Radio frequency circuit and electronic equipment

Abstract

The embodiment of the invention discloses a radio frequency circuit and electronic equipment, and belongs to the technical field of power electronics. The radio frequency circuit comprises a radio frequency transceiver, and a first communication module, a second communication module, a third communication module and a fourth communication module which are respectively connected with the radio frequency transceiver, the first communication module, the second communication module, the third communication module and the fourth communication module are respectively connected with a first antenna, a second antenna, a third antenna and a fourth antenna; the first communication module comprises a transmitting path and a receiving path of a plurality of frequency bands; the second communication module comprises a transmitting path and a receiving path of a plurality of frequency bands; the third communication module comprises a receiving path of a plurality of frequency bands and a single-frequency transmitting path; and the fourth communication module comprises a receiving path of a plurality of frequency bands. According to the embodiment of the invention, the uplink and downlink transmission rate of the network can be further improved, and the single-user peak rate and the system capacity are greatly improved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of power electronics, and particularly relate to a radio frequency circuit and an electronic device. BACKGROUND

[0002] With the development of society, the progress of science and technology, and the continuous improvement of living standards, people have increasingly high requirements for network transmission stability and transmission rate. At present, mobile intelligent terminals generally support multi-band 3G, 4G LTE and NR 5G networks, among which most of the high-end mobile intelligent terminals can support LTE CA (Carrier Aggregation) technology, as well as LTE and 5G technologies. Through CA and ENDC dual connectivity (E-UTRAN New Radio-Dual Connectivity) technologies, multiple frequency bands of signals can be aggregated together to improve the uplink and downlink transmission rates of LTE and NR networks.

[0003] In order to further improve the uplink and downlink transmission rates of the network and make the network transmission more stable, LTE, NR downlink 4x4 MIMO (Multiple Input Multiple Out), downlink 4x4 MIMO, dual uplink, triple uplink, dual connectivity ENDC 4MIMO, etc. are designed in the mobile intelligent terminal, which can greatly improve the single user peak rate and system capacity. However, the above design greatly increases the design complexity and occupied area of the radio frequency front-end circuit, and also brings great challenges to the design of the radio frequency front-end circuit of the mobile intelligent terminal. SUMMARY

[0004] The main purpose of the embodiments of the present application is to provide a radio frequency circuit and an electronic device, which aims to at least further improve the uplink and downlink transmission rates of the network, and greatly improve the single user peak rate and system capacity.

[0005] To achieve the above purpose, the embodiments of the present application provide a radio frequency circuit, which comprises:

[0006] a radio frequency transceiver, and a first communication module, a second communication module, a third communication module and a fourth communication module connected with the radio frequency transceiver respectively;

[0007] The first communication module, the second communication module, the third communication module and the fourth communication module are connected with a first antenna, a second antenna, a third antenna and a fourth antenna respectively;

[0008] The first communication module comprises a plurality of frequency bands of first transmitting paths and first receiving paths;

[0009] The second communication module includes a second transmitting path and a second receiving path of multiple frequency bands;

[0010] The third communication module includes at least a third receiving path of multiple frequency bands;

[0011] The fourth communication module includes a fourth receiving path of multiple frequency bands.

[0012] In addition, to achieve the above object, the embodiment of the present application further provides an electronic device, which comprises the radio frequency circuit as described above.

[0013] The embodiment of the present application provides a radio frequency circuit and an electronic device, which at least overcome the problem that the radio frequency front-end circuit in the related art cannot support more application scenarios at low cost. The radio frequency circuit comprises a radio frequency transceiver, and a first communication module, a second communication module, a third communication module and a fourth communication module connected with the radio frequency transceiver respectively; the first communication module, the second communication module, the third communication module and the fourth communication module are connected with a first antenna, a second antenna, a third antenna and a fourth antenna respectively; the first communication module includes a first transmitting path and a first receiving path of multiple frequency bands; the second communication module includes a second transmitting path and a second receiving path of multiple frequency bands; the third communication module includes at least a third receiving path of multiple frequency bands; and the fourth communication module includes a fourth receiving path of multiple frequency bands. The embodiment of the present application can support more application scenarios, improve the network uplink and downlink transmission rate, and greatly improve the single-user peak rate and system capacity by using a separate device without using a receiving front-end module, a combiner and the like which have a large area, limited frequency band combination and high price. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the embodiments or the related art description will be briefly introduced. Obviously, the drawings in the following description are only some of the embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor based on the drawings shown.

[0015] Figure 1 A structural schematic diagram of a radio frequency circuit provided by an embodiment of the present application is shown in FIG. 1;

[0016] Figure 2 A detailed structural schematic diagram of a radio frequency circuit provided by an embodiment of the present application is shown in FIG. 2;

[0017] Figure 3 A detailed structural schematic diagram of a radio frequency circuit provided by an embodiment of the present application is shown in FIG. 2; Figure 2 A detailed structural schematic diagram of a radio frequency circuit provided by an embodiment of the present application is shown in FIG. 2;

[0018] Figure 4A detailed structure diagram of a radio frequency circuit is provided for another embodiment of the present application;

[0019] Figure 5 A detailed structure diagram of a radio frequency circuit is provided for another embodiment of the present application; Figure 4 A detailed structure diagram of a radio frequency circuit is provided for another embodiment of the present application;

[0020] Figure 6 A detailed structure diagram of a radio frequency circuit is provided for another embodiment of the present application;

[0021] Figure 7 A detailed structure diagram of a radio frequency circuit is provided for another embodiment of the present application.

[0022] The implementation, functional features and advantages of the embodiments of the present application will be further described with reference to the accompanying drawings.

[0023] Explanation of reference signs:

[0024] 100, first communication module; 200, second communication module; 300, third communication module; 400, fourth communication module. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the embodiments of the present application.

[0026] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0027] In addition, the description of "first", "second", etc. in the embodiments of the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the embodiments of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited. In addition, the meaning of "and / or" appearing throughout the text is to include three parallel schemes, for example, "A and / or B" includes A scheme, or B scheme, or A and B schemes.

[0028] In the embodiments of the present application, unless specifically defined and limited otherwise, the terms "connected", "fixed", and the like should be interpreted broadly, for example, "fixed" can be fixed connection, or detachable connection, or integrated; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection through an intermediate medium; can be internal connection of two elements, or interaction relationship between two elements, unless specifically defined otherwise. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0029] It should also be understood that the description of "one embodiment" or "some embodiments" and the like in the specification of the embodiments of the present application means that the specific features, structures or characteristics described in connection with the embodiment are included in one or more embodiments of the embodiments of the present application. Therefore, the statements "in one embodiment", "in some embodiments", "in other some embodiments", "in other some embodiments" and the like appearing in different places in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "include", "contain", "have" and their variants mean "include but not limited to", unless otherwise specifically emphasized.

[0030] With the development of society, the progress of science and technology, and the continuous improvement of living standards, people's requirements for network transmission stability and transmission rate are getting higher and higher. At present, mobile intelligent terminals generally support multi-band 3G, 4G LTE and NR 5G networks, among which most of the high-end mobile intelligent terminals can support LTE CA (Carrier Aggregation) technology, as well as LTE and 5G technologies. Through CA and ENDC dual connection (E-UTRAN New Radio-Dual Connectivity, 4G-5G dual connection) technology, multiple frequency band signals can be aggregated together to improve the uplink and downlink transmission rate of LTE and NR networks.

[0031] In order to further improve the uplink and downlink transmission rate of the network and make the network transmission more stable, LTE, NR downlink 4x4 MIMO (Multiple Input Multiple Out), downlink 4x4 MIMO, dual uplink, triple uplink, dual connection ENDC 4MIMO, etc. are designed in the mobile intelligent terminal, which can greatly improve the single user peak rate and system capacity.

[0032] Designing LTE and NR downlink 4x4 MIMO, dual uplink, triple uplink, and dual-connectivity ENDC4 MIMO in mobile smart terminals can significantly improve single-user peak data rate and system capacity. In current devices, mid-to-high frequency 4MIMO is relatively common in LTE or NR, while low-frequency downlink is mainly 2x2 MIMO, and combinations of CA and ENDC between low frequencies are rare. Carrier aggregation between two or three low frequencies requires combiners and receiver front-end modules for two or three frequency bands, which are difficult to implement due to limitations in frequency, isolation, and size. Currently, only a few low-frequency combiners and receiver front-end modules are available on the market.

[0033] Furthermore, dual uplink is already quite common in current devices, but triple uplink is still uncommon. To increase uplink speed, even quad uplink transmission is possible. Compared to the original LTE and NR low-frequency downlink 2x2 MIMO, implementing downlink 4x4 MIMO requires two additional downlink receive RF paths. To achieve uplink CA and ENDC between low, medium, and high frequencies, two, three, or four uplink paths are needed. This allows for arbitrary combinations between different frequency bands to achieve carrier aggregation and dual 4G / 5G connectivity, and enables 4MIMO support across all frequency bands. This significantly increases the design complexity and footprint of the RF front-end circuitry, posing a significant challenge to the design of RF front-end circuitry for mobile smart terminals.

[0034] Based on this, embodiments of this application provide a radio frequency (RF) circuit and electronic device that overcomes at least the problem that RF front-end circuits in related technologies cannot support more application scenarios at low cost. In this RF circuit, by using discrete components, it is possible to support more application scenarios, improve network uplink and downlink transmission rates, and significantly increase single-user peak rates and system capacity without using large-area, frequency-band-limited, and expensive receiver front-end modules, combiners, etc.

[0035] The radio frequency circuits and electronic devices provided in this application are specifically described through the following embodiments. First, the radio frequency circuits in the embodiments of this application are described.

[0036] This application provides a radio frequency circuit, referring to... Figure 1 , Figure 1 This is a schematic diagram of a radio frequency (RF) circuit according to an embodiment of the present application. The RF circuit includes:

[0037] Radio frequency transceiver, and a first communication module 100, a second communication module 200, a third communication module 300 and a fourth communication module 400 respectively connected to the radio frequency transceiver;

[0038] The first communication module 100, the second communication module 200, the third communication module 300 and the fourth communication module 400 are connected with the first antenna, the second antenna, the third antenna and the fourth antenna respectively;

[0039] The first communication module 100 comprises a first transmitting path and a first receiving path of multiple frequency bands;

[0040] The second communication module 200 comprises a second transmitting path and a second receiving path of multiple frequency bands;

[0041] The third communication module 300 comprises at least a third receiving path of multiple frequency bands;

[0042] The fourth communication module 400 comprises a fourth receiving path of multiple frequency bands.

[0043] In the embodiment, the radio frequency transceiver can be realized based on a radio frequency transceiver chip, the first communication module 100 and the second communication module 200 are radio frequency modules with both transmitting path and receiving path, the third communication module 300 and the fourth communication module 400 are radio frequency modules with receiving path, and in some specific cases, the third communication module 300 can also have both transmitting path and receiving path, and these paths all comprise multiple independent frequency bands, and the four communication modules can cooperate to complete 4MIMO, multiple frequency carrier aggregation CA or ENDC dual connection of each frequency band.

[0044] As an example, the transmitting paths of different frequency bands are configured to the transmitting paths of the first communication module 100, the second communication module 200 and the third communication module 300, the transmitting paths of the same frequency band are configured to different communication modules, and independent transmission is realized through different antennas, so that the frequency bands can be arbitrarily combined to realize up to three-frequency transmission and single-frequency double transmission; the receiving paths are respectively configured to the four communication modules, four receiving paths are configured to each single frequency band, different frequency bands are configured to the same communication module, and the same frequency band is configured to different communication modules, and different frequency bands are combined through filters, double-frequency filters, low-medium-high frequency dividers and low-medium frequency dividers, so as to realize multiple frequency 4MIMO carrier aggregation and ENDC dual connection.

[0045] Reference Figure 2 In some feasible embodiments, the first communication module 100 comprises a first power amplifier, a first multiplexer of multiple frequency bands, a first switch, a first frequency divider and a first receiving low noise amplifier; the radio frequency transceiver, the first power amplifier, the first multiplexer of multiple frequency bands, the first switch, the first frequency divider and the first antenna are sequentially connected to form a first transmitting path; and the first antenna, the first frequency divider, the first switch, the first multiplexer of multiple frequency bands, the first receiving low noise amplifier and the radio frequency transceiver are sequentially connected to form a first receiving path.

[0046] The second communication module 200 includes: a second power amplifier, a second multiplexer with multiple frequency bands, a second switch, a second frequency divider, and a second receiving low-noise amplifier; a radio frequency transceiver, the second power amplifier, the second multiplexer with multiple frequency bands, the second switch, the second frequency divider, and the second antenna are connected in sequence to form a second transmission path; the second antenna, the second frequency divider, the second switch, the second multiplexer with multiple frequency bands, the second receiving low-noise amplifier, and the radio frequency transceiver are connected in sequence to form a second receiving path;

[0047] The third communication module 300 includes: a third receiving low-noise amplifier, a third receiving filter for multiple frequency bands, a third switch, and a third frequency divider; the third antenna, the third frequency divider, the third switch, the third receiving filter for multiple frequency bands, the third receiving low-noise amplifier, and the radio frequency transceiver are connected in sequence to form a third receiving path.

[0048] The fourth communication module 400 includes: a fourth receiving low-noise amplifier, a fourth receiving filter for multiple frequency bands, a fourth switch, and a fourth frequency divider; the fourth antenna, the fourth frequency divider, the fourth switch, the fourth receiving filter for multiple frequency bands, the fourth receiving low-noise amplifier, and the radio frequency transceiver are connected in sequence to form a fourth receiving path.

[0049] In this embodiment, each multiplexer can be selected from duplexers, triplexers, quadplexers, sextuplers, etc., according to actual needs. Each frequency divider can be selected from low-medium-high frequency dividers, low-medium frequency dividers, medium-high frequency dividers, etc., according to actual needs. Each receiving filter can be selected from single-frequency receiving filters, dual-frequency receiving filters, multi-frequency receiving filters, etc., according to actual needs. This embodiment does not impose any restrictions on this.

[0050] In some feasible embodiments, the first multiplexer is a duplexer, the first frequency divider is a low-medium-high frequency divider, the second multiplexer is a duplexer, the second frequency divider is a low-medium-high frequency divider, the third receiving filter is a single-frequency receiving filter, and the fourth receiving filter is a single-frequency receiving filter.

[0051] As an example, by breaking down the paths of different frequency bands, we can... Figure 2 The radio frequency circuitry in the text is further refined into, for example... Figure 3 The radio frequency circuit shown is composed of Figure 3It can be seen that the first communication module 100 includes transmitting and receiving paths, respectively, power amplifier 1, transmitting path 1 of different frequency bands, duplexers 1 of different frequency bands, switch 1, transceiving path 1 of medium and high frequencies, frequency divider 1 of low, medium and high frequencies, receiving path 1 of different frequency bands and receiving low noise amplifier 1; the second communication module 200 includes transmitting and receiving paths, respectively, power amplifier 2, transmitting path 2 of different frequency bands, duplexers 2 of different frequency bands, switch 2, transceiving path 2 of medium and high frequencies, frequency divider 2 of low, medium and high frequencies, receiving path 2 of different frequency bands and receiving low noise amplifier 2; the third communication module 300 includes receiving paths, respectively, frequency divider 3 of low, medium and high frequencies, receiving path 3 of different frequency bands, receiving filter 3 of different frequency bands and receiving low noise amplifier 3; the fourth communication module 400 includes receiving paths, respectively, frequency divider 4 of low, medium and high frequencies, receiving path 4 of different frequency bands, receiving filter 4 of different frequency bands and receiving low noise amplifier 4.

[0052] As an example, when the first frequency band works, the 4MIMO paths are respectively: first frequency band receiving path 1, first frequency band receiving path 2, first frequency band receiving path 3 and first frequency band receiving path 4.

[0053] As an example, when the second frequency band works, the 4MIMO paths are respectively: second frequency band receiving path 1, second frequency band receiving path 2, second frequency band receiving path 3 and second frequency band receiving path 4.

[0054] As an example, when the third frequency band works, the 4MIMO paths are respectively: third frequency band receiving path 1, third frequency band receiving path 2, third frequency band receiving path 3 and third frequency band receiving path 4. If CA or ENDC between low frequencies is to be realized, such as CA or ENDC between the first frequency band and the second frequency band, then the first frequency band can be set to transceiving antennas one and three; the second frequency band is set to transceiving antennas two and four, or vice versa. Because the four paths are independent, any combination can be realized, and different frequency bands can be configured according to different needs. In addition, CA or ENDC between low frequencies and medium and high frequencies can also be realized, and 4MIMO can be achieved for low, medium and high frequencies.

[0055] In some possible embodiments, the first multiplexer is a fourplexer or a sixplexer, the first frequency divider is a medium and high frequency divider, the second multiplexer is a fourplexer or a sixplexer, the second frequency divider is a medium and high frequency divider, the third receiving filter is a dual-frequency receiving filter and the fourth receiving filter is a dual-frequency receiving filter.

[0056] As an example, if dual low frequency 4MIMO and dual uplink are to be realized, the first frequency band can be set to transceiving antennas one and three, and the second frequency band can be set to transceiving antennas two and four. Figure 3two duplexers in the first communication module 100 and the second communication module 200 are replaced by four duplexers which can support two frequency bands at the same time, and the single-frequency receiving filter in the receiving path is replaced by a dual-frequency receiving filter. In this way, not only can the CA or ENDC combination between two frequency bands be realized, but also one path can be reduced to realize more frequency band combinations. The first frequency band transmitting path is the first transmitting path 1, and the receiving paths are the first frequency band receiving paths 1, 2, 3, and 4. The second frequency band transmitting path is the second frequency band transmitting path 2, and the receiving paths are the second frequency band receiving paths 1, 2, 3, and 4, so that the dual-low-frequency band uplink 2MIMO and downlink 4MIMO CA are realized.

[0057] With reference to Figure 4 In some possible embodiments, the third communication module 300 further includes a single-frequency transmitting path;

[0058] The first communication module 100 includes a first multi-mode power amplifier, a first multiplexer of multiple frequency bands, a first switch, a first frequency divider, and a first low-noise amplifier. The radio frequency transceiver, the first multi-mode power amplifier, the first multiplexer of multiple frequency bands, the first switch, the first frequency divider, and the first antenna are sequentially connected to form a first transmitting path. The first antenna, the first frequency divider, the first switch, the first multiplexer of multiple frequency bands, the first low-noise amplifier, and the radio frequency transceiver are sequentially connected to form a first receiving path.

[0059] The second communication module 200 includes a second multi-mode power amplifier, a second multiplexer of multiple frequency bands, a second switch, a second frequency divider, and a second low-noise amplifier. The radio frequency transceiver, the second multi-mode power amplifier, the second multiplexer of multiple frequency bands, the second switch, the second frequency divider, and the second antenna are sequentially connected to form a second transmitting path. The second antenna, the second frequency divider, the second switch, the second multiplexer of multiple frequency bands, the second low-noise amplifier, and the radio frequency transceiver are sequentially connected to form a second receiving path.

[0060] The third communication module 300 includes a single-frequency power amplifier, a third multiplexer, a third low-noise amplifier, a third receiving filter of multiple frequency bands, a third switch, and a third frequency divider. The radio frequency transceiver, the single-frequency power amplifier, the third multiplexer, the third switch, the third frequency divider, and the third antenna are sequentially connected to form a single-frequency transmitting path. The third antenna, the third frequency divider, the third switch, the third receiving filter of multiple frequency bands, the third low-noise amplifier, and the radio frequency transceiver are sequentially connected to form a third receiving path.

[0061] The fourth communication module 400 includes a fourth low-noise amplifier, a fourth receiving filter of multiple frequency bands, a fourth switch, and a fourth frequency divider. The fourth antenna, the fourth frequency divider, the fourth switch, the fourth receiving filter of multiple frequency bands, the fourth low-noise amplifier, and the radio frequency transceiver are sequentially connected to form a fourth receiving path.

[0062] In the embodiment, the third communication module 300 includes a single-frequency transmitting path in addition to the third receiving path of multiple frequency bands, and the single-frequency power amplifier in the embodiment can be replaced by different frequency bands and can be greater than or equal to one.

[0063] Similarly to the above embodiment, in the embodiment, each multiplexer can be selected from a duplex, a triplex, a quadruplex, a sextuplex, and the like according to actual needs, each frequency divider can be selected from a low, medium, and high frequency divider, a low and medium frequency divider, a medium and high frequency divider, and the like according to actual needs, and each receiving filter can be selected from a single-frequency receiving filter, a dual-frequency receiving filter, a multi-frequency receiving filter, and the like according to actual needs, and the embodiment does not limit this.

[0064] In some possible embodiments, the radio frequency circuit is configured to implement ENDC between three uplinks and two downlinks of low frequencies.

[0065] As an example, if it is desired to implement CA or ENDC between three low frequencies, three uplinks, and two downlinks, the radio frequency circuit in the Figure 4 may be further refined into the radio frequency circuit as shown in Figure 5 It can be known from Figure 5 that the LTE low-frequency two-frequency transmitting path passes through the first and second frequency band transmitting path 1, the first and second frequency band transmitting path 2, the NR low-frequency third frequency band transmitting path passes through the third frequency band transmitting path 3, the LTE two-frequency main set receiving path passes through the first and second frequency band receiving path 1, the LTE two-frequency diversity receiving path passes through the first and second frequency band receiving path 2, the NR frequency band main set receiving path passes through the third frequency band receiving path 3, and the NR frequency band diversity receiving path passes through the third frequency band receiving path 4, thereby implementing ENDC between three uplinks and two downlinks of low frequencies.

[0066] In some possible embodiments, the radio frequency circuit is configured to implement CA between three uplinks and four downlinks of low, medium, and high frequencies.

[0067] In some possible embodiments, the radio frequency circuit is configured to implement ENDC between three uplinks and four downlinks of low, medium, and high frequencies.

[0068] As an example, if it is desired to implement CA or ENDC between low, medium, and high frequencies, three uplinks, and four downlinks, the low-frequency transmitting path can be set as the first frequency band transmitting path 1, the medium-frequency transmitting path can be set as the medium-frequency transmitting path 2, the high-frequency transmitting path can be set as the high-frequency transmitting path 3, the four-way receiving of the low frequency can be set as the first frequency band receiving path 1, 2, 3, and 4, the receiving of the medium frequency can be set as the medium-frequency receiving path 1, 2, 3, and 4, and the receiving of the high frequency can be set as the high-frequency receiving path 1, 2, 3, and 4, thereby implementing CA or ENDC between three uplinks and four downlinks of low, medium, and high frequencies.

[0069] In some possible embodiments, the third receiving filter is a dual-frequency receiving filter or a multi-band receiving filter, and the fourth receiving filter is a dual-frequency receiving filter or a multi-band receiving filter.

[0070] It can be understood that each receiving filter can be selected from a single-frequency receiving filter, a dual-frequency receiving filter, a multi-band receiving filter, and the like according to actual needs, and the embodiments are not limited in this regard.

[0071] As an example, the embodiments provide a radio frequency circuit example as shown in Figure 6 as shown in

[0072] as shown in Figure 6 , to realize LB LTE+LB NR EN-DC, such as ENDC of B20+N28, dual low frequency dual connectivity, and dual low frequency supporting 4MIMO. The specific working path is as follows: the transmitting path of LTE:B20 is transceiver module 1, multi-mode power amplifier 1+B20&B28 four power 1+switch 1+frequency divider 1+antenna 1; the main set receiving PRX of B20 is antenna 1+frequency divider 1+switch 1+B20&B28 four power 1+low noise amplifier 1; the diversity receiving DRX of B20 is antenna 2+frequency divider 2+switch 2+B20&B28 four power 2+low noise amplifier 2; the PRX MIMO of B20 is antenna 3+frequency divider 3+switch 3+B20&B28 dual-frequency receiving filter 1+low noise amplifier 3; the DRX MIMO of B20 is antenna 4+frequency divider 4+switch 4+B20&B28 dual-frequency receiving filter 2+low noise amplifier 4. The transmitting path of NR:N28 is transceiver module 2, multi-mode power amplifier 2+B20&B28 four power 2+switch 2+frequency divider 2+antenna 2; the main set receiving PRX of N28 is antenna 2+frequency divider 2+switch 2+B20&B28 four power 2+low noise amplifier 2; the diversity receiving DRX of N28 is antenna 1+frequency divider 1+switch 1+B20&B28 four power 1+low noise amplifier 1; the PRX MIMO of N28 is antenna 4+frequency divider 4+switch 4+B20&B28 dual-frequency receiving filter 2+low noise amplifier 4; the DRX MIMO of N28 is antenna 3+frequency divider 3+switch 3+B20&B28 dual-frequency receiving filter 1+low noise amplifier 3. In this way, ENDC of B20+N28 is realized, and 4MIMO reception can be supported.

[0073] as shown in Figure 6As shown, three low-frequency LB+LB+LB CA, such as B8+B20+B28 CA, is implemented, and three low frequencies support simultaneous support of dual uplink and downlink 2MIMO. The transmission path of B20 passes through multi-mode power amplifier 1 from radio transceiver chip TX1 to four power amplifier 1 of B20&B28, to switch 1, and is transmitted from antenna 1 through frequency divider 1; the main set reception of B20 and B28 passes through antenna 1 to frequency divider 1, then passes through switch 1, then passes through four power amplifier 1 of B20&B28 to low noise amplifier 1, and then reaches the receiving RX1 of the radio transceiver chip; the diversity reception of B20 and B28 passes through antenna 3 to frequency divider 3, then passes through switch 3, then passes through dual-frequency reception filter 1 of B20&B28 to low noise amplifier 3, and then reaches the receiving RX3 of the radio transceiver chip; the transmission path of B8 passes through multi-mode power amplifier 2 from radio transceiver chip TX2 to dual power amplifier 2 of B8, to switch 2, and is transmitted from antenna 2 through frequency divider 2; the main set reception of B8 passes through antenna 2 to frequency divider 2, then passes through switch 2, then passes through dual power amplifier 2 of B8 to low noise amplifier 2, and then reaches the receiving RX2 of the radio transceiver chip; the diversity reception of B8 passes through antenna 4 to frequency divider 4, then passes through switch 4, then passes through reception filter 2 of B8 to low noise amplifier 4, and then reaches the receiving RX4 of the radio transceiver chip. In this way, 3CA of B8+B20+B28 is implemented, supporting B8, B20 dual uplink and B8, B20, B28 2MIMO downlink.

[0074] As an example, the embodiment based on the above embodiments provides a radio frequency circuit as shown in another example: Figure 7 Another example of a radio frequency circuit is shown as follows:

[0075] As shown in another example of a radio frequency circuit: Figure 7As shown, LB+LB+MB+MB+HB 5CA is realized, and five frequencies support 4MIMO, such as 5CA of B20+B28+B1+B3+B7, three transmissions, low frequency B20, medium frequency B1, and high frequency B7, and five frequencies support 4MIMO. The transmission path of B20 passes through multi-mode power amplifier 1 from radio transceiver chip TX1 to four-power amplifier 1 of B20&B28, to switch 1, and is transmitted from antenna 1 through frequency divider 1; the main set reception of B20 and B28 passes through antenna 1 to frequency divider 1, passes through switch 1, passes through four-power amplifier 1 of B20&B28 to low noise amplifier 1, and then reaches the reception RX1 of the radio transceiver chip; the diversity reception of B20 and B28 passes through antenna 2 to frequency divider 2, passes through switch 2, passes through four-power amplifier 2 of B20&B28 to low noise amplifier 2, and then reaches the reception RX2 of the radio transceiver chip; the main set MIMO reception of B20 and B28 passes through antenna 3 to frequency divider 3, passes through switch 3, passes through dual-frequency reception filter 1 of B20&B28 to low noise amplifier 3, and then reaches the reception RX3 of the radio transceiver chip; the diversity MIMO reception of B20 and B28 passes through antenna 4 to frequency divider 4, passes through switch 4, passes through dual-frequency reception filter 2 of B20&B28 to low noise amplifier 4, and then reaches the reception RX4 of the radio transceiver chip. The transmission path of B1 passes through single-frequency power amplifier 3 from radio transceiver chip TX3 to B1+B3 transmission path 3, and is transmitted from antenna 3 through frequency divider 3; the main set reception of B1 and B3 passes through antenna 3 to frequency divider 3, passes through B1+B3 transmission path 3 to low noise amplifier 3, and then reaches the reception RX3 of the radio transceiver chip; the diversity reception of B1 and B3 passes through antenna 4 to frequency divider 4, passes through B1+B3 transmission path 4 to low noise amplifier 4, and then reaches the reception RX4 of the radio transceiver chip; the main set MIMO reception of B1 and B3 passes through antenna 1 to frequency divider 1, passes through B1+B3 reception path 1 to low noise amplifier 1, and then reaches the reception RX1 of the radio transceiver chip; the diversity MIMO reception of B1 and B3 passes through antenna 2 to frequency divider 2, passes through B1+B3 reception path 2 to low noise amplifier 2, and then reaches the reception RX2 of the radio transceiver chip.The transmitting path of B7 transmits from the radio frequency transceiver chip TX2 through the multi-mode power amplifier 2 to the B7 transceiver path 2, and transmits from the antenna 2 through the frequency divider 2; the main set reception of B7 reaches the frequency divider 2 through the antenna 2, and then reaches the low noise amplifier 2 through the B7 transceiver path 2, and then reaches the radio frequency transceiver chip RX2; the diversity reception of B7 reaches the frequency divider 1 through the antenna 1, and then reaches the low noise amplifier 1 through the B7 transceiver path 1, and then reaches the radio frequency transceiver chip RX1; the main set MIMO reception of B7 reaches the frequency divider 4 through the antenna 4, and then reaches the low noise amplifier 4 through the B7 receiving path 4, and then reaches the radio frequency transceiver chip RX4; the diversity MIMO reception of B7 reaches the frequency divider 3 through the antenna 3, and then reaches the low noise amplifier 3 through the B7 receiving path 3, and then reaches the radio frequency transceiver chip RX3. Three uplinks, five downlinks, and 4MIMO CA are realized.

[0076] The embodiment provides a radio frequency circuit which uses a separation device, does not need to use a large-area, frequency band combination limited, and expensive receiving front end module, combiner, and the like, and can realize carrier aggregation CA4MIMO and 4G, 5G dual connection ENDC 4MIMO between low frequencies and between low, medium, and high frequencies, in particular, 2CA4MIMO, 3CA, and ENDC 4MIMO between low frequencies.

[0077] In addition, the embodiment of the application further provides an electronic device comprising the radio frequency circuit provided in the above embodiment.

[0078] The electronic device provided in the embodiment belongs to the same technical concept as the radio frequency circuit provided in the above embodiment, and the technical details not described in detail in the embodiment can be referred to the above any embodiment, and the electronic device has the same beneficial effects as the radio frequency circuit in each embodiment.

[0079] It should be noted that the technical solutions of each embodiment of the embodiment of the application can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor is it within the protection scope claimed by the embodiment of the application.

[0080] The above is only an optional embodiment of the embodiment of the application, and does not limit the patent scope of the embodiment of the application, any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the embodiment of the application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the embodiment of the application.

Claims

1. A radio frequency circuit, characterized in that, The radio frequency circuit includes: A radio frequency transceiver, and a first communication module, a second communication module, a third communication module and a fourth communication module respectively connected to the radio frequency transceiver; The first communication module, the second communication module, the third communication module, and the fourth communication module are respectively connected to the first antenna, the second antenna, the third antenna, and the fourth antenna; The first communication module includes a first transmission path and a first receiving path for multiple frequency bands; The second communication module includes a second transmission path and a second receiving path with multiple frequency bands; The third communication module includes at least a third receiving path for multiple frequency bands; The fourth communication module includes a fourth receiving path with multiple frequency bands.

2. The radio frequency circuit as described in claim 1, characterized in that, The first communication module includes: a first power amplifier, a first multiplexer for multiple frequency bands, a first switch, a first frequency divider, and a first receiving low-noise amplifier; the radio frequency transceiver, the first power amplifier, the first multiplexer for multiple frequency bands, the first switch, the first frequency divider, and the first antenna are connected in sequence to form the first transmission path; the first antenna, the first frequency divider, the first switch, the first multiplexer for multiple frequency bands, the first receiving low-noise amplifier, and the radio frequency transceiver are connected in sequence to form the first receiving path; The second communication module includes: a second power amplifier, a second multiplexer for multiple frequency bands, a second switch, a second frequency divider, and a second receiving low-noise amplifier; the radio frequency transceiver, the second power amplifier, the second multiplexer for multiple frequency bands, the second switch, the second frequency divider, and the second antenna are connected in sequence to form the second transmission path; the second antenna, the second frequency divider, the second switch, the second multiplexer for multiple frequency bands, the second receiving low-noise amplifier, and the radio frequency transceiver are connected in sequence to form the second receiving path; The third communication module includes: a third receiving low-noise amplifier, a third receiving filter for multiple frequency bands, a third switch, and a third frequency divider; the third antenna, the third frequency divider, the third switch, the third receiving filter for multiple frequency bands, the third receiving low-noise amplifier, and the radio frequency transceiver are connected in sequence to form the third receiving path; The fourth communication module includes: a fourth receiving low-noise amplifier, a fourth receiving filter for multiple frequency bands, a fourth switch, and a fourth frequency divider; the fourth antenna, the fourth frequency divider, the fourth switch, the fourth receiving filter for multiple frequency bands, the fourth receiving low-noise amplifier, and the radio frequency transceiver are connected in sequence to form the fourth receiving path.

3. The radio frequency circuit as described in claim 2, characterized in that, The first multiplexer is a duplexer, the first frequency divider is a low-medium-high frequency divider, the second multiplexer is a duplexer, the second frequency divider is a low-medium-high frequency divider, the third receiving filter is a single-frequency receiving filter, and the fourth receiving filter is a single-frequency receiving filter.

4. The radio frequency circuit as described in claim 2, characterized in that, The first multiplexer is a quadruple or sextupler, the first frequency divider is a mid-to-high frequency frequency divider, the second multiplexer is a quadruple or sextupler, the second frequency divider is a mid-to-high frequency frequency divider, the third receiving filter is a dual-frequency receiving filter, and the fourth receiving filter is a dual-frequency receiving filter.

5. The radio frequency circuit as described in claim 1, characterized in that, The third communication module also includes a single-frequency transmission path; The first communication module includes: a first multimode power amplifier, a first multiplexer for multiple frequency bands, a first switch, a first frequency divider, and a first low-noise amplifier; the radio frequency transceiver, the first multimode power amplifier, the first multiplexer for multiple frequency bands, the first switch, the first frequency divider, and the first antenna are connected in sequence to form the first transmission path; the first antenna, the first frequency divider, the first switch, the first multiplexer for multiple frequency bands, the first low-noise amplifier, and the radio frequency transceiver are connected in sequence to form the first receiving path; The second communication module includes: a second multi-mode power amplifier, a second multiplexer for multiple frequency bands, a second switch, a second frequency divider, and a second low-noise amplifier; the radio frequency transceiver, the second multi-mode power amplifier, the second multiplexer for multiple frequency bands, the second switch, the second frequency divider, and the second antenna are connected in sequence to form the second transmission path; the second antenna, the second frequency divider, the second switch, the second multiplexer for multiple frequency bands, the second low-noise amplifier, and the radio frequency transceiver are connected in sequence to form the second reception path; The third communication module includes: a single-frequency power amplifier, a third multiplexer, a third low-noise amplifier, a third receiving filter for multiple frequency bands, a third switch, and a third frequency divider; the radio frequency transceiver, the single-frequency power amplifier, the third multiplexer, the third switch, the third frequency divider, and the third antenna are connected in sequence to form the single-frequency transmission path; the third antenna, the third frequency divider, the third switch, the third receiving filter for multiple frequency bands, the third low-noise amplifier, and the radio frequency transceiver are connected in sequence to form the third receiving path; The fourth communication module includes: a fourth low-noise amplifier, a fourth receiving filter for multiple frequency bands, a fourth switch, and a fourth frequency divider; the fourth antenna, the fourth frequency divider, the fourth switch, the fourth receiving filter for multiple frequency bands, the fourth low-noise amplifier, and the radio frequency transceiver are connected in sequence to form the fourth receiving path.

6. The radio frequency circuit as described in claim 5, characterized in that, The radio frequency circuit is configured to implement ENDC between three uplink and two downlink low frequencies.

7. The radio frequency circuit as described in claim 5, characterized in that, The radio frequency circuit is configured to implement CA (Carrier Interchange) between three uplinks and four downlinks at low, medium, and high frequencies.

8. The radio frequency circuit as described in claim 5, characterized in that, The radio frequency circuit is configured to achieve ENDC between three uplinks and four downlinks at low, medium, and high frequencies.

9. The radio frequency circuit as described in claim 5, characterized in that, The third receiving filter is a dual-frequency receiving filter or a multi-band receiving filter, and the fourth receiving filter is a dual-frequency receiving filter or a multi-band receiving filter.

10. An electronic device, characterized in that, The electronic device includes a radio frequency circuit as described in any one of claims 1 to 9.

Images