Repair device and repair method

Abstract

The invention provides a repair device and a repair method, and relates to the technical field of chip repair, the repair device comprises a fixing mechanism, a heating mechanism, a sintering patch mechanism and a cooling mechanism, the fixing mechanism is provided with an air inlet and an air outlet; the heating mechanism is arranged on the fixing mechanism and located in the containing cavity. The sintering chip-mounting mechanism extends into the accommodating chamber through the air outlet, an interval is preset between the sintering chip-mounting mechanism and the edge of the air outlet, and the sintering chip-mounting mechanism is configured to attach the chip to the mounting area of the shell and heat and fix the chip to the mounting area; and the cooling mechanism comprises a cooling pipeline, and the cooling pipeline is connected to the sintering chip mounting mechanism and is communicated to the mounting area. Compared with the prior art, sintering of a single chip can be achieved, other chips which do not need to be repaired are prevented from being affected, and the overall structure is simplified. And meanwhile, a large amount of cooling gas does not need to be introduced, so that the use amount of the cooling gas is effectively reduced, the cooling effect is better, and other attached chips are not influenced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip repair, in particular to a repair device and a repair method. BACKGROUND

[0002] At present, COS (Chip on Submount) chips are sintered and fixed on a shell. When one or more chips fail, the failed single chip needs to be repaired. The repair process usually includes the steps of removing the failed chip and re-sintering the qualified chip. In the re-sintering process, since the single chip needs to be sintered, the current manual sintering process is usually used, that is, the qualified chip and solder are placed on the shell by manual operation, and then the shell is put into a sintering furnace for re-sintering.

[0003] However, this method cannot realize the sintering of a single chip at a fixed point, which may affect the remaining chips. At the same time, the manual sintering process is inefficient, and a large amount of cooling gas needs to be introduced for overall cooling after sintering, which cannot cool the actual sintering site at a fixed point, resulting in waste of cooling gas. SUMMARY

[0004] The purpose of the present application is to provide a repair device which can realize full-automatic repair sintering operation, and can realize the repair sintering of a single chip, avoid affecting other chips, and can cool the sintered chip at a fixed point without the need for a large amount of cooling gas, thereby effectively saving the amount of cooling gas used.

[0005] In a first aspect, the present application provides a repair device, comprising: a fixing mechanism, the fixing mechanism having a receiving chamber, an air inlet and an air outlet respectively communicating with the receiving chamber, the receiving chamber being configured to accommodate a shell, and the fixing mechanism being configured to adjust the angle or position of the shell; a heating mechanism, the heating mechanism being provided on the fixing mechanism and located in the receiving chamber; a sintering patch mechanism, the sintering patch mechanism extending into the receiving chamber through the air outlet and being spaced apart from the edge of the air outlet, the sintering patch mechanism being configured to attach a chip to a mounting area of the shell and heat and fix the chip to the mounting area; a cooling mechanism, the cooling mechanism comprising a cooling pipeline connected to the sintering patch mechanism and communicating with the mounting area.

[0006] In an optional embodiment, the cooling mechanism further comprises a cooling cover having two ends respectively open, the cooling cover being arranged around the outer periphery of the sintering patch mechanism, the cooling cover covering the mounting area, and the air outlet end of the cooling pipeline extending into the cooling cover.

[0007] In optional embodiments, the air inlet is arranged at the bottom of the accommodating chamber, the air outlet is arranged at the top of the accommodating chamber, and the cooling pipeline is arranged at the air inlet; and / or the air inlet is further provided with a protection pipeline, and the air inlet end of the cooling pipeline is communicated with the air inlet or the protection pipeline.

[0008] In optional embodiments, the cooling cover is further provided with a flow guide plate, the flow guide plate is connected to the air outlet end of the cooling pipeline and extends in the horizontal direction, and the flow guide plate and the interior of the cooling cover are provided with a gap.

[0009] In optional embodiments, the cooling cover sequentially comprises, from bottom to top, a tapered section with a bottom opening, a connecting section, and an enlarged section with a top opening, wherein the horizontal cross section of the tapered section gradually decreases in the direction from bottom to top, the horizontal cross section of the enlarged section gradually increases in the direction from bottom to top, and the cooling pipeline is communicated with the tapered section.

[0010] In optional embodiments, the sintering patch mechanism comprises a fixing column and a pressing assembly, the pressing assembly comprises a pressing head and a pressing driving member, the pressing driving member is arranged on the fixing column and connected with the pressing head to drive the pressing head to perform a pressing action. In optional embodiments, the sintering patch mechanism further comprises a feeding assembly, the feeding assembly comprises a feeding bin, a feeding track, and a transfer member, the feeding bin is arranged on one side of the feeding track, the transfer member is arranged on the side of the feeding bin away from the feeding track, and one end of the feeding track extends to the bottom end of the fixing column.

[0011] In optional embodiments, the feeding assembly further comprises a pushing member, the pushing member is movably arranged on one side of the feeding track and selectively partially extends into the feeding track.

[0012] In optional embodiments, the sintering patch mechanism comprises an adsorption head and a position adjusting module, the position adjusting module is movably arranged on the fixing mechanism and connected with the adsorption head. The adsorption head is configured to adsorb the chip and align the chip to the mounting area of the shell or detach the chip from the mounting area under the driving of the position adjusting module; and / or the bottom end of the adsorption head is formed with an avoiding gap, at least two sides of the avoiding gap are formed with negative pressure adsorption surfaces, the avoiding gap is configured to avoid the functional area of the chip, and the negative pressure adsorption surfaces are configured to adsorb the non-functional area of the chip.

[0013] In an optional embodiment, the sintering patch mechanism comprises an adsorption head, a position adjusting module, a pressing assembly and a conversion seat, the position adjusting module is movably arranged on the fixing mechanism, the adsorption head and the pressing assembly are both mounted on the conversion seat, the conversion seat is configured to switch the relative positions of the adsorption head and the pressing assembly, the adsorption head is configured to detach the chip from the mounting area under the driving of the position adjusting module, and the pressing assembly is configured to align and adhere the chip to the mounting area of the shell.

[0014] In an optional embodiment, the fixing mechanism comprises a fixing rack, a mounting carrier, a driving assembly and a protective enclosure, the protective enclosure is arranged on the fixing rack and forms the containing chamber, and the mounting carrier is movably arranged on the fixing rack; the driving assembly is arranged on the fixing rack, and the driving assembly partially extends into the protective enclosure and is in transmission connection with the mounting carrier.

[0015] In an optional embodiment, the fixing mechanism further comprises a clamping assembly, the clamping assembly comprises a sliding seat and a positioning clamping piece, the fixing rack is further provided with a sliding rail, the sliding seat is slidably arranged on the sliding rail and is configured to move close to or away from the mounting carrier, and the positioning clamping piece is arranged on the sliding seat and is configured to be correspondingly inserted into the slot on the shell to fix the shell.

[0016] In a second aspect, an embodiment of the present application provides a repair method, which is suitable for the repair device described above, and the method comprises the following steps: installing a shell in the containing chamber, wherein at least one mounting area of the shell has a chip in a failure state, and the containing chamber is continuously filled with nitrogen through the gas inlet and discharged through the gas outlet; heating the shell to a first preset temperature, wherein the first preset temperature is less than the melting temperature of the solder; heating the failed chip to a second preset temperature, wherein the second preset temperature is greater than the melting temperature of the solder; removing the failed chip from the mounting area and adsorbing the molten solder; maintaining the shell at the first preset temperature; placing a solder sheet on the exposed mounting area; adhering a qualified chip to the mounting area; heating the chip to the second preset temperature, stopping heating after the solder sheet is completely melted, introducing nitrogen into the mounting area, and sintering and fixing the qualified chip in the mounting area.

[0017] In an optional embodiment, the step of sintering and fixing the qualified chip in the mounting area comprises: pressing the chip downward by a preset distance to sinter and fix the chip in the mounting area; and / or, before the step of placing the solder sheet in the exposed mounting area, the method further comprises: rotating the shell to make the exposed mounting area horizontally upward; wherein the shell is in a tower shape.

[0018] The beneficial effects of the embodiments of the present application include: The repair device and repair method provided by the embodiments of the present application, when sintering and repairing, first use the fixing mechanism to install the shell and can adjust the angle or position of the shell, then use the heating mechanism to preheat the shell, then use the sintering and patching mechanism to patch the chip to the mounting area of the shell and sinter and fix the chip on the mounting area, and finally use the cooling pipeline to pass cooling gas to the mounting area to cool the sintered chip. Compared with the prior art, the sintering and patching mechanism can realize automatic alignment, patching and sintering of the chip without manual sintering, and by adjusting the angle or position of the shell, sintering of a single chip can be realized, avoiding affecting other chips that do not need to be repaired, and simplifying the overall structure. At the same time, the cooling pipeline can directly pass cooling gas to the mounting area to directly cool the sintered single chip, avoiding overall chamber or environmental cooling, without the need for a large amount of cooling gas, effectively saving the amount of cooling gas used, and the cooling effect is better, without affecting other already patched chips. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0020] Figure 1 The structure schematic diagram of the repair device provided by the embodiments of the present application in the first perspective view; Figure 2 The structure schematic diagram of the repair device provided by the embodiments of the present application in the second perspective view; Figure 3 The partial structure schematic diagram of the repair device provided by the embodiments of the present application; Figure 4 The structure schematic diagram of the repair device provided by the embodiments of the present application in the third perspective view; Figure 5 The structure schematic diagram of the repair device provided by the embodiments of the present application in the third perspective view; Figure 4Schematic diagram of the adsorption head; Figure 6 A schematic diagram of the second sintering patch mechanism in the rework device provided in an embodiment of the present invention from a first perspective. Figure 7 A schematic diagram of the second type of sintering patch mechanism in the rework device provided in an embodiment of the present invention from a second perspective. Figure 8 A schematic diagram of the second type of sintering patch mechanism in the rework device provided in an embodiment of the present invention from a third perspective; Figure 9 A schematic diagram of the second sintering patch mechanism in the rework device provided in an embodiment of the present invention from a fourth perspective; Figure 10 This is a schematic diagram of the third type of sintering patch mechanism in the rework device provided in an embodiment of the present invention.

[0021] Icons: 10-Rework device; 100-Fixing mechanism; 110-Base; 120-Fixing frame; 130-Mounting support; 140-Drive assembly; 150-Clamping assembly; 151-Sliding seat; 152-Push-pull handle; 153-Alignment clamping component; 154-Slide rail; 160-Protective enclosure; 161-Receiving chamber; 162-Air inlet; 163-Air outlet; 170-Protective pipe; 200-Heating mechanism; 210-Heating tube; 300-Sintering patch mechanism; 330-Fixing column 340 - Pressing assembly; 341 - Pressing head; 342 - Pressing drive; 350 - Feeding assembly; 351 - Feeding bin; 352 - Feeding track; 353 - Transfer component; 354 ​​- Pushing component; 370 - Adsorption head; 371 - Clearance notch; 380 - Position adjustment module; 390 - Converter seat; 400 - Cooling mechanism; 410 - Cooling pipe; 420 - Cooling cover; 421 - Guide plate; 422 - Tapered section; 423 - Connecting section; 424 - Enlarged section; 20 - Housing; 30 - Chip. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0025] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0026] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0027] As disclosed in the background section, when reworking existing COS (Chip on Submount) chips, since the casing typically contains multiple chips, and only one or more of them may fail, reworking usually requires melting and disassembling the failed chip and then re-sintering a new, usable chip. Therefore, due to process limitations, a manual sintering process is currently commonly used. This involves heating the entire chip during disassembly, using tools to remove the failed chip, manually placing solder and a new, usable chip in the disassembled area, and then placing it in a sintering furnace for re-sintering. During this process, other unfailed chips are also affected and therefore require clamping using fixtures.

[0028] Therefore, conventional rework processes cannot achieve targeted removal and sintering of individual chips, leaving the remaining undamaged chips susceptible to thermal effects. Furthermore, manual sintering is inefficient, requiring a large amount of cooling gas for overall cooling after sintering, making it impossible to cool the specific sintered area, resulting in wasted cooling gas.

[0029] To address the aforementioned problems, embodiments of the present invention provide a novel rework device and rework method. It should be noted that, unless otherwise specified, the features in the embodiments of the present invention can be combined with each other.

[0030] See Figure 1This invention provides a rework device 10 that can automate the rework and sintering of a single chip 30. By utilizing the principle of local heating, it can disassemble and sinter a single chip 30, avoiding the impact on other chips 30. At the same time, it can perform point cooling on the reworked and sintered chip 30 without the need for a large amount of cooling gas, thus effectively saving the amount of cooling gas used.

[0031] The rework device 10 provided in this embodiment of the invention includes a fixing mechanism 100, a heating mechanism 200, a sintering and bonding mechanism 300, and a cooling mechanism 400. The fixing mechanism 100 has an air inlet 162 and an air outlet 163 respectively communicating with a receiving chamber 161. The receiving chamber 161 is configured to receive a housing 20. The fixing mechanism 100 is also configured to adjust the angle or position of the housing 20. The heating mechanism 200 is disposed on the fixing mechanism 100 and located inside the receiving chamber 161. The sintering and bonding mechanism 300 extends into the receiving chamber 161 through the air outlet 163 and is spaced from the edge of the air outlet 163. The sintering and bonding mechanism 300 is configured to bond a chip 30 to the mounting area of ​​the housing 20 and heat and fix the chip 30 to the mounting area. The cooling mechanism 400 includes a cooling pipe 410, which is connected to the sintering and bonding mechanism 300 and communicates with the mounting area.

[0032] In actual rework sintering, the housing 20 is first installed in the receiving chamber 161 using the fixing mechanism 100, and the angle or position of the housing 20 can be adjusted. Then, the housing 20 is preheated using the heating mechanism 200. Next, the chip 30 is bonded to the mounting area of ​​the housing 20 using the sintering and bonding mechanism 300, and the chip 30 is sintered and fixed in the mounting area. Finally, cooling gas is introduced into the mounting area through the cooling pipe 410 to cool the sintered chip 30. By using the sintering and bonding mechanism 300, automatic bonding and sintering of the chip 30 can be achieved, eliminating the need for manual sintering. Furthermore, by adjusting the angle or position of the housing 20, sintering of a single chip 30 can be achieved, avoiding interference with other chips 30 that do not require rework, thus simplifying the overall structure. Meanwhile, the cooling pipe 410 can directly introduce cooling gas into the installation area, thereby directly cooling the sintered single chip 30, avoiding the need for cooling the entire chamber or environment, eliminating the need for a large amount of cooling gas, effectively saving the amount of cooling gas used, and providing a better cooling effect without affecting other chips 30 that have already been mounted.

[0033] It should be noted that the chip 30 mentioned in this embodiment can be a COS (Chip on Submount) chip, which is mounted on the housing 20. The housing 20 can be a tower-shaped housing or a ring-shaped housing, with multiple COS chips distributed in a stepped manner around its perimeter. Of course, the chip 30 and housing 20 here are not limited to these. Any structure with a chip 30 mounted on the housing 20 that requires rework, disassembly, and sintering is within the protection scope of this invention.

[0034] See Figures 2 to 5 In some embodiments, the heating mechanism 200 includes a plurality of heating tubes 210 disposed within the receiving chamber 161, thereby enabling the receiving chamber 161 to be heated. Specifically, the heating tubes 210 may be infrared irradiation lamps distributed around the perimeter of the housing 20. Here, the heating tubes 210 can heat the housing 20 within the receiving chamber 161 to a first preset temperature, which is lower than the melting temperature of the solder, thereby achieving preheating.

[0035] In some embodiments, the sintering and bonding mechanism 300 includes an adsorption head 370 and a position adjustment module 380. The position adjustment module 380 is movably mounted on the fixing mechanism 100 and connected to the adsorption head 370. The adsorption head 370 is configured to adsorb the chip 30 and, driven by the position adjustment module 380, aligns and bonds the chip 30 to the mounting area of ​​the housing 20 or removes the chip 30 from the mounting area.

[0036] Specifically, the position adjustment module 380 can be a three-dimensional translation mechanism, achieving three-dimensional movement through a combination of multiple cylinders, slide rails, and sliders. The specific structure can refer to existing three-dimensional translation mechanisms. The adsorption head 370, driven by the position adjustment module 380, can achieve three-dimensional position adjustment. During disassembly, the adsorption head 370 can directly adsorb the failed chip 30 to be disassembled and remove it. Simultaneously, during sintering, the adsorption head 370 can adsorb qualified chips 30 to the mounting area for convenient sintering.

[0037] In some embodiments, the bottom end of the adsorption head 370 has an avoidance notch 371, and at least two sides of the avoidance notch 371 have negative pressure adsorption surfaces. The avoidance notch 371 is configured to avoid the functional area of ​​the chip 30, and the negative pressure adsorption surfaces are configured to adhere to and adsorb the non-functional area of ​​the chip 30. Specifically, the avoidance notch 371 makes the adsorption head 370 have an arched groove structure. The functional area here refers to the gold wires on the heat sink and the pin area of ​​the chip 30. The non-functional area refers to the flat surface area of ​​the chip 30, where no gold wires or pins are provided. That is, the adsorption head 370 adsorbs on the non-functional area without affecting the function, performance, or structure of the chip 30.

[0038] Furthermore, the sintering and bonding mechanism 300 also includes a heating module (not shown in the figure). This heating module can be an electromagnetic pulse heating element and is integrated on the adsorption head 370, so that the chip 30 can be heated in a concentrated manner during disassembly and sintering. For details, please refer to the subsequent disassembly and sintering steps.

[0039] In some embodiments, the fixing mechanism 100 includes a fixing frame 120, a mounting base 130, a drive assembly 140, and a protective housing 160. The protective housing 160 is disposed on the fixing frame 120 and encloses a receiving chamber 161. The mounting base 130 is movably disposed on the fixing frame 120. The drive assembly 140 is disposed on the fixing frame 120, and a portion of the drive assembly 140 extends into the protective housing 160 and is drively connected to the mounting base 130. Specifically, the fixing frame 120 is mounted on a base 110, and a support seat is provided on the edge of the base 110. The position adjustment module 380 is disposed on the support seat. The drive assembly 140 may be composed of a stepper motor, and the output shaft of the stepper motor is connected to the mounting base 130, thereby driving the mounting base 130 to rotate, realizing the adjustment of the angle of the housing 20, and ensuring that the installation area on the housing 20 that needs to be processed is horizontally upward.

[0040] Furthermore, the fixing mechanism 100 also includes a clamping assembly 150, which includes a sliding seat 151 and an alignment clamping member 153. A slide rail 154 is also provided on the fixing frame 120. The sliding seat 151 is slidably mounted on the slide rail 154 and configured to move closer to or further away from the mounting carrier 130. The alignment clamping member 153 is mounted on the sliding seat 151 and configured to correspondingly insert into a slot on the housing 20 to fix the housing 20. Specifically, the clamping assembly 150 also includes a push-pull handle 152, which is located at the end of the slide rail 154 away from the mounting carrier 130 and is kinetically connected to the sliding seat 151, enabling the sliding seat 151 to move closer to or further away from the mounting carrier 130. In actual use, the housing 20 can be fixed or released by pushing or pulling the handle 152. In the fixed state, the housing 20 is horizontally limited, but the drive assembly 140 can still rotate the housing 20 via the mounting carrier 130 to achieve angle adjustment.

[0041] See Figures 6 to 9In some embodiments, the cooling mechanism 400 further includes a cooling cover 420, which surrounds the sintering and mounting mechanism 300 and covers the mounting area. The outlet end of the cooling pipe 410 extends into the cooling cover 420. Specifically, during actual sintering, the cooling cover 420 can cover the mounting area, allowing the sintered chip 30 to be in a relatively enclosed environment. At this time, cooling gas, preferably nitrogen, is introduced into the cooling cover 420 through the cooling pipe 410, so that the mounting area is in a flowing nitrogen atmosphere and the sintered chip 30 is precisely cooled.

[0042] In some embodiments, the air inlet 162 is located at the bottom of the receiving chamber 161, the air outlet 163 is located at the top of the receiving chamber 161, and the cooling pipe 410 is located at the air inlet 162. Specifically, the air inlet 162 and the air outlet 163 are located at the bottom and top of the receiving chamber 161, respectively, thus achieving a bottom-intake and top-out structure. Nitrogen gas can be introduced through the air inlet 162, thereby placing the entire receiving chamber 161 in a flowing nitrogen environment, thus forming a protective atmosphere, allowing nitrogen gas to flow within the receiving chamber 161, displacing the air within the receiving chamber 161, and ensuring that the housing 20 can be successfully disassembled and sintered. Furthermore, the cooling pipe 410 also introduces nitrogen gas from bottom to top through the air inlet 162, providing precise cooling for the sintered chip 30.

[0043] Furthermore, a protective conduit 170 is also provided at the air inlet 162. One end of the cooling conduit 410 extends into the cooling cover 420, and the other end connects to the air inlet 162 or the protective conduit 170. Specifically, the cooling conduit 410 is a flexible hose with a certain length allowance. The protective conduit 170 can introduce nitrogen gas into the receiving chamber 161 through the air inlet 162. The bottom end of the cooling conduit 410 can connect to the air inlet 162, thereby delivering the nitrogen gas at the air inlet 162 to the installation area. Of course, the cooling conduit 410 can also be directly connected to the protective conduit 170, so that the protective conduit 170 and the cooling conduit 410 can be integrated and use a common gas source.

[0044] In some embodiments, an airflow valve may also be provided at the air inlet end of the protective pipe 170 (i.e., the end near the air inlet 162). This airflow valve opens when nitrogen cooling of the sintered chip 30 is required, increasing the nitrogen flow into the cooling cover 420 to improve the cooling effect. In other cases, the nitrogen flow into the cooling cover 420 is reduced, as long as the nitrogen atmosphere flowing through the cooling cover 420 is maintained.

[0045] In some embodiments, a guide plate 421 is further provided inside the cooling cover 420. The guide plate 421 is connected to the air outlet end of the cooling pipe 410 and extends horizontally. A gap is pre-set between the guide plate 421 and the inner wall of the cooling cover 420, and / or, a through-hole is provided on the guide plate 421. Preferably, the gap is located on the side away from the cooling pipe 410. Specifically, during the sintering process, the guide plate 421, corresponding to the area above the mounting region, can guide the cooling gas (nitrogen) blown out of the cooling pipe 410 to the surface of the chip 30, thereby ensuring sufficient contact between the nitrogen and the chip 30 to be cooled, improving the cooling effect. After heat exchange with the chip 30, the nitrogen becomes hot nitrogen, which is discharged through the gap and / or the vent to the top opening of the cooling cover 420. This improves the cooling effect of the cooling cover 420. The guide plate 421 also has a through-hole for the adsorption or pressing member of the sintering mounting mechanism 300 to pass through.

[0046] In some embodiments, the cooling shroud 420 includes, from bottom to top, a tapering section 422 with a bottom opening, a connecting section 423, and an enlarging section 424 with a top opening, wherein the horizontal cross-section of the tapering section 422 gradually decreases from bottom to top, the horizontal cross-section of the enlarging section 424 gradually increases from bottom to top, and the cooling pipe 410 is connected to the tapering section 422.

[0047] Specifically, the tapered section 422, connecting section 423, and expanding section 424 are arranged sequentially from bottom to top and integrally formed. The cooling pipe 410 connects to the tapered section 422, allowing the cooling gas (nitrogen) to fully contact the chip 30. After entering the tapered section 422, the nitrogen is guided to the surface of the chip 30 by the guide plate 421. After sufficient heat exchange, the gas flows through the gaps around the guide plate 421 along the tapered section 422 to the connecting section 423, and finally flows out through the opening of the expanding section 424, achieving rapid discharge of the cooled nitrogen. The length ratio of the tapered section 422 and the opening inclination of the expanding section 424 in the vertical direction can be further designed according to actual needs.

[0048] It should be noted that the connecting section 423 here can also be designed as an arc shape, so that the cooling shroud 420 has a gradual shape. Alternatively, the connecting section 423 can be omitted, and the tapering section 422 can be directly connected to the expanding section 424.

[0049] In some embodiments, the sintering and mounting mechanism 300 includes a fixing post 330 and a pressing assembly 340. The pressing assembly 340 includes a pressing head 341 and a pressing drive 342. The pressing drive 342 is disposed on the fixing post 330 and connected to the pressing head 341 to drive the pressing head 341 to perform a pressing action. Specifically, the bottom end of the fixing post 330 can extend into the receiving chamber 161 through the air outlet 163. Under the drive of the pressing drive 342, the pressing head 341 presses the qualified chip 30 down to the mounting area, completing the chip 30 mounting action. The required descent distance after the solder melts to ensure good contact between the chip 30 and the housing 20 over time is obtained through experiments and set as a preset distance.

[0050] It should be noted that the pressing head 341 here can also be integrated with a heating module, that is, an electromagnetic pulse heating element, which can heat the chip 30 during the pressing process, so that the solder is in a molten state and then the chip 30 is pressed down again at a preset distance to ensure that the chip 30 is properly attached.

[0051] Furthermore, the sintering and bonding mechanism 300 also includes a loading assembly 350, which includes a loading bin 351, a loading track 352, and a transfer member 353. The loading bin 351 is located on one side of the loading track 352, and the transfer member 353 is located on the side of the loading bin 351 away from the loading track 352. One end of the loading track 352 extends to the bottom end of the fixing post 330. Specifically, the transfer member can transfer multiple chips 30 in the loading bin 351 to the loading track 352, and the loading track 352 can transport the chips 30 to below the pressing head 341.

[0052] In some embodiments, the feeding assembly 350 further includes a pusher 354, which is movably disposed on one side of the feeding track 352 and selectively extends partially into the feeding track 352. By designing the pusher 354, multiple chips 30 on the feeding track 352 can be pushed, allowing multiple chips 30 to be sequentially transported to the underside of the pressure head 341 to complete the placement operation in multiple mounting areas.

[0053] See Figure 10In some embodiments, the sintering and bonding mechanism 300 includes an adsorption head 370, a position adjustment module 380, a pressing component 340, and a conversion seat 390. The position adjustment module 380 is movably mounted on the fixing mechanism 100. The adsorption head 370 and the pressing component 340 are both mounted on the conversion seat 390. The conversion seat 390 is configured to switch the relative positions of the adsorption head 370 and the pressing component 340. The adsorption head 370 is configured to remove the chip 30 from the mounting area under the drive of the position adjustment module 380, and the pressing component 340 is configured to align and bond the chip 30 to the mounting area of ​​the housing 20. Specifically, the switching of the adsorption head 370 and the pressing component 340 can be achieved by setting the conversion seat 390. The specific structure of the adsorption head 370 and the pressing component 340 can be referred to the above description. The conversion seat 390 can be switched by motor control or manually, and is not specifically limited here.

[0054] Another embodiment of the present invention provides a rework method applicable to the aforementioned rework device 10, the method comprising the following steps: S1: Install housing 20 in receiving chamber 161.

[0055] At least one mounting area of ​​the housing 20 has a chip 30 in a disabled state, and the receiving chamber 161 is in a flowing nitrogen environment. Specifically, the housing 20 to be disassembled is first mounted on the mounting carrier 130 and clamped and fixed using the clamping assembly 150. The mounting carrier 130 is rotated by the driving assembly 140 so that the chip 30 to be disassembled is horizontally facing upwards. Then, the flow rate of the protective gas (nitrogen) is set, the protective gas is turned on, and nitrogen is continuously introduced into the receiving chamber 161 through the inlet 162 and discharged outwards through the outlet 163, so that the gas flows in the receiving chamber 161, displacing the air.

[0056] S2: Heat the housing 20 to the first preset temperature.

[0057] Specifically, the heating mechanism 200 uses multiple infrared irradiation lamps to heat the receiving chamber 161, raising the housing 20 to a first preset temperature. This first preset temperature is lower than the melting temperature of the solder, for example, if the solder is SAC305 (tin-silver-copper) solder, its melting temperature can be 218°C. In some embodiments, the first preset temperature can be 175°C-190°C, at which temperature the solder will not fuse, preventing other undamaged chips 30 from detaching. During heating, the infrared irradiation lamps heat the entire tower-shaped housing 20, and the heating temperature is fed back in real time by a temperature probe.

[0058] S3: The chip that has failed to heat up is brought to the second preset temperature.

[0059] The second preset temperature is higher than the first preset temperature, and the second preset temperature is also higher than the solder melting temperature. Specifically, chip 30 can be disassembled using an adsorption head 370. First, the adsorption head 370 is moved directly above the failed chip 30, and then the adsorption head 370 is pressed down to make contact with the chip 30. Then, the chip 30 to be disassembled can be directly heated by the pulse heating element on the adsorption head 370. The combined heating of the receiving chamber 161 by the infrared irradiation lamp and the chip 30 to be disassembled by the pulse heating element on the adsorption head 370 brings the failed chip 30 to the second preset temperature, causing the solder to melt.

[0060] The pulse heating element can raise the temperature of the adsorption head 370 to 100℃-130℃, thereby allowing the chip 30 area to be further heated to a second preset temperature, which can be 230-250℃, higher than the solder melting temperature. In other words, the combined thermal fields of infrared heating (180℃) and electromagnetic pulse heating (100℃) can make the local temperature of the solder exceed its melting temperature (10℃-30℃ higher). During this process, it is necessary to ensure close contact between the adsorption head 370 and the chip 30.

[0061] S4: Remove the failed chip 30 from the mounting area and absorb the molten solder.

[0062] Specifically, the failed chip 30 can be removed from the mounting area by an additional disassembly mechanism or by the adsorption action of the adsorption head 370, and the residual solder can be adsorbed and removed, thus completing the disassembly of the chip 30.

[0063] After disassembly, the sintering step is required.

[0064] S5: Keep the housing 20 at the first preset temperature.

[0065] Step S5 can be executed immediately following step S4, or steps S1-S4 can be repeated to disassemble multiple failed chips 30 before executing step S5. Step S5 and step S2 are cyclical preheating steps. This embodiment uses the example of disassembling a single failed chip 30 and then sintering a single qualified chip 30 as an example for explanation.

[0066] Specifically, firstly, a qualified COS chip is installed on the adsorption head 370 with an electromagnetic pulse heating element, wherein the adsorption head 370 can adsorb the non-functional area of ​​the chip 30. Then, the protective gas flow rate is reset and the protective gas is turned on, so that nitrogen gas is blown from bottom to top and flows in the receiving chamber 161, displacing the air in the receiving chamber 161. Then, multiple infrared irradiation lamps are used to reheat the receiving chamber 161, so that the housing 20 can be maintained at a first preset temperature.

[0067] S6: Place the solder pad in the exposed mounting area.

[0068] Specifically, solder sheets can be placed in the cleaned mounting area. The solder sheets will not melt directly at the first preset temperature, and the solder sheets can also be SAC305 (tin-silver-copper) solder. Before placing the solder sheets, the housing 20 needs to be rotated so that the exposed mounting area is horizontally facing upwards; the housing 20 is tower-shaped. That is, the stepper motor of the drive assembly 140 needs to be used to align the initial position. Specifically, based on the distribution of the chips 30 in the tower-shaped housing 20, the angle between two adjacent chips 30 is calculated, and the housing 20 is rotated until the mounting area to be sintered is horizontally facing upwards. Then, the pre-formed solder sheets are placed within the mounting area.

[0069] S7: Attach the qualified chip 30 to the mounting area.

[0070] Specifically, first, the adsorption head 370 is moved directly above the mounting area to be sintered. Then, the adsorption head 370 is pressed down so that it contacts the chip 30. The contact status between the chip 30 and the mounting area can be determined by a pressure sensor. Of course, the pressing component 340 can also be used instead of the adsorption head 370 here.

[0071] S8: Heat the chip 30 to the second preset temperature. After the solder sheet has completely melted, stop heating, introduce nitrogen gas into the mounting area, and sinter the qualified chip 30 to fix it in the mounting area.

[0072] Specifically, the electromagnetic pulse heating mode of the adsorption head 370 is activated, and its integrated electromagnetic pulse heating element is used to heat the adsorption head 370 to 100°C, thereby heating the chip 30 to a second preset temperature, which is higher than the solder melting temperature. The solder melting state is then observed. After the solder melts, the chip 30 is pressed down a preset distance, causing the chip 30 to be sintered and fixed within the mounting area. This preset distance can be an empirical value, such as 1-3mm, and pressing down on the chip 30 ensures proper fit. Heating is then stopped, and cooling gas is introduced into the mounting area through the cooling pipe 410, causing the sintered chip 30 to cool rapidly, thereby rapidly cooling and solidifying the solder, completing the sintering process.

[0073] It should be noted that during the process of aligning the adsorption head 370 with the installation area, a CCD module can be used to assist in the judgment. The CCD module can determine the alignment status of the qualified chip 30 with the installation area. If there is a deviation, a small-angle fine adjustment can be made by the fine-tuning module that moves the adsorption head 370 to ensure the alignment status of the chip 30.

[0074] The rework device 10 and rework method provided in this embodiment of the invention, during rework sintering, firstly, a fixing mechanism 100 is used to install the housing 20, and the angle or position of the housing 20 can be adjusted. Then, a heating mechanism 200 is used to preheat the housing 20. Next, a sintering and bonding mechanism 300 is used to bond the chip 30 to the mounting area of ​​the housing 20, and the chip 30 is sintered and fixed on the mounting area. Finally, a cooling pipe 410 is used to introduce cooling gas into the mounting area to cool the sintered chip 30. Compared with the prior art, this embodiment of the invention uses a sintering and bonding mechanism 300 to achieve automatic alignment, bonding, and sintering of the chip 30, eliminating the need for manual sintering. Furthermore, by adjusting the angle or position of the housing 20, the sintering of a single chip 30 can be achieved, avoiding affecting other chips 30 that do not require rework, and simplifying the overall structure. Meanwhile, the cooling pipe 410 can directly introduce cooling gas into the installation area, thereby directly cooling the sintered single chip 30, avoiding the need for cooling the entire chamber or environment, eliminating the need for a large amount of cooling gas, effectively saving the amount of cooling gas used, and providing a better cooling effect without affecting other chips 30 that have already been mounted.

[0075] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A rework device, characterized in that, include: A fixing mechanism (100) has a receiving chamber (161), an air inlet (162) and an air outlet (163) respectively communicating with the receiving chamber (161), the receiving chamber (161) being configured to receive a housing (20), and the fixing mechanism (100) being further configured to adjust the angle or position of the housing (20); A heating mechanism (200) is disposed on the fixing mechanism (100) and located within the receiving chamber (161); A sintering and bonding mechanism (300) extends into the receiving chamber (161) through the air outlet (163) and is spaced from the edge of the air outlet (163). The sintering and bonding mechanism (300) is configured to bond the chip (30) to the mounting area of ​​the housing (20) and heat and fix the chip (30) to the mounting area. A cooling mechanism (400) includes a cooling pipe (410) connected to the sintering patch mechanism (300) and connected to the mounting area.

2. The rework device according to claim 1, characterized in that, The cooling mechanism (400) further includes a cooling shroud (420) with openings at both ends. The cooling shroud (420) surrounds the outer periphery of the sintering patch mechanism (300) and covers the mounting area. The outlet end of the cooling pipe (410) extends into the cooling shroud (420).

3. The rework device according to claim 2, characterized in that, The air inlet (162) is located at the bottom of the receiving chamber (161), the air outlet (163) is located at the top of the receiving chamber (161), and the cooling pipe (410) is located at the air inlet (162). And / or, a protective pipe (170) is also provided at the air inlet (162), and the air inlet end of the cooling pipe (410) is connected to the air inlet (162) or the protective pipe (170).

4. The rework device according to claim 2, characterized in that, The cooling cover (420) is also provided with a guide plate (421), which is connected to the air outlet of the cooling pipe (410) and extends in the horizontal direction. The guide plate (421) and the inner wall of the cooling cover (420) are pre-set with a gap.

5. The rework device according to claim 2, characterized in that, The cooling shroud (420) includes, from bottom to top, a tapering section (422) with a bottom opening, a connecting section (423), and an enlarging section (424) with a top opening. The horizontal cross-section of the tapering section (422) gradually decreases from bottom to top, and the horizontal cross-section of the enlarging section (424) gradually increases from bottom to top. The cooling pipe (410) is connected to the tapering section (422).

6. The rework device according to claim 1, characterized in that, The sintering patch mechanism (300) includes a fixed post (330) and a pressing assembly (340). The pressing assembly (340) includes a pressing head (341) and a pressing drive (342). The pressing drive (342) is disposed on the fixed post (330) and connected to the pressing head (341) to drive the pressing head (341) to perform a pressing action.

7. The rework device according to claim 6, characterized in that, The sintering and patching mechanism (300) further includes a feeding assembly (350), which includes a feeding bin (351), a feeding track (352), and a transfer member (353). The feeding bin (351) is located on one side of the feeding track (352), and the transfer member (353) is located on the side of the feeding bin (351) away from the feeding track (352). One end of the feeding track (352) extends to the bottom end of the fixed column (330).

8. The rework device according to claim 7, characterized in that, The feeding assembly (350) also includes a pusher (354), which is movably disposed on one side of the feeding track (352) and selectively extends partially into the feeding track (352).

9. The rework device according to claim 1, characterized in that, The sintering patch mechanism (300) includes an adsorption head (370) and a position adjustment module (380). The position adjustment module (380) is movably mounted on the fixing mechanism (100) and connected to the adsorption head (370). The adsorption head (370) is configured to adsorb the chip (30) and, driven by the position adjustment module (380), align and attach the chip (30) to the mounting area of ​​the housing (20) or remove the chip (30) from the mounting area; and / or, the bottom end of the adsorption head (370) is formed with an avoidance notch (371), and at least two sides of the avoidance notch (371) are formed with negative pressure adsorption surfaces. The avoidance notch (371) is configured to avoid the functional area of ​​the chip (30), and the negative pressure adsorption surfaces are configured to adhere to and adsorb the non-functional area of ​​the chip (30).

10. The rework device according to claim 1, characterized in that, The sintering and bonding mechanism (300) includes an adsorption head (370), a position adjustment module (380), a pressing component (340), and a conversion seat (390). The position adjustment module (380) is movably mounted on the fixing mechanism (100). The adsorption head (370) and the pressing component (340) are both mounted on the conversion seat (390). The conversion seat (390) is configured to switch the relative positions of the adsorption head (370) and the pressing component (340). The adsorption head (370) is configured to remove the chip (30) from the mounting area under the drive of the position adjustment module (380). The pressing component (340) is configured to align and bond the chip (30) to the mounting area of ​​the housing (20).

11. The rework device according to claim 1, characterized in that, The fixing mechanism (100) includes a fixing frame (120), a mounting base (130), a drive assembly (140), and a protective enclosure (160). The protective enclosure (160) is disposed on the fixing frame (120) and forms the receiving chamber (161). The mounting base (130) is movably disposed on the fixing frame (120). The drive assembly (140) is disposed on the fixing frame (120), and part of the drive assembly (140) extends into the protective enclosure (160) and is connected to the mounting base (130) in a transmission manner.

12. The rework device according to claim 11, characterized in that, The fixing mechanism (100) further includes a clamping assembly (150), which includes a sliding seat (151) and an alignment clamping member (153). The fixing frame (120) is also provided with a slide rail (154). The sliding seat (151) is slidably disposed on the slide rail (154) and is configured to be close to or away from the mounting carrier (130). The alignment clamping member (153) is disposed on the sliding seat (151) and is configured to be inserted into a slot on the housing (20) to fix the housing (20).

13. A rework method, characterized in that, The method, applicable to the rework apparatus as described in any one of claims 1-12, comprises: A housing (20) is installed in a receiving chamber (161), wherein the chip (30) in at least one mounting area of ​​the housing (20) is in a disabled state, and nitrogen gas is continuously introduced into the receiving chamber (161) through the air inlet (162) and discharged outward through the air outlet (163); The housing (20) is heated to a first preset temperature, wherein the first preset temperature is less than the solder melting temperature; The chip (30) that has failed to heat up is brought to a second preset temperature, which is greater than the solder melting temperature; Remove the failed chip (30) from the mounting area and absorb the molten solder; Maintain the housing (20) at a first preset temperature; Place the solder sheet in the exposed mounting area; The qualified chip (30) is attached to the mounting area; The chip (30) is heated to a second preset temperature. After the solder sheet has completely melted, the heating is stopped, nitrogen gas is introduced into the mounting area, and the qualified chip (30) is sintered and fixed in the mounting area.

14. The rework method according to claim 13, characterized in that, The step of sintering and fixing the qualified chip (30) in the mounting area includes: The chip (30) is pressed down by a preset distance so that the chip (30) is sintered and fixed in the mounting area; And / or, prior to the step of placing the solder sheet in the exposed mounting area, the method further includes: Rotate the housing (20) so that the exposed mounting area is horizontal and facing upward; The shell (20) is tower-shaped.

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