A method for producing thick copper circuit lines of a circuit board and a circuit board

Abstract

The application discloses a thick copper circuit production method of a circuit board and the circuit board. The method comprises the following steps: performing fine carving treatment on a first copper layer and a second copper layer of a to-be-processed circuit board to obtain a first thick copper circuit and a second thick copper circuit; performing resin filling treatment between the first thick copper circuit and the second thick copper circuit to obtain a first circuit board, wherein the first filling hole resin between the first thick copper circuit has a first groove after cooling, and the second filling hole resin between the second thick copper circuit has a second groove after cooling; performing grinding and polishing treatment on the first filling hole resin and the second filling hole resin to obtain a third circuit board; and performing circuit forming treatment on the third circuit board to obtain a target circuit board. The first copper layer and the second copper layer are subjected to fine carving treatment, the forming of the thick copper circuit is quickly completed, and the production efficiency is high. The resin is filled between the thick copper circuits, the interference between the thick copper circuits is reduced, and the production quality of the circuit board is improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a method for producing thick copper lines on a circuit board and the circuit board itself. Background Technology

[0002] In current circuit board manufacturing, the etching process typically involves applying a dry film to a copper-clad circuit board and then performing chemical etching. However, when the copper layer on the circuit board is relatively thick, the etching efficiency is low, interference between lines is strong, and the overall circuit board production quality is poor. Summary of the Invention

[0003] In view of this, the purpose of this invention is to provide a method for producing thick copper lines on a circuit board and a circuit board that can improve the production efficiency of thick copper lines and ensure the production quality of the circuit board.

[0004] In a first aspect, embodiments of the present invention provide a method for producing thick copper lines on a circuit board, comprising:

[0005] After precision engraving of the first copper layer and the second copper layer of the circuit board to be processed, a first thick copper line and a second thick copper line are obtained. The first thick copper line is located in the first copper layer, and the second thick copper line is located in the second copper layer. A first semi-cured layer, a core board layer and a second semi-cured layer are sequentially disposed between the first copper layer and the second copper layer. The first copper layer, the second copper layer and the core board layer have the same thickness.

[0006] A first circuit board is obtained by resin filling between the first thick copper line and the second thick copper line. The first filling resin between the first thick copper lines has a first groove after cooling, and the second filling resin between the second thick copper lines has a second groove after cooling. The depth of the first groove is less than or equal to the first thickness difference between the first filling resin and the first thick copper line, and the depth of the second groove is less than or equal to the second thickness difference between the second filling resin and the second thick copper line.

[0007] The third circuit board is obtained by grinding and polishing the first and second pore-filling resins.

[0008] The target circuit board is obtained by performing circuit forming processing on the third circuit board.

[0009] In some optional embodiments, the process of precision etching the first and second copper layers of the circuit board to be processed to obtain the first thick copper line and the second thick copper line includes:

[0010] Obtain circuit pattern information and first pose information. The circuit pattern information represents the circuit parameters of the first thick copper circuit and the second thick copper circuit, and the first pose information indicates the pose information of the circuit board to be processed.

[0011] Based on the circuit pattern information and the first pose information, a first laser groove is obtained by performing a first laser etching process on the first copper layer, and a second laser groove is obtained by performing a second laser etching process on the second copper layer.

[0012] The first thick copper line is obtained by performing a first mechanical cut on the first laser groove. The first precision carving groove is obtained by performing the first mechanical cut on the first laser groove. The first precision carving groove is used to fill the first hole-filling resin.

[0013] The second thick copper line is obtained by performing a second mechanical cut on the second laser groove. The second precision carving groove is obtained by performing a second mechanical cut on the second laser groove. The second precision carving groove is used to fill the second hole-filling resin. The precision carving process represents the first laser etching process, the second laser etching process, the first mechanical cut, and the second mechanical cut.

[0014] In some optional embodiments, obtaining the first laser groove by performing a first laser etching process on the first copper layer according to the circuit pattern information and the first pose information includes:

[0015] The first laser control map is obtained based on the circuit graphic information and the laser path generation algorithm;

[0016] Obtain the first thickness information of the first copper layer;

[0017] A first correction pattern is determined based on the first pose information, the first thickness information, and the first line etching area, wherein the first line etching area represents the area on the first copper layer where laser etching is performed.

[0018] The first laser control spectrum is obtained by correcting the first laser control spectrum according to the first correction spectrum;

[0019] The first laser groove is obtained by controlling the laser etching component to perform the first laser etching process in the first line etching area according to the first laser correction control spectrum.

[0020] In some optional embodiments, obtaining the second laser groove after performing a second laser etching process on the second copper layer includes:

[0021] After swapping the poses of the first copper layer and the second copper layer, the second pose information of the circuit board to be processed is obtained.

[0022] The second laser control map is obtained based on the circuit graphic information and the laser path generation algorithm;

[0023] Obtain the second thickness information of the second copper layer;

[0024] The second correction pattern is determined based on the second pose information, the second thickness information, and the second line etching area, wherein the second line etching area represents the area on the second copper layer where laser etching is performed.

[0025] The second laser control spectrum is obtained by correcting the second laser control spectrum according to the second correction spectrum;

[0026] The laser etching component is controlled according to the second laser correction control map to perform the second laser etching process in the second line etching area to obtain the second laser groove.

[0027] In some optional embodiments, obtaining the first thick copper line by performing a first mechanical cut on the first laser groove includes:

[0028] Obtain the first shape information of the first laser groove;

[0029] A first stress bearing map is determined based on the first shape information and the stress analysis model. The first stress bearing map is used to indicate the stress bearing value corresponding to each part of the first laser groove.

[0030] Based on the first shape information and the law of cutting stress generation, the cutting positions where the stresses cancel each other out during cutting are determined, and the first cutting stress symmetry table is obtained.

[0031] A first target cutting sequence table is determined based on the first stress bearing spectrum and the first cutting stress symmetry table. The first target cutting sequence table indicates the cutting sequence of each cutting area on the first laser groove.

[0032] Obtain the first depth of the first laser groove;

[0033] The first cutting depth is determined based on the first depth and the first thickness information;

[0034] According to the first target cutting sequence table, the cutting components are controlled sequentially to cut to the first cutting depth in each cutting area of ​​the first laser groove to obtain the first thick copper line.

[0035] In some optional embodiments, obtaining the second thick copper line by performing a second mechanical cut on the second laser groove includes:

[0036] Obtain the second shape information of the second laser groove;

[0037] The second stress bearing spectrum is determined based on the second shape information, the first thick copper line and the stress analysis model. The second stress bearing spectrum is used to indicate the stress bearing value corresponding to each part of the second laser groove.

[0038] Based on the second shape information, the first thick copper line, and the law of cutting stress generation, the cutting positions where the stresses cancel each other out during cutting are determined, and the second cutting stress symmetry table is obtained.

[0039] The second target cutting sequence table is determined based on the second stress bearing spectrum and the second cutting stress symmetry table. The second target cutting sequence table indicates the cutting sequence of each cutting area on the second laser groove.

[0040] Obtain the second depth of the second laser groove;

[0041] The second cutting depth is determined based on the second depth and the second thickness information;

[0042] According to the second target cutting sequence table, the cutting components are controlled sequentially to cut to the second cutting depth in each cutting area of ​​the second laser groove to obtain the second thick copper line.

[0043] In some optional embodiments, after the first and second copper layers of the circuit board to be processed are precision-etched to obtain the first thick copper line and the second thick copper line, the process further includes:

[0044] Obtain copper layer information and prepreg information, wherein the copper layer information represents the material information of the first engraving groove and the second engraving groove, and the prepreg information represents the material information of the first prepreg layer and the second prepreg layer;

[0045] Acquire roughening fluid information, wherein the roughening fluid information represents the concentration, composition and temperature information of the roughening fluid;

[0046] Based on the roughening liquid information and the copper layer information, a first roughening curve for the first fine carving groove and a second roughening curve for the second fine carving groove are generated. The first roughening curve characterizes the relationship between the sidewall roughness of the first fine carving groove and time, and the second roughening curve characterizes the relationship between the sidewall roughness of the second fine carving groove and time.

[0047] Based on the roughening liquid information and the semi-cured sheet information, a third roughening curve for the first fine carving groove and a fourth roughening curve for the second fine carving groove are generated. The third roughening curve represents the relationship between the bottom roughness of the first fine carving groove and time, and the fourth roughening curve represents the relationship between the bottom roughness of the second fine carving groove and time.

[0048] The first fine carving groove is roughened according to the first roughening curve and the third roughening curve, and the second fine carving groove is roughened according to the second roughening curve and the fourth roughening curve, wherein the first fine carving groove has a first roughness and the second fine carving groove has a second roughness.

[0049] In some optional embodiments, the step of roughening the first engraving groove according to the first roughening curve and the third roughening curve, and roughening the second engraving groove according to the second roughening curve and the fourth roughening curve, includes:

[0050] Obtain the first coarsening weight of the first fine carving groove sidewall and the second coarsening weight of the second fine carving groove sidewall;

[0051] Obtain the third coarsening weight of the bottom of the first fine carving groove and the fourth coarsening weight of the bottom of the second fine carving groove;

[0052] The roughness at each time point on the first coarsening curve is multiplied by the first coarsening weight to obtain the first weighted coarsening curve, and the roughness at each time point on the second coarsening curve is multiplied by the second coarsening weight to obtain the second weighted coarsening curve.

[0053] The roughness at each time point on the third coarsening curve is multiplied by the third coarsening weight to obtain the third weight coarsening curve, and the roughness at each time point on the fourth coarsening curve is multiplied by the fourth coarsening weight to obtain the fourth weight coarsening curve.

[0054] The first comprehensive coarsening curve is obtained by superimposing the first weight coarsening curve and the third weight coarsening curve, and the second comprehensive coarsening curve is obtained by superimposing the second weight coarsening curve and the fourth weight coarsening curve.

[0055] The first roughening time is determined based on the first roughness and the first comprehensive roughening curve, and the second roughening time is determined based on the second roughness and the second comprehensive roughening curve.

[0056] The first fine carving tank is roughened by a roughening liquid during the first roughening time, and the second fine carving tank is roughened by a roughening liquid during the second roughening time.

[0057] In some optional embodiments, the process of grinding and polishing the first and second pore-filling resins to obtain the third circuit board includes:

[0058] After ceramic polishing the first pore-filling resin and the second pore-filling resin respectively, a first polishing resin and a second polishing resin are obtained. The first polishing resin is at the same level as the bottom of the first groove, and the second polishing resin is at the same level as the bottom of the second groove.

[0059] After the first polishing resin and the second polishing resin are polished with non-woven fabric, a third polishing resin and a fourth polishing resin are obtained. The third polishing resin is at the same level as the top of the first thick copper line, and the fourth polishing resin is at the same level as the top of the second thick copper line.

[0060] The third circuit board is obtained by polishing the third polishing resin and the fourth polishing resin respectively.

[0061] Secondly, embodiments of the present invention provide a circuit board, which is manufactured by the aforementioned method for producing thick copper lines for circuit boards.

[0062] The implementation of this invention provides the following beneficial effects: This invention provides a method for producing thick copper circuitry on a circuit board, comprising: performing precision engraving on a first copper layer and a second copper layer of the circuit board to be processed to obtain a first thick copper circuit and a second thick copper circuit, wherein the first thick copper circuit is located on the first copper layer, the second thick copper circuit is located on the second copper layer, and a first semi-cured layer, a core board layer, and a second semi-cured layer are sequentially disposed between the first copper layer and the second copper layer, and the first copper layer, the second copper layer, and the core board layer have the same thickness; performing resin filling treatment between the first thick copper circuit and the second thick copper circuit to obtain a first circuit board, wherein the first via-filling resin between the first thick copper circuits has a first groove after cooling, and the second via-filling resin between the second thick copper circuits has a second groove after cooling, wherein the depth of the first groove is less than or equal to a first thickness difference between the first via-filling resin and the first thick copper circuit, and the depth of the second groove is less than or equal to a second thickness difference between the second via-filling resin and the second thick copper circuit; performing grinding and polishing treatment on the first and second via-filling resins to obtain a third circuit board; and performing circuit forming treatment on the third circuit board to obtain a target circuit board. By precision carving the first and second copper layers, the thick copper circuitry can be formed quickly, resulting in high production efficiency. By filling the spaces between the thick copper circuitry with resin, the flatness of the circuitry is ensured, and the resin isolation reduces interference between the circuitry, improving the quality of the thick copper circuitry and thus enhancing the overall quality of the circuit board production. Attached Figure Description

[0063] Figure 1 This is a flowchart of the steps of a method for producing thick copper lines on a circuit board according to an embodiment of the present invention;

[0064] Figure 2 This is a schematic diagram of the structure of the circuit board to be processed provided in an embodiment of the present invention;

[0065] Figure 3 This is a schematic diagram of the fine carving of the first and second fine carving grooves provided in the embodiments of the present invention;

[0066] Figure 4 This is a schematic diagram of resin filling provided in an embodiment of the present invention.

[0067] Reference numerals: First copper layer 100, first laser groove 110, first engraving groove 120, first thick copper line 130, first hole-filling resin 140, third polishing resin 150, first semi-cured layer 200, core board layer 300, second semi-cured layer 400, second copper layer 500, second laser groove 510, second engraving groove 520, second thick copper line 530, second hole-filling resin 540, fourth polishing resin 550. Detailed Implementation

[0068] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0069] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0070] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0071] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0072] The following describes in further detail the method for producing thick copper lines on a circuit board according to an embodiment of the present invention.

[0073] Reference Figure 1-4 , Figure 1 A flowchart illustrating a method for producing thick copper lines on a circuit board, as provided in this embodiment of the invention, includes, but is not limited to, the following steps:

[0074] S100, after precision engraving of the first copper layer 100 and the second copper layer 500 of the circuit board to be processed, a first thick copper line 130 and a second thick copper line 530 are obtained. The first thick copper line 130 is located on the first copper layer 100, and the second thick copper line 530 is located on the second copper layer 500. A first semi-cured layer 200, a core board layer 300 and a second semi-cured layer 400 are sequentially disposed between the first copper layer 100 and the second copper layer 500. The first copper layer 100, the second copper layer 500 and the core board layer 300 have the same thickness.

[0075] Specifically, the circuit board to be processed in this application is formed by laminating at least two thick copper plates, a core board, and at least two prepreg sheets. The specific number of core boards, thick copper plates, and prepreg sheets is set according to actual needs and is not limited here. In some embodiments, the circuit board to be processed in this application is a fiberglass board, specifically a three-layer board.

[0076] Before fine engraving, the cutting speed, feed rate, and cutting depth of the fine engraving equipment are determined based on the copper layer thickness of the first copper layer 100 and the second copper layer 500, the circuit accuracy requirements, etc. A suitable fixture is used to fix the circuit board to be processed on the worktable of the fine engraving equipment to ensure that the circuit board to be processed will not be displaced or vibrated during the fine engraving process.

[0077] During the fine engraving of the first copper layer 100, the engraving path for the first copper layer 100 is generated according to the design requirements. Following the set process parameters and engraving path, the fine engraving equipment is started to engrave the first copper layer 100. During the fine engraving process, the operation of the engraving equipment and the processing quality of the lines are monitored in real time. After the fine engraving is completed, the lines of the first copper layer 100 are inspected for quality, including dimensional accuracy, shape accuracy, and surface roughness.

[0078] During the fine engraving of the second copper layer 500, the mark points are first positioned using the vision system of the fine engraving equipment or other positioning devices to align the mark points of the second copper layer 500 with those of the first copper layer 100, ensuring the positional accuracy of the lines on both copper layers. The fine engraving steps of the first thick copper line 130 are repeated to obtain the second thick copper line 530.

[0079] In some alternative embodiments, refer to Figure 3The first thick copper line 130 and the second thick copper line 530 are obtained by precision engraving the first copper layer 100 and the second copper layer 500 of the circuit board to be processed, including:

[0080] S110, acquire circuit pattern information and first pose information. The circuit pattern information represents the circuit parameters of the first thick copper line 130 and the second thick copper line 530, and the first pose information indicates the pose information of the circuit board to be processed.

[0081] Specifically, the circuit pattern information includes parameters for the specific thickness of the copper circuit and the parameters for the engraving grooves: the width, spacing, corner radius, and circuit direction of the first thick copper circuit 130 and the second thick copper circuit 530; and the depth (equal to the copper layer thickness) and width of the first engraving groove 120 and the second engraving groove 520. The circuit pattern information is converted into a laser etching path (vector graphics) and a mechanical cutting path (including compensation). Since the bottom of the engraving groove is a semi-cured layer, if the engraving groove is obtained directly by laser etching, the high temperature generated by the laser etching will melt the semi-cured layer, leading to misalignment between the copper layer and the core board or local depressions in the semi-cured layer, thus affecting the quality of the final target circuit board. Therefore, this application combines laser etching and mechanical cutting, first performing laser etching and then mechanical cutting, ensuring circuit forming efficiency while avoiding the melting of the semi-cured layer, thus improving the quality of the target circuit board. Specifically, the depths of the first laser groove 110 and the second laser groove 510 etched by laser are related to the melting temperature of the semi-cured layer. That is, when the laser etching reaches the bottom of the first laser groove 110 and the second laser groove 510, the temperature on the semi-cured layer (referring to the first semi-cured layer 200 and the second semi-cured layer 400) is lower than the melting temperature. The first pose information is obtained by a visual positioning system (such as a CCD camera and Mark point recognition) to acquire the pose information (spatial coordinates, rotation angle) of the circuit board to be processed, and this information is synchronized to the laser etching equipment (i.e., the laser etching component) and the mechanical cutting equipment (i.e., the mechanical cutting component).

[0082] S120, based on the circuit pattern information and the first pose information, a first laser etching process is performed on the first copper layer 100 to obtain a first laser groove 110, and a second laser etching process is performed on the second copper layer 500 to obtain a second laser groove 510.

[0083] Specifically, the circuit pattern information and the first position information are synchronized to the control system of the laser etching equipment, and the control system automatically generates a suitable laser etching path. For the first copper layer 100, the laser etching equipment performs the first laser etching process according to the generated path: the laser beam is focused on a designated area of ​​the first copper layer 100, and the excess copper material is gradually removed through high temperature energy, finally forming the first laser groove 110 on the first copper layer 100; the shape and position of the first laser groove 110 match the first thick copper line 130 to be formed subsequently, and the groove depth is controlled at a certain proportion of the copper layer thickness (such as 60% to 70%), which both reserves processing allowance for subsequent mechanical cutting and avoids the laser directly penetrating the copper layer and damaging the first semi-cured layer 200 below. Similarly, for the second copper layer 500, the second laser etching process is performed according to the same information matching and path generation logic to form a second laser groove 510 on the second copper layer 500 that is compatible with the second thick copper line 530, and to ensure that the positional deviation of the second laser groove 510 and the first laser groove 110 in the vertical direction is controlled within a preset range (e.g., ≤0.01mm) to meet the alignment requirements between circuit board layers.

[0084] S130, the first thick copper line 130 is obtained by performing a first mechanical cut on the first laser groove 110, and the first precision carving groove 120 is obtained by performing the first mechanical cut on the first laser groove 110, and the first precision carving groove 120 is used to fill the first hole filling resin 140.

[0085] Specifically, the first laser groove 110 is mechanically cut to form the first thick copper line 130 and create the first precision-carved groove 120 for filling with resin. Before the first mechanical cut, the position is recalibrated based on the first position information to ensure that the cutting path is precisely aligned with the laser groove. During cutting, a carbide end mill adapted to the width of the first laser groove 110 is selected, and the first laser groove 110 is processed according to preset cutting parameters (including spindle speed, feed rate, and layer cutting depth): the end mill gradually cuts away the remaining copper material in the groove of the first laser groove 110 along the contour of the first laser groove 110 until the cutting depth reaches the total thickness of the copper layer (i.e., just reaching the surface of the first semi-cured layer 200 below). Through the first mechanical cutting, the uncut area on the first copper layer 100 forms the first thick copper line 130; at the same time, the original first laser groove 110 is deepened and the outline is more precise after mechanical cutting, and finally forms the first precision groove 120. The size (width and depth) of the first precision groove 120 matches the filling requirements of the first hole-filling resin 140. By filling the first hole-filling resin 140, functions such as insulation, heat conduction or structural reinforcement are achieved.

[0086] S140, the second thick copper line 530 is obtained by performing a second mechanical cut on the second laser groove 510. The second laser groove 510 is then cut into a second precision carving groove 520. The second precision carving groove 520 is used to fill the second hole-filling resin 540. The precision carving process represents the first laser etching process, the second laser etching process, the first mechanical cut, and the second mechanical cut.

[0087] Specifically, the second laser groove 510 undergoes a second mechanical cut to form the second thick copper line 530 and the corresponding second precision-carved groove 520. The operation logic is the same as the first mechanical cut: first, the circuit board is flipped over (or the processing direction of the mechanical cutter is adjusted), and the position of the first posture information and the second laser groove 510 is used as a reference for precise positioning; then, a milling cutter adapted to the second laser groove 510 is selected, and the second laser groove 510 is mechanically cut according to the set cutting parameters, gradually removing the remaining copper material in the groove until the cutting depth reaches the total thickness of the second copper layer 500 (reaching the surface of the second semi-cured layer 400 below). At this time, the uncut area on the second copper layer 500 becomes the second thick copper line 530, and the second laser groove 510 forms the second precision-carved groove 520 after mechanical cutting. The second precision-carved groove 520 is used for subsequent filling with the second through-hole resin 540, and its size and specifications match the filling requirements of the second through-hole resin 540.

[0088] In some optional embodiments, the step of obtaining the first laser groove 110 by performing a first laser etching process on the first copper layer 100 according to the circuit pattern information and the first pose information includes:

[0089] S121, the first laser control map is obtained based on the line graphic information and the laser path generation algorithm;

[0090] Specifically, based on the circuit pattern information (including the parameters of the first thick copper line 130 and the corresponding etching requirements) and the laser path generation algorithm, the first laser control pattern is calculated. The first laser control pattern contains control parameters such as the basic path of laser etching, power distribution, and scanning speed, and is the initial operating data of the laser etching component.

[0091] S122, Obtain the first thickness information of the first copper layer 100;

[0092] Specifically, the first thickness information of the first copper layer 100 is obtained, that is, the actual thickness data of the first copper layer 100. The first thickness information can be obtained by visual inspection device or laser inspection device (such as laser thickness gauge), or by storing preset data (such as storing circuit board model and corresponding thickness data in advance, and obtaining the corresponding first thickness information by obtaining circuit board model).

[0093] S123, determine a first correction pattern based on the first pose information, the first thickness information and the first line etching area, wherein the first line etching area represents the area where laser etching is performed on the first copper layer 100.

[0094] Specifically, the first pose information refers to the actual pose of the circuit board on the processing table. This first pose information allows for the calculation of the deviation between the circuit pattern design coordinates and the actual position of the circuit board, providing data for path offset correction. Based on the difference between the actual thickness and the designed thickness indicated by the first thickness information, the compensation amount for laser power or the number of scans is calculated (e.g., increasing power by 5% or adding one scan when the thickness increases), ensuring the etching depth matches the actual copper layer. The first circuit etching area refers to the specific area on the first copper layer 100 that needs to be etched (defined by the circuit pattern information). Combining the circuit density within the area (e.g., reducing the scanning speed in dense areas to ensure edge accuracy), corner distribution, and other characteristics, local parameter adjustment rules are determined (e.g., reducing power by 10% in dense corner areas). By fusing the first pose information, the first thickness information, and the correction information corresponding to the first circuit etching area, a first correction map is finally generated. The first correction map includes specific path offset compensation values, power adjustment coefficients, speed correction ratios, and other correction parameters.

[0095] S124, the first laser control spectrum is obtained by correcting the first laser control spectrum according to the first correction spectrum;

[0096] Specifically, each correction parameter in the first correction map (such as path offset of 0.02mm, power increase of 5%, and corner speed reduction of 30%) is applied to the first laser control map; coordinate offset correction is performed on the basic scanning trajectory to ensure that the path is aligned with the actual position of the circuit board; the value of laser power or the number of scans is adjusted according to the thickness deviation to ensure that the etching depth meets the requirements; and local fine-tuning of the scanning speed and power of different sub-regions is performed according to the characteristics of the first line etching area (such as reducing the speed in the dense area from 500mm / s to 350mm / s).

[0097] S125, the laser etching component is controlled to perform the first laser etching process in the first line etching area according to the first laser correction control spectrum to obtain the first laser groove 110.

[0098] Specifically, the laser etching assembly (including a laser, scanning galvanometer, focusing lens, etc.) receives control commands corresponding to the first laser correction control pattern and performs precise etching within the first line etching area according to the corrected scanning trajectory, power, speed, and other parameters: the laser beam is focused on the surface of the first copper layer 100, melting and removing the copper material in the designated area through high temperature. During the etching process, the laser responds in real time to changes in parameters in the pattern (such as automatically reducing speed and adjusting power when reaching a corner) to ensure smooth groove edges and uniform depth (deviation ≤ 0.01 mm). Finally, a first laser groove 110 is formed on the first copper layer 100, with a height consistent with the designed contour and a depth adapted to the copper layer thickness, providing a precise guide groove for subsequent mechanical cutting.

[0099] In some optional embodiments, the process of obtaining the second laser groove 510 after performing a second laser etching process on the second copper layer 500 includes:

[0100] S126, after swapping the poses of the first copper layer 100 and the second copper layer 500, the second pose information of the circuit board to be processed is obtained.

[0101] Specifically, since the second copper layer 500 and the first copper layer 100 are located on opposite sides of the circuit board, the circuit board is first flipped using an automated flipping device so that the second copper layer 500 faces upwards and is then re-fixed on the processing table. Subsequently, using the same vision positioning system as that used to acquire the first pose information, the offset of the circuit board on the X and Y axes and the rotation angle around the Z axis after flipping are detected to generate the second pose information.

[0102] S127, A second laser control map is obtained based on the line graphic information and the laser path generation algorithm;

[0103] Specifically, parameters related to the second thick copper line 530 (including line outline, spacing, corners, etc., which must maintain interlayer correspondence with the first thick copper line 130) are extracted from the line graphic information and input into the same laser path generation model. Based on the line characteristics of the second copper layer 500, the laser path generation model calculates the basic path of laser etching (which is consistent with the path of the first laser control pattern in vertical projection), the initial power distribution (such as the reference values ​​of power for straight segments and power at corners), and the scanning speed reference. Finally, these are integrated to form the second laser control pattern, ensuring its interlayer path symmetry with the first laser control pattern.

[0104] S128, Obtain the second thickness information of the second copper layer 500;

[0105] Specifically, using the same high-precision thickness measuring instrument (such as a laser thickness gauge) as the one used to measure the first thickness information, multiple measurement points (covering the edge and center) are selected within the second line etching area to measure the actual thickness value and calculate the average value.

[0106] S129, a second correction pattern is determined based on the second pose information, the second thickness information, and the second line etching region, wherein the second line etching region represents the area where laser etching is performed on the second copper layer 500.

[0107] Specifically, a coordinate transformation algorithm is used to convert the positional deviation after flipping into a path compensation amount, ensuring that the etching path is aligned with the actual position of the second line etching area. Based on the difference between the actual thickness indicated by the second thickness information and the designed thickness, a compensation coefficient for laser power or number of scans is calculated. According to the characteristics of the second line etching area (such as line density and corner distribution, which must correspond to the first line etching area), for high-density areas or complex corners, a local speed reduction ratio or power fine-tuning value is calculated. Multiple parameter adjustment data are then fused to generate a second correction map that includes path correction, energy compensation, and local parameter adjustments.

[0108] S1210, after correcting the second laser control spectrum according to the second correction spectrum, a second laser correction control spectrum is obtained;

[0109] Specifically, the parameters in the second corrected control map are applied to the second laser control map: coordinate offset and rotation corrections are performed on the base path to eliminate the influence of pose deviations; laser power or number of scans is adjusted according to the second thickness information to ensure that the etching depth matches the actual copper layer; and the scanning speed and power of different sub-regions are locally optimized based on the characteristics of the second line etching area. The corrected second laser correction control map must maintain a precise correspondence with the first laser correction control map on the interlayer path.

[0110] S1211, according to the second laser correction control spectrum, the laser etching component is controlled to perform the second laser etching process in the second line etching area to obtain the second laser groove 510.

[0111] Specifically, the laser etching component performs etching within the second line etching area according to the control commands of the second laser correction control spectrum: the laser beam is focused on the surface of the second copper layer 500, removing copper material according to the corrected path, power, and speed. During the process, it responds in real time to parameter changes in corner and dense areas (such as speed reduction and power adjustment) to ensure smooth groove edges and uniform depth. The final formed second laser groove 510 is symmetrical in position and size with the first laser groove 110, providing precise guidance for subsequent second mechanical cutting, while also meeting the correspondence requirements of the two-layer precision-carved groove.

[0112] In some optional embodiments, obtaining the first thick copper line 130 after performing a first mechanical cut on the first laser groove 110 includes:

[0113] S131, Obtain the first shape information of the first laser groove 110;

[0114] Specifically, the first laser groove 110 is scanned in its entirety using a high-precision optical scanning device (such as a 3D laser profilometer) to extract its geometric feature data, including the width variation of the groove (e.g., the width of a straight segment is 0.2 mm, and the width at the corner is 0.22 mm), the corner angle (e.g., 90° or the radius of the rounded corner), the edge flatness (e.g., whether there are local protrusions or depressions), and the trajectory of the groove (e.g., the specific coordinates of the straight segment and the arc segment), to form the first shape information.

[0115] S132, a first stress bearing map is determined based on the first shape information and the stress analysis model. The first stress bearing map is used to indicate the stress bearing value corresponding to each part of the first laser groove 110.

[0116] Specifically, the stress analysis model simulates the stress distribution patterns at different parts of the groove during mechanical cutting. For example, the right-angle corners of the groove are prone to stress concentration due to abrupt structural changes (resistance values ​​are lower, such as ≤50MPa), while the middle of the straight section can withstand higher stresses due to its uniform structure (such as ≤100MPa). If there are protrusions at the edge of the groove, the stress resistance value at the root of the protrusion will be significantly reduced (such as ≤30MPa). The stress analysis model, combined with the geometric parameters of each part in the first shape information, calculates the maximum stress resistance value at each location, ultimately forming a first stress resistance map, which visually indicates the stress tolerance capacity of each part of the groove.

[0117] S133, after determining the cutting positions where the stresses cancel each other out during cutting based on the first shape information and the cutting stress generation law, the first cutting stress symmetry table is obtained.

[0118] Specifically, the stress generation law of cutting indicates that during mechanical cutting, the cutting tool will generate symmetrical or asymmetrical cutting stress on both sides of the groove (e.g., cutting a straight segment generates bidirectional symmetrical stress, while corners generate unidirectional concentrated stress). By analyzing the symmetrical structure of the groove in the first shape information (e.g., whether there are axially symmetrical or centrally symmetrical regions), cutting positions where the stresses can cancel each other out can be found: for example, for a straight segment groove, symmetrical points on both sides with the centerline as the axis of symmetry are selected as the starting points for cutting, and the cutting stresses generated on both sides are symmetrically canceled out along the centerline; for an arc-shaped groove, two positions symmetrical about the central angle are selected for simultaneous cutting, and the symmetry of the radial stress is used to cancel out part of the stress. These symmetrical cutting positions and corresponding stress cancellation methods are compiled into a first cutting stress symmetry table to reduce overall stress accumulation.

[0119] S134, determine the first target cutting sequence table according to the first stress bearing spectrum and the first cutting stress symmetry table, the first target cutting sequence table indicates the cutting sequence of each cutting area on the first laser groove 110;

[0120] Specifically, areas with high stress tolerance that can be offset by symmetrical cutting (such as the middle of a straight segment) should be prioritized for cutting to avoid impacting low-stress areas (such as corners and protruding edges) during the initial cutting. Low-stress areas should be cut later, using a symmetrical cutting method (such as cutting symmetrically twice on both sides of a corner) to reduce local stress. Simultaneously, the order of adjacent cutting areas should avoid stress superposition (e.g., cutting area A first, waiting for its stress to be released, and then cutting the adjacent area B), ultimately forming a first target cutting sequence table with a clear order for each cutting area.

[0121] S135, obtain the first depth of the first laser groove 110;

[0122] Specifically, the depth is measured at multiple points within the groove using a depth measuring instrument (such as a contact thickness gauge), and the average value is taken as the first depth.

[0123] S136, determine the first cutting depth based on the first depth and the first thickness information;

[0124] Specifically, the first cutting depth is the total thickness of the first copper layer 100 (first thickness information) minus the first depth of the first laser groove 110, which is the remaining copper layer thickness that needs to be removed by mechanical cutting.

[0125] S137, according to the first target cutting sequence table, the cutting components are sequentially controlled to cut to the first cutting depth in each cutting area of ​​the first laser groove 110 to obtain the first thick copper line 130.

[0126] Specifically, the cutting components (such as CNC milling cutters) cut each area sequentially according to a sequence list: first, high-stress areas are cut in a set order using a symmetrical cutting method (such as simultaneous feeding on both sides of a straight section), with a cutting depth of 0.1mm per layer; when cutting to low-stress areas (such as corners), the feed speed is reduced, and multiple cuts are performed in a symmetrical order to ensure timely stress release after each layer is cut. Finally, after mechanical cutting, the uncut copper layer of the first laser groove 110 forms the first thick copper line 130, the cut area forms the first precision-engraved groove 120, and the edges of the line are free from stress damage (such as cracking or deformation).

[0127] In some optional embodiments, obtaining the second thick copper line 530 by performing a second mechanical cut on the second laser groove 510 includes:

[0128] S141, Obtain the second shape information of the second laser groove 510;

[0129] Specifically, the second laser groove 510 is scanned in its entirety using a 3D laser profilometer to extract its geometric features, including the width distribution of the groove (such as the width difference between straight segments and corners), the corner curvature (corresponding to the corner radius of the first laser groove 110), the edge smoothness, and the overall trajectory, thus forming the second shape information.

[0130] S142, a second stress bearing spectrum is determined based on the second shape information, the first thick copper line 130 and the stress analysis model. The second stress bearing spectrum is used to indicate the stress bearing value corresponding to each part of the second laser groove 510.

[0131] Specifically, in addition to relying on the second shape information (such as corners, protruding edges, and other areas prone to stress concentration), the stress analysis model also needs to incorporate the structural parameters of the first thick copper line 130 (such as the width, spacing, and location of stress-weak areas of the first line). For example, if there is residual stress in a certain area of ​​the first thick copper line 130 due to cutting (such as at a corner), the stress tolerance value of the corresponding vertical projection area of ​​the second laser groove 510 needs to be lowered (to avoid damage to the core layer 300 caused by the superposition of stresses from the two layers). For structurally stable areas such as straight sections, the stress tolerance value can be kept consistent with the first stress tolerance map. The final second stress tolerance map marks the maximum stress tolerance value of each part of the second laser groove 510 and complements the stress state of the first thick copper line 130.

[0132] S143, based on the second shape information, the first thick copper line 130 and the cutting stress generation law, the cutting position where the stresses cancel each other out during cutting is determined, and the second cutting stress symmetry table is obtained.

[0133] Specifically, based on the analysis of the symmetrical structure of the second laser groove 510 (such as the axisymmetric region), and combined with the cutting stress distribution of the first thick copper line 130 (such as the stress cancellation position during the cutting of the first line), symmetrical cutting points that can balance the stress of the two layers are selected. For example, if the straight segment of the first thick copper line 130 uses "centerline symmetrical cutting" to cancel the stress, then the corresponding straight segment of the second laser groove 510 also selects a symmetrical cutting position with the same centerline as the axis of symmetry, so that the cutting stress of the two layers is symmetrically distributed along the core board layer 300 and cancels each other out. For the corner area, referring to the cutting stress direction of the corner of the first thick copper line 130, a mirror-distributed cutting point is selected at the corner of the second laser groove 510 to avoid unidirectional stress concentration being transmitted to the core board. These symmetrical positions and stress cancellation logic are organized into a second cutting stress symmetry table to ensure stress coordination between the two layers of cutting.

[0134] S144, determine the second target cutting sequence table according to the second stress bearing spectrum and the second cutting stress symmetry table, the second target cutting sequence table indicates the cutting sequence of each cutting area on the second laser groove 510;

[0135] Specifically, priority is given to cutting the areas in the second laser groove 510 with high stress tolerance that correspond to the areas already cut in the first thick copper line 130 (e.g., the area corresponding to the straight section of the first line that has been cut). The stress release state of the first line is used to assist in the stress dispersion of the second line. For the second groove area corresponding to the stress-weak area of ​​the first thick copper line 130 (e.g., corner), it is cut later, and a more refined symmetrical cutting step is adopted (e.g., cutting in 3 progressive steps, with the feed amount reduced to 0.05mm each time). At the same time, it is ensured that the order of adjacent cutting areas is "mirror-synchronized" with the first target cutting sequence table (e.g., the first line is cut on the left side first and then on the right side, while the second line is cut on the right side first and then on the left side) to avoid interlayer stress direction conflicts. The final second target cutting sequence table is formed.

[0136] S145, obtain the second depth of the second laser groove 510;

[0137] Specifically, similar to the depth measurement of the first laser groove 110, the depth is measured at multiple points within the groove using a contact thickness gauge, and the average value is taken as the second depth.

[0138] S146, determine the second cutting depth based on the second depth and the second thickness information;

[0139] Specifically, the second cutting depth is the total thickness of the second copper layer 500 minus the second depth of the second laser groove 510.

[0140] S147, according to the second target cutting sequence table, the cutting component is controlled to cut to the second cutting depth in each cutting area of ​​the second laser groove 510 to obtain the second thick copper line 530.

[0141] Specifically, the control cutting assembly cuts each area sequentially according to a sequence list. For the high-stress area corresponding to the first thick copper line 130, a cutting path symmetrical to the first mechanical cutting is adopted; when cutting to the area corresponding to the stress-weak area of ​​the first line, the feed speed is reduced, and cutting is performed in a symmetrical sequence. Finally, after mechanical cutting, the uncut copper layer of the second laser groove 510 forms the second thick copper line 530 corresponding to the first thick copper line 130 layer, and the cut area forms the second precision groove 520.

[0142] In some optional embodiments, after the first copper layer 100 and the second copper layer 500 of the circuit board to be processed are precision etched to obtain the first thick copper line 130 and the second thick copper line 530, the process further includes:

[0143] S150, acquire copper layer information and prepreg information, wherein the copper layer information represents the material information of the first engraving groove 120 and the second engraving groove 520, and the prepreg information represents the material information of the first prepreg layer 200 and the second prepreg layer 400.

[0144] Specifically, the copper layer information refers to the material characteristics of the sidewalls of the first engraving tank 120 and the second engraving tank 520 (such as the purity of the copper layer, whether it contains a plating layer, etc.). Different material information directly affects the corrosion effect of the roughening liquid on the sidewalls of the tank. The semi-cured sheet information refers to the material (such as the type of resin, glass fiber content) and surface characteristics of the first semi-cured layer 200 and the second semi-cured layer 400.

[0145] S151, Obtain roughening liquid information, wherein the roughening liquid information represents the concentration information, composition information and temperature information of the roughening liquid;

[0146] Specifically, the roughening fluid information includes the concentration, composition, and operating temperature of the roughening fluid, which are set according to specific process requirements and are not limited here.

[0147] S152, a first roughening curve of the first fine carving groove 120 and a second roughening curve of the second fine carving groove 520 are generated according to the roughening liquid information and the copper layer information. The first roughening curve characterizes the relationship between the sidewall roughness of the first fine carving groove 120 and the time, and the second roughening curve characterizes the relationship between the sidewall roughness of the second fine carving groove 520 and the time.

[0148] Specifically, based on the roughening solution information and copper layer information, the roughening patterns of the sidewalls of the first engraving tank 120 and the second engraving tank 520 are calculated through experiments or simulation models. The first roughening curve, with time as the horizontal axis and the sidewall roughness of the first engraving tank 120 as the vertical axis, visually presents the sidewall roughness at different time points. The slope of the curve is determined by the reactivity of the copper layer material with the roughening solution (e.g., the curve slope of a high-purity copper layer is greater than that of a copper layer containing impurities). Similarly, the second roughening curve corresponds to the sidewall of the second engraving tank 520. The curve parameters need to be adjusted according to the material differences of the second copper layer 500 to ensure that the sidewall roughness meets the resin bonding strength requirements.

[0149] S153, generate a third roughening curve for the first fine carving groove 120 and a fourth roughening curve for the second fine carving groove 520 based on the roughening liquid information and the semi-cured sheet information. The third roughening curve characterizes the relationship between the bottom roughness of the first fine carving groove 120 and time, and the fourth roughening curve characterizes the relationship between the bottom roughness of the second fine carving groove 520 and time.

[0150] Specifically, combining the information from the roughening liquid and the semi-cured sheet, the roughening patterns of the bottom of the first engraving tank 120 and the second engraving tank 520 are constructed respectively: the third roughening curve has time as the horizontal axis and the roughness of the bottom of the first engraving tank 120 (that is, the upper surface of the first semi-cured layer 200) as the vertical axis. Since the semi-cured layer material (such as epoxy resin) has stronger corrosion resistance to the roughening liquid than the copper layer, its curve slope is smaller than that of the first roughening curve; the fourth roughening curve corresponds to the bottom of the second engraving tank 520. The curve is adjusted according to the material characteristics of the second semi-cured layer 400 to ensure that the bottom roughness can enhance the resin bonding force without destroying the structural integrity of the semi-cured layer.

[0151] S154, the first fine carving groove 120 is roughened according to the first roughening curve and the third roughening curve, and the second fine carving groove 520 is roughened according to the second roughening curve and the fourth roughening curve, wherein the first fine carving groove 120 has a first roughness and the second fine carving groove 520 has a second roughness.

[0152] Specifically, when roughening the first engraving tank 120, the optimal roughening time is determined by referring to both the first and third roughening curves: roughening is stopped when the sidewall roughness reaches the target value and the bottom roughness simultaneously meets the standard, ultimately resulting in a uniform first roughness in the first engraving tank 120. For the second engraving tank 520, the roughening process is controlled according to the synergistic requirements of the second and fourth roughening curves to ensure that the sidewall and bottom roughness are matched, forming a second roughness that meets the standard. During the roughening process, the parameters of the roughening fluid are monitored in real time, and the parameters are maintained stable by replenishing the fluid or temperature control to ensure the accuracy of the roughening curve.

[0153] In some optional embodiments, the step of roughening the first engraving groove 120 according to the first roughening curve and the third roughening curve, and roughening the second engraving groove 520 according to the second roughening curve and the fourth roughening curve, includes:

[0154] S1541, obtain the first roughening weight of the sidewall of the first fine carving groove 120 and the second roughening weight of the sidewall of the second fine carving groove 520;

[0155] S1542, obtain the third coarsening weight of the bottom of the first fine carving groove 120 and the fourth coarsening weight of the bottom of the second fine carving groove 520;

[0156] Specifically, based on the influence weight of different parts of the engraving groove on the bonding force, corresponding roughening weights are assigned: For the sidewall of the first engraving groove 120, a first roughening weight is determined based on its contact area with the filling resin and the mechanical bonding requirements (e.g., 0.6, where a higher value indicates a greater impact of the roughness of that part on the overall bonding force); similarly, a second roughening weight is determined by considering the structural characteristics of the sidewall of the second engraving groove 520 (e.g., whether it is a groove next to a high-frequency signal line). For the bottom, considering the connection strength requirements between the first semi-cured layer 200 at the bottom of the first engraving groove 120 and the resin, a third roughening weight is assigned; and a fourth roughening weight is determined based on the material difference of the semi-cured layer at the bottom of the second engraving groove 520.

[0157] S1543, multiply the roughness at each time point on the first coarsening curve by the first coarsening weight to obtain the first weighted coarsening curve, and multiply the roughness at each time point on the second coarsening curve by the second coarsening weight to obtain the second weighted coarsening curve.

[0158] S1544, the roughness at each time point on the third coarsening curve is multiplied by the third coarsening weight to obtain the third weight coarsening curve, and the roughness at each time point on the fourth coarsening curve is multiplied by the fourth coarsening weight to obtain the fourth weight coarsening curve.

[0159] Specifically, the roughness value at each time point on the first roughening curve (sidewall roughness changing with time) is multiplied by the first roughening weight to obtain the first weighted roughening curve, which reflects the weighted contribution of sidewall roughness to the overall roughening effect. Similarly, the second roughening curve is multiplied by the second roughening weight to obtain the second weighted roughening curve; the third roughening curve (bottom roughness) is multiplied by the third roughening weight to obtain the third weighted roughening curve; and the fourth roughening curve is multiplied by the fourth roughening weight to obtain the fourth weighted roughening curve.

[0160] S1545, the first weight coarsening curve and the third weight coarsening curve are superimposed to obtain the first comprehensive coarsening curve, and the second weight coarsening curve and the fourth weight coarsening curve are superimposed to obtain the second comprehensive coarsening curve.

[0161] Specifically, the first weighted roughening curve and the third weighted roughening curve are superimposed on the same time axis. The superimposed value at each time point is the sum of the sidewall weighted roughness and the bottom weighted roughness, forming the first comprehensive roughening curve. The first comprehensive roughening curve reflects the overall roughening effect of the first engraving groove 120 at different time points (taking into account the weighted contributions of the sidewalls and the bottom). Similarly, the second weighted roughening curve and the fourth weighted roughening curve are superimposed to obtain the second comprehensive roughening curve, which is used to evaluate the overall roughening effect of the second engraving groove 520.

[0162] S1546, determine the first roughening time based on the first roughness and the first comprehensive roughening curve, and determine the second roughening time based on the second roughness and the second comprehensive roughening curve;

[0163] Specifically, the time point corresponding to the first roughness (the preset target overall roughness value) is found in the first comprehensive roughening curve; this time point is the first roughening time. For the second engraving groove 520, the time point matching the second roughness is found in the second comprehensive roughening curve and determined as the second roughening time.

[0164] S1547, the first fine carving tank 120 is roughened by roughening liquid during the first roughening time, and the second fine carving tank 520 is roughened by roughening liquid during the second roughening time.

[0165] Specifically, the circuit board to be processed is placed in a processing tank containing a roughening solution, or the roughening solution is precisely sprayed into the first fine-carving tank 120 area and the second fine-carving tank 520 area via a spray system. For the first fine-carving tank 120, the roughening time is controlled to the first roughening time, during which the concentration, temperature, and other parameters of the roughening solution are kept stable. For the second fine-carving tank 520, roughening is carried out according to the second roughening time. If both fine-carving tanks need to be processed simultaneously, synchronous roughening can be achieved by adjusting the local roughening solution flow rate (e.g., increasing the flow rate in the second fine-carving tank 520 area to accelerate the reaction). After roughening, the first fine-carving tank 120 and the second fine-carving tank 520 respectively form surface states that meet the first roughness and the second roughness, thereby ensuring that the bonding force between the filling resin and the fine-carving tank meets the requirements.

[0166] S200, after resin filling treatment between the first thick copper line 130 and the second thick copper line 530, a first circuit board is obtained. The first filling resin 140 between the first thick copper line 130 has a first groove after cooling, and the second filling resin 540 between the second thick copper line 530 has a second groove after cooling. The depth of the first groove is less than or equal to the first thickness difference between the first filling resin 140 and the first thick copper line 130, and the depth of the second groove is less than or equal to the second thickness difference between the second filling resin 540 and the second thick copper line 530.

[0167] Specifically, the first engraving groove 120 between the first thick copper lines 130 is filled with a first filling resin 140, and the second engraving groove 520 between the second thick copper lines 530 is filled with a second filling resin 540. After filling, the resin undergoes a cooling and curing process. Due to the shrinkage characteristics of the resin during curing, the first filling resin 140 will form a first groove on the surface after cooling, and the second filling resin 540 will form a second groove on the surface after cooling.

[0168] The depth of the first groove must be strictly controlled within a specific range: the depth of the first groove is less than or equal to the first thickness difference between the first via-filling resin 140 and the first thick copper line 130 (i.e., the difference between the overall thickness of the cured first via-filling resin 140 and the thickness of the first thick copper line 130). Similarly, the depth of the second groove must also be less than or equal to the second thickness difference between the second via-filling resin 540 and the second thick copper line 530 (i.e., the difference between the overall thickness of the cured second via-filling resin 540 and the thickness of the second thick copper line 530); this ensures that the grooves do not affect the surface flatness of the circuit board and subsequent processing: if the groove depth exceeds the corresponding thickness difference, the surface of the first via-filling resin 140 will be lower than the surface of the first thick copper line 130, and the surface of the second via-filling resin 540 will be lower than the surface of the second thick copper line 530, resulting in poor contact or structural defects in subsequent processes (such as surface treatment and component soldering). By limiting the groove depth, a smooth transition surface between the via-filling resin and the thick copper line can be ensured, meeting the structural and performance requirements of the first circuit board.

[0169] S300, the first hole-filling resin 140 and the second hole-filling resin 540 are polished to obtain the third circuit board.

[0170] Specifically, the first groove of the first through-hole filling resin 140 and the second groove of the second through-hole filling resin 540 are first ground to remove most of the depressions and edge protrusions. During this process, the surface of the thick copper circuit should be used as a reference to avoid excessive grinding and damage to the copper layer. After rough grinding, the process is switched to fine grinding to further eliminate rough grinding marks and reduce the surface height difference between the resin and the copper circuit. Then, the ground resin and copper circuit surfaces are mirror polished to reduce the overall surface roughness, resulting in the third circuit board.

[0171] In some optional embodiments, the process of polishing the first through-filling resin 140 and the second through-filling resin 540 to obtain the third circuit board includes:

[0172] S310, the first filling resin 140 and the second filling resin 540 are respectively ceramic polished to obtain the first polishing resin and the second polishing resin. The first polishing resin is at the same level as the bottom of the first groove, and the second polishing resin is at the same level as the bottom of the second groove.

[0173] Specifically, the first pore-filling resin 140 and the second pore-filling resin 540 are respectively subjected to ceramic polishing to obtain the first polishing resin and the second polishing resin. High-hardness ceramic abrasive blocks are used for ceramic polishing, and a relatively low polishing pressure (0.1-0.2 MPa) is applied to the resin surface. For the first pore-filling resin 140, the focus is on polishing the first groove area formed after cooling. Excess resin above the groove is removed through the grinding action of the abrasive blocks until the surface of the first polished resin is at the same level as the bottom of the first groove, eliminating the raised edges and most of the depression height of the groove. For the second pore-filling resin 540, the same ceramic polishing parameters and logic are used to polish it until the surface of the second polished resin is at the same level as the bottom of the second groove.

[0174] S320, after the first polishing resin and the second polishing resin are polished with non-woven fabric respectively, a third polishing resin 150 and a fourth polishing resin 550 are obtained. The third polishing resin 150 is at the same level as the top of the first thick copper line 130, and the fourth polishing resin 550 is at the same level as the top of the second thick copper line 530.

[0175] Specifically, the first and second polishing resins are polished with non-woven fabric to obtain the third polishing resin 150 and the fourth polishing resin 550. For non-woven fabric polishing, elastic non-woven fabric abrasive pads (such as nylon non-woven fabric abrasive pads) are used, and the polishing pressure is reduced to 0.05-0.1 MPa to treat the resin surface with a gentler grinding method: For the first polishing resin, starting from the surface flush with the bottom of the first groove, polishing is gradually performed until the resin surface is at the same level as the top of the first thick copper line 130. During this process, the top of the first thick copper line 130 is used as a reference for real-time calibration to avoid over-polishing and damaging the copper layer; For the second polishing resin, similarly using the top of the second thick copper line 530 as a reference, non-woven fabric polishing is used to bring its surface to the same level as the top of the second thick copper line 530. At this point, the resin and the thick copper line have initially formed a flush surface.

[0176] S330, the third circuit board is obtained by polishing the third polishing resin 150 and the fourth polishing resin 550 respectively.

[0177] Specifically, the polishing stage uses a polishing wheel and a special polishing fluid for mirror polishing. For the third polishing resin 150, the high-speed rotation of the polishing wheel and the chemical abrasive action of the polishing fluid further reduce the surface roughness of the resin and eliminate the fine traces left by the non-woven fabric polishing. For the fourth polishing resin 550, the same polishing parameters are used to process it, so that the third polishing resin 150 and the fourth polishing resin 550 form a continuous, flat and uniform surface with the corresponding thick copper lines, thus obtaining the third circuit board.

[0178] S400, the target circuit board is obtained after the third circuit board is subjected to circuit forming process.

[0179] Specifically, the circuit forming process includes drilling electroplated through holes, electroplating copper onto the through holes, circuit testing, edge forming, final inspection, and packaging and warehousing, in order to obtain the desired target circuit board.

[0180] Implementing the embodiments of the present invention has the following beneficial effects: The embodiments of the present invention provide a method for producing thick copper lines on a circuit board, comprising: performing precision engraving on a first copper layer 100 and a second copper layer 500 of the circuit board to be processed to obtain a first thick copper line 130 and a second thick copper line 530, wherein the first thick copper line 130 is located on the first copper layer 100, and the second thick copper line 530 is located on the second copper layer 500, wherein a first semi-cured layer 200, a core board layer 300, and a second semi-cured layer 400 are sequentially disposed between the first copper layer 100 and the second copper layer 500, wherein the first copper layer 100, the second copper layer 500, and the core board layer 300 have the same thickness; the first thick copper line 130 and the second thick copper line 530 are respectively disposed on the first thick copper line 130 and the second thick copper line 530. After resin filling between the lines 530, a first circuit board is obtained. The first via-filling resin 140 between the first thick copper lines 130 has a first groove after cooling, and the second via-filling resin 540 between the second thick copper lines 530 has a second groove after cooling. The depth of the first groove is less than or equal to the first thickness difference between the first via-filling resin 140 and the first thick copper line 130, and the depth of the second groove is less than or equal to the second thickness difference between the second via-filling resin 540 and the second thick copper line 530. After grinding and polishing the first and second via-filling resins 140 and 540, a third circuit board is obtained. After circuit forming processing on the third circuit board, the target circuit board is obtained. By precision carving the first copper layer 100 and the second copper layer 500, the thick copper lines can be formed quickly, resulting in high production efficiency. By filling the thick copper lines with resin, the flatness of the thick copper lines is ensured, and the resin isolation reduces interference between the thick copper lines, improving the quality of the thick copper lines and thus improving the production quality of the circuit board.

[0181] Secondly, embodiments of the present invention also provide a circuit board, which is manufactured by the aforementioned method for producing thick copper lines for circuit boards.

[0182] It is evident that the content of the above method embodiments is applicable to this circuit board embodiment. The specific functions implemented in this circuit board embodiment are the same as those in the above method embodiments, and the beneficial effects achieved are also the same as those achieved in the above method embodiments.

[0183] On the other hand, embodiments of the present invention also propose an electronic device, including: a memory for storing program instructions; and a processor for calling the program instructions stored in the memory and executing the aforementioned method for producing thick copper circuit boards according to the obtained program instructions. The processor can be implemented using a general-purpose central processing unit (CPU), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application. The memory can be implemented using read-only memory (ROM), static storage devices, dynamic storage devices, or random access memory (RAM). The memory can store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory and called by the processor to execute the method for producing thick copper circuit boards in the embodiments of this application. The memory and the processor can be connected via a bus or similar means.

[0184] On the other hand, embodiments of the present invention also provide a storage medium, which is a computer-readable storage medium storing a computer program that, when executed by a processor, implements the aforementioned method for producing thick copper traces on a circuit board. The memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, the memory may include high-speed random access memory and non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory includes memories remotely located relative to the processor, which can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof. The apparatus embodiments described above are merely illustrative; the units described as separate components may or may not be physically separate, and may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0185] In some alternative embodiments, the functions / operations mentioned in the block diagrams may not occur in the order shown in the operation diagrams. For example, depending on the functions / operations involved, two consecutively shown blocks may actually be executed substantially simultaneously, or the blocks may sometimes be executed in reverse order. Furthermore, the embodiments presented and described in the flowcharts of this application are provided by way of example to provide a more comprehensive understanding of the technology. The disclosed methods are not limited to the operations and logic flows presented herein. Alternative embodiments are contemplated in which the order of various operations is changed and sub-operations described as part of a larger operation are executed independently.

[0186] Furthermore, although this application is described in the context of functional modules, it should be understood that, unless otherwise stated to the contrary, one or more of the functions and / or features may be integrated into a single physical device and / or software module, or one or more functions and / or features may be implemented in a separate physical device or software module. It is also understood that a detailed discussion of the actual implementation of each module is unnecessary for understanding this application. Rather, given the properties, functions, and internal relationships of the various functional modules in the apparatus disclosed herein, the actual implementation of the module will be understood within the scope of conventional technology for an engineer. Therefore, those skilled in the art can implement the application set forth in the claims using ordinary techniques without excessive experimentation. It is also understood that the specific concepts disclosed are merely illustrative and not intended to limit the scope of this application, which is determined by the full scope of the appended claims and their equivalents.

[0187] In the foregoing description of this specification, the references to terms such as "one embodiment," "another embodiment," or "some embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0188] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

[0189] The above is a detailed description of the preferred embodiments of this application, but this application is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this application, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A method of producing thick copper wiring of a circuit board, characterized by, The method comprises the following steps: After performing fine carving processing on the first copper layer and the second copper layer of a to-be-processed circuit board, first thick copper lines and second thick copper lines are obtained, the first thick copper lines are located on the first copper layer, the second thick copper lines are located on the second copper layer, a first prepreg layer, a core layer and a second prepreg layer are sequentially arranged between the first copper layer and the second copper layer, and the first copper layer, the second copper layer and the core layer have the same thickness; After performing resin filling processing between the first thick copper lines and the second thick copper lines, a first circuit board is obtained, a first filling hole resin between the first thick copper lines has a first groove after cooling, a second filling hole resin between the second thick copper lines has a second groove after cooling, a depth of the first groove is less than or equal to a first thickness difference between the first filling hole resin and the first thick copper line, and a depth of the second groove is less than or equal to a second thickness difference between the second filling hole resin and the second thick copper line; After performing polishing processing on the first filling hole resin and the second filling hole resin, a third circuit board is obtained; After performing line forming processing on the third circuit board, a target circuit board is obtained; The method comprises the following steps: Obtaining line pattern information and first pose information, the line pattern information represents line parameters of the first thick copper lines and the second thick copper lines, and the first pose information indicates pose information of the to-be-processed circuit board; After performing first laser etching processing on the first copper layer according to the line pattern information and the first pose information, first laser grooves are obtained, and after performing second laser etching processing on the second copper layer, second laser grooves are obtained; After performing first mechanical cutting on the first laser grooves, the first thick copper lines are obtained, the first laser grooves obtain first fine carving grooves after the first mechanical cutting, and the first fine carving grooves are used for filling the first filling hole resin; After performing second mechanical cutting on the second laser grooves, the second thick copper lines are obtained, the second laser grooves obtain second fine carving grooves after the second mechanical cutting, and the second fine carving grooves are used for filling the second filling hole resin, and the fine carving processing represents the first laser etching processing, the second laser etching processing, the first mechanical cutting and the second mechanical cutting.

2. The thick copper circuit production method of claim 1, wherein, The method comprises the following steps: Obtaining a first laser control map according to the line pattern information and a laser path generation algorithm; Obtaining first thickness information of the first copper layer; Determining a first correction map according to the first pose information, the first thickness information and a first line etching region, the first line etching region represents a region for performing laser etching on the first copper layer; After correcting the first laser control map according to the first correction map, a first laser correction control map is obtained. The first laser etching treatment is performed on the first circuit etching area according to the first laser control map, and the first laser groove is obtained after the first laser etching treatment.

3. The thick copper circuit production method of claim 2, wherein, The second laser etching treatment is performed on the second copper layer according to the second laser control map, and the second laser groove is obtained after the second laser etching treatment. The second pose information of the circuit board to be processed is obtained by exchanging the pose of the first copper layer and the second copper layer. The second laser control map is obtained according to the circuit pattern information and a laser path generation algorithm. Second thickness information of the second copper layer is obtained. The second correction map is determined according to the second pose information, the second thickness information and a second circuit etching area. The second laser correction control map is obtained by correcting the second laser control map according to the second correction map. The second laser etching treatment is performed on the second circuit etching area according to the second laser correction control map, and the second laser groove is obtained after the second laser etching treatment.

4. The thick copper circuit production method of claim 3, wherein The first thick copper circuit is obtained by performing the first mechanical cutting on the first laser groove. First shape information of the first laser groove is obtained. The first stress bearing map is determined according to the first shape information and a stress analysis model, and the first stress bearing map is used to indicate stress bearing values corresponding to each part of the first laser groove. The first cutting stress symmetry table is obtained by determining cutting positions at which stresses offset each other when cutting according to the first shape information and a cutting stress generation rule. The first target cutting sequence table is determined according to the first stress bearing map and the first cutting stress symmetry table, and the first target cutting sequence table indicates a cutting sequence of each cutting area on the first laser groove. First depth of the first laser groove is obtained. First cutting depth is determined according to the first depth and the first thickness information. The first thick copper circuit is obtained by controlling a cutting assembly to perform the first cutting depth of cutting on each cutting area of the first laser groove in sequence according to the first target cutting sequence table.

5. The thick copper circuit production method of claim 4, wherein, The second thick copper circuit is obtained by performing the second mechanical cutting on the second laser groove. Second shape information of the second laser groove is obtained. The second stress bearing map is determined according to the second shape information, the first thick copper circuit and a stress analysis model, and the second stress bearing map is used to indicate stress bearing values corresponding to each part of the second laser groove. The second cutting stress symmetry table is obtained by determining cutting positions at which stresses offset each other when cutting according to the second shape information, the first thick copper circuit and a cutting stress generation rule. The second target cutting sequence table is determined according to the second stress bearing map and the second cutting stress symmetry table, and the second target cutting sequence table indicates a cutting sequence of each cutting area on the second laser groove. Second depth of the second laser groove is obtained. Second cutting depth is determined according to the second depth and the second thickness information. According to the second target cutting sequence table, the cutting assembly is controlled to cut the second cutting depth in each cutting area of the second laser groove in sequence, and the second thick copper circuit is obtained.

6. The thick copper circuit production method of claim 1, wherein, After the first and second copper layers of the circuit board to be processed are subjected to the fine carving processing to obtain the first and second thick copper circuits, the method further comprises: obtaining copper layer information and prepreg information, the copper layer information representing material information of the first and second fine carving grooves, and the prepreg information representing material information of the first and second prepreg layers; obtaining roughening liquid information, the roughening liquid information representing concentration information, component information and temperature information of the roughening liquid; generating a first roughening curve of the first fine carving groove and a second roughening curve of the second fine carving groove according to the roughening liquid information and the copper layer information, the first roughening curve representing a relationship between sidewall roughness of the first fine carving groove and time, and the second roughening curve representing a relationship between sidewall roughness of the second fine carving groove and time; generating a third roughening curve of the first fine carving groove and a fourth roughening curve of the second fine carving groove according to the roughening liquid information and the prepreg information, the third roughening curve representing a relationship between bottom roughness of the first fine carving groove and time, and the fourth roughening curve representing a relationship between bottom roughness of the second fine carving groove and time; roughening the first fine carving groove according to the first roughening curve and the third roughening curve, and roughening the second fine carving groove according to the second roughening curve and the fourth roughening curve, the first fine carving groove having a first roughness, and the second fine carving groove having a second roughness.

7. The thick copper circuit production method of claim 6, wherein, The roughening the first fine carving groove according to the first roughening curve and the third roughening curve, and roughening the second fine carving groove according to the second roughening curve and the fourth roughening curve comprises: obtaining a first roughening weight value of the sidewall of the first fine carving groove and a second roughening weight value of the sidewall of the second fine carving groove; obtaining a third roughening weight value of the bottom of the first fine carving groove and a fourth roughening weight value of the bottom of the second fine carving groove; multiplying the roughness at each time point on the first roughening curve by the first roughening weight value to obtain a first weight roughening curve, and multiplying the roughness at each time point on the second roughening curve by the second roughening weight value to obtain a second weight roughening curve; multiplying the roughness at each time point on the third roughening curve by the third roughening weight value to obtain a third weight roughening curve, and multiplying the roughness at each time point on the fourth roughening curve by the fourth roughening weight value to obtain a fourth weight roughening curve; superimposing the first weight roughening curve and the third weight roughening curve to obtain a first comprehensive roughening curve, and superimposing the second weight roughening curve and the fourth weight roughening curve to obtain a second comprehensive roughening curve; determining a first roughening time according to the first roughness and the first comprehensive roughening curve, and determining a second roughening time according to the second roughness and the second comprehensive roughening curve; The first fine carving groove is roughened by a roughening liquid in the first roughening time, and the second fine carving groove is roughened by a roughening liquid in the second roughening time.

8. The thick copper circuit production method of claim 1, wherein, The first and second filling hole resins are polished to obtain a third circuit board. The first and second filling hole resins are respectively polished to obtain first and second polishing resins, the first polishing resin is at the same horizontal position as the bottom of the first groove, and the second polishing resin is at the same horizontal position as the bottom of the second groove. The first and second polishing resins are respectively polished to obtain third and fourth polishing resins, the third polishing resin is at the same horizontal position as the top of the first thick copper line, and the fourth polishing resin is at the same horizontal position as the top of the second thick copper line. The third and fourth polishing resins are respectively polished to obtain the third circuit board.

9. A circuit board, characterized by The circuit board is produced by the thick copper line production method of the circuit board in any one of claims 1-8.

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