Single-machine installation structure and single-machine thermal control method

Abstract

The invention relates to the technical field of satellite single-machine temperature control, in particular to a single-machine installation structure and a single-machine thermal control method. A single-machine installation structure comprises a single-machine installation plate, an expansion type thermal control plate, a thermal control plate driving mechanism and a heat conduction structure. The single machine is mounted on the satellite platform through the single machine mounting plate in a heat-insulating manner; the single machine is connected with the satellite platform through a single machine mounting plate; the single machine is in heat-conducting connection with the single machine mounting plate; the single-machine mounting plate with the self-heating function is in heat conduction connection with the expansion type thermal control plate through a heat conduction structure; one surface of the expanded thermal control board is a radiating surface, and the other surface is an absorbing surface or an isolating surface; wherein the absorption radiation ratio of the absorption surface is greater than that of the radiation surface; the thermal control board driving mechanism used for controlling the expansion degree and the pointing direction of the expansion type thermal control board is installed on the satellite platform and is in signal connection with the control system used for controlling the temperature of the single machine. According to the expansion type thermal control board provided by the invention, the heat dissipation function and the heating function of the thermal control board can be switched.

Description

Technical Field

[0001] This invention relates to the field of satellite unit temperature control technology, specifically to a unit installation structure and a unit thermal control method. Background Technology

[0002] Spacecraft face a harsh and dynamically changing thermal environment during their operation in orbit. On the one hand, the background temperature in deep space is close to absolute zero, and on the other hand, strong direct sunlight can cause the temperature of the exposed surface to rise sharply to over 100°C. At the same time, there are also complex heat flows such as Earth's albedo heat flow, Earth's infrared radiation, and heat generated by equipment operation. This complex thermal environment will cause thermal gradients to exist in different parts of the spacecraft and become unstable as the spacecraft operates in orbit.

[0003] Thermal gradients and temperature fluctuations in the equipment mounting structure can cause thermal deformation of the mounting surface, leading to displacement or angular deflection of the equipment. Simultaneously, unstable temperatures on the mounting surface can affect the temperature stability of the equipment itself. Equipment displacement, deflection, and temperature fluctuations can impact the performance of sensitive devices such as laser communication terminals, solid-state power amplifiers, and fiber optic gyroscopes. Current spacecraft thermal design typically controls the temperature of individual units at reasonable levels under high-temperature conditions by increasing the heat dissipation surface. However, under low-temperature conditions, due to the large heat dissipation area, high-power heating elements are required to maintain the temperature of individual units, resulting in high satellite thermal control power, wasted onboard energy, and impacting the satellite's mission performance. Furthermore, to reduce thermal deformation of the equipment mounting structure, high thermal stability materials such as aluminum-based silicon carbide and titanium alloys are generally used in the structural design, increasing structural costs. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defects existing in the prior art, thereby providing a single-unit installation structure and a single-unit thermal control method.

[0005] A single-unit mounting structure includes: a single-unit mounting plate, an expandable thermal control plate, a thermal control plate driving mechanism, and a heat-conducting structure; The unit is thermally insulated and mounted to the satellite platform via a unit mounting plate; the unit and the satellite platform are indirectly connected through the interface of the unit mounting plate; the unit and the unit mounting plate are thermally connected. The self-heating mounting plate and the unfoldable thermal control plate are connected by a heat-conducting structure. One side of the unfoldable thermal control plate is a radiating surface, and the other side is an absorbing surface or an insulating surface; wherein, the absorption ratio of the absorbing surface is greater than that of the radiating surface. The thermal control plate drive mechanism, used to control the unfolding degree and pointing direction of the deployable thermal control plate, is mounted on the satellite platform and is connected to the control system signal used to control the temperature of individual units.

[0006] Preferably, the single-unit mounting plate includes a multi-layer structure consisting of a substrate, a heating layer and a multi-layer thermal insulation component, and a low-rigidity connection structure for penetrating the multi-layer structure and fixing the single-unit mounting plate and the satellite platform. The first multi-layer heat insulation component, the single unit, the substrate, the heating layer, the second multi-layer heat insulation component, and the satellite platform are arranged in sequence; The single-unit mounting plate also includes: a temperature sensor mounted on the substrate for measuring the temperature at the single-unit mounting location on the substrate; the single unit, heating layer, temperature sensor and satellite platform are all connected to the interface on the substrate for communication.

[0007] Preferably, the unfoldable heat control plate adopts a multi-fold structure, which is composed of several heat control plates connected by hinges; and two adjacent heat control plates are connected by flexible heat-conducting cables. One end of the deployable thermal control plate is fixed to the satellite platform and is thermally connected to the single-unit mounting plate through a thermally conductive structure. The output end of the thermal control plate drive mechanism is connected to one end of the deployable thermal control plate, so that the deployable thermal control plate can adjust its on-track orientation under the control of the thermal control plate drive mechanism.

[0008] Preferably, the unfolded thermal control plate adopts a single-fold structure; One end of the deployable thermal control plate is fixed to the satellite platform and is thermally connected to the single-unit mounting plate through a thermally conductive structure. The output end of the thermal control plate drive mechanism is connected to one end of the deployable thermal control plate, so that the deployable thermal control plate can adjust its on-track orientation under the control of the thermal control plate drive mechanism.

[0009] A thermal control method based on a single-unit installation structure is implemented using a single-unit installation structure, and is adjusted accordingly based on the changes in influencing factors in the heat exchange equation of the single-unit installation plate and the heat exchange equation of the unfolded thermal control plate. Specifically: When the temperature of the single-unit mounting plate is higher than the preset upper temperature limit: the unfoldable thermal control plate is directed to the direction of the least external heat flow intensity to dissipate heat. When the temperature of the single-unit mounting plate is lower than the preset lower limit: the heating layer starts heating and the unfolded heat control plate is pointed in the direction of the greatest external heat flow intensity to reduce the heating power required for single-unit insulation.

[0010] Preferably, the heat exchange equation for a single-unit mounting plate is: ; In the formula, the subscript Indicates a standalone mounting plate; subscript This indicates a deployable thermal control panel. The internal heat source of the single-unit mounting plate, including the heat dissipation of the single unit. Heat generated by the heating layer Two parts; The temperature of the single-unit mounting plate; The thermal conductivity coefficient between the unfolded heat sink and the single-unit mounting plate; For the temperature of the unfolded thermal control plate, This refers to the heat capacity of the single-unit mounting plate.

[0011] Preferably, the heat exchange equation for the unfolded heat control plate is: ; in External heat flow absorbed by the front of the deployable thermal control plate; External heat flow absorbed by the back of the expandable thermal control plate; The thermal conductivity coefficient between the single-unit mounting plate and the unfolded thermal control plate; The heat capacity of the unfolded thermal control plate; The radiation area of ​​the unfolded thermal control plate; Emissivity of the front side of the deployable thermal control plate; Emissivity of the back of the deployable thermal control plate.

[0012] The technical solution of this invention has the following advantages: The high-temperature-stability single-unit mounting structure provided by this invention employs a combined active and passive thermal control scheme to control the temperature of the single-unit mounting plate, achieving high-temperature-stability temperature control of the single-unit mounting plate with low thermal control power. The unfoldable thermal control plate provided by this invention can adjust the orientation of the thermal control plate through a drive mechanism, thereby achieving active adjustment of the external heat flow on both sides of the thermal control plate. The unfoldable thermal control plate provided by this invention has different thermal radiation properties on both sides, allowing for switching between heat dissipation and heating functions of the thermal control plate. Attached Figure Description

[0013] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0014] Figure 1 This is an out-of-plane heat flow diagram for each surface when the satellite azimuth offset parameter is 59 degrees. Figure 2 This is an out-of-plane heat flow diagram for each surface when the satellite azimuth offset parameter is 87 degrees. Figure 3 This is a configuration diagram of a single-unit installation structure in the launch state according to the present invention; Figure 4 This is a configuration diagram of a single-unit installation structure in orbit according to the present invention; Figure 5 This is a schematic diagram showing the assembly relationship between the single-unit mounting plate and the satellite platform. Figure 6 This is an exploded view of the multi-layer assembly relationship of a single-unit mounting plate.

[0015] Explanation of reference numerals in the attached figures: 1-Single-unit mounting plate, 101-Base plate, 102-Low-rigidity silicone rubber structure, 103-Temperature sensor, 104-Heating layer, 105-Heat-conducting layer, 106-1-First multi-layer heat insulation component, 106-2-First multi-layer heat insulation component, 106-Multi-layer heat insulation component; 2-Expandable heat control plate, 201-Inward fold, 202-Outward fold, 203-Hinge, 204-Flexible heat-conducting cable, 205-Hot knife pressing and releasing mechanism; 3-Thermal control board drive mechanism, 301-Stepper motor, 302-Rotating shaft; 4-Heat-conducting structure, 5-Single unit, 6-Satellite platform. Detailed Implementation

[0016] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0018] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0019] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0020] Example 1 like Figure 3 This embodiment discloses a single-unit installation structure, including: a single-unit installation plate 1, an unfoldable thermal control plate 2, a thermal control plate driving mechanism 3, and a heat-conducting structure 4; Unit 5 is thermally insulated and mounted on satellite platform 6 via unit mounting plate 1; in this embodiment, unit mounting plate 1 provides an installation interface for unit 5, which has high thermal stability requirements; unit mounting plate 1 and satellite platform 6 are thermally and deformation decoupled; unit 5 and satellite platform 6 are indirectly connected through the interface of unit mounting plate 1; unit 5 and unit mounting plate 1 are thermally conductively connected. The self-heating single-unit mounting plate 1 and the unfoldable thermal control plate 2 are thermally connected through the thermally conductive structure 4. One side of the unfoldable thermal control plate 2 is a radiating surface, and the other side is an absorbing surface or an insulating surface; wherein, the absorption ratio of the absorbing surface is greater than that of the radiating surface. The heat control plate drive mechanism 3, which controls the unfolding degree and pointing direction of the unfolding heat control plate 2, is installed on the satellite platform 6 and is connected to the control system signal for controlling the temperature of the single unit 5.

[0021] Specifically: It should be noted that during actual assembly, the heat dissipation surface of the satellite platform 6 is located in a position that does not affect the single-unit installation structure of this embodiment, so as to avoid the heat radiation from the heat dissipation surface of the satellite platform 6 affecting the single-unit installation structure of this embodiment.

[0022] The single-unit mounting plate 1 includes a multi-layer structure consisting of a base plate 101, a heating layer 104, and a multi-layer thermal insulation assembly 106, as well as a low-rigidity connection structure 102 that penetrates the multi-layer structure and fixes the single-unit mounting plate 1 and the satellite platform 6. It should be noted that in actual use, the low-rigidity connection structure 102 is a rubber structure or a metal-rubber structure; if it is a metal-rubber structure, a thermal insulation pad needs to be placed between the metal-rubber structure and the satellite platform 6. The multi-layer thermal insulation assembly 106 includes: a first multi-layer thermal insulation assembly 106-1 and a second multi-layer thermal insulation assembly 106-2. The first multi-layer heat insulation component 106-1, the single unit 5, the substrate 101, the heating layer 104, the second multi-layer heat insulation component 106-2, and the satellite platform 6 are arranged in sequence; The single-unit mounting plate 1 also includes a temperature sensor 103 mounted on the substrate 101 for measuring the temperature at the mounting position of the single unit 5 on the substrate 101; in this embodiment, the heating layer 104 performs thermal compensation on the substrate 101 and forms a closed-loop control based on the measurement results of the temperature sensor 103.

[0023] The stand-alone unit 5, heating layer 104, temperature sensor 103, and satellite platform 6 are all connected to the interface on the substrate 101 for communication.

[0024] In practical applications, the substrate 101 is made of metal structural plate, carbon fiber structural plate or honeycomb base plate.

[0025] As an improved embodiment of Example 1, the single-unit mounting plate 1 further includes a heat-conducting layer 105 to improve the temperature uniformity of the single-unit mounting plate 1; the structure of the heat-conducting layer 105 includes, but is not limited to, a heat-conducting film or a heat-conducting pipe; such as Figure 6 As shown, in this embodiment, the heat-conducting layer 105 is a graphite heat-conducting film, which is placed between the heating layer 104 and the second multilayer heat insulation component 106-2. It should be noted that in order to ensure the thermal insulation connection between the single-unit mounting plate 1 and the satellite platform 6, the size of the second multilayer heat insulation component 106-2 is greater than or equal to the size of the heat-conducting layer 105.

[0026] Similarly, in this embodiment, the specifications of the second multi-layer thermal insulation component 106-2 on the side of the single-unit mounting plate 1 closest to the satellite platform 6 are designed according to the actual thermal environment of the satellite platform 6 to achieve the purpose of isolating the heat flow of the satellite platform 6. Furthermore, in practical applications, the first multi-layer thermal insulation component 106-1 on the side of the single-unit mounting plate 1 furthest from the satellite platform 6 is designed according to the external heat flow of the surface of the single-unit mounting plate 1 furthest from the satellite platform 6 and the surface of the single unit 5 to achieve the purpose of isolating the external heat flow.

[0027] The deployable thermal control plate 2 adopts a single-fold structure. One end of the deployable thermal control plate 2 is fixed on the satellite platform 6 and is thermally connected to the single-unit mounting plate 1 through the thermally conductive structure 4. The output end of the thermal control plate drive mechanism 3 is connected to one end of the deployable thermal control plate 2 so that the deployable thermal control plate 2 can adjust its on-track orientation under the control of the thermal control plate drive mechanism 3.

[0028] As an improved implementation, the unfoldable heat control plate 2 adopts a multi-fold structure, which is composed of several heat control plates connected by hinges 203; and two adjacent heat control plates are thermally connected by flexible heat-conducting cables 204. One end of the deployable thermal control plate 2 is fixed to the satellite platform 6 and is thermally connected to the single-unit mounting plate 1 through the thermally conductive structure 4. The output end of the thermal control plate drive mechanism 3 is connected to one end of the deployable thermal control plate 2 so that the deployable thermal control plate 2 can adjust its on-track orientation under the control of the thermal control plate drive mechanism 3.

[0029] In practical applications, the heat conduction structure 4 includes, but is not limited to, flexible heat conduction structures such as flexible heat conduction cable structures and flexible heat conduction wire structures.

[0030] In practical applications, the unfoldable thermal control plate 2 adopts a metal structural plate or a carbon fiber structural plate; furthermore, if the front of the unfoldable thermal control plate 2 is a radiating surface, it is sprayed with thermal control white paint or pasted with a secondary surface mirror. The back of the unfoldable thermal control plate 2 is either an absorption surface or an isolation surface. When the back is an absorption surface, it has a high absorption-emissivity ratio. The surface coating material includes, but is not limited to, gray paint, black paint, gold plating, or black nickel plating. The area of ​​the paint is designed according to the specific specifications. When the back is an isolation surface, a multi-layer heat insulation component 106 is attached. In this embodiment, the front and back are named relative to the satellite platform 6. For example, the back is the side closer to the satellite platform when the satellite is not launched.

[0031] The thermal control plate drive mechanism 3 includes, but is not limited to, a stepper motor or a voice coil motor, which is a drive device that can ensure the unfolding of the thermal control plate 2; It should be noted that during satellite launch, the deployable thermal control plate is pressed and folded onto the satellite platform 6 adjacent to the single unit 5 using a shape memory alloy expansion joint, a hot knife, and a pyrotechnic cutter. After the satellite enters orbit, it unfolds via the thermal control plate drive mechanism 3 and hinge 203. Figure 4 As shown, the specific gathering device used in this embodiment is the hot knife pressing and releasing mechanism 205.

[0032] Example 2 Based on Example 1, this example further discloses a thermal control method based on a single-unit installation structure. It is implemented using a single-unit installation structure as described in Example 1, and is adjusted accordingly based on the changes in influencing factors in the heat exchange equation of the single-unit installation plate 1 and the heat exchange equation of the unfolded thermal control plate 2. It is a method that combines active and passive thermal control methods.

[0033] Specifically; When the temperature of the single-unit mounting plate 1 is higher than the preset upper temperature limit: the unfoldable thermal control plate 2 is directed to the direction of the minimum external heat flow intensity to dissipate heat. When the temperature of the single-unit mounting plate 1 is lower than the preset lower limit: the heating layer 104 starts heating and points the unfolded heat control plate 2 in the direction of the greatest external heat flow intensity to reduce the heating power required for the single-unit 5 to keep warm.

[0034] In practical applications, the heat exchange equation for a single-unit mounting plate is expressed as: ; In the formula, the subscript Indicates single-unit mounting plate 1; subscript Indicates unfolded thermal control panel 2; subscript Indicates satellite platform 6; The external heat flow absorbed by the single-unit mounting plate 1; The internal heat source of the single-unit mounting plate 1 includes the heat dissipation of the single-unit 5. The heat generated by the heating layer 104 Two parts; The absorption factor represents the proportion of heat radiated by satellite platform 6 that is absorbed by the single-unit mounting plate 1. The radiation area of ​​satellite platform 6, For the launch rate of satellite platform 6, It is the Stephen-Boltzmann constant. The temperature of satellite platform 6, The thermal conductivity coefficient between satellite platform 6 and single-unit mounting plate 1; The temperature of the single-unit mounting plate 1; The thermal conductivity coefficient between the unfolded heat sink 2 and the single-unit mounting plate 1; The temperature of the unfolded thermal control plate 2, For the heat capacity of the single-unit mounting plate 1, The radiation area of ​​the single-unit mounting plate 1. The emission rate of the single-unit mounting plate 1.

[0035] Since the outer surfaces of the single-unit mounting plate 1 and the single-unit 5 are equipped with a first multi-layer thermal insulation component 106-1, the external space heat flow absorbed by the single-unit mounting plate 1, the thermal radiation from the satellite platform 6, and the thermal radiation from the single-unit mounting plate 1 are negligible. Because the single-unit mounting structure is installed on the satellite platform 6 using thermal insulation, the heat conduction between the single-unit mounting plate 1 and the satellite platform 6 is negligible. Therefore, the heat exchange equation for the single-unit mounting plate 1 simplifies to: ; The temperature change rate of the single-unit mounting plate 1 mainly depends on the working heat consumption of the single unit 5, the heating power of the heating belt, and the heat conduction between the single-unit mounting plate 1 and the unfolded thermal control plate 2. The heat exchange equation of the unfolded thermal control plate 2 is: ; in External heat flow absorbed by the front of the deployable thermal control plate; External heat flow absorbed by the back of the expandable thermal control plate; The thermal conductivity coefficient between the single-unit mounting plate and the unfolded thermal control plate; The heat capacity of the unfolded thermal control plate; The radiation area of ​​the unfolded thermal control plate; Emissivity of the front side of the deployable thermal control plate; Emissivity of the back of the deployable thermal control plate.

[0036] The external heat flow absorbed by the deployable thermal control plate 2 includes three parts: solar radiation heat flow, Earth's albedo heat flow, and Earth's infrared radiation heat flow, which are represented as follows: ; in , , To display the solar radiation heat flow, Earth's albedo heat flow, and Earth's infrared radiation heat flow on the front of the thermal control panel 2, 、 、 To display the solar radiation heat flow, Earth's albedo heat flow, and Earth's infrared radiation heat flow on the back of thermal control panel 2, To measure the solar absorptivity on the front of thermal control panel 2, To measure the solar absorptivity on the back of thermal control panel 2.

[0037] Combining the above equations, the temperature change rate of the single-unit mounting plate 1 is: ; From the formula for the temperature change rate of the single-unit mounting plate 1, it can be seen that the parameters affecting the temperature stability of the single-unit mounting plate 1 can be divided into three groups: The first set of parameters is , , , , , , These parameters can be designed according to actual needs during the design phase and remain basically stable during the spacecraft's on-orbit flight; The second set of parameters is , This parameter depends on the on-orbit operating status of the unit and the operating status of the heating layer 104, and will change depending on the mission mode. The third set of parameters is , , , 、 、 These parameters depend on the position of the deployable thermal control plate 2 relative to the sun and the earth. By setting the deployable thermal control plate 2 at a location where the external heat flow changes drastically at different angles, the external heat flow can be adjusted in orbit by adjusting the angle of the deployable thermal control plate. When the satellite is in orbit, it operates according to the different working modes of the single unit 5. Adjust the working mode of heating layer 104. The external heat flow of the unfolded heat control plate 2 is adjusted by adjusting the angle of the unfolded heat control plate 2. , , , 、 、 When the temperature of the single-unit mounting plate 1 exceeds the preset upper limit of temperature, the direction of the heat control plate is actively adjusted to reduce heat absorption and increase heat radiation for heat dissipation. When the temperature of the single-unit mounting plate 1 is lower than the lower limit of temperature, it is heated by the heating layer 104, and the direction of the unfolded heat control plate 2 is actively adjusted to increase heat absorption and reduce heat radiation for heating, thereby achieving low heat control power and high temperature stability temperature control of the single-unit mounting plate 1.

[0038] To further describe the technical solution of this embodiment, example parameters are provided below. Application Scenario: The satellite operates in a 500km sun-synchronous orbit with an inclination of 97.336° and an orbital Beta angle ranging from 59° to 87°. The positive X-axis represents the flight direction, the positive Z-axis represents the direction relative to the Earth, and the positive Y-axis is determined using the right-hand rule. The external heat flux of each surface of the satellite is shown in Table 1 below, and the surface heat flux density at different times is shown in Table 2 below. Figure 1-2 , Figure 1-2 In the diagram, +X represents the positive X-axis, -X represents the negative X-axis, +Y represents the positive Y-axis, -Y represents the negative Y-axis, +Z represents the positive Z-axis, and -Z represents the negative Z-axis. Therefore, by arranging the expandable heat control plate 2 on the negative Y-axis side and setting the rotation axis of the heat control plate drive mechanism 3 to the Z-axis, the external heat flow on the front and back sides of the expandable heat control plate 2 can be significantly adjusted by adjusting its orientation. Table 1. Average external heat flux density (W / m³) of satellites reaching the outer surfaces of each instrument compartment. 2

[0039] The heat dissipation surface of satellite platform 6 is located on the negative Z-axis side to avoid the heat radiation from the heat dissipation surface of satellite platform 6 affecting the single-unit installation structure; The base plate 101 of the single-unit mounting plate 1 is a thin-walled aluminum alloy reinforced structural plate with a total thickness of 12mm, a wall thickness of 1mm, and a reinforcing rib width of 4mm. It is equipped with a single-unit 5 mounting interface and a connection interface with the satellite platform structure 6. The single-unit mounting plate 1 weighs 0.8kg, and the single-unit 5 weighs 1.5kg. like Figure 5 The base plate 101 of the single-unit mounting plate 1 is connected to the satellite platform structure 6 through a low-rigidity silicone rubber structure 102; The single-unit mounting plate 1 has four temperature sensors 103 installed near the installation position of the single unit 5 to measure the temperature at the installation position of the single unit 5; Eight constantan foil heating elements are attached to the back of the single-unit mounting plate 1 as heating layer 104, each heating element has a power of 2W, which performs thermal compensation on the substrate 101 and performs closed-loop control based on the measurement results of the temperature sensor 103. like Figure 6 The graphite thermal conductive film is covered with a 10-unit second multilayer thermal insulation component 106-2; The side of the single-unit mounting plate 1 away from the satellite platform 6 and the outer surface of the single unit 5 are covered with 20 units of the first multi-layer thermal insulation component 106-1; The mounting surface of unit 5 is filled with thermally conductive silicone grease and thermally connected to the mounting plate 1 of unit 5. like Figure 4 The unfoldable heat control plate 2 has a two-fold structure, including an inner fold 201 and an outer fold 202. Both are made of aluminum alloy thin-walled stiffened plates, with dimensions of 360mm×300mm, a total thickness of 2mm, a wall thickness of 0.8mm, a stiffener width of 3mm, and a weight of 0.28kg. The inner fold 201 and the outer fold 202 of the unfoldable thermal control plate 2 are connected by a hinge 203 and heat is conducted through a flexible heat-conducting cable 204. The front of the unfoldable thermal control panel 2 is a radiating surface, sprayed with thermal control white paint, with a solar absorption ratio of... The emissivity is 0.17. It is 0.87; The back of the unfolded thermal control plate 2 is the absorption surface, sprayed with thermal control gray paint, which has a solar absorption ratio of The emissivity is 0.80. It is 0.85; The deployable thermal control plate 2 is connected to the satellite platform 6 via the thermal control plate drive mechanism 3, and the angle between the normal of the deployable thermal control plate 2 and the negative Y-axis is controlled by the stepper motor 301. θ The temperature change rate of the single-unit mounting plate 1 can be expressed as: ; Based on the heat generated under different operating conditions of the single unit 5 The external heat flow of the expandable heat control plate 2 is adjusted by regulating the amount of θ, and the heat generated by the heating layer 104 is also adjusted. To achieve low-power, high-temperature stability control of the single-unit mounting plate 1; The thermal control board drive structure 3 is composed of a stepper motor 301 and a rotating shaft 302. The heat conduction structure 4 uses a flexible heat conduction tape to achieve heat conduction between the single-unit mounting plate 1 and the unfoldable thermal control plate 2.

[0040] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A single machine installation structure characterized by comprising: The application relates to a single-machine installation structure. The single machine (5) is installed on a satellite platform (6) through a single-machine installation plate (1) and is indirectly connected to the satellite platform (6) through an interface of the single-machine installation plate (1); the single machine (5) and the single-machine installation plate (1) are in heat-conducting connection. The single-machine installation plate (1) with a self-heating function is in heat-conducting connection with the unfolded heat-control plate (2) through a heat-conducting structure (4). One side of the unfolded heat-control plate (2) is a radiation side, and the other side is an absorption side or an isolation side; the absorption ratio of the absorption side is greater than that of the radiation side. The heat-control plate driving mechanism (3) for controlling the unfolding degree and the pointing direction of the unfolded heat-control plate (2) is installed on the satellite platform (6) and is in signal connection with a control system for controlling the temperature of the single machine (5). The single-machine installation plate (1) comprises a multilayer structure formed by a base plate (101), a heating layer (104) and a plurality of multilayer heat insulation components (106) and a low-rigidity connecting structure (102) for penetrating through the multilayer structure and fixedly connecting the single-machine installation plate (1) and the satellite platform (6).

2. The single machine mounting structure of claim 1, wherein The first multilayer heat insulation component (106-1), the single machine (5), the base plate (101), the heating layer (104), the second multilayer heat insulation component (106-2) and the satellite platform (6) are sequentially arranged. The single-machine installation plate (1) further comprises a temperature sensor (103) installed on the base plate (101) and used for measuring the temperature at the single machine (5) installation position on the base plate (101); the single machine (5), the heating layer (104), the temperature sensor (103) and the satellite platform (6) are in interface communication connection with the base plate (101). The unfolded heat-control plate (2) adopts a multi-fold structure and is formed by a plurality of heat-control plates connected through hinges (203); and the adjacent two heat-control plates are in heat-conducting connection through flexible heat-conducting ropes (204).

3. The single machine mounting structure of claim 2, wherein One end of the unfolded heat-control plate (2) is fixed on the satellite platform (6) and is in heat-conducting connection with the single-machine installation plate (1) through the heat-conducting structure (4). The output end of the heat-control plate driving mechanism (3) is in transmission connection with one end of the unfolded heat-control plate (2), so that the unfolded heat-control plate (2) is adjusted in the on-orbit pointing under the control of the heat-control plate driving mechanism (3). The unfolded heat-control plate (2) adopts a single-fold structure.

4. The single machine mounting structure of claim 2, wherein One end of the unfolded heat-control plate (2) is fixed on the satellite platform (6) and is in heat-conducting connection with the single-machine installation plate (1) through the heat-conducting structure (4). The output end of the heat-control plate driving mechanism (3) is in transmission connection with one end of the unfolded heat-control plate (2), so that the unfolded heat-control plate (2) is adjusted in the on-orbit pointing under the control of the heat-control plate driving mechanism (3). The single-machine installation structure is realized according to any one of claims 3-4, and corresponding adjustment is made according to the change of the influencing factors in the heat exchange equation of the single-machine installation plate (1) and the heat exchange equation of the unfolded heat-control plate (2), specifically as follows:

5. A thermal control method according to a single machine installation structure, characterized by, When the temperature of the single-machine installation plate (1) is higher than the preset upper limit value, the unfolded heat-control plate (2) is pointed to the direction with the minimum external heat flow intensity for heat dissipation. ​ When the temperature of the single-machine installation plate (1) is lower than the preset lower limit value, the heating layer (104) performs heating work and points the unfolded heat control plate (2) to the direction with the maximum external heat flow intensity, so as to reduce the heating power required for the single-machine (5) heat preservation.

6. The thermal control method according to the single-computer installation structure according to claim 5, characterized by, The heat exchange equation of the single-machine installation plate (1) is: ； In the formula, subscript represents the single machine mounting plate; subscript represents the expanded heat control plate, is the internal heat source of the single machine mounting plate (1), including the heat consumption of the single machine (5) and the heat generated by the heating layer (104) Two parts; is the temperature of the single machine mounting plate (1); is the heat transfer coefficient between the expanded heat dissipation plate (2) and the single machine mounting plate (1); is the temperature of the expanded heat control plate (2), is the heat capacity of the single machine mounting plate (1).

7. The thermal control method according to the single-computer installation structure according to claim 6, characterized by, The heat exchange equation of the unfolded heat control plate (2) is: ； wherein is the spatial external heat flux absorbed by the front face of the deployable thermal control panel; is the spatial external heat flux absorbed by the back face of the deployable thermal control panel; is the thermal conduction coefficient between the single machine mounting panel and the deployable thermal control panel; is the thermal capacity of the deployable thermal control panel; is the radiating area of the deployable thermal control panel; is the emissivity of the front face of the deployable thermal control panel; is the emissivity of the back face of the deployable thermal control panel.

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