating electronic components according to claim 1, characterized in that: The limiting component (53) includes a fixing strip (531) fixedly installed above the placement block (51) and a displacement strip (532) movably installed above the placement block (51), with a telescopic member (533) installed between the displacement strip (532) and the fixing strip (531).

5. A milling machine for heat-dissipating electronic components according to claim 1, characterized in that: The placement block (51) has a strip-shaped mounting groove (512) inside. The two L-shaped clamps (54) are slidably installed inside the strip-shaped mounting groove (512). A pushing component (511) is installed inside the strip-shaped mounting groove (512). The two L-shaped clamps (54) are synchronously and symmetrically fed around the heat dissipation element (4) under the action of the pushing component (511).

6. A milling machine for heat-dissipating electronic components according to claim 5, characterized in that: The pushing component (511) is an electrically driven telescopic structure. When the pushing component (511) is started, the two L-shaped clamps (54) and the barrier (55) perform synchronous symmetrical feeding with the heat dissipation element (4) as the center.

7. A milling machine for heat-dissipating electronic components according to claim 1, characterized in that: The drive block (541) is equipped with a telescopic motor (5411). The telescopic motor (5411) has a multi-stage telescopic rod (5412) installed at one end facing the push bar (556). The multi-stage telescopic rod (5412) is connected to the side of the push bar (556).

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