A method and system for constructing a thermal compensation power prediction model of an optoelectronic pod

Abstract

The application discloses a kind of thermal compensation power prediction model construction method and system of optoelectronic pod, it is related to airborne optoelectronic pod technical field, can when pod executes the shooting task of different height, guarantee the temperature uniformity of each key part of optical system, to guarantee the imaging quality problem of pod.Through equal division method obtains a group of optoelectronic pod pressure value, according to the pressure value obtains the thermal compensation power of each heating zone corresponding to each heating zone;The pressure value and the corresponding thermal compensation power of each heating zone construct the data set of each heating zone, the data set is fitted, obtains the corresponding pressure-thermal compensation power function of each heating zone, the pressure-thermal compensation power function is used as the thermal compensation power prediction model of optoelectronic pod each heating zone.The method disclosed in the application is suitable for airborne optoelectronic pod temperature control when flight altitude changes.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of airborne optoelectronic pod, in particular to the technical field of airborne optoelectronic pod environmental control temperature control. BACKGROUND

[0002] When high-altitude aerial photography is performed, it is necessary to stabilize the temperature of the optoelectronic pod and eliminate the influence of temperature gradient on the imaging quality by using thermal control technology, which is a necessary measure in the scheme of high-altitude airborne optoelectronic pod.

[0003] The traditional thermal control technology controls the heating sheet in an open-loop temperature control mode by using a temperature relay, or controls the heating sheet in a closed-loop temperature control mode by using a temperature sensor to realize temperature control effect. Although these two modes can achieve the purpose of temperature control, there are only two temperature control states of no heating and constant heating, which cannot meet the requirements of different flight altitudes. The change of flight altitude will affect the convective heat transfer efficiency and heat transfer path of the heating sheet, causing local temperature to be out of standard or temperature overshoot, and then enlarging the temperature gradient to affect the imaging quality of the pod.

[0004] In summary, the existing airborne optoelectronic pod has the problem that the change of flight altitude causes local temperature to be out of standard or temperature overshoot, and then enlarges the temperature gradient to affect the imaging quality of the pod. SUMMARY

[0005] The present application can ensure the temperature uniformity of each key component of the optical system when the pod performs shooting tasks at different altitudes, thereby ensuring the imaging quality of the pod. The present application provides the following scheme:

[0006] Scheme one, a method for constructing a thermal compensation power prediction model of an optoelectronic pod, comprising the following steps:

[0007] Step A1, obtaining a group of pressure values of the optoelectronic pod by equal division method, and obtaining the thermal compensation power of each heating area corresponding to the pressure values;

[0008] Step A2, constructing a data set of each heating area by taking the pressure value and the corresponding thermal compensation power of each heating area, fitting the data set, obtaining the pressure-thermal compensation power function corresponding to each heating area, and taking the pressure-thermal compensation power function as the thermal compensation power prediction model of each heating area of the optoelectronic pod.

[0009] Further, in an embodiment of the present application, the thermal compensation power of each heating area corresponding to the pressure value is obtained in step A1, and specifically:

[0010] Each pressure value in the group of pressure values is processed respectively as follows to obtain the thermal compensation power corresponding to each pressure value,

[0011] Set the pressure value in the optical pod simulation model to the pressure value described above, and perform simulation to obtain a corresponding temperature distribution cloud image;

[0012] Compare the obtained temperature distribution cloud image with a preset temperature threshold, if the temperature of a heating area does not meet the preset threshold, modify the heat compensation power of the heating area and perform simulation to obtain a corresponding temperature distribution cloud image, repeat the step until the obtained temperature distribution cloud image meets the preset temperature threshold, and obtain the heat compensation power corresponding to the pressure value.

[0013] Further, in an embodiment of the present application, the optical pod simulation model is constructed by the following steps:

[0014] Step S1, three-dimensional modeling is performed on a target optical pod to obtain an initial optical pod simulation model of the target optical pod;

[0015] Step S2, simulation is performed based on the initial optical pod simulation model to obtain a temperature distribution cloud image of the target optical pod;

[0016] Step S3, an initial temperature control scheme is obtained according to the temperature distribution cloud image and a preset threshold;

[0017] Step S4, the initial temperature control scheme is added to the initial optical pod simulation model for simulation to obtain a corresponding temperature distribution cloud image;

[0018] Step S5, compare the obtained temperature distribution cloud image with a preset temperature threshold, if the preset temperature threshold is not met, optimize the initial temperature control scheme until the preset temperature threshold is met, and obtain an optimized temperature control scheme;

[0019] Step S6, add the optimized temperature control scheme to the initial optical pod simulation model as a final optical pod simulation model.

[0020] Further, in an embodiment of the present application, the three-dimensional modeling includes setting a flow field area, modeling main optical elements and structural parts, meshing, setting initial model parameters, setting thermal analysis solving parameters, and setting boundary conditions.

[0021] Further, in an embodiment of the present application, the temperature control scheme includes the position and number of heating areas, the spatial range of each heating area, and the heat compensation power of each heating area.

[0022] Further, in an embodiment of the present application, the optimization of the initial temperature control scheme in step S5 is as follows:

[0023] According to the temperature distribution cloud image, the temperature of each heating area is obtained, and according to the temperature of each heating area, the following operations are performed:

[0024] If the temperature of the heating zone is higher than the preset temperature threshold, but the temperature of the surrounding thereof is lower than the preset temperature threshold, the range of the heating zone is expanded;

[0025] If the temperature of the heating zone and the temperature of the surrounding thereof are both lower than the preset temperature threshold, the heat compensation power corresponding to the heating zone is increased;

[0026] If the temperature of the heating zone is lower than the preset temperature threshold, but the temperature of the surrounding thereof is higher than the preset temperature threshold, the range of the heating zone is reduced;

[0027] If the temperature of the heating zone and the temperature of the surrounding thereof are both higher than the preset temperature threshold, the heat compensation power corresponding to the heating zone is reduced.

[0028] Further, in an embodiment of the present application, the position and number of the heating zones are determined by setting the heating zones near the components to be heated whose temperature is lower than the preset threshold.

[0029] Scheme two, a heat compensation power prediction model construction system of an electro-optical pod, comprising the following modules:

[0030] Module one, used for obtaining a set of pressure values of the electro-optical pod by equal division method, and obtaining the heat compensation power of each heating zone corresponding to the pressure values;

[0031] Module two, used for constructing a data set of each heating zone by using the pressure value and the corresponding heat compensation power of each heating zone, fitting the data set, obtaining the pressure-heat compensation power function corresponding to each heating zone, and taking the pressure-heat compensation power function as the heat compensation power prediction model of each heating zone of the electro-optical pod.

[0032] Scheme three, an electronic device, comprising a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory complete mutual communication through the communication bus;

[0033] The memory is used for storing a computer program;

[0034] The processor is used for executing the program stored on the memory, and realizes the heat compensation power prediction model construction method of any one of the above-mentioned methods.

[0035] Scheme four, a computer readable storage medium, wherein the computer readable storage medium stores a computer program, and the computer program is executed by the processor to realize the heat compensation power prediction model construction method of any one of the above-mentioned methods.

[0036] The thermal compensation power prediction model construction method and system for an optoelectronic pod described in this invention can ensure the temperature uniformity of key components in the optical system when the pod performs shooting tasks at different altitudes, thereby guaranteeing the imaging quality of the pod. Specific beneficial effects include:

[0037] The thermal compensation power prediction model for the optoelectronic pod obtained by the prediction model construction method described in this invention is used to predict the thermal compensation power of the optoelectronic pod. The difference between using this model and existing technologies lies in the fact that existing technologies only offer two temperature control states: no heating and constant heating, which cannot adapt to the requirements of different flight altitudes. To solve the above technical problems, this invention constructs a thermal compensation power prediction model for the optoelectronic pod. This model changes the thermal compensation power value from a constant to a power-pressure function, without adding redundant structures or equipment, and without occupying onboard resources. It can adapt to pressure changes caused by different flight altitudes. Whether during ascent, descent, or mission execution, it can ensure the temperature uniformity of key components as much as possible while meeting preset thresholds, avoiding localized temperature substandardities or temperature overshoot, reducing temperature fluctuations in key components, and ensuring the thermal stability of the entire structure.

[0038] The method described in this invention is applicable to the environmental control and temperature control of airborne optoelectronic pods during flight altitude changes. Attached Figure Description

[0039] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0040] Figure 1 This is a flowchart of the method for constructing the thermal compensation power prediction model of the optoelectronic pod as described in Implementation Method 1.

[0041] Figure 2 It is the fourth heating zone near the secondary reflector group as described in Embodiment 1.

[0042] Figure 3 It is the pressure-power function of different heating zones as described in Implementation Method 1.

[0043] Figure 4 This is a schematic diagram of the conventional structure of the target optoelectronic pod described in Embodiment 2.

[0044] Figure label:

[0045] 1. Outer shell; 2. Optical system; 3. Load frame. Detailed Implementation

[0046] The various embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. The embodiments described by reference to the drawings are exemplary and are intended to explain the present application, but cannot be understood as a limitation of the present application.

[0047] In an embodiment, a method for constructing a thermal compensation power prediction model of an optoelectronic pod is provided, which comprises the following steps: Figure 1 As shown in the figure, the method comprises the following steps:

[0048] In step A1, a set of pressure values of the optoelectronic pod is obtained by equal division, and the corresponding thermal compensation power of each heating zone is obtained according to the pressure values.

[0049] In step A2, the pressure values and the corresponding thermal compensation power of each heating zone are used to construct a data set of each heating zone, the data set is fitted to obtain a pressure-thermal compensation power function corresponding to each heating zone, and the pressure-thermal compensation power function is used as a thermal compensation power prediction model of each heating zone of the optoelectronic pod.

[0050] In the embodiment, the set of pressure values is obtained by equal division, and the equal division interval is preferably , wherein is the initial pressure, is the standard atmospheric pressure.

[0051] In the embodiment, the corresponding thermal compensation power of each heating zone is obtained according to the pressure values in step A1, and the method comprises the following steps:

[0052] Each pressure value in the set of pressure values is processed respectively to obtain the corresponding thermal compensation power of the pressure value,

[0053] The pressure values in the simulation model of the optoelectronic pod are set to the above-mentioned pressure values, and simulation is performed to obtain the corresponding temperature distribution cloud map.

[0054] The obtained temperature distribution cloud map is compared with a preset temperature threshold value, if the temperature of a certain heating zone does not meet the preset threshold value, the thermal compensation power of the heating zone is modified and simulation is performed to obtain the corresponding temperature distribution cloud map, the step is repeated until the obtained temperature distribution cloud map meets the preset temperature threshold value, and the thermal compensation power corresponding to the pressure value is obtained.

[0055] The method for constructing a thermal compensation power prediction model of an optoelectronic pod according to the embodiment changes the thermal compensation power value from a constant to a pressure-power function, which can adapt to the change of pressure caused by different flight altitudes of the aircraft. Whether it is the process of ascending or descending of the aircraft or the process of performing tasks, the temperature uniformity of each key component can be ensured as much as possible under the premise of meeting the preset threshold value, so as to ensure the imaging quality of the pod.

[0056] The embodiment provides an example, and the optoelectronic pod simulation model includes six heating areas, which are a first heating area near a load frame, a second heating area and a third heating area near a main mirror group, a fourth heating area and a fifth heating area near a secondary mirror group, and a sixth heating area near the rest of an optical system, as shown in Figure 2 . Figure 2 The fourth heating area is near the secondary mirror group; in the example, the method includes the following steps:

[0057] Step A01, a set of pressure values are obtained by equal division, the equal division interval is [8835, 101325], and the new pressure after equal division is denoted as , ,... .

[0058] According to the pressure values, the thermal compensation power of each heating area is obtained, and the thermal compensation power of each heating area is specifically obtained as follows:

[0059] The pressure values in the optoelectronic pod simulation model are set to the above pressure values, simulation is performed to obtain corresponding temperature distribution maps;

[0060] The obtained temperature distribution maps are compared with preset temperature thresholds, if the temperature of a heating area does not meet the preset threshold, the thermal compensation power of the heating area is modified and simulation is performed to obtain corresponding temperature distribution maps, the step is repeated until the obtained temperature distribution maps meet the preset temperature thresholds, and the thermal compensation power corresponding to the pressure values is obtained.

[0061] Taking the pressure as an example, the obtained thermal compensation power is denoted as , , , wherein is the thermal compensation power of the first heating area, is the thermal compensation power of the second heating area,... is the thermal compensation power of the sixth heating area.

[0062] All pressure and thermal compensation power data are sorted according to the heating areas, the pressure and thermal compensation power of the first heating area are a data set , the pressure and thermal compensation power of the second heating area are a data set , the pressure and thermal compensation power of the third heating area are a data set , the pressure and thermal compensation power of the fourth heating area are a data set , the pressure and thermal compensation power of the fifth heating area are a data set , and the pressure and thermal compensation power of the sixth heating area are a data set , and the above .

[0063] Step A02, based on each heating zone, constructing a data set of each heating zone by combining the pressure value of each heating zone and the corresponding thermal compensation power, fitting the data set, as shown in Figure 3 to obtain the corresponding pressure -thermal compensation power function of each heating zone of the optoelectronic pod, and the pressure-thermal compensation power function as a thermal compensation power prediction model of each heating zone of the optoelectronic pod.

[0064] Embodiment two, this embodiment is a further limitation of the thermal compensation power prediction model construction method described in embodiment one, in this embodiment, the optoelectronic pod simulation model is constructed by the following steps:

[0065] Step S1, three-dimensional modeling of the target optoelectronic pod is performed to obtain an initial optoelectronic pod simulation model of the target optoelectronic pod;

[0066] Step S2, simulation is performed based on the initial optoelectronic pod simulation model to obtain a temperature distribution cloud map of the target optoelectronic pod;

[0067] Step S3, an initial temperature control scheme is obtained according to the temperature distribution cloud map and a preset threshold;

[0068] Step S4, the initial temperature control scheme is added to the initial optoelectronic pod simulation model for simulation to obtain a corresponding temperature distribution cloud map;

[0069] Step S5, the obtained temperature distribution cloud map is compared with a preset temperature threshold, if the preset temperature threshold is not met, the initial temperature control scheme is optimized until the preset temperature threshold is met, and an optimized temperature control scheme is obtained;

[0070] Step S6, the optimized temperature control scheme is added to the initial optoelectronic pod simulation model as a final optoelectronic pod simulation model.

[0071] In this embodiment, if the simulation does not converge in step S2, the quality of the divided grid and the flow field related parameters are checked, and after adjustment, the solution is performed again until the result converges, and the temperature distribution cloud map is obtained.

[0072] In this embodiment, the schematic diagram of the conventional structure of the target optoelectronic pod is as shown in Figure 4

[0073] ​The photoelectric pod simulation model construction method of the embodiment is to perform three-dimensional modeling on the target photoelectric pod; a temperature control scheme is designed and optimized according to the temperature distribution cloud picture and a preset threshold; and the obtained temperature control scheme is added to the photoelectric pod simulation model. The photoelectric pod simulation model provides a basis for the establishment of a data set in the subsequent thermal compensation power prediction model construction process. The photoelectric pod simulation model does not increase redundant structures and equipment, and does not occupy on-board resources. The data set fitted equation constructed based on the model can adapt to the change in pressure caused by different flight altitudes of the aircraft.

[0074] Embodiment three, the embodiment is a further limitation of the thermal compensation power prediction model construction method of embodiment two. In the embodiment, the three-dimensional modeling includes setting a flow field region, modeling main optical elements and structural components, grid division, setting initial model parameters, setting thermal analysis solving parameters, and setting boundary conditions.

[0075] In the embodiment, the setting of the flow field region preferably sets the target photoelectric pod as an internal field region and the pod outside as an external field region.

[0076] In the embodiment, the main optical elements and structural components include a shell, a load frame, and an optical system.

[0077] In the embodiment, the modeling of the main optical elements and structural components preferably models the pod shell as a closed entity and models the main optical elements and structural components outside the pod shell as a closed surface model assembly.

[0078] In the embodiment, the grid division includes:

[0079] Preferably, unstructured tetrahedral grids are used for grid division of the entire pod and fluid region.

[0080] Preferably, local grid refinement is performed on key components, including but not limited to critical components, structural components, and optical systems. The optical system includes a mirror group and related support structures.

[0081] In the embodiment, the initial model parameters include:

[0082] The turbulence type is preferably a K-ε two-equation turbulence model, which is used to solve the problem of airflow flowing in the pod.

[0083] The radiation field range preferably covers all model objects.

[0084] The flight parameters include initial pressure , flight altitude, environmental radiation temperature, environmental fluid temperature, environmental fluid flow direction, and environmental fluid speed.

[0085] Temperature parameters of each component of the pod model, including initial temperature, thermal radiation coefficient and thermal coupling parameters between components;

[0086] The initial temperature is preferably the average temperature before takeoff from the ground, preferably 20°C;

[0087] The thermal radiation coefficient preferably includes the mirror reflectivity defined based on the surface material properties of each part, including surface absorptivity, emissivity, and the reflective surface of the mirror.

[0088] The thermal coupling parameters preferably include coefficient values ​​that define the heat transfer coefficient between screwed or glued components and resistance values ​​that define the impedance at the solder joint positions of the components.

[0089] In this embodiment, the boundary condition is preferably a no-slip boundary condition.

[0090] This embodiment provides an example where the flight requirements of the optoelectronic pod are used as flight boundary conditions, with a flight altitude of 17km and an initial pressure set. The Pa is set to 8835, the ambient radiation temperature is set to -56.5℃, the ambient fluid temperature is set to -56.5℃, the ambient fluid flow direction is set to the opposite direction of the pod's flight, and the ambient fluid velocity is set to the pod's flight speed.

[0091] Implementation Method 4: This implementation method further defines the method for constructing the photoelectric pod simulation model described in Implementation Method 2. In this implementation method, the temperature control scheme includes the location and number of heating zones, the spatial range of each heating zone, and the thermal compensation power.

[0092] In this embodiment, the thermal compensation power includes the absorbed power. and convective power ;

[0093] pass

[0094]

[0095] Obtaining absorbed power ,in, Specific heat capacity of an object, expressed in J / (kg•K); The weight of the object is expressed in kg. The heat absorption time is expressed in seconds (s). The temperature of an object after it absorbs heat, in °C; The temperature of the object before it absorbs heat, in °C;

[0096] pass

[0097]

[0098] Obtaining convective power wherein, is the convection heat transfer coefficient, unit W / (K•m 2 ); is the area perpendicular to the heat transfer direction, unit m 2 ; is the surface temperature of the object, unit ℃; is the fluid temperature, unit ℃.

[0099] Embodiment five, this embodiment is a further limitation of the photovoltaic pod simulation model construction method of embodiment two, in this embodiment, the optimization of the initial temperature control scheme in step S5 is as follows:

[0100] According to the temperature distribution cloud map, the temperature of each heating area is obtained, and the following operations are performed according to the temperature of each heating area:

[0101] If the temperature of the heating area is higher than the preset temperature threshold, but the temperature around it is lower than the preset temperature threshold, then the range of the heating area is expanded;

[0102] If the temperature of the heating area and the temperature around it are both lower than the preset temperature threshold, then the heat compensation power corresponding to the heating area is increased;

[0103] If the temperature of the heating area is lower than the preset temperature threshold, but the temperature around it is higher than the preset temperature threshold, then the range of the heating area is reduced;

[0104] If the temperature of the heating area and the temperature around it are both higher than the preset temperature threshold, then the heat compensation power corresponding to the heating area is reduced.

[0105] This embodiment is a further limitation of the photovoltaic pod simulation model construction method, and the optimization of the initial temperature control scheme is illustrated. This method dynamically adjusts the distribution of heat energy in space and intensity through global temperature measurement, and realizes uniform and accurate temperature control effect.

[0106] Embodiment six, this embodiment is a further limitation of the photovoltaic pod simulation model construction method of embodiment four, in this embodiment, the position and number of the heating area are determined by setting the heating area near the component to be heated whose temperature is lower than the preset threshold.

[0107] In this embodiment, the component to be heated includes a key component.

Claims

1. A method for constructing a thermal compensation power prediction model of an optical pod, characterized in that, The method comprises the following steps: Step A1, obtaining a set of pressure values of the optoelectronic pod by equal division, and obtaining the corresponding heat compensation power of each heating zone according to the pressure values; Step A2, constructing a data set of each heating zone by the pressure value and the corresponding heat compensation power of each heating zone, fitting the data set, and obtaining the corresponding pressure-heat compensation power function of each heating zone, and taking the pressure-heat compensation power function as the heat compensation power prediction model of each heating zone of the optoelectronic pod; The pressure values of the group of optoelectronic pods are obtained by equalization, the equalization interval being wherein is the initial pressure, is the standard atmospheric pressure; In step A1, the corresponding heat compensation power of each heating zone is obtained according to the pressure value, specifically as follows: Each pressure value in the set of pressure values of the optoelectronic pod is processed respectively as follows to obtain the corresponding heat compensation power of the pressure value, The pressure value in the optoelectronic pod simulation model is set as the pressure value, and the temperature field data in the corresponding temperature distribution cloud diagram is obtained by simulation through the optoelectronic pod simulation model; The obtained temperature field data in the temperature distribution cloud diagram is compared with the preset temperature threshold value, if the temperature of a certain heating zone does not meet the preset temperature threshold value, the heat compensation power of the heating zone is modified and simulated to obtain the corresponding temperature field data in the temperature distribution cloud diagram, the step is repeated until the obtained temperature field data in the temperature distribution cloud diagram meets the preset temperature threshold value, and the heat compensation power of each heating zone corresponding to the pressure value is obtained; The optoelectronic pod simulation model is constructed by the following steps: Step S1, three-dimensional modeling of the target optoelectronic pod is performed to obtain an initial optoelectronic pod simulation model of the target optoelectronic pod; Step S2, simulation is performed based on the initial optoelectronic pod simulation model to obtain temperature field data in a temperature distribution cloud diagram of the target optoelectronic pod; Step S3, an initial temperature control scheme is obtained according to the temperature field data in the temperature distribution cloud diagram and a preset temperature threshold value; Step S4, the initial temperature control scheme is added to the initial optoelectronic pod simulation model for simulation to obtain corresponding temperature field data in a temperature distribution cloud diagram; Step S5, the obtained temperature field data in the temperature distribution cloud diagram is compared with the preset temperature threshold value, if the preset temperature threshold value is not met, the initial temperature control scheme is optimized until the preset temperature threshold value is met, and an optimized temperature control scheme is obtained; Step S6, the optimized temperature control scheme is added to the initial optoelectronic pod simulation model as a final optoelectronic pod simulation model; The temperature control scheme comprises the position, number, spatial range and heat compensation power of each heating zone. 2.The method of claim 1, wherein, The three-dimensional modeling comprises setting a flow field region, modeling main optical elements and structural parts, meshing, setting initial model parameters, setting thermal analysis solving parameters and setting boundary conditions. 3.The method of claim 1, wherein, In step S5, the initial temperature control scheme is optimized in the following manner: According to the temperature field data in the temperature distribution cloud diagram, the temperature of each heating zone is obtained, and the following operations are performed according to the temperature of each heating zone: If the temperature of a heating zone is higher than the preset temperature threshold value, but the temperature around it is lower than the preset temperature threshold value, the range of the heating zone is expanded; If the temperature of the heating zone and the temperature around the heating zone are both lower than the preset temperature threshold, increase the heat compensation power corresponding to the heating zone; If the temperature of the heating zone is lower than the preset temperature threshold, but the temperature around the heating zone is higher than the preset temperature threshold, reduce the range of the heating zone; If the temperature of the heating zone and the temperature around the heating zone are both higher than the preset temperature threshold, reduce the heat compensation power corresponding to the heating zone. 4.The method of claim 1, wherein, The position and number of the heating zone are determined by setting the heating zone near the component to be heated whose temperature is lower than the preset temperature threshold.

5. A system for constructing a thermal compensation power prediction model of an optical pod, the system comprising: The method comprises the following modules: Module one, for obtaining a set of pressure values of the optoelectronic pod by equal division method, and obtaining the heat compensation power of each heating zone corresponding to the pressure values; Module two, for constructing the data set of each heating zone by the pressure value and the corresponding heat compensation power of each heating zone, fitting the data set to obtain the pressure-heat compensation power function corresponding to each heating zone, and taking the pressure-heat compensation power function as the heat compensation power prediction model of each heating zone of the optoelectronic pod; The pressure values of the group of optoelectronic pods are obtained by equalization, the equalization interval being wherein is the initial pressure, is the standard atmospheric pressure; In module one, the heat compensation power of each heating zone corresponding to the pressure value is obtained, specifically as follows: Each pressure value in the set of pressure values of the optoelectronic pod is processed respectively as follows to obtain the heat compensation power corresponding to each pressure value, The pressure value in the optoelectronic pod simulation model is set as the pressure value, and the temperature field data in the corresponding temperature distribution cloud diagram is obtained by simulation through the optoelectronic pod simulation model; The obtained temperature field data in the temperature distribution cloud diagram is compared with the preset temperature threshold, if the temperature of a certain heating zone does not meet the preset temperature threshold, the heat compensation power of the heating zone is modified and simulation is performed to obtain the temperature field data in the corresponding temperature distribution cloud diagram, the step is repeated until the temperature field data in the obtained temperature distribution cloud diagram meets the preset temperature threshold, and the heat compensation power of each heating zone corresponding to the pressure value is obtained; The optoelectronic pod simulation model comprises the following sub-modules: Sub-module one, three-dimensional modeling of the target optoelectronic pod is performed to obtain the initial optoelectronic pod simulation model of the target optoelectronic pod; Sub-module two, simulation is performed based on the initial optoelectronic pod simulation model to obtain the temperature field data in the temperature distribution cloud diagram of the target optoelectronic pod; Sub-module three, the initial temperature control scheme is obtained according to the temperature field data in the temperature distribution cloud diagram and the preset temperature threshold; Sub-module four, the initial temperature control scheme is added to the initial optoelectronic pod simulation model for simulation to obtain the temperature field data in the corresponding temperature distribution cloud diagram; Sub-module five, the obtained temperature field data in the temperature distribution cloud diagram is compared with the preset temperature threshold, if the preset temperature threshold is not met, the initial temperature control scheme is optimized until the preset temperature threshold is met, and the optimized temperature control scheme is obtained; Sub-module six, the optimized temperature control scheme is added to the initial optoelectronic pod simulation model as the final optoelectronic pod simulation model; The temperature control scheme comprises the position and number of the heating zone, and the spatial range and heat compensation power of each heating zone.

6. An electronic device, comprising: The application relates to a computer device, which comprises a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory realize mutual communication through the communication bus. The memory is used for storing a computer program. The processor is used for executing the program stored in the memory, so as to realize the heat compensation power prediction model construction method in any one of claims 1-4.

7. A computer-readable storage medium, characterized in that, The computer readable storage medium stores a computer program, and the computer program is executed by the processor to realize the heat compensation power prediction model construction method in any one of claims 1-4.

Images