An ITO thin film flexible antenna based on low-temperature coupling connection

Abstract

This invention relates to the technical field of flexible antennas and discloses an ITO thin-film flexible antenna based on low-temperature coupling. The antenna includes a substrate, an integrated module brushed onto the substrate, a copper plate fixedly connected to one side of the substrate, a sealing plate, a protective plate, and a temperature control device fixedly connected to the copper plate, and two sliding rods slidably connected to the outside of a support member. These sliding rods are symmetrical about the central axis of the copper plate. A micro-pump drives the coolant inside the copper plate, and the temperature control device controls the sliding rods to change the flow path inside the copper plate. Through a memory spring, a shunt device, and the sliding rods, when the substrate heats up, causing the coolant temperature inside the copper plate to rise, the heat is transferred to the memory spring through a copper tube made of copper. If the temperature exceeds the phase transition temperature of the memory spring, the spring automatically extends and generates axial thrust, pushing the slider along the copper tube. This not only reduces system energy consumption and cost but also avoids the impact of electrical control failures on heat dissipation, improving the antenna's reliability in complex environments.

Description

Technical Field

[0001] This invention relates to the technical field of flexible antennas, and more particularly to a flexible ITO thin film antenna based on low-temperature coupling connection. Background Technology

[0002] ITO thin-film flexible antennas based on low-temperature coupling are widely used due to their thinness, flexibility, and transparency. They are used in wearable devices, IoT devices, biomedical fields, flexible display devices, and automotive electronics to ensure communication and device performance.

[0003] However, while existing ITO films exhibit good conductivity, they possess an inherent resistance of 10-100Ω. When an antenna transmits communication signals, the current flowing through the film generates heat. This heat generation is positively correlated with the square of the current, the resistance, and the duration of current flow. In practice, bends in the antenna current path can lead to increased local resistance, creating "hot spots." Signal fluctuations can cause instantaneous current increases, making localized heat accumulation even easier. Furthermore, the antenna is composed of an ITO conductive layer, a flexible dielectric substrate, and an encapsulation layer. In alternating electric fields used for wireless communication above 1GHz, the dielectric substrate molecules undergo high-frequency polarization flipping, resulting in dielectric loss through molecular friction and collisions, which is converted into heat. This dielectric loss heat directly affects temperature stability. Additionally, external electrical currents generated by devices such as mobile phones and industrial motors in the antenna's operating environment further contribute to the problem. Magnetic fields, according to the law of electromagnetic induction, will generate eddy currents in the ITO conductive layer. When this current flows through the thin-film resistor, it will also generate Joule heat. The stronger the external electromagnetic field, the larger the induced current and the more obvious the heat generation. For example, in automotive electronics, antennas near the engine are susceptible to strong electromagnetic interference. Due to induced heat, the working stability is reduced. For the antenna itself, the heat generation will increase the resistivity of the ITO film by 0.1%-0.3% for every 1°C increase, leading to antenna impedance mismatch, increased signal reflection loss, decreased communication efficiency, and damage to the antenna structure. The temperature resistance limit of its substrate and packaging materials is only 80-150°C. Long-term heat generation or local high temperature will cause the substrate to soften, age, and crack. In flexible display devices, the ITO film may also fall off due to heat generation, directly causing antenna failure and increasing the system failure rate. Summary of the Invention

[0004] The purpose of this invention is to provide a flexible ITO thin film antenna based on low-temperature coupling connection, thereby solving the problem of severe overheating in flexible antennas.

[0005] The technical solution of the present invention is as follows: a flexible ITO thin film antenna based on low-temperature coupling connection, including a substrate, an integrated module brushed on the substrate, a copper plate fixedly connected to one side of the substrate, a sealing plate, a protective plate and a temperature control device fixedly connected to the copper plate, a shunt device slidably connected to the copper plate, a micro electric pump fixedly connected to the copper plate, a support device disposed on the surface of the copper plate, and a slide rod slidably connected to the outside of the support device. The slide rod is provided in two and is symmetrical about the central axis of the copper plate. The micro electric pump is used to drive the coolant in the copper plate, and the temperature control device controls the slide rod to change the internal flow path of the copper plate.

[0006] Furthermore, the integrated module includes a transceiver module, a baseband module, a radio frequency module, an anti-interference module, and a WIFI matching module. The baseband module is connected to the radio frequency module, one end of the baseband module is an anti-interference module, and the radio frequency module is connected to the WIFI matching module.

[0007] Furthermore, the temperature control device includes a copper tube connected to both ends of a copper plate, a disk fixedly connected to the outside of the copper tube, a slider slidably connected to the outside of the copper tube, a memory spring connected between the disk and the slider, the memory spring being in contact with the copper tube, and the slider being fixedly connected to the diverter.

[0008] Furthermore, an outer protective strip is fixedly connected to the outer diameter of the copper plate, the coolant is located inside the outer protective strip, and a straight strip is fixedly connected to the middle of the copper plate, the center line of the straight strip coincides with the center line of the copper plate.

[0009] Furthermore, the support includes a U-shaped frame fixedly connected to the copper plate, a round rod fixedly connected to the U-shaped frame, and a return spring connected between the slide rod and the U-shaped frame. The number of return springs is equal to the number of slide rods, and the micro electric pump is attached to the U-shaped frame.

[0010] Furthermore, the diverting component includes two diverting blocks that are slidably connected inside the copper plate, a diverting rod that is fixedly connected to the diverting blocks, and a connecting block that is connected between the two diverting blocks. The connecting block is fixedly connected to the slider, and the two diverting blocks are symmetrical about the central axis of the copper plate.

[0011] Furthermore, one end of the slide rod is slidably connected to the outside of the round rod, and the other end of the slide rod is provided with a round block.

[0012] Furthermore, the diverter block has an inclined surface on the side near the circular block, and a straight groove is formed on that side. The diverter block also has a straight groove.

[0013] Furthermore, the width of the straight strip is equal to the spacing between the two diverter blocks, one end of the straight strip is attached to the U-shaped frame, and the other end of the outer protective strip does not contact the outer protective strip.

[0014] The beneficial effects of this invention are:

[0015] Through the memory spring, shunt, and slide bar, when the substrate heats up, causing the coolant temperature inside the copper plate to rise, the heat is transferred to the memory spring through a copper tube made of copper. If the temperature exceeds the phase transition temperature of the memory spring, the spring automatically extends and generates axial thrust, pushing the slider to slide along the copper tube. This, in turn, moves the shunt within the copper plate flow channel. Simultaneously, the movement of the shunt releases the pressure on the slide bar block, causing the return spring to rebound and push the slide bar to adjust its position, reducing the area between the slide bar and the outer protective strip and expanding the area with the straight strip. This accelerates the mixing of coolant in different areas and expands the cooling coverage. When the substrate temperature decreases and the coolant temperature falls below the phase transition temperature, the memory spring returns to its initial length, and the shunt and slide bar reset under the spring force, returning to their initial heat dissipation state. The entire process is completed solely through purely mechanical actions such as the thermal deformation of the memory spring, the transmission of spring force, and the sliding of mechanical components. It eliminates the need for electronic control components such as motors, sensors, and control chips, thus reducing system energy consumption and cost, avoiding the impact of electronic control failures on heat dissipation, and improving the reliability of the antenna in complex environments.

[0016] With the built-in RFIC, dual-band SAW filter, and flexible impedance matching network in the transceiver module, it can accurately complete the modulation, transmission, demodulation, and reception of 2.4GHz / 5GHz dual-band signals, ensuring the purity of multi-band signals. The baseband module and the RF module form a collaborative link. The baseband module transmits the processed digital signal to the RF module, which modulates it into a high-frequency WIFI signal by the RFIC, reducing transmission loss caused by signal interference. Combined with the low-power MCU control module's sleep and wake-up functions, it can meet the high-performance requirements of high-definition data transmission and multi-device connection, while balancing power supply stability and device battery life, making it suitable for various application scenarios such as smart homes, wearable devices, and flexible electronics.

[0017] By using an ultra-thin copper plate made of pure copper, the high thermal conductivity of copper is used to quickly conduct heat from the substrate to the flow channel. A micro electric pump drives the coolant to circulate and remove the heat. Straight bars divide the flow channel inside the copper plate into symmetrical sub-flow channels. With the dynamic adjustment of the flow divider, the coolant can be quickly concentrated and circulated, reducing the temperature difference between different areas, improving the uniformity of the resistivity of the ITO thin film and the consistency of the antenna impedance, and avoiding signal transmission instability caused by local overheating. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram from a first perspective of the present invention;

[0019] Figure 2 This is a schematic diagram of the overall structure of the present invention;

[0020] Figure 3 This is a schematic diagram of the temperature control device of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of the support component of the present invention;

[0022] Figure 5 This is a diagram showing the state when the flow divider block and the slide bar of the present invention are in contact;

[0023] Figure 6 This is a diagram showing the state of the flow divider block and the slide bar when they separate.

[0024] Figure 7 For the present invention Figure 4 Enlarged diagram of point A in the middle.

[0025] In the picture:

[0026] 1. Substrate; 101. Transceiver Module; 102. Baseband Module; 103. RF Module; 104. Anti-interference Module; 105. WIFI Matching Module; 2. Copper Plate; 21. Outer Protective Strip; 22. Straight Strip; 3. Sealing Plate; 4. Protective Plate; 5. Temperature Control Module; 51. Copper Tube; 52. Disc; 53. Slider; 54. Memory Spring; 6. Diverter Component; 61. Diverter Block; 611. Inclined Surface; 612. Straight Slot; 62. Diverter Rod; 63. Connecting Block; 7. Miniature Electric Pump; 8. Support Component; 81. U-Shaped Frame; 82. Round Rod; 83. Return Spring; 9. Slide Rod; 91. Round Block. Detailed Implementation

[0027] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0028] Reference Figures 1-7 This invention provides an ITO thin-film flexible antenna based on low-temperature coupling, comprising a substrate 1, an integrated module brushed on the substrate 1, a copper plate 2 fixedly connected to one side of the substrate 1, a sealing plate 3, a protective plate 4, and a temperature control 5 fixedly connected to the copper plate 2, a shunt 6 slidably connected to the copper plate 2, a micro electric pump 7 fixedly connected to the copper plate 2, a support 8 disposed on the surface of the copper plate 2, and a slide rod 9 slidably connected to the outside of the support 8. Two slide rods 9 are provided and symmetrical about the central axis of the copper plate 2. The micro electric pump 7 is used to drive the coolant inside the copper plate 2. The temperature control 5 controls the slide rod 9 to change the internal flow path of the copper plate 2, so that the coolant changes with the substrate 1, changing the cooling area, making the temperature of the substrate 1 uniform, and ensuring that the substrate 1 does not overheat.

[0029] Specifically, the micro electric pump 7 can drive the coolant circulation within the copper plate 2. The temperature control unit 5 can precisely control the slide bar 9 to change the flow path of the coolant inside the copper plate 2 according to the temperature changes in different areas of the substrate 1. This allows the coolant to flexibly adjust the cooling area according to the temperature distribution of the substrate 1, ensuring uniform temperature of the substrate 1 and effectively avoiding overheating. The heat generated by the substrate 1 is removed by the circulation of the coolant within the copper plate 2. The copper plate 2 is made of ultra-thin copper, and the high thermal conductivity of copper can quickly conduct heat from the substrate 1 to the flow channel. The micro electric pump 7, as the power source for coolant circulation, drives the coolant to circulate through the squeezing action of the peristaltic pump.

[0030] Reference Figures 1-3 The integrated module includes a transceiver module 101, a baseband module 102, a radio frequency module 103, an anti-interference module 104, and a WIFI matching module 105. The baseband module 102 is connected to the radio frequency module 103, one end of the baseband module 102 is the anti-interference module 104, and the radio frequency module 103 is connected to the WIFI matching module 105.

[0031] Specifically, the transceiver module 101 connects to the ITO thin-film antenna body to complete the modulation, transmission, demodulation, and reception of 2.4GHz / 5GHz WIFI high-frequency signals. It has a built-in RFIC, dual-band SAW filter, and flexible impedance matching network to ensure the purity and transmission efficiency of multi-band signals. The substrate 1 supports multiple generations of WIFI protocols such as 802.11ax and completes data encoding, decoding, and QoS priority management. It is equipped with a low-power MCU control module for sleep and wake-up. At the same time, the transceiver module 101 connects to external lines to provide power support for the entire antenna system, balancing power supply stability and device battery life. The substrate 1 is designed with a flexible shielding layer, PDMS encapsulation layer, and anti-bending stress to resist external EMI interference, moisture erosion, and mechanical bending damage.

[0032] The baseband module 102 transmits the processed digital signal to the radio frequency module 103. The RFIC of the radio frequency module 103 modulates it into a WIFI high-frequency signal. The high-frequency signal output by the radio frequency module 103 is first converted into a balanced signal adapted to the ITO antenna by ITO-WIFI, and then passed through DCBlock to block DC before being transmitted to the baseband module 102 to complete decoding and QoS priority judgment. Finally, the valid data is output to the terminal device.

[0033] Reference Figures 1-7 The temperature control 5 includes a copper tube 51 connected to both ends of the copper plate 2, a disc 52 fixedly connected to the outside of the copper tube 51, a slider 53 slidably connected to the outside of the copper tube 51, and a memory spring 54 connected between the disc 52 and the slider 53. The memory spring 54 is in contact with the copper tube 51, so that the slider 53 can be at the same temperature as the copper tube 51. The slider 53 is fixedly connected to the diverter 6.

[0034] Specifically, the copper tube 51 is made of copper and has a hollow cylindrical structure. Both ends are connected to the copper plate 2 by a low-temperature welding process. When the temperature is lower than the phase change temperature, the memory spring 54 maintains its initial length. When the temperature is higher than the phase change temperature, the memory spring 54 automatically contracts and generates axial thrust. When the substrate 1 heats up, causing the temperature of the coolant in the flow channel of the copper plate 2 to rise, the heat is transferred to the memory spring 54 through the copper tube 51. If the temperature exceeds the phase change temperature of the memory spring 54, the memory spring 54 automatically extends, pushing the slider 53 to slide along the copper tube 51 towards the disk 52. While the slider 53 slides, it drives the diverter 6 to move in the flow channel of the copper plate 2, adjusting the flow direction and flow rate of the coolant to make the coolant coverage wider. When the temperature of the substrate 1 decreases and the coolant temperature is lower than the phase change temperature of the memory spring 54, the memory spring 54 returns to its initial length, the slider 53 resets under the action of the spring force, and the diverter 6 returns to its initial position simultaneously, realizing the dynamic adjustment of the heat dissipation state.

[0035] Reference Figures 2-6 The outer diameter of the copper plate 2 is fixedly connected to an outer protective strip 21, and the coolant is located inside the outer protective strip 21. A straight strip 22 is fixedly connected to the middle of the copper plate 2, and the center line of the straight strip 22 coincides with the center line of the copper plate 2.

[0036] Specifically, when the memory spring 54 of the temperature control 5 contracts and drives the flow divider 6 to move, the flow divider 6 slides along one side of the straight bar 22, allowing the coolant in the closed space enclosed by the outer protective bar 21 to circulate and enhance heat dissipation. Conversely, when the flow divider 6 moves back, the straight bar 22 is closed on both sides and does not participate in heat exchange.

[0037] Among them, the straight bar 22 divides the inner flow channel into symmetrical sub-flow channels, which, together with the flow divider 6, allows the coolant to be quickly concentrated and can only circulate, further reducing the temperature difference between different areas, improving the uniformity of the ITO film resistivity, resulting in better antenna impedance consistency and significantly enhanced signal transmission stability. Meanwhile, the outer protective bar 21 provides sealing and edge protection, solving the coolant leakage problem, preventing the coolant from corroding the ITO film layer of the substrate 1 or surrounding electronic components, and reducing antenna short-circuit failures caused by leakage.

[0038] Reference Figures 2-6 The support member 8 includes a U-shaped frame 81 fixedly connected to the copper plate 2, a round rod 82 fixedly connected to the U-shaped frame 81, a return spring 83 connected between the slide rod 9 and the U-shaped frame 81, the number of return springs 83 is equal to the number of slide rods 9, the micro electric pump 7 is attached to the U-shaped frame 81, one end of the slide rod 9 is slidably connected to the outside of the round rod 82, and the other end of the slide rod 9 is provided with a round block 91.

[0039] Specifically, when the memory spring 54 is in its initial position, the diverter 6 will squeeze the round block 91. At this time, the return spring 83 is compressed, and the diverter 6 and the round block 91 are in contact, thus sealing the area. When the memory spring 54 straightens, the diverter 6 moves, and the return spring 83 rebounds, causing the slide bar 9 to move. This reduces the area between the slide bar 9 and the outer guard strip 21 and increases the area between the slide bar 9 and the straight bar 22, accelerating the mixing of coolant from different areas. When the temperature of the substrate 1 decreases and the memory spring 54 returns to its initial length, the diverter 6 will squeeze the round block 91 again to maintain stable coolant circulation.

[0040] Reference Figures 2-5 The diverter 6 includes two diverter blocks 61 that are slidably connected inside the copper plate 2, a diverter rod 62 that is fixedly connected to the diverter blocks 61, and a connecting block 63 that is connected between the two diverter blocks 61. The connecting block 63 is fixedly connected to the slider 53. The two diverter blocks 61 are symmetrical about the central axis of the copper plate 2. The diverter block 61 has an inclined surface 611 on the side near the circular block 91, and a straight groove 612 is opened on this side. The diverter block 61 has a straight groove 612.

[0041] Specifically, the memory spring 54 straightens, pushing the slider 53 to move. The connecting block 63 drives the two diverter blocks 61 to move. At the same time, the slide bar 9 loses the pressure of the inclined surface 611 and is pushed by the return spring 83. The straight slot 612 allows the coolant to flow from below it, avoiding dead zones. When the diverter block 61 presses against the round block 91, the round block 91 will move along the inclined surface 611. The two then come together to create a closed space for diversion, ensuring stable coolant circulation.

[0042] Reference Figures 1-7 The width of the straight bar 22 is equal to the spacing between the two shunt blocks 61. One end of the straight bar 22 is attached to the U-shaped frame 81, so that there is no crossflow in the flow channel in the initial state, eliminating the heat dissipation blind area around the straight bar 22. The other end of the outer protective strip 21 does not contact the outer protective strip 21, so that the maximum operating temperature of the straight bar 22 is reduced, reducing the risk of cracking caused by thermal stress at the welding part of the straight bar 22 and the copper plate 2, and extending the overall life of the antenna structure.

[0043] The working principle of this invention is as follows: The heat generated by the substrate 1 during operation is transferred to the copper plate 2. The coolant inside the copper plate absorbs the heat and its temperature rises. The heat is conducted to the memory spring 54 through the copper tube 51 made of red copper. When the temperature is below the phase transition temperature, the memory spring 54 maintains its initial length. When the temperature exceeds the phase transition temperature, the memory spring 54 automatically extends, generating an axial thrust to push the slider 53 to slide along the copper tube 51 towards the disk 52. When the temperature decreases, the memory spring 54 contracts and resets, pulling the slider 53 back to its initial position. Since the slider 53 is rigidly connected to the connecting block 63... When slider 53 moves, it drives two symmetrical diverter blocks 61 to slide along the straight bar 22 of copper plate 2. The diverter blocks 61 move with slider 53, releasing the pressure on the round block 91. The return spring 83 rebounds and pushes the slide rod 9 to slide along the round rod 82, expanding the flow channel space between the slide rod 9 and the straight bar 22. The coolant flows through the entire flow channel through the straight groove 612. When the diverter block 61 moves back, it squeezes the round block 91 of the slide rod 9 through the inclined surface 611, causing the return spring 83 to compress. The slide rod 9 and the outer guard strip 21 fit together to form a closed area. The coolant only circulates in the local flow channels on both sides of the straight bar 22.

[0044] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A flexible ITO thin-film antenna based on low-temperature coupling connection, comprising a substrate (1), characterized in that: It also includes an integrated module on the substrate (1), a copper plate (2) fixedly connected to one side of the substrate (1), a sealing plate (3), a protective plate (4) and a temperature control (5) fixedly connected to the copper plate (2), a diverter (6) slidably connected to the copper plate (2), a micro electric pump (7) fixedly connected to the copper plate (2), a support (8) set on the surface of the copper plate (2), and a slide rod (9) slidably connected to the outside of the support (8). The slide rod (9) is provided in two and is symmetrical about the central axis of the copper plate (2). The micro electric pump (7) is used to drive the coolant in the copper plate (2). The temperature control (5) controls the slide rod (9) to change the internal flow path of the copper plate (2). The integrated module includes a transceiver module (101), a baseband module (102), a radio frequency module (103), an anti-interference module (104), and a WIFI matching module (105). The baseband module (102) is connected to the radio frequency module (103), one end of the baseband module (102) is the anti-interference module (104), and the radio frequency module (103) is connected to the WIFI matching module (105). The temperature control unit (5) includes a copper tube (51) connected to both ends of a copper plate (2), a disc (52) fixedly connected to the outside of the copper tube (51), a slider (53) slidably connected to the outside of the copper tube (51), and a memory spring (54) connected between the disc (52) and the slider (53). The memory spring (54) is in contact with the copper tube (51), and the slider (53) is fixedly connected to the diverter (6).

2. The ITO thin-film flexible antenna based on low-temperature coupling connection according to claim 1, characterized in that: The outer diameter of the copper plate (2) is fixedly connected to an outer protective strip (21), the coolant is located inside the outer protective strip (21), and a straight strip (22) is fixedly connected to the middle of the copper plate (2), the center line of the straight strip (22) coincides with the center line of the copper plate (2).

3. The ITO thin-film flexible antenna based on low-temperature coupling connection according to claim 2, characterized in that: The support member (8) includes a U-shaped frame (81) fixedly connected to the copper plate (2), a round rod (82) fixedly connected to the U-shaped frame (81), and a return spring (83) connected between the slide rod (9) and the U-shaped frame (81). The number of return springs (83) is equal to that of the slide rod (9). The micro electric pump (7) is attached to the U-shaped frame (81).

4. The ITO thin-film flexible antenna based on low-temperature coupling connection according to claim 3, characterized in that: The diverter (6) includes two diverter blocks (61) that are slidably connected inside the copper plate (2), a diverter rod (62) that is fixedly connected to the diverter blocks (61), and a connecting block (63) that is connected between the two diverter blocks (61). The connecting block (63) is fixedly connected to the slider (53). The two diverter blocks (61) are symmetrical about the central axis of the copper plate (2).

5. The ITO thin-film flexible antenna based on low-temperature coupling connection according to claim 3, characterized in that: One end of the slide rod (9) is slidably connected to the outside of the round rod (82), and the other end of the slide rod (9) is provided with a round block (91).

6. The ITO thin-film flexible antenna based on low-temperature coupling connection according to claim 4, characterized in that: The diverting block (61) has an inclined surface (611) on the side near the circular block (91), and a straight slot (612) is provided on this side. The diverting block (61) has a straight slot (612).

7. The ITO thin-film flexible antenna based on low-temperature coupling connection according to claim 2, characterized in that: The width of the straight strip (22) is equal to the distance between the two diverting blocks (61). One end of the straight strip (22) is attached to the U-shaped frame (81), and the other end of the outer guard strip (21) does not contact the outer guard strip (21).

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