Lead frame used in high-voltage control box and high-voltage control box

Abstract

The invention relates to a lead frame used in a high-voltage control box and the high-voltage control box, the lead frame comprises a frame base body, and the frame base body is made of engineering plastics; the conductive copper bar is embedded into the frame base body and is combined with the frame base body through an integrated injection molding process, and the conductive copper bar comprises a high-voltage acquisition channel and a low-voltage control channel; the plugging interfaces are arranged on the frame base body and comprise a high-voltage acquisition interface and a low-voltage control interface, the high-voltage acquisition interface is electrically connected with the high-voltage acquisition channel, and the low-voltage control interface is electrically connected with the low-voltage control channel; wherein the high-voltage acquisition channel is used for acquiring a high-voltage signal of the relay and outputting the high-voltage signal to the BMS integrated circuit board, the low-voltage control channel is used for receiving a control signal from the BMS integrated circuit board and transmitting the control signal to the relay, and the plug-in interface is connected with the BMS integrated circuit board in a plug-in mode through a connector. The assembly efficiency can be improved, the connection reliability is enhanced, and the maintenance complexity is reduced.

Description

Technical Field

[0001] This invention relates to the field of power battery pack control technology, and in particular to a lead frame and a high-voltage control box for use in a high-voltage control box. Background Technology

[0002] With the rapid development of new energy vehicle technology, the control systems within power battery packs are becoming increasingly complex. Relays, as core components of the battery management system, are responsible for controlling the switching on and off of high-voltage circuits; their connection methods and integration directly affect the performance and reliability of the entire system. Traditional relay connection schemes typically use laser welding or bolt fastening to achieve electrical connections, which can meet basic conduction requirements to a certain extent. Meanwhile, existing lead frame designs often employ a separate structure, with the high-voltage acquisition module and low-voltage control circuit designed and manufactured separately, and then assembled into a complete control system through external connections.

[0003] However, existing technologies have several shortcomings. First, laser welding and bolt fastening methods are susceptible to process factors, potentially leading to issues such as incomplete welds and missed bolts, affecting the stability and reliability of the connection. Second, the separate design results in cumbersome assembly procedures, requiring significant manual labor and time, thus reducing production efficiency. Furthermore, when the system malfunctions and requires repair, traditional connection methods necessitate re-welding or disassembling bolts, making repairs complex and prone to secondary damage. Simultaneously, the highly customized design means the product can only be adapted to specific vehicle models, resulting in poor versatility. This not only increases R&D costs but also hinders supply chain efficiency and the realization of large-scale production. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a lead frame and a high-voltage control box for use in a high-voltage control box, which realizes the integrated layout of high-voltage acquisition channel and low-voltage control channel, thereby improving assembly efficiency, enhancing connection reliability and reducing maintenance complexity.

[0005] To achieve the above objectives, the present invention adopts the following technical solution.

[0006] In a first aspect, the present invention provides a lead frame for use in a high-voltage control box, comprising: The frame base is made of engineering plastic; A conductive copper busbar is embedded in the frame substrate and bonded to the frame substrate by an integral injection molding process. The conductive copper busbar includes a high-voltage acquisition channel and a low-voltage control channel. The plug-in interface is disposed on the frame base and includes a high-voltage acquisition interface and a low-voltage control interface. The high-voltage acquisition interface is electrically connected to the high-voltage acquisition channel, and the low-voltage control interface is electrically connected to the low-voltage control channel. The high-voltage acquisition channel is used to acquire the high-voltage signal of the relay and output it to the BMS integrated circuit board. The low-voltage control channel is used to receive the control signal from the BMS integrated circuit board and transmit it to the relay. The plug-in interface is connected to the BMS integrated circuit board in a plug-in manner.

[0007] Furthermore, the aforementioned lead frame also includes: The buckles are located on both sides of the frame base and are used to fix them to the outer shell of the high-voltage control box.

[0008] Furthermore, in the aforementioned lead frame, the high-voltage acquisition channel and the low-voltage control channel adopt a parallel wiring isolation design within the frame substrate, with the high-voltage acquisition channel located in the outer region and the low-voltage control channel located in the middle region.

[0009] Furthermore, in the aforementioned lead frame, the high-voltage acquisition interfaces are respectively located at both ends of the BMS integrated circuit board, and the low-voltage control interface is located in the middle position between the high-voltage acquisition interfaces.

[0010] Furthermore, in the aforementioned lead frame, the conductive copper busbars are flexibly arranged within the lead frame to accommodate the placement of the relay.

[0011] Furthermore, in the aforementioned lead frame, the conductive copper busbar includes six high-voltage acquisition channels. When the four relays are arranged vertically side by side, the six high-voltage acquisition channels are arranged in a staggered parallel layout in the vertical direction within the frame substrate.

[0012] Furthermore, in the aforementioned lead frame, the conductive copper busbar includes six high-voltage acquisition channels. When the four relays are arranged in a staggered pattern of two horizontal and two vertical lines, the six high-voltage acquisition channels form a symmetrical arrangement in pairs within the frame matrix.

[0013] Secondly, the present invention provides a high-voltage control box, comprising: outer shell; The low-voltage control module is configured as a lead frame as described in any of the first aspects above, and is fixedly disposed on the top of the housing. The high-voltage sampling module includes a high-voltage main copper busbar and connecting copper plates, which are fixedly installed at the bottom of the outer casing; The relay is pressed into the housing via the lead frame; The BMS integrated circuit board is electrically connected to the low-voltage control module and the high-voltage sampling module, and is used to send low-voltage control signals and receive high-voltage sampling signals.

[0014] Furthermore, in the aforementioned high-voltage control box, the high-voltage acquisition module is electrically connected to the high-voltage acquisition channel within the lead frame via the connecting copper sheet and / or directly electrically connected to the BMS integrated circuit board.

[0015] Furthermore, in the aforementioned high-voltage control box, the outer casing is connected to the lead frame via a snap-fit ​​connection. The high-voltage main copper busbar is embedded in the outer casing and is electrically connected to the high-voltage terminal of the relay. One end of the connecting copper sheet is electrically connected to the high-voltage main copper busbar, and the other end is electrically connected to the high-voltage acquisition channel in the lead frame and / or directly connected to the BMS integrated circuit board.

[0016] In summary, compared with the prior art, the present invention has at least one of the following beneficial technical effects: The lead frame of this invention integrates the conductive copper busbar into the frame substrate using a one-piece injection molding process, achieving an integrated design of the high-voltage acquisition channel and the low-voltage control channel. This significantly simplifies the assembly process and improves production efficiency. Furthermore, when the system requires maintenance, disassembly and reassembly can be completed through simple plug-and-play operations, eliminating the need for re-welding or bolt removal, thus reducing maintenance complexity and the risk of secondary damage. In addition, the standardized plug-in interface design improves the product's versatility, which helps reduce R&D costs and enable mass production. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a lead frame assembly according to the present invention.

[0019] Figure 2 This is a schematic diagram of the internal structure of a lead frame assembly according to the present invention.

[0020] Figure 3 This is a schematic diagram of an embodiment of the conductive copper busbar circuit layout of the present invention.

[0021] Figure 4 This is a schematic diagram of another embodiment of the conductive copper busbar circuit layout of the present invention.

[0022] Figure 5This is a three-dimensional schematic diagram of a circuit connection structure inside the lead frame assembly of the present invention.

[0023] Figure 6 This is a three-dimensional schematic diagram of another circuit connection structure inside the lead frame assembly of the present invention.

[0024] Figure 7 This is an exploded view of a high-voltage control box assembly according to the present invention.

[0025] Explanation of reference numerals in the attached diagram: 100, lead frame; 110, conductive copper busbar; 111, high-voltage acquisition channel; 112, low-voltage control channel; 120, plug-in interface; 121, high-voltage acquisition interface; 122, low-voltage control interface; 130, snap-fit; 140, frame base; 200, high-voltage main copper busbar; 300, connecting copper sheet; 400, relay; 500, housing; 600, BMS integrated circuit board; 700, rubber pad. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application.

[0027] It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment in the following embodiments have their own emphasis; for parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0028] The following is in conjunction with the appendix Figure 1-7 The present invention will be described in further detail below.

[0029] Reference Figure 1 and Figure 2 A lead frame 100 includes a frame base 140, a conductive copper busbar 110, and a plug-in interface 120. The frame base 140 is made of engineering plastic. In some embodiments, the frame base 140 is made of PA6-GF30 material, which is nylon 6 with 30% glass fiber added, possessing good insulation properties, heat resistance, and dimensional stability. The lead frame 100 does not deform or age in an operating environment ranging from -40°C to 125°C.

[0030] The conductive copper busbar 110 is embedded within the frame substrate 140 and bonded to the frame substrate 140 via an integral injection molding process. In some embodiments, the conductive copper busbar 110 is made of a silver-containing high-conductivity copper alloy with a conductivity ≥95% IACS. The conductive copper busbar 110 includes a high-voltage acquisition channel 111 and a low-voltage control channel 112. The high-voltage acquisition channel 111 is used to acquire the high-voltage signal from the high-voltage contacts of the relay and output it to the BMS integrated circuit board. The low-voltage control channel 112 is used to receive control signals from the BMS integrated circuit board and transmit them to the relay.

[0031] The plug-in interface 120 is disposed on the frame base 140 and includes a high-voltage acquisition interface 121 and a low-voltage control interface 122. The high-voltage acquisition interface 121 is electrically connected to the high-voltage acquisition channel 111, and the low-voltage control interface 122 is electrically connected to the low-voltage control channel 112. The plug-in interface 120 is connected to the BMS integrated circuit board using a plug-in interface.

[0032] Reference Figure 1 The lead frame 100 has a planar plate-like structure with several interface areas. The bottom of the frame base 140 is provided with a shock-absorbing rib structure to improve the lead frame 100's ability to withstand vibration and impact during vehicle operation. (Refer to...) Figure 2 The internal structure of the lead frame 100 shows that the conductive copper busbar 110 is divided into two types according to the current path: high voltage acquisition channel 111 and low voltage control channel 112, which respectively serve the high voltage access of the relay and the transmission of BMS control logic signals.

[0033] The integrated injection molding process allows the conductive copper busbar 110 to be firmly embedded in the frame substrate 140 without affecting its conductivity, achieving dual integration of electrical and structural properties. This process includes steps such as pre-positioning of the copper busbar, in-mold assembly, and injection molding encapsulation.

[0034] Reference Figure 1 and Figure 2 The lead frame 100 also includes clips 130. Clips 130 are disposed on both sides of the frame base 140 for fixed connection with the outer housing 500 of the high voltage control box.

[0035] In some embodiments, the snap-fit ​​130 employs a resilient reset design, enabling rapid insertion and automatic positioning during assembly. The snap-fit ​​130 extends from the side of the frame base 140, forming a resiliently deformable structure. When the lead frame 100 is installed into the housing 500, the snap-fit ​​130 engages with the corresponding slot on the housing 500, achieving mechanical locking through resilient deformation.

[0036] The snap-fit ​​130 includes a resilient arm and a locking protrusion. The resilient arm is connected to the frame base 140, and the locking protrusion is located at the free end of the resilient arm. During assembly, the locking protrusion bends inward under external force. When it reaches the predetermined position, the resilient arm springs back, causing the locking protrusion to engage in the slot of the housing 500, forming a stable mechanical connection.

[0037] In some embodiments, the snap fastener 130 and the frame base 140 are manufactured using an integral injection molding process to ensure connection strength and structural integrity. The snap fastener 130 is made of the same material as the frame base 140, both being engineering plastics with sufficient elasticity and strength to withstand mechanical stresses during assembly and use.

[0038] Reference Figure 3 and Figure 4 The high-voltage acquisition channel 111 and the low-voltage control channel 112 are designed with parallel wiring isolation within the frame base 140 and can be formed by stamping from a single piece of raw material. The high-voltage acquisition channel 111 is located in the outer area, and the low-voltage control channel 112 is located in the middle area.

[0039] In some implementations, the high-voltage acquisition channel 111 and the low-voltage control channel 112 are electrically isolated by spatial separation. The high-voltage acquisition channel 111 is located on the outer portion of the conductive copper busbar 110, forming an independent high-voltage signal transmission path. The low-voltage control channel 112 is located in the central area of ​​the conductive copper busbar 110, maintaining a physical distance from the high-voltage acquisition channel 111 to ensure the required electrical clearance and creepage distance.

[0040] Reference Figure 3 The high-voltage acquisition channel 111 extends outward from the high-voltage acquisition interface 121, forming a symmetrical branch structure within the frame base 140. The low-voltage control channel 112 branches off to both sides from the low-voltage control interface 122, located in the area between the high-voltage acquisition channels 111. This layout allows the high-voltage acquisition channel 111 and the low-voltage control channel 112 to be arranged in a layered spatial arrangement, avoiding mutual interference.

[0041] Reference Figure 4 In another embodiment, the high-voltage acquisition channel 111 is also located in the outer region of the conductive copper busbar 110, while the low-voltage control channel 112 is located in the middle region. The high-voltage acquisition channel 111 and the low-voltage control channel 112 are arranged in parallel and maintain a fixed spacing within the frame base 140.

[0042] The parallel wiring isolation design achieves electromagnetic isolation between the high-voltage acquisition channel 111 and the low-voltage control channel 112 through physical separation. The high-voltage acquisition channel 111 carries the high-voltage signal from the relay 400, while the low-voltage control channel 112 transmits the control signal from the BMS integrated circuit board 600. The separate arrangement of the two channels within the frame substrate 140 reduces electromagnetic coupling effects and improves the stability of signal transmission.

[0043] In some embodiments, the minimum spacing between the high-voltage acquisition channel 111 and the low-voltage control channel 112 is set to a predetermined value to ensure that insulation performance is maintained under high-voltage operating conditions. The engineering plastic material of the frame substrate 140 forms an insulating barrier between the high-voltage acquisition channel 111 and the low-voltage control channel 112, further enhancing the isolation effect.

[0044] Reference Figure 3 and Figure 4 The high-voltage acquisition interface 121 is respectively located at both ends of the frame base 140, and the low-voltage control interface 122 is located in the middle position between the high-voltage acquisition interfaces 121.

[0045] In some embodiments, the high-voltage acquisition interfaces 121 are distributed at opposite ends of the frame base 140. (Refer to...) Figure 3 The high-voltage acquisition interfaces 121 are respectively located at the outer ends of the conductive copper busbars 110 and are directly electrically connected to the high-voltage acquisition channels 111. The distributed arrangement of the high-voltage acquisition interfaces 121 enables the high-voltage signal acquisition points to form a distributed layout in space, reducing electromagnetic interference between adjacent interfaces.

[0046] Reference Figure 4 In another embodiment, the high-voltage acquisition interface 121 is also located at both ends of the frame base 140. The high-voltage acquisition interface 121 is electrically connected to the corresponding high-voltage acquisition channel 111, forming the input and output endpoints of the high-voltage signal.

[0047] The low-voltage control interface 122 is located in the middle area between the high-voltage acquisition interfaces 121. (Refer to...) Figure 3 The low-voltage control interface 122 is located in the center of the frame base 140 and is electrically connected to the low-voltage control channel 112. The central position of the low-voltage control interface 122 ensures that the low-voltage control signal is isolated and distributed between the high-voltage acquisition interfaces 121.

[0048] Reference Figure 4 The low-voltage control interface 122 is positioned in the central area of ​​the frame base 140 in a manner similar to... Figure 3 The layout remains consistent throughout. The low-voltage control interface 122, through its electrical connection with the low-voltage control channel 112, enables the reception and transmission of control signals from the BMS integrated circuit board 600.

[0049] In some implementations, the high-voltage acquisition interface 121 and the low-voltage control interface 122 are positioned to physically isolate the high and low voltage signals. The high-voltage acquisition interface 121 is located at both ends of the frame base 140, and the low-voltage control interface 122 is located in the middle. This layout forms a corresponding interface distribution on the BMS integrated circuit board 600. The high-voltage acquisition interfaces 121 are distributed at both ends of the BMS integrated circuit board 600, and the low-voltage control interface 122 corresponds to the middle area of ​​the BMS integrated circuit board 600.

[0050] The high-voltage acquisition interface 121 and the low-voltage control interface 122 are standardized in their distribution through the overall design of the plug-in interface 120. The plug-in interface 120 includes the high-voltage acquisition interface 121 and the low-voltage control interface 122, forming a unified connector structure. When the lead frame 100 is connected to the BMS integrated circuit board 600, the high-voltage acquisition interface 121 and the low-voltage control interface 122 respectively cooperate with the corresponding interfaces on the BMS integrated circuit board 600, realizing the functional separation of high-voltage signal acquisition and low-voltage control signal transmission.

[0051] The conductive copper busbar (110) of the present invention is flexibly arranged within the lead frame to adapt to the placement of the relay (200).

[0052] Reference Figure 3 and Figure 5 In some embodiments, the conductive copper busbar 110 includes six high-voltage acquisition channels 111. When the four relays 400 are arranged vertically side by side, the six high-voltage acquisition channels 111 are arranged in a staggered parallel layout in the vertical direction within the frame base 140.

[0053] Reference Figure 3 Six high-voltage acquisition channels 111 are arranged vertically within the conductive copper busbar 110. The high-voltage acquisition channels 111 are distributed sequentially along the longitudinal direction of the frame base 140, with each pair of adjacent high-voltage acquisition channels 111 being staggered. The high-voltage acquisition channels 111 maintain a parallel orientation while forming a staggered, intersecting interval.

[0054] In some embodiments, the staggered parallel arrangement in the vertical direction creates a layered arrangement of the high-voltage acquisition channels 111 within the frame base 140. The staggered arrangement of the high-voltage acquisition channels 111 reduces electromagnetic interference between adjacent channels while optimizing the space utilization within the conductive copper busbar 110.

[0055] Reference Figure 5 When the relays 400 are arranged vertically side by side, the four relays 400 are arranged sequentially along the longitudinal direction, forming an overall vertical linear arrangement. The six high-voltage acquisition channels 111 correspond to the arrangement of the relays 400, forming an electrical connection path within the conductive copper busbar 110 that matches the position of the relays 400.

[0056] In some implementations, the staggered parallel layout of the high-voltage acquisition channels 111 makes full use of the vertical space of the frame base 140. The wiring path of the high-voltage acquisition channels 111 is optimized, the copper wire length is shortened, and the assembly alignment efficiency is improved. The staggered parallel layout allows the high-voltage acquisition channels 111 to achieve a compact spatial arrangement while maintaining electrical independence.

[0057] Reference Figure 3 The high-voltage acquisition channel 111 extends inward from the high-voltage acquisition interface 121, forming a vertical branch network within the conductive copper busbar 110. The staggered arrangement of the high-voltage acquisition channels 111 ensures that each channel occupies a different spatial level in the vertical direction, avoiding physical conflicts between channels.

[0058] Reference Figure 5 The six high-voltage acquisition channels 111 within the conductive copper busbar 110 are connected to the high-voltage terminals of the relay 400. The vertically staggered layout of the high-voltage acquisition channels 111 matches the vertically parallel arrangement of the relay 400, thus realizing the transmission path of the high-voltage signal from the relay 400 to the BMS integrated circuit board 600.

[0059] Reference Figure 3 The low-voltage control channel 112 is distributed in the interval area between the high-voltage acquisition channels 111 to ensure physical isolation between the high-voltage and low-voltage lines.

[0060] In some embodiments, the low-voltage control channel 112 is disposed in the central region of the conductive copper busbar 110, located within the spatial interval formed by the high-voltage acquisition channels 111. The low-voltage control channel 112 extends to both sides from the low-voltage control interface 122, forming an independent signal transmission path in the region between the high-voltage acquisition channels 111.

[0061] Reference Figure 3 The high-voltage acquisition channels 111 form a symmetrical branch structure within the conductive copper busbar 110, with spatial intervals between them. The low-voltage control channels 112 utilize these intervals for wiring, maintaining physical separation from the high-voltage acquisition channels 111. The distribution of the low-voltage control channels 112 results in a spatially layered arrangement of the high-voltage signal transmission path and the low-voltage control signal transmission path.

[0062] In some embodiments, the spacing between the low-voltage control channel 112 and the high-voltage acquisition channel 111 is set to a predetermined value to ensure that insulation performance is maintained under high-voltage operating conditions. The engineering plastic material of the frame substrate 140 forms an insulating barrier between the low-voltage control channel 112 and the high-voltage acquisition channel 111, preventing the high-voltage signal from interfering with the low-voltage control signal.

[0063] The distribution design of the low-voltage control channel 112 within the interval area of ​​the high-voltage acquisition channel 111 achieves electrical safety isolation. The low-voltage control channel 112 carries control signals from the BMS integrated circuit board 600, while the high-voltage acquisition channel 111 transmits high-voltage signals from the relay 400. The spacing of the two channels within the conductive copper busbar 110 reduces electromagnetic coupling effects and prevents high-voltage signals from damaging the low-voltage control circuit.

[0064] In some implementations, the wiring path of the low-voltage control channel 112 avoids the direct proximity area of ​​the high-voltage acquisition channel 111. The low-voltage control channel 112 forms a meandering path within the space between the high-voltage acquisition channels 111, increasing the spatial distance between the low-voltage control channel 112 and the high-voltage acquisition channel 111. This distribution improves the insulation strength between the high- and low-voltage lines, ensuring the safe operation of the low-voltage control circuit.

[0065] Reference Figure 4 and Figure 6 In some embodiments, the conductive copper busbar 110 includes six high-voltage acquisition channels 111. When the four relays 400 are arranged in a staggered pattern of two horizontal and two vertical lines, the six high-voltage acquisition channels 111 form a symmetrical arrangement in pairs within the frame base 140.

[0066] Reference Figure 4 The six high-voltage acquisition channels 111 are arranged symmetrically within the conductive copper busbar 110. The high-voltage acquisition channels 111 employ a symmetrical arrangement in pairs, forming a balanced spatial configuration within the frame base 140. This symmetrical arrangement of the high-voltage acquisition channels 111 allows for spatially dispersed distribution of the high-voltage connection points, reducing the risk of electrical interference between adjacent lines.

[0067] In some embodiments, when the relays 400 are arranged in a staggered pattern of two horizontal and two vertical lines, the two sets of relays 400 are arranged alternately in horizontal and vertical positions, respectively. The staggered arrangement of the relays 400 forms an "L"-shaped or "Z"-shaped spatial configuration structure inside the control box. The six high-voltage acquisition channels 111 correspond to the staggered arrangement of the relays 400, forming electrical connection paths within the conductive copper busbar 110 that match the positions of the relays 400.

[0068] Reference Figure 6 The six high-voltage acquisition channels 111 within the conductive copper busbar 110 form a symmetrical arrangement in pairs. This symmetrical arrangement of the high-voltage acquisition channels 111 within the frame base 140 creates a regular and balanced layout, forming a centrally symmetrical structure. The symmetrical arrangement of the high-voltage acquisition channels 111 in pairs enables the conductive copper busbar 110 to achieve a spatially balanced load distribution.

[0069] In some embodiments, the symmetrical arrangement of the high-voltage acquisition channels 111 creates a mirror-symmetrical arrangement within the conductive copper busbar 110. This symmetrical distribution of the high-voltage acquisition channels 111 reduces stress concentration within the conductive copper busbar 110, improving structural stability. The symmetrical arrangement of the high-voltage acquisition channels 111 also provides a spatial layout basis for creating natural heat dissipation channels within the control box.

[0070] Reference Figure 4 The symmetrical arrangement of the high-voltage acquisition channels 111 forms a regional electrical connection network within the conductive copper busbar 110. The symmetrical distribution of the high-voltage acquisition channels 111 achieves balanced distribution of electrical load, avoiding unilateral overload. The symmetrical arrangement of the high-voltage acquisition channels 111 and the staggered arrangement of the relays 400 (two horizontal and two vertical) create a matching spatial relationship.

[0071] Reference Figure 6 The symmetrical layout of the conductive copper busbar 110 is reflected in the symmetrical arrangement of the six high-voltage acquisition channels 111 in pairs. The symmetrical distribution of the high-voltage acquisition channels 111 within the conductive copper busbar 110 achieves a balance between mechanical strength and electrical performance in the overall structure. This symmetrical arrangement of the high-voltage acquisition channels 111 is suitable for applications with complex or customized control box structures.

[0072] Reference Figure 4 The three high-voltage acquisition channels 111 located on one side of the frame base 140 are horizontally distributed, and the three high-voltage acquisition channels 111 on the other side are mirror-symmetrical to it, forming a centrally symmetrical structure.

[0073] In some embodiments, three high-voltage acquisition channels 111 are provided on one side of the frame base 140, and these three high-voltage acquisition channels 111 are arranged horizontally. The horizontal distribution of the high-voltage acquisition channels 111 causes the conductive copper busbar 110 to form parallel electrical connection paths on this side of the frame base 140. The three horizontally distributed high-voltage acquisition channels 111 maintain the same spatial hierarchy within the conductive copper busbar 110, forming a uniform horizontal arrangement structure.

[0074] Reference Figure 4 The three high-voltage acquisition channels 111 on the other side of the frame base 140 are mirror images of the three high-voltage acquisition channels 111 on the first side. The three high-voltage acquisition channels 111 on the other side are also horizontally distributed, forming a symmetrical spatial mapping with the high-voltage acquisition channels 111 on the first side. This mirror-symmetrical arrangement allows the conductive copper busbars 110 to form a symmetrical electrical connection network within the frame base 140.

[0075] In some embodiments, the centrally symmetrical structure is achieved through a mirror-symmetrical arrangement of the high-voltage acquisition channels 111 on both sides. The central axis of the frame base 140 divides the six high-voltage acquisition channels 111 into two groups, with three high-voltage acquisition channels 111 in each group located on either side of the central axis. The centrally symmetrical structure allows the conductive copper busbars 110 to form a balanced spatial configuration within the frame base 140, avoiding the phenomenon of load concentration on one side.

[0076] Reference Figure 4 The centrally symmetrical structure enables a uniform spatial distribution of the high-voltage acquisition channels 111 within the conductive copper busbar 110. The mirror-symmetric arrangement of the high-voltage acquisition channels 111 on both sides creates a regular geometric arrangement, achieving a balanced state in terms of mechanical stress distribution for the overall structure of the conductive copper busbar 110. The centrally symmetrical structure reduces stress concentration points of the conductive copper busbar 110 within the frame base 140, improving the mechanical stability of the structure.

[0077] In some implementations, the horizontally distributed high-voltage acquisition channels 111 provide a spatial advantage for heat dissipation within the control box. The symmetrical distribution of the high-voltage acquisition channels 111 on both sides creates a uniform heat source distribution within the frame base 140, avoiding localized overheating. The centrally symmetrical structure allows heat to form a symmetrical conduction path within the conductive copper busbar 110, which is beneficial for a balanced overall temperature distribution.

[0078] Reference Figure 4 The mirror-symmetric arrangement creates a symmetrical electromagnetic field distribution within the frame substrate 140. The symmetrical configuration of the high-voltage acquisition channels 111 on both sides reduces electromagnetic imbalance within the conductive copper busbars 110, thus minimizing electromagnetic interference. The centrally symmetrical structure, through a balanced distribution of electrical connection paths, improves the electrical compatibility between the high-voltage acquisition channels 111.

[0079] Through the technical solutions of the above embodiments, the lead frame 100 achieves an integrated design of the high-voltage acquisition channel 111 and the low-voltage control channel 112, which can significantly improve assembly efficiency and connection reliability. The integrated injection molding process ensures a firm bond between the conductive copper busbar 110 and the frame base 140, avoiding problems such as incomplete soldering and missing locks that may occur with traditional laser welding and bolt fastening methods. The parallel wiring isolation design and spatial layered arrangement effectively reduce electromagnetic interference between high and low voltage lines, improving signal transmission stability. The plug-in connection to the BMS integrated circuit board 600 achieves plug-and-play functionality. When the system needs maintenance, disassembly and assembly can be completed through simple plug-and-play operations without re-soldering or removing bolts, reducing maintenance complexity and the risk of secondary damage. The standardized plug-in interface 120 design improves product versatility, helps reduce R&D costs, and enables mass production. The elastic reset snap-fit ​​design 130 makes the assembly process more convenient while ensuring the stability of the mechanical connection.

[0080] This invention also discloses a high-voltage control box.

[0081] Reference Figure 7 A high-voltage control box includes a housing 500, a low-voltage control module, a high-voltage sampling module, a relay 400, a BMS integrated circuit board 600, and a rubber pad 700.

[0082] The low-voltage control module is configured as a lead frame 100 as described in any of the above embodiments, and is fixedly disposed on the top of the housing 500.

[0083] The high-voltage sampling module includes a high-voltage main copper busbar 200 and a connecting copper plate 300, which are fixedly installed at the bottom of the outer casing 500.

[0084] The relay 400 is pressed into the housing 500 via the lead frame 100.

[0085] The BMS integrated circuit board 600 is electrically connected to the low-voltage control module and the high-voltage sampling module, and is used to send low-voltage control signals and receive high-voltage sampling signals.

[0086] The high-voltage acquisition module is electrically connected to the high-voltage acquisition channel 111 in the lead frame 100 via the connecting copper sheet 300 and / or directly electrically connected to the BMS integrated circuit board 600.

[0087] Specifically, the low-voltage control module and the high-voltage sampling module are respectively arranged at the top and bottom ends of the control box. The low-voltage control module is integrated inside the lead frame 100, which is fixed to the top of the high-voltage box by the clip 130, which not only realizes the reliable crimping of the relay 400, but also plays a role in overall fixation.

[0088] The high-voltage sampling module is integrated into the bottom of the high-voltage box using an injection molding process. Its signal output offers flexible connection options: it can be directly connected to the BMS integrated circuit board 600, or it can be connected to the BMS via centralized wiring through the top lead frame 100. This modular design ensures the reliability of electrical connections while providing diverse system integration solutions.

[0089] The housing 500 forms the structural frame of the high-voltage control box, providing housing space and mechanical protection for the internal components. In some embodiments, the housing 500 is made of engineering plastics or metal materials, possessing good mechanical strength and insulation properties. The interior of the housing 500 includes mounting positions and fixing structures for accommodating and securing the various components.

[0090] The high-voltage main copper busbar 200 is embedded in the housing 500 and connected to the high-voltage terminal of the relay 400. In some embodiments, the high-voltage main copper busbar 200 is made of a high-conductivity copper alloy, forming the main current conduction path within the high-voltage control box. The high-voltage main copper busbar 200 is installed in a predetermined position within the housing 500, providing a high-voltage power input point for the relay 400.

[0091] One end of the connecting copper sheet 300 is connected to the high-voltage main copper busbar 200, and the other end is connected to the high-voltage acquisition channel 111 inside the lead frame 100. In some embodiments, the connecting copper sheet 300 is fixedly connected to the high-voltage main copper busbar 200 by welding. The other end of the connecting copper sheet 300 is connected to the high-voltage acquisition channel 111 inside the lead frame 100 by overlapping, realizing the transmission of high-voltage signals from the high-voltage main copper busbar 200 to the lead frame 100.

[0092] The relay 400 is housed within the housing 500 and is electrically connected to the high-voltage main copper busbar 200 and the lead frame 100. In some embodiments, the high-voltage terminal of the relay 400 is directly plugged into the high-voltage main copper busbar 200 to control the on / off state of the high-voltage circuit. The control terminal of the relay 400 is connected to the low-voltage control channel 112 within the lead frame 100 to receive control signals from the BMS integrated circuit board 600.

[0093] The BMS integrated circuit board 600 is electrically connected to the lead frame 100 via a plug-in interface 120. In some embodiments, the BMS integrated circuit board 600 and the lead frame 100 are connected via a plug-in interface, achieving a plug-and-play electrical connection. The BMS integrated circuit board 600 receives high-voltage acquisition signals from the lead frame 100 through the plug-in interface 120, and simultaneously sends control signals from the relay 400 to the lead frame 100.

[0094] Reference Figure 7 The assembly process of the high-voltage control box involves the layered assembly of multiple components. The high-voltage main copper busbar 200 is first installed to the bottom of the housing 500 at a predetermined position. One end of the connecting copper plate 300 is welded to the high-voltage main copper busbar 200, and the other end of the connecting copper plate 300 is exposed for subsequent connection to the lead frame 100.

[0095] The relay 400 is inserted into the mounting position inside the housing 500, and its high-voltage terminal is electrically connected to the high-voltage main copper busbar 200. The lead frame 100 is mounted above the relay 400, with a rubber pad 700 in the middle for heat dissipation and cushioning. The high-voltage acquisition channel 111 inside the lead frame 100 overlaps with the exposed end of the connecting copper plate 300. The lead frame 100 is mechanically fixed to the housing 500 by a clip 130. The lead frame 100 guides and presses the relay end position using a positioning boss on its own.

[0096] The BMS integrated circuit board 600 is plugged into the plug-in interface 120 at the top of the lead frame 100, completing the electrical connection between all components in the high-voltage control box. The entire assembly structure forms a stable and compact high-voltage control system, and the components achieve functional integration through mechanical fixing and electrical connection.

[0097] In some embodiments, the lead frame 100 is provided with a reserved EMI shielding grounding point for electromagnetic interference shielding and grounding connection. The EMI shielding grounding point forms a metal contact point on the frame base 140 of the lead frame 100 and is connected to the housing 500 or other grounding structure to provide electromagnetic shielding function.

[0098] In some implementations, the lead frame 100 is provided with a reserved diagnostic sampling interface for system fault detection and signal sampling. The diagnostic sampling interface forms an additional electrical connection point on the lead frame 100, reserving interface space for subsequent intelligent fault detection functions. The diagnostic sampling interface is connected to the conductive copper busbar 110 within the lead frame 100 to realize signal monitoring of the high-voltage acquisition channel 111 and the low-voltage control channel 112.

[0099] Reference Figure 7 In some embodiments, the lead frame 100 is mechanically fixed to the housing 500 by a snap fastener 130. The snap fastener 130 adopts an elastic reset design, which cooperates with the corresponding slot on the housing 500 during assembly, and achieves quick insertion and automatic positioning through elastic deformation. When the lead frame 100 needs to be removed from the housing 500, the snap fastener 130 can be bent inward by external force to release the locked state and achieve quick disassembly.

[0100] The BMS integrated circuit board 600 is plugged into the plug-in interface 120 at the top of the lead frame 100, forming a layered assembly structure. In some embodiments, the BMS integrated circuit board 600 and the plug-in interface 120 are connected using a standardized connector plug-in method to ensure the stability and reliability of the electrical connection. The plug-in interface 120 includes a high-voltage acquisition interface 121 and a low-voltage control interface 122, which respectively mate with corresponding interfaces on the BMS integrated circuit board 600.

[0101] The layered assembly structure allows the components to be arranged in an orderly manner in the vertical direction. From bottom to top, they are: housing 500, high-voltage main copper busbar 200, relay 400, lead frame 100, and BMS integrated circuit board 600. This layered configuration achieves a compact arrangement of components within a limited space, while also facilitating assembly and maintenance.

[0102] In some implementations, the layered assembly structure achieves stable bonding between components through a combination of mechanical fixing and electrical connection. The lead frame 100 is mechanically locked to the housing 500 via a snap-fit ​​130, while simultaneously establishing an electrical connection to the BMS integrated circuit board 600 via a plug-in interface 120. The relay 400 is connected to the high-voltage main copper busbar 200 via a high-voltage terminal, and its control terminal is connected to the low-voltage control channel 112 within the lead frame 100, forming a complete electrical circuit.

[0103] The layered assembly structure allows components to be installed layer by layer in a predetermined order during assembly, avoiding interference between components. When a component needs repair or replacement, the lower components can be accessed by disassembling the upper components, making the repair operation simple and efficient.

[0104] Through the technical solutions described in the above embodiments, the high-voltage control box achieves a comprehensive improvement in multiple technical effects. The integrated injection molding process firmly combines the conductive copper busbar with the frame substrate, eliminating the risks of incomplete welding and loose connections inherent in traditional welding and bolting methods, significantly improving connection reliability. The parallel wiring isolation design and layered spatial arrangement effectively reduce electromagnetic interference between high and low voltage lines, ensuring signal transmission stability. The plug-in connection method enables plug-and-play functionality; during maintenance, simple plug-and-play operations are all that's needed to complete assembly and disassembly, avoiding re-welding or bolt removal, greatly reducing maintenance complexity and the risk of secondary damage. The standardized plug-in interface design enhances product versatility, reduces customization requirements, and helps lower R&D costs and achieve mass production. The elastic reset snap-fit ​​design simplifies assembly processes, improving production efficiency while ensuring mechanical connection stability. The layered assembly structure allows for orderly arrangement of components within a compact space, facilitating assembly and maintenance operations, and forming a stable, efficient, and easy-to-maintain high-voltage control system.

[0105] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A lead frame for use in a high-voltage control box, characterized in that, include: A frame substrate (140) is made of engineering plastic; A conductive copper busbar (110) is embedded in the frame substrate (140) and is combined with the frame substrate (140) by an integral injection molding process. The conductive copper busbar (110) includes a high voltage acquisition channel (111) and a low voltage control channel (112). A plug-in interface (120) is provided on the frame base (140) and includes a high-voltage acquisition interface (121) and a low-voltage control interface (122). The high-voltage acquisition interface (121) is electrically connected to the high-voltage acquisition channel (111), and the low-voltage control interface (122) is electrically connected to the low-voltage control channel (112). The high-voltage acquisition channel (111) is used to acquire the high-voltage signal of the relay (400) and output it to the BMS integrated circuit board (600). The low-voltage control channel (112) is used to receive the control signal from the BMS integrated circuit board (600) and transmit it to the relay (400). The plug-in interface (120) is connected to the BMS integrated circuit board (600) in a plug-in manner.

2. The lead frame according to claim 1, characterized in that, Also includes: Buckles (130) are provided on both sides of the frame base (140) for fixed connection with the outer shell (500) of the high voltage control box.

3. The lead frame according to claim 1, characterized in that, The high-voltage acquisition channel (111) and the low-voltage control channel (112) are designed with parallel wiring isolation within the frame base (140). The high-voltage acquisition channel (111) is located in the outer region, and the low-voltage control channel (112) is located in the middle region.

4. The lead frame according to claim 1, characterized in that, The high-voltage acquisition interface (121) is respectively located at both ends of the frame base (140), and the low-voltage control interface (122) is located in the middle position between the high-voltage acquisition interfaces (121).

5. The lead frame according to claim 1, characterized in that, The conductive copper busbar (110) is flexibly arranged within the lead frame to accommodate the placement of the relay (200).

6. The lead frame according to claim 5, characterized in that, The conductive copper busbar (110) includes six high-voltage acquisition channels (111). When the four relays (400) are arranged vertically side by side, the six high-voltage acquisition channels (111) are arranged in a staggered parallel layout in the vertical direction within the frame base (140).

7. The lead frame according to claim 5, characterized in that, The conductive copper busbar (110) includes six high-voltage acquisition channels (111). When the four relays (400) are arranged in a staggered pattern of two horizontal and two vertical lines, the six high-voltage acquisition channels (111) form a symmetrical arrangement in pairs within the frame base (140).

8. A high-voltage control box, characterized in that, include: Outer shell (500); The low-voltage control module is configured as a lead frame (100) as described in any one of claims 1-7, and is fixedly disposed on the top of the housing (500); The high-voltage sampling module includes a high-voltage main copper busbar (200) and a connecting copper plate (300), which are fixedly installed at the bottom of the outer casing (500); The relay (400) is pressed into the housing (500) via the lead frame (100); The BMS integrated circuit board (600) is electrically connected to the low-voltage control module and the high-voltage sampling module, and is used to send low-voltage control signals and receive high-voltage sampling signals.

9. A high-voltage control box according to claim 8, characterized in that, The high-voltage acquisition module is electrically connected to the high-voltage acquisition channel (111) in the lead frame (100) via the connecting copper plate (300) and / or directly electrically connected to the BMS integrated circuit board (600).

10. A high-voltage control box according to claim 8, characterized in that, The outer casing (500) and the lead frame (100) are connected by a snap fastener (130); The high-voltage main copper busbar (200) is embedded in the outer casing (500) and is electrically connected to the high-voltage terminal of the relay (400); One end of the connecting copper sheet (300) is electrically connected to the high-voltage main copper busbar (200), and the other end is electrically connected to the high-voltage acquisition channel (111) in the lead frame (100) and / or directly connected to the BMS integrated circuit board (600).

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