Light-emitting device and lighting device

Abstract

The invention relates to a light-emitting device and a lighting device. The purpose of the present invention is to provide a light-emitting device and a lighting device having the light-emitting device, capable of suppressing peeling of a reflective resin layer disposed around a light-emitting element from a substrate. The light-emitting device includes: a light-emitting element mounted on an upper surface of a substrate; a resin wall having an opening surrounding the light emitting element and having an opening narrowing portion in which the opening size of the opening is narrowed in the normal direction of the upper surface of the substrate; a reflective resin layer provided on an upper surface of the substrate between the opening narrowed portion of the resin wall and the light emitting element; and a phosphor resin layer provided above the light emitting element.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a light emitting device and a lighting device. BACKGROUND

[0002] In the past, a light emitting device in which a light emitting element and a reflective resin are layered inside an opening of a resin wall having the opening formed on a substrate, and a phosphor layer covering them are arranged has been known (Patent Documents 1 and 2). A resin layer such as a reflective resin is used around the light emitting element, whereby improvement of light extraction efficiency is achieved.

[0003] Patent Document 1: Japanese Patent Application Publication No. H05-029665

[0004] Patent Document 2: Japanese Patent Application Publication No. 2004-055632

[0005] In the light emitting device described in the above Patent Documents 1 and 2, there is a problem that the resin layer such as a reflective resin arranged around the light emitting element is easily peeled from the substrate. SUMMARY

[0006] The present disclosure was completed in order to solve the above problem, and has an object to provide a light emitting device in which peeling of a reflective resin layer arranged around a light emitting element from a substrate is suppressed or reduced, and a lighting device having the light emitting device.

[0007] The present disclosure was completed in order to achieve the above object, and provides a light emitting device including: a light emitting element mounted on an upper surface of a substrate; a resin wall having an opening that surrounds the light emitting element, and having an opening reduction portion in which an opening size of the opening is reduced in a normal direction of the upper surface of the substrate; a reflective resin layer provided on the upper surface of the substrate between the opening reduction portion of the resin wall and the light emitting element; and a phosphor resin layer provided above the light emitting element.

[0008] According to such a light emitting device, the resin wall has the opening reduction portion, whereby an anchoring effect is generated in a portion of the reflective resin layer provided on the upper surface of the substrate between the opening reduction portion and the light emitting element, and peeling of the reflective resin layer from the substrate can be easily suppressed or reduced. Further, the resin wall has the opening reduction portion, whereby the spread of the reflective resin layer onto the resin wall becomes large, and light extraction efficiency based on reflection can be improved. Furthermore, compared with the structure of the resin wall in the past, the height of the resin wall can be obtained while the width of the resin wall is suppressed, the phosphor concentration of the phosphor resin layer can be reduced, and cost reduction can be facilitated.

[0009] At this time, the light emitting element can internally include a light emitting layer that generates light, and the upper surface of the reflective resin layer can be higher than the upper surface of the light emitting layer and lower than the upper surface of the light emitting element.

[0010] Thus, light emitted from the side of the light emitting layer can be effectively reflected by the reflective resin layer, and the luminance of the light emitting device can be improved. Further, the reflective resin layer is relatively thick, and thus the adhesive area with other components increases, and the effect of suppressing or reducing peeling of the reflective resin layer becomes higher. Furthermore, the reflective resin layer is relatively thick, and thus light emitted obliquely downward from the light emitting layer can be reduced from being transmitted to the back surface side of the substrate.

[0011] At this time, the light emitting element can internally include a light emitting layer that generates light, the upper surface of the reflective resin layer that interfaces with the side surface of the light emitting element can be higher than the upper surface of the light emitting layer and lower than the upper surface of the light emitting element, the upper surface of the reflective resin layer between the light emitting element and the resin wall can have a recess, and a portion of the phosphor resin layer can enter the recess.

[0012] Thus, light emitted from the side of the light emitting layer can be effectively reflected by the reflective resin layer, and the luminance of the light emitting device can be improved. Further, the reflective resin layer is relatively thick, and thus the adhesive area with other components increases and the effect of suppressing or reducing peeling of the reflective resin layer becomes higher. Furthermore, a portion of the phosphor resin layer enters the recess, and thus the effect of suppressing or reducing peeling of the reflective resin layer is further improved. Further, the reflective resin layer is relatively thick, and thus light emitted obliquely downward from the light emitting layer can be reduced from being transmitted to the back surface side of the substrate.

[0013] At this time, the resin wall can have an opening expansion portion above the opening reduction portion, the opening of the opening expansion portion can have an opening size that expands in the normal direction of the upper surface of the substrate, and the reflective resin layer can reach the opening expansion portion from the opening reduction portion.

[0014] Thus, peeling of the reflective resin layer can be more effectively suppressed or reduced.

[0015] At this time, the reflective resin layer can be composed of a resin that is softer than the resin wall.

[0016] Thus, peeling of the reflective resin layer can be more effectively reduced.

[0017] At this time, the cross-sectional shape of the resin wall in a cross section perpendicular to the upper surface of the substrate can be any of a substantially circular shape, a substantially elliptical shape, a substantially rhombic shape, and a substantially hexagonal shape.

[0018] The resin wall can be more easily formed.

[0019] At this time, a semiconductor element without a light emitting layer, which is buried in the inside of the reflective resin layer, can be included on the upper surface of the substrate in the opening of the resin wall.

[0020] Thus, a reflective resin layer having a function of preventing damage due to intrusion of moisture or the like from the outside and contact from the outside is obtained.

[0021] At this time, a lighting device having the above-described light emitting device can be provided.

[0022] Thus, a lighting device having stable light emitting characteristics can be provided.

[0023] As described above, according to the light emitting device of the present disclosure, peeling of the reflective resin layer from the substrate can be easily suppressed or reduced. In addition, light extraction efficiency based on reflection can be improved. Furthermore, the height of the resin wall can be obtained while suppressing the width of the resin wall, and the concentration of phosphor of the phosphor resin layer can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 An example of the light emitting device of the present disclosure is shown (cross-sectional view).

[0025] Figure 2 Another example (modification example 1) of the light emitting device of the present disclosure is shown (cross-sectional view).

[0026] Figure 3 Another example (modification example 2) of the light emitting device of the present disclosure is shown (cross-sectional view).

[0027] Figure 4 Another example (modification example 3) of the light emitting device of the present disclosure is shown (cross-sectional view).

[0028] Figure 5 An example of the lighting device of the present disclosure is shown (top view).

[0029] Figure 6 An example of the light emitting device of the related art is shown (cross-sectional view).

[0030] REFERENCE NUMERALS

[0031] 1: substrate; 2: light emitting element; 2S: upper surface of light emitting element; 3: light emitting layer; 3S: upper surface of light emitting layer; 4: resin wall; 5: opening reducing portion; 6: opening expanding portion; 7: reflective resin layer; 7S: upper surface of reflective resin layer; 8: recess (reflective resin layer); 9: phosphor resin layer; 10: recess (phosphor resin layer); 11: metal pattern; 12: bonding layer; 13, 14: electrode; 30: Zener diode; 31: diode; 32: IC; 100, 200, 300, 400: light emitting device; 500: lighting device. DETAILED DESCRIPTION

[0032] Hereinafter, the present disclosure will be described in detail, but the present disclosure is not limited thereto.

[0033] As described above, a light emitting device capable of suppressing or reducing peeling of a reflective resin layer disposed around a light emitting element from a substrate is required.

[0034] The present inventors and others have repeatedly conducted intensive research on the above problem, and as a result, have found that peeling of a reflective resin layer can be easily suppressed or reduced, light extraction efficiency based on reflection can be improved, the height of a resin wall can be obtained while suppressing the width of the resin wall, the concentration of phosphor of a phosphor resin layer can be reduced, and the present disclosure has been completed, by a light emitting device having: a light emitting element mounted on the upper surface of a substrate; a resin wall having an opening surrounding the light emitting element, and having an opening reduction portion in which the opening size of the opening is reduced in the normal direction of the upper surface of the substrate; a reflective resin layer disposed on the upper surface of the substrate between the opening reduction portion of the resin wall and the light emitting element; and a phosphor resin layer disposed above the light emitting element.

[0035] Hereinafter, the present disclosure will be described with reference to the accompanying drawings.

[0036] [Light emitting device]

[0037] First, the light emitting device of the present disclosure will be described with reference to Figures 1 to 3 (Fig. 2). As shown in Figures 1 to 3 , the light emitting device 100, 200, 300 of the present disclosure has a light emitting element 2 mounted on a substrate 1, and a resin wall 4 having an opening surrounding the light emitting element 2. The resin wall 4 has an opening reduction portion 5 in which the opening size of the opening is reduced in the normal direction of the upper surface of the substrate 1. Further, a reflective resin layer 7 is disposed on the upper surface of the substrate 1 between the opening reduction portion 5 of the resin wall 4 and the light emitting element 2. In addition, a phosphor resin layer 9 is disposed above the light emitting element 2.

[0038] As shown in Figures 1 to 3As in the light emitting device 100, 200, 300, the resin wall 4 has the opening reducing portion 5, and the reflective resin layer 7 enters the space between the opening reducing portion 5 and the substrate 1, thereby producing an anchoring effect on a part of the reflective resin layer 7 provided on the upper surface of the substrate 1 between the opening reducing portion 5 and the light emitting element 2, and it is possible to easily suppress and reduce peeling of the reflective resin layer 7. Then, the light emitting device becomes one in which the reflective resin layer 7 is stably disposed on the substrate 1. Further, the resin wall 4 has the opening reducing portion 5, and thereby the spread of the reflective resin layer 7 on the resin wall 4 becomes large, and it is possible to improve the light extraction efficiency based on reflection. Further, compared with the structure of the resin wall in which only the opening size is enlarged toward the normal direction (upward) of the upper surface of the substrate 1 as described in Patent Documents 1, 2, it is possible to obtain the height of the resin wall while suppressing the width of the resin wall, and thereby it is possible to reduce the phosphor concentration of the phosphor resin layer, and thus it is possible to contribute to cost reduction.

[0039] Although in the light emitting device 100, 200, 300, the resin wall 4 is provided on the substrate 1, it is also possible to provide the resin wall 4 on the substrate 1 as in the light emitting device 200. Figures 1 to 3 Figure 4 As shown in the light emitting device 300, it is possible to provide the light emitting device in which the semiconductor element 30 not having a light emitting layer is provided on the upper surface of the substrate 1 in the opening of the resin wall 4, and the semiconductor element not having a light emitting layer is buried in the inside of the reflective resin layer. Such a reflective resin layer becomes a reflective resin layer which has a function as a sealing resin for preventing damage due to intrusion of moisture or the like from the outside, and contact from the outside.

[0040] (Substrate)

[0041] In the light emitting device of the present disclosure, the kind of the substrate 1 is not particularly limited, but for example, it is preferable to use a ceramic substrate. Since the linear expansion coefficient of the ceramic substrate is small among other substrates having practicality, the temperature characteristics of the resin such as the reflective resin provided on the substrate are close, and thus the temperature characteristics of the light emitting device as a whole are more stable and good.

[0042] (Light emitting element)

[0043] ​In the light emitting device of the present disclosure, the type of the light emitting element 2 is not particularly limited. The light emitting element 2 can be used by being selected from among known LED chips and the like that output light in the ultraviolet to blue range, or can be an LED chip that outputs red light. With regard to the light emitting element 2, the metal pattern 11 provided on the substrate 1 can also be joined to the electrodes 13, 14 of the light emitting element 2 via the joining layer 12 of solder or the like. As the light emitting element (LED chip), a flip chip in which a P-type electrode and an N-type electrode are provided on one main surface side and light is emitted from the other main surface side is preferably used. In the LED chip, light is output from the light emitting layer 3, but is not only output from above and below the LED chip, but also from the side (side surface). In the case of using a flip chip, since the base portion of the LED chip (the upper surface side of the light emitting element (LED chip) 2) becomes the light extraction surface side, it is comparatively easy to secure the distance in the thickness direction from the light emitting layer 3 to the light extraction surface. As a result, even if the reflective resin layer 7 is provided to a height between the side surface of the light emitting layer 3 and the upper surface of the LED chip 2, it is not easy for the reflective resin layer 7 to climb over the light extraction surface. Therefore, it is possible to stably improve the light extraction efficiency of the light emitting device.

[0044] Further, the number of light emitting elements 2 arranged inside the opening of the resin wall 4 is not particularly limited. It is also possible to arrange one light emitting element 2 per one opening. In addition, a buffer film (not shown) that reduces the total reflection of light from the side surface side of the light emitting layer 3 can be provided between the reflective resin layer 7 and the light emitting element 2. Further, a resin layer different from the reflective resin layer 7 can be provided between the reflective resin layer 7 and the resin wall 4, between the reflective resin layer 7 and the substrate 1, or / and between the reflective resin layer 7 and the phosphor resin layer 9.

[0045] (resin wall)

[0046] The resin wall 4 is formed on the substrate 1 in a manner of surrounding the light emitting element 2, and has an opening. The light emitting element 2, the reflective resin layer 7, the phosphor resin layer 9, and the like are arranged inside the opening of the resin wall 4. The resin wall 4 is also sometimes referred to as a dam or a resin frame. As described above, the resin wall 4 can have only the opening reducing portion 5. The opening size of the opening is reduced in the normal line direction of the upper surface of the substrate by the opening reducing portion of the resin wall. The opening reducing portion can also be referred to as a shape that overhangs toward the opening side surrounded by the resin wall when the resin wall is observed in cross section.

[0047] The resin wall 4 can be composed of a resin containing a filler such as titanium oxide that improves the reflection of light. The resin wall 4 can have any shape and structure material other than the opening reducing portion 5, as long as the light emitting element 2, the reflective resin layer 7, the phosphor resin layer 9, and the like can be arranged inside the opening thereof.

[0048] As described above, it is preferable to use a ceramic substrate having a high thermal conductivity as the substrate 1, but since the ceramic substrate is not coated with a resist (solder resist) that reflects light on the front surface, light emitted downward from the light emitting element 2 easily transmits to the back surface of the substrate 1. In the case of using such a ceramic substrate that easily transmits (easily leaks) light to the back surface side of the substrate, the reflection resin layer is thickened, whereby light leakage to the back surface side of the substrate can be suppressed and the light beam can be improved. It is also necessary to make the resin wall relatively high in order to support the thick reflection resin layer, but by providing the resin wall with the opening reducing portion 5 as in the present disclosure, the height (H) of the resin wall can be easily ensured without expanding the width (W) of the resin wall, and a thick reflection resin layer can be easily and stably formed. Thus, a light emitting device that can more effectively suppress light leakage to the back surface side of the substrate 1 can be provided. Figure 1

[0049] Further, as described above, in the case of using a flip chip structure light emitting element (LED chip), it is necessary to provide the metal pattern 11 printed on the substrate 1. However, since the metal pattern 11 absorbs light, if a thick reflection resin layer 7 can be provided on the metal pattern 11, it is expected that light absorption at the metal pattern 11 can be reduced.

[0050] In addition, the shape of the resin wall on the side (outer side) opposite to the opening when viewed in cross section is not particularly limited. It can be a shape that is asymmetric to the opening side (inner side), such as a shape perpendicular to the upper surface of the substrate, or it can be the same cross-sectional shape as the opening side (inner side).

[0051] Further, as Figures 1 to 3 indicated, it is also possible to have an opening expanding portion 6 having an opening that expands in the normal direction of the upper surface of the substrate 1 when viewed in cross section above the opening reducing portion 5. In such a case, for example, the cross-sectional shape of the resin wall 4 can be a polygonal shape such as a substantially circular shape, a substantially elliptical shape, a substantially rhombic shape, a substantially hexagonal shape, a substantially octagonal shape, or the like, and since the resin wall can be easily formed, it is relatively preferable. Here, the substantially recited also includes a slight cross-sectional shape deformation or a portion with a rounded corner. The cross-sectional shape of the resin wall 4 can be adjusted by matching the shape of the nozzle used when extruding the resin to form the resin wall 4 to the cross-sectional shape of the resin wall 4 to be formed. By providing the opening expanding portion 6 above the opening reducing portion 5, the width of the resin wall 4 can be made relatively narrow and the height of the resin wall 4 can be made relatively high. Thus, the resin wall 4 that provides a thick reflection resin layer 7 can be formed while the size of the light emitting device is better suppressed.

[0052] As Figure 6 ​As shown in the existing example of the light-emitting device 400, when the resin wall 4 is composed only of an enlarged portion 6 whose opening size increases in the normal direction of the upper surface of the substrate 1 when viewed in cross-section, or when the resin wall 4 is a vertical wall with a constant opening size, the anchoring effect does not act on the reflective resin layer 7, and the reflective resin layer 7 is easily peeled off from the substrate 1.

[0053] The shape of the opening in the resin wall 4 when viewed from above is not particularly limited; examples include polygons, circles, etc., including quadrilaterals. Figure 5 As in the example of the lighting device 500, if the resin wall is set to a quadrilateral shape when viewed from above, the deviation of the in-plane distribution of the surface light source when used as a light source for lamps such as fog lights can be effectively suppressed.

[0054] (Reflective resin layer)

[0055] The space within the opening of the resin wall 4 (the inner side surrounded by the resin wall 4) on the upper surface of the substrate 1, where the reflective resin layer 7 is disposed, is also disposed around the light-emitting element 2. Through the narrowing portion 5 of the opening provided in the resin wall 4, an anchoring effect acts on the reflective resin layer 7, suppressing and reducing the peeling of the reflective resin layer 7 from the substrate 1. The reflective resin layer 7 of this disclosure is used to reflect light from the light-emitting element 2 and efficiently guide light upwards, thereby improving light extraction efficiency. For example, it is composed of a resin containing fillers such as titanium dioxide that enhance light reflection.

[0056] like Figures 1 to 3 As shown, preferably, a flip-chip structure light-emitting element 2 is used, with the reflective resin layer 7 in contact with the light-emitting element 2. Furthermore, by making the reflective resin layer 7 thicker, light leakage to the back side of the substrate 1 is reduced while upward reflection, thereby further improving the brightness above the light-emitting device. More preferably, the reflective resin layer 7 is formed with a thickness such that the upper surface 7S of the reflective resin layer 7 is higher than the upper surface 3S of the light-emitting layer 3 of the light-emitting element 2 but lower than the upper surface 2S of the light-emitting element 2. This allows light emitted from the side (side surface) of the light-emitting layer 3 to be reflected by the reflective resin. Therefore, the brightness above the light-emitting device can be further improved. Furthermore, the portion of the reflective resin layer 7 on the light-emitting element 2 side is preferably positioned at a height between the upper surface of the LED chip 2 and the side surface of the light-emitting layer 3, above the side surface of the light-emitting layer 3. Also, the portion of the reflective resin layer 7 on the resin wall 4 side is preferably positioned from at least a portion of the height of the narrowed opening 5 of the resin wall 4 to at least a portion of the height of the enlarged opening 6 of the resin wall 4. This creates an anchoring effect, which stably suppresses the peeling of the reflective resin layer 7 while reflecting light from the light-emitting element 2 and efficiently guiding the light upward, thus more effectively suppressing light leakage to the back side of the substrate 1.

[0057] Furthermore, preferably, such asFigures 1 to 3 As shown in the light emitting device 100, 200, 300, the resin wall 4 has the opening expansion portion 6 described above, and the reflective resin layer 7 reaches from the opening reduction portion 5 to the opening expansion portion 6. If this structure is adopted, peeling of the reflective resin layer can be more effectively suppressed or reduced.

[0058] As the resin constituting the reflective resin layer 7, a silicone resin, a mixed resin having both characteristics of a silicone resin and an epoxy resin, or the like can be exemplified.

[0059] In addition, since the ceramic substrate is not coated with a resist (solder resist) that reflects light on the front surface, light emitted downward from the light emitting element 2 easily transmits to the back surface of the substrate 1. Therefore, it is preferable to provide the reflective resin layer 7 not only to the side surface of the light emitting layer of the light emitting element 2 but also to the front surface side of the substrate below the side surface of the light emitting layer, to make the thickness of the resin of the reflective resin layer 7 thicker, and to suppress light leakage to the back surface side of the substrate. Thus, a light emitting device having a better temperature characteristic while more effectively suppressing light leakage to the back surface side of the substrate 1 can be provided.

[0060] Further, in the case of using a flip chip structure light emitting element (LED chip) as described later, it is necessary to provide a metal pattern 11 printed on the substrate 1. However, since the metal pattern 11 absorbs light, if a thicker reflective resin layer 7 can be provided on the metal pattern 11, it is expected that the reflective resin layer 7 reduces light absorption at the metal pattern 11.

[0061] (Fluorescent Resin Layer)

[0062] The resin of the fluorescent resin layer 9 of the present disclosure can be composed of a resin containing a fluorescent material, and is not particularly limited. As the resin constituting the fluorescent resin layer 9, a silicone resin, a mixed resin having both characteristics of a silicone resin and an epoxy resin, or the like can be exemplified. The softness of the resin of the fluorescent resin layer 9 can be, for example, 15 to 35 in terms of Shore hardness A. Further, as the fluorescent material, one or more kinds of fluorescent materials, for example, a YAG fluorescent material can be contained.

[0063] The fluorescent resin layer 9 is provided above the light emitting element 2, and only needs to cover at least the output surface of the light emitting element. As shown in the light emitting device 100, 200, 300, it can also be formed to cover the entire opening of the resin wall 4. Further, as shown in the light emitting device 300, the fluorescent resin layer 9 can be in contact with the upper portion of the opening expansion portion 6, but can also be provided inside the opening expansion portion 6. Figures 1 to 3 Figures 1 to 3 As shown in the light emitting device 300, the fluorescent resin layer 9 can be in contact with the upper portion of the opening expansion portion 6, but can also be provided inside the opening expansion portion 6.

[0064] (Other)

[0065] The preferable mode of the relationship between the resin wall, the reflective resin layer, and the fluorescent resin layer described above will be described.​

[0066] The resin of the phosphor resin layer 9 preferably satisfies a prescribed relationship of softness with the resin of the reflective resin layer 7.

[0067] The reflective resin layer 7 can be composed of a resin softer than the phosphor resin layer 9. In addition, in the present disclosure, the softness of the resin can be prescribed by Shore hardness A. In this case, the reflective resin layer 7 being a resin softer than the phosphor resin layer 9 means that the Shore hardness A of the resin of the reflective resin layer 7 is smaller than the Shore hardness A of the resin of the phosphor resin layer 9. The softness of the resin of the reflective resin layer 7 can be set to, for example, a range of 17 to 26 in terms of Shore hardness A, and more preferably 20. Further, the softness of the resin of the phosphor resin layer 9 can be set to, for example, 26 in terms of Shore hardness A. The base resin of the reflective resin layer 7 can also be a resin of the same system as the resin constituting the phosphor resin layer 9, and can be selected from a resin of a different specification in terms of softness (Shore hardness A).

[0068] The reflective resin layer 7 achieves an improvement in light extraction efficiency by covering the side surface of the light emitting element 2, but using a softer resin thereby enables absorption of the influence of thermal expansion and contraction due to the heat generating light emitting element 2. Such a light emitting device can suppress changes in light emitting characteristics due to heat generation of the light emitting element.

[0069] In the case where the resin of the reflective resin layer 7 is much harder than the resin of the phosphor resin layer 9 (Shore hardness A of the phosphor resin layer 9 < Shore hardness A of the reflective resin layer 7), when the light emitting element 2 becomes a high temperature state, the reflective resin layer 7 surrounded by the resin wall 4 and the substrate 1 expands mainly toward the phosphor resin layer 9 side. At this time, when the hardness of the phosphor resin layer 9 is high, the internal stress of the reflective resin layer 7 increases. As a result, peeling can sometimes occur at the interface between the reflective resin layer 7 and the light emitting element 2 starting from the corner, edge, or the like of the light emitting element 2, and a decrease in light extraction efficiency and a deviation in chromaticity distribution of the light emitting device can occur. When the difference in Shore hardness A of the resins of the reflective resin layer 7 and the phosphor resin layer 9 is small, and more preferably the same, when the reflective resin layer 7 expands toward the phosphor resin layer 9 side, the phosphor resin layer 9 can deform in a manner of following the deformation of the reflective resin layer 7. As a result, peeling can be suppressed at the interface between the reflective resin layer 7 and the light emitting element 2 starting from the corner, edge, or the like of the light emitting element 2. Therefore, it is preferable that the difference in Shore hardness A of the resins of the reflective resin layer 7 and the phosphor resin layer 9 be small, and more preferably the same. The difference in Shore hardness A of the resins of the reflective resin layer 7 and the phosphor resin layer 9 (Shore hardness A of the phosphor resin layer - Shore hardness A of the reflective resin layer) is preferably 0 or more and 20 or less, and more preferably 0 or more and 18 or less.

[0070] Further, the resin of the reflective resin layer 7 is also preferably made of a material that is more easily cured and shrunk by heat than the resin of the phosphor resin layer 9. The easiness of the curing and shrinking at this time can be expressed by the shrinkage ratio at the time of curing, for example, and the shrinkage ratio of the resin of the reflective resin layer 7 is preferably larger than the shrinkage ratio of the phosphor resin layer 9. By being provided as such a combination of resins, the light emitted from the light emitting element 2 is reflected by the reflective resin layer 7, and the light reflected by the reflective resin layer 7 is emitted from the light emitting device 1, as shown in FIG. 1. As a result, the light emitted from the light emitting element 2 is effectively reflected by the reflective resin layer 7, and the luminance of the light emitting device is improved. Figure 2 the light emitting device 200 of Modification 1, Figure 3 the light emitting device 300 of Modification 2, as shown in FIG. 3, a recess (indentation) 8 is formed in the upper surface of the reflective resin layer 7.

[0071] As shown in FIG. 1, Figure 2 , Figure 3 If the upper surface of the reflective resin layer 7 that is in contact with the side surface of the light emitting element 2 is formed higher than the upper surface 3S of the light emitting layer 3 and lower than the upper surface 2S of the light emitting element 2, a recess 8 is provided in the upper surface of the reflective resin layer 7 between the light emitting element 2 and the resin wall 4, and a part of the phosphor resin layer 9 enters the recess 8, then the light emitted from the side of the light emitting layer 3 can be effectively reflected by the reflective resin layer 7, and the luminance of the light emitting device can be improved. Further, the reflective resin layer 7 is provided to be relatively thick, and thus the adhesive area with other components is increased, and the effect of reducing the peeling of the reflective resin layer 7 becomes higher. Also, a part of the phosphor resin layer 9 enters the recess 8, and thus the effect of reducing and suppressing the peeling of the reflective resin layer 7 becomes higher. Further, the reflective resin layer 7 is relatively thick, and thus the light emitted from the light emitting layer 3 to the obliquely downward direction can be reduced from being transmitted to the back surface side of the substrate 1.

[0072] Further, the recess (indentation) 8 of the upper surface of the reflective resin layer 7 is formed to be continuous with the opening enlarged portion 6 of the resin wall 4, and thus the recess (indentation) 8 between the light emitting element 2 and the resin wall 4 is provided with a rounded corner, and the light emitted from the light emitting element 2 becomes cross light, and the degradation of the light emitting characteristics can be effectively suppressed without easily becoming a yellow ring or the like, and the light emitting characteristics become more favorable. As such, the reflective resin layer 7 preferably has the recess (indentation) 8 in the upper surface. Also, a part of the phosphor resin layer 9 enters the recess 8, and thus the effect of reducing and suppressing the peeling of the reflective resin layer 7 becomes higher.

[0073] In the case where the recess (indentation) 8 is formed in the upper surface of the reflective resin layer 7, as shown in the light emitting device 300 of Modification 2, Figure 3 a recess (indentation) 10 can also be further formed in the surface of the phosphor resin layer 9 above the recess of the reflective resin layer 7. If it is such a structure, the angle color difference is further improved, and thus it is more preferable. The adhesiveness with the reflective resin layer 7 is made relatively high, and thus the recess (indentation) 10 is easily formed in the surface of the phosphor resin layer 9.

[0074] The resin wall 4 is preferably made of a resin harder than the phosphor resin layer 9 (the resin of the phosphor resin layer 9 is softer than the resin of the resin wall 4). At this time, a resin having a Shore hardness A of 53 to 68 can be used as the resin constituting the resin wall 4. In addition, the difference in the Shore hardness A between the resin of the resin wall 4 and the resin of the reflective resin layer 7 is preferably 25 or more, and more preferably 35 or more.

[0075] (Illumination device)

[0076] The present disclosure can provide an illumination device having the above-described light emitting device. Figure 6 An example of an illumination device (top view) is shown. In addition, the phosphor resin layer is not shown in order to be able to see the structural components such as the light emitting element. An illumination device 500 can be provided, which has a light emitting device having a Zener diode 30 or the like in addition to the light emitting element 2 in the opening of the resin wall 4 provided on the substrate 1, and a diode 31, an IC 32 on the substrate 1 outside the opening of the resin wall 4. The specific use of the illumination device is not particularly limited, and can be set to indoor lighting, outdoor lighting, a headlamp of an automobile, or the like.

[0077] As described above, the light emitting device of the present disclosure is a light emitting device capable of easily suppressing or reducing peeling of the reflective resin layer. In addition, it is a light emitting device capable of improving light extraction efficiency based on reflection. Furthermore, since the phosphor concentration of the phosphor resin layer can be reduced, it can contribute to cost reduction.

[0078] The present specification contains the following modes.

[0079] [1] A light emitting device, wherein the light emitting device includes:

[0080] a light emitting element mounted on an upper surface of a substrate;

[0081] a resin wall having an opening that surrounds the light emitting element, and having an opening reduction portion in which an opening size of the opening is reduced in a normal direction of the upper surface of the substrate;

[0082] a reflective resin layer provided on the upper surface of the substrate between the opening reduction portion of the resin wall and the light emitting element; and

[0083] a phosphor resin layer provided above the light emitting element.

[0084] [2] The light emitting device according to the above [1], wherein

[0085] the light emitting element includes, inside, a light emitting layer that generates light,

[0086] The upper surface of the reflective resin layer is higher than the upper surface of the light emitting layer and lower than the upper surface of the light emitting element.

[0087] [3] The light emitting device according to the above [1], wherein

[0088] The light emitting element internally includes a light emitting layer that generates light,

[0089] The upper surface of the reflective resin layer that interfaces with the side surface of the light emitting element is higher than the upper surface of the light emitting layer and lower than the upper surface of the light emitting element,

[0090] The upper surface of the reflective resin layer between the light emitting element and the resin wall has a recess, and a portion of the phosphor resin layer enters the recess.

[0091] [4] The light emitting device according to the above [1], the above [2], or the above [3], wherein

[0092] The resin wall has an opening expansion portion above the opening reduction portion, in which the opening size of the opening expands in the normal direction of the upper surface of the substrate,

[0093] The reflective resin layer reaches the opening expansion portion from the opening reduction portion.

[0094] [5] The light emitting device according to the above [1], the above [2], the above [3], or the above [4], wherein

[0095] The reflective resin layer is composed of a resin that is softer than the resin wall.

[0096] [6] The light emitting device according to the above [1], the above [2], the above [3], the above [4], or the above [5], wherein

[0097] The cross-sectional shape of the resin wall in a cross section perpendicular to the upper surface of the substrate is any of a substantially circular shape, a substantially elliptical shape, a substantially rhombic shape, and a substantially hexagonal shape.

[0098] [7] The light emitting device according to the above [1], the above [2], the above [3], the above [4], the above [5], or the above [6], wherein

[0099] The upper surface of the substrate in the opening of the resin wall includes a semiconductor element that does not have a light emitting layer,

[0100] The semiconductor element that does not have a light emitting layer is embedded inside the reflective resin layer.

[0101] [8]: An illumination device, wherein the illumination device has the light emitting device of the above-mentioned [1], the above-mentioned [2], the above-mentioned [3], the above-mentioned [4], the above-mentioned [5], the above-mentioned [6] or the above-mentioned [7].

[0102] In addition, the present disclosure is not limited to the above-described embodiments. The above-described embodiments are merely illustrative, and technical solutions having substantially the same structure as the technical concept recited in the claims of the present disclosure and exerting the same effects are all included within the technical scope of the present disclosure.

Claims

1. A light emitting device, characterized by, The light emitting device has: a light emitting element mounted on an upper surface of a substrate; a resin wall having an opening that surrounds the light emitting element, and having an opening reduction portion in which an opening size of the opening is reduced in a normal line direction of the upper surface of the substrate; a reflective resin layer provided on the upper surface of the substrate between the opening reduction portion of the resin wall and the light emitting element; and a phosphor resin layer provided above the light emitting element.

2. The light emitting device according to claim 1, wherein the light emitting element internally includes a light emitting layer that generates light, an upper surface of the reflective resin layer is higher than an upper surface of the light emitting layer and lower than an upper surface of the light emitting element.

3. The light emitting device according to claim 1, wherein the light emitting element internally includes a light emitting layer that generates light, an upper surface of the reflective resin layer that borders a side surface of the light emitting element is higher than an upper surface of the light emitting layer and lower than an upper surface of the light emitting element, an upper surface of the reflective resin layer between the light emitting element and the resin wall has a recess into which a portion of the phosphor resin layer enters.

4. The light emitting device according to claim 1, wherein the resin wall has an opening expansion portion above the opening reduction portion in which an opening size of the opening is expanded in the normal line direction of the upper surface of the substrate, the reflective resin layer reaches from the opening reduction portion to the opening expansion portion.

5. The light emitting device according to claim 1, wherein the reflective resin layer is composed of a resin that is softer than the resin wall.

6. The light emitting device according to claim 1, wherein a cross-sectional shape of the resin wall in a cross section perpendicular to the upper surface of the substrate is any of a substantially circular shape, a substantially elliptical shape, a substantially rhombic shape, and a substantially hexagonal shape.

7. The light emitting device according to claim 1, wherein the light emitting device includes a semiconductor element that does not have a light emitting layer on the upper surface of the substrate within the opening of the resin wall, the semiconductor element that does not have a light emitting layer is embedded inside the reflective resin layer.

8. An illumination device, comprising: the light emitting device according to any one of claims 1 to 7. ​

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