Display panel with integrated off-axis microlens array

Abstract

Various embodiments include a display panel having an integrated microlens array. The display panel generally includes a mesa array that includes an array of pixel light sources (e.g., LEDs) electrically coupled to respective pixel driver circuits (e.g., FETs). The microlens array is arranged off-axis over a mesa comprising the pixel light sources and is positioned with the purpose of reducing divergence of light generated by the pixel light sources and directs the light to a particular angle or focus pixel by pixel. Different microlens shapes and combinations are achieved in the display panel. The display panel may also include an integrated optical spacer formed of the same layer of microlens material to maintain positioning between the microlenses and the pixel driver circuitry.

Description

[0001] This patent application is a divisional application of Chinese Patent Application No. CN202180064482.5 entitled "Display Panel with Integrated Off-Axis Microlens Array", which entered the Chinese national phase on March 21, 2023, under the PCT Treaty and was filed on September 27, 2021. Technical Field

[0002] This disclosure generally relates to display devices, and more specifically, to systems and methods for fabricating display panels that integrate off-axis microlens arrays. Background Technology

[0003] Display technology is becoming increasingly important in today's commercial electronic devices. These display panels are widely used in fixed large screens such as LCD TVs and OLED TVs, as well as in portable electronic devices such as personal laptops, smartphones, tablets, and wearable devices. The development direction of fixed large screen technology is to achieve wide viewing angles to accommodate and enable multiple viewers to see the screen from various angles. For example, various liquid crystal materials such as super-twisted nematic (STN) and thin-film compensated super-twisted nematic (FSTN) have been developed to achieve wide viewing angles for all pixel light sources in the display panel.

[0004] However, most portable electronic devices are designed primarily for a single user, and the screen orientation of these devices should be adjusted to provide the optimal viewing angle for the individual user, rather than a wide viewing angle to accommodate multiple viewers. For example, the appropriate viewing angle for a user could be perpendicular to the screen surface. In this case, most of the light emitted at a wide viewing angle is wasted compared to a fixed large screen. Furthermore, a wide viewing angle raises privacy concerns when using portable electronic devices in public areas.

[0005] Furthermore, in conventional projection systems based on passive imaging devices such as liquid crystal displays (LCDs), digital mirror devices (DMDs), and liquid crystal on silicon (LCOS), the passive imaging devices themselves do not emit light. Specifically, conventional projection systems project an image by optically modulating a portion of the parallel light emitted from a light source—for example, a portion emitted at the pixel level by an LCD panel or reflected at the pixel level by a DMD panel. However, the portion of light that is not emitted or reflected is lost, reducing the efficiency of the projection system. Moreover, to provide parallel light, complex illumination optics are required to collect the diverging light emitted by the light source. These illumination optics not only make the system bulky but also introduce additional light loss into the system, further impacting its performance. In conventional projection systems, typically less than 10% of the illumination light generated by the light source is used to form the projected image.

[0006] Light-emitting diodes (LEDs) have advantages such as long lifespan and low energy consumption, and are widely used in various fields. As a next-generation light source, they are used as backlight units in mobile phones, digital devices, LCD displays, etc., and are also used for vehicle dashboard lighting, taillights, traffic lights, and other general lighting devices. They are widely used in the display field, including internal and external electronic signs, as well as in the biological and environmental fields, including water pollution and blood oxygen concentration. Due to improved product performance and reduced production costs, the application range of LEDs continues to expand every year. To meet these demands, various researches are underway. There are two main approaches: improving internal quantum efficiency and improving external extraction efficiency. Internal quantum efficiency can be improved by increasing the recombination rate of emitting electron-hole pairs and decreasing the recombination rate of non-emitting electron-hole pairs in the active layer of the LED. However, this method has certain technical limitations. On the other hand, active research is currently underway on improving external extraction efficiency. To overcome this problem, microlens arrays are used to reduce one or more of scattering, internal reflection, waveguides, absorption, etc.

[0007] LEDs, made of semiconductor materials, can be used in monochrome or full-color displays. In current displays employing LEDs, they are typically used as a light source to provide light that is optically modulated by, for example, an LCD or DMD panel. That is, the light emitted by the LED itself does not form an image. LED displays that include LED panels comprising multiple LED chips as imaging devices have also been studied. In such LED displays, the LED panel is a self-emitting imaging device, where each pixel may include one LED chip (monochrome display) or multiple LED chips, each chip representing a primary color (full-color display).

[0008] However, the light emitted by LED chips is spontaneously emitted and therefore undirected, resulting in a large divergence angle. A large divergence angle can cause various problems in LED displays. For example, due to the large divergence angle, the light emitted by the LED chips is more easily scattered and / or reflected within the LED display. Scattered / reflected light illuminates other pixels, leading to inter-pixel crosstalk, loss of sharpness, and loss of contrast.

[0009] Furthermore, in traditional LEDs, the light emitted by each microlens is in the same direction, so the light can only be focused on a plane, not a single point, which limits the application areas of LEDs. In addition, LEDs require the application of additional refractive optical structures, which leads to optical crosstalk between pixels, loss of sharpness, and loss of contrast. Summary of the Invention

[0010] There is a need for improved display designs that address and resolve the aforementioned shortcomings of conventional display systems. Specifically, a display panel is required that reduces viewing angles for better user privacy, improves directional focusing, and / or reduces light waste to lower power consumption, and reduces inter-pixel light interference to provide a better image.

[0011] Various embodiments include display panels with integrated microlens arrays. The display panel typically includes an array of pixel light sources (e.g., LEDs, OLEDs) electrically coupled to corresponding pixel driver circuitry (e.g., FETs). The microlens array is aligned with the pixel light sources and positioned to reduce the divergence of light generated by the pixel light sources. The display panel may also include integrated optical spacers to maintain the positioning between the microlenses and the pixel driver circuitry.

[0012] Microlens arrays reduce the divergence angle of light generated by pixel light sources and the usable viewing angle of the display panel. This, in turn, reduces power waste, increases brightness, and / or better protects user privacy in public areas.

[0013] Display panels integrating microlens arrays can be fabricated using various manufacturing methods, resulting in a wide range of device designs. In one approach, the microlens array is directly fabricated as a mesa or substrate protrusion with pixel light sources. In other approaches, techniques such as self-assembly, high-temperature reflow, grayscale photolithography, molding / imprinting / stamping, and dry etching pattern transfer can be used to fabricate microlens arrays.

[0014] Other aspects include components, devices, systems, improvements, methods and processes including manufacturing methods, applications, and other technologies related to any of the above aspects.

[0015] This disclosure provides a light-emitting structure with an off-axis microlens, which allows the direction of light emitted by the microlens to be changed without additional optical structures.

[0016] In some embodiments, a light-emitting display with an off-axis microlens array can control the light direction of each microlens, and light from different microlenses in the microlens array can be focused at a single point.

[0017] This disclosure also provides a photodetector with an off-axis microlens array that can receive light from a single point. Furthermore, non-parallel light from this point can be converted into parallel light by the microlens array. The parallel light can then enter a sensor or another photodetector unit.

[0018] In some embodiments, this disclosure provides a light-emitting structure including three microlenses. This allows for adjustment of the brightness and / or sharpness of a light-emitting display using this structure, and reduces the usable viewing angle.

[0019] Some exemplary embodiments of this disclosure include a light-emitting structure comprising three microlenses. For example, a first microlens may be formed above a first light-emitting platform, and the central axis of the first microlens is not coaxially aligned with the central axis of the first light-emitting platform. A portion of the light emitted by the first light-emitting region can directly reach and pass through the first microlens. A second microlens may be located above a second light-emitting platform, and a third microlens may be located above the second microlens. A portion of the light emitted by the second light-emitting platform can directly reach and pass through the second microlens. A portion of the light passing through the second microlens can further reach and pass through the third microlens. Therefore, the optical path can be adjusted according to the relative positions of the three microlenses. Thus, divergence can be reduced, and the usable viewing angle can be reduced to a level that allows the display and panel using LED devices to be seen by the user's line of sight perpendicular to the surface of the display and panel. This can also reduce power loss, increase brightness, and / or better protect user privacy in public areas.

[0020] In another example, the light-emitting structure may further include one or more reflectors, and the first and second light-emitting platforms may be surrounded by one or more reflectors. A portion of the light emitted by the first and second light-emitting platforms can directly reach and pass through one or more of the three microlenses. Another portion of the light emitted by the first and second light-emitting platforms can reach one or more reflectors and be reflected, then reach and pass through one or more of the three microlenses. Therefore, more light emitted by the first and second light-emitting platforms can be utilized compared to a light-emitting structure without any reflectors. This reduces divergence and can decrease the usable viewing angle to a level where displays and panels using LED devices can be seen by several users. This also reduces power consumption, increases brightness, and / or appropriately protects user privacy in public areas.

[0021] In some embodiments, the light-emitting structure includes a diffractive lens, thereby allowing adjustment of the brightness and / or sharpness of the light-emitting display. Selective wavelengths of light may also be reflected or passed through the diffractive lens.

[0022] Some exemplary embodiments of this disclosure include a light-emitting structure comprising a microlens formed on a light-emitting mesa and a diffraction lens covering the microlens. The microlens may be aligned with the light-emitting mesa and covered by the diffraction lens to reduce divergence of light emitted from the light-emitting mesa. For example, the microlens may be coaxially aligned with the light-emitting mesa and covered by the diffraction lens. A portion of the light emitted from the light-emitting region may directly reach and pass through the microlens, and then selectively pass through the diffraction lens. Another portion of the light emitted from the light-emitting mesa may directly reach and selectively pass through the diffraction lens. One advantage of the disclosed light-emitting structure is enhanced brightness. Another advantage is increased contrast. Therefore, divergence can be reduced and the usable viewing angle can be reduced to a level that allows a display and panel using LED devices to be seen by a user's line of sight perpendicular to the surface of the display and panel. This can also reduce power loss, increase brightness, and / or better protect user privacy in public areas.

[0023] In another example, the microlens can be coaxially aligned with the light-emitting area, situated above the emitting platform, covered by diffraction lenses, and surrounded by a reflector. A portion of the light emitted from the emitting area can directly reach and pass through the microlens and / or diffraction lenses. Another portion of the light emitted from the emitting center can reach and be reflected by the reflector, then reach and pass through the microlens and / or diffraction lenses. Therefore, more light emitted from the emitting platform can be utilized compared to a light-emitting structure without a reflector. Consequently, divergence can be reduced, and the usable viewing angle can be reduced to a level where displays and panels using LED devices can be seen by several users. This can also reduce power consumption, increase brightness, and / or appropriately protect user privacy in public areas.

[0024] This disclosure therefore includes, but is not limited to, the following exemplary embodiments.

[0025] Some exemplary embodiments of this disclosure include a light-emitting structure array system having an off-axis microlens array structure, comprising: at least one light-emitting platform; and at least one microlens formed above the light-emitting platform, wherein the central axis of the at least one microlens is not coaxially aligned with the central axis of the at least one light-emitting platform.

[0026] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the relative position of each microlens with respect to the corresponding light-emitting platform is the same.

[0027] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure array system further includes a sensor, and the emitted light from the at least one light-emitting mesa is converted together into the sensor by at least one microlens.

[0028] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the sensor is arranged at the central axis of the light-emitting structure array system.

[0029] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the corresponding offset distance of the central axis of each microlens relative to the central axis of its corresponding light-emitting platform increases from the center of the light-emitting structure array system to the edge of the light-emitting structure array system.

[0030] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the sensor is not arranged at the central axis of the light-emitting structure array system.

[0031] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the offset distance of the central axis of each microlens relative to the central axis of the corresponding light-emitting platform increases from the central axis of the sensor to any edge of the light-emitting structure array system.

[0032] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the angle of the light emitted by each microlens increases from the central axis of the sensor to any edge of the light-emitting structure array system.

[0033] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the offset of the central axis of at least one microlens from the central axis of at least one light-emitting mesa is no greater than 4.5 μm.

[0034] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the offset distance between the edge of the bottom surface of at least one light-emitting platform and the edge of the bottom surface of at least one microlens is within 30% of the diameter of the bottom surface of at least one microlens.

[0035] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, at least one microlens is made of silicon oxide or an organic material.

[0036] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the bottom surface of at least one microlens intersects the central axis of at least one light-emitting platform.

[0037] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure array system further includes a semiconductor substrate and a reflector cup, and at least one light-emitting mesa is formed on the semiconductor substrate and at least one light-emitting mesa is surrounded by the reflector cup.

[0038] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the inner wall of the reflector cup is stepped.

[0039] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, at least one light-emitting mesa includes: a light-emitting layer, a bottom bond and layer located at the bottom of the light-emitting layer and bonded to a semiconductor substrate, and a top electrode layer covering at least one light-emitting mesa and electrically connected to a reflector. In some embodiments, the reflector is electrically connected to the semiconductor substrate.

[0040] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure array system further includes spacers formed between at least one light-emitting mesa and at least one microlens.

[0041] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the height of the spacer is less than the height of at least one microlens.

[0042] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure array system, the semiconductor substrate is an IC substrate.

[0043] Some exemplary embodiments of this disclosure include a light-emitting structure having at least one off-axis microlens, comprising: a light-emitting platform; a first microlens formed on the light-emitting platform; and a second microlens formed on the light-emitting platform and covering the first microlens.

[0044] In some exemplary embodiments or any combination of exemplary embodiments of a light-emitting structure having at least one off-axis microlens, the diameter of the second microlens is larger than the diameter of the first microlens.

[0045] In some exemplary embodiments or any combination of exemplary embodiments of a light-emitting structure having at least one off-axis microlens, the central axis of the first microlens is coaxially aligned with the central axis of the light-emitting platform, and the central axis of the second microlens is not coaxially aligned with the central axis of the light-emitting platform.

[0046] In some exemplary embodiments or any combination of exemplary embodiments of a light-emitting structure having at least one off-axis microlens, the central axis of the second microlens is coaxially aligned with the central axis of the light-emitting platform, and the central axis of the first microlens is not coaxially aligned with the central axis of the light-emitting platform.

[0047] In some exemplary embodiments or any combination of exemplary embodiments of a light-emitting structure having at least one off-axis microlens, the central axis of the first microlens is not coaxially aligned with the central axis of the light-emitting platform, the central axis of the second microlens is not coaxially aligned with the central axis of the light-emitting platform, and the central axis of the first microlens is not coaxially aligned with the central axis of the second microlens.

[0048] In some exemplary embodiments or any combination of exemplary embodiments of a light-emitting structure having at least one off-axis microlens, the light-emitting structure includes more than one set of light-emitting platforms, first microlenses and second microlenses, and within each set of the light-emitting structure, the positions of each first microlens relative to each second microlens are different.

[0049] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the offset distance between the central axis of the second microlens and the central axis of the light-emitting platform is no greater than 12 μm.

[0050] In some exemplary embodiments or any combination of exemplary embodiments of a light-emitting structure having at least one off-axis microlens, the offset distance between the central axis of the first microlens and the central axis of the light-emitting platform is no greater than 1.5 μm.

[0051] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the offset distance between the central axis of the first microlens and the central axis of the second microlens is not greater than 6 μm and not less than 4.5 μm.

[0052] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the bottom surface of the second microlens intersects the central axis of the light-emitting platform.

[0053] In some exemplary embodiments or any combination of exemplary embodiments of a light-emitting structure having at least one off-axis microlens, the bottom surface of the first microlens intersects the central axis of the light-emitting platform.

[0054] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the material of the first microlens is the same as the material of the second microlens.

[0055] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure having at least one off-axis microlens further includes a semiconductor substrate and a reflector. In some embodiments, a light-emitting mesa is formed on the semiconductor substrate, and the light-emitting mesa is surrounded by the reflector.

[0056] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the inner wall of the reflector cup is stepped.

[0057] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the light-emitting mesa includes: a light-emitting layer; a bottom bonding layer located at the bottom of the light-emitting layer and bonded to a semiconductor substrate; and a top electrode layer covering the light-emitting mesa and electrically connected to a reflector cup, wherein the reflector cup is electrically connected to the semiconductor substrate.

[0058] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure having at least one off-axis microlens further includes a spacer formed between the light-emitting platform and the first microlens.

[0059] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the height of the spacer is less than the height of the first microlens.

[0060] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the semiconductor substrate is an IC substrate.

[0061] Some exemplary embodiments of this disclosure include a light-emitting structure having at least one off-axis microlens, comprising: a light-emitting platform; a first microlens formed on the light-emitting platform; and a second microlens formed on the first microlens.

[0062] In some exemplary embodiments or any combination of exemplary embodiments of a light-emitting structure having at least one off-axis microlens, the diameter of the second microlens is smaller than the diameter of the first microlens.

[0063] In some exemplary embodiments or any combination of exemplary embodiments of a light-emitting structure having at least one off-axis microlens, the central axis of the first microlens is coaxially aligned with the central axis of the light-emitting platform, and the central axis of the second microlens is not coaxially aligned with the central axis of the light-emitting platform.

[0064] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the light-emitting structure includes more than one group of light-emitting platforms, first microlenses, and second microlenses. In some embodiments, within each group of the light-emitting structure, the positions of each first microlens relative to each second microlens are different.

[0065] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the offset distance between the central axis of the second microlens and the central axis of the light-emitting platform is no greater than 1.5 μm.

[0066] In some exemplary embodiments or any combination of exemplary embodiments of a light-emitting structure having at least one off-axis microlens, the bottom surface of the first microlens intersects the central axis of the light-emitting platform.

[0067] In some exemplary embodiments or any combination of exemplary embodiments of a light-emitting structure having at least one off-axis microlens, the bottom surface of the second microlens does not intersect the central axis of the light-emitting platform.

[0068] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the material of the first microlens is the same as the material of the second microlens.

[0069] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure having at least one off-axis microlens further includes a semiconductor substrate and a reflector cup, wherein a light-emitting mesa is formed on the semiconductor substrate and the light-emitting mesa is surrounded by the reflector cup.

[0070] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the inner wall of the reflector cup is stepped.

[0071] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the light-emitting mesa includes: a light-emitting layer; a bottom bonding layer located at the bottom of the light-emitting layer and bonded to a semiconductor substrate; and a top electrode layer covering the light-emitting mesa and electrically connected to a reflector cup, wherein the reflector cup is electrically connected to the semiconductor substrate.

[0072] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure having at least one off-axis microlens further includes a spacer formed between the light-emitting platform and the first microlens.

[0073] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the height of the spacer is less than the height of the first microlens.

[0074] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having at least one off-axis microlens, the semiconductor substrate is an IC substrate.

[0075] Some exemplary embodiments of this disclosure include a light-emitting structure having an off-axis microlens structure, comprising: a first light-emitting platform; at least a first microlens formed above the first light-emitting platform, wherein the central axis of the first microlens is not coaxially aligned with the central axis of the first light-emitting platform; a second light-emitting platform; at least a second microlens formed above the second light-emitting platform; and at least a third microlens formed above the second light-emitting platform.

[0076] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the third microlens covers and contacts the entire top surface of the second microlens.

[0077] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the offset of the central axis of the first microlens from the central axis of the first light-emitting stage is no greater than 4.5 μm.

[0078] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the offset distance between the edge of the bottom surface of the first light-emitting platform and the edge of the bottom surface of the first microlens is within 30% of the diameter of the bottom surface of the first microlens.

[0079] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the material of the first microlens is silicon oxide or an organic material.

[0080] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the bottom surface of the first microlens intersects the central axis of the first light-emitting platform.

[0081] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure further includes a semiconductor substrate and at least two reflectors, wherein a first light-emitting mesa and a second light-emitting mesa are formed on the semiconductor substrate, and the first light-emitting mesa and the second light-emitting mesa are surrounded by one of the two reflectors, respectively.

[0082] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the inner wall of the reflector cup is stepped.

[0083] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the first light-emitting mesa includes: a first light-emitting layer; a first bottom bonding layer located at the bottom of the first light-emitting layer and bonded to a semiconductor substrate; and a top electrode layer located at the top surface of the first light-emitting mesa and electrically connected to a first reflector of the two reflectors. In some embodiments, the second light-emitting mesa includes: a second light-emitting layer; a second bottom bonding layer located at the bottom of the second light-emitting layer and bonded to a semiconductor substrate; and a top electrode layer also located at the top surface of the second light-emitting mesa and electrically connected to a second reflector of the two reflectors, wherein the first and second reflectors are electrically connected to the semiconductor substrate.

[0084] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure further includes spacers covering the first and second light-emitting platforms, wherein the spacers are formed between the first light-emitting platform and the first microlens, and also between the second light-emitting platform and the second microlens.

[0085] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the height of the spacer is less than the height of the first microlens.

[0086] The light-emitting structure according to any one of claims 51-61, wherein the diameter of the third microlens is larger than the diameter of the second microlens.

[0087] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the central axis of the second microlens is coaxially aligned with the central axis of the second light-emitting platform, and the central axis of the third microlens is not coaxially aligned with the central axis of the second light-emitting platform.

[0088] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the central axis of the third microlens is coaxially aligned with the central axis of the second light-emitting platform, and the central axis of the second microlens is not coaxially aligned with the central axis of the second light-emitting platform.

[0089] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the central axis of the second microlens is not coaxially aligned with the central axis of the second light-emitting platform, the central axis of the third microlens is not coaxially aligned with the central axis of the second light-emitting platform, and the central axis of the second microlens is not coaxially aligned with the central axis of the third microlens.

[0090] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the light-emitting structure includes more than one set of light-emitting platforms, a first microlens, a second microlens and a third microlens, and within each set of the light-emitting structure, the position of each second microlens relative to each third microlens is different.

[0091] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the offset distance between the central axis of the third microlens and the central axis of the second light-emitting platform is no greater than 12 μm.

[0092] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the offset distance between the central axis of the second microlens and the central axis of the second light-emitting platform is no greater than 1.5 μm.

[0093] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the offset distance between the central axis of the second microlens and the central axis of the third microlens is not greater than 6 μm and not less than 4.5 μm.

[0094] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the bottom surface of the third microlens intersects the central axis of the second light-emitting platform.

[0095] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the bottom surface of the second microlens does not intersect the central axis of the second light-emitting platform.

[0096] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the material of the second microlens is the same as the material of the third microlens, and the material of the first microlens is the same as the material of the third microlens.

[0097] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the offset distance between the central axis of the first microlens and the central axis of the first light-emitting platform is less than the offset distance between the central axis of the third microlens and the central axis of the second light-emitting platform.

[0098] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the semiconductor substrate is an IC substrate.

[0099] Some exemplary embodiments of this disclosure include a light-emitting structure comprising: a first light-emitting platform; a first microlens formed above the first light-emitting platform, wherein the central axis of the first microlens is not coaxially aligned with the central axis of the first light-emitting platform; a second light-emitting platform; a second microlens formed above the second light-emitting platform; and a third microlens formed above the second microlens, wherein the third microlens does not cover the entire top surface of the second microlens.

[0100] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the offset distance between the central axis of the first microlens and the central axis of the first light-emitting platform is no greater than 4.5 μm.

[0101] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the offset distance between the edge of the bottom surface of the first light-emitting platform and the edge of the bottom surface of the first microlens is within 30% of the diameter of the bottom surface of the first microlens.

[0102] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the material of the first microlens is silicon oxide or an organic material.

[0103] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the bottom surface of the first microlens intersects the central axis of the first light-emitting platform.

[0104] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure further includes a semiconductor substrate and a reflector cup, wherein a first light-emitting mesa and a second light-emitting mesa are formed on the semiconductor substrate, and wherein the first light-emitting mesa and the second light-emitting mesa are surrounded by respective reflector cups.

[0105] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the inner sidewall of each of the reflectors is stepped.

[0106] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the first light-emitting mesa includes: a first light-emitting layer; a first bottom bonding layer formed at the bottom of the first light-emitting layer and bonded to a semiconductor substrate; and a top electrode layer covering the first light-emitting layer and electrically connected to a first reflector in a reflector cup. In some embodiments, the second light-emitting mesa includes: a second light-emitting layer; a second bottom bonding layer formed at the bottom of the second light-emitting layer and bonded to a semiconductor substrate; and a top electrode layer also covering the second light-emitting layer and electrically connected to a second reflector cup in a reflector cup, wherein the reflector cup is electrically connected to the semiconductor substrate.

[0107] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure further includes spacers covering the first and second light-emitting platforms, wherein the spacers are formed between the first light-emitting platform and the first microlens, and also between the second light-emitting platform and the second microlens.

[0108] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the height of the spacer is less than the height of the first microlens.

[0109] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the horizontal dimension of the third microlens is smaller than the horizontal dimension of the bottom surface of the second microlens.

[0110] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the central axis of the second microlens is coaxially aligned with the central axis of the second light-emitting platform, and the vertical axis of the third microlens is not coaxially aligned with the central axis of the second light-emitting platform. When the third microlens is in its complete shape, the vertical axis passes through the center point of the third microlens.

[0111] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the light-emitting structure includes more than one set of light-emitting platforms, first microlenses and second microlenses, and in each set of the light-emitting structure, the positions of each first microlens relative to each second microlens are different.

[0112] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the offset distance between the vertical axis of the third microlens and the central axis of the second light-emitting platform is no greater than 1.5 μm.

[0113] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the bottom surface of the second microlens intersects the central axis of the second light-emitting platform.

[0114] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the bottom surface of the first microlens does not intersect the central axis of the first light-emitting platform.

[0115] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the material of the second microlens is the same as that of the third microlens, and the material of the first microlens is the same as that of the second microlens.

[0116] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the offset distance between the central axis of the first microlens and the central axis of the first light-emitting platform is greater than the offset distance between the vertical axis of the third microlens and the central axis of the second light-emitting platform.

[0117] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the semiconductor substrate is an IC substrate.

[0118] Some exemplary embodiments of this disclosure include a light-emitting structure having a coaxial microlens, comprising: a light-emitting platform; a first microlens formed on the light-emitting platform; and a second microlens covering and contacting the first microlens.

[0119] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having coaxial microlenses, the refractive index of the first microlens is higher than that of the second microlens.

[0120] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a coaxial microlens, the material of the second microlens is different from the material of the first microlens.

[0121] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a coaxial microlens, the first microlens has a hemispherical structure and the second microlens has a polygonal structure without the portion cut off by the first microlens or a composite structure without the portion cut off by the first microlens.

[0122] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a coaxial microlens, the composite structure is a combination of a hemispherical structure and a trapezoidal structure or a hemispherical structure and a triangular structure.

[0123] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having coaxial microlenses, a trapezoidal structure is formed at the bottom of the hemispherical structure, or a triangular structure is formed at the bottom of the hemispherical structure.

[0124] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a coaxial microlens, the polygonal structure is a trapezoidal structure having a top surface that is inclined relative to the bottom surface of the trapezoidal structure.

[0125] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having coaxial microlenses, the central axis of the first microlens and the central axis of the second microlens are coaxially aligned with the central axis of the light-emitting platform.

[0126] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure having a coaxial microlens further includes a semiconductor substrate and a reflector cup, wherein a light-emitting mesa is formed on the semiconductor substrate and the light-emitting mesa is surrounded by the reflector cup.

[0127] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a coaxial microlens, the inner wall of the reflector cup is stepped.

[0128] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a coaxial microlens, the light-emitting mesa includes: a light-emitting layer; a bottom bonding layer located at the bottom of the light-emitting layer and bonded to a semiconductor substrate; and a top electrode layer covering the light-emitting mesa and electrically connected to a reflector cup, wherein the reflector cup is electrically connected to the semiconductor substrate.

[0129] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure having coaxial microlenses further includes spacers formed above the light-emitting platform.

[0130] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a coaxial microlens, the height of the spacer is less than the height of the first microlens or the height of the second microlens.

[0131] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a coaxial microlens, the semiconductor substrate is an IC substrate.

[0132] Some exemplary embodiments of this disclosure include a light-emitting structure having an elliptical microlens structure, comprising: a light-emitting platform; and at least one elliptical microlens formed above the light-emitting platform, wherein the central axis of the elliptical microlens is not coaxially aligned with the central axis of the light-emitting platform.

[0133] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the elliptical microlens is formed by a combination of a quarter of a sphere and a quarter of an ellipsoid.

[0134] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the radius of the sphere is no greater than 9 μm, and the major radius of the ellipsoid is no greater than 18 μm.

[0135] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the offset distance between the center of the elliptical microlens and the center of the light-emitting platform on the horizontal plane is no greater than 4.5 μm.

[0136] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the material of the elliptical microlens is silicon oxide or an organic material.

[0137] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the bottom surface of the elliptical microlens intersects the central axis of the light-emitting platform.

[0138] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure further includes a semiconductor substrate and a reflector cup, wherein a light-emitting mesa is formed on the semiconductor substrate and the light-emitting mesa is surrounded by the reflector cup.

[0139] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the inner wall of the reflector cup is stepped.

[0140] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the light-emitting mesa includes: a light-emitting layer; a bottom bonding layer located at the bottom of the light-emitting layer and bonded to a semiconductor substrate; and a top electrode layer covering the light-emitting mesa and electrically connected to a reflector cup, wherein the reflector cup is electrically connected to the semiconductor substrate.

[0141] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure further includes spacers formed between the light-emitting platform and the elliptical microlens.

[0142] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the height of the spacer is less than the height of the elliptical microlens.

[0143] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the height of the spacer is less than 5 μm.

[0144] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the semiconductor substrate is an IC substrate.

[0145] Some exemplary embodiments of this disclosure include a light-emitting structure having a microlens composite structure, comprising: a light-emitting platform; and a microlens composite structure. In some embodiments, the microlens composite structure includes: at least one microlens formed above the light-emitting platform; and a reflective portion formed on one side of the microlens.

[0146] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a microlens composite structure, the microlens is a sphere with a notch on the surface of the microlens.

[0147] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a microlens composite structure, the reflective portion is formed on the surface of the notch.

[0148] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a microlens composite structure, the notch has an inclined surface relative to the bottom surface of the microlens, and the reflective portion is a planar structure attached to the inclined surface.

[0149] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a microlens composite structure, the notch is a recess, and the reflective portion is attached to the recessed surface.

[0150] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a microlens composite structure, the material of the microlens is silicon oxide or an organic material.

[0151] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a microlens composite structure, the bottom surface of the microlens intersects the central axis of the light-emitting platform.

[0152] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure having a microlens composite structure further includes a semiconductor substrate and a reflector cup, wherein a light-emitting mesa is formed on the semiconductor substrate and the light-emitting mesa is surrounded by the reflector cup.

[0153] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a microlens composite structure, the inner wall of the reflector cup is stepped.

[0154] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a microlens composite structure, the light-emitting mesa includes: a light-emitting layer; a bottom bonding layer located at the bottom of the light-emitting layer and bonded to a semiconductor substrate; and a top electrode layer covering the light-emitting mesa and electrically connected to a reflector cup, wherein the reflector cup is electrically connected to the semiconductor substrate.

[0155] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure having a microlens composite structure further includes a spacer formed between the light-emitting platform and the microlens.

[0156] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a microlens composite structure, the height of the spacer is less than the height of the microlens.

[0157] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having a microlens composite structure, the semiconductor substrate is an IC substrate.

[0158] Some exemplary embodiments of this disclosure include a light-emitting structure, comprising: a light-emitting mesa; a microlens formed on the light-emitting mesa; and a diffractive lens covering the microlens.

[0159] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the material of the microlens is different from the material of the diffraction lens.

[0160] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the diffraction lens is a Bragg reflector.

[0161] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the center point of the top surface of the diffraction lens is located on the central axis of the microlens.

[0162] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the central axis of the diffraction lens is inclined relative to the vertical axis of the substrate perpendicular to the light-emitting structure, and the central axis of the microlens is vertical relative to the vertical axis of the substrate perpendicular to the light-emitting structure.

[0163] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the microlens has a hemispherical structure, and the diffractive lens has a polygonal structure or a composite structure.

[0164] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the composite structure includes a combination of a hemispherical structure and a trapezoidal structure or a hemispherical structure and a triangular structure.

[0165] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, a trapezoidal structure is formed at the bottom of the hemispherical structure, or a triangular structure is formed at the bottom of the hemispherical structure.

[0166] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the polygonal structure is a trapezoidal structure, which includes an inclined top surface relative to the bottom surface of the trapezoidal structure.

[0167] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the central axis of the microlens and the axis passing through the center point of the top surface of the diffraction lens are coaxially aligned with the central axis of the light-emitting platform.

[0168] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure further includes a semiconductor substrate and at least one reflector cup, wherein a light-emitting mesa is formed on the semiconductor substrate and the light-emitting mesa is surrounded by at least one reflector cup.

[0169] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the inner wall of the reflector cup is stepped.

[0170] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the light-emitting mesa includes: a light-emitting layer; a bottom bonding layer located at the bottom of the light-emitting layer and bonded to a semiconductor substrate; and a top electrode layer covering the light-emitting mesa and electrically connected to at least one reflector cup, wherein the at least one reflector cup is electrically connected to the semiconductor substrate.

[0171] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure further includes spacers covering the light-emitting platform.

[0172] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the height of the spacer is less than the height of the microlens.

[0173] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure, the semiconductor substrate is an IC substrate.

[0174] Some exemplary embodiments of this disclosure include a light-emitting structure having an off-axis microlens structure, comprising: a light-emitting platform; and at least one microlens formed above the light-emitting platform, wherein the central axis of the microlens is not coaxially aligned with the central axis of the light-emitting platform.

[0175] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having an off-axis microlens structure, the offset distance between the central axis of the microlens and the central axis of the light-emitting platform is no greater than 4.5 μm.

[0176] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having an off-axis microlens structure, the offset distance between the edge of the bottom surface of the light-emitting platform and the edge of the bottom surface of the microlens is within 30% of the diameter of the bottom surface of the first microlens.

[0177] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having an off-axis microlens structure, the material of the microlens is silicon oxide or an organic material.

[0178] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having an off-axis microlens structure, the bottom surface of the microlens intersects the central axis of the light-emitting platform.

[0179] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure having an off-axis microlens structure further includes a semiconductor substrate and a reflector cup, wherein a light-emitting mesa is formed on the semiconductor substrate and the light-emitting mesa is surrounded by the reflector cup.

[0180] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having an off-axis microlens structure, the inner wall of the reflector cup is stepped.

[0181] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having an off-axis microlens structure, the light-emitting mesa includes: a light-emitting layer; a bottom bonding layer located at the bottom of the light-emitting layer and bonded to a semiconductor substrate; and a top electrode layer covering the light-emitting mesa and electrically connected to a reflector cup, wherein the reflector cup is electrically connected to the semiconductor substrate.

[0182] In some exemplary embodiments or any combination of exemplary embodiments, the light-emitting structure having an off-axis microlens structure further includes a spacer formed between the light-emitting platform and the microlens.

[0183] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having an off-axis microlens structure, the height of the spacer is less than the height of the microlens.

[0184] In some exemplary embodiments or any combination of exemplary embodiments of the light-emitting structure having an off-axis microlens structure, the semiconductor substrate is an IC substrate.

[0185] The display devices and systems disclosed herein are designed to reduce viewing angles and light interference, thereby improving the luminous efficiency, resolution, and overall performance of the display system. Therefore, the implementation of this display system with a microlens array better meets the stringent display requirements for augmented reality (AR) and virtual reality (VR), head-up displays (HUDs), mobile device displays, wearable device displays, high-definition projectors, and automotive displays compared to conventional displays.

[0186] It should be noted that the various embodiments described above can be combined with any other embodiments described herein. The features and advantages described in the specification are not exhaustive; in particular, many additional features and advantages will be apparent to those skilled in the art from the drawings, specification, and claims. Furthermore, it should be noted that the language used in the specification is chosen primarily for readability and guidance purposes and is not intended to define or limit the subject matter of the invention. Attached Figure Description

[0187] To enable this disclosure to be understood in more detail, it can be described more specifically by referring to the features of various embodiments, some of which are illustrated in the accompanying drawings. However, these drawings only illustrate relevant features of this disclosure and should not be considered limiting, as the description may allow for other valid features.

[0188] For convenience, "up" refers to the substrate away from the light-emitting structure, and "down" refers to the substrate. Other directional terms, such as top, bottom, above, below, directly below, and under, are also explained accordingly.

[0189] Figure 1A A cross-sectional view of an exemplary light-emitting structure according to some embodiments is shown.

[0190] Figure 1B A method for fabricating a display panel with an integrated microlens array using top-down pattern transfer according to some embodiments is shown.

[0191] Figure 1C A method for fabricating a display panel with an integrated microlens array using top-down pattern transfer according to some embodiments is shown.

[0192] Figure 2A-2C Cross-sectional views of some exemplary embodiments of the reflector cup according to some embodiments are shown.

[0193] Figure 3 Illustrations are shown according to some embodiments Figure 1A A cross-sectional view of an exemplary structure of the light-emitting mesa on the substrate.

[0194] Figure 4 A cross-sectional view of an exemplary light-emitting structure having a microlens and an array of light-emitting mesa is shown according to some embodiments.

[0195] Figure 5 This is a top view of a light-emitting structure array system of off-axis arranged light-emitting platforms and microlenses according to some embodiments.

[0196] Figure 6 A cross-sectional view of a light-emitting structure array system according to some embodiments is shown, wherein the sensor is located at the center above the light-emitting structure array system.

[0197] Figure 7 A cross-sectional view of a light-emitting structure array system according to some embodiments is shown, wherein the sensor is located on one side or off-center above the light-emitting structure array system.

[0198] Figure 8 A cross-sectional view of an exemplary light-emitting structure having a microlens located within a large microlens, according to some embodiments, is shown, wherein the lateral dimension of the microlens is smaller than that of the large microlens.

[0199] Figures 9A-9D Illustrations are shown according to some embodiments Figure 8 Some exemplary simulation results of the light emitted by the large microlens of the light-emitting structure shown.

[0200] Figure 10A cross-sectional view of an exemplary light-emitting structure having a microlens located within a large microlens, according to some embodiments, is shown, wherein the lateral dimension of the microlens is smaller than that of the large microlens.

[0201] Figure 11A-11E Illustrations are shown according to some embodiments Figure 10 Some exemplary simulation results of the light emitted by the large microlens of the light-emitting structure shown.

[0202] Figure 12 A cross-sectional view of an exemplary light-emitting structure having a microlens located within a large microlens, according to some embodiments, is shown, wherein the lateral dimension of the microlens is smaller than that of the large microlens.

[0203] Figure 13 A cross-sectional view of an exemplary light-emitting structure having a microlens located within a large microlens, according to some embodiments, is shown, wherein the lateral dimension of the microlens is smaller than that of the large microlens.

[0204] Figures 14A-14B Illustrations are shown according to some embodiments Figure 13 Some exemplary simulation results of the light emitted by the large microlens of the light-emitting structure shown.

[0205] Figure 15 A cross-sectional view of an exemplary light-emitting structure according to some embodiments is shown, having a microlens located above a large microlens (or a microlens located further away on the light-emitting path of the light-emitting structure relative to the large microlens), wherein the lateral dimension of the microlens is smaller than that of the large microlens.

[0206] Figure 16 A cross-sectional view of an exemplary light-emitting structure according to some embodiments is shown, having a microlens located above a large microlens (or a microlens located further away on the light-emitting path of the light-emitting structure relative to the large microlens), wherein the lateral dimension of the microlens is smaller than that of the large microlens.

[0207] Figure 17 A cross-sectional view of an exemplary light-emitting structure according to some embodiments is shown, having a microlens located above a large microlens (or a microlens located further away on the light-emitting path of the light-emitting structure relative to the large microlens), wherein the lateral dimension of the microlens is smaller than that of the large microlens.

[0208] Figure 18 A cross-sectional view of an exemplary light-emitting structure according to some embodiments is shown, having a microlens located above a large microlens (or a microlens located further away on the light-emitting path of the light-emitting structure relative to the large microlens), wherein the lateral dimension of the microlens is smaller than that of the large microlens.

[0209] Figure 19 A cross-sectional view is shown of an exemplary light-emitting structure according to some embodiments, having at least two microlenses and a light-emitting stage, wherein at least one pair has a microlens located within a large microlens, wherein the lateral dimension of the microlens is smaller than that of the large microlens.

[0210] Figure 20 A cross-sectional view of an exemplary light-emitting structure according to some embodiments is shown, having at least two microlenses and a light-emitting stage, wherein at least one pair has a microlens located above a large microlens (or a microlens located further away on the light-emitting path of the light-emitting structure relative to the large microlens), wherein the lateral dimension of the microlens is smaller than that of the large microlens.

[0211] Figure 21 A cross-sectional view of an exemplary light-emitting structure having at least one microlens group and a light-emitting stage surface according to some embodiments is shown.

[0212] Figure 22 A cross-sectional view of an exemplary light-emitting structure having at least one microlens group and a light-emitting stage surface according to some embodiments is shown.

[0213] Figure 23 A cross-sectional view of an exemplary light-emitting structure having at least one microlens group and a light-emitting stage surface according to some embodiments is shown.

[0214] Figure 24 A cross-sectional view of an exemplary light-emitting structure having at least one microlens group and a light-emitting stage surface according to some embodiments is shown.

[0215] Figure 25 A cross-sectional view of an exemplary light-emitting structure having at least one microlens group and a light-emitting stage surface according to some embodiments is shown.

[0216] Figure 26 A cross-sectional view of an exemplary light-emitting structure having at least one microlens and a light-emitting stage surface according to some embodiments is shown.

[0217] Figure 27 A cross-sectional view is shown of an exemplary light-emitting structure according to some embodiments, having at least two microlenses and a light-emitting stage, wherein at least one of the microlenses has a notch portion covered by a reflective portion.

[0218] Figure 28 This is a top view of a micro LED display panel according to some embodiments.

[0219] As is common practice, the various features illustrated in the accompanying drawings may not be drawn to scale. Therefore, for clarity, the dimensions of the features may be arbitrarily expanded or reduced. Additionally, some drawings may not depict all parts of a given system, method, or apparatus. Finally, the same reference numerals may be used to denote similar features throughout the specification and drawings. Detailed Implementation

[0220] This document describes numerous details to provide a thorough understanding of the exemplary embodiments illustrated in the accompanying drawings. However, some embodiments may be practiced without these detailed descriptions, and the scope of the claims is limited only to those features and aspects specifically detailed in the claims. Furthermore, well-known methods, components, and materials have not been described exhaustively so as not to unnecessarily obscure relevant aspects of the embodiments described herein.

[0221] As mentioned above, in some examples, LED chips have a large divergence angle, which leads to various problems such as those discussed in the background section. Furthermore, in projection systems employing LED arrays with multiple LED chips as self-emissive imager devices, projection lenses or groups of projection lenses are required to project the image generated by the LED array, and these lenses can have a finite numerical aperture. Therefore, due to the large divergence angle of the LED chips, only a portion of the light emitted by the LED chips can be collected by the projection lenses. This reduces the brightness of the LED-based projection system and / or increases power consumption.

[0222] Embodiments consistent with this disclosure include an integrated display panel as a self-emitting imager device and a method of manufacturing the display panel. The integrated display panel includes a substrate with a pixel driver circuit array, a mesa array formed on the substrate including, for example, LED chips, and a microlens array formed above the mesa array. The display panel and the display panel-based projection system combine a light source, image forming function, and beam collimation function into a single monolithic device, and can overcome the shortcomings of conventional projection systems. Furthermore, the direction and focus of the light from the LEDs can be individually adjusted on each of the microlens array and the light-emitting mesa formed on the display panel.

[0223] Figure 1A A cross-sectional view of an exemplary light-emitting structure 100 according to some embodiments is shown. For convenience, "upper" refers to the area away from the substrate 110, and "lower" refers to the area towards the substrate 110. Other directional terms such as top, bottom, above, below, directly below, and under are also interpreted accordingly. The light-emitting structure 100 includes a light-emitting platform 101, such as... Figure 1AAs shown within the dashed rectangle. In some embodiments, the light-emitting mesa 101 includes at least one single-pixel light-emitting device, such as an LED or micro-LED, or an OLED, and light is emitted from the light-emitting mesa 101. The light-emitting mesa 101 has a top surface and a bottom surface. In some embodiments, the diameter or width of the top surface of the light-emitting mesa 101 is in the range of 1 μm–8 μm, while the diameter or width of the bottom surface of the light-emitting mesa 101 is in the range of 3 μm–10 μm. In some embodiments, the diameter or width of the top surface of the light-emitting mesa 101 is in the range of 8 μm–25 μm, while the diameter or width of the bottom surface of the light-emitting mesa 101 is in the range of 10 μm–35 μm. In some embodiments, the height of the light-emitting mesa 101 is in the range of 1–10 μm. In some embodiments, the height of the light-emitting mesa 101 is approximately 1.3 μm. In some embodiments, the diameter or width of the top surface of the light-emitting mesa 101 is equal to or greater than the diameter or width of the bottom surface of the light-emitting mesa 101.

[0224] In some embodiments, the display panel includes an array of individual pixel light-emitting devices, such as a light-emitting mesa 101. In some embodiments, the distance between the central axes of two adjacent light-emitting mesas is in the range of 1 μm–10 μm. In some embodiments, the distance between the central axes of two adjacent light-emitting mesas can vary from about 40 μm to about 20 μm, about 10 μm, and / or about 5 μm or less. In some embodiments, the size of the mesa and the distance between the light-emitting mesas can depend on the resolution of the display. For example, for a display panel with 5000 pixels per inch (PPI), the diameter or width of the top surface of the light-emitting mesa 101 is 1.5 μm, while the diameter or width of the bottom surface of the light-emitting mesa 101 is 2.7 μm. In some embodiments, the distance between the nearest bottom edges of two adjacent light-emitting mesas can be in the range of 1 μm–10 μm. In some embodiments, the distance between the nearest bottom edges of two adjacent light-emitting mesas is 2.3 μm.

[0225] In some exemplary embodiments, the light-emitting structure 100 further includes microlenses. For example... Figure 1A As shown, the light-emitting structure 100 may include a microlens 102 formed above the light-emitting mesa 101. In some embodiments, the microlens 102 is positioned relative to the light-emitting mesa 101 to reduce the divergence of light emitted from the light-emitting mesa 101 and to reduce the usable viewing angle of a single pixel LED device. Figure 1A As shown, the microlens 102 has a vertical central axis A-A', and the light-emitting platform 101 has a vertical central axis B-B'. The vertical central axis is perpendicular to the surface of the substrate 110. The central axis can refer to a straight line passing through any two center points of the pattern. For example, the central axis of the microlens 102 (i.e., the central axis A-A') passes through the center point of the top surface of the microlens 102 and the center point of the bottom surface of the microlens 102.

[0226] In some embodiments, the microlens 102 is stacked off-axis on the light-emitting platform 101, meaning that the central axis A-A' of the microlens 102 is not coaxially aligned, overlapped, or coincident with the central axis B-B' of the light-emitting platform 101. In some embodiments, the horizontal distance between the central axis A-A' of the microlens 102 and the central axis B-B' of the light-emitting platform 101 is at least 1 μm, 2 μm, 5 μm, or 10 μm. In some embodiments, the horizontal distance between the central axis A-A' of the microlens 102 and the central axis B-B' of the light-emitting platform 101 does not exceed 4.5 μm. In some cases, the horizontal offset distance may be less than half the bottom diameter of the light-emitting platform 101 and less than one-quarter of the bottom diameter of the light-emitting platform 101. Therefore, divergence can be reduced and the usable viewing angle can be reduced to a level that allows displays and panels using single-pixel LED devices to be seen by several users. This can also reduce power consumption, improve brightness, and / or appropriately protect user privacy in public areas.

[0227] In some other embodiments ( Figure 1A (Not shown in the image) Microlens 102 is coaxially aligned with the light-emitting platform 101 along the A-A' direction, and the horizontal distance between the central axis A-A' of microlens 102 and the central axis B-B' of light-emitting platform 101 is 0. All light emitted from the light-emitting platform 101 can directly reach and pass through microlens 102. Therefore, when the central axis A-A' of microlens 102 and the central axis B-B' of light-emitting platform 101 are the same, divergence can be reduced, and the usable viewing angle can be reduced to the level that a display and panel using a single-pixel LED device can see from the user's line of sight perpendicular to the surface of the display and panel. This can also reduce power loss, increase brightness, and / or better protect user privacy in public areas. In another example, a portion of the light emitted from the light-emitting platform 101 can directly reach and pass through microlens 102, while another portion of the light emitted from the light-emitting center can bypass or avoid microlens 102. Therefore, the brightness of the light-emitting structure can be adjusted.

[0228] In some embodiments, the structure of a microlens may include an element having a planar surface and a convex surface. For example, such as Figure 1AAs shown, the structure of the microlens 102 can be hemispherical. The structure of the microlens 102 can also be semi-ellipsoidal, semi-oval, or other single element having a plane and a convex surface. In some embodiments, the structure of the microlens 102 can also be a polygonal structure or a composite structure. For example, a composite structure can include a hemisphere and a cylinder located below the plane of the hemisphere. As another example, a composite structure can be composed of a quarter-sphere and a quarter-ellipsoid. In this example, the radius of the sphere can not exceed 9 μm, and the major radius of the ellipsoid can not exceed 18 μm. However, in some embodiments, the microlens can have a triangular or rectangular coverage area while also having a curved surface.

[0229] In some embodiments, the microlens may further include a reflective portion capable of adjusting the optical path. For example, the microlens 102 may include an inclined surface formed on one side of the surface of the microlens 101, and the reflective portion may be formed on the inclined surface. In one example, the reflective portion may be a plane attached to the inclined surface. In another example, the reflective portion may be a curved or wavy surface.

[0230] In some embodiments, the material of the microlens may include an inorganic or plastic (organic) material that is transparent to the light emitted by the light-emitting structure 100. For example, a preferred material for the microlens 102 may be silicon oxide. In some embodiments, the inorganic material includes silicon oxide, silicon nitride, silicon carbide, titanium oxide, zirconium oxide, alumina, phosphosilicate glass (PSG), or borosilicate glass, or any combination thereof. In some embodiments, the plastic material includes polymers such as SU-8, PermiNex, benzocyclobutene (BCB), or transparent plastics (resins) including spin-coated glass (SOG), or Micro-Rest's bonding adhesive BCL-1200, or any combination thereof.

[0231] In some embodiments, microlenses composed of inorganic or organic materials are formed by mask patterning, photolithography, and then etching. In some embodiments, microlenses composed of organic materials are formed by mask patterning, photolithography, and then reflowing at high temperature.

[0232] In some embodiments, a first method for fabricating a microlens includes the step of directly depositing a microlens material layer on top of a pixel light source and making the microlens material layer in direct physical contact with the pixel light source. In some embodiments, the shape of the microlens material layer conforms to the shape of the pixel light source and forms a hemisphere on the pixel light source. In some embodiments, the top of the pixel light source is generally flat, and the formed microlens 102 is generally hemispherical. In some embodiments, the microlens material layer is directly deposited on the surface of the pixel light source, such as the planarized surface of a single-pixel tri-color LED device, using chemical vapor deposition (CVD) technology. In some embodiments, the deposition parameters for the CVD process are: power from about 0 W to about 1000 W, pressure from about 100 mTorr to about 2000 mTorr, and temperature from about 23°C. o C to approximately 500 o C. The airflow is from about 0 to about 3000 sccm (standard cubic centimeters per minute), and the time is from about 1 hour to about 3 hours. In some embodiments, the material of the microlens material layer is a dielectric material such as silicon dioxide.

[0233] In some embodiments, the first method for fabricating a microlens further includes the step of patterning a microlens material layer to expose an electrode region of a substrate. In some embodiments, the step of patterning the microlens material layer includes an etching step. In some embodiments, the etching step includes the step of forming a mask on the surface of the microlens material. The etching step further includes patterning the mask by a photolithography process to form an opening in the mask and expose the microlens material layer above the electrode region of the pixel light source. The etching step further includes the step of etching the portion of the microlens material layer exposed by the opening protected by the mask. In some embodiments, the exposed microlens material layer is etched by a wet etching method.

[0234] In some embodiments, a second method for fabricating a microlens may further include an optional step of forming a marker layer with markings for alignment with a microlens material layer deposited in subsequent steps. For example, the formed marker layer aligns the units of the luminescent pixels with the microlens material layer to form a microlens at the center of the pixel light source. In some embodiments, the formed marker layer aligns the pixel light source with layers above it, particularly the microlens material layer, to form a microlens on top of the pixel light source.

[0235] A second method for fabricating microlenses also includes the step of depositing a layer of microlens material directly on top of at least one pixel light source. Figure 1B-1C Further illustrated is a method for fabricating a display panel with an integrated microlens array using top-down pattern transfer, according to some embodiments. In some embodiments, such as Figure 1BAs shown, a microlens material layer 1145 covers the top of the pixel light source 1106M, and the top surface of the microlens material layer 1145 is flat. In some embodiments, the microlens material layer 1145 is deposited on the top of the pixel light source array 1106 by spin coating. In some embodiments, the material of the microlens material layer 1145 is photoresist. In some embodiments, the material of the microlens material layer 1145 is a dielectric material such as silicon oxide.

[0236] A second method for fabricating microlenses also includes top-down patterning of microlens material layers, thereby... Figure 1B-1C The step of forming at least one hemisphere in the microlens material layer is illustrated. In some embodiments, patterning does not need to penetrate or etch to the bottom of the microlens material layer 1145. In some embodiments, the hemisphere of the microlens 1120 is positioned above at least one pixel light source 1106M.

[0237] In some embodiments, the step of patterning the microlens material layer from top to bottom further includes, for example, Figure 1B The first step shown is depositing a mask layer 1130 on the surface of the microlens material layer 1145.

[0238] The top-down patterning of the microlens material layer further includes a second step of patterning the mask layer 1130 to form a hemispherical pattern in the mask layer 1130. In some examples, the mask layer 1130 is first patterned by a photolithography process and then by a reflow process. In some embodiments, the photosensitive polymer mask layer 1130 is patterned into isolated cells 1140, as shown in... Figure 1B The dashed rectangular units in the diagram are prepared for the formation of a hemispherical pattern. As an example, the isolated units 1140 are patterned and formed using a photolithography process. The patterned photosensitive polymer mask layer 1150 with the isolated units 1140 is then formed into a hemispherical pattern 1160 via a high-temperature reflow process. In one method, the isolated units 1140 are formed into the isolated hemispherical pattern 1160 via high-temperature reflow. In some embodiments, the isolated hemispherical pattern 1160 of a pixel does not directly physically contact the hemispherical patterns of adjacent pixels. In some embodiments, the hemispherical pattern 1160 of a pixel only contacts the hemispherical patterns of adjacent pixels at the bottom of the hemispherical pattern 1160. The patterned photosensitive polymer mask layer 1150 is heated to a temperature above the melting point of the polymer material for a certain period of time. After the polymer material melts into a liquefied state, the surface tension of the liquefied material causes it to take on a shape with a smooth curved surface. For a cell with a circular base of radius R, when the cell height is 2R / 3, the hemispherical shape / pattern will be formed after the reflow process. Figure 1BA display panel with an array of hemispherical patterns 1160 integrated after a high-temperature reflow process is shown. In some embodiments, the hemispherical patterns in the mask layer can be formed by other fabrication methods, including the fabrication method for microlenses described in the first method for fabricating microlenses. In some other embodiments, the hemispherical patterns in the mask layer can be formed using grayscale mask photolithography exposure. In some other embodiments, the hemispherical patterns in the mask layer can be formed via a molding / imprinting process.

[0239] The top-down patterning of the microlens material layer also includes a third step of using the hemispherical pattern 1160 as a mask to etch the microlens material layer 1145 to form hemispheres in the microlens material layer 1145. In some examples, the etching of the microlens material layer 1145 is performed using a photolithography process. In some examples, the etching of the microlens material layer 1145 is performed using a process such as... Figure 1B Dry etching, such as plasma etching process 1135, is shown. In some embodiments, after the microlens material layer 1145 is etched, the microlens material layer 1145 is not etched through to expose the top surface of the pixel light source 1106M, such as... Figure 1B-1C As shown, the spacer 1170 is formed on top of or covers the top of the pixel light source 1106M, such as... Figure 1C As shown.

[0240] A second method for fabricating microlenses also includes patterning the microlens material layer to expose the electrode region of the substrate (in Figure 1C (Not shown in the image). In some embodiments, the step of patterning the microlens material layer includes an etching step. In some embodiments, the etching step includes forming a mask on the surface of the microlens material. The etching step further includes patterning the mask using a photolithography process to form an opening in the mask that exposes the microlens material layer above the electrode region of the pixel light source. The etching step further includes etching the exposed microlens material layer protected by the mask. In some embodiments, the exposed microlens material layer is etched using a wet etching method. In some embodiments, the opening for the electrode is located outside the display array region.

[0241] As mentioned above, Figures 1B to 1C Various fabrication methods for forming display panels integrated with microlens arrays are illustrated. It should be understood that these are merely examples, and other fabrication techniques may also be used.

[0242] While the detailed description includes many details, these should not be construed as limiting the scope of the invention but merely as illustrating different examples and aspects of the invention. It should be understood that the scope of the invention includes other embodiments not discussed in detail above. For example, microlenses with bases of different shapes, such as square bases or other polygonal bases, may also be used.

[0243] In some exemplary embodiments, the light-emitting structure 100 may further include spacers covering the light-emitting mesa. For example, as... Figure 1A As shown, the light-emitting structure 100 may include a spacer 108 covering the light-emitting mesa 101. The spacer 108 may be an optically transparent layer formed to provide a suitable spacing between the microlens 102 and the light-emitting mesa 101. Therefore, light emitted from the light-emitting mesa 101 can pass through the spacer 108 and then reach the microlens 102. In some embodiments, the spacer 108 may also fill the area surrounding the light-emitting mesa 101 and increase the refractive index of the medium surrounding the light-emitting mesa 101. Therefore, the spacer 108 can change the optical path of the light emitted from the light-emitting mesa 101. In some embodiments, the spacer 108 may be located between the light-emitting mesa 101 and the microlens 102. In some embodiments, the top surface of the spacer 108 may be planarized. In some embodiments, the spacer 108 may be formed directly on the surface of the planarized insulating layer 109, such as... Figure 1A As shown. In some embodiments, the spacer 108 may cover a conductive layer (such as...) Figure 1A The conductive layer 115 shown is exposed on its top surface and in contact with it. In some embodiments, the spacer 108 may be integrated with the microlens 102. In some embodiments, the spacer 108 may be the same as or a portion of the planarized insulating layer 109 and integrated with the planarized insulating layer 109.

[0244] In some embodiments, spacer 108 extends the light path emitted by the light-emitting mesa 101. In some embodiments, spacer 108 alters the light path emitted by an individual pixel LED device by making the light emitted by the LED device more focused or more diffused, as required by design.

[0245] In some embodiments, the size of the bottom surface of the microlens 102 may be smaller than the size of the bottom surface of the light-emitting stage 101. In some embodiments, the size of the bottom surface of the microlens 102 may be equal to or larger than the size of the bottom surface of the light-emitting stage 101, such as... Figure 1A As shown.

[0246] In some embodiments, the spacer 108 may be made of a variety of materials that are transparent to the wavelength emitted by the light-emitting mesa 101. Examples of transparent materials for the spacer 108 include polymers, dielectrics, and semiconductors. In some embodiments, the spacer 108 may include one or more dielectric materials. In some embodiments, the dielectric material includes one or more materials such as silicon oxide, silicon nitride, silicon carbide, titanium oxide, zirconium oxide, and aluminum oxide. In some embodiments, the spacer 108 is made of photoresist. In some embodiments, the spacer 108 and the microlens 102 have the same material. In some embodiments, the spacer 108 and the microlens 102 have different materials.

[0247] In some exemplary embodiments, the height of the spacer may be smaller than the height of the microlens. For example, as... Figure 1A As shown, the height of the spacer 108 may be less than the height of the microlens 102. In some exemplary embodiments, the height of the spacer 108 may be equal to or greater than the height of the microlens 102. In some embodiments, the height of the spacer formed between a light-emitting platform and a microlens may not be equal to the height of the spacer formed between another light-emitting platform and another microlens within the same display panel. In other embodiments, the height of the spacer formed between a light-emitting platform and a microlens may be non-uniform. For example, regarding the height of the spacer formed between the light-emitting platform 101 and the first microlens 102, the height of the spacer at the central axis A-A' may be less than the height of the spacer at the central axis B-B'.

[0248] In some exemplary embodiments, the light-emitting structure 100 may further include a semiconductor substrate and at least one reflector. The light-emitting mesa may be formed on the semiconductor substrate, and the edge / edge surface of the light-emitting mesa may be surrounded by at least one reflector. The reflector is a structure positioned relative to the light-emitting mesa 101 to reflect light emitted from the light-emitting mesa 101 in a substantially upward direction. In some embodiments, the reflector forms a circular sidewall around the light-emitting mesa 101 and includes multiple components, such as reflector components 111 and 112. For example, as... Figure 1A As shown, the light-emitting structure 100 may include a semiconductor substrate 110 and reflector components 111112. A light-emitting mesa 101 may be formed on the semiconductor substrate 110 and surrounded by reflector components 111 and 112. Reflector components 111 and 112 may be formed on the semiconductor substrate 110.

[0249] In some exemplary embodiments, the semiconductor substrate 110 may be an integrated circuit (IC) substrate. The light-emitting mesa may be driven individually or collectively by the IC. In some embodiments, the semiconductor substrate 110 may be another conductive substrate.

[0250] In some embodiments, reflector components 111 and 112 can isolate at least some or substantially all of the light emitted by the light-emitting platform 101. For example, as Figure 1A As shown, when the height of reflector components 111 and 112 is greater than the height of the light-emitting platform 101, reflector components 111 and 112 can prevent some or substantially all of the light emitted by adjacent light-emitting platforms around the light-emitting platform 101 from interfering with the light emitted by the light-emitting platform 101. Therefore, reflector components 111 and 112 can suppress inter-pixel optical crosstalk and improve the overall contrast of the LED display using the light-emitting structure 100. In some embodiments, reflection from the reflector cups can also increase light emission efficiency and brightness by focusing the light emission in a specific direction. For example, some light emitted by the light-emitting platform 101 can reach reflector components 111 and 112 and be reflected upwards by them.

[0251] In some embodiments, the height of reflector components 111 and 112 may be greater than the height of the light-emitting platform 101. In some embodiments, the height of reflector components 111 and 112 may be equal to or less than the height of the light-emitting platform 101. In some embodiments, the height of reflector components 111 and 112 may be between 0.5 micrometers and 50 micrometers. In some embodiments, the height of reflector components 111 and 112 may be between 1 micrometer and 20 micrometers. In some embodiments, the height of reflector components 111 and 112 may be between 2 micrometers and 10 micrometers. In a preferred embodiment, the height of reflector components 111 and 112 is approximately 2.5 micrometers, while the height of the light-emitting platform 101 is approximately 1.9 micrometers. In some embodiments, the height of the reflectors may vary. For example, the height of reflector component 111 may be different from the height of reflector component 112.

[0252] In some embodiments, the top surface of the spacer 108 may be above the top surfaces of the reflector components 111 and 112. In some embodiments, the top surface of the spacer 108 may be at the same height as or below the top surfaces of the reflector components 111 and 112. In some embodiments, the top surface of the spacer 108 may be at the same height as or below the top surface of the reflector component 111, but above the top surface of the reflector component 112.

[0253] The inner wall of the reflector cup can refer to the surface facing the light-emitting platform. For example, as... Figure 1A As shown, the inner wall 113 of reflector component 111 and the inner wall 114 of reflector component 112 can face the light-emitting platform 101. The shape of the inner wall of the reflector can be various. In some embodiments, the inner wall of the reflector can be straight, such as... Figure 1AThe inner sidewalls 113 and 114 are shown. In some embodiments, the steepness of the inner sidewalls of the reflector cup components 111 and 112 can be designed to reduce the divergence of light emitted from the light-emitting platform 101. For example, the angle of the inner sidewall of reflector cup 111 relative to the vertical axis perpendicular to the semiconductor substrate 110 can be from at least 5 degrees to at most 75 degrees. In another example, the angle of the inner sidewall of reflector cup 111 relative to the vertical axis perpendicular to the semiconductor substrate 110 can be from at least 10 degrees to at most 50 degrees.

[0254] In some embodiments, the inner wall of the reflector cup may be curved, wavy, multi-lined, or a combination thereof. The detailed structure of the inner wall of the reflector cup will be described below. Figure 2A Some exemplary embodiments in –2C are further described.

[0255] In some embodiments, the reflector may include a metal. In some embodiments, the reflector may include a dielectric material such as silicon oxide. In some embodiments, the reflector may include a photosensitive dielectric material. In some embodiments, the photosensitive dielectric material may include SU-8, photosensitive polyimide (PSPI), or benzocyclobutene (BCB). In other embodiments, the reflector may include a photoresist material.

[0256] In some exemplary embodiments, the light-emitting mesa 101 may include a conductive electrode layer 115 as a cover layer on top of the light-emitting mesa 101. In some embodiments, the light-emitting mesa 101 includes a light-emitting layer 120. Generally, the LED light-emitting layer includes a PN junction / diode having a p-type region / layer and an n-type region / layer, and an active layer between the p-type region / layer and the n-type region / layer.

[0257] The conductive electrode layer can be electrically connected to the reflector cups including reflector cup components 111 and 112, and can be further electrically connected to a light-emitting layer, such as the light-emitting layer 120 of the light-emitting platform 101. In one example, such as Figure 1A As shown, the conductive electrode layer 115 can be electrically connected to the bottom of each reflector component 111 and 112, respectively. In another example, Figure 1ANot shown, the conductive electrode layer 115 may be electrically connected to the top of each reflector component 111 and 112, respectively. The conductive electrode layer may cover the light-emitting layer 120 and be further electrically connected to the light-emitting layer 120 on its top. In another example, the conductive electrode layer 115 may be electrically connected to the inner sidewalls of each of the reflector components 111 and 112, such as 113 and 114. In some embodiments, the conductive electrode layer 115 may be formed between the light-emitting layer 120 and the microlens 102. In some embodiments, the conductive electrode layer 115 may be formed between the spacer 108 and the light-emitting layer 120. In some embodiments, the conductive electrode layer 115 may be made of a material such as graphene, indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), or fluorine-doped tin oxide (FTO), or any combination thereof. In some embodiments, the conductive electrode layer 115 may be transparent, and some light emitted by the light-emitting layer 120 may pass through the conductive electrode layer 115.

[0258] In some exemplary embodiments, the light-emitting mesa 101 may further include one or more metal bonding layers (e.g., metal bonding layer 116) formed on the semiconductor substrate 110. The metal bonding layers may be electrically connected to the light-emitting mesa 101. For example, as... Figure 1A As shown, the light-emitting mesa 101 may include a metal bonding layer 116 located at the bottom of the light-emitting mesa 101. The metal bonding layer 116 may be formed on the semiconductor substrate 110. The metal bonding layer 116 may be further formed at the bottom of the light-emitting mesa 101 and electrically connected to the light-emitting layer 120. In some embodiments, the metal bonding layer 116 has a sloped side surface. This sloped side surface makes it easier for different connectors to connect to the LED light-emitting layer, prevents those connectors from disconnecting due to sharp angles, and enhances the overall stability of the device. In some embodiments, the metal bonding layer 116 may also function as a reflector to reflect light emitted by the upper LED layer.

[0259] In some embodiments, the metal bonding layer 116 is electrically connected to a driver circuit on the semiconductor substrate 110 and a light-emitting layer 120 above the metal bonding layer 116, functioning similarly to a P-electrode. In some embodiments, the thickness of the metal bonding layer 116 is from about 0.1 micrometers to about 3 micrometers. In other embodiments, the thickness of the metal bonding layer 116 is about 0.3 micrometers. The metal bonding layer 116 may include an ohmic contact layer and a metal bonding layer. In some embodiments, the metal bonding layer 116 may include two metal layers. One of the metal layers may be deposited on a layer above the metal bonding layer within the light-emitting structure 100. A corresponding bonding metal layer may also be deposited on the semiconductor substrate 110.

[0260] In some embodiments, the composition of the metal bonding layer 116 includes Au-Au bonding, Au-Sn bonding, Au-In bonding, Ti-Ti bonding, Cu-Cu bonding, or a mixture thereof. For example, if Au-Au bonding is chosen, each of the two Au layers requires a Cr coating as an adhesive layer and a Pt coating as an anti-diffusion layer. The Pt coating is located between the Au layer and the Cr layer. The Cr layer and the Pt layer are located at the top and bottom of the two bonded Au layers. In some embodiments, when the two Au layers are of approximately the same thickness, the Au on the two layers diffuses into each other under high pressure and high temperature, bonding the two layers together. Eutectic bonding, hot-press bonding, and transient liquid phase (TLP) bonding are example techniques that can be used.

[0261] In some exemplary embodiments, the light-emitting structure 100 may further include isolation structures, such as 118 between the light-emitting mesas, such as the light-emitting mesas 101, on the substrate 110. The isolation structures 118 are formed on the substrate 110. In some embodiments, the isolation structures 118 are thinner than the bonding layer 116. In some embodiments, the isolation structures 118 are made of a dielectric material such as SiO2. In some embodiments, the dielectric material of the isolation structures 118 may be an inorganic or organic material.

[0262] In some exemplary embodiments, the light-emitting structure 100 may further include an insulating layer 117 on the surface of the light-emitting layer 120 and on the surfaces of the isolation structure 118 and the bonding layer 116. In some embodiments, a conductive electrode layer 115 is then formed on the surface of the insulating layer 117. In some embodiments, the insulating layer 117 is made of a dielectric material such as SiO2. In some embodiments, the dielectric material of the insulating layer 117 may be an inorganic or organic material.

[0263] Figure 2A-2C Cross-sectional views of some exemplary embodiments of the reflector cup according to some embodiments are shown, which can correspond to Figure 1A The reflector cup components 111 and / or 112 in the middle. In some embodiments, such as Figure 2A As shown, the reflector 201 may include an inner sidewall 201a facing the light-emitting platform 101. The inner sidewall 201a may be curved to reflect some of the light emitted from the light-emitting platform 101 upwards. In some embodiments, such as Figure 2BAs shown, the inner sidewalls of the reflector cup 202 can be multi-lined, including sub-inner sidewalls 202A, 202B, and 202C. The sub-inner sidewalls 202A, 202B, and 202C face the light-emitting platform 101, such that some light emitted from the light-emitting platform can be reflected upwards by the sub-inner sidewalls 202A, 202B, and 202C. Each sub-inner sidewall can also adjust the focal point of light emitted in different patterns (particularly horizontally). In some embodiments, the steepness (the angle of the inner sidewall of the reflector cup relative to the vertical axis perpendicular to the semiconductor substrate 110) of each sub-inner sidewall from bottom to top of the reflector cup 202 can gradually increase. In other embodiments, the steepness of each sub-inner sidewall from bottom to top of the reflector cup 202 can gradually decrease. In other embodiments, the steepness of each sub-inner wall (relative to the bottom of the reflector cup 202) from the bottom to the top of the reflector cup 202 can be randomly selected.

[0264] However, in some embodiments, such as Figure 2C As shown, the inner wall of reflector 203 can be stepped. Reflector 203 may include one or more stepped structures (e.g., stepped structures 203-1, 203-2, and 203-3). Each of the one or more stepped structures may include sub-inner walls (e.g., sub-inner walls 203a, 203b, and 203c, respectively). Similar to reflector 202 described above, reflector 203 may also reflect some of the light emitted from the luminous platform upwards, and the focus of the light emitted in different patterns (especially horizontally) can be adjusted, for example, by changing the steepness and height of each sub-inner wall.

[0265] In some embodiments, the reflector cup can be fabricated by a combination of deposition, photolithography, and etching processes. In some embodiments, the reflector cup can be fabricated by other suitable methods. In one example, the reflector cup can be fabricated by the following steps: 1) the PSPI is formed into a reflector cup shape by photolithography; 2) a metal layer (Pt, Rh, Al, Au, Ag), a TiO2 / SiO2 stack (distributed Bragg reflector (DBR)), or any other layer (ODR) with total internal reflection properties is deposited on the entire surface by vapor deposition; and 3) the reflective layer is masked by photoresist while the reflective layer on another area is etched, thereby exposing the light-emitting area to air. In another example, the reflector cup can be prepared by the following steps: 1) depositing or spin-coating an isolation layer (SiO2, SiN, or SU8) thicker than the light-emitting structure onto the light-emitting structure; 2) using photoresist as a mask to etch the shape of the reflector cup into the isolation layer; 3) depositing a metal layer (Pt, Rh, Al, Au, Ag), a TiO2 / SiO2 stack (DBR), or any other layer (ODR) with total internal reflection properties over the entire surface by vapor deposition; and 4) masking the reflective layer with photoresist while etching the reflective layer in another area, thereby exposing the light-emitting area.

[0266] In some embodiments, the reflector cup may further include one or more reflective coatings. The one or more reflective coatings may be disposed on one or more inner sidewalls of the reflector cup, such as inner sidewalls 113, 114 and 201a, sub-inner sidewalls 202A, 202B and 202C, and sub-inner sidewalls 203a, 203b and 203c. The bottom of each of the one or more reflective coatings does not contact the light-emitting platform, for example, as shown in the figure. Figure 1A The light-emitting mesa 101 described herein (not shown in Figure 2). One or more reflective coatings can reflect the light emitted from the light-emitting mesa, thereby enhancing the brightness and luminous efficacy of the micro-LED panel or display. For example, the light emitted from the light-emitting mesa can reach one or more reflective coatings and can be reflected upwards by one or more reflective coatings.

[0267] In some embodiments, one or more reflective coatings, together with a reflector cup, can utilize the reflection direction and / or reflection intensity of light emitted from the light-emitting mesa. For example, the inner sidewalls 203a, 203b, and 203c can be tilted at a certain angle; therefore, one or more reflective coatings disposed on the inner sidewalls 203a, 203b, and 203c are tilted at the same angle as the inner sidewalls 203a, 203b, and 203c. When light emitted from the light-emitting mesa reaches one or more reflective coatings, the light emitted from the light-emitting mesa will be reflected by one or more reflective coatings at the angles of the inner sidewalls 203a, 203b, and 203c.

[0268] One or more reflective coatings may be made of highly reflective materials, having a reflectivity greater than 60%, 70%, or 80%, so that most of the light emitted by the luminescent platform can be reflected. In some embodiments, one or more reflective coatings may include one or more metallic conductive materials with high reflectivity. In these embodiments, the one or more metallic conductive materials may include one or more of aluminum, gold, or silver. In other embodiments, one or more reflective coatings may be multilayered. More specifically, one or more reflective coatings may include one or more stacked reflective material layers and one or more dielectric material layers. For example, one or more reflective coatings may include one reflective material layer and one dielectric material layer. In some other embodiments, one or more reflective coatings may include two reflective material layers and a dielectric material layer located between the two reflective material layers. However, in some other embodiments, one or more reflective coatings may include two dielectric material layers and a reflective material layer located between the two dielectric material layers. In some embodiments, the multilayer structure may include two or more metal layers, which may include one or more of TiAu, CrAl, or TiWAg.

[0269] In some embodiments, one or more reflective coatings may be multilayer omnidirectional reflectors (ODRs), including a metal layer and a transparent conductive oxide (TCO) layer. For example, the multilayer structure may include a dielectric material layer, a metal layer, and a TCO layer. In some embodiments, one or more reflective coatings may include two or more dielectric material layers, alternately arranged to form a dielectric barrier (DBR). For example, one or more reflective coatings may include a dielectric material layer, a metal layer, and a transparent dielectric layer. The transparent dielectric layer may include one or more of SiO2, Si3N4, Al2O3, or TiO2. One or more reflective coatings may further include a dielectric material layer, a TCO, and a DBR. In other embodiments, one or more reflective coatings may include one or more metallic conductive materials with high reflectivity. In these embodiments, the one or more metallic conductive materials may include one or more of aluminum, gold, or silver.

[0270] In some embodiments, one or more reflective coatings may be conductive, and then one or more reflective coatings may also function as electrical contacts with the light-emitting structure 100. For example, the light-emitting mesa 101 may be electrically connected to one or more reflective coatings. One or more reflective coatings may be patterned to not block light emitted from the light-emitting mesa. One or more reflective coatings may then also function as common electrodes for LED devices and / or individual LEDs on the display panel.

[0271] Figure 3 The figure illustrates some embodiments. Figure 1A Cross-sectional view 300 of an exemplary structure of the light-emitting mesa 101 on the substrate 110. (See figure 300) Figure 1A As shown, the light-emitting mesa 101 may include at least one light-emitting layer (e.g., light-emitting layer 120) and a bottom bonding layer (e.g., bottom bonding layer 116) located at the bottom of the light-emitting layer 120 and bonded to the semiconductor substrate 110. In some embodiments, the light-emitting mesa 101 includes a top electrode layer (e.g., top electrode layer 115) covering the light-emitting layer 120 and electrically connected to at least one reflector (e.g., reflector components 111 and / or 112), such as... Figure 1A As shown. In some embodiments, at least one reflector (e.g., reflector component 111 or 112) may be electrically connected to the semiconductor substrate 110. For example, as Figure 3 As shown, the light-emitting mesa 101 may include a light-emitting layer 120, a bottom bonding layer 116 located at the bottom of the light-emitting layer 120 and bonded to the semiconductor substrate 110, and a top electrode layer 115 covering the light-emitting layer 120 and electrically connected to at least one of the reflectors 111 and / or 112 (as described in Figures 1 to 2). Figure 3 (Not shown in the image).

[0272] In some embodiments, the light-emitting layer 120 may emit green, blue, or red light. The light emitted by the light-emitting layer 120 may pass through and / or bypass the top electrode layer 115 and reach the microlens 102 (e.g., ...). Figure 1A As described, Figure 3 (Not shown in the image). The light emitted by the light-emitting layer 120 can also reach at least one of the reflectors 111 and / or 112 and be reflected upwards to the microlens 102 or / and another lens (not shown in the image). Figure 3 (Not shown in the image). In some embodiments, the light-emitting platform 101 may include two or more light-emitting layers emitting different colors. The two or more light-emitting layers may be vertically stacked or arranged parallel to each other on the same layer. For example, a light-emitting layer emitting green light may be disposed above a light-emitting layer emitting red light; or a light-emitting layer emitting green light may be arranged horizontally parallel to a light-emitting layer emitting red light. In some embodiments, the light-emitting structure 100 may include two or more light-emitting platforms. In some embodiments, each light-emitting platform may include at least one light-emitting layer emitting different colors. When two light-emitting platforms are located within the light-emitting structure 100, two colors and combinations of two colors can be emitted from the light-emitting structure 100. When three light-emitting platforms are located within the light-emitting structure 100, three colors and combinations of three colors can be emitted from the light-emitting structure 100.

[0273] In some embodiments, the light-emitting layer, such as 301, may comprise a plurality of epitaxial sublayers with different compositions. Examples of LED epitaxial layers may include III-V nitride, III-V arsenide, III-V phosphide, and III-V antimonide epitaxial structures. Examples of microLEDs may include GaN-based UV / blue / green microLEDs, AlInGaP-based red / orange microLEDs, and GaAs or InP-based infrared (IR) microLEDs.

[0274] In some embodiments, the bottom bonding layer 116 may be a metal layer or a conductive transparent layer, such as an ITO layer, formed at the bottom of the light-emitting layer 120 to improve conductivity and transparency. In some embodiments, when there is more than one light-emitting layer within the light-emitting mesa, the light-emitting layers are bonded together through corresponding bonding layers between them. Light emitted by a light-emitting layer can pass through the bonding layer above the current light-emitting layer and be reflected by the bonding layer below the current light-emitting layer. In some embodiments, the bottom bonding layer 116 is bonded to the semiconductor substrate 110.

[0275] In some embodiments, the top electrode layer 115 may be a metal layer or a conductive transparent layer, such as an ITO layer, formed on the light-emitting layer 120 to improve conductivity and transparency. Additionally, in some embodiments, each light-emitting layer has additional conductive layers at its bottom and top, such as a conductive layer 302 at the bottom of the light-emitting layer 120 and a conductive layer 303 at the top of the light-emitting layer 120. Each conductive layer is electrically connected to an IC circuit within the top electrode layer or substrate. The top electrode layer 115 may be electrically connected to another circuit or component. In some embodiments, a contact pad 304 may be provided, such as... Figure 3 As shown, it is located between the top electrode layer 115 and the conductive layer 303. The contact pad 304 can be made of materials such as graphene, ITO, TCO, AZO, or FTO, or any combination thereof. In some embodiments, the conductive layer 303 can be electrically connected to at least one reflector cup via the conductive electrode layer 115 (e.g., Figure 1A (As described).

[0276] In some embodiments, a reflective layer, such as reflective layer 301, may be located above the bottom bonding layer 116 and at the bottom of each light-emitting layer, such as light-emitting layer 120. In some embodiments, a reflective layer, such as reflective layer 301, may be located below a conductive layer, such as conductive layer 302, and at the bottom of each light-emitting layer, such as light-emitting layer 120. The reflective layer can improve light transmission efficiency. For example, light emitted by light-emitting layer 120 can be reflected by reflective layer 301. In some embodiments, the material of the reflective layer may have a high reflectivity, particularly for light emitted by the light-emitting layer above the current reflective layer. For example, the reflective layer has a reflectivity greater than 60%. In another example, the reflective layer has a reflectivity greater than 70%. In yet another example, the reflective layer has a reflectivity greater than 80%. In some embodiments, the material of the reflective layer may be one or more metals selected from Rh, Al, Ag, and Au. In some embodiments, the reflective layer may include at least two sublayers with different refractive indices. Each sublayer also has a high reflectivity, such as greater than 60%, 70%, or 80%. In some embodiments, the reflective layer may include a DBR structure. For example, the reflective layer may be formed from multiple layers of alternating or different materials with different refractive indices. In some cases, the boundaries of each layer in a DBR structure cause partial reflection of light waves. A reflective layer can be used to reflect selected wavelengths. In some embodiments, the reflective layer can be made of multiple layers, for example, at least two layers of SiO2 and Ti3O5, respectively. By varying the thickness and number of the SiO2 and Ti3O5 layers, selective reflection or transmission of light of different wavelengths can be achieved.

[0277] In some embodiments, at least one reflector may be electrically connected to a semiconductor substrate, for example, through a top electrode layer.

[0278] Figure 4 The figure illustrates a cross-sectional view of an exemplary light-emitting structure 400 having a microlens and an array of light-emitting mesa according to some embodiments. In some exemplary embodiments, the light-emitting structure includes a first light-emitting mesa. For example, the light-emitting structure 400 includes a first light-emitting mesa 401, such as... Figure 4 As shown. In some embodiments, the first light-emitting platform 401 has a... Figure 1A The first light-emitting mesa 101 and related structures described herein have the same or similar dimensions, shape, structure, composition, positioning, and fabrication (including reflectors and other related structures, such as optional spacers). The first light-emitting mesa 401 may include an LED or a micro-LED, and light may be emitted from the first light-emitting mesa 401. The first light-emitting mesa 401 may have a top surface and a bottom surface. In some embodiments, the diameter or width of the top surface of the first light-emitting mesa 401 and the diameter or width of the bottom surface of the first light-emitting mesa 401 may be as described above regarding... Figure 1A Within a similar range as described.

[0279] In some exemplary embodiments, the light-emitting structure 400 further includes a first microlens. For example... Figure 4 As shown, the light-emitting structure 400 includes a first microlens 402 formed on the first light-emitting platform 401. In some embodiments, the first microlens 402 may have a... Figure 1A The microlens 102 described herein has the same or similar size, shape, structure, composition, positioning, and fabrication. In some embodiments, the first microlens 402 may be coaxially aligned with the first light-emitting stage 401 along the C-C' direction. Figure 4 (not shown in the image), and is located above the first light-emitting platform 401. Figure 4 The axis C-C' shown refers to the central axis of the first light-emitting platform 401. Figure 4 The axis D-D' shown refers to the central axis of the first microlens 402. In these embodiments with coaxially aligned central axes ( Figure 4 In a design (not shown), all light emitted from the first emitting platform 401 can directly reach and pass through the first microlens 402. Therefore, divergence can be reduced, and the usable viewing angle can be minimized to the level visible to a user's line of sight perpendicular to the surface of the display and panel using single-pixel LED devices. This also reduces power consumption, increases brightness, and / or better protects user privacy in public areas. In another example, a portion of the light emitted from the first emitting platform 401 can directly reach and pass through the first microlens 402, while another portion of the light emitted from the emitting center can bypass or avoid the microlens 402. Therefore, the brightness from the first emitting platform 401 can be adjusted.

[0280] In yet another example, such as Figure 4 As shown, the central axis of the first microlens 402 is off-axis and stacked on the central axis of the first light-emitting stage 401. In other words, the central axis D-D' of the first microlens 402 is not coaxially aligned, overlapped, or coincident with the central axis C-C' of the first light-emitting stage 401, as shown. Figure 4As shown. In some embodiments, the offset distance between the central axis D-D' of the first microlens 402 and the central axis C-C' of the first light-emitting platform 401 is no greater than 4.5 μm. In this example, the vertical light array 440 from the center of the light-emitting platform 401 is redirected by the microlens to a light array 442 at an angle to the vertical light array 440. The light array 444 from the edge of the light-emitting platform 401 toward the center of the microlens 402 is redirected by the microlens to a light array 446, the angle of which is greater with respect to the axis perpendicular to the substrate 410 than the angle of which is greater with respect to the axis of which is perpendicular to the substrate 410. In this embodiment, divergence can be reduced and the usable viewing angle can be reduced to the extent that displays and panels using single-pixel LED devices can be seen by a user only at a specific angle of sight relative to the surface of the display and panel. This can also reduce power loss, increase brightness, and / or appropriately protect user privacy in public areas.

[0281] exist Figure 4 In this structure, the light-emitting structure comprises multiple light-emitting mesas distributed in an array. For example, Figure 5 This is a top view of a light-emitting structure array system 500 comprising off-axis arranged light-emitting platforms and microlenses according to some embodiments. The array shape can be a matrix, circle, rectangle, square, hexagon, or other shape. In the array, a microlens is disposed above each light-emitting platform. The light-emitting platform 501 and the microlens 502 located above the light-emitting platform 501 are included in the off-axis arranged array of light-emitting platforms and microlenses. In some embodiments, the edge of the first light-emitting platform is close to the edge of the first microlens; for example, the offset distance between the edge of the bottom surface of the first light-emitting platform and the edge of the bottom surface of the first microlens is within 30% of the diameter of the bottom surface of the first microlens. For example, as... Figure 4 As shown, line E-E' refers to the farthest point passing through the edge of the bottom surface of the first light-emitting platform 401 (along...). Figure 5 In the cross-sectional view of G-G', the vertical line is the furthest point 504 of the first light-emitting platform 501. Similarly, line F-F' refers to the furthest point passing through the edge of the bottom surface of the first microlens 402 (along...). Figure 5 The vertical line in the cross-sectional view of G-G' is the furthest point 506 of the first microlens 502. The offset distance between the edge of the bottom surface of the first light-emitting platform 401 and the edge of the bottom surface of the first microlens 402 refers to the offset distance between line E-E' and line F-F'. In some embodiments, such as Figure 5 As shown, the offset distance between the edge of the bottom surface of the first light-emitting platform 401 and the edge of the bottom surface of the first microlens 402 is zero; for example, 504 and 506 are the same point. In some embodiments, such as Figure 4As shown, the offset distance between the edge 504 of the bottom surface of the first light-emitting platform 401 / 501 and the edge 506 of the bottom surface of the first microlens 402 / 502 is very small. For example, the offset distance between lines E-E' and F-F' can be within 30% of the diameter of the bottom surface of the first microlens 402. In some embodiments, the offset distance between lines E-E' and F-F' can be greater than 30% but less than 50% of the diameter of the bottom surface of the first microlens 402. In some embodiments, the offset distance between lines E-E' and F-F' can be greater than 50% of the diameter of the bottom surface of the first microlens 402.

[0282] In some embodiments, the bottom surface of the first microlens 402 covers the position of the central axis C-C' of the first light-emitting stage 401. In other words, the central axis C-C' of the first light-emitting stage 401 intersects with the bottom surface of the first microlens 402, as shown below. Figure 4 As shown.

[0283] In some embodiments, the structure of the first microlens 402 may include an element having a planar surface and a convex surface. For example, as Figure 4 As shown, the structure of the first microlens 402 can be hemispherical. Other structures of the first microlens 402 can also be similar to those described above. Figure 1A Other structures / shapes described. In some embodiments, the first microlens 402 may further include a reflective portion capable of adjusting the optical path. The reflective portion may be similar to the reflective portion described above.

[0284] In some embodiments, the material of the first microlens 402 includes inorganic or organic materials. For example, the material of the first microlens 402 may include silicon oxide. Other materials and manufacturing methods for the first microlens 402 may be described above. Figure 1A The microlens 102 is made of the same or similar material and is manufactured in a similar manner.

[0285] In some embodiments, the light-emitting structure 400 further includes a second light-emitting platform and a second microlens formed above the second light-emitting platform. For example, as... Figure 4 As shown, the light-emitting platform 400 includes a second light-emitting platform 403 and a second microlens 404 formed above the second light-emitting platform 403. In some embodiments, the second light-emitting platform 403 may be similar to the first light-emitting platform 401 as described above, and the second microlens 404 may be similar to the first microlens 402 as described above. In some embodiments, the second light-emitting platform 403 may be adjacent to the first light-emitting platform 401. For example, as... Figure 4 As shown, the second light-emitting platform 403 is adjacent to the first light-emitting platform 401 at the same horizontal position. In another example, the second light-emitting platform 403 may be adjacent to the first light-emitting platform 401 at a higher or lower horizontal position.

[0286] In some embodiments, the structure of the second microlens 404 may include an element having a planar surface and a convex surface. For example, as Figure 4 As shown, the structure of the second microlens 404 can be hemispherical. Other structures of the second microlens 404 can also be similar to those described above. Figure 1A Other structures / shapes described. In some embodiments, the second microlens 404 may further include a reflective portion capable of adjusting the optical path. The reflective portion may be similar to the reflective portion described above.

[0287] In some embodiments, the offset between the central axis of the first microlens 402 and the central axis of the first light-emitting platform 401 is the same as the offset between the central axis of the second microlens 404 and the central axis of the second light-emitting platform 403. In some embodiments, the offset between the central axis of the first microlens 402 and the central axis of the first light-emitting platform 401 is different from the offset between the central axis of the second microlens 404 and the central axis of the second light-emitting platform 403. Figure 5 As shown, in some embodiments, the relative positions of each microlens, such as 502, and each corresponding light-emitting mesa, such as 501, are identical within the light-emitting structure array system 500. For example, the offset distance of the central axis of the microlens relative to the central axis of the corresponding light-emitting mesa (e.g., ...) Figure 4 The distance between lines D-D' and C-C' shown is the same on all light-emitting mesa and microlens pairs in the light-emitting structure array system 500. Thus, all light emitted from the light-emitting mesa and microlens pairs in the light-emitting structure array system 500 is directed toward the user or device at the same angle or a similar angular range.

[0288] Figure 6 A cross-sectional view of a light-emitting structure array system 600 according to some embodiments is shown, wherein a sensor 602 is located at a central position above the light-emitting structure array system 600. The light-emitting structure array system 600 includes one or more light-emitting mesa, such as 604, 608, 612, 616, and 620, and one or more microlenses, such as 606, 610, 614, 618, and 622, each light-emitting mesa and microlens being similar to those described in any of Figures 1 to 5. In some embodiments, emitted light from one or more light-emitting mesa is converted together to the sensor 602 by one or more microlenses. In some embodiments, the sensor 602 (or the central axis of the sensor 602) is arranged at a position H-H' of the central axis of the light-emitting structure array system 600.

[0289] In some embodiments, the offset distance of the microlens relative to the corresponding light-emitting stage is different within the light-emitting structure array system 600. In some embodiments, the offset distance of the microlens relative to the light-emitting stage is determined by the position of the sensor and the position of the microlens relative to the sensor. In some embodiments, such as Figure 6 As shown, the offset distance of the central axis of the microlens relative to the central axis of the corresponding light-emitting platform (such as...) Figure 4 The distance between lines D-D' and C-C' (as shown) increases from the center of the light-emitting structure array system where sensor 602 is located to the edge of the light-emitting structure array system 600. In other words, when both the first microlens and the first light-emitting platform are closer to sensor 602 than both the second microlens and the second light-emitting platform are, the offset distance of the central axis of the first microlens, such as 610, relative to the central axis of the first light-emitting platform, such as 608, is less than the offset distance of the central axis of the second microlens, such as 614, relative to the central axis of the second light-emitting platform, such as 612. In some embodiments, when both the central axes of the microlenses and the central axes of the light-emitting platforms are coaxially aligned with the central axis of sensor 602, the offset distance of the central axis of the microlens, such as 606, relative to the central axis of the corresponding light-emitting platform, such as 604, is zero. In some embodiments, the offset distance between the microlenses and the light-emitting platforms on the light-emitting structure array system 600 is no greater than 4.5 μm.

[0290] In some embodiments, the offset distance of the central axis of each microlens relative to the central axis of its corresponding light-emitting platform is symmetrical about the central axis of the light-emitting structure array system 600 in which the sensor 602 is located. For example, the offset distance of the central axis of microlens 610 relative to the central axis of its corresponding light-emitting platform 608 is the same as the offset distance of the central axis of microlens 618 relative to the central axis of its corresponding light-emitting platform 616. The offset distance of the central axis of microlens 614 relative to the central axis of its corresponding light-emitting platform 612 is the same as the offset distance of the central axis of microlens 622 relative to the central axis of its corresponding light-emitting platform 620. In some embodiments, to the right of the central axis of the sensor, the microlens is shifted to the left relative to the corresponding light-emitting platform below the microlens (see, for example, Figure 6 Microlenses 610 and 614 in the sensor). In some embodiments, on the left side of the sensor's central axis, the microlens is shifted to the right relative to the corresponding light-emitting stage below the microlens (see, for example, microlenses 610 and 614). Figure 6 Microlenses 618 and 622 (in the image).

[0291] like Figure 6The illustrated light-emitting structure array system 600 can direct the light emitted from each light-emitting mesa towards the sensor 602 located at the center. For example, light emitted from the central light-emitting mesa 604 at the center of the light-emitting structure array system 600, along its central axis, does not change direction after passing through the microlens 606. Light emitted from the central light-emitting mesa 608, along its central axis, changes direction towards the sensor 602 after passing through the microlens 610. Light emitted from the central light-emitting mesa 612, along its central axis, changes direction towards the sensor 602 after passing through the microlens 614. The angle of light emitted from microlenses positioned near the edges of the light-emitting structure array system 600 relative to the vertical axis perpendicular to the substrate surface is greater than the angle of light emitted from microlenses positioned near the center of the light-emitting structure array system relative to the vertical axis perpendicular to the substrate surface. For example, the angle of light emitted from microlens 614 positioned near the edges of the light-emitting structure array system 600 relative to the vertical axis perpendicular to the substrate surface is greater than the angle of light emitted from microlens 610 positioned near the center of the light-emitting structure array system 600 relative to the vertical axis perpendicular to the substrate surface.

[0292] Figure 7 A cross-sectional view of a light-emitting structure array system 700 according to some embodiments is shown, wherein a sensor 702 is located on one side or off-center above the light-emitting structure array 700. The light-emitting structure array system 700 includes one or more light-emitting mesa, such as 704, 708, 712, 716, and 720, and one or more microlenses, such as 706, 710, 714, 718, and 722, each light-emitting mesa and microlens being similar to those described in any of Figures 1-5. In some embodiments, emitted light from one or more light-emitting mesa through one or more microlenses is converted together into the sensor 702. In some embodiments, the sensor 702 (or the central axis of the sensor 702) is arranged at a position not on the central axis of the light-emitting structure array system 700. For example, the central axis I-I' of the sensor 702 passes through one side of the light-emitting structure array system 700.

[0293] In some embodiments, the offset distance of each microlens relative to its respective light-emitting stage is different within the light-emitting structure array system 700. In some embodiments, the offset distance of the microlens relative to the light-emitting stage is determined by the position of the sensor and the position of the microlens relative to the sensor. In some embodiments, such as Figure 7 As shown, for each microlens-stage surface, as the position progresses from the central axis I-I' of the sensor 702 towards the edge of the light-emitting structure array system 700, i.e. from... Figure 7 The central axis I-I' of the microlens is shifted horizontally to the left, and the offset distance of the central axis of the microlens relative to the central axis of the corresponding luminescent stage (such as...) Figure 4The distance between lines D-D' and C-C' shown increases. In other words, when both the first microlens and the first emitting platform are closer to sensor 702 than both the second microlens and the second emitting platform are closer to the same sensor 702, the offset distance of the central axis of the first microlens, such as 706, relative to the central axis of the first emitting platform, such as 704, is smaller than the offset distance of the central axis of the second microlens, such as 710, relative to the central axis of the second emitting platform, such as 708. In some embodiments, Figure 7 As not shown, when the central axis of the microlens and the central axis of the light-emitting stage are both coaxially aligned with the central axis of the sensor 702, the offset distance of the central axis of the microlens relative to the central axis of the corresponding light-emitting stage is zero. In some embodiments, the offset distance between the microlens and the light-emitting stage on the light-emitting structure array system 700 is no greater than 4.5 μm.

[0294] In some embodiments, Figure 7 Not shown, the offset distance of the central axis of the corresponding microlens relative to the central axis of the corresponding light-emitting stage is symmetrical about the central axis of the sensor 702. In some embodiments, on the right side of the sensor's central axis, the microlens is shifted to the left relative to the corresponding light-emitting stage below the microlens. In some embodiments, on the left side of the sensor's central axis, the microlens is shifted to the right relative to the corresponding light-emitting stage below the microlens.

[0295] like Figure 7 The illustrated light-emitting structure array system 700 can direct the light emitted by each light-emitting mesa towards the sensor 702, which is located off-center. For example, light emitted from light-emitting mesa 708 at its central axis changes direction towards the sensor 702 after passing through microlens 710, while light emitted from light-emitting mesa 712 at its central axis changes direction towards the sensor 702 after passing through microlens 714. The angle of light emitted by microlenses positioned further from the central axis of the sensor 702 relative to the vertical axis perpendicular to the substrate surface is greater than the angle of light emitted by microlenses positioned closer to the central axis of the sensor 702 relative to the vertical axis perpendicular to the substrate surface. For example, the angle of light emitted by microlens 714 positioned further from the central axis of the sensor 702 relative to the vertical axis perpendicular to the substrate surface is greater than the angle of light emitted by microlens 710 positioned closer to the central axis of the sensor 702 relative to the vertical axis perpendicular to the substrate surface.

[0296] When the offset distance of each microlens relative to its corresponding emitting stage is the same, the light emitted by the microlens array is parallel and forms a emitting plane. When the offset distance of each microlens relative to its corresponding emitting stage is different, the light emitted by the microlens array can be focused on a point instead of a plane.

[0297] Figure 8 A cross-sectional view of an exemplary light-emitting structure 800 having microlenses located within a large microlens, according to some embodiments, is shown, wherein the lateral dimension of the microlens is smaller than that of the large microlens. The array structure, size, shape, fabrication, and materials of the large microlens and the light-emitting platform (including associated reflectors and optional spacers) are the same as or similar to those of the light-emitting structures described in any of Figures 1-7. The materials, shapes, and fabrication of the microlenses are similar to those of the large microlenses described above in Figures 1-7. In some embodiments, within the same microlens group and light-emitting platform, the light-emitting structure 800 includes microlenses such as 806 or 808 and large microlenses such as 802 or 804. Microlenses such as 806 or 808 are formed on a light-emitting platform such as 401 or 403. Large microlenses are formed on a light-emitting platform such as 401 or 403 and cover the microlenses such as 806 or 808. The diameter of the large microlens such as 802 is larger than that of the microlens such as 806 to improve light extraction efficiency.

[0298] In some embodiments, such as Figure 8 As shown, the central axis J-J' of the microlens 806 is shifted from the central axis K-K' of the light-emitting stage 401 to change the direction of light, while the central axis of the large microlens 802 is coaxially aligned (or identical to) the central axis K-K' of the light-emitting stage 401. In some embodiments, the offset distance between the central axis of the microlens 806 and the central axis of the light-emitting stage 401 is no greater than 9 μm, preferably no greater than 1.5 μm.

[0299] In some embodiments, the edge of the microlens 806 does not need to cover the central axis of the light-emitting platform 401, such as... Figure 8 As shown, the edge of the large microlens 802 covers the central axis of the light-emitting platform 401, similarly as above. Figure 4 As described in [the text]. In other words, the central axis K-K' of the light-emitting platform 401 does not need to intersect the bottom surface of the microlens 806, but the central axis K-K' of the light-emitting platform 401 intersects the bottom surface of the large microlens 802. In some other embodiments, Figure 8 As not shown in the diagram, the edges of both the microlens 806 and the macrolens 802 cover the central axis of the emitting platform 401. In other words, the central axis K-K' of the emitting platform 401 intersects the bottom surface of the microlens 806, and the central axis K-K' of the emitting platform 401 intersects the bottom surface of the macrolens 802.

[0300] In some embodiments, light rays 840 emitted from the light-emitting mesa 401 are redirected to 842 upon exiting the large microlens 802. Light rays 844 emitted from the light-emitting mesa 401 are redirected to 846 during their passage through the small microlens 806 and are redirected to 848 upon exiting the large microlens 802. Adding a small microlens within the large microlens can further direct and adjust the light within specific portions of the LED pixel structure to specific angles. For example, in Figure 8 In this process, light rays emitted from the large microlens become more focused in certain directions.

[0301] Figures 9A-9D The following are examples of embodiments. Figure 8 Some exemplary simulation results of the light emitted by the large microlens of the light-emitting structure 800 shown. Figures 9A-9D This diagram illustrates the change in emitted light intensity of a self-emissive structure 800 when the central axis of a large microlens, such as 802, is coaxially aligned (or identical to) with the central axis K-K' of a light-emitting mesa, such as 401, and the central axis J-J' of a small microlens, such as 806, with varying offset distances. The emitted light intensity is measured in a vertical plane passing through the vertical central axis of the light-emitting mesa, such as the central axis K-K' of the light-emitting mesa 401. X and Y represent offset distances in two orthogonal directions, X and Y, on a horizontal plane parallel to the substrate 410. In this example, the maximum horizontal dimension (such as the bottom surface) of the light-emitting mesa, such as 401, is 8 μm. The maximum horizontal dimension (such as the bottom surface) of the small microlens, such as 806, is 18 μm. The maximum horizontal dimension (such as the bottom surface) of the large microlens, such as 802, is 36 μm. Figures 9A-9D The variation in the intensity of the emitted light from the self-emissive structure 800 is also shown as the angle (emission angle θ in degrees) of the emitted light relative to the axis perpendicular to the substrate 410 changes.

[0302] For example, in Figure 9A In the experiment, when the offset distance between the central axis of the emitting platform and the central axis of the microlens is 1.5 μm in the X direction and 1.5 μm in the Y direction, the maximum normalized emitted light intensity at a 0-degree exit angle is approximately 0.3 au. At exit angles of approximately +30 and -30 degrees, two additional secondary peak normalized emitted light intensities exist, with a secondary peak intensity of approximately 0.15 au. When the absolute value of the exit angle is greater than 30 degrees, the light intensity gradually decreases to zero as the absolute value of the exit angle increases. When the absolute value of the exit angle is less than 30 degrees, the light intensity gradually decreases as the absolute value of the exit angle decreases, with a minimum intensity of approximately 0.05 au, close to a 0-degree exit angle.

[0303] For example, in Figure 9BIn the model, when the offset distance between the central axis of the emitting platform and the central axis of the microlens is 3 μm in the X direction and 3 μm in the Y direction, the maximum normalized emitted light intensity at a 0-degree exit angle is approximately 0.3 au. At exit angles of approximately +35 degrees and -35 degrees, two additional secondary peak normalized emitted light intensities exist. The secondary peak intensity is approximately 0.16 au. When the absolute value of the exit angle is greater than 35 degrees, the light intensity gradually decreases to zero as the absolute value of the exit angle increases. When the absolute value of the exit angle is less than 35 degrees, the light intensity gradually decreases as the absolute value of the exit angle decreases, with a minimum intensity of approximately 0.05 au, close to a 0-degree exit angle.

[0304] For example, in Figure 9C In the experiment, when the offset distance between the central axis of the emitting platform and the central axis of the microlens is 4.5 μm in both the X and Y directions, the maximum normalized emitted light intensity at a 0-degree exit angle is approximately 0.2 au. At exit angles of approximately +30 degrees and -30 degrees, two additional secondary peak normalized emitted light intensities exist, with a secondary peak intensity of approximately 0.16 au. When the absolute value of the exit angle is greater than 30 degrees, the light intensity gradually decreases to zero as the absolute value of the exit angle increases. When the absolute value of the exit angle is less than 30 degrees, the light intensity gradually decreases as the absolute value of the exit angle decreases, with a minimum intensity of approximately 0.01 au, close to a 0-degree exit angle.

[0305] For example, in Figure 9D In the model, when the offset distance between the central axis of the emitting platform and the central axis of the microlens is 9 μm in the X direction and 9 μm in the Y direction, the maximum normalized emitted light intensity at a 0-degree exit angle is approximately 0.275 au. At exit angles of approximately +40 degrees and -40 degrees, two additional secondary peak normalized emitted light intensities exist. The secondary peak intensity is approximately 0.16 au. When the absolute value of the exit angle is greater than 40 degrees, the light intensity gradually decreases to zero as the absolute value of the exit angle increases. When the absolute value of the exit angle is less than 40 degrees, the light intensity gradually decreases as the absolute value of the exit angle decreases, with a minimum intensity value of approximately 0.075 au, close to a 0-degree exit angle.

[0306] Figure 10A cross-sectional view of an exemplary light-emitting structure 1000 having microlenses located within a large microlens, according to some embodiments, is shown, wherein the lateral dimension of the microlens is smaller than that of the large microlens. The array structure, size, shape, fabrication, and materials of the large microlens and the light-emitting platform (including associated reflectors and optional spacers) are the same as or similar to those of the light-emitting structures described in any of Figures 1-7. The materials, shapes, and fabrication of the microlenses are similar to those of the large microlenses described above in Figures 1-7. In some embodiments, within the same microlens group and light-emitting platform, the light-emitting structure 1000 includes microlenses such as 1006 or 1008 and large microlenses such as 1002 or 1004. Microlenses such as 1006 or 1008 are formed on a light-emitting platform such as 401 or 403. Large microlenses are formed on a light-emitting platform such as 401 or 403 and cover the microlenses such as 1006 or 1008. Large microlenses, such as the 1002, have a larger diameter than small microlenses, such as the 1006, to improve light extraction efficiency.

[0307] In some embodiments, such as Figure 10 As shown, the central axis M-M' of the large microlens 1002 is shifted from the central axis L-L' of the light-emitting stage 401 to change the direction of light, while the central axis of the small microlens 1006 is coaxially aligned (or identical to) the central axis L-L' of the light-emitting stage 401. Preferably, the offset distance between the central axis of the large microlens 1002 and the central axis of the light-emitting stage 401 is no greater than 12 μm, and in some embodiments, no greater than 1.5 μm.

[0308] In some embodiments, the edge of the microlens 1006 covers the central axis of the light-emitting platform 401, such as... Figure 10 As shown, the edge of the large microlens 1002 covers the central axis of the light-emitting platform 402, similarly as above. Figure 4 As described in the text. In other words, the central axis L-L' of the light-emitting stage 401 intersects the bottom surface of the microlens 1006, and the central axis L-L' of the light-emitting stage 401 intersects the bottom surface of the large microlens 1002.

[0309] In some embodiments, light rays 1038 emitted from the light-emitting mesa 401 are redirected to 1040 during their passage through the macrolens 1002 and redirected to 1042 upon exiting the macrolens 1002. Light rays 1044 emitted from the light-emitting mesa 401 pass through the microlens 1006 and are then redirected to 1046 upon exiting the macrolens 1002. Adding microlenses within the macrolens can further direct and modulate light to specific angles within specific portions of the LED pixel structure. For example, in Figure 10 In this process, light rays emitted from the large microlens become more focused in certain directions.

[0310] Figure 11A-11E The following are examples of embodiments. Figure 10 Some exemplary simulation results of the light emitted by the large microlens of the light-emitting structure 1000 shown. Figure 11A-11E This diagram illustrates the change in emitted light intensity of the self-emissive structure 1100 when the central axis of a microlens, such as 1006, is coaxially aligned (or identical to) with the central axis L-L' of a luminescent mesa, such as 401, and the central axis J-J' of a large microlens, such as 1002, with varying offset distances. The emitted light intensity is measured in a vertical plane passing through the vertical central axis of the luminescent mesa, such as the central axis L-L' of the luminescent mesa 401. X and Y represent offset distances in two orthogonal directions, X and Y, on a horizontal plane parallel to the substrate 410. In this example, the maximum horizontal dimension (such as the bottom surface) of the luminescent mesa, such as 401, is 8 μm. The maximum horizontal dimension (such as the bottom surface) of the microlens, such as 1006, is 18 μm. The maximum horizontal dimension (such as the bottom surface) of the large microlens, such as 1002, is 36 μm. Figure 11A-11E The variation in the intensity of the emitted light from the self-emissive structure 1000 is also shown as the angle (emission angle θ in degrees) of the emitted light relative to the axis perpendicular to the substrate 410 changes.

[0311] For example, in Figure 11A In the experiment, when the offset distance between the central axis of the emitting platform and the central axis of the large microlens is 3 μm in the X direction and 3 μm in the Y direction, the maximum normalized emitted light intensity at a 0-degree exit angle is approximately 0.28 au. At approximately +40 degrees exit angle, there exists a secondary peak normalized emitted light intensity of approximately 0.175 au. When the exit angle is greater than 40 degrees, the light intensity gradually decreases to zero as the exit angle increases. When the exit angle is less than 40 degrees but greater than 0 degrees, the light intensity gradually decreases as the exit angle decreases, reaching a minimum intensity of approximately 0.05 au, close to a 0-degree exit angle. When the exit angle is less than 0 degrees, the light intensity remains stable until approximately -30 degrees, and then gradually decreases to zero as the exit angle decreases.

[0312] For example, in Figure 11BIn the model, when the offset distance between the central axis of the emitting platform and the central axis of the large microlens is 4.5 μm in both the X and Y directions, the maximum normalized emitted light intensity at a 0-degree exit angle is approximately 0.2 au. At approximately +45 degrees exit angle, there is a peak normalized emitted light intensity of approximately 0.2 au. When the exit angle is greater than 45 degrees, the light intensity gradually decreases to zero as the exit angle increases. When the exit angle is less than 45 degrees but greater than 0 degrees, the light intensity gradually decreases as the exit angle decreases, with a minimum intensity of approximately 0.025 au, close to a 0-degree exit angle. When the exit angle is less than 0 degrees, the light intensity gradually decreases to zero as the exit angle decreases.

[0313] For example, in Figure 11C In the experiment, when the offset distance between the central axis of the emitting platform and the central axis of the large microlens is 6 μm in the X direction and 6 μm in the Y direction, the maximum normalized emitted light intensity at a 0-degree exit angle is approximately 0.21 au. At approximately +50 degrees exit angle, there exists a secondary peak normalized emitted light intensity of approximately 0.18 au. When the exit angle is greater than 50 degrees, the light intensity gradually decreases to zero as the exit angle increases. When the exit angle is less than 50 degrees but greater than 0 degrees, the light intensity gradually decreases as the exit angle decreases, with a minimum intensity of approximately 0.025 au, close to a 0-degree exit angle. When the exit angle is less than 0 degrees, the light intensity remains stable until approximately -20 degrees, and then gradually decreases to zero as the exit angle decreases.

[0314] For example, in Figure 11D In the experiment, when the offset distance between the central axis of the emitting stage and the central axis of the large microlens is 9 μm in the X direction and 9 μm in the Y direction, the maximum normalized emitted light intensity at a 0-degree exit angle is approximately 0.15 au. At approximately +55 degrees exit angle, there exists a secondary peak normalized emitted light intensity of approximately 0.09 au. When the exit angle is greater than 55 degrees, the light intensity gradually decreases to zero as the exit angle increases. When the exit angle is less than 55 degrees but greater than 0 degrees, the light intensity gradually decreases as the exit angle decreases, reaching a minimum intensity of approximately 0.03 au near 25 degrees, after which the light intensity gradually increases as the exit angle decreases. When the exit angle is less than 0 degrees, the light intensity remains stable until approximately -20 degrees, then gradually decreases to zero as the exit angle decreases.

[0315] For example, in Figure 11EIn the experiment, when the offset distance between the central axis of the emitting platform and the central axis of the large microlens is 12 μm in both the X and Y directions, the maximum normalized emitted light intensity at a 0-degree exit angle is approximately 0.2 au. When the exit angle is less than 0 degrees, the light intensity gradually decreases to zero as the exit angle decreases. When the exit angle is greater than 0 degrees, the light intensity gradually decreases to zero as the exit angle increases.

[0316] Figure 12 A cross-sectional view of an exemplary light-emitting structure 1200 having microlenses located within a large microlens, according to some embodiments, is shown, wherein the lateral dimension of the microlens is smaller than that of the large microlens. The array structure, size, shape, fabrication, and materials of the large microlens and the light-emitting platform (including associated reflectors and optional spacers) are the same as or similar to those of the light-emitting structures described in any of Figures 1-7. The materials, shapes, and fabrication of the microlenses are similar to those of the large microlenses described above in Figures 1-7. In some embodiments, within the same microlens group and light-emitting platform, the light-emitting structure 1200 includes microlenses such as 1206 or 1208 and large microlenses such as 1202 or 1204. Microlenses such as 1206 or 1208 are formed on a light-emitting platform such as 401 or 403. Large microlenses are formed on a light-emitting platform such as 401 or 403 and cover the microlenses such as 1206 or 1208. Large microlenses, such as 1202, have a larger diameter than small microlenses, such as 1206, to improve light extraction efficiency.

[0317] In some embodiments, such as Figure 12 As shown, the central axis N-N' of the microlens 1206 and the central axis of the macrolens 1202 are shifted from the central axis O-O' of the light-emitting stage 401 to change the direction of light, while the central axis of the microlens 1206 is coaxially aligned (or identical to) the central axis of the macrolens 1202. Preferably, the offset distance between the central axis of the macrolens 1202 and the central axis of the light-emitting stage 401 is no greater than 12 μm.

[0318] In some embodiments, the edge of the microlens 1206 covers the central axis of the light-emitting platform 401, such as... Figure 12 As shown, the edge of the large microlens 1202 covers the central axis of the light-emitting platform 401, similarly as above. Figure 4 As described in the text. In other words, the central axis O-O' of the light-emitting stage 401 intersects the bottom surface of the microlens 1206, and the central axis O-O' of the light-emitting stage 401 intersects the bottom surface of the large microlens 1202.

[0319] In some embodiments, light rays 1236 emitted from the light-emitting mesa 401 are redirected to 1238 while passing through the microlens 1206, then redirected to 1240 while passing through the macrolens 1202, and finally redirected to 1242 upon exiting the macrolens 1202. Light rays 1244 emitted from the light-emitting mesa 401 pass through the microlens 1206, then are redirected to 1246 while passing through the macrolens 1202, and finally redirected to 1248 upon exiting the macrolens 1202. Adding a microlens within the macrolens can further direct and modulate light within specific portions of the LED pixel structure to specific angles, particularly when the first and macrolenses have different refractive indices. For example, in Figure 12 In this process, the light emitted from the large microlens becomes more focused in certain directions around the luminous platform.

[0320] Figure 13 A cross-sectional view of an exemplary light-emitting structure 1300 having microlenses located within a large microlens, according to some embodiments, is shown, wherein the lateral dimension of the microlens is smaller than that of the large microlens. The array structure, size, shape, fabrication, and materials of the large microlens and the light-emitting platform (including associated reflectors and optional spacers) are the same as or similar to those of the light-emitting structures described in any of Figures 1-7. The materials, shapes, and fabrication of the microlenses are similar to those of the large microlenses described above in Figures 1-7. In some embodiments, within the same microlens group and light-emitting platform, the light-emitting structure 1300 includes microlenses such as 1306 or 1308 and large microlenses such as 1302 or 1304. Microlenses such as 1306 or 1308 are formed on a light-emitting platform such as 401 or 403. Large microlenses are formed on a light-emitting platform such as 401 or 403 and cover the microlenses such as 1306 or 1308. Large microlenses, such as 1302, have a larger diameter than small microlenses, such as 1306, to improve light extraction efficiency.

[0321] In some embodiments, such as Figure 13As shown, the central axis Q-Q' of the microlens 1306 and the central axis R-R' of the macrolens 1302 are shifted from the central axis P-P' of the emitting platform 401 to change the direction of light, while the central axis of the microlens 1306 is not coaxially aligned with (or identical to) the central axis of the macrolens 1302. Preferably, the offset distance between the central axis Q-Q' of the microlens 1306 and the central axis R-R' of the macrolens 1302 is not greater than 6 μm and not less than 4.5 μm. In some embodiments, the offset distance between the central axis of the macrolens 1302 and the central axis of the emitting platform 401 is not greater than 12 μm. Furthermore, for corresponding microlens groups and emitting platforms within the same display panel, the positions of the microlens relative to the macrolens can be different to obtain different light directions and angles.

[0322] In some embodiments, the edge of the microlens 1306 covers the central axis P-P' of the light-emitting platform 401, such as... Figure 13 As shown, the edge of the large microlens 1302 covers the central axis P-P' of the emitting platform 401, similarly as above. Figure 4 As described in [the document]. In other words, the central axis P-P' of the emitting platform 401 intersects the bottom surface of the microlens 1306, and the central axis P-P' of the emitting platform 401 intersects the bottom surface of the second microlens 1302. In another embodiment, only the edge of the microlens 1306 covers the central axis P-P' of the emitting platform 401.

[0323] In some embodiments, light rays 1338 emitted from the light-emitting mesa 401 are redirected to 1340 while passing through the macro-microlens 1302 and are redirected to 1342 upon exiting the macro-microlens 1302. Light rays 1344 emitted from the light-emitting mesa 401 pass through the microlens 1306, are then redirected to 1346 while passing through the macro-microlens 1302, and are redirected to 1348 upon exiting the macro-microlens 1302. Adding a microlens within the macro-microlens can further direct and tune light to specific angles within specific portions of the LED pixel structure, particularly when the first and macro-microlenses have different refractive indices. For example, in Figure 13 In this process, the light emitted from the large microlens becomes more focused in certain directions around the luminous platform.

[0324] Figures 14A-14B Illustrations are shown according to some embodiments Figure 13 Some exemplary simulation results of the light emitted by the large microlens of the light-emitting structure 1300 shown. Figures 14A-14BThe variation in emitted light intensity of the self-emissive structure 1300 is shown when the offset distance between the central axis P-P' of the emitting mesa, such as 401, and the central axis Q-Q' of the microlens, such as 1306, and the offset distance between the central axis P-P' of the emitting mesa, such as 401, and the central axis R-R' of the microlens, such as 1302, are both changed. The emitted light intensity is measured in a vertical plane passing through the vertical central axis of the emitting mesa, such as the central axis P-P' of the emitting mesa 401. X and Y represent the offset distance in two orthogonal directions, X and Y, on a horizontal plane parallel to the substrate 410. In this example, the maximum horizontal dimension (such as the bottom surface) of the emitting mesa, such as 401, is 8 μm. The maximum horizontal dimension (such as the bottom surface) of the microlens, such as 1306, is 18 μm. The maximum horizontal dimension (such as the bottom surface) of the microlens, such as 1302, is 36 μm. Figures 14A-14B The variation in the intensity of the emitted light from the self-emissive structure 1300 is also shown as the angle (emission angle θ in degrees) of the emitted light relative to the axis perpendicular to the substrate 410 changes.

[0325] For example, in Figure 14A In the experiment, when the offset distance between the central axis of the emitting stage and the central axis of the microlens is 3 μm in the X direction and 3 μm in the Y direction, and the offset distance between the central axis of the emitting stage and the central axis of the large microlens is 9 μm in the X direction and 9 μm in the Y direction, the maximum normalized emitted light intensity at a 0-degree exit angle is approximately 0.06 au. At approximately +55 degrees exit angle, there is a peak normalized emitted light intensity of approximately 0.095 au. When the exit angle is greater than +55 degrees, the light intensity gradually decreases to zero as the exit angle increases. When the exit angle is less than 55 degrees but greater than 0 degrees, the light intensity gradually decreases as the exit angle decreases, with a minimum intensity of approximately 0.015 au, close to a 0-degree exit angle. When the exit angle is less than 0 degrees, the light intensity remains stable at 0.025 au until approximately -55 degrees, and then gradually decreases to zero as the exit angle decreases.

[0326] For example, in Figure 14BIn the experiment, when the offset distance between the central axis of the emitting stage and the central axis of the microlens is 4.5 μm in the X direction and 4.5 μm in the Y direction, and the offset distance between the central axis of the emitting stage and the central axis of the large microlens is 9 μm in the X direction and 9 μm in the Y direction, the maximum normalized emitted light intensity at a 0-degree exit angle is approximately 0.08 au. At approximately +55 degrees exit angle, there is a peak normalized emitted light intensity of approximately 0.09 au. When the exit angle is greater than +55 degrees, the light intensity gradually decreases to zero as the exit angle increases. When the exit angle is less than +55 degrees but greater than 0 degrees, the light intensity gradually decreases as the exit angle decreases, with a minimum intensity of approximately 0.015 au, close to a 0-degree exit angle. When the exit angle is less than 0 degrees, the light intensity remains stable at 0.025 au until approximately -55 degrees, and then gradually decreases to zero as the exit angle decreases.

[0327] exist Figure 8-13 In some embodiments, preferably, the edge of the large microlens covers the central axis of the light-emitting platform, thereby avoiding a reduction in light extraction efficiency. Figure 8-13 In some embodiments, the material of the microlens differs from that of the macrolens; for example, the macrolens and microlenses have different refractive indices and different optical properties. Figure 8-13 In some embodiments, the material of the microlens is the same as that of the macrolens to avoid light loss at the interface.

[0328] Figure 15 A cross-sectional view of an exemplary light-emitting structure 1500 according to some embodiments is shown, having a microlens located above a large microlens (or a microlens located further along the light-emitting path of the light-emitting structure relative to the large microlens), wherein the lateral dimension of the microlens is smaller than that of the large microlens. The array structure, size, shape, fabrication, and materials of the large microlens and the light-emitting platform (including associated reflectors and optional spacers) are the same as or similar to those of the light-emitting structures described in any of Figures 1-7. The materials, shapes, and fabrication of the microlenses are similar to those of the large microlenses described above in Figures 1-7. In some embodiments, within the same microlens group and light-emitting platform, the light-emitting structure 1500 includes a microlens such as 1506 or 1508 and a large microlens such as 1502 or 1504. The large microlens such as 1502 or 1504 is formed above a light-emitting platform such as 401 or 403. The microlens is formed above the large microlens such as 1502 or 1504 and covers a portion of the surface of the large microlens but not the entire surface of the large microlens. Large microlenses, such as the 1502, have a larger diameter than small microlenses, such as the 1506, to improve light extraction efficiency. In... Figure 15In some embodiments shown, a microlens, such as 1506, is formed directly on a macrolens, such as 1502, such that the top surface of the macrolens remains unchanged (having its original shape, such as a hemisphere), while the bottom surface of the microlens conforms to the shape of the surface of the macrolens. In some embodiments, the overall shape of the microlens is hemispherical, but its bottom surface conforms to the shape of a portion of the top surface of the macrolens.

[0329] In some embodiments, such as Figure 15 As shown, the central axis of the microlens 1506 is defined as an axis perpendicular to the surface of the substrate 410, passing through the center of the complete sphere or other shape (such as an incomplete sphere or other shape) forming the microlens. In some embodiments, the central axis J-J' of the microlens 1506 is shifted from the central axis K-K' of the emitting platform 401 to change the direction of light, while the central axis of the macrolens 1502 is coaxially aligned (or identical to) the central axis K-K' of the emitting platform 401. In some embodiments, the offset distance between the central axis of the microlens 1506 and the central axis of the emitting platform 401 is no greater than 9 μm, preferably no greater than 1.5 μm.

[0330] In some embodiments, the edge of the microlens 1506 does not need to cover the central axis of the light-emitting platform 401, such as... Figure 15 As shown, the edge of the large microlens 1502 covers the central axis of the emitting platform 401, similarly as above. Figure 4 As described in [the text]. In other words, the central axis K-K' of the light-emitting stage 401 does not need to intersect the bottom surface of the microlens 1506, but the central axis K-K' of the light-emitting stage 401 intersects the bottom surface of the large microlens 1502. In some other embodiments, Figure 15 As not shown, the edges of both the microlens 1506 and the macrolens 1502 cover the central axis of the emitting platform 401. In other words, the central axis K-K' of the emitting platform 401 intersects the bottom surface of the microlens 1506, and the central axis K-K' of the emitting platform 401 intersects the bottom surface of the macrolens 1502.

[0331] In some embodiments, light rays 1540 emitted from the light-emitting mesa 401 are redirected to 1542 upon exiting the large microlens 1502. Light rays 1544 emitted from the light-emitting mesa 401 are redirected to 1546 while passing through the large microlens 1502, then redirected to 1548 while passing through the small microlens 1506, and finally redirected to 1550 upon exiting the small microlens 1506. Adding a small microlens above the large microlens can further direct and adjust the light within a portion of the LED pixel structure to a specific angle. For example, in Figure 15 In this process, light rays emitted from the large microlens become more focused in certain directions.

[0332] In some embodiments, for Figure 15 The simulation results of the light emitted by the large and small microlenses of the 1500 light-emitting structure shown are very similar to those of... Figures 9A-9D As shown in the figure, Figure 8 The embodiments shown depict a microlens located within a large microlens. For example, when the central axis of the large microlens, such as 1502, is coaxially aligned (or identical to) with the central axis K-K' of the emitting mesa, such as 401, the emitted light intensity of the self-emissive structure 1500 changes with the offset distance between the central axis K-K' of the emitting mesa, such as 401, and the central axis J-J' of the microlens, such as 1506. The emitted light intensity is measured in a vertical plane passing through the vertical central axis of the emitting mesa, such as the central axis K-K' of the emitting mesa 401. X and Y represent the offset distance in two orthogonal directions, X and Y, on a horizontal plane parallel to the substrate 410. In this example, the maximum horizontal dimension (such as the bottom surface) of the emitting mesa, such as 401, is 8 μm. The maximum horizontal dimension of the microlens, such as 1506, is 18 μm. The maximum horizontal dimension (such as the bottom surface) of the large microlens, such as 1502, is 36 μm. The intensity of the emitted light from the self-emissive structure 1500 also changes with the angle (emission angle θ in degrees) of the emitted light relative to the axis perpendicular to the substrate 410.

[0333] Figure 16 A cross-sectional view of an exemplary light-emitting structure 1600 according to some embodiments is shown, having a microlens located above a large microlens (or a microlens located further along the light-emitting path of the light-emitting structure relative to the large microlens), wherein the lateral dimension of the microlens is smaller than that of the large microlens. The array structure, size, shape, fabrication, and materials of the large microlens and the light-emitting platform (including associated reflectors and optional spacers) are the same as or similar to those of the light-emitting structures described in any of Figures 1-7. The materials, shapes, and fabrication of the microlenses are similar to those of the large microlenses described above in Figures 1-7. In some embodiments, within the same microlens group and light-emitting platform, the light-emitting structure 1600 includes a microlens such as 1606 or 1608 and a large microlens such as 1602 or 1604. The large microlens such as 1602 or 1604 is formed above a light-emitting platform such as 401 or 403. The microlens is formed above the large microlens such as 1602 or 1604 and covers a portion of the surface of the large microlens but not the entire surface of the large microlens. Large microlenses, such as the 1602, have a larger diameter than small microlenses, such as the 1606, to improve light extraction efficiency. In... Figure 16In some embodiments shown, a microlens, such as 1606, is formed directly on a macrolens, such as 1602, such that the top surface of the macrolens remains unchanged (having its original shape, such as a hemisphere), while the bottom surface of the microlens conforms to the shape of the surface of the macrolens. In some embodiments, the overall shape of the microlens is hemispherical, but its bottom surface conforms to the shape of a portion of the top surface of the macrolens.

[0334] In some embodiments, such as Figure 16 As shown, the central axis of the microlens 1606 is defined as an axis perpendicular to the surface of the substrate 410, passing through the center of the complete sphere or other shape (such as an incomplete sphere or other shape) forming the microlens. In some embodiments, such as Figure 16 As shown, the central axis M-M' of the large microlens 1602 is shifted from the central axis L-L' of the light-emitting stage 401 to change the direction of light, while the central axis of the small microlens 1606 is coaxially aligned with (or identical to) the central axis L-L' of the light-emitting stage 401. Preferably, the offset distance between the central axis of the large microlens 1602 and the central axis of the light-emitting stage 401 is no greater than 12 μm. In some embodiments, the offset distance between the central axis of the large microlens 1602 and the central axis of the light-emitting stage 401 is no greater than 1.5 μm.

[0335] In some embodiments, the edge of the microlens 1606 covers the central axis of the light-emitting platform 401, such as... Figure 16 As shown, the edge of the large microlens 1602 covers the central axis of the light-emitting platform 401, similarly as above. Figure 4 As described in the text. In other words, the central axis L-L' of the light-emitting stage 401 intersects the bottom surface of the microlens 1606, and the central axis L-L' of the light-emitting stage 401 intersects the bottom surface of the large microlens 1602.

[0336] In some embodiments, light rays 1638 emitted from the light-emitting mesa 401 are redirected to 1640 while passing through the large microlens 1602, and then redirected to 1642 upon exiting the large microlens 1602. Light rays 1644 emitted from the light-emitting mesa 401 pass through the large microlens 1602, are redirected to 1646 while passing through the small microlens 1606, and then redirected to 1648 upon exiting the small microlens 1606. Adding a small microlens above the large microlens can further direct and adjust the light within a portion of the LED pixel structure to a specific angle. For example, in Figure 16 In this process, light rays emitted from the large microlens become more focused in certain directions.

[0337] In some embodiments, for Figure 16The simulation results of the light emitted by the large and small microlenses of the 1600 light-emitting structure shown are very similar to those of... Figure 11A-11E As shown in the figure, Figure 10 The example shown illustrates a case where the microlens is located within a macrolens.

[0338] Figure 17 A cross-sectional view of an exemplary light-emitting structure 1700 according to some embodiments is shown, having a microlens located above a large microlens (or a microlens located further along the light-emitting path of the light-emitting structure relative to the large microlens), wherein the lateral dimension of the microlens is smaller than that of the large microlens. The array structure, size, shape, fabrication, and materials of the large microlens and the light-emitting platform (including associated reflectors and optional spacers) are the same as or similar to those of the light-emitting structures described in any of Figures 1-7. The materials, shapes, and fabrication of the microlenses are similar to those of the large microlenses described above in Figures 1-7. In some embodiments, within the same microlens group and light-emitting platform, the light-emitting structure 1700 includes microlenses such as 1706 or 1708 and large microlenses such as 1702 or 1704. The large microlens such as 1702 or 1704 is formed above a light-emitting platform such as 401 or 403. The microlenses are formed above the large microlenses such as 1702 or 1704 and cover a portion of the surface of the large microlens but not the entire surface of the large microlens. Large microlenses, such as the 1702, have a larger diameter than small microlenses, such as the 1706, to improve light extraction efficiency. In... Figure 17 In some embodiments shown, a microlens, such as 1706, is formed directly on a macrolens, such as 1702, such that the top surface of the macrolens remains unchanged (having its original shape, such as a hemisphere), while the bottom surface of the microlens conforms to the shape of the surface of the macrolens. In some embodiments, the overall shape of the microlens is hemispherical, but its bottom surface conforms to the shape of a portion of the top surface of the macrolens.

[0339] In some embodiments, such as Figure 17 As shown, the central axis of the microlens 1706 is defined as an axis perpendicular to the surface of the substrate 410, passing through the center of the complete sphere or other shape (such as an incomplete sphere or other shape) forming the microlens. In some embodiments, such as Figure 17 As shown, the central axis N-N' of the microlens 1706 and the central axis of the macrolens 1702 are shifted from the central axis O-O' of the emitting stage 401 to change the direction of light, while the central axis of the microlens 1706 is coaxially aligned (or identical to) the central axis of the macrolens 1702. Preferably, the offset distance between the central axis of the macrolens 1702 and the central axis of the emitting stage 401 is no greater than 12 μm.

[0340] In some embodiments, the edge of the microlens 1706 covers the central axis of the light-emitting platform 401, such as... Figure 17 As shown, the edge of the large microlens 1702 covers the central axis of the light-emitting platform 401, similarly as above. Figure 4 As described in the text. In other words, the central axis O-O' of the light-emitting stage 401 intersects the bottom surface of the microlens 1706, and the central axis O-O' of the light-emitting stage 401 intersects the bottom surface of the large microlens 1702.

[0341] In some embodiments, light rays 1738 emitted from the light-emitting mesa 401 are redirected to 1740 while passing through the large microlens 1702 and are redirected to 1742 upon exiting the large microlens 1702. Light rays 1744 emitted from the light-emitting mesa 401 pass through the large microlens 1702, are then redirected to 1746 while passing through the small microlens 1706, and are redirected to 1748 upon exiting the small microlens 1706. Adding a small microlens above the large microlens can further direct and adjust the light within a portion of the LED pixel structure to a specific angle. For example, in Figure 17 In this process, the light emitted from the large microlens becomes more focused in certain directions around the luminous platform.

[0342] Figure 18 A cross-sectional view of an exemplary light-emitting structure 1800 according to some embodiments is shown, having a microlens located above a large microlens (or a microlens located further along the light-emitting path of the light-emitting structure relative to the large microlens), wherein the lateral dimension of the microlens is smaller than that of the large microlens. The array structure, size, shape, fabrication, and materials of the large microlens and the light-emitting platform (including associated reflectors and optional spacers) are the same as or similar to those of the light-emitting structures described in any of Figures 1-7. The materials, shapes, and fabrication of the microlenses are similar to those of the large microlenses as described above in Figures 1-7. In some embodiments, within the same microlens group and light-emitting platform, the light-emitting structure 1800 includes microlenses such as 1806 or 1808 and large microlenses such as 1802 or 1804. The large microlens such as 1802 or 1804 is formed above a light-emitting platform such as 401 or 403. The microlenses are formed above the large microlenses such as 1802 or 1804 and cover a portion of the surface of the large microlens but not the entire surface of the large microlens. Large microlenses, such as the 1802, have a larger diameter than small microlenses, such as the 1806, to improve light extraction efficiency. In... Figure 18In some embodiments shown, a microlens, such as 1806, is formed directly on a macrolens, such as 1802, such that the top surface of the macrolens remains unchanged (having its original shape, such as a hemisphere), while the bottom surface of the microlens conforms to the shape of the surface of the macrolens. In some embodiments, the overall shape of the microlens is hemispherical, but its bottom surface conforms to the shape of a portion of the top surface of the macrolens.

[0343] In some embodiments, such as Figure 18 As shown, the central axis of the microlens 1806 is defined as an axis perpendicular to the surface of the substrate 410, passing through the center of the complete sphere or other shape (such as an incomplete sphere or other shape) forming the microlens. In some embodiments, such as Figure 18 As shown, the central axis Q-Q' of the microlens 1806 and the central axis R-R' of the macrolens 1802 are shifted from the central axis P-P' of the emitting platform 401 to change the direction of light, while the central axis of the microlens 1806 is not coaxially aligned with (or is not the same as) the central axis of the macrolens 1802. Preferably, the offset distance between the central axis Q-Q' of the microlens 1806 and the central axis R-R' of the macrolens 1802 is not greater than 6 μm and not less than 4.5 μm. In some embodiments, the offset distance between the central axis of the macrolens 1802 and the central axis of the emitting platform 401 is not greater than 12 μm. Furthermore, for corresponding microlens groups and emitting platforms within the same display panel, the positions of the microlens relative to the macrolens can be different to obtain different light directions and angles.

[0344] In some embodiments, the edge of the microlens 1806 covers the central axis P-P' of the light-emitting platform 401, such as... Figure 18 As shown, the edge of the large microlens 1802 covers the central axis of the emitting platform 401, similarly as above. Figure 4 As described in [the document]. In other words, the central axis P-P' of the emitting platform 401 intersects the bottom surface of the microlens 1806, and the central axis P-P' of the emitting platform 401 intersects the bottom surface of the second microlens 1802. In another embodiment, only the edge of the large microlens 1802 covers the central axis P-P' of the emitting platform 401.

[0345] In some embodiments, light rays 1838 emitted from the light-emitting mesa 401 are redirected to 1840 while passing through the large microlens 1802 and are redirected to 1842 upon exiting the large microlens 1802. Light rays 1844 emitted from the light-emitting mesa 401 pass through the large microlens 1802, are then redirected to 1846 while passing through the small microlens 1806, and are redirected to 1848 upon exiting the small microlens 1806. Adding a small microlens above the large microlens can further direct and adjust the light within a portion of the LED pixel structure to a specific angle. For example, in Figure 18 In this process, the light emitted from the large microlens becomes more focused in certain directions around the luminous platform.

[0346] In some embodiments, for Figure 18 The simulation results of the light emitted by the large and small microlenses of the 1800 light-emitting structure shown are very similar to those of... Figures 14A-14B As shown in the figure, Figure 13 The example shown illustrates a case where the microlens is located within a macrolens.

[0347] exist Figure 15-18 In some embodiments, preferably, the edge of the large microlens covers the central axis of the light-emitting platform, thereby avoiding a reduction in light extraction efficiency. Figure 15-18 In some preferred embodiments, the microlens is made of the same material as the macrolens to avoid light loss at the interface. Figure 15-18 In some embodiments, the material of the microlens is different from that of the macrolens; for example, the macrolens and microlenses have different refractive indices and different optical properties.

[0348] Figure 19 A cross-sectional view of an exemplary light-emitting structure 1900 according to some embodiments is shown, having at least two microlenses and light-emitting stage surfaces, with at least one pair having microlenses located within a large microlens, wherein the lateral dimension of the microlens is smaller than that of the large microlens. The array structure, dimensions, shape, fabrication, and materials of the large microlens and light-emitting stage surfaces (including associated reflectors and optional spacers) are consistent with any of those in Figures 1-7, particularly... Figure 4 The light-emitting structures described herein are the same as or similar. The materials, shapes, and fabrication of the microlenses are similar to those of the large microlenses described above in Figures 1-7. The light-emitting structure 1900 includes a first pair of large microlenses 402 and a light-emitting platform 401. The light-emitting structure 1900 includes a second pair of large microlenses 404 and a light-emitting platform 403, as well as a microlens 1902 located within the large microlenses 404.

[0349] Similar to the above Figure 8 , 10 12, and Figure 13As shown in any of the examples, within the same microlens group and emitting stage, the light-emitting structure 1900 includes a small microlens such as 1902 and a large microlens such as 404. The small microlens such as 1902 is formed on the emitting stage such as 403 and is located within the large microlens such as 404. The large microlens such as 404 is formed on the emitting stage such as 403 and covers the small microlens such as 1902. The diameter of the large microlens such as 404 is larger than the diameter of the small microlens such as 1902 to improve light extraction efficiency.

[0350] Within the same microlens group and emitting stage of the light-emitting structure 1900, the relative positions and offset distances between the central axis S-S' of the emitting stage 403, the central axis T-T' of the small microlens 1902, and the central axis U-U' of the large microlens 404 are as described above. Figure 8 , 10 The same as or similar to any of the descriptions in 1, 12, and 13.

[0351] In some embodiments, Figure 19 In the process, the offset distance between the central axis D-D' of the microlens 402 and the central axis C-C' of the corresponding light-emitting platform 401 is less than the offset distance between the central axis U-U' of the large microlens 404 and the central axis S-S' of the corresponding light-emitting platform 403.

[0352] Figure 20 A cross-sectional view of an exemplary light-emitting structure 2000, according to some embodiments, is shown, having at least two microlenses and light-emitting stage surfaces, wherein at least one pair has a microlens located above a large microlens (or a microlens located further along the light-emitting path of the light-emitting structure relative to the large microlens), wherein the lateral dimension of the microlens is smaller than that of the large microlens. The array structure, size, shape, fabrication, and materials of the large microlens and light-emitting stage surfaces (including associated reflectors and optional spacers) are consistent with any of those in Figures 1-7, particularly... Figure 4 The light-emitting structures described herein are the same as or similar. The materials, shapes, and fabrication of the microlenses are similar to those of the large microlenses described above in Figures 1-7. The light-emitting structure 1900 includes a first pair of large microlenses 402 and a light-emitting platform 401. The light-emitting structure 1900 includes a second pair of large microlenses 404 and a light-emitting platform 403, as well as a microlens 1902 located above the large microlenses 404.

[0353] With the above Figure 15-18Similarly, within the same microlens group and emitting stage, the light-emitting structure 2000 includes a small microlens such as 2002 and a large microlens such as 404. The large microlens such as 404 is formed on the emitting stage such as 403. The small microlens such as 2002 is formed above the large microlens such as 404 and covers a portion of the surface of the large microlens, but not the entire surface. The diameter of the large microlens such as 404 is larger than that of the small microlens such as 2002 to improve light extraction efficiency. Figure 20 In some embodiments shown, a microlens, such as 2002, is formed directly on a macrolens, such as 404, such that the top surface of the macrolens remains unchanged (having its original shape, such as a hemisphere), while the bottom surface of the microlens conforms to the shape of the surface of the macrolens. In some embodiments, the overall shape of the microlens is hemispherical, but its bottom surface conforms to the shape of a portion of the top surface of the macrolens.

[0354] Within the same microlens group and emitting stage of the light-emitting structure 2000, the relative positions and offset distances between the central axis S-S' of the emitting stage 403, the central axis T-T' of the small microlens 2002, and the central axis U-U' of the large microlens 404 are as described above. Figure 15-18 Any one of the descriptions is the same as or similar to any of them.

[0355] In some embodiments, Figure 20 In the process, the offset distance between the central axis D-D' of the microlens 402 and the central axis C-C' of the corresponding light-emitting stage 401 is greater than the offset distance between the central axis T-T' of the microlens 2002 and the central axis S-S' of the corresponding light-emitting stage 403.

[0356] In some embodiments, Figures 19-20 In any one of them, the material of the microlens 1902 or 2002 is the same as the material of the large microlens 404 in the same microlens group and emitting stage. In some embodiments, the material of the large microlens 402 is the same as the material of the microlens 1902 or 2002 in another microlens group and emitting stage.

[0357] Figure 21 A cross-sectional view of an exemplary light-emitting structure 2100 having at least one microlens group and a light-emitting stage surface is shown according to some embodiments. The structure, size, shape, fabrication, and materials of the array of microlenses 102 and light-emitting stage surfaces 101 (including associated reflectors and optional spacers) are particularly consistent with any of Figures 1-7. Figure 1A The luminescent structures described herein are the same as or similar. Figure 21In this embodiment, a microlens 2102 is formed above the microlens 102. In some embodiments, the microlens 2102 covers and contacts the top surface of the microlens 102. The material and fabrication of the microlens 2102 are similar to those of the microlens 102 as described above in Figures 1-7. In some embodiments, the central axis of the microlens 102 and the central axis of the microlens 2102 are coaxially aligned or identical. In some embodiments as described above, the central axis of the microlens 102 is not coaxially aligned or identical to the central axis B-B' of the light-emitting platform 101. In a preferred embodiment, the central axis of the microlens 102 is coaxially aligned or identical to the central axis B-B' of the light-emitting platform 101. In some embodiments, the horizontal dimension of the microlens 2102 is equal to or greater than the horizontal dimension of the microlens 102.

[0358] In some embodiments, the material of microlens 2102 is different from the material of microlens 102. In some embodiments, the refractive index of microlens 102 is higher than that of microlens 2102, thereby improving light extraction efficiency. The light direction of the self-emitting platform 101 is changed via microlens 102 and microlens 2102. For example, light ray 2104 emitted from the central axis of the emitting platform 101 passes through microlens 102 and microlens 2102, and is redirected to 2106 when exiting microlens 2102. Light ray 2108 emitted from the emitting platform 101 passes through microlens 102, is redirected to 2110 during its passage through microlens 2102, and is redirected to 2112 when exiting microlens 2102.

[0359] exist Figure 21 In some embodiments, the bottom of microlens 2102 conforms to the top surface of microlens 102. In some embodiments, microlens 102 has a hemispherical shape. In some embodiments, microlens 2102 has a cylindrical structure with a polygonal cross-section, disregarding the portion cut off from microlens 102. When viewed from a cross-sectional view and disregarding the portion cut off from microlens 102, the polygonal structure can be a planar figure described by a closed polygonal chain formed by connecting a finite number of straight line segments. For example, the simplified figure can be a unilateral, diagonal, triangle, quadrilateral, pentagon, hexagon, heptagon, octagon, decagon, unequal side, dodecagon, thirteen-sided, fourteen-sided, fifteen-sided, sixteen-sided, seventeen-sided, eighteen-sided, nineteen-sided, twenty-four-sided, thirty-sided, forty-sided, fifty-sided, sixty-sided, seventy-sided, eighty-sided, ninety-sided, one hundred-sided, or other regular or irregular shapes.

[0360] like Figure 21As shown, in some embodiments, disregarding the portion cut off by the microlens 102, the polygonal cross-section is a trapezoid with a sloping top surface 2130. In some embodiments, the sloping top surface 2130 has an angle in the range of 10-80 degrees relative to an axis perpendicular to the surface of the substrate 110. In some embodiments, the sloping top surface 2130 has an angle in the range of 30-60 degrees relative to an axis perpendicular to the surface of the substrate 110. In some embodiments, the sloping top surface may be curved, wavy, or a combination thereof.

[0361] Adding a microlens 2102 above the microlens 102 can further direct and adjust the light from the light-emitting platform to a certain angle. For example, in Figure 21 In this display, light emitted from microlens 102 is more focused in certain directions around the light-emitting platform. Therefore, even when the central axis of the light-emitting platform 101 and the central axis of microlens 102 are the same, the light emitted from microlens 102 can still be redirected at a certain angle as it passes through and exits microlens 2102. Furthermore, the light emission angle and intensity can be further adjusted when the offsets of the central axes of microlens 102 and microlens 2102 relative to the central axis of the light-emitting platform 101 are changed. For example, the central axis of microlens 2102 does not need to be the same as the central axis of microlens 102 or the central axis of the light-emitting platform 101, and the offsets can be different within the same display.

[0362] Figure 22 A cross-sectional view of an exemplary light-emitting structure 2200 having at least one microlens group and a light-emitting stage surface is shown according to some embodiments. The structure, size, shape, fabrication, and materials of the array of microlenses 102 and light-emitting stage surfaces 101 (including associated reflectors and optional spacers) are particularly consistent with any of Figures 1-7. Figure 1A The luminescent structures described in [the text] are the same as or similar to those described in [the text]. Figure 22 In this embodiment, a microlens 2202 is formed above a microlens 102. In some embodiments, the microlens 2202 covers and contacts the top surface of the microlens 102. The material and fabrication of the microlens 2202 are similar to those of the microlens 102 as described above in Figures 1-7. In some embodiments, the central axis of the microlens 102 and the central axis of the microlens 2202 are coaxially aligned or identical. In some embodiments as described above, the central axis of the microlens 102 is not coaxially aligned or identical to the central axis B-B' of the light-emitting platform 101. In a preferred embodiment, the central axis of the microlens 102 is coaxially aligned or identical to the central axis B-B' of the light-emitting platform 101. In some embodiments, the horizontal dimension of the microlens 2202 is equal to or greater than the horizontal dimension of the microlens 102.

[0363] In some embodiments, the material of microlens 2202 is different from the material of microlens 102. In some embodiments, the refractive index of microlens 102 is higher than that of microlens 2202, thereby improving light extraction efficiency. The light direction of the self-emitting mesa 101 is changed via microlens 102 and microlens 2202. For example, light ray 2204 emitted from the central axis of the emitting mesa 101 passes through microlens 102 and microlens 2202, and is redirected to 2206 when exiting microlens 2202. Light ray 2208 emitted from the emitting mesa 101 passes through microlens 102, is redirected to 2210 during its passage through microlens 2202, and is redirected to 2212 when exiting microlens 2202.

[0364] exist Figure 22 In some embodiments, the bottom of microlens 2202 conforms to the top curved surface of microlens 102. In some embodiments, microlens 102 has a hemispherical shape. In some embodiments, when the cut-off portion of microlens 102 is disregarded, microlens 2202 has a cylindrical structure with a triangular cross-section. Figure 22 As shown, in some embodiments, the microlens 2202 has an inclined top surface 2230. In some embodiments, the inclined top surface 2230 has an angle in the range of 10-80 degrees relative to an axis perpendicular to the surface of the substrate 110. In some embodiments, the inclined top surface 2230 has an angle in the range of 30-60 degrees relative to an axis perpendicular to the surface of the substrate 110.

[0365] Adding a microlens 2202 above the microlens 102 can further direct and adjust the light from the light-emitting platform to a certain angle. For example, in Figure 22 In this display, light emitted from microlens 102 is more focused in certain directions around the light-emitting platform. Therefore, even when the central axis of the light-emitting platform 101 and the central axis of microlens 102 are the same, the light emitted from microlens 102 can still be redirected at a certain angle as it passes through and exits microlens 2202. Furthermore, the light emission angle and intensity can be further adjusted when the offsets of the central axes of microlens 102 and microlens 2202 relative to the central axis of the light-emitting platform 101 are changed. For example, the central axis of microlens 2202 does not need to be the same as the central axis of microlens 102 or the central axis of the light-emitting platform 101, and the offsets can be different within the same display.

[0366] Figure 23 A cross-sectional view of an exemplary light-emitting structure 2300 having at least one microlens group and a light-emitting stage surface is shown according to some embodiments. The structure, size, shape, fabrication, and materials of the array of microlenses 102 and light-emitting stage surfaces 101 (including associated reflectors and optional spacers) are particularly consistent with any of Figures 1-7. Figure 1AThe luminescent structures described in [the text] are the same as or similar to those described in [the text]. Figure 23 In this embodiment, a microlens 2302 is formed above the microlens 102. In some embodiments, the microlens 2302 covers and contacts the top surface of the microlens 102. The material and fabrication of the microlens 2302 are similar to those of the microlens 102 as described above in Figures 1-7. In some embodiments, the central axis of the microlens 102 and the central axis of the microlens 2302 are coaxially aligned or identical. In some embodiments as described above, the central axis of the microlens 102 is not coaxially aligned or identical to the central axis B-B' of the light-emitting platform 101. In a preferred embodiment, the central axis of the microlens 102 is coaxially aligned or identical to the central axis B-B' of the light-emitting platform 101. In some embodiments, the horizontal dimension of the microlens 2302 is equal to or greater than the horizontal dimension of the microlens 102.

[0367] In some embodiments, the material of microlens 2302 is different from the material of microlens 102. In some embodiments, the refractive index of microlens 102 is higher than that of microlens 2302, thereby improving light extraction efficiency. The light direction of the self-emitting platform 101 is changed via microlens 102 and microlens 2302. For example, light ray 2304 emitted from the central axis of the emitting platform 101 passes through microlens 102 and microlens 2302, and is redirected to 2306 when exiting microlens 2302. Light ray 2308 emitted from the emitting platform 101 passes through microlens 102, is redirected to 2310 during its passage through microlens 2302, and is redirected to 2312 when exiting microlens 2302.

[0368] exist Figure 23 In some embodiments, the bottom of microlens 2302 conforms to the top curved surface of microlens 102. In some embodiments, microlens 102 has a hemispherical shape. In some exemplary embodiments, the composite structure may be a combination of two or more structures. In some embodiments, microlens 2302 is a composite structure having two shaped components 2302-1 and 2302-2. Microlens component 2302-1 is formed at the bottom of microlens component 2302-2. In some embodiments, when the portion cut off from microlens 102 is disregarded, microlens component 2302-1 has a cylindrical structure with a polygonal cross-section. Figure 23 As shown, in some embodiments, disregarding the portion cut off by the microlens 102, the polygonal cross-section is a trapezoid with a sloping top surface 2330. For example... Figure 23As shown, in some embodiments, the microlens component 2302-1 has an inclined top surface 2330. In some embodiments, the inclined top surface 2330 has an angle in the range of 10-80 degrees relative to an axis perpendicular to the surface of the substrate 110. In some embodiments, the inclined top surface 2330 has an angle in the range of 30-60 degrees relative to an axis perpendicular to the surface of the substrate 110. Figure 23 As shown, in some embodiments, microlens component 2302-2 has a hemispherical shape with a flat bottom side surface and a convex top side surface. The flat bottom side surface of microlens component 2302-2 seamlessly contacts and covers the inclined top surface 2330 of microlens component 2302-1. The flat bottom side surface of microlens component 2302-2 and the inclined top surface 2330 of microlens component 2302-1 have the same shape and size, and they are both inclined at the same angle relative to an axis perpendicular to the surface of substrate 110. The two microlens components 2302-1 and 2302-2 are integral parts of microlens 2302 and form the composite shape of microlens 2302.

[0369] Adding a microlens 2302 above the microlens 102 can further direct and adjust the light from the light-emitting platform to a certain angle. For example, in Figure 23 In this display, light emitted from microlens 102 is more focused in certain directions around the light-emitting platform. Therefore, even when the central axis of the light-emitting platform 101 and the central axis of microlens 102 are the same, the light emitted from microlens 102 can still be redirected at a certain angle as it passes through and exits microlens 2302. Furthermore, the light emission angle and intensity can be further adjusted when the offsets of the central axes of microlens 102 and microlens 2302 relative to the central axis of the light-emitting platform 101 are changed. For example, the central axis of microlens 2302 does not need to be the same as the central axis of microlens 102 or the central axis of the light-emitting platform 101, and the offsets can be different within the same display.

[0370] Figure 24 A cross-sectional view of an exemplary light-emitting structure 2400 having at least one microlens group and a light-emitting stage surface is shown according to some embodiments. The structure, size, shape, fabrication, and materials of the array of microlens 102 and light-emitting stage surface 101 (including associated reflectors and optional spacers) are particularly consistent with any of Figures 1-7. Figure 1A The luminescent structures described in [the text] are the same as or similar to those described in [the text]. Figure 24In this embodiment, a microlens 2402 is formed above the microlens 102. In some embodiments, the microlens 2402 covers and contacts the top surface of the microlens 102. The material and fabrication of the microlens 2402 are similar to those of the microlens 102 as described above in Figures 1-7. In some embodiments, the central axis of the microlens 102 and the central axis of the microlens 2402 are coaxially aligned or identical. In some embodiments as described above, the central axis of the microlens 102 is not coaxially aligned or identical to the central axis B-B' of the light-emitting platform 101. In a preferred embodiment, the central axis of the microlens 102 is coaxially aligned or identical to the central axis B-B' of the light-emitting platform 101. In some embodiments, the horizontal dimension of the microlens 2402 is equal to or greater than the horizontal dimension of the microlens 102.

[0371] In some embodiments, the material of microlens 2402 is different from the material of microlens 102. In some embodiments, the refractive index of microlens 102 is higher than that of microlens 2402, thereby improving light extraction efficiency. The light direction of the self-emitting mesa 101 is changed via microlens 102 and microlens 2402. For example, light ray 2404 emitted from the central axis of the emitting mesa 101 passes through microlens 102 and microlens 2402, and is redirected to 2406 when exiting microlens 2402. Light ray 2408 emitted from the emitting mesa 101 passes through microlens 102, is redirected to 2410 during its passage through microlens 2402, and is redirected to 2412 when exiting microlens 2412.

[0372] exist Figure 24 In some embodiments, the bottom of microlens 2402 conforms to the top curved surface of microlens 102. In some embodiments, microlens 102 has a hemispherical shape. In some embodiments, microlens 2402 is a composite structure having two shaped components 2402-1 and 2402-2. Microlens component 2402-1 is formed at the bottom of microlens component 2402-2. When the portion cut off from microlens 102 is disregarded, microlens component 2402-1 has a cylindrical structure with a triangular cross-section. Figure 24 As shown, in some embodiments, the microlens component 2402-1 has an inclined top surface 2430. In some embodiments, the inclined top surface 2430 has an angle in the range of 10-80 degrees relative to an axis perpendicular to the surface of the substrate 110. In some embodiments, the inclined top surface 2430 has an angle in the range of 30-60 degrees relative to an axis perpendicular to the surface of the substrate 110. Figure 24As shown, in some embodiments, microlens component 2402-2 has a hemispherical shape with a flat bottom side surface and a convex top side surface. The flat bottom side surface of microlens component 2402-2 seamlessly contacts and covers the inclined top surface 2430 of microlens component 2402-1. The flat bottom side surface of microlens component 2402-2 and the inclined top surface 2430 of microlens component 2402-1 have the same shape and size, and they are both inclined at the same angle relative to an axis perpendicular to the surface of substrate 110. The two microlens components 2402-1 and 2402-2 are integral parts of microlens 2402 and form the composite shape of microlens 2402.

[0373] Adding a microlens 2402 above the microlens 102 can further direct and adjust the light from the light-emitting platform to a certain angle. For example, in Figure 24 In this display, light emitted from microlens 102 is more focused in certain directions around the light-emitting platform. Therefore, even when the central axis of the light-emitting platform 101 and the central axis of microlens 102 are the same, the light emitted from microlens 102 can still be redirected at a certain angle as it passes through and exits microlens 2402. Furthermore, the light emission angle and intensity can be further adjusted when the offsets of the central axes of microlens 102 and microlens 2402 relative to the central axis of the light-emitting platform 101 are changed. For example, the central axis of microlens 2402 does not need to be the same as the central axis of microlens 102 or the central axis of the light-emitting platform 101, and the offsets can vary within the same display.

[0374] Figure 25 A cross-sectional view of an exemplary light-emitting structure 2500 having at least one microlens group and a light-emitting stage surface is shown according to some embodiments. The structure, size, shape, fabrication, and materials of the array of microlenses 102 and light-emitting stage surfaces 101 (including associated reflectors and optional spacers) are particularly consistent with any of Figures 1-7. Figure 1A The luminescent structures described in [the text] are the same as or similar to those described in [the text]. Figure 25 In this embodiment, a microlens 2502 is formed above a microlens 102. In some embodiments, the microlens 2502 covers and contacts the top surface of the microlens 102. In some embodiments, the material and fabrication of the microlens 2502 are similar to those of the microlens 102 as described above in Figures 1-7. In some embodiments, the microlens 2502 is a diffractive microlens. In some embodiments, the central axis of the microlens 102 intersects the center point of the top surface 2540 of the diffractive microlens 2502. In a preferred embodiment, the central axis of the microlens 102 is coaxially aligned with or the same as the central axis B-B' of the emitting stage 101. In some embodiments, the horizontal dimension of the microlens 2502 is equal to or greater than the horizontal dimension of the microlens 102.

[0375] In some embodiments, the material of microlens 2502 is different from the material of microlens 102. In some embodiments, the refractive index of microlens 102 is higher than that of microlens 2502, improving light extraction efficiency. In some embodiments, the refractive index of microlens 102 is lower than that of microlens 2502. The light direction of the self-emitting platform 101 is changed via microlens 102 and microlens 2502. For example, light ray 2504 emitted from the central axis of the emitting platform 101 passes through microlens 102 and microlens 2502, and is redirected to 2506 when exiting microlens 1502. Light ray 2508 emitted from the emitting platform 101 passes through microlens 102, is redirected to 2510 during its passage through microlens 2502, and is redirected to 2512 when exiting microlens 2502.

[0376] exist Figure 25 In some embodiments, the bottom of microlens 2502 conforms to the top curvature of microlens 102. In some embodiments, microlens 102 has a hemispherical shape. In some embodiments, microlens 2502 is a composite structure having four shape components 2502-1, 2502-2, 2502-3, and 2502-4. In some embodiments, when the cut-off portion of microlens 102 is disregarded, microlens component 2502-1 has a cylindrical structure with a polygonal cross-section. Figure 25 As shown, in some embodiments, disregarding the portion cut off by the microlens 102, the polygonal cross-section is a trapezoid with a sloping top surface 2530. In some other embodiments, in Figure 25 As not shown, when the portion cut off by the microlens 102 is not considered, the microlens component 2502-1 has a cylindrical structure with a triangular cross-section, similar to the one shown above. Figure 22 and 24 The microlens component described herein. Microlens component 2502-1 is formed at the bottom of microlens components 2502-2, 2502-3 and 2502-4.

[0377] like Figure 25 As shown, in some embodiments, the microlens component 2502-1 has an inclined top surface 2530. In some embodiments, the inclined top surface 2530 has an angle in the range of 10-80 degrees relative to an axis perpendicular to the surface of the substrate 110. In some embodiments, the inclined top surface 2530 has an angle in the range of 30-60 degrees relative to an axis perpendicular to the surface of the substrate 110. Figure 25As shown, in some embodiments, the microlens component 2502-2 has a hemispherical shape with a flat bottom surface and a convex top surface. In some embodiments, the microlens component 2502-2 has a central axis V-V' passing through the center point of the top surface and the center point of the bottom surface of the hemispherical microlens component 2502-2. In some embodiments, the center point may refer to a point related to a geometry such that for any point on the geometry, there exists another point on the geometry, and the straight line connecting these two points is bisected by the origin. For example, the diffractive microlens 2502 may be a hemispherical structure, so the center point of the top surface of the diffractive microlens 2502 may refer to the highest point of the top surface of the hemispherical structure.

[0378] The central axis V-V' is inclined, while the central axis of microlens 102 is vertical. In some embodiments, the central axis V-V' of microlens component 2502-2 is perpendicular to the inclined top surface 2530 of microlens component 2502-1. The flat bottom side surface of microlens component 2502-2 seamlessly contacts and covers the middle portion of the inclined top surface 2530 of microlens component 2502-1. The flat bottom side surface of microlens component 2502-2 and the inclined top surface 2530 of microlens component 2502-1 are in contact with each other, and they are both inclined at the same angle relative to the axis perpendicular to the surface of substrate 110. In some embodiments, polygonal structures such as microlens components 2502-3 and 2502-4 are formed around microlens component 2502-2. Figure 25 The cross-section is adjusted to increase diffraction. In some embodiments, the polygonal structure is similar to... Figure 2C The stepped structure described herein. In some embodiments, the stepped structure microlens components 2502-3 and 2502-4 have a stepped top surface that rises toward the edge of the microlens 2502. In some embodiments, the microlens components 2502-3 and 2502-4 have multiple surfaces tilted at different angles to redirect light from the light-emitting structure 2500 to different directions. The four microlens components 2502-1, 2502-2, 2502-3, and 2502-4 are integral parts of the microlens 2502 and form the composite shape of the microlens 2502. In some embodiments, the microlens 2502 has multiple surfaces tilted at different angles to redirect light from the light-emitting structure 2500 to different directions.

[0379] Adding a diffraction microlens 2502 above the microlens 102 can further direct and adjust the light from the light-emitting stage to a certain angle. For example, in Figure 25In this display, light emitted from microlens 102 exhibits greater diffraction in certain directions around the emitting platform. Therefore, even when the central axis of the emitting platform 101 and the central axis of microlens 102 are the same, the light emitted from microlens 102 can still be redirected at multiple angles as it passes through and exits microlens 2502. Furthermore, the light emission angle and intensity can be further adjusted when the offsets of the central axes of microlens 102 and microlens 2502 relative to the central axis of the emitting platform 101 are changed. For example, the central axis of microlens 2502 does not need to be the same as the central axis of microlens 102 or the central axis of the emitting platform 101, and the offsets can vary within the same display.

[0380] In some embodiments, light of a specific wavelength can be selectively passed through or reflected by the diffractive microlens 2502, depending on its design. In some embodiments, the diffractive lens may be above the microlens 102, and the bottom surface of the diffractive microlens 2502 is not larger than the bottom surface of the microlens 102.

[0381] In some embodiments, the diffractive microlens 2502 may include a single slit, at which the diffraction effect may occur. In some embodiments, the diffractive microlens 2502 may include two slits, at which the diffraction effect may occur. In some embodiments, the diffractive microlens 2502 may include one or more circular apertures, at which the diffraction effect may occur. In some embodiments, the diffractive microlens 2502 may include one or more periodic and / or aperiodic structures, at which the diffraction effect may occur.

[0382] In some exemplary embodiments, the diffractive microlens 2502 may be a Bragg reflector. A Bragg reflector may comprise layers of two different optical materials arranged in an alternating order. For example, a Bragg reflector may be a quarter-wavelength reflector. Each layer of optical material may have a different thickness corresponding to a quarter of the wavelength the Bragg reflector is designed for. When the Bragg reflector is designed for a larger angle of incidence, thicker layers may be required accordingly. Thus, selected wavelengths of light emitted from the luminescent platform and / or light passing through the microlens can be reflected by the Bragg reflector. In some embodiments, the Bragg reflector is implemented on the top surface of the microlens 2502. In some embodiments, the Bragg reflector is implemented only on the surfaces of microlens components 2502-3 and 2502-4.

[0383] In some embodiments, the Bragg reflector for the red LED comprises multiple layers of Au and / or indium tin oxide (ITO).

[0384] In one example, the Bragg reflector may comprise alternating layers of TiO2 and SiO2. In one example, the following distributed Bragg reflector (DBR) structures shown in Table 1 can be used to reflect green light emitted by a green LED:

[0385] Table 1: DBR layer structure used for green LED reflective layer.

[0386]

[0387] In one example, the following DBR structure shown in Table 2 can be used to reflect blue light emitted by a blue LED:

[0388] Table 2: DBR layer structure of blue LED reflective layer.

[0389]

[0390] The light-emitting structure 2500 can use Bragg mirrors with different structures. In some embodiments, the Bragg mirror can be a dielectric mirror based on thin-film coating technology, such as electron beam evaporation or ion beam sputtering. In these embodiments, the Bragg mirror can include amorphous materials. In some embodiments, the Bragg mirror can be a fiber Bragg grating, including a long-period fiber grating. In these embodiments, the fiber Bragg grating can be fabricated by irradiating an optical fiber with spatially patterned ultraviolet light. In some embodiments, the Bragg mirror can be a bulk Bragg grating, which can be fabricated in a photosensitive bulk glass. In some embodiments, the Bragg mirror can be a semiconductor Bragg mirror, which can be fabricated using photolithography. Other types of Bragg mirrors can be applied based on, for example, a corrugated waveguide structure that can be fabricated using photolithography.

[0391] In some embodiments, the Bragg reflector can use a multilayer reflector design other than a simple quarter-wavelength design. In these embodiments, the Bragg reflector can have a lower reflectivity for the same number of layers, but can be optimized, for example, as a dichroic mirror or a dispersion-chirped mirror for dispersion compensation.

[0392] In some embodiments, such as Figure 1A As shown, the microlens 102 can be formed into many different shapes or composite shapes. Figure 26 A cross-sectional view of an exemplary light-emitting structure 2600 having at least one microlens and a light-emitting stage surface is shown according to some embodiments. The structure, dimensions, shape, fabrication, and materials of the array of microlenses 2602 and light-emitting stages surface 2601 (including associated reflectors and optional spacers) are consistent with any of the structures in Figures 1-7, particularly those in Figures 1-7. Figure 1AThe light-emitting structures described herein are the same as or similar. In some embodiments, the microlens 2602 is an elliptical microlens formed by combining a quarter-sphere and a quarter-ellipsoid. In some embodiments, Figure 26 Not shown in the image. Figure 8-25 Other microlenses described herein may be formed above or inside microlens 2602.

[0393] In a preferred embodiment, the central axis of the microlens 2602 (the axis that passes through the center point of the bottom surface of the microlens 2602 and is perpendicular to the substrate surface) is not aligned with or is different from the central axis of the light-emitting platform 2601.

[0394] In some embodiments, the microlens 2602 is a composite structure having two shape components 2602-1 and 2602-2. In some embodiments, microlens component 2602-1 is a quarter-sphere. In some embodiments, microlens component 2602-2 is a quarter-ellipsoid. The two shape components 2602-1 and 2602-2 are seamlessly formed and joined together. For example, the diameter of microlens component 2602-1 matches the diameter of microlens component 2602-2 along the Z-direction and the diameter along the direction perpendicular to the cross-section 2600. The two microlens components 2602-1 and 2602-2 are integral parts of microlens 2602 and form the composite shape of microlens 2602.

[0395] The direction of light from the light-emitting platform 2601 is changed at different angles from different surfaces of the microlens 2602 through the microlens 2602. Figure 26 Simulations of the light paths from the emitting platform 2601 to the microlens 2602, including diffraction and reflection effects, are shown. For example, light ray 2604 emitted from the central axis of the emitting platform 2601 passes through the microlens 2602 and is redirected to 2606 upon exiting the microlens 2602. Light ray 2608 emitted from the emitting platform 2601 passes through the microlens 2602 and is redirected to 2610 upon exiting the microlens 2602.

[0396] In some embodiments, the radius of the sphere is no greater than 9 μm and the major axis of the ellipsoid is no greater than 18 μm. In some embodiments, similar to Figure 1A In order to improve light extraction efficiency, the central axis of the microlens 102 is offset from the central axis of the light-emitting stage 2601 by no more than 4.5 μm in the horizontal position. In some embodiments, similar to Figure 1A The edge of the microlens 102 and microlens 2602 covers the central axis of the light-emitting platform 2601.

[0397] The composite asymmetric shape of the microlens 2602 can further direct and adjust the light from the emitting platform to a certain angle. For example, in Figure 26 In this display, light emitted from microlens 2602 exhibits greater diffraction in certain directions around the emitting platform and greater focusing in others. Therefore, even when the central axis of the emitting platform 2601 and the central axis of microlens 2602 are the same, the light emitted from microlens 2602 can still be redirected at multiple angles as it passes through and exits microlens 2602. Furthermore, the light exit angle and intensity can be further adjusted when the offsets of the central axes of microlens 2602 and the microlens above microlens 2602 relative to the central axis of the emitting platform 2601 are changed. For example, the central axis of the microlens above microlens 2602 does not need to be the same as the central axis of microlens 2602 or the central axis of the emitting platform 2601, and the offsets can vary within the same display.

[0398] Figure 27 A cross-sectional view is shown of an exemplary light-emitting structure 2700 according to some embodiments, having at least two microlenses and light-emitting stage surfaces, with at least one microlens having a notched portion covered by a reflective portion. The array structure, dimensions, shape (excluding the notch), fabrication, and materials of the microlenses and light-emitting stage surfaces (including associated reflectors and optional spacers) are consistent with any of Figures 1-7, particularly... Figure 4 The light-emitting structures described herein are the same as or similar. Light-emitting structure 2700 includes a first pair of microlenses 2702 and a light-emitting mesa 401. Light-emitting structure 2700 also includes a second pair of microlenses 2704 and a light-emitting mesa 403.

[0399] In some embodiments, microlenses 2702 or 2704 have a cut-out portion as a notch on one side of the top surface of the microlens. In one example, notch 2710 leaves a sloping flat surface on microlens 2702. In another example, notch 2720 leaves a curved surface on microlens 2704. In some embodiments, a reflective portion is formed on or attached to the surface of the notch. For example, reflective portion 2712 is formed on the surface of notch 2710. Reflective portion 2722 is formed on the surface of notch 2720. The reflective portion is a surface that conforms to the shape of the surface of the notch on the microlens. For example, reflective portion 2712 on microlens 2702 is a sloping flat surface layer. Reflective portion 2722 on microlens 2704 is a curved surface layer. The shapes of the notch and reflective portion are not limited to flat and curved shapes; other shapes such as rectangles, triangles, squares, polygons, and other composite shapes are also possible.

[0400] In some embodiments, the reflective portion 2712 or 2722 may include a reflective layer to improve light reflection within a specific portion of the microlens. In these embodiments, the reflective layer may have a high reflectivity. For example, the reflectivity of the reflective layer may be greater than 60%. In another example, the reflectivity of the reflective layer may be greater than 70%. In yet another example, the reflectivity of the reflective layer may be greater than 80%. However, in these embodiments, the material of the reflective layer may include one or more metals selected from Rh, Al, Ag, and Au, or may include two sublayers with different refractive indices. In some embodiments, the reflective layer may be as described above. Figure 25 The Bragg reflector as described.

[0401] In some embodiments, the direction of light rays from the light-emitting platform 401 is changed at different angles from different surfaces of the microlens 2702 via the microlens 2702 and the reflector 2712. For example, light ray 2714 emitted from the light-emitting platform 401 passes through the microlens 2702, is reflected as 2716 within the microlens 2702, and is redirected as 2718 when exiting the microlens 2702. In some embodiments, the direction of light rays from the light-emitting platform 403 is changed at different angles from different surfaces of the microlens 2704 via the microlens 2704 and the reflector 2722. For example, light ray 2724 emitted from the light-emitting platform 403 passes through the microlens 2704, is reflected as 2726 within the microlens 2704, and is redirected as 2728 when exiting the microlens 2704.

[0402] The asymmetrical shape of the notched microlens, combined with the reflective element, can further direct and adjust the light from the emitting platform to a specific angle. For example, in Figure 27 In this display, light emitted from microlenses 2702 or 2704 exhibits greater diffraction in certain directions around the luminescent platform and greater focusing in others. Therefore, even when the central axis of the luminescent platform, such as 401, is the same as the central axis of the microlens, such as 2702, the light emitted from microlens 2702 can still be redirected at multiple angles as it passes through and exits microlens 2702. Furthermore, the angle and intensity of the emitted light can be further adjusted when the offset of the central axis of the microlens, such as 2702, relative to the central axis of the luminescent platform, such as 401, and the position of a notch, such as 2710, on the microlens are changed. For example, the offset between the central axis of the microlens and the central axis of the luminescent platform, the position of the notch, and the shape and type of the notch can differ within the same display.

[0403] Although the detailed description includes many details, these should not be construed as limiting the scope of the invention but merely as illustrating different examples and aspects of the invention. It should be understood that the scope of the invention includes other embodiments not discussed in detail above. For example, microlenses with bases of different shapes, such as square bases or other polygonal bases, may also be used. Various other modifications, alterations, and variations in the arrangement, operation, and details of the methods and apparatus of the invention disclosed herein will be apparent to those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims. Therefore, the scope of the invention should be determined by the appended claims and their legal equivalents.

[0404] Other embodiments include various subsets that combine or otherwise rearrange the embodiments shown in Figures 1-27 in various other embodiments. For example, within the same display panel, each embodiment of the microlens(group) and luminescent platform structure described in any of Figures 1-27 can be combined with any other embodiment described in Figures 1-27.

[0405] Figure 28 This is a top view of a micro LED display panel 2800 according to some embodiments. The display panel 2800 includes a data interface 2810, a control module 2820, and a pixel area 2850. The data interface 2810 receives data defining the image to be displayed. The source and format of this data will vary depending on the application. The control module 2820 receives the input data and converts it into a form suitable for driving the pixels in the display panel. The control module 2820 may include: digital logic and / or a state machine to convert from the received format to a format suitable for the pixel area 2850, shift registers or other types of buffers and memories to store and transfer data, a digital-to-analog converter and a level converter, and a scan controller including clock circuitry.

[0406] Pixel region 2850 includes a mesa array containing pixels (in Figure 28 (Not shown separately in LED 2834). Pixels include microLEDs such as monochrome or multicolor LEDs 2834 integrated with, for example, a pixel driver as described above. Array of microlenses ( Figure 28 (Not shown separately in LED 2834) covers the top of the tiered array. In this example, the display panel 2800 is a color RGB display panel. It includes red, green, and blue pixels. Within each pixel, LED 2834 is controlled by a pixel driver. According to the previously shown embodiment, the pixel is in contact with a power supply voltage (not shown), ground via a grounding pad 2836, and also with control signals. Although in Figure 28Not shown, the p-electrode of LED 2834 is electrically connected to the output of the driving transistor. LED current drive signal connections (between the p-electrode of the LED and the output of the pixel driver), ground connections (between the n-electrode and system ground), power supply voltage Vdd connections (between the source of the pixel driver and system Vdd), and control signal connections to the pixel driver gate are made according to various embodiments. Any microlens array disclosed herein can be implemented using a microLED display panel 2800.

[0407] Figure 28 This is just a representative illustration. Other designs will be obvious. For example, the colors don't have to be red, green, and blue. Nor do they have to be arranged in rows or bars. As an example, besides Figure 28 In addition to the square matrix arrangement of pixels shown, the hexagonal matrix arrangement of pixels can also be used to form the display panel 2800.

[0408] In some applications, a fully programmable rectangular pixel array is not necessary. Other designs for display panels and displays with various shapes can also be formed using the device structures described herein. One class of examples is professional applications, including signage and automotive. For instance, multiple pixels can be arranged in a star or spiral shape to form a display panel, and different patterns on the display panel can be generated by turning the LEDs on and off. Another professional example is automotive headlights and intelligent lighting, where certain pixels are grouped together to form various lighting shapes, and each group of LED pixels can be turned on or off or otherwise adjusted by individual pixel drivers.

[0409] Even the lateral arrangement of devices within each pixel can be varied. Figure 1A In this configuration, the LEDs and pixel drivers are arranged vertically, meaning each LED is positioned above its corresponding pixel driver circuit. Other arrangements are also possible. For example, the pixel drivers could also be located "behind," "in front of," or "beside" the LEDs.

[0410] Different types of display panels can be manufactured. For example, the resolution of display panels typically ranges from 8×8 to 3840×2160. Common display resolutions include QVGA (320×240 with a 4:3 aspect ratio), XGA (1024×768 with a 4:3 aspect ratio), D (1280×720 with a 16:9 aspect ratio), FHD (1920×1080 with a 16:9 aspect ratio), UHD (3840×2160 with a 16:9 aspect ratio), and 4K (326×2160). A wide variety of pixel sizes are also available, ranging from submicron and below to 10mm and above. The overall display area size can also vary widely, from diagonally small to tens of micrometers or smaller to hundreds of inches or larger.

[0411] Different applications will also have different requirements for optical brightness and viewing angle. Example applications include direct-view displays for home / office projectors and portable electronics such as smartphones, laptops, wearable electronics, AR and VR glasses, and light engines for retinal projection. Power consumption can vary from as low as a few milliwatts for retinal projectors to up to kilowatts for large-screen outdoor displays, projectors, and smart car headlights. In terms of frame rate, due to the fast response (nanosecond level) of inorganic LEDs, frame rates can reach the kHz level, or even the MHz level for low resolutions.

[0412] Other embodiments include various subsets that combine or otherwise rearrange the embodiments shown in Figures 1-28 in various other embodiments.

[0413] While the detailed description contains many details, these should not be construed as limiting the scope of the invention, but merely as illustrating different examples and aspects of the invention. It should be understood that the scope of the invention includes other embodiments not discussed in detail above. For example, the methods described above can be applied to the integration of non-LED and OLED functional devices with control circuitry that is not pixel driver-based. Examples of non-LED devices include vertical-cavity surface-emitting lasers (VCSELs), photodetectors, microelectromechanical systems (MEMS), silicon photonic devices, power electronic devices, and distributed feedback lasers (DFBs). Examples of other control circuitry include current drivers, voltage drivers, transimpedance amplifiers, and logic circuits.

[0414] The foregoing description of the disclosed embodiments is provided to enable making or using the embodiments and variations thereof described herein. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments without departing from the spirit or scope of the subject matter disclosed herein. Therefore, this disclosure is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the following claims and the principles and novel features disclosed herein.

[0415] The features of this invention can be implemented using a computer program product or with the aid of a computer program product, such as a storage medium (of various media) or a computer-readable storage medium (of various media), wherein instructions are stored thereon or thereon, which can be used to program a processing system to perform any of the features presented herein. The storage medium may include, but is not limited to, high-speed random access memory, such as DRAM, SRAM, DDRRAM, or other random access solid-state memory devices, and may include non-volatile memory, such as one or more disk storage devices, optical disk storage devices, flash memory devices, or other non-volatile solid-state memory devices. The memory may optionally include one or more storage devices located remotely from the CPU. The non-volatile memory devices within the memory or optionally the memory include non-transitory computer-readable storage media.

[0416] Features of the invention, stored on any machine-readable medium (of various kinds), can be contained in software and / or firmware for controlling the hardware of a processing system and enabling the processing system to interact with other entities using the results of the invention. Such software or firmware may include, but is not limited to, application code, device drivers, operating systems, and execution environments / containers.

[0417] It should be understood that although the terms “first,” “second,” etc., may be used in this document to describe various elements or steps, these elements or steps should not be limited by these terms. These terms are only used to distinguish one element or step from another.

[0418] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the claims. As used in the description of the embodiments and the appended claims, the singular forms “a,” “an,” and “this” are intended to include multiple forms as well, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items. It should also be understood that the terms “comprising” and / or “including”, when used in this specification, specify the presence of said features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups.

[0419] As used herein, the term "if" can be interpreted as meaning, depending on the context, that the prerequisite of a statement is true "in the case of," "when," or "in response to detection." Similarly, the phrases "if it is determined that [the prerequisite of that statement is true]," "if [the prerequisite of the statement is true]," or "when [the prerequisite of the statement is true]" can be interpreted as meaning, depending on the context, that the stated prerequisite is true "when determined," "in response to determined," "according to determined," "when detected," or "in response to detection."

[0420] The foregoing description, used for illustration, has been described with reference to specific embodiments. However, the foregoing illustrative discussion is not intended to be exhaustive or to limit the claims to the precise forms disclosed. Many modifications and variations can be made in light of the foregoing teachings. The embodiments were chosen and described in order to best explain the principles of practical application and operation, thereby enabling others skilled in the art to best utilize the invention and its various embodiments.

Claims

1. A light-emitting structure array system, comprising: Semiconductor substrate; The first light-emitting mesa on the semiconductor substrate includes: A metal layer is formed on the semiconductor substrate; A light-emitting layer is formed on the metal layer; A first insulating layer covers at least the sidewalls of the light-emitting layer and at least a portion of the metal layer, the first insulating layer having an opening exposing a portion of the light-emitting layer; and A top electrode layer is formed on the first insulating layer and is electrically contacted with the light-emitting layer via the opening; and A reflector cup surrounds the first light-emitting platform and is in physical contact with the top electrode layer.

2. The light-emitting structure array system according to claim 1, further comprising: A first microlens is formed above the first light-emitting platform, wherein the central axis of the first microlens is coaxially aligned with the central axis of the first light-emitting platform.

3. The light-emitting structure array system according to claim 2, further comprising: A spacer is formed between the first light-emitting platform and the first microlens.

4. The light-emitting structure array system according to claim 1, further comprising: An isolation structure is formed between the first light-emitting platform and the second light-emitting platform, wherein the first insulating layer covers the top surface of the isolation structure.

5. The light-emitting structure array system according to claim 4, wherein the isolation structure is thinner than the metal layer.

6. The light-emitting structure array system according to claim 4, wherein the isolation structure comprises a dielectric material.

7. The light-emitting structure array system according to claim 1, further comprising: A second insulating layer covers the first light-emitting platform and the reflector.

8. The light-emitting structure array system according to claim 7, wherein the second insulating layer comprises a polymer.

9. The light-emitting structure array system according to claim 1, wherein: The lateral dimension of the metal layer is larger than the lateral dimension of the light-emitting layer; and The first insulating layer covers at least a portion of the top surface of the metal layer.

10. The light-emitting structure array system according to claim 1, wherein the top surface of the first insulating layer is flush with the top surface of the light-emitting layer.

11. The light-emitting structure array system according to claim 1, wherein the top surface of the first insulating layer is higher than the top surface of the light-emitting layer.

12. The light-emitting structure array system of claim 1, wherein the first insulating layer covers the top surface of the light-emitting layer; and the opening exposes a portion of the top surface of the light-emitting layer.

13. The light-emitting structure array system of claim 1, wherein the first insulating layer does not cover at least a portion of the top surface of the light-emitting layer.

14. The light-emitting structure array system according to claim 1, wherein the first insulating layer comprises a dielectric material.

15. The light-emitting structure array system according to claim 1, wherein the top surface of the reflector cup is higher than the top surface of the first light-emitting platform.

16. The light-emitting structure array system according to claim 1, wherein the reflector is electrically connected to the top electrode layer at the bottom of the reflector.

17. The light-emitting structure array system according to claim 1, wherein the reflector is electrically connected to the semiconductor substrate.

18. The light-emitting structure array system of claim 1, wherein the semiconductor substrate is configured as an integrated circuit (IC) substrate.

19. The light-emitting structure array system of claim 18, wherein the metal layer is electrically connected to the driving circuit and the light-emitting layer on the semiconductor substrate.

20. The light-emitting structure array system according to claim 1, wherein the top electrode layer is a conductive transparent layer.

Images