Reworking jig for semiconductor packaging piece

Abstract

The reworking jig comprises a main body part and a plurality of mounting positions arranged on the main body part, the mounting positions are sequentially arranged along the length direction of the main body part, each mounting position comprises a sunken groove which is sunken downwards from the upper surface of the main body part, and the size of each sunken groove corresponds to the size of the semiconductor packaging part. A through hole penetrating through the thickness direction of the main body part is formed in the bottom of the sunken groove; a first handheld part and a second handheld part are arranged at the two ends of the main body part in the length direction respectively, and the first handheld part comprises a first sunken opening which is sunken from the end face of one end of the main body part in the length direction to the inner side of the main body part; and the second handheld part comprises a second sunken opening which is sunken from the end surface of the other end of the main body part in the length direction to the inner side of the main body part. The reworking jig for the semiconductor packaging piece comprises the plurality of mounting positions, the through holes are formed in the bottoms of the mounting positions, and the first handheld part and the second handheld part are arranged at the two ends of the main body part, so that the reworking jig is very humanized in design and convenient to use.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging, and in particular to a rework fixture for semiconductor packaged components. Background Technology

[0002] Semiconductor packages, such as FCBGA packages, may have some appearance abnormalities during the packaging process, such as foreign objects or yellowed solder balls. For these semiconductor packages with appearance abnormalities, rework is required to remove foreign objects or to wipe off the yellowed substances on the solder balls with an eraser. However, it is very inconvenient to fix the semiconductor package by hand. Summary of the Invention

[0003] The purpose of this invention is to provide a rework fixture for semiconductor packages, so as to solve the problem that it is very inconvenient to fix semiconductor packages by hand in the prior art.

[0004] To achieve the above objectives, this utility model provides a rework fixture for semiconductor packages, comprising a main body and a plurality of mounting positions disposed on the main body. The plurality of mounting positions are arranged sequentially along the length direction of the main body. Each mounting position includes a recessed groove that is recessed downward from the upper surface of the main body. The size of the recessed groove corresponds to the size of the semiconductor package. The bottom of the recessed groove is provided with a through hole that penetrates the thickness direction of the main body. A first hand-held portion and a second hand-held portion are respectively provided at both ends of the main body along its length direction. The first hand-held portion includes a first recessed opening that is recessed into the inner side of the main body from one end along its length direction. The second hand-held portion includes a second recessed opening that is recessed into the inner side of the main body from the other end along its length direction.

[0005] Preferably, the semiconductor package is rectangular, the mounting position is also rectangular and has four corners, each corner is provided with a clearance hole, and the clearance hole passes through the main body.

[0006] Preferably, the cross-section of the through hole is square, and the side length of the through hole cross-section is greater than or equal to 22.5 mm and less than or equal to 23.5 mm.

[0007] Preferably, the first recess penetrates the lower part of the main body, and the second recess penetrates the lower part of the main body.

[0008] Preferably, the opening depth of the first recess and the second recess in the length direction of the main body is greater than or equal to 14 mm and less than or equal to 16 mm, and the opening length of the first recess and the second recess in the width direction of the main body is greater than or equal to 54 mm and less than or equal to 56 mm.

[0009] Preferably, there are three mounting positions, which are evenly spaced apart.

[0010] Preferably, the three mounting positions are a first mounting position, a second mounting position, and a third mounting position. The first mounting position is located in the middle of the length direction of the main body. The second mounting position and the third mounting position are respectively located on both sides of the first mounting position. The distance between the first mounting position and the second mounting position is the same as the distance between the first mounting position and the third mounting position, and both are a first distance. The first distance is greater than or equal to 26.5 mm and less than or equal to 27.5 mm.

[0011] Preferably, the cross-section of the recessed groove is square, and the side length of the cross-section of the recessed groove is greater than or equal to 31 mm and less than or equal to 31.5 mm, and the depth of the recessed groove is greater than or equal to 4 mm and less than or equal to 15 mm.

[0012] Preferably, the length of the main body is greater than or equal to 199 mm and less than or equal to 201 mm, and the width of the main body is greater than or equal to 99 mm and less than or equal to 101 mm.

[0013] Preferably, the main body is made of plastic steel sheet.

[0014] Compared with the prior art, the rework fixture for semiconductor packages of this utility model includes several mounting positions and through holes at the bottom of the mounting positions, and first and second hand-held parts are provided at both ends of the main body. The design is very user-friendly and easy to use. Attached Figure Description

[0015] Figure 1 This is a perspective view of a rework fixture for semiconductor packaging components according to an embodiment of the present invention.

[0016] Figure 2 This is a top view of a rework fixture for semiconductor packages according to an embodiment of the present invention.

[0017] Figure 3 This is a perspective view of another aspect of the rework fixture for semiconductor packages according to an embodiment of the present invention.

[0018] Figure 4 This is a side view of a rework fixture for semiconductor packages according to an embodiment of the present invention.

[0019] Figure 5 This is a cross-sectional view of a rework fixture for semiconductor packages according to an embodiment of the present invention.

[0020] Figure 6This is a structural diagram of a rework fixture for semiconductor packages after mounting the semiconductor package, according to an embodiment of the present invention. Detailed Implementation

[0021] To explain in detail the technical content, structural features, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0022] like Figures 1 to 6 As shown, this utility model embodiment provides a rework fixture 10 for a semiconductor package 20, including a main body 1 and a plurality of mounting positions 11 provided on the main body 1. The plurality of mounting positions 11 are arranged sequentially along the length direction of the main body 1. Each mounting position 11 includes a recessed groove 111 that is recessed downward from the upper surface of the main body 1. The size of the recessed groove 111 corresponds to the size of the semiconductor package 20. The bottom of the recessed groove 111 is provided with a through hole 12 that penetrates the thickness direction of the main body 1. A first hand-holding part 13 and a second hand-holding part 14 are respectively provided at both ends in the length direction of the main body 1. The first hand-holding part 13 includes a first recessed opening 131 that is recessed from one end of the main body 1 towards the inner side of the main body 1 in the length direction. The second hand-holding part 14 includes a second recessed opening 141 that is recessed from the other end of the main body 1 towards the inner side of the main body 1 in the length direction. Specifically, the main body 1 is made of plastic steel plate. The plastic steel material of the main body 1 can effectively prevent static electricity and effectively avoid scratching the semiconductor package 20 during rework. The through hole 12 makes it easy for fingers to push the semiconductor package 20 upward from the back of the main body 1. The first hand-held part 13 and the second hand-held part 14 make it easy for operators to hold the two ends of the rework fixture 10 for handling and transfer. The design is very ingenious.

[0023] In this embodiment of the utility model, the rework fixture 10 is used to place the semiconductor package 20 in the recessed groove 111, and then perform processes such as removing foreign objects or wiping off the yellowing substances on the solder balls with an eraser. After the rework process is completed, the semiconductor package 20 is pushed out from the through hole 12 by holding the rework fixture 10 and using fingers, etc., which is convenient to operate.

[0024] The rework fixture 10 for semiconductor package 20 in this embodiment includes several mounting positions 11 and through holes 12 at the bottom of the mounting positions 11. A first hand-held part 13 and a second hand-held part 14 are provided at both ends of the main body 1. The design is very user-friendly and easy to use.

[0025] In this embodiment of the present invention, the semiconductor package 20 is rectangular, and the mounting position 11 is correspondingly rectangular with four corners. Each corner is provided with a clearance hole 15, which penetrates the main body 1. Specifically, the radius of the clearance hole 15 can be 1 mm. The clearance hole 15 can prevent collisions with the semiconductor package 20, thereby avoiding damage to the semiconductor package 20. Designing the clearance hole 15 to penetrate the main body 1 makes the rework fixture 10 easier to process and can increase the air permeability of the four corners of the semiconductor package 20.

[0026] In this embodiment of the utility model, such as Figure 2 As shown, the cross-section of the through hole 12 is square, and the side length b of the cross-section of the through hole 12 is greater than or equal to 22.5 mm and less than or equal to 23.5 mm. Specifically, the side length b of the cross-section of the through hole 12 is preferably 23 mm, so that a finger can pass through the through hole 12 and push the semiconductor package 20 upward.

[0027] In this embodiment of the utility model, such as Figure 1 and Figure 3 As shown, the first recess 131 penetrates the lower part of the main body 1, and the second recess 141 penetrates the lower part of the main body 1, thereby making it easier for the operator to hold the rework fixture 10. Of course, in some other embodiments, the first recess 131 and the second recess 141 may not penetrate the lower part of the main body 1, as long as the operator's fingers can be inserted into the first recess 131 and the second recess 141.

[0028] In this embodiment of the utility model, such as Figures 4 to 5 As shown, the opening depth h of the first recess 131 and the second recess 141 in the length direction of the main body 1 is greater than or equal to 14 mm and less than or equal to 16 mm, and the opening length d of the first recess 131 and the second recess 141 in the width direction of the main body 1 is greater than or equal to 54 mm and less than or equal to 56 mm. Specifically, the opening depth h of the first recess 131 and the second recess 141 in the length direction of the main body 1 is preferably 15 mm, and the opening length d of the first recess 131 and the second recess 141 in the width direction of the main body 1 is preferably 55 mm, thereby facilitating handheld operation of the rework fixture 10 and ensuring high structural strength of the rework fixture 10.

[0029] In this embodiment of the utility model, such as Figure 1As shown, there are three mounting positions 11, which are evenly spaced. Specifically, the three mounting positions 11 are a first mounting position 1101, a second mounting position 1102, and a third mounting position 1103. The first mounting position 1101 is located in the middle of the length of the main body 1. The second mounting position 1102 and the third mounting position 1103 are located on both sides of the first mounting position 1101. The distance between the first mounting position 1101 and the second mounting position 1102 is the same as the distance between the first mounting position 1101 and the third mounting position 1103, and both are the first distance, which is greater than or equal to 26.5 mm and less than or equal to 27.5 mm. Specifically, the first distance is preferably 27 mm. By reasonably setting the first distance, the processing accuracy and structural strength of the rework fixture 10 are ensured. It should be noted that in some other embodiments, there may be one, two or more mounting positions 11, which can be designed according to actual needs. In addition, the size of each mounting position 11 may be different, so as to accommodate the rework of semiconductor packages 20 of different sizes.

[0030] In this embodiment of the utility model, such as Figure 2 As shown, the cross-section of the recessed groove 111 is square, and the side length 'a' of the cross-section of the recessed groove 111 is greater than or equal to 31 mm and less than or equal to 31.5 mm, and the depth of the recessed groove 111 is greater than or equal to 4 mm and less than or equal to 15 mm. Specifically, the side length 'a' of the cross-section of the recessed groove 111 is preferably 31.15 mm.

[0031] In this embodiment of the utility model, such as Figure 2 As shown, the length of the main body 1 is greater than or equal to 199 mm and less than or equal to 201 mm, and the width of the main body 1 is greater than or equal to 99 mm and less than or equal to 101 mm. Specifically, the length of the main body 1 is preferably 200 mm, and the width of the main body 1 is preferably 100 mm.

[0032] The above-disclosed examples are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent changes made in accordance with the scope of the present utility model application shall still fall within the scope of the present utility model.

Claims

1. A rework fixture for semiconductor packages, characterized in that, The package includes a main body and a plurality of mounting positions disposed on the main body. The plurality of mounting positions are arranged sequentially along the length direction of the main body. Each mounting position includes a recessed groove that is recessed downward from the upper surface of the main body. The size of the recessed groove corresponds to the size of the semiconductor package. The bottom of the recessed groove is provided with a through hole that penetrates the thickness direction of the main body. The main body has a first hand-held portion and a second hand-held portion at both ends along its length. The first hand-held portion includes a first recessed opening that faces inward from one end of the main body along its length. The second hand-held portion includes a second recessed opening that faces inward from the other end of the main body along its length.

2. The rework fixture for semiconductor packages as described in claim 1, characterized in that, The semiconductor package is rectangular, and the mounting position is also rectangular with four corners. Each corner is provided with a clearance hole that passes through the main body.

3. The rework fixture for semiconductor packages as described in claim 1, characterized in that, The cross-section of the through hole is square, and the side length of the through hole cross-section is greater than or equal to 22.5 mm and less than or equal to 23.5 mm.

4. The rework fixture for semiconductor packages as described in claim 1, characterized in that, The first recess penetrates the lower part of the main body, and the second recess penetrates the lower part of the main body.

5. The rework fixture for semiconductor packages as described in claim 4, characterized in that, The opening depth of the first recess and the second recess in the length direction of the main body is greater than or equal to 14 mm and less than or equal to 16 mm, and the opening length of the first recess and the second recess in the width direction of the main body is greater than or equal to 54 mm and less than or equal to 56 mm.

6. The rework fixture for semiconductor packages as described in claim 1, characterized in that, There are three mounting positions, which are evenly spaced apart.

7. The rework fixture for semiconductor packages as described in claim 6, characterized in that, The three mounting positions are a first mounting position, a second mounting position, and a third mounting position. The first mounting position is located in the middle of the length of the main body. The second mounting position and the third mounting position are respectively located on both sides of the first mounting position. The distance between the first mounting position and the second mounting position is the same as the distance between the first mounting position and the third mounting position, and both are a first distance. The first distance is greater than or equal to 26.5 mm and less than or equal to 27.5 mm.

8. The rework fixture for semiconductor packages as described in claim 7, characterized in that, The recessed groove has a square cross-section, and the side length of the recessed groove is greater than or equal to 31 mm and less than or equal to 31.5 mm. The depth of the recessed groove is greater than or equal to 4 mm and less than or equal to 15 mm.

9. The rework fixture for semiconductor packages as described in claim 8, characterized in that, The length of the main body is greater than or equal to 199 mm and less than or equal to 201 mm, and the width of the main body is greater than or equal to 99 mm and less than or equal to 101 mm.

10. The rework fixture for semiconductor packages as described in claim 1, characterized in that, The main body is made of plastic steel plate.

Images