Polishing equipment and polishing method

Abstract

The invention discloses grinding equipment and a grinding method, and belongs to the technical field of sole processing, the grinding equipment comprises a base, at least two sets of grinding mechanisms, a top frame, at least two sets of carrying mechanisms and a turnover mechanism, and the base is provided with a first carrying table and a second carrying table; the grinding mechanisms are arranged on the base, the first carrying table is arranged at the output port of the adjacent part of the grinding mechanisms, and the second carrying table is arranged at the input port of the adjacent other part of the grinding mechanisms. The top frame is arranged on the base; the carrying mechanisms are arranged on the top frame, part of the carrying mechanisms are used for driving shoe insole raw materials to pass through part of the grinding mechanisms, and the rest of the carrying mechanisms are used for driving the shoe insole raw materials to pass through the rest of the grinding mechanisms. The overturning mechanism is arranged on the base and used for overturning the shoe insole raw materials on the first carrying table and placing the shoe insole raw materials on the second carrying table. According to the technical scheme, the polishing speed of the shoe insole raw material is increased, and the polishing time of a single shoe insole raw material is shortened.

Description

Technical Field

[0001] This application relates to the field of shoe sole processing technology, and in particular to a polishing device and polishing method. Background Technology

[0002] Shoe soles are generally composed of materials such as the outsole, midsole, and heel. Among them, the raw materials for the midsole need to undergo multiple processing steps to become the consumables used to assemble the shoe sole.

[0003] Existing shoe midsole materials typically have an outer layer, which needs to be removed during production. Furthermore, it's difficult to maintain a perfectly smooth surface during manufacturing. To ensure the quality of the sole, the cut midsole material requires peeling and sanding. However, both sides of the midsole material need sanding, and current sanding equipment cannot complete both sides in a single process. This affects the sanding speed, increases the sanding time per piece of midsole material, and is gradually failing to meet usage requirements. Summary of the Invention

[0004] This application provides a grinding device and grinding method, which aims to increase the grinding speed of shoe midsole materials and shorten the grinding time of a single shoe midsole material.

[0005] To achieve the above objectives, according to a first aspect of this application, a polishing apparatus is provided, comprising: A base, on which a first platform and a second platform are provided; At least two grinding mechanisms are provided, the grinding mechanisms are mounted on the base, the first platform is mounted at the output port of part of the grinding mechanisms, and the second platform is mounted at the input port of the remaining grinding mechanisms. A top frame, which is mounted on the base; At least two sets of conveying mechanisms are provided, which are mounted on the top frame. Some of the conveying mechanisms are used to carry the shoe midsole material through some of the polishing mechanisms, and the remaining conveying mechanisms are used to carry the shoe midsole material through the remaining polishing mechanisms. A flipping mechanism is disposed on the base and is used to flip the shoe midsole material on the first platform and place it on the second platform.

[0006] Optionally, the flipping mechanism includes a first support, which is configured to move on a base on one side of the first platform and the second platform. The first support is provided with a first telescopic member, and the output end of the first telescopic member is provided with a rotating member. The output end of the rotating member is provided with a clamping member, which is used to clamp the shoe midsole material on the first platform.

[0007] Optionally, the output end of the clamping member is equipped with a gripper, and both the first platform and the second platform are provided with gripper grooves for the gripper to pass through.

[0008] Optionally, the polishing mechanism includes a chamber, a polishing assembly is provided inside the chamber, and hatches are provided at both ends of the chamber, which serve as the input and output ports of the polishing mechanism, respectively. Movable door assemblies are provided at both ends of the chamber.

[0009] Optionally, a clearance passage is provided on the top of the cabin, the clearance passage connects the hatches at both ends of the cabin, the clearance passage is used to allow the transport mechanism to pass through the cabin, and elastic isolation members are provided on both sides of the clearance passage.

[0010] Optionally, the polishing equipment further includes a dust collection component, which includes a dust collection seat and a dust collection pipe. The dust collection seat is disposed in the chamber, and the bottom of the dust collection seat is connected to the dust collection pipe.

[0011] Optionally, the cabin is equipped with an air knife assembly, which is used to remove debris from the surface of the shoe midsole material after it has been polished by the polishing assembly.

[0012] Optionally, the conveying mechanism includes a second support, which is configured to move along the top frame. A lifting assembly is provided on the second support, and a conveying arm is provided at the output end of the lifting assembly. A positioning assembly is provided at the end of the conveying arm, and the positioning assembly is used to fix the shoe midsole material.

[0013] Optionally, a receiving arm is provided between the transport arm and the positioning component, and the thickness of the receiving arm is less than the thickness of the transport arm.

[0014] Optionally, the base is further provided with a feeding platform and a discharging platform. The feeding platform is used to place the shoe midsole raw material to be polished. Part of the conveying mechanism can transport the unpolished shoe midsole raw material on the feeding platform to part of the polishing mechanism for polishing. The discharging platform is used to place the polished shoe midsole raw material.

[0015] According to a second aspect of this application, a polishing method is provided, utilizing the aforementioned polishing equipment, comprising: The conveying mechanism partially drives the shoe midsole material through the polishing mechanism partially to polish one side of the shoe midsole material; The shoe midsole material, after one side has been polished, is placed on the first platform via part of the conveying mechanism; The shoe midsole material on the first platform is clamped and flipped by the flipping mechanism, and the flipped shoe midsole material is placed on the second platform. The remaining part of the conveying mechanism drives the shoe midsole material on the second platform through the remaining part of the polishing mechanism to polish the other side of the shoe midsole material.

[0016] In the polishing equipment of this application embodiment, through the above technical solution, the shoe midsole material can be driven by the conveying mechanism to pass through the polishing mechanism on one side of the top frame to perform peeling and polishing on one side of the shoe midsole material, and the polished shoe midsole material can be placed on the first platform. The flipping mechanism can flip the shoe midsole material on the first platform to the second platform, and the conveying mechanism can then drive the shoe midsole material through the polishing mechanism on the other side of the top frame, providing conditions for peeling and polishing the other side of the shoe midsole material. This allows the polishing equipment to achieve double-sided polishing of the shoe midsole material in one polishing process, increasing the polishing speed of the shoe midsole material, shortening the polishing time of a single piece of shoe midsole material, meeting the polishing needs of shoe midsole materials, and improving the applicability of the polishing equipment.

[0017] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0019] Figure 1 This is a first-view structural schematic diagram of the grinding equipment provided in an exemplary embodiment of this disclosure; Figure 2 yes Figure 1 A second-view structural schematic diagram of the provided grinding equipment; Figure 3 yes Figure 1 A schematic diagram of the structure of the provided grinding equipment after the cavity has been disassembled; Figure 4 yes Figure 1 A first-view structural diagram of the cabin and its internal structure after disassembly using the provided grinding equipment; Figure 5 yes Figure 4 A structural diagram from a second perspective; Figure 6 yes Figure 4 An enlarged schematic diagram of part A in the middle; Figure 7 yes Figure 5 Enlarged schematic diagram of part B in the middle; Figure 8 yes Figure 1 An enlarged schematic diagram of section C.

[0020] Figure 9 yes Figure 3 An enlarged schematic diagram of section D in the middle; Figure 10 yes Figure 3 A second-view structural schematic diagram of the provided grinding equipment; Figure 11 yes Figure 3 A third-view structural diagram of the provided grinding equipment; Figure 12 yes Figure 10 An enlarged schematic diagram of section E in the middle; Figure 13 yes Figure 11 Enlarged schematic diagram of section F in the middle.

[0021] Explanation of reference numerals in the attached figures: 10. Base; 11. First platform; 12. Second platform; 13. Feeding platform; 14. Discharging platform; 15. Support frame; 151. Second motor; 152. Linear motion module; 16. Claw groove; 20. Grinding mechanism; 21. Cabin; 211. Hatch; 212. Clearance passage; 22. Grinding assembly; 221. Support seat; 222. Grinding roller; 223. First motor; 23. Movable door assembly; 231. Cabin door; 232. Second telescopic component; 24. Elastic isolation component; 25. Dust collection assembly; 251. Dust collection seat; 252. Dust collection pipe; 26. Air knife assembly; 30. Tilting mechanism; 31. First bracket; 311. First telescopic component; 3111, end plate; 312, rotating component; 313, clamping component; 3131, gripper; 3132, connecting plate; 40, top frame; 41, first guide rail; 42, first rack; 50, conveying mechanism; 51, second bracket; 511, first rail sleeve; 512, third motor; 5121, drive gear; 513, auxiliary gear; 52, lifting assembly; 521, back plate; 522, second guide rail; 523, fourth motor; 524, lead screw; 525, lifting plate; 5251, second rail sleeve; 5252, threaded sleeve; 53, conveying arm; 54, positioning assembly; 55, receiving arm; 60, shoe midsole raw material. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0023] This application provides a grinding device; please refer to [reference needed]. Figures 1 to 5 The polishing equipment includes a base 10, at least two polishing mechanisms 20, a top frame 40, at least two conveying mechanisms 50, and a flipping mechanism 30.

[0024] Specifically, the base 10 is provided with a first platform 11 and a second platform 12. The base 10 can be a cuboid structure. The first platform 11 and the second platform 12 are respectively located at adjacent corners on the upper surface of the base 10.

[0025] A polishing mechanism 20 is mounted on a base 10. A first platform 11 is positioned at the output port of a portion of the polishing mechanism 20, and a second platform 12 is positioned at the input port of the remaining portion of the polishing mechanism 20. The first platform 11 is used to hold the midsole material 60 removed from the output port of the portion of the polishing mechanism 20. The second platform 12 is used to receive the midsole material 60 removed from the first platform 11, thereby providing midsole material 60 to the remaining portion of the polishing mechanism 20.

[0026] The top frame 40 is mounted on the base 10. The top frame 40 is approximately located at the center of the upper surface of the base 10. At least some of the two sets of grinding mechanisms 20 are located on one side of the top frame 40, while the remaining grinding mechanisms 20 are located on the other side of the top frame 40. This allows the grinding mechanisms 20, the first platform 11, and the second platform 12 to be rationally arranged on the base 10, helping to reduce the overall size of the grinding equipment and save space.

[0027] A conveying mechanism 50 is mounted on the top frame 40. Part of the conveying mechanism 50 carries the midsole material 60 through a portion of the polishing mechanism 20, while the remaining conveying mechanisms 50 carry the midsole material 60 through the remaining polishing mechanisms 20. At least two sets of conveying mechanisms 50 are positioned such that a portion of the conveying mechanism 50 corresponds to one side of the polishing mechanism 20 on the top frame 40, thus allowing the portion of the conveying mechanism 50 to fix and carry the midsole material 60 through the polishing mechanism 20, achieving polishing of one surface of the midsole material 60. The remaining conveying mechanisms 50 are positioned to correspond to the remaining polishing mechanisms 20 on the other side of the top frame 40, thus allowing the remaining conveying mechanisms 50 to fix and carry the midsole material 60 through the remaining polishing mechanisms 20, achieving polishing of the other surface of the midsole material 60.

[0028] A flipping mechanism 30 is mounted on the base 10. This mechanism flips the shoe midsole material 60 on the first platform 11 and places it on the second platform 12. As the shoe midsole material 60 passes through a portion of the grinding mechanism 20 on one side of the top frame 40, driven by a partial conveying mechanism 50, one side of the shoe midsole material 60 can be ground smooth. The shoe midsole material 60, with one side ground smooth, is placed on the first platform 11. The flipping mechanism 30 can then transport the shoe midsole material 60 from the first platform 11 to the second platform 12. Furthermore, during the transport from the first platform 11 to the second platform 12, the shoe midsole material 60 can be flipped so that when it passes through the remaining portion of the grinding mechanism 20 on the other side of the top frame 40, the other side of the shoe midsole material 60 can be ground. It should be noted that when one surface of the midsole material 60 is flat and does not require polishing, the midsole material 60 may not come into contact with the polishing roller 222 inside the polishing mechanism 20 as it passes through one side of the top frame 40. That is, although the midsole material 60 passes through the polishing mechanism 20, the polishing mechanism 20 does not polish the flat surface of the midsole material 60.

[0029] Through the above technical solution, driven by the conveying mechanism 50, the shoe midsole material 60 can pass through the polishing mechanism 20 on one side of the top frame 40 to perform peeling and polishing on one side of the shoe midsole material 60, and can place the polished shoe midsole material 60 on the first platform 11. Through the flipping mechanism 30, the shoe midsole material 60 on the first platform 11 can be flipped over during the process of moving to the second platform 12, and then the conveying mechanism 50 can drive the shoe midsole material 60 through the polishing mechanism 20 on the other side of the top frame 40, providing conditions for peeling and polishing the other side of the shoe midsole material 60. This allows the polishing equipment to achieve double-sided polishing of the shoe midsole material 60 in one polishing process, increasing the polishing speed of the shoe midsole material 60, shortening the polishing time of a single piece of shoe midsole material 60, meeting the polishing requirements of the shoe midsole material 60, and improving the applicability of the polishing equipment.

[0030] In some embodiments, please refer to Figure 6 and Figure 7The flipping mechanism 30 includes a first support 31, which is configured to move on a base 10 on one side of the first platform 11 and the second platform 12. A first telescopic member 311 is provided on the first support 31, and a rotating member 312 is provided at the output end of the first telescopic member 311. A clamping member 313 is provided at the output end of the rotating member 312 for clamping the shoe midsole material 60 on the first platform 11. Specifically, a support frame 15 is provided on the base 10 adjacent to the first platform 11 and the second platform 12. A linear motion module 152 driven by a second motor 151 is provided on the support frame 15. The linear motion module 152 can be a lead screw module consisting of a lead screw and a lead screw seat. The output end of the second motor 151 is connected to the lead screw, thereby driving the output end of the lead screw module to move. A second support 51 is provided at the output end of the lead screw module to enable the second support 51 to move on the base 10 on one side of the first platform 11 and the second platform 12. The first telescopic component 311 can be a telescopic cylinder, with an end plate 3111 fixedly mounted on its output end. The rotating component 312 can be a rotating cylinder, fixedly mounted on the end plate 3111, with its output end passing through the end plate 3111. The clamping component 313 can be a clamping cylinder, fixedly mounted on the output end of the rotating cylinder. Thus, the clamping cylinder can clamp the shoe midsole material 60 on the first platform 11, and the telescopic cylinder can lift the shoe midsole material 60 from the first platform 11. Driven by the linear motion module 152 driven by the second motor 151, the shoe midsole material 60 clamped by the clamping cylinder can move from the first platform 11 to the second platform 12. Furthermore, during the movement, the rotating cylinder can cause the shoe midsole material 60 to flip. When the flipped midsole material 60 moves to the second platform 12, the telescopic cylinder moves to place the midsole material 60 on the second platform 12, and the clamping cylinder releases the midsole material 60, thereby placing the flipped midsole material 60 on the second platform 12.

[0031] In some embodiments, please continue to refer to Figure 6 and Figure 7The output end of the clamping member 313 is equipped with a gripper 3131, and both the first platform 11 and the second platform 12 are provided with a claw groove 16 for the gripper 3131 to pass through. Specifically, when the clamping member 313 is a clamping cylinder, the two output ends of the clamping cylinder can simultaneously move closer or further apart. Each output end of the clamping cylinder is provided with a set of grippers 3131. The vertical beam structures of the two sets of grippers 3131 at the output ends of the clamping cylinder are identical. Each set of grippers 3131 may include one or more. The grippers 3131 are connected to the output ends of the clamping cylinder through a connecting plate 3132. The claw groove 16 penetrates the main body of the first platform 11 and the second platform 12, and the shape of the claw groove 16 is adapted to the gripper 3131. When the clamping cylinder clamps the shoe midsole material 60 located on the first platform 11, the clamping claw 3131 located below the first platform 11 passes through the main body of the first platform 11 and contacts the bottom surface of the shoe midsole material 60. In conjunction with the clamping claw 3131 located on the top surface of the shoe midsole material 60, it can clamp the shoe midsole material 60 on the first platform 11. When the shoe midsole material 60, after being flipped over, is placed on the second platform 12, the clamping cylinder allows the clamping claw 3131 located on the bottom surface of the shoe midsole material 60 to pass through the main body of the second platform 12, so that the clamping claws 3131 on the top and bottom surfaces of the shoe midsole material 60 can move away from each other, thus placing the shoe midsole material 60 on the second platform 12.

[0032] It should be noted that, in order to ensure the stability of the shoe midsole material 60 placed on the first platform 11 and the second platform 12, the edges of the shoe midsole material 60 are all located inside the main body edges of the first platform 11 and the second platform 12 after being placed on them. Therefore, with this design, it is inconvenient for the clamping cylinder to hold the shoe midsole material 60 on the first platform 11, nor is it convenient for the clamping cylinder to place the shoe midsole material 60 on the second platform 12. In this embodiment, by providing claw grooves 16 on the first platform 11 and the second platform 12, the clamping claws 3131 of the clamping cylinder can pass through the first platform 11 and the second platform 12, which facilitates the clamping and placement of the shoe midsole material 60.

[0033] In some embodiments, please Figures 1 to 3 Further reference Figure 8 and Figure 9The grinding mechanism 20 includes a chamber 21, inside which a grinding assembly 22 is housed. The chamber 21 has hatches 211 at both ends, serving as the input and output ports of the grinding mechanism 20, respectively. Movable door assemblies 23 are also provided at both ends of the chamber 21. Specifically, the chamber 21 is mounted on bases 10 on both sides of the top frame 40. The grinding assembly 22 includes a support base 221 located within the chamber 21, a grinding roller 222 rotatably mounted on the support base 221, and a first motor 223. The first motor 223 is located within the base 10. A drive wheel is provided at the output end of the first motor 223, and a driven wheel is provided at one end of the grinding roller 222. The drive wheel of the first motor 223 and the driven wheel of the grinding roller 222 are connected by a belt drive.

[0034] In addition, the movable door assembly 23 includes a hatch 231 and a second telescopic member 232. The hatch 231 is slidably disposed at the hatch opening 211. The second telescopic member 232 can be a telescopic cylinder. The second telescopic member 232 is disposed on the hull 21 below the hatch opening 211, and the output end of the second telescopic member 232 is fixedly connected to the hatch 231, thereby driving the hatch 231 to rise and fall through the second telescopic member 232, realizing the closing and opening of the hatch opening 211.

[0035] Therefore, during the peeling and polishing of the shoe midsole material 60, the hatch 231 of the inlet side of the chamber 21 lowers, opening the inlet side hatch 211, allowing the conveying mechanism 50 to carry the shoe midsole material 60 into the chamber 21 through the inlet side hatch 211. The hatch 231 of the inlet side hatch 211 of the chamber 21 then rises, closing the inlet side hatch 211. When the conveying mechanism 50 carries the shoe midsole material 60 past the polishing roller 222 of the polishing assembly 22, it can peel and polish the surface of the shoe midsole material 60, keeping the surface of the shoe midsole material 60 flat. The hatch 231 of the outlet side hatch 211 of the chamber 21 lowers, opening the outlet side hatch 211, allowing the conveying mechanism 50 to carry the shoe midsole material 60 out of the chamber 21 through the outlet side hatch 211. The hatch 231 of the hatch 211 on the output side of the hull 21 rises and closes the hatch 211 on the output side of the hull 21.

[0036] In some embodiments, please continue to refer to Figure 8 and Figure 9A clearance channel 212 is provided on the top of the cabin 21, connecting the hatches 211 at both ends of the cabin 21. The clearance channel 212 allows the transport mechanism 50 to pass through the cabin 21, and elastic isolation members 24 are provided on both sides of the clearance channel 212. Specifically, the clearance channel 212 is arranged along the movement trajectory of the transport mechanism 50. When the transport mechanism 50 carries the shoe midsole material 60 through the cabin 21, the clearance channel 212 prevents the top of the cabin 21 from obstructing the movement of the transport mechanism 50. The elastic isolation members 24 can be elastic brushes arranged along the extension direction of the clearance channel 212. The elastic brushes can both block the clearance channel 212 to a certain extent, reducing the diffusion of grinding dust out of the cabin 21, and also prevent affecting the movement of the transport mechanism 50 within the clearance channel 212.

[0037] In some embodiments, please refer to Figure 9 The grinding equipment also includes a dust collection assembly 25, which includes a dust collection seat 251 and a dust collection pipe 252. The dust collection seat 251 is disposed inside the chamber 21, and its bottom is connected to the dust collection pipe 252. The dust collection seat 251 is disposed inside the support base 221 and is located directly below the grinding roller 222. The end of the integrated pipe away from the dust collection seat 251 is connected to a dust collection device (not shown in the figure). When the grinding roller 222 of the grinding assembly 22 performs peeling and grinding on the shoe midsole material 60, the dust collection device can suck out the grinding dust inside the chamber 21 through the dust collection pipe 252 and the dust collection seat 251, preventing dust accumulation inside the chamber 21 and helping to reduce the amount of dust spreading from inside the chamber 21 to the surrounding working area of ​​the grinding equipment.

[0038] In some embodiments, please continue to refer to Figure 9 The cabin 21 is equipped with an air knife assembly 26, which is used to remove debris from the surface of the shoe midsole material 60 after it has been polished by the polishing assembly 22. The air knife assembly 26 can be mounted on the support frame 15 or the dust collection seat 251. When the conveying mechanism 50 carries the polished shoe midsole material 60 past the air knife assembly 26, the air knife assembly 26 can remove dust from the surface of the shoe midsole material 60, keeping the surface of the shoe midsole material 60 clean, which helps the shoe midsole material 60 to be re-adsorbed and fixed by the conveying mechanism 50 after it has been turned over.

[0039] In some embodiments, please Figures 1 to 5 Further reference Figures 10 to 13The conveying mechanism 50 includes a second support 51, which is configured to move along the top frame 40. A lifting assembly 52 is mounted on the second support 51, and a conveying arm 53 is mounted at the output end of the lifting assembly 52. ​​A positioning assembly 54 is mounted at the end of the conveying arm 53, and the positioning assembly 54 is used to fix the shoe midsole material 60. Specifically, both sides of the top frame 40 are provided with a first guide rail 41 and a first rack 42 extending along the length of the top frame 40. One or more first guide rails 41 can be provided. When multiple first guide rails 41 are provided on both sides of the top frame 40, first guide rails 41 are arranged on both sides of the first rack 42. A first rail sleeve 511 corresponding to the first rail is provided on the second support 51. Through the cooperation of the first rail sleeve 511 and the first rail, a sliding connection between the second support 51 and the top frame 40 can be achieved. A third motor 512 is fixedly mounted on the second support 51, and a drive gear 5121 meshing with the first rack 42 is fixedly mounted at the output end of the third motor 512. By engaging the drive gear 5121 and the first rack 42, the second bracket 51 can reciprocate along the first track, thereby enabling the conveying mechanism 50 to drive the shoe midsole material 60 through the polishing mechanism 20 for peeling and polishing.

[0040] It should be noted that the second support 51 is also provided with an auxiliary gear 513 that meshes with the first rack 42. The auxiliary gear 513 can improve the stability of the second support 51 moving along the top frame 40.

[0041] In addition, the lifting assembly 52 includes a back plate 521, which is fixedly mounted on the second bracket 51. A second guide rail 522 is provided on the back plate 521 along its length. One or more second guide rails 522 are provided. A lead screw 524, parallel to the second guide rail 522, is also rotatably mounted on the back plate 521. A fourth motor 523, fixedly connected to one end of the lead screw 524, is fixedly mounted on the back plate 521. The lifting assembly 52 also includes a lifting plate 525. The lifting plate 525 is provided with a second rail sleeve 5251 corresponding to the second guide rail 522 and a threaded sleeve 5252 corresponding to the lead screw 524. The second rail sleeve 5251 and the second guide rail 522 allow for sliding between the lifting plate 525 and the back plate 521. Driven by the fourth motor 523, the threaded sleeve 5252 and the lead screw 524 enable the lifting plate 525 to move up and down along the back plate 521.

[0042] In this embodiment, the transport arm 53 is connected to the lifting plate 525. The positioning component 54 can be a suction cup component, which can adsorb and fix the shoe midsole material 60. By the horizontal movement of the second bracket 51 along the first guide rail 41 and the vertical movement of the lifting plate 525 along the back plate 521, the transport arm 53 and the positioning component 54 can move in the horizontal and vertical directions. In this way, the transport mechanism 50 can adsorb and fix the shoe midsole material 60 through the positioning component 54, and under the action of the first bracket 31 and the lifting plate 525, drive the shoe midsole material 60 to pass through the grinding component 22 for peeling and grinding, and can realize the placement of the shoe midsole material 60 on the first platform 11 and the removal of the shoe midsole material 60 from the second platform 12.

[0043] In some embodiments, please refer to Figure 1 , Figure 2 , Figure 8 , Figure 11 and Figure 12 A receiving arm 55 is provided between the transport arm 53 and the positioning component 54, and the thickness of the receiving arm 55 is less than the thickness of the transport arm 53. Specifically, the thickness of the receiving arm 55 is adapted to the thickness of the clearance channel 212. By providing a thinner receiving arm 55 between the positioning component 54 and the transport arm 53, the width of the clearance channel 212 at the mating point between the transport mechanism 50 and the top of the chamber 21 can be set within a smaller range, reducing the gap at the connection between the transport arm 53 and the elastic isolation member 24, and reducing the amount of grinding dust inside the chamber 21 diffused into the external environment.

[0044] In some embodiments, please refer to Figures 1 to 5 as well as Figure 10 and Figure 11The base 10 is also equipped with an infeed platform 13 and an outlet platform 14. The infeed platform 13 is used to place the shoe midsole material 60 to be polished. A partial conveying mechanism 50 can transport the unpolished shoe midsole material 60 on the infeed platform 13 to the partial polishing mechanism 20 for polishing. The outlet platform 14 is used to place the polished shoe midsole material 60. Specifically, when the base 10 has a cuboid structure, the infeed platform 13, the outlet platform 14, the first platform 11, and the second platform 12 are located at the four corners adjacent to the surface of the base 10, and the top frame 40 is located at the center adjacent to the base 10. The partial polishing mechanism 20 is located between the infeed platform 13 and the first platform 11, and the remaining partial polishing mechanism 20 is located between the second platform 12 and the outlet platform 14. The conveying mechanism 50 can adsorb and fix the shoe midsole material 60 located on the infeed platform 13, and drive the shoe midsole material 60 to be polished by the partial polishing mechanism 20 and then placed on the first platform 11. The flipping mechanism 30 can move the shoe midsole material 60 located on the first platform 11 to the second platform 12, and flip the shoe midsole material 60 during the movement, placing the flipped shoe midsole material 60 on the second platform 12. The conveying mechanism 50 can adsorb and fix the shoe midsole material 60 located on the second platform 12, and drive the shoe midsole material 60 through the remaining grinding mechanism 20 to place it on the discharge platform 14.

[0045] According to a second aspect of this disclosure, a polishing method is provided, utilizing the polishing equipment in the above embodiments, comprising: driving the shoe midsole material through a partial conveying mechanism 50 to pass through a partial polishing mechanism 20 to polish one side of the shoe midsole material, and performing peeling polishing on one side of the shoe midsole material 60 to keep one side of the shoe midsole material 60 flat.

[0046] After one side of the shoe midsole material is polished, it is placed on the first platform 11 through a partial handling mechanism 50.

[0047] The shoe midsole material on the first platform 11 is clamped and flipped by the flipping mechanism 30, and the flipped shoe midsole material is placed on the second platform 12, thereby changing the upper and lower surfaces of the shoe midsole material 60 so as to peel and polish the unpolished surface of the shoe midsole material 60.

[0048] The remaining part of the conveying mechanism 50 drives the shoe midsole material on the second platform 12 through the remaining part of the polishing mechanism 20 to polish the other side of the shoe midsole material, thereby realizing the peeling and polishing of both sides of the shoe midsole material 60.

[0049] It is understood that in other embodiments, when the other side of the shoe midsole material 60 does not need to be polished, part of the conveying mechanism 50 still drives the shoe midsole material 60 on the second platform 12 through the remaining polishing mechanism 20. However, when the shoe midsole material 60 passes through the polishing mechanism 20, the polishing mechanism 20 will not polish the other side of the shoe midsole material.

[0050] This polishing method has all the beneficial effects of the aforementioned polishing equipment, which will not be elaborated upon here.

[0051] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0052] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0053] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0054] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A grinding device, characterized in that, include: A base (10) is provided with a first platform (11) and a second platform (12). At least two sets of polishing mechanisms (20) are provided on the base (10), the first platform (11) is provided at the output port of part of the polishing mechanism (20), and the second platform (12) is provided at the input port of the remaining part of the polishing mechanism (20); Top frame (40), the top frame (40) is disposed on the base (10); At least two sets of conveying mechanisms (50) are provided on the top frame (40). Some of the conveying mechanisms (50) are used to drive the shoe midsole material through some of the polishing mechanisms (20), and the remaining conveying mechanisms (50) are used to drive the shoe midsole material through the remaining polishing mechanisms (20). A flipping mechanism (30) is disposed on the base (10) and is used to flip the shoe midsole material (60) on the first platform (11) and place it on the second platform (12).

2. The grinding equipment according to claim 1, characterized in that, The flipping mechanism (30) includes a first support (31) configured to move on a base (10) on one side of the first platform (11) and the second platform (12). A first telescopic member (311) is provided on the first support (31). A rotating member (312) is provided at the output end of the first telescopic member (311). A clamping member (313) is provided at the output end of the rotating member (312). The clamping member (313) is used to clamp the shoe midsole material (60) on the first platform (11).

3. The grinding equipment according to claim 2, characterized in that, The output end of the clamping member (313) is equipped with a gripper (3131), and the first platform (11) and the second platform (12) are both provided with a gripper groove (16) for the gripper (3131) to pass through.

4. The grinding equipment according to claim 1, characterized in that, The polishing mechanism (20) includes a chamber (21), a polishing component (22) is provided inside the chamber (21), and hatches (211) are provided at both ends of the chamber (21) as the input port and output port of the polishing mechanism (20), respectively. Movable door components (23) are provided at both ends of the chamber (21).

5. The grinding equipment according to claim 4, characterized in that, The top of the cabin (21) is provided with a clearance passage (212), which connects the hatches (211) at both ends of the cabin (21). The clearance passage (212) is used to allow the transport mechanism (50) to pass through the cabin (21). Elastic isolation members (24) are provided on both sides of the clearance passage (212).

6. The grinding equipment according to claim 4, characterized in that, The polishing equipment also includes a dust collection component (25), which includes a dust collection seat (251) and a dust collection pipe (252). The dust collection seat (251) is located inside the chamber (21), and the bottom of the dust collection seat (251) is connected to the dust collection pipe (252).

7. The grinding equipment according to claim 4, characterized in that, The cabin (21) is equipped with an air knife assembly (26), which is used to remove debris from the surface of the shoe midsole material (60) after it has been polished by the polishing assembly (22).

8. The grinding equipment according to claim 1, characterized in that, The conveying mechanism (50) includes a second support (51) configured to move along the top frame (40). A lifting assembly (52) is provided on the second support (51). A conveying arm (53) is provided at the output end of the lifting assembly (52). A positioning assembly (54) is provided at the end of the conveying arm (53). The positioning assembly (54) is used to fix the shoe midsole material (60).

9. The grinding equipment according to claim 8, characterized in that, A receiving arm (55) is provided between the transport arm (53) and the positioning component (54), and the thickness of the receiving arm (55) is less than the thickness of the transport arm (53).

10. The grinding equipment according to claim 1, characterized in that, The base (10) is also provided with a feeding platform (13) and a discharging platform (14). The feeding platform (13) is used to place the shoe midsole material (60) to be polished. Part of the conveying mechanism (50) can transport the unpolished shoe midsole material (60) on the feeding platform (13) to part of the polishing mechanism (20) for polishing. The discharging platform (14) is used to place the polished shoe midsole material (60).

11. A polishing method, characterized in that, The polishing apparatus according to any one of claims 1 to 10 comprises: The shoe midsole material is driven by part of the conveying mechanism (50) through part of the polishing mechanism (20) to polish one side of the shoe midsole material; The polished midsole material is placed on the first platform (11) via part of the conveying mechanism (50); The shoe midsole material on the first platform (11) is clamped and flipped by the flipping mechanism (30), and the flipped shoe midsole material is placed on the second platform (12). The remaining part of the conveying mechanism (50) drives the shoe midsole material on the second platform (12) through the remaining part of the polishing mechanism (20) to polish the other side of the shoe midsole material.

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