Punching assembly, continuous punch forming equipment and modular case heat dissipation hole array punch forming process

Abstract

The application discloses a stamping assembly, a continuous stamping forming equipment and a modular case heat dissipation hole array stamping forming process, wherein the stamping assembly comprises an upper die seat and a lower die seat; the upper die seat comprises an upper die seat fixing frame and a stamping head assembly; the stamping head assembly comprises a stamping head assembly fixing frame and a stamping head component; the stamping head component comprises a stamping head fixing frame and a stamping head structure; the stamping head structure comprises an inner stamping head and an outer adjusting stamping head; the outer adjusting stamping head is in a multilayer annular structure and is sequentially arranged outside the inner stamping head; the lower die seat comprises a lower die seat fixing frame and a stamping hole assembly; the stamping hole assembly comprises a stamping hole assembly fixing frame and a stamping hole component; the stamping hole component comprises a stamping hole fixing frame and a stamping hole structure; the stamping hole structure comprises an inner stamping hole and an outer adjusting stamping ring; the outer adjusting stamping ring is in a multilayer annular structure and is located at the periphery of the inner stamping hole.

Description

Technical Field

[0001] This invention relates to the field of stamping equipment technology, and more specifically, to a stamping component, a continuous stamping forming equipment, and a stamping forming process for a modular chassis heat dissipation hole array. Background Technology

[0002] For the stamping of large-scale metal sheets, existing technologies typically employ multi-hole dies, or group dies. However, traditional multi-hole die technology has extremely poor flexibility. A set of array dies can basically only be used to stamp parts with a specific hole position. If the product design changes and the position, diameter, or number of holes needs to be adjusted, the entire die may be scrapped and needs to be redesigned and manufactured, directly leading to increased production costs. Summary of the Invention

[0003] In order to solve the technical problems mentioned in the background, the present invention aims to provide a stamping component, a continuous stamping forming equipment and a modular chassis heat dissipation hole array stamping forming process. The present invention adopts a structural design of a stamping head and stamping hole with adjustable position and specifications, and realizes a highly compatible array stamping forming process with adjustable hole diameter and variable array.

[0004] To achieve the above objectives, the present invention provides a stamping assembly. In this invention, the stamping assembly includes an upper die base and a lower die base. The upper die base includes an upper die base fixing frame, and at least one set of stamping head assemblies is slidably mounted within the upper die base fixing frame. Each stamping head assembly includes a stamping head assembly fixing frame, and at least one set of stamping head components is slidably mounted within the stamping head assembly fixing frame. Each stamping head component includes a stamping head fixing frame and a stamping head structure. The stamping head structure includes an inner stamping head and an outer adjusting stamping head. The external adjusting stamping head has a multi-layered annular structure and is sequentially sleeved outside the inner stamping head; the lower die base includes a lower die base fixing frame, and at least one set of stamping hole assemblies are slidably installed in the lower die base fixing frame. The stamping hole assembly includes a stamping hole assembly fixing frame, and at least one set of stamping hole components are slidably installed in the stamping hole assembly fixing frame; the stamping hole component includes a stamping hole fixing frame and a stamping hole structure, and the stamping hole structure includes an inner stamping hole and an external adjusting stamping ring. The external adjusting stamping ring has a multi-layered annular structure and is located around the inner stamping hole.

[0005] Furthermore, in the technical solution of the present invention, the upper mold base fixing frame is provided with a first slide rail at both ends, the stamping head assembly fixing frame is provided with a first slide groove at both ends, the stamping head assembly is slidably mounted on the first slide rail through the first slide groove, and multiple sets of fastening screws are provided on the groove wall of the first slide groove.

[0006] Furthermore, in the technical solution of the present invention, a second slide rail is provided on both sides of the inner side of the stamping head assembly fixing frame, and a second slide groove is provided on both sides of the stamping head fixing frame. The stamping head component is slidably mounted on the second slide rail through the second slide groove, and a plurality of fastening screws are provided on the groove wall of the second slide groove.

[0007] Furthermore, in the technical solution of the present invention, a third slide rail is provided at both ends of the inner cavity of the lower mold base fixing frame, and a third slide groove is provided at both ends of the stamping hole assembly fixing frame. The stamping hole assembly is slidably mounted on the third slide rail through the third slide groove, and multiple sets of fastening screws are provided on the groove wall of the third slide groove.

[0008] Furthermore, in the technical solution of the present invention, a fourth slide rail is provided on both sides of the inner side of the punching hole assembly fixing frame, and a fourth slide groove is provided on both sides of the punching hole fixing frame. The punching hole component is slidably installed on the fourth slide rail through the fourth slide groove, and multiple sets of fastening screws are provided on the groove wall of the fourth slide groove.

[0009] Furthermore, in the technical solution of the present invention, the stamping head structure is slidably installed in the stamping head fixing frame, and both the inner stamping head and the outer adjusting stamping head can slide out from the stamping head fixing frame. Each layer of the multi-layer annular structure of the outer adjusting stamping head can slide separately. The stamping head component has multiple sets of limiting holes along the vertical direction. The multiple sets of limiting holes all penetrate the stamping head fixing frame and the stamping head structure. Each set of limiting holes is provided with a limiting block. The limiting block is used to restrict the sliding of the stamping head structure in the stamping head fixing frame.

[0010] Furthermore, in the technical solution of the present invention, the lower end of the outer adjusting stamping ring is also provided with a reset plate, the lower end of the reset plate is connected with a reset spring, the outer adjusting stamping ring can slide along the direction of the inner stamping hole, each layer of the multi-layer ring structure of the outer adjusting stamping ring can slide separately, the reset plate is also provided with a plurality of sliding holes, the lower end of the outer adjusting stamping ring is fixedly connected with a plurality of limiting rods, the lower end of the stamping hole fixing frame is also provided with a limiting cavity, and the plurality of limiting rods respectively pass through the sliding holes and extend into the limiting cavity.

[0011] Furthermore, in the technical solution of the present invention, the punching hole component further includes multiple sets of limiting blocks, each of the multiple sets of limiting blocks having a through hole of different diameter in the middle, and the multiple sets of limiting blocks being disposed in the limiting cavity. By selecting limiting blocks with through holes of different diameters, the position of the limiting rod within different ranges can be blocked.

[0012] In another aspect, the present invention provides a continuous stamping forming device, which employs a stamping assembly as described above. In the technical solution of the present invention, the continuous stamping forming device further includes a press, wherein the upper die holder is fixedly installed on the output end of the press by the upper die holder fixing frame, and the lower die holder is fixedly installed on the worktable of the press by the lower die holder fixing frame.

[0013] This invention also provides a modular chassis heat dissipation hole array stamping process, which uses a continuous stamping equipment as described above. In the technical solution of this invention, the modular chassis heat dissipation hole array stamping process specifically includes the following steps:

[0014] Based on the different heat dissipation hole array designs of different parts of the modular chassis, the stamping positions of the stamping head component and the stamping hole component are adjusted, specifically through:

[0015] The position of the stamping head assembly is adjusted by sliding along the first slide rail and fixed by multiple sets of fastening screws; the position of the stamping head component is adjusted by sliding along the second slide rail and fixed by multiple sets of fastening screws.

[0016] The position of the punching hole assembly is adjusted by sliding along the third slide rail and fixed by multiple sets of fastening screws. The position of the punching hole component is adjusted by sliding along the fourth slide rail and fixed by multiple sets of fastening screws. The position of the punching head component and the punching hole component are adjusted by sliding the inner punching head in the punching head component into the inner punching hole in the corresponding punching hole component.

[0017] Based on the different heat dissipation hole array designs of different parts of the modular chassis, the punching hole diameter of the punching head component and the punching hole component is adjusted, specifically through:

[0018] The inner punch head and the outer adjusting punch head slide out from the punch head fixing frame. The outer adjusting punch head is slidably sleeved on the outside of the inner punch head through a multi-layer structure. The number of structural layers on which the outer adjusting punch head is slidably sleeved on the outside of the inner punch head is controlled, and the position is fixed by a limiting block.

[0019] Select a limit block and install it in the limit cavity of the stamping hole component, wherein the diameter of the through hole corresponding to the limit block is the stamping hole diameter.

[0020] Beneficial Effects: In summary, the present invention provides a stamping component, a continuous stamping forming equipment, and a modular chassis heat dissipation hole array stamping forming process. In the technical solution of the present invention, a structural design of a stamping head and stamping hole with adjustable position and specifications is adopted. A set of stamping components can realize stamping processes with various stamping sizes and array specifications, reducing the consumption costs of punch inventory and mold production. It realizes a highly compatible array stamping forming process with adjustable hole diameter and variable array, which is very suitable for stamping forming of modular chassis heat dissipation holes with diversity.

[0021] Other features and advantages of the present invention will be set forth in the following description. Attached Figure Description

[0022] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the overall structure of a stamping assembly according to an embodiment of the present invention;

[0024] Figure 2 This is a partial structural diagram of an upper mold base A according to an embodiment of the present invention;

[0025] Figure 3 This is a partial structural diagram of a lower mold base B according to an embodiment of the present invention;

[0026] Figure 4 This is a partial structural schematic diagram of a stamping head assembly A2 according to an embodiment of the present invention;

[0027] Figure 5 This is a partial structural schematic diagram of a punching hole assembly B2 according to an embodiment of the present invention;

[0028] Figure 6 This is a partial structural schematic diagram of a stamping head component A22 according to an embodiment of the present invention;

[0029] Figure 7 This is a partial structural schematic diagram of a punching hole component B22 according to an embodiment of the present invention;

[0030] Figure 8 This is a partial structural diagram of a limiting block B225 according to an embodiment of the present invention;

[0031] In the diagram: A. Upper die base; A1. Upper die base fixing frame; A11. First slide rail; A2. Punch head assembly; A21. Punch head assembly fixing frame; A211. First slide groove; A212. Second slide rail; A22. Punch head component; A221. Punch head fixing frame; A221-1. Second slide groove; A222. Punch head structure; A222-1. Inner punch head; A222-2. Outer adjusting punch head; A223. Limiting hole; A224. Limiting block; B. Lower die base; B1. Lower die base fixing frame; B223. 1. Third slide rail; B2. Punching hole assembly; B21. Punching hole assembly fixing frame; B211. Third slide groove; B212. Fourth slide rail; B22. Punching hole component; B221. Punching hole fixing frame; B221-1. Fourth slide groove; B222. Punching hole structure; B222-1. Inner punching hole; B222-2. Outer adjusting punching ring; B222-3. Limiting bar; B223. Reset plate; B223-1. Sliding hole; B224. Limiting cavity; B225. Limiting block; B225-1. Through hole. Detailed Implementation

[0032] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0033] The core of this invention is to provide a stamping component, a continuous stamping forming equipment, and a modular chassis heat dissipation hole array stamping forming process. This embodiment adopts a structural design of a stamping head and stamping hole with adjustable position and specifications, realizing a highly compatible array stamping forming process with adjustable hole diameter and variable array.

[0034] Figure 1 This is a schematic diagram of the overall structure of a stamping assembly according to an embodiment of the present invention, as shown below. Figure 1 As shown, this embodiment provides a stamping assembly, including an upper die holder A and a lower die holder B. Figure 2 This is a partial structural diagram of an upper mold base A according to an embodiment of the present invention. Figure 3 This is a partial structural diagram of a lower mold base B according to an embodiment of the present invention, as shown below. Figure 2 and Figure 3As shown, the upper die holder A includes an upper die holder fixing frame A1, which is used for mounting the upper die holder A on the press. At least one set of stamping head assemblies A2 is slidably installed in the upper die holder fixing frame A1. The lower die holder B includes a lower die holder fixing frame B1, which is used for mounting the lower die holder B on the press. At least one set of stamping hole assemblies B2 is slidably installed in the lower die holder fixing frame B1. The number and position of the stamping head assemblies A2 correspond to the number and position of the stamping hole assemblies B2. The stamping head assemblies A2 and the stamping hole assemblies B2 are corresponding sets of components.

[0035] Specifically, in this embodiment, Figure 4 This is a partial structural schematic diagram of a stamping head assembly A2 according to an embodiment of the present invention. Figure 5 This is a partial structural diagram of a punching hole assembly B2 according to an embodiment of the present invention, as shown below. Figure 4 and Figure 5 As shown, the stamping head assembly A2 includes a stamping head assembly fixing frame A21, and at least one set of stamping head components A22 are slidably installed in the stamping head assembly fixing frame A21; the stamping hole assembly B2 includes a stamping hole assembly fixing frame B21, and at least one set of stamping hole components B22 are slidably installed in the stamping hole assembly fixing frame B21; wherein, the number and position of the stamping head components A22 correspond to the number and position of the stamping hole components B22.

[0036] Specifically, in this embodiment, Figure 6 This is a partial structural diagram of a stamping head component A22 according to an embodiment of the present invention. Figure 7 This is a partial structural diagram of a punching hole component B22 according to an embodiment of the present invention, as shown below. Figure 6 and Figure 7As shown, the stamping head component A22 includes a stamping head fixing frame A221 and a stamping head structure A222. The stamping head structure A222 includes an inner stamping head A222-1 and an outer adjusting stamping head A222-2. The outer adjusting stamping head A222-2 has a multi-layered annular structure and is sequentially sleeved outside the inner stamping head A222-1. The number of layers of the outer adjusting stamping head A222-2 is selected according to the stamping hole diameter. For example, if the stamping diameter of the inner stamping head A222-1 is 1mm and the thickness of each layer of the outer adjusting stamping head A222-2 is 0.1mm, then when stamping a hole diameter of 1.6mm, the number of layers of the outer adjusting stamping head A222-2 sleeved outside the inner stamping head A222-1 is three. The stamping hole component B22 includes a stamping hole fixing frame B221 and a stamping hole structure B222-2. 222, the punching hole structure B222 includes an inner punching hole B222-1 and an outer adjusting punching ring B222-2. The outer adjusting punching ring B222-2 has a multi-layered annular structure and is located around the inner punching hole B222-1. The diameter of the inner punching hole B222-1 matches the size of the inner punching head A222-1. The thickness of each layer in the multi-layered annular structure of the outer adjusting punching ring B222-2 matches the thickness of each layer of the outer adjusting punching head A222-2. The corresponding limiting position is selected according to the required punching hole diameter. For example, when punching a hole diameter of 1.6mm, the required punching hole diameter is the 1mm diameter of the inner punching hole B222-1 plus the three layers of the outer adjusting punching ring B222-2. That is, the outer adjusting punching ring B222-2 is limited in the structural layers other than the three layers.

[0037] Specifically, in this embodiment, please refer to Figure 2 and Figure 4 Both ends of the upper mold base fixing frame A1 are provided with first slide rails A11, and both ends of the stamping head assembly fixing frame A21 are provided with first slide grooves A211. The stamping head assembly A2 is slidably mounted on the first slide rails A11 through the first slide grooves A211. Furthermore, multiple sets of fastening screws are provided on the groove wall of the first slide groove A211. These fastening screws are used to fix the position of the stamping head assembly A2 after it slides.

[0038] Specifically, in this embodiment, please refer to Figure 4 and Figure 6 The stamping head assembly fixing frame A21 has a second slide rail A212 on both sides inside, and the stamping head fixing frame A221 has a second slide groove A221-1 on both sides. The stamping head component A22 is slidably mounted on the second slide rail A212 through the second slide groove A221-1. The groove wall of the second slide groove A221-1 is also provided with multiple sets of fastening screws. The fastening screws here are used to fix the position of the stamping head component A22 after it slides.

[0039] Specifically, in this embodiment, please refer to Figure 3 and Figure 5 Both ends of the lower mold base fixing frame B1 are provided with a third slide rail B11, and both ends of the punching hole assembly fixing frame B21 are provided with a third slide groove B211. The punching hole assembly B2 is slidably mounted on the third slide rail B11 through the third slide groove B211. Furthermore, multiple sets of fastening screws are provided on the groove wall of the third slide groove B211. These fastening screws are used to fix the position of the punching hole assembly B2 after it slides.

[0040] Specifically, in this embodiment, please refer to Figure 5 and Figure 7 The punch hole assembly fixing frame B21 has a fourth slide rail B212 on both sides inside, and the punch hole fixing frame B221 has a fourth slide groove B221-1 on both sides. The punch hole component B22 is slidably mounted on the fourth slide rail B212 through the fourth slide groove B221-1. The fourth slide groove B221-1 also has multiple sets of fastening screws on its groove wall. These fastening screws are used to fix the position of the punch hole component B22 after it slides.

[0041] Specifically, in this embodiment, please continue to refer to... Figure 6 The stamping head structure A222 is slidably installed within the stamping head fixing frame A221. Both the inner stamping head A222-1 and the outer adjusting stamping head A222-2 can slide out from within the stamping head fixing frame A221. Each layer of the multi-layer annular structure of the outer adjusting stamping head A222-2 can slide independently, allowing selection of the number of layers of the outer adjusting stamping head A222-2 to be fitted. That is, the number of layers of the outer adjusting stamping head A222-2 structure that need to be fitted is slid to the inner stamping head A222-1. On the outside of 1, the stamping head component A22 has multiple sets of limiting holes A223 opened in the vertical direction. The multiple sets of limiting holes A223 all penetrate the stamping head fixing frame A221 and the stamping head structure A222. Each set of limiting holes A223 is provided with a limiting block A224. The limiting block A224 is used to limit the sliding of the stamping head structure A222 in the stamping head fixing frame A221, that is, to fix the position of the inner stamping head A222-1 and the outer adjusting stamping head A222-2 after sliding.

[0042] Specifically, in this embodiment, please continue to refer to... Figure 7The lower end of the outer adjusting stamping ring B222-2 is also provided with a reset plate B223. A reset spring is connected to the lower end of the reset plate B223. The outer adjusting stamping ring B222-2 can slide along the direction of the inner stamping hole B222-1. Each layer of the multi-layered annular structure of the outer adjusting stamping ring B222-2 can slide independently, allowing the unrestricted downward movement of the structural layers in the outer adjusting stamping ring B222-2 during stamping (during the downward stamping process). The reset plate B222-2... The 23 is also provided with several sliding holes B223-1. Several limiting rods B222-3 are fixedly connected to the lower end of the outer adjusting stamping ring B222-2. The limiting rods B222-3 are fixedly connected to the lower part of each layer of the multi-layer ring structure of the outer adjusting stamping ring B222-2. The lower end of the stamping hole fixing frame B221 is also provided with a limiting cavity B224. The limiting rods B222-3 pass through the sliding holes B223-1 and extend into the limiting cavity B224. Figure 7 This is a partial structural diagram of a punching hole component B22 according to an embodiment of the present invention, as shown below. Figure 7 As shown, in this embodiment, the stamping hole component B22 further includes multiple sets of limiting blocks B225. The multiple sets of limiting blocks B225 each have a through hole B225-1 with a different diameter in the middle. The multiple sets of limiting blocks B225 are disposed within the limiting cavity B224. By selecting limiting blocks B225 with different diameter through holes B225-1, the positions of limiting rods B222-3 within different ranges can be blocked. That is, by selecting limiting blocks B225 with different diameter through holes B225-1, the positions of other limiting rods B222-3, excluding the stamping hole diameter range, are blocked. The diameters of the multiple sets of limiting blocks B225 correspond one-to-one with the diameter of each layer of the multi-layered annular structure of the external adjusting stamping ring B222-2.

[0043] This embodiment also provides a continuous stamping forming equipment, which adopts a stamping component according to the above description. The continuous stamping forming equipment further includes a press, which is the prior art. The upper die holder A is fixedly installed on the output end of the press through the upper die holder fixing frame A1, and the lower die holder B is fixedly installed on the worktable of the press through the lower die holder fixing frame B1.

[0044] This embodiment also provides a modular chassis heat dissipation hole array stamping process, which uses a continuous stamping equipment as described above, and specifically includes the following steps:

[0045] Based on the different heat dissipation hole array designs of different parts of the modular chassis, the stamping positions of the stamping head component A22 and the stamping hole component B22 are adjusted, specifically by:

[0046] The position of the stamping head assembly A2 is adjusted by sliding along the first slide rail A11 and fixed by multiple sets of fastening screws; the position of the stamping head component A22 is adjusted by sliding along the second slide rail A212 and fixed by multiple sets of fastening screws.

[0047] The position of the punching hole assembly B2 is adjusted by sliding along the third slide rail B11 and fixed by multiple sets of fastening screws. The position of the punching hole component B22 is adjusted by sliding along the fourth slide rail B212 and fixed by multiple sets of fastening screws. The inner punching head A222-1 in the punching head component A22 is pre-inserted into the inner punching hole B222-1 in the corresponding punching hole component B22 to simultaneously adjust the position of the punching head component A22 and the punching hole component B22.

[0048] Based on the different heat dissipation hole array designs of different parts of the modular chassis, the punching hole diameters of the punching head component A22 and the punching hole component B22 are adjusted, specifically through:

[0049] The inner stamping head A222-1 and the outer adjusting stamping head A222-2 are slid out from the stamping head fixing frame A221. The outer adjusting stamping head A222-2 is slidably sleeved on the outside of the inner stamping head A222-1 through a multi-layer structure. The number of structural layers of the outer adjusting stamping head A222-2 slidably sleeved on the outside of the inner stamping head A222-1 is controlled, and its position is fixed by the limiting insert A224.

[0050] Select the limiting block B225 and install it in the limiting cavity B224 of the stamping hole component B22, wherein the diameter of the through hole B225-1 corresponding to the limiting block B225 is the stamping hole diameter.

[0051] It should be noted that, as those skilled in the art will know, the technical solution of this embodiment is mainly applied to low-strength stamping processes, such as the array stamping process of heat dissipation holes in modular chassis, in order to solve the problem of high cost of conventional molds caused by the diversity of their designs.

[0052] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A stamping assembly, comprising an upper die holder (A) and a lower die holder (B), characterized in that, The upper die base (A) includes an upper die base fixing frame (A1), and at least one set of stamping head assemblies (A2) are slidably installed in the upper die base fixing frame (A1). The stamping head assembly (A2) includes a stamping head assembly fixing frame (A21), and at least one set of stamping head parts (A22) are slidably installed in the stamping head assembly fixing frame (A21). The upper die base fixing frame (A1) has a first slide rail (A11) at both ends, and the stamping head assembly fixing frame (A21) has a first slide groove (A211) at both ends. The stamping head assembly (A2) is slidably installed on the first slide rail (A11) through the first slide groove (A211), and multiple sets of fastening screws are also provided on the groove wall of the first slide groove (A211). The stamping head component (A22) includes a stamping head fixing frame (A221) and a stamping head structure (A222). The stamping head structure (A222) includes an inner stamping head (A222-1) and an outer adjusting stamping head (A222-2). The outer adjusting stamping head (A222-2) has a multi-layered annular structure and is sequentially sleeved outside the inner stamping head (A222-1). The stamping head structure (A222) is slidably installed inside the stamping head fixing frame (A221). Both the inner stamping head (A222-1) and the outer adjusting stamping head (A222-2) can be moved from the stamping head fixing frame (A221). The external adjusting punch head (A222-2) slides out from within the multi-layered annular structure, and each layer of the structure can slide independently. The punch head component (A22) has multiple sets of limiting holes (A223) opened in the vertical direction. The multiple sets of limiting holes (A223) all penetrate the punch head fixing frame (A221) and the punch head structure (A222). Each set of limiting holes (A223) is provided with a limiting block (A224). The limiting block (A224) is used to limit the sliding of the punch head structure (A222) within the punch head fixing frame (A221). The lower die base (B) includes a lower die base fixing frame (B1), and at least one set of punching hole assemblies (B2) are slidably installed in the lower die base fixing frame (B1). The punching hole assembly (B2) includes a punching hole assembly fixing frame (B21), and at least one set of punching hole components (B22) are slidably installed in the punching hole assembly fixing frame (B21). The lower die base fixing frame (B1) has a third slide rail (B11) at both ends, and the punching hole assembly fixing frame (B21) has a third slide groove (B211) at both ends. The punching hole assembly (B2) is slidably installed on the third slide rail (B11) through the third slide groove (B211), and multiple sets of fastening screws are also provided on the groove wall of the third slide groove (B211). The punching hole component (B22) includes a punching hole fixing frame (B221) and a punching hole structure (B222). The punching hole structure (B222) includes an inner punching hole (B222-1) and an outer adjusting punching ring (B222-2). The outer adjusting punching ring (B222-2) has a multi-layer ring structure and is located around the inner punching hole (B222-1).

2. A stamping assembly according to claim 1, characterized in that, The stamping head assembly fixing frame (A21) has a second slide rail (A212) on both sides inside, and a second slide groove (A221-1) is opened on both sides of the stamping head fixing frame (A221). The stamping head component (A22) is slidably mounted on the second slide rail (A212) through the second slide groove (A221-1), and multiple sets of fastening screws are also provided on the groove wall of the second slide groove (A221-1).

3. A stamping assembly according to claim 1, characterized in that, The punch hole assembly fixing frame (B21) has a fourth slide rail (B212) on both sides inside, and a fourth slide groove (B221-1) is opened on both sides of the punch hole fixing frame (B221). The punch hole component (B22) is slidably mounted on the fourth slide rail (B212) through the fourth slide groove (B221-1), and multiple sets of fastening screws are also provided on the groove wall of the fourth slide groove (B221-1).

4. A stamping assembly according to claim 1, characterized in that, The lower end of the outer adjusting stamping ring (B222-2) is also provided with a reset plate (B223). The lower end of the reset plate (B223) is connected with a reset spring. The outer adjusting stamping ring (B222-2) can slide along the direction of the inner stamping hole (B222-1). Each layer of the multi-layer ring structure of the outer adjusting stamping ring (B222-2) can slide separately. The reset plate (B223) is also provided with several sliding holes (B223-1). The lower end of the outer adjusting stamping ring (B222-2) is fixedly connected with several limiting rods (B222-3). The lower end of the stamping hole fixing frame (B221) is also provided with a limiting cavity (B224). Several limiting rods (B222-3) pass through the sliding holes (B223-1) and extend into the limiting cavity (B224).

5. A stamping assembly according to claim 4, characterized in that, The punching hole component (B22) also includes multiple sets of limiting blocks (B225). Each of the multiple sets of limiting blocks (B225) has a through hole (B225-1) with a different diameter in the middle. The multiple sets of limiting blocks (B225) are arranged in the limiting cavity (B224). By selecting the limiting blocks (B225) with different diameter through holes (B225-1), the position of the limiting rod (B222-3) in different ranges can be blocked.

6. A continuous stamping forming apparatus, employing a stamping component according to any one of claims 1-5, characterized in that, It also includes a press, wherein the upper die holder (A) is fixedly installed on the output end of the press via the upper die holder fixing frame (A1), and the lower die holder (B) is fixedly installed on the worktable of the press via the lower die holder fixing frame (B1).

7. A modular chassis heat dissipation hole array stamping process, employing a continuous stamping equipment according to claim 6, characterized in that, Specifically, the steps include the following: Based on the different heat dissipation hole array designs of different parts of the modular chassis, the stamping positions of the stamping head component (A22) and the stamping hole component (B22) are adjusted, specifically through: The position of the stamping head assembly (A2) is adjusted by sliding along the first slide rail (A11) and fixed by multiple sets of fastening screws; the position of the stamping head component (A22) is adjusted by sliding along the second slide rail (A212) and fixed by multiple sets of fastening screws. The position of the punching hole assembly (B2) is adjusted by sliding along the third slide rail (B11) and fixed by multiple sets of fastening screws. The position of the punching hole component (B22) is adjusted by sliding along the fourth slide rail (B212) and fixed by multiple sets of fastening screws. The position of the punching head component (A22) and the punching hole component (B22) are adjusted by pre-inserting the inner punching head (A222-1) in the corresponding inner punching hole component (B22) in the punching hole component (B22) simultaneously. Based on the different heat dissipation hole array designs of different parts of the modular chassis, the punching hole diameters of the punching head component (A22) and the punching hole component (B22) are adjusted, specifically through: The inner punch head (A222-1) and the outer adjusting punch head (A222-2) slide out from the punch head fixing frame (A221). The outer adjusting punch head (A222-2) is slidably sleeved on the outside of the inner punch head (A222-1) through a multi-layer structure. The number of structural layers of the outer adjusting punch head (A222-2) slidably sleeved on the outside of the inner punch head (A222-1) is controlled, and its position is fixed by a limiting block (A224). Select the limiting block (B225) and install it in the limiting cavity (B224) of the stamping hole component (B22), wherein the diameter of the through hole (B225-1) corresponding to the limiting block (B225) is the stamping hole diameter.

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