一种多层线路板加工用压合装置
The traction assembly, consisting of clamping and moving devices, performs preliminary alignment and flattening of the flexible copper foil laminate, solving the problem of arching and wrinkling caused by friction in the processing of multilayer circuit boards, and improving the forming quality and consistency of multilayer circuit boards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN TOPREACH SCI-TECH CO LTD
- Filing Date
- 2025-10-14
- Publication Date
- 2026-07-17
AI Technical Summary
During the processing of multilayer circuit boards, flexible copper foil laminates are thin and highly flexible. During alignment, they are prone to arching or local wrinkling due to interlayer friction or uneven external force, resulting in interlayer gaps or alignment deviations, which affect the bonding strength and conductivity.
The traction assembly, consisting of a clamping device and a moving device, aligns the flexible copper foil laminate through an L-shaped placement plate and a unidirectional lead screw. It also uses an air outlet to blow air and smooth the assembly to prevent inward rolling. Combined with a lifting structure, it can adapt to different stacking levels.
This process achieves initial alignment and flatness of flexible copper foil laminates, improves the quality consistency and bonding strength of multilayer circuit boards, avoids interlayer gaps and alignment deviations, and enhances molding quality.
Smart Images
Figure CN121126706B_ABST