Repair device and repair method

Abstract

This invention provides a rework device and method, relating to the field of chip rework technology. The rework device includes a fixing mechanism, a heating mechanism, a sintering and bonding mechanism, and a cooling mechanism. The fixing mechanism has an air inlet and an air outlet. The heating mechanism is mounted on the fixing mechanism and located within a receiving cavity. The sintering and bonding mechanism extends into the receiving cavity through the air outlet and is spaced from the edge of the air outlet. The sintering and bonding mechanism is configured to bond the chip to the mounting area of ​​the housing and heat and fix the chip to the mounting area. The cooling mechanism includes a cooling pipe connected to the sintering and bonding mechanism and leading to the mounting area. Compared to existing technologies, this invention enables the sintering of a single chip, avoiding impact on other chips that do not require rework and simplifying the overall structure. It also eliminates the need for large amounts of cooling gas, effectively saving cooling gas consumption, and provides better cooling without affecting other already bonded chips.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip repair, in particular to a repair device and a repair method. BACKGROUND

[0002] At present, COS (Chip on Submount) chips are sintered and fixed on a shell, when one or more chips are failed, the failed single chip needs to be repaired, and the repair process usually includes the steps of removing the failed chip and re-sintering the qualified chip. When re-sintering the qualified chip, since the single chip needs to be sintered, the current artificial sintering process is usually used, that is, the qualified chip and solder are placed on the shell by artificial, and then put into a sintering furnace for re-sintering.

[0003] However, this way cannot realize the sintering of single chip at a fixed point, which causes the remaining chips to be easily affected. At the same time, the artificial sintering process is low in efficiency, and a large amount of cooling gas needs to be introduced for overall cooling after sintering, which cannot cool the actual sintering part at a fixed point, causing waste of cooling gas. SUMMARY

[0004] The purpose of the present application is to provide a repair device which can realize full-automatic repair sintering action, and can realize the repair sintering of single chip, avoid affecting other chips, and can cool the sintered chip at a fixed point without the need of introducing a large amount of cooling gas, thereby effectively saving the use amount of cooling gas.

[0005] In a first aspect, the present application provides a repair device, comprising:

[0006] A fixing mechanism, the fixing mechanism has a containing chamber, an air inlet and an air outlet which are respectively communicated with the containing chamber, the containing chamber is configured to contain a shell, and the fixing mechanism is further configured to adjust the angle or position of the shell;

[0007] A heating mechanism, the heating mechanism is arranged on the fixing mechanism and located in the containing chamber;

[0008] A sintering patch mechanism, the sintering patch mechanism extends into the containing chamber through the air outlet, and a gap is preset between the sintering patch mechanism and the edge of the air outlet, the sintering patch mechanism is configured to bond a chip to a mounting area of the shell and heat and fix the chip on the mounting area;

[0009] A cooling mechanism, the cooling mechanism comprises a cooling pipeline connected to the sintering patch mechanism and communicated to the mounting area.

[0010] In an optional embodiment, the cooling mechanism further comprises a cooling cover with two ends respectively open, the cooling cover is arranged around the sintering patch mechanism, the cooling cover covers the mounting area, and the air outlet end of the cooling pipeline extends into the cooling cover.

[0011] In an optional embodiment, the air inlet is arranged at the bottom of the accommodating chamber, the air outlet is arranged at the top of the accommodating chamber, and the cooling pipeline is arranged at the air inlet; and / or, a protection pipeline is further arranged at the air inlet, and the air inlet end of the cooling pipeline is communicated to the air inlet or the protection pipeline.

[0012] In an optional embodiment, a flow guide plate is further arranged in the cooling cover, the flow guide plate is connected to the air outlet end of the cooling pipeline and extends in the horizontal direction, and the flow guide plate and the inside of the cooling cover are provided with a gap.

[0013] In an optional embodiment, the cooling cover comprises, from bottom to top, a tapered section with a bottom opening, a connecting section, and an enlarged section with a top opening, wherein the horizontal cross section of the tapered section gradually decreases in the direction from bottom to top, the horizontal cross section of the enlarged section gradually increases in the direction from bottom to top, and the cooling pipeline is communicated to the tapered section.

[0014] In an optional embodiment, the sintering patch mechanism comprises a fixing column and a pressing assembly, the pressing assembly comprises a pressing head and a pressing driving member, the pressing driving member is arranged on the fixing column and connected with the pressing head to drive the pressing head to perform pressing action.

[0015] In an optional embodiment, the sintering patch mechanism further comprises a feeding assembly, the feeding assembly comprises a feeding bin, a feeding track, and a transfer member, the feeding bin is arranged at one side of the feeding track, the transfer member is arranged at the side of the feeding bin away from the feeding track, and one end of the feeding track extends to the bottom end of the fixing column.

[0016] In an optional embodiment, the feeding assembly further comprises a pushing member, the pushing member is movably arranged at one side of the feeding track and selectively partially extends into the feeding track.

[0017] In an optional embodiment, the sintering patch mechanism comprises a suction head and a position adjusting module, the position adjusting module is movably arranged on the fixing mechanism and connected with the suction head.

[0018] The adsorption head is configured to adsorb the chip and, under the driving of the position adjustment module, align and attach the chip to the mounting area of the shell or detach the chip from the mounting area; and / or, the bottom end of the adsorption head is formed with a avoiding gap, at least two sides of the avoiding gap are formed with negative pressure adsorption surfaces, the avoiding gap is configured to avoid the functional area of the chip, and the negative pressure adsorption surfaces are configured to adsorb the non-functional area of the chip.

[0019] In an optional embodiment, the sintering patch mechanism comprises an adsorption head, a position adjustment module, a pressing assembly and a conversion seat, the position adjustment module is movably arranged on the fixing mechanism, the adsorption head and the pressing assembly are both mounted on the conversion seat, the conversion seat is configured to switch the relative positions of the adsorption head and the pressing assembly, the adsorption head is configured to detach the chip from the mounting area under the driving of the position adjustment module, and the pressing assembly is configured to align and attach the chip to the mounting area of the shell.

[0020] In an optional embodiment, the fixing mechanism comprises a fixing rack, a mounting carrier, a driving assembly and a protective enclosure, the protective enclosure is arranged on the fixing rack and forms the containing chamber, and the mounting carrier is movably arranged on the fixing rack; the driving assembly is arranged on the fixing rack, and part of the driving assembly extends into the protective enclosure and is in transmission connection with the mounting carrier.

[0021] In an optional embodiment, the fixing mechanism further comprises a clamping assembly, the clamping assembly comprises a sliding seat and an alignment clamping piece, the fixing rack is further provided with a sliding rail, the sliding seat is slidably arranged on the sliding rail and is configured to move close to or away from the mounting carrier, and the alignment clamping piece is arranged on the sliding seat and is configured to be correspondingly inserted into the slot on the shell to fix the shell.

[0022] In a second aspect, the embodiments of the present application provide a repair method, which is suitable for the repair device described above, and the method comprises:

[0023] installing a shell in the containing chamber, wherein at least one chip in a mounting area of the shell is in a failure state, and the containing chamber continuously introduces nitrogen into the containing chamber through the gas inlet and discharges the nitrogen outward through the gas outlet;

[0024] heating the shell to a first preset temperature, wherein the first preset temperature is less than a solder melting temperature;

[0025] heating the failure chip to a second preset temperature, wherein the second preset temperature is greater than the solder melting temperature;

[0026] taking off the failed chip from the mounting area and absorbing the molten solder;

[0027] maintaining the shell at a first preset temperature;

[0028] placing a solder sheet on the exposed mounting area;

[0029] attaching the qualified chip to the mounting area;

[0030] heating the chip to a second preset temperature, stopping heating after the solder sheet is completely melted, introducing nitrogen gas to the mounting area, and sintering and fixing the qualified chip on the mounting area.

[0031] In an optional embodiment, the step of sintering and fixing the qualified chip on the mounting area comprises:

[0032] pressing the chip by a preset distance to sinter and fix the chip on the mounting area; and / or, before the step of placing a solder sheet on the exposed mounting area, the method further comprises:

[0033] rotating the shell to make the exposed mounting area horizontally upward;

[0034] wherein the shell is in a tower shape.

[0035] The beneficial effects of the embodiments of the present application include:

[0036] The repair device and repair method provided by the embodiments of the present application, when performing repair sintering, first install the shell by using the fixing mechanism and can adjust the angle or position of the shell, then preheat the shell by using the heating mechanism, then attach the chip to the mounting area of the shell by using the sintering and patching mechanism and sinter and fix the chip on the mounting area, and finally introduce cooling gas to the mounting area by using the cooling pipeline to cool the sintered chip. Compared with the prior art, the embodiments of the present application can realize automatic alignment, attachment and sintering of the chip by using the sintering and patching mechanism, without manual sintering, and by adjusting the angle or position of the shell, the sintering of a single chip can be realized, avoiding the influence on other chips that do not need to be repaired, and simplifying the overall structure. At the same time, the cooling pipeline can directly introduce cooling gas to the mounting area, thereby directly cooling the sintered single chip, avoiding the cooling of the overall chamber or environment, without the need for a large amount of cooling gas, effectively saving the use amount of cooling gas, and the cooling effect is better, without affecting other attached chips. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those of ordinary skill in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0038] Figure 1 The structure schematic diagram of the repair device provided by the embodiment of the present application is shown in the first perspective view.

[0039] Figure 2 The structure schematic diagram of the repair device provided by the embodiment of the present application is shown in the second perspective view.

[0040] Figure 3 The partial structure schematic diagram of the repair device provided by the embodiment of the present application is shown.

[0041] Figure 4 The structure schematic diagram of the repair device provided by the embodiment of the present application is shown in the third perspective view.

[0042] Figure 5 The structure schematic diagram of the suction head is shown. Figure 4

[0043] The schematic diagram of the second sintering patch mechanism in the repair device provided by the embodiment of the present application is shown in the first perspective view. Figure 6

[0044] The schematic diagram of the second sintering patch mechanism in the repair device provided by the embodiment of the present application is shown in the second perspective view. Figure 7

[0045] The schematic diagram of the second sintering patch mechanism in the repair device provided by the embodiment of the present application is shown in the third perspective view. Figure 8

[0046] The schematic diagram of the second sintering patch mechanism in the repair device provided by the embodiment of the present application is shown in the fourth perspective view. Figure 9

[0047] The schematic diagram of the third sintering patch mechanism in the repair device provided by the embodiment of the present application is shown. Figure 10

[0048] ​Icon: 10 - repair device; 100 - fixing mechanism; 110 - base; 120 - fixing frame; 130 - mounting carrier; 140 - driving assembly; 150 - clamping assembly; 151 - sliding seat; 152 - push-pull handle; 153 - alignment clamping piece; 154 - sliding rail; 160 - protection enclosure; 161 - containing cavity; 162 - air inlet; 163 - air outlet; 170 - protection pipeline; 200 - heating mechanism; 210 - heating pipe; 300 - sintering patch mechanism; 330 - fixing column; 340 - pressing-down assembly; 341 - pressing-down head; 342 - pressing-down driving piece; 350 - feeding assembly; 351 - feeding bin; 352 - feeding track; 353 - transfer piece; 354 - pushing piece; 370 - adsorption head; 371 - avoiding notch; 380 - position adjusting module; 390 - conversion seat; 400 - cooling mechanism; 410 - cooling pipeline; 420 - cooling cover; 421 - flow guide plate; 422 - tapered section; 423 - connecting section; 424 - enlarged section; 20 - shell; 30 - chip. DETAILED DESCRIPTION

[0049] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0050] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0051] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0052] In the description of the present application, it should be noted that if the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the present application is usually placed, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the present application.

[0053] In addition, the terms "first", "second", etc. are used only for differentiation and cannot be understood as indicating or implying relative importance.

[0054] As disclosed in the background art, when the existing COS (Chip on Submount) chip is repaired, since there are usually multiple chips on the shell, and only one or more chips are defective, it is usually necessary to melt and disassemble the defective chip and re-sinter a new qualified chip during repair. Therefore, due to the process, the current manual sintering process is usually used, that is, the whole needs to be heated during disassembly, and the defective chip is removed by using a tool, and then the solder and the new qualified chip are manually placed in the disassembly area, and then put into the sintering furnace for re-sintering. In this process, the other non-defective chips will also be affected, so it is necessary to use a clamp to clamp them again.

[0055] Therefore, the conventional repair process cannot realize the disassembly and sintering of a single chip at a fixed point, which causes the remaining non-defective chips to be easily affected by heat. Moreover, the manual sintering process is inefficient, and a large amount of cooling gas needs to be introduced for overall cooling after sintering, which cannot cool the actual sintering site at a fixed point, resulting in waste of cooling gas.

[0056] In order to solve the above problems, the embodiments of the present application provide a new repair device and a repair method. It should be noted that the features in the embodiments of the present application can be combined with each other without conflict.

[0057] Referring to Figure 1 The embodiments of the present application provide a repair device 10, which can realize automatic repair and sintering of a single chip 30. By using the principle of local heating, the disassembly and sintering of a single chip 30 are realized, and the influence on other chips 30 is avoided. At the same time, the repaired and sintered chip 30 can be cooled at a fixed point, and a large amount of cooling gas does not need to be introduced, which effectively saves the amount of cooling gas used.

[0058] The repair device 10 provided by the embodiment of the present application comprises a fixing mechanism 100, a heating mechanism 200, a sintering patch mechanism 300 and a cooling mechanism 400. The fixing mechanism 100 is provided with an air inlet 162 and an air outlet 163 which are respectively communicated with a containing cavity 161. The containing cavity 161 is configured to contain a shell 20. The fixing mechanism 100 is further configured to adjust the angle or position of the shell 20. The heating mechanism 200 is arranged on the fixing mechanism 100 and located in the containing cavity 161. The sintering patch mechanism 300 extends into the containing cavity 161 through the air outlet 163 and is spaced apart from the edge of the air outlet 163. The sintering patch mechanism 300 is configured to bond a chip 30 to a mounting area of the shell 20 and heat and fix the chip 30 on the mounting area. The cooling mechanism 400 comprises a cooling pipeline 410 which is connected to the sintering patch mechanism 300 and communicated to the mounting area.

[0059] In actual repair sintering, the shell 20 is first installed in the containing cavity 161 by the fixing mechanism 100, and the angle or position of the shell 20 can be adjusted. Then the shell 20 is preheated by the heating mechanism 200. Then the chip 30 is bonded to the mounting area of the shell 20 by the sintering patch mechanism 300, and the chip 30 is sintered and fixed on the mounting area. Finally, the cooling pipeline 410 is used to introduce cooling gas into the mounting area to cool the sintered chip 30. By using the sintering patch mechanism 300, the automatic bonding and sintering of the chip 30 can be realized without manual sintering. By adjusting the angle or position of the shell 20, the sintering of a single chip 30 can be realized, which avoids affecting other chips 30 that do not need to be repaired and simplifies the overall structure. At the same time, the cooling pipeline 410 can directly introduce cooling gas into the mounting area to directly cool the sintered single chip 30, avoiding the cooling of the overall cavity or environment, and without the need for a large amount of cooling gas, effectively saving the use amount of cooling gas, and the cooling effect is better and does not affect other already bonded chips 30.

[0060] It should be noted that the chip 30 mentioned in the embodiment can be a COS (Chip on Submount) chip which is mounted on the shell 20. The shell 20 can be a tower-shaped shell or a ring-shaped shell, and the periphery thereof is distributed with a plurality of COS chips in a stepped manner. Of course, the chip 30 and the shell 20 herein are not limited to this, but any chip 30 which is mounted on the shell 20 and needs to be repaired, disassembled and sintered is within the protection scope of the present application.

[0061] Referring to Figures 2 to 5In some embodiments, the heating mechanism 200 comprises a plurality of heating tubes 210, which are arranged in the accommodating chamber 161 so as to heat the accommodating chamber 161. Specifically, the heating tubes 210 can be infrared irradiation tubes and are distributed around the shell 20, and the heating tubes 210 can heat the shell 20 in the accommodating chamber 161 to a first preset temperature, which is less than the melting temperature of the solder, so as to achieve preheating.

[0062] In some embodiments, the sintering and patching mechanism 300 comprises a suction head 370 and a position adjusting module 380, which is movably arranged on the fixing mechanism 100 and connected with the suction head 370. The suction head 370 is configured to adsorb the chip 30 and is driven by the position adjusting module 380 to align and patch the chip 30 to the mounting area of the shell 20 or to detach the chip 30 from the mounting area.

[0063] Specifically, the position adjusting module 380 can be a three-dimensional translation mechanism, which realizes three-dimensional movement through the combination of a plurality of air cylinders, slide rails and sliding blocks, and the specific structure can refer to the existing three-dimensional translation mechanism. The suction head 370 can realize three-dimensional position adjustment under the driving of the position adjusting module 380. When disassembling, the suction head 370 can directly adsorb the failed chip 30 to be disassembled and detach the failed chip 30. Meanwhile, when sintering, the suction head 370 can adsorb the qualified chip 30 to the mounting area, facilitating sintering.

[0064] In some embodiments, the bottom end of the suction head 370 is formed with a avoiding gap 371, at least two sides of the avoiding gap 371 are formed with negative pressure adsorption surfaces, the avoiding gap 371 is configured to avoid the functional area of the chip 30, and the negative pressure adsorption surfaces are configured to patch the non-functional area of the chip 30. Specifically, the avoiding gap 371 makes the suction head 370 present an arched groove structure, and the functional area refers to the gold wire on the heat sink and the pin area of the chip 30. The non-functional area refers to the flat surface area of the chip 30, which is not provided with gold wire or pin, that is, the suction head 370 is adsorbed in the non-functional area, which does not affect the function, performance and structure of the chip 30.

[0065] Further, the sintering and patching mechanism 300 further comprises a heating module (not shown in the figure), which can be an electromagnetic pulse heating piece and is integrated on the suction head 370, so as to concentrate on heating the chip 30 during disassembly and sintering, and the specific process can refer to the subsequent disassembly and sintering steps.

[0066] In some embodiments, the fixing mechanism 100 comprises a fixing frame 120, a mounting carrier 130, a driving assembly 140 and a protective enclosure 160, the protective enclosure 160 is arranged on the fixing frame 120 and forms a containing cavity 161, the mounting carrier 130 is movably arranged on the fixing frame 120; the driving assembly 140 is arranged on the fixing frame 120 and partially extends into the protective enclosure 160 and is in driving connection with the mounting carrier 130. Specifically, the fixing frame 120 is mounted on a base 110, the edge of the base 110 is provided with a support seat, and the position adjusting module 380 is arranged on the support seat. The driving assembly 140 can be composed of a stepping motor, the output shaft of the stepping motor is connected with the mounting carrier 130, so as to drive the mounting carrier 130 to rotate, realize the adjustment of the angle of the shell 20 and ensure that the mounting area of the shell 20 that needs to be processed is horizontally upward.

[0067] Further, the fixing mechanism 100 further comprises a clamping assembly 150, the clamping assembly 150 comprises a sliding seat 151 and a positioning clamping piece 153, the fixing frame 120 is further provided with a sliding rail 154, the sliding seat 151 is slidably arranged on the sliding rail 154 and is configured to be close to or away from the mounting carrier 130, and the positioning clamping piece 153 is arranged on the sliding seat 151 and is configured to be correspondingly inserted into the slot on the shell 20 to fix the shell 20. Specifically, the clamping assembly 150 further comprises a push-pull handle 152, the push-pull handle 152 is arranged at one end of the sliding rail 154 away from the mounting carrier 130 and is in driving connection with the sliding seat 151, so as to drive the sliding seat 151 to be close to or away from the mounting carrier 130. In actual use, the shell 20 can be fixed or unfixed by the push-pull handle 152. In the fixed state, the shell 20 is horizontally limited, and at this time the driving assembly 140 can still drive the shell 20 to rotate through the mounting carrier 130 to realize the adjustment of the angle.

[0068] Referring to Figures 6 to 9 In some embodiments, the cooling mechanism 400 further comprises a cooling cover 420, the cooling cover 420 is arranged around the outer periphery of the sintering patch mechanism 300, the cooling cover 420 covers the mounting area, and the outlet end of the cooling pipeline 410 extends into the cooling cover 420. Specifically, in actual sintering, the cooling cover 420 can cover the mounting area, so that the sintered chip 30 can be in a relatively closed environment, at this time, the cooling gas, which is preferably nitrogen, is introduced into the cooling cover 420 through the cooling pipeline 410, so that the mounting area is in a flowing nitrogen atmosphere and the sintered chip 30 is precisely cooled.

[0069] In some embodiments, the gas inlet 162 is arranged at the bottom of the accommodating chamber 161, the gas outlet 163 is arranged at the top of the accommodating chamber 161, and the cooling pipe 410 is arranged at the gas inlet 162. Specifically, the gas inlet 162 and the gas outlet 163 are arranged at the bottom and the top of the accommodating chamber 161 respectively, so as to realize the configuration of bottom gas inlet and top gas outlet. The gas inlet 162 can be connected to nitrogen gas, so that the accommodating chamber 161 is in a flowing nitrogen gas environment as a whole, thereby forming a protective atmosphere, so that nitrogen gas can flow in the accommodating chamber 161 to push away the air in the accommodating chamber 161, and ensure that the shell 20 can be smoothly disassembled and sintered. The cooling pipe 410 also passes through the gas inlet 162 to introduce nitrogen gas from bottom to top, so as to precisely cool the sintered chip 30.

[0070] Further, the gas inlet 162 is further provided with a protection pipe 170, one end of the cooling pipe 410 extends into the cooling cover 420, and the other end is connected to the gas inlet 162 or the protection pipe 170. Specifically, the cooling pipe 410 is in the form of a hose and is designed to have a certain length allowance. The protection pipe 170 can introduce nitrogen gas into the accommodating chamber 161 through the gas inlet 162, and the bottom end of the cooling pipe 410 can be connected to the gas inlet 162, so as to send the nitrogen gas at the gas inlet 162 to the mounting area. Of course, the cooling pipe 410 can also be directly connected to the protection pipe 170, so that the protection pipe 170 and the cooling pipe 410 can be integrally arranged and use a common gas source.

[0071] In some embodiments, the gas inlet end (i.e. the end close to the gas inlet 162) of the protection pipe 170 can also be provided with a gas flow valve. The gas flow valve is opened when nitrogen gas is needed to cool the sintered chip 30, so as to increase the amount of nitrogen gas introduced into the cooling cover 420, so as to improve the cooling effect. In other cases, the amount of nitrogen gas introduced into the cooling cover 420 is reduced, and only the nitrogen gas atmosphere flowing in the cooling cover 420 needs to be ensured.

[0072] In some embodiments, a flow guide plate 421 is further arranged in the cooling cover 420, which is connected to the air outlet end of the cooling pipe 410 and extends in the horizontal direction. The flow guide plate 421 is provided with a gap with the inner wall of the cooling cover 420, and / or the flow guide plate 421 is provided with air holes penetrating upward and downward. Preferably, the gap is arranged at the side away from the cooling pipe 410. Specifically, during the sintering process, the flow guide plate 421 corresponds to the upper part of the mounting area, and can guide the cooling gas (nitrogen) blown out by the cooling pipe 410 to the surface of the chip 30, so that the nitrogen gas is in full contact with the chip 30 to be cooled, thereby improving the cooling effect. After heat exchange with the chip 30 to be cooled, the nitrogen gas becomes hot nitrogen gas, which is discharged to the top opening of the cooling cover 420 through the gap and / or the air holes. In order to improve the cooling effect of the cooling cover 420. The flow guide plate 421 is further provided with a through hole for the suction or pressing member of the sintering patch mechanism 300 to pass through.

[0073] In some embodiments, the cooling cover 420 comprises, from bottom to top, a tapered section 422 with a bottom opening, a connecting section 423, and an enlarged section 424 with a top opening, wherein the horizontal cross section of the tapered section 422 gradually decreases in the direction from bottom to top, the horizontal cross section of the enlarged section 424 gradually increases in the direction from bottom to top, and the cooling pipe 410 is connected to the tapered section 422.

[0074] Specifically, the tapered section 422, the connecting section 423 and the enlarged section 424 are arranged in sequence from bottom to top and are integrally formed, and the cooling pipe 410 is connected to the tapered section 422, so that the cooling gas (nitrogen) is in full contact with the chip 30. After the nitrogen gas enters the tapered section 422, it is guided to the surface of the chip 30 by the flow guide plate 421. After sufficient heat exchange, the gas flows along the tapered section 422 to the connecting section 423 through the gap around the flow guide plate 421, and finally flows out of the opening of the enlarged section 424, realizing the rapid discharge of the cooled nitrogen gas. The length ratio of the tapered section 422 and the enlarged section 424 in the vertical direction and the inclination of the opening can be further designed according to actual needs.

[0075] It should be noted that the connecting section 423 can also be designed as an arc-shaped structure, so that the cooling cover 420 as a whole has a gradual change. Alternatively, the connecting section 423 can be omitted, and the tapered section 422 and the enlarged section 424 are directly connected.

[0076] In some embodiments, the sintering patch mechanism 300 comprises a fixed column 330 and a pressing assembly 340, the pressing assembly 340 comprising a pressing head 341 and a pressing drive 342, the pressing drive 342 being arranged on the fixed column 330 and connected with the pressing head 341 to drive the pressing head 341 to perform a pressing action. Specifically, the bottom end of the fixed column 330 can extend into the containing chamber 161 through the air outlet 163, and the pressing head 341 is driven by the pressing drive 342 to press the qualified chip 30 to the mounting area, thereby completing the patching action of the chip 30. Through experiments, the required falling distance of the chip 30 with time variation after the solder is melted to ensure good contact between the chip 30 and the shell 20 is set as a preset distance.

[0077] It should be noted that the pressing head 341 here can also be integrated with a heating module, i.e., integrated with an electromagnetic pulse heating element, which can heat the chip 30 during the pressing process, so that the chip 30 is pressed by a preset distance after the solder is in a molten state, thereby ensuring that the chip 30 is properly attached.

[0078] Further, the sintering patch mechanism 300 further comprises a feeding assembly 350, the feeding assembly 350 comprising a feeding bin 351, a feeding track 352 and a transfer element 353, the feeding bin 351 being arranged on one side of the feeding track 352, the transfer element 353 being arranged on the side of the feeding bin 351 away from the feeding track 352, and one end of the feeding track 352 extending to the bottom end of the fixed column 330. Specifically, the transfer element can transfer the plurality of chips 30 in the feeding bin 351 to the feeding track 352, and the feeding track 352 can transmit the chips 30 to the bottom of the pressing head 341.

[0079] In some embodiments, the feeding assembly 350 further comprises a pushing element 354, the pushing element 354 being movably arranged on one side of the feeding track 352 and selectively partially extending into the feeding track 352. By designing the pushing element 354, the plurality of chips 30 on the feeding track 352 can be pushed, so that the plurality of chips 30 can be sequentially conveyed to the bottom of the pressing head 341 to complete the patching action of the plurality of mounting areas.

[0080] Referring to Figure 10In some embodiments, the sintering patch mechanism 300 comprises an adsorption head 370, a position adjusting module 380, a pressing assembly 340, and a conversion seat 390. The position adjusting module 380 is movably arranged on the fixing mechanism 100, the adsorption head 370 and the pressing assembly 340 are both mounted on the conversion seat 390, the conversion seat 390 is configured to switch the relative positions of the adsorption head 370 and the pressing assembly 340, the adsorption head 370 is configured to detach the chip 30 from the mounting area under the driving of the position adjusting module 380, and the pressing assembly 340 is configured to align and attach the chip 30 to the mounting area of the shell 20. Specifically, the switching of the adsorption head 370 and the pressing assembly 340 can be realized by arranging the conversion seat 390. The specific structure of the adsorption head 370 and the pressing assembly 340 can be referred to the foregoing description. The conversion seat 390 can be switched by a motor control or manually, which is not specifically limited here.

[0081] The application also provides a repair method suitable for the repair device 10. The method comprises the following steps:

[0082] S1: installing the shell 20 in the accommodating chamber 161.

[0083] Specifically, the shell 20 to be disassembled is first installed on the mounting carrier 130, clamped and fixed by the clamping assembly 150, and rotated by the driving assembly 140 to make the chip 30 to be disassembled horizontally upward. Then, the flow of the protective gas (nitrogen) is set, the protective gas is opened, and the nitrogen is continuously introduced into the accommodating chamber 161 through the gas inlet 162 and discharged outward through the gas outlet 163, so that the gas flows in the accommodating chamber 161 and expels the air.

[0084] S2: heating the shell 20 to a first preset temperature.

[0085] Specifically, the plurality of infrared irradiation lamp tubes of the heating mechanism 200 are used to heat the accommodating chamber 161, so that the shell 20 is heated to a first preset temperature. The first preset temperature is less than the melting temperature of the solder. For example, the solder is SAC305 (tin-silver-copper) solder, and the melting temperature can be 218℃. In some embodiments, the first preset temperature can be 175℃-190℃, at which the solder will not be welded, avoiding the disbonding of other non-failed chips 30. When heating, the infrared irradiation lamp tubes are used to heat the whole shell 20 in a tower shape, and the temperature probe is used to feedback the heating temperature in real time.

[0086] S3: heating the failed chip 30 to a second preset temperature.

[0087] Wherein the second preset temperature is greater than the first preset temperature, and the second preset temperature is greater than the solder melting temperature. Specifically, the disassembling chip 30 can be realized by the adsorption head 370, first moving the adsorption head 370 to the top of the failed chip 30, and then pressing the adsorption head 370 so that the adsorption head 370 is in contact with the chip 30. Then the chip 30 to be disassembled can be heated by the pulse heating device on the adsorption head 370, and the superimposed heating of the pulse heating device on the adsorption head 370 and the infrared radiation lamp tube to the chip 30 to be disassembled, so that the failed chip 30 is heated to the second preset temperature, so that the solder is melted.

[0088] Wherein, the pulse heating device can make the adsorption head 370 heat to 100-130℃, and then make the chip 30 region further heat to the second preset temperature on the basis of the first preset temperature, and the second preset temperature can be 230-250℃, which is greater than the solder melting temperature. That is, the local temperature of the solder can be greater than its melting temperature (10-30℃ higher than the melting temperature) by the superposition of the thermal field of infrared heating (180℃) and electromagnetic pulse heating (100℃) in this process, and the adsorption head 370 needs to be in close contact with the chip 30.

[0089] S4: The failed chip 30 is taken off from the mounting area and the molten solder is adsorbed.

[0090] Specifically, the failed chip 30 can be taken off from the mounting area by an additional disassembly mechanism or directly by the adsorption of the adsorption head 370, and the residual solder is adsorbed and removed, completing the disassembling chip 30 step.

[0091] After the disassembly is completed, a sintering step needs to be entered.

[0092] S5: The shell 20 is kept at the first preset temperature.

[0093] Step S5 can be performed after step S4, or steps S1-S4 can be repeated, and then step S5 is performed after the disassembly of multiple failed chips 30 is completed. Step S5 and step S2 are cyclic preheating steps. This embodiment is described by taking the sintering of a single qualified chip 30 after the disassembly of a single failed chip 30 as an example.

[0094] Specifically, first, install a qualified COS chip on the adsorption head 370 with an electromagnetic pulse heating device, wherein the adsorption head 370 can adsorb the non-functional area of the chip 30. Then reset the protective gas flow, and open the protective gas so that the nitrogen gas blows from bottom to top and flows in the containing chamber 161, pushing away the air in the containing chamber 161. Then use multiple infrared radiation lamps to heat the containing chamber 161 again, so that the shell 20 can be kept at the first preset temperature.

[0095] S6: Put the solder sheet into the exposed mounting area.

[0096] Specifically, the solder sheet can be put into the mounting area after cleaning, and the solder sheet will not directly melt at the first preset temperature. The solder sheet can be SAC305 (tin-silver-copper) solder. Before putting the solder sheet, the shell 20 needs to be rotated so that the exposed mounting area is horizontally upward; wherein the shell 20 is in the shape of a tower. That is, the initial position needs to be aligned by using the stepping motor of the driving assembly 140. Specifically, the angle between the two adjacent chips 30 can be calculated according to the distribution of the chips 30 in the tower-shaped shell 20, and the shell 20 is rotated to the mounting area to be sintered horizontally upward, and then the preformed solder sheet is placed in the mounting area.

[0097] S7: Attach the qualified chip 30 to the mounting area.

[0098] Specifically, first move the suction head 370 to the mounting area to be sintered, and then press the suction head 370 downward so that the suction head 370 is in contact with the chip 30. The contact between the chip 30 and the mounting area can be determined by the pressure sensor. Of course, the suction head 370 can be replaced by the pressing assembly 340.

[0099] S8: Heat the chip 30 to a second preset temperature, stop heating after the solder sheet is completely melted, introduce nitrogen gas into the mounting area, and sinter and fix the qualified chip 30 in the mounting area.

[0100] Specifically, the electromagnetic pulse heating mode of the suction head 370 is turned on, and the integrated electromagnetic pulse heating element is used to heat the suction head 370 to 100℃, so as to heat the chip 30 to a second preset temperature, which is greater than the solder melting temperature. Then observe the solder melting state, and after the solder is melted, press the chip 30 by a preset distance, so that the chip 30 is sintered and fixed in the mounting area. The preset distance can be an empirical value, for example, 1-3mm, and the chip 30 can be attached in place by pressing the chip 30. Then stop heating, and use the cooling pipeline 410 to introduce cooling gas into the mounting area, so that the sintered chip 30 cools down quickly, and then the solder cools and solidifies quickly, and the sintering is completed.

[0101] It should be noted that during the process of aligning the suction head 370 with the mounting area, a CCD module can be used to assist in judging the alignment state of the qualified chip 30 and the mounting area. If there is deviation, a fine adjustment module that drives the suction head 370 to move can be used for small-angle fine adjustment to ensure the alignment state of the chip 30.

[0102] The rework device 10 and the rework method provided by the embodiment of the present application can first install the shell 20 by using the fixing mechanism 100 and can adjust the angle or position of the shell 20, then preheat the shell 20 by using the heating mechanism 200, then adhere the chip 30 to the mounting area of the shell 20 by using the sintering patch mechanism 300 and sinter and fix the chip 30 on the mounting area, and finally introduce cooling gas into the mounting area by using the cooling pipeline 410 to cool the sintered chip 30. Compared with the prior art, the sintering patch mechanism 300 can realize automatic alignment, adhesion and sintering of the chip 30, manual sintering is not needed, and by adjusting the angle or position of the shell 20, sintering of a single chip 30 can be realized, the influence on other chips 30 that do not need to be reworked is avoided, and the overall structure is simplified. At the same time, the cooling pipeline 410 can directly introduce cooling gas into the mounting area to directly cool the sintered single chip 30, the overall cavity or environment is not cooled, a large amount of cooling gas is not needed, the use amount of the cooling gas is effectively saved, the cooling effect is better, and the other already adhered chips 30 are not affected.

[0103] The above merely describes the specific embodiments of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A rework apparatus, characterized by, The application relates to a fixing mechanism (100) having a containing chamber (161), an air inlet (162) and an air outlet (163) respectively communicating with the containing chamber (161), the containing chamber (161) being configured to contain a shell (20), the fixing mechanism (100) being further configured to adjust the angle or position of the shell (20); a heating mechanism (200) arranged on the fixing mechanism (100) and located in the containing chamber (161); a sintering patch mechanism (300) extending into the containing chamber (161) through the air outlet (163) and being spaced apart from the edge of the air outlet (163), the sintering patch mechanism (300) being configured to attach a chip (30) to the mounting area of the shell (20) and heat and fix the chip (30) to the mounting area; and a cooling mechanism (400) comprising a cooling pipeline (410) connected to the sintering patch mechanism (300) and communicating with the mounting area. The sintering patch mechanism (300) comprises an adsorption head (370), a position adjusting module (380), a pressing assembly (340) and a conversion seat (390), the position adjusting module (380) is movably arranged on the fixing mechanism (100), the adsorption head (370) and the pressing assembly (340) are both mounted on the conversion seat (390), the conversion seat (390) is configured to switch the relative positions of the adsorption head (370) and the pressing assembly (340), and the pressing assembly (340) is configured to align and attach the chip (30) to the mounting area of the shell (20). The adsorption head (370) is configured to adsorb the chip (30) and align and attach the chip (30) to the mounting area of the shell (20) or detach the chip (30) from the mounting area under the driving of the position adjusting module (380). The cooling mechanism (400) further comprises a cooling cover (420) having two ends respectively open, the cooling cover (420) surrounds the outer periphery of the sintering patch mechanism (300), the cooling cover (420) covers the mounting area, and the air outlet end of the cooling pipeline (410) extends into the cooling cover (420). The air inlet (162) is arranged at the bottom of the containing chamber (161), the air outlet (163) is arranged at the top of the containing chamber (161), and the cooling pipeline (410) is arranged at the air inlet (162). The air inlet (162) is arranged at the bottom of the containing chamber (161), the air outlet (163) is arranged at the top of the containing chamber (161), and the cooling pipeline (410) is arranged at the air inlet (162). The air inlet (162) is arranged at the bottom of the containing chamber (161), the air outlet (163) is arranged at the top of the containing chamber (161), and the cooling pipeline (410) is arranged at the air inlet (162).

2. The rework apparatus of claim 1, wherein ​ 3. The rework apparatus of claim 2, wherein ​ ​ 4. The rework apparatus of claim 2, wherein The cooling cover (420) is further provided with a flow guide plate (421) which is connected to the air outlet end of the cooling pipeline (410) and extends in the horizontal direction, and the flow guide plate (421) is provided with a gap with the inner wall of the cooling cover (420).

5. The rework apparatus of claim 2, wherein The cooling cover (420) sequentially comprises a tapered section (422) with a bottom opening, a connecting section (423) and an enlarged section (424) with a top opening from bottom to top, wherein the horizontal section of the tapered section (422) gradually decreases from bottom to top, the horizontal section of the enlarged section (424) gradually increases from bottom to top, and the cooling pipeline (410) is communicated to the tapered section (422).

6. The rework apparatus of claim 1, wherein The sintering patch mechanism (300) comprises a fixed column (330) and a pressing assembly (340), the pressing assembly (340) comprises a pressing head (341) and a pressing drive (342), the pressing drive (342) is arranged on the fixed column (330) and connected with the pressing head (341) to drive the pressing head (341) to perform pressing action.

7. The rework apparatus of claim 6, wherein The sintering patch mechanism (300) further comprises a feeding assembly (350), the feeding assembly (350) comprises a feeding bin (351), a feeding track (352) and a transfer member (353), the feeding bin (351) is arranged on one side of the feeding track (352), the transfer member (353) is arranged on the side of the feeding bin (351) away from the feeding track (352), and one end of the feeding track (352) extends to the bottom end of the fixed column (330).

8. The rework apparatus of claim 7, wherein The feeding assembly (350) further comprises a pushing member (354), the pushing member (354) is movably arranged on one side of the feeding track (352) and selectively partially extends into the feeding track (352).

9. The rework apparatus of claim 1, wherein The bottom end of the suction head (370) is formed with an avoiding notch (371), at least two sides of the avoiding notch (371) are formed with negative pressure suction surfaces, the avoiding notch (371) is configured to avoid the functional area of the chip (30), and the negative pressure suction surfaces are configured to fit and suction the non-functional area of the chip (30).

10. The rework apparatus of claim 1, wherein The fixing mechanism (100) comprises a fixing rack (120), a mounting carrier (130), a driving assembly (140) and a protective enclosure (160), the protective enclosure (160) is arranged on the fixing rack (120) and forms the containing chamber (161), and the mounting carrier (130) is movably arranged on the fixing rack (120); the driving assembly (140) is arranged on the fixing rack (120), and the driving assembly (140) partially extends into the protective enclosure (160) and is in transmission connection with the mounting carrier (130).

11. The rework apparatus of claim 10, wherein, The fixing mechanism (100) further comprises a clamping assembly (150), the clamping assembly (150) comprising a sliding seat (151) and a positioning clamping piece (153), the fixing frame (120) further being provided with a sliding rail (154), the sliding seat (151) being slidingly arranged on the sliding rail (154) and being configured to move close to or away from the mounting carrier (130), the positioning clamping piece (153) being arranged on the sliding seat (151) and being configured to correspondingly plug into a slot on the shell (20) to fix the shell (20).

12. A rework method characterized by, The method is suitable for the repair device according to any one of claims 1-11, and the method comprises: installing the shell (20) in a containing chamber (161), wherein the chip (30) of at least one mounting area of the shell (20) is in a failure state, and the containing chamber (161) is continuously filled with nitrogen through an air inlet (162) into the containing chamber (161) and discharged through an air outlet (163); heating the shell (20) to a first preset temperature, wherein the first preset temperature is less than a solder melting temperature; heating the failed chip (30) to a second preset temperature, wherein the second preset temperature is greater than the solder melting temperature; removing the failed chip (30) from the mounting area and absorbing the molten solder; maintaining the shell (20) at the first preset temperature; placing a solder sheet on the exposed mounting area; attaching a qualified chip (30) to the mounting area; heating the chip (30) to the second preset temperature, stopping heating after the solder sheet is completely melted, introducing nitrogen into the mounting area, and sintering and fixing the qualified chip (30) in the mounting area.

13. The rework method of claim 12, wherein, The step of sintering and fixing the qualified chip (30) in the mounting area comprises: pressing the chip (30) down by a preset distance to sinter and fix the chip (30) in the mounting area; and / or, before the step of placing a solder sheet on the exposed mounting area, the method further comprises: rotating the shell (20) so that the exposed mounting area is horizontally upward; wherein the shell (20) is in a tower shape.

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