Server radiation suppression method and system based on conductive spraying and dynamic signal management

Abstract

The application discloses a server radiation suppression method and system based on conductive spraying and dynamic signal management, relates to the technical field of electromagnetic compatibility of servers, and discloses the server radiation suppression method and system based on conductive spraying and dynamic signal management, which constructs a stable grounding path through a layered conductive spraying process, suppresses high-frequency interference by adopting a gridding shielding flat cable, realizes real-time optimization of radiation by combining dynamic signal closed-loop control, and improves overall suppression effect by processing multi-dimensional data in cooperation, so that the grounding stability can be improved, the high-frequency interference suppression capability can be enhanced, radiation dynamic optimization can be realized, and overall suppression cooperation can be improved.

Description

Technical Field

[0001] This application relates to the field of server electromagnetic compatibility technology, and in particular to a server radiation suppression method and system based on conductive spraying and dynamic signal management. Background Technology

[0002] With the continuous improvement of data processing capabilities in current server technology development, the electromagnetic radiation generated by servers during operation has become an increasingly prominent issue. This electromagnetic radiation may not only interfere with the stable operation of the server itself, affecting the accuracy and speed of data transmission, but may also adversely affect surrounding electronic equipment, interfering with its normal operation, and even, in extreme cases, posing a potential threat to the health of operators.

[0003] Traditional server radiation suppression methods, such as using simple shielding or adding filtering circuits, can reduce radiation to some extent, but they often have limited effectiveness, high costs, or negative impacts on server heat dissipation. Especially in high-frequency signal transmission and complex electromagnetic environments, the suppression effect of traditional methods is significantly reduced, making it difficult to meet the stringent requirements of modern servers for low radiation and high stability. Specifically, existing technologies suffer from the following shortcomings: rough chassis surface treatment leads to unstable grounding impedance; simple signal cable shielding structures cannot effectively suppress high-frequency interference; the lack of intelligent feedback mechanisms in dynamic signal management leads to lag in radiation control; and the lack of coordinated optimization between suppression modules results in poor overall suppression performance.

[0004] The above content is only used to help understand the technical solution of this application and does not represent an admission that the above content is prior art. Summary of the Invention

[0005] The main objective of this application is to provide a server radiation suppression method and system based on conductive spraying and dynamic signal management, which aims to improve grounding stability, enhance high-frequency interference suppression capability, achieve dynamic radiation optimization, and improve overall suppression synergy.

[0006] To achieve the above objectives, this application proposes a server radiation suppression method based on conductive spraying and dynamic signal management, the method comprising:

[0007] Impurities on the surface of the server chassis plastic components are removed by sandblasting pretreatment to obtain clean chassis surface data. The clean chassis surface data is then processed by a layered conductive spraying process, sequentially spraying a base coat, a main coat, and a top coat to obtain multi-layer conductive coating data. The multi-layer conductive coating data is then subjected to segmented heating and curing treatment to obtain cured conductive layer data. Finally, the cured conductive layer data is processed by conductive treatment of the inner wall of the mounting holes and installation of conductive gaskets to generate chassis grounding conductive path data.

[0008] Composite cable material data was obtained by laminating polyimide substrate, meshing copper foil shielding layer and adhesive processing; the composite cable material data was processed by etching wiring to generate cable layout data including differential signal lines and start and end ground pins; the cable layout data was processed by edge sealing and bending reinforcement to obtain flexible shielded cable performance verification data;

[0009] The system uses programmable logic devices to scan the presence status of standard slots for the server's high-speed peripheral interconnect (HSI) components, acquiring device presence status data. This data is then processed through logic decision-making to generate a clock channel shutdown command when a device is not connected. This command is transmitted to a clock signal buffer and processed to shut down the corresponding clock channel. Near-field probes are used to collect server radiation signals, generating radiation monitoring data. This data is then processed through feedback optimization to generate logic decision-optimized parameter data. Based on these optimization parameters, the system adjusts the logic decision-making parameters to generate radiation-optimized dynamic signal control results.

[0010] The chassis grounding conductive path data, flexible shielded cabling performance verification data, and radiation-optimized dynamic signal control result data are processed through common-mode interference collaborative suppression to generate overall electromagnetic radiation suppression effect data.

[0011] In one embodiment, the layered conductive spraying process includes:

[0012] The clean frame surface data is processed by plasma cleaning and surface activator spraying to obtain activated surface data;

[0013] The activated surface data was sequentially processed by spraying a silver epoxy resin composite primer, a main coating, and a top coating to obtain the layered coating adhesion data;

[0014] The data on the adhesion of the layered coating is processed by a staged heating and heat curing process to generate the data of the cured conductive layer.

[0015] In one embodiment, the step of generating cured conductive layer data by performing a segmented heating and thermal curing process on the layered coating adhesion data includes:

[0016] The adhesion data of the layered coating is obtained by pre-curing it in a preset first temperature range to obtain preliminary curing data;

[0017] The preliminary curing data is then subjected to a primary curing process within a preset second temperature range to obtain stable conductive layer data.

[0018] The stable conductive layer data is cooled to generate solidified conductive layer data.

[0019] In one embodiment, the meshed copper foil shielding layer treatment includes:

[0020] The copper foil shielding material is processed by laser etching to form a grid-like structure, and the gridded copper foil data is obtained.

[0021] The gridded copper foil data is combined with a polyimide substrate through hot-pressing lamination to generate composite cable material data.

[0022] In one embodiment, the step of obtaining device in-situ status data through scanning processing using a programmable logic device includes:

[0023] Initialization configuration data is obtained through initialization configuration processing using programmable logic devices;

[0024] Based on the initial configuration data, the clock signal buffer control link is verified by executing a self-test program to obtain self-test verification data.

[0025] Based on self-test verification data, in-situ status detection data is generated by sampling and processing the standard slot voltage signal of the peripheral component interconnection standard.

[0026] The in-situ status detection data is converted into binary logical values ​​to obtain the device in-situ status data.

[0027] In one embodiment, generating clock channel shutdown command data by processing device in-situ status data through logical decision processing includes:

[0028] The device presence status data is processed through logical judgment, and when the judgment result is that the device is not connected, channel shutdown decision data is generated.

[0029] The channel shutdown decision data is converted into a high-level signal and processed to generate clock channel shutdown command data.

[0030] In one embodiment, the method further includes:

[0031] At the input end of the server signal line, a tunable filter is used to analyze and process signal noise to obtain noise spectrum data.

[0032] The noise spectrum data is processed through dynamic parameter matching to generate filter adjustment command data;

[0033] The filter adjustment command data is fed back to the tunable filter for processing to obtain broadband noise suppression result data;

[0034] The broadband noise suppression results data are integrated into the radiation-optimized dynamic signal control results data.

[0035] In one embodiment, generating logical decision optimization parameter data from radiation monitoring data through feedback optimization processing includes:

[0036] Radiation monitoring data is processed by threshold comparison to obtain radiation intensity deviation data;

[0037] The radiation intensity deviation data is processed using a proportional-integral-differential algorithm to generate logical decision optimization parameter data.

[0038] In one embodiment, the step of generating overall electromagnetic radiation suppression effect data by processing the chassis grounding conductive path data, flexible shielded cabling performance verification data, and radiation-optimized dynamic signal control result data through common-mode interference collaborative suppression includes:

[0039] The grounding conductivity path data of the chassis is processed through grounding impedance effectiveness analysis to obtain grounding effectiveness assessment data;

[0040] The performance verification data of the flexible shielded cabling is processed through electromagnetic shielding effectiveness verification to obtain the cabling shielding effectiveness verification data;

[0041] The optimized dynamic signal control results data are processed by radiation source attenuation simulation to obtain signal radiation suppression evaluation data.

[0042] The grounding effectiveness assessment data, cable shielding effectiveness verification data, and signal radiation suppression assessment data are weighted and fused to generate overall electromagnetic radiation suppression effect data.

[0043] Furthermore, to achieve the above objectives, this application also proposes a server radiation suppression system based on conductive spraying and dynamic signal management. The system includes a memory, a processor, and a computer program stored in the memory and executable on the processor. The computer program is configured to implement the steps of the server radiation suppression method based on conductive spraying and dynamic signal management.

[0044] The server radiation suppression method and system proposed in this application, based on conductive spraying and dynamic signal management, constructs a stable grounding path through a layered conductive spraying process, suppresses high-frequency interference by using a gridded shielded cabling, achieves real-time radiation optimization by combining dynamic signal closed-loop control, and improves the overall suppression effect through multi-dimensional data collaborative processing. This can improve grounding stability, enhance high-frequency interference suppression capability, achieve dynamic radiation optimization, and improve overall suppression synergy. Attached Figure Description

[0045] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0046] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 This is a flowchart illustrating an embodiment of the server radiation suppression method based on conductive spraying and dynamic signal management provided in this application.

[0048] Figure 2 This is a schematic diagram of a server radiation suppression system based on conductive spraying and dynamic signal management according to an embodiment of this application.

[0049] Explanation of icon numbers:

[0050] 10. Memory; 20. Processor.

[0051] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0052] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of this application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0053] It should be understood that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0054] In existing technologies, server electromagnetic radiation suppression primarily relies on metal shielding and filtering circuits. However, as data processing speeds increase to the gigahertz level, common-mode interference and near-field radiation from high-frequency signals significantly amplify. Traditional metal shielding structures struggle to achieve complete enclosure in complex cable layouts, and there is a conflict between heat dissipation channels and shielding effectiveness. In a data center operation and maintenance scenario, frequent hot-swapping of standard slots for rapid peripheral component interconnection led to idle clock signal radiation. Conventional filtering methods could not dynamically adapt to changes in device connection status, resulting in multiple electromagnetic compatibility tests exceeding limits.

[0055] To address these issues, the research team discovered that electromagnetic leakage primarily originates from charge accumulation on non-conductive surface structures and clock signal radiation from unused interfaces. By analyzing the distribution characteristics of high-frequency electromagnetic fields, they proposed a technical approach combining conductive coatings with dynamic signal control. For plastic chassis surfaces, a layered spraying process was used to construct continuous conductive paths; for high-speed cabling, a gridded shielding structure was developed to suppress crosstalk; and for idle device interfaces, a real-time status monitoring and dynamic signal channel shutdown mechanism was designed. These three technical directions work synergistically to form a composite radiation suppression solution.

[0056] Based on this, embodiments of this application provide a server radiation suppression method based on conductive spraying and dynamic signal management, referring to... Figure 1 The server radiation suppression method based on conductive spraying and dynamic signal management includes steps S100 to S400, wherein:

[0057] Step S100: Remove impurities from the surface of the server chassis plastic components through sandblasting pretreatment to obtain clean chassis surface data; process the clean chassis surface data through a layered conductive spraying process, sequentially spraying a base coat, a main coat, and a top coat to obtain multi-layer conductive coating data; process the multi-layer conductive coating data through segmented heating and heat curing treatment to obtain cured conductive layer data; process the cured conductive layer data through conductive treatment of the inner wall of the mounting holes and installation of conductive gaskets to generate chassis grounding conductive path data;

[0058] Step S200: Composite cable material data is obtained by laminating polyimide substrate, meshed copper foil shielding layer and adhesive; the composite cable material data is processed by etching wiring to generate cable layout data including differential signal lines and start and end ground pins; the cable layout data is processed by edge sealing and bending reinforcement to obtain flexible shielded cable performance verification data.

[0059] Step S300: The programmable logic device scans and processes the presence status of the server's fast peripheral component interconnect standard slots to obtain device presence status data; the device presence status data is processed through logic decision-making, and clock channel shutdown command data is generated when the device is not connected; the clock channel shutdown command data is transmitted to the clock signal buffer and controlled to shut down the corresponding clock channel; the server radiation signal is collected through a near-field probe to obtain radiation monitoring data; the radiation monitoring data is processed through feedback optimization to generate logic decision optimization parameter data; based on the logic decision optimization parameter data, the logic decision processing parameters are adjusted to generate radiation-optimized dynamic signal control result data.

[0060] Step S400: The chassis grounding conductive path data, flexible shielded cable performance verification data, and radiation-optimized dynamic signal control result data are processed through common-mode interference collaborative suppression to generate electromagnetic radiation suppression effect data for the whole machine.

[0061] In this embodiment, sandblasting pretreatment refers to removing surface contaminants using abrasive impact. Specifically, dry sandblasting with alumina particles can be used to ensure the bonding strength between the subsequent coating and the substrate. Layered conductive spraying refers to depositing conductive materials with different functions in stages. Specifically, a silver epoxy resin base coating can be used to improve adhesion, a nickel-based main coating to enhance conductivity, and a polymer top coating to prevent oxidation. Segmented temperature-curing refers to heat treatment in different temperature ranges. Specifically, pre-curing at 80-100℃ can eliminate solvents, and main curing at 150-180℃ can form a cross-linked structure. Conductive treatment of the inner wall of the mounting hole refers to strengthening the conductivity of mechanical connection parts. Specifically, conductive adhesive can be used to fill the thread gaps to form an equipotential connection. Mesh copper foil shielding layer refers to a metal shielding structure with regular pores. Specifically, laser etching can be used to form a diamond-shaped grid with a line width of 0.1mm, balancing shielding effectiveness and flexibility. Logical decision processing refers to signal control based on device status. Specifically, a finite state machine model can be used to determine the interface usage status and generate corresponding channel control commands.

[0062] In this embodiment, the surface of the plastic chassis is sandblasted and then coated three times to form a conductive layer with a gradient thickness. The base coat fills the surface micropores, the main coat constructs the main conductive network, and the top coat provides environmental protection. The curing process uses a stepped temperature rise curve to avoid coating cracking. During cable fabrication, a copper mesh is etched onto the polyimide substrate, and serpentine routing is used to reduce crosstalk. The device interface status monitoring system scans the slot voltage at a 1-second cycle, and when device removal is detected, the corresponding clock buffer is shut down within 10 milliseconds. The radiation data collected by the near-field probe is analyzed by Fourier transform, and the shutdown response threshold of the signal channel is automatically adjusted.

[0063] In this embodiment, the solution utilizes surface conductive treatment to give the plastic chassis shielding functionality, reducing equipment weight. Furthermore, this solution dynamically disables clock signals on unused interfaces, lowering radiation intensity during idle states. Compared to integral copper foil shielded cabling, the mesh structure maintains good shielding effectiveness while improving bending lifespan. Thus, this application effectively reduces the overall electromagnetic radiation level of the server.

[0064] In one feasible implementation, the layered conductive spraying process includes: cleaning the clean frame surface data through plasma cleaning and surface activator spraying to obtain activated surface data; sequentially spraying the activated surface data through a silver epoxy resin composite primer, a main coating, and a top coating to obtain layered coating adhesion data; and performing a segmented heating and curing process on the layered coating adhesion data to generate cured conductive layer data.

[0065] In this embodiment, plasma cleaning refers to cleaning and modifying the surface using active particles generated by ionized gas. Specifically, it can be achieved by using a radio frequency power supply to excite inert gas to form a plasma flow, used to remove residual contaminants and increase surface energy. Surface activator spraying refers to applying chemical reagents containing polar groups to enhance surface wettability. Specifically, it can be achieved by using a silane coupling agent solution through atomized spraying, used to promote chemical bonding between the coating and the substrate. The silver epoxy resin composite base coating is a bottom coating formed by mixing conductive silver particles with an epoxy resin matrix. Specifically, it can be achieved by dispersing micron-sized silver powder and a two-component epoxy resin in a certain proportion and then spraying, used to establish a continuous conductive network and improve adhesion. The main coating is an intermediate coating with higher conductivity. Specifically, it can be achieved by using an epoxy resin composite material with a higher silver content through secondary spraying, used to enhance overall conductivity. The top coating is an outer coating that balances wear resistance and surface smoothness. Specifically, it can be achieved by using modified epoxy resin with added nanofillers through fine spraying, used to protect the internal conductive layer and optimize surface properties. Segmented temperature curing refers to controlling the temperature in stages to gradually cross-link and cure the coating. Specifically, it can be achieved by using a gradient temperature program combined with a hot air circulating oven, which is used to avoid coating cracking and ensure the stability of the interfaces between layers.

[0066] In this embodiment, after plasma cleaning, surface contaminants are effectively removed from the cleaned frame surface, resulting in a micro-rough structure. A surface activator is then uniformly sprayed onto the surface, forming a transition layer through chemical bonding. A silver epoxy resin composite primer is sprayed onto the activated surface, filling surface micropores and forming a dense conductive substrate at a low viscosity. The main coating further increases the silver content on top of the primer, achieving uniform coverage by adjusting the spraying pressure and atomization parameters, forming a low-resistance pathway. The topcoat is sprayed before the main coating cures, utilizing leveling properties to optimize surface morphology. During the staged heating process, the primer is pre-cured at a lower temperature, and then the temperature is gradually increased to allow the main coating and topcoat to complete cross-linking reactions sequentially, ultimately forming a stable conductive layer with a gradient structure.

[0067] In this embodiment, the solution combines layered spraying with segmented curing. While ensuring the functionality of each layer, it alleviates internal stress through temperature gradient control. For example, the pre-curing stage uses a temperature range controllable between 50-80℃, and the main curing stage employs a stepped heating strategy of 80-120℃, allowing each layer to reach its optimal curing state sequentially. This achieves reliable bonding between the conductive coating and the plastic substrate, effectively reducing interfacial contact resistance and improving electromagnetic shielding performance. The layered structure design avoids stress concentration problems caused by excessively thick single coatings, and the segmented curing process reduces the generation of bubbles and cracks, thereby improving the mechanical stability and long-term reliability of the conductive layer. The synergistic effect of surface activation treatment and gradient materials ensures uniform coating coverage even on complex morphological surfaces, significantly reducing electromagnetic leakage paths.

[0068] In one feasible implementation, the step of generating cured conductive layer data by performing a segmented heating and thermal curing process on the layered coating adhesion data includes: performing a pre-curing process on the layered coating adhesion data in a preset first temperature range to obtain preliminary cured data; performing a main curing process on the preliminary cured data in a preset second temperature range to obtain stable conductive layer data; and performing a cooling process on the stable conductive layer data to generate cured conductive layer data.

[0069] In this embodiment, the preset first temperature range refers to the heating range below the glass transition temperature of the material, specifically between 50°C and 80°C. Low-temperature pre-curing allows for the slow release of internal stress in the coating, preventing cracking caused by rapid temperature increases. The preset second temperature range refers to the heating range above the glass transition temperature of the material, specifically between 120°C and 150°C. High-temperature primary curing promotes the resin cross-linking reaction, forming a dense conductive network structure. The cooling treatment refers to controlling the coating shrinkage rate through a gradient cooling method, specifically by reducing the temperature by 10°C per hour, to prevent the coating from peeling off from the substrate due to excessive temperature differences.

[0070] In this embodiment, during the conductive coating curing process, the sprayed frame is first placed in a pre-curing environment and kept at a constant temperature within a preset first temperature range, allowing the solvents in the base coat, main coat, and top coat to gradually evaporate, forming a preliminary bonded coating structure. Subsequently, the pre-cured component is transferred to the main curing equipment, where a stepped temperature increase is performed within a preset second temperature range, allowing the resin matrix to complete the cross-linking reaction and form a continuous coating with stable conductive properties. Finally, a program-controlled cooling system implements gradient cooling to ensure that the difference in thermal expansion coefficients between the coating and the substrate is buffered, ultimately forming a crack-free conductive layer with satisfactory adhesion.

[0071] In this embodiment, the solution achieves consistent curing rates inside and outside the coating through the coordinated control of segmented heating and gradient cooling. This effectively solves the problem of structural defects in the conductive layer caused by thermal stress concentration, realizes a stable bond between the conductive coating and the plastic substrate, avoids coating cracking or peeling caused by temperature changes during curing, and ensures that the conductive layer maintains stable electromagnetic shielding performance under long-term server operation.

[0072] In one feasible implementation, the meshed copper foil shielding layer processing includes: forming a mesh structure by laser etching of copper foil shielding material to obtain meshed copper foil data; and combining the meshed copper foil data with a polyimide substrate by hot pressing lamination to generate composite cable material data.

[0073] In this embodiment, the laser etching process to form a grid structure refers to using high-precision laser equipment to etch a uniformly distributed perforated pattern on the surface of the copper foil. Specifically, a 10.6-micron wavelength carbon dioxide laser can be used in conjunction with a CNC moving platform. The etching depth and linewidth are controlled by adjusting the laser power and scanning speed. The hot-press lamination process refers to physically bonding the polyimide substrate to the copper foil under high temperature and high pressure conditions. This can be achieved using a laminator with a temperature range of 180-220℃ and a pressure of 5-8 MPa, with staged pressure increases to prevent material deformation. The gridded copper foil refers to forming a periodic open structure while maintaining the continuity of the conductive copper foil. This can be achieved using an etching pattern of repeating rhomboid or hexagonal units, allowing the copper foil to maintain its electromagnetic shielding capability while reducing weight and material costs.

[0074] In this embodiment, during the fabrication of the flexible shielded cable, a whole copper foil is first placed on a laser processing platform and etched according to preset grid density parameters to form a mesh-like copper foil layer with regular holes. Subsequently, the etched copper foil is stacked with a polyimide film and sent to a hot press for lamination. During this process, the polyimide substrate softens at high temperature and adheres tightly to the copper foil mesh. After cooling, a composite shielding material with a three-dimensional structure is formed. This material retains the conductive properties of the copper foil while reducing the overall weight through its grid design. Simultaneously, the polyimide substrate provides the cable with the necessary flexibility to adapt to the space constraints of internal server cabling.

[0075] In this embodiment, the gridded copper foil formed by laser etching reduces the amount of copper used while maintaining the same shielding effectiveness. The grid structure also disperses stress, preventing bending and breakage. Furthermore, the hot-press lamination process, compared to traditional adhesive bonding, eliminates the risk of interface peeling due to adhesive aging, thus improving the bonding strength between the shielding layer and the substrate. Through the above technical solutions, this application effectively solves the assembly difficulty problem caused by the excessive weight of the shielding cabling inside the server and reduces skin effect loss during high-frequency signal transmission. The gridded copper foil structure maintains electromagnetic shielding effectiveness while enhancing the cabling's flexibility in confined spaces, while the hot-press composite process ensures the structural stability of the shielding layer under long-term vibration environments, preventing a decline in shielding performance due to interface separation.

[0076] In one feasible implementation, the step of obtaining device in-situ status data through programmable logic device scanning processing includes: obtaining initialization configuration data through programmable logic device initialization configuration processing; obtaining self-test verification data by executing a self-test program to verify the clock signal buffer control link based on the initialization configuration data; generating in-situ status detection data by sampling the standard slot voltage signal of the Fast Peripheral Component Interconnect (FPCI) based on the self-test verification data; and obtaining device in-situ status data by converting the in-situ status detection data into binary logic values.

[0077] In this embodiment, the initialization and configuration processing of the programmable logic device refers to setting parameters and loading registers for the programmable logic device. Specifically, this can be achieved by writing control instructions into non-volatile memory using a preset configuration protocol, ensuring that the device is in a state where a self-test program can be executed. The self-test program verification processing of the clock signal buffer control link involves detecting the response state of the clock signal buffer using a preset test signal sequence. Specifically, a cyclic redundancy check algorithm can be used to verify the data integrity of the control link, ensuring the reliability of the signal transmission path. The sampling and processing of the standard slot voltage signal for the fast peripheral component interconnection refers to acquiring and quantizing the voltage signal of the slot's power pins. Specifically, an analog-to-digital converter can be used to convert the analog voltage signal into a digital signal, and a preset threshold can be compared to determine if a physical connection exists. The conversion to binary logic values ​​involves mapping the quantized voltage signal result to a logic level state. Specifically, logic gate circuits or software algorithms can be used to define a voltage value higher than a threshold as a logic high level and a voltage value lower than a threshold as a logic low level, thereby simplifying the subsequent logic judgment process.

[0078] In this embodiment, the programmable logic device first completes register settings and function module activation according to preset initialization configuration data. Then, it executes a self-test program to send a test signal to the clock signal buffer and verify whether its feedback meets expectations. If the self-test verification is successful, the voltage signal sampling module is started to periodically detect the power supply pins of the fast peripheral component interconnect standard slot. Finally, the sampled voltage signal is converted into a binary logic value through quantization and threshold comparison. For example, when the detected voltage is higher than 3.3V, it is determined as logic "1" indicating that the device is in place, and when it is lower than 2.7V, it is determined as logic "0" indicating that the device is not connected.

[0079] In this embodiment, the solution uses programmable logic devices to achieve a fully automated initialization, self-test, sampling, and logic conversion process. This not only improves the detection speed but also reduces the risk of misjudgment caused by environmental noise interference through digital signal processing. This allows the application to determine the presence status of server peripheral components in real time and accurately, providing a reliable data basis for dynamically shutting down the clock channels of unused devices. This effectively reduces electromagnetic radiation leakage caused by invalid signal transmission and avoids device malfunctions due to misjudgment.

[0080] In one feasible implementation, the step of generating clock channel shutdown command data by processing device presence status data through logical decision processing includes: processing device presence status data through logical judgment, generating channel shutdown decision data when the judgment result is that the device is not connected; and generating clock channel shutdown command data by converting the channel shutdown decision data into a high-level signal.

[0081] In this embodiment, the logic judgment processing refers to parsing the device's in-situ status data into binary logic values. This can be implemented using the AND gate circuit or state machine built into a programmable logic device. By matching the device's in-situ status data with preset logic conditions, it determines whether the device is in an unconnected state. The conversion to a high-level signal processing refers to converting the logic judgment result into an electrical signal output. This can be implemented using a digital signal conversion circuit, mapping the logic level signal into a drive signal that controls the operation of the clock signal buffer.

[0082] In this embodiment, when no device is connected to the server's Fast Peripheral Component Interconnect Standard Slot, the binary logic value corresponding to the device's presence status data is low. At this time, the logic judgment processing module generates channel shutdown decision data by comparing preset logic conditions. This data is transmitted to the signal conversion module, where it is converted into a high-level signal by a level conversion circuit. This signal directly acts on the enable terminal of the clock signal buffer, cutting off the power supply circuit to the corresponding clock channel. This automatically shuts down the relevant clock signal source when the peripheral is not connected, eliminating electromagnetic radiation generated by invalid clock signals.

[0083] In this embodiment, the solution establishes a dynamic correlation between device connection status and clock signal control through the synergistic effect of logical judgment and signal conversion. When a device is detected to be disconnected, a shutdown action is triggered immediately, which effectively avoids the radiation leakage problem caused by response delay in traditional solutions. This allows the application to accurately identify the device's on-site status and quickly cut off idle clock signals, significantly reducing the intensity of electromagnetic radiation caused by invalid clock signals. At the same time, it avoids the risk of misoperation that may be caused by manual intervention and improves the electromagnetic compatibility of the server during operation.

[0084] In one feasible implementation, the method further includes: at the input end of the server signal line, analyzing and processing signal noise through a tunable filter to obtain noise spectrum data; processing the noise spectrum data through parameter dynamic matching to generate filter adjustment command data; feeding the filter adjustment command data back to the tunable filter for processing to obtain broadband noise suppression result data; and integrating the broadband noise suppression result data into radiation-optimized dynamic signal control result data.

[0085] In this embodiment, the tunable filter refers to a filtering device that can dynamically adjust its frequency response characteristics according to the characteristics of the input signal. Specifically, it can be implemented using a digitally programmable filter or an analog filter circuit based on a varactor diode, used to actively identify and suppress noise interference in specific frequency bands at the signal transmission input. Noise spectrum data refers to the spectral distribution information obtained after frequency domain decomposition of the noise at the signal line input using a Fast Fourier Transform or a spectrum analyzer. Specifically, it can be generated using real-time sampling and frequency domain conversion algorithms, used to quantify the distribution characteristics of noise energy in different frequency bands. Parameter dynamic matching processing refers to the control logic that adjusts the filter cutoff frequency, attenuation slope, and passband range in real time according to the noise spectrum characteristics. Specifically, it can be achieved through adaptive matching calculation using preset noise thresholds and frequency band weighting coefficients, realizing dynamic adaptation of filter parameters to noise characteristics.

[0086] In this embodiment, after deploying a tunable filter at the server signal line input, the input signal is first sampled in real time and its spectrum is analyzed to extract the energy distribution data of noise in a specific frequency band. Then, the noise spectrum data is input into a parameter matching algorithm, which generates corresponding filter adjustment instructions based on a preset noise suppression strategy. For example, the cutoff frequency is adjusted to block high-frequency noise or the passband range is expanded to retain effective signals. The adjusted filter parameters are immediately applied to the tunable filter hardware, forming a closed-loop control circuit to continuously suppress broadband noise. Finally, the noise suppression effect data is integrated with the output results of the dynamic signal control module to form a complete radiation optimization control dataset.

[0087] In this embodiment, through real-time spectrum analysis and dynamic parameter matching, the filter can adaptively adjust to the noise characteristics under different operating conditions, which not only ensures continuous suppression of broadband noise, but also avoids interference with normal signal transmission. It realizes accurate identification and dynamic suppression of noise at the input end of the server signal line, effectively reduces common-mode radiation leakage caused by broadband noise, and enhances the overall coordination of the radiation suppression system through data integration, thereby improving its adaptability to complex electromagnetic environments.

[0088] In one feasible implementation, the step of generating logical decision optimization parameter data from radiation monitoring data through feedback optimization processing includes: obtaining radiation intensity deviation data by performing threshold comparison processing on radiation monitoring data; and generating logical decision optimization parameter data by processing the radiation intensity deviation data through a proportional-integral-differential algorithm.

[0089] In this embodiment, threshold comparison processing refers to comparing and analyzing the real-time collected radiation intensity values ​​with preset safety thresholds. This can be implemented using a comparator module built into a digital signal processor to quickly identify areas exceeding radiation limits. Proportional-integral-derivative (PID) algorithm processing refers to adjusting multi-dimensional parameters based on the dynamic trends of the deviation data. This can be implemented using a control algorithm module built into a programmable logic device to optimize the dynamic response of the closed-loop control system.

[0090] In this embodiment, during server operation, a near-field probe continuously collects radiation intensity signals from a specific area inside the chassis and converts these signals into digital quantities, which are then transmitted to the data processing unit. The data processing unit compares the real-time radiation intensity data point-by-point with a preset safety threshold range. When an abnormal radiation point exceeding the threshold range is detected, corresponding radiation intensity deviation data is generated. This deviation data is input to the proportional-integral-derivative (PID) algorithm module. The proportional term quickly responds to the current deviation amplitude, the integral term eliminates historical accumulated errors, and the derivative term predicts future trends, ultimately outputting dynamically adaptive logic decision optimization parameters. These optimization parameters are fed back to the dynamic signal control module in real time to adjust the trigger conditions or response speed of the clock channel shutdown logic, forming a closed-loop control circuit.

[0091] In this embodiment, by introducing a proportional-integral-differential algorithm to dynamically compensate for radiation deviation in multiple dimensions, control accuracy can be improved while maintaining system stability, avoiding radiation suppression failure caused by response lag or overshoot. Thus, this application can achieve real-time dynamic optimization of the radiation suppression strategy, effectively reducing the peak electromagnetic radiation of the server under high-frequency signal switching or sudden load scenarios, while avoiding signal integrity loss due to excessive suppression. This scheme ensures the matching degree between radiation control parameters and the current operating state through a closed-loop feedback mechanism, improving the stability of the overall electromagnetic compatibility performance.

[0092] In one feasible implementation, the step of generating overall electromagnetic radiation suppression effect data by processing common-mode interference collaborative suppression data through chassis grounding conductive path data, flexible shielded cabling performance verification data, and radiation-optimized dynamic signal control result data includes: processing chassis grounding conductive path data through grounding impedance effectiveness analysis to obtain grounding effectiveness assessment data; processing flexible shielded cabling performance verification data through electromagnetic shielding effectiveness verification to obtain cabling shielding effectiveness verification data; processing radiation-optimized dynamic signal control result data through radiation source attenuation simulation to obtain signal radiation suppression assessment data; and generating overall electromagnetic radiation suppression effect data through weighted fusion processing of grounding effectiveness assessment data, cabling shielding effectiveness verification data, and signal radiation suppression assessment data.

[0093] In this embodiment, grounding impedance effectiveness analysis refers to evaluating conductivity continuity by measuring the resistance value and frequency response characteristics of the grounding path. Specifically, this can be achieved using a four-wire resistance measurement method combined with frequency sweep signal injection, used to quantify the charge discharge capability of the grounding system. Electromagnetic shielding effectiveness verification refers to evaluating shielding performance by testing the reflection and absorption capabilities of the cabling material to electromagnetic waves. Specifically, this can be achieved using a transverse electromagnetic wave chamber testing system combined with a vector network analyzer, used to verify the suppression effect of high-frequency interference. Radiation source attenuation simulation refers to predicting the suppression effect of signal control strategies by establishing an equivalent model of the radiation source inside the server. Specifically, this can be achieved using finite element electromagnetic field simulation software combined with measured radiation spectra, used to evaluate the attenuation degree of dynamic signal control on the radiation source. Weighted fusion processing refers to data integration based on the contribution of each subsystem to the overall radiation, assigning weight coefficients. Specifically, this can be achieved by using the analytic hierarchy process (AHP) to determine the weight ratios and then performing linear weighted calculations, used to comprehensively evaluate the synergistic effect of multi-dimensional suppression measures.

[0094] In this embodiment, during the server assembly stage, the grounding conductive path data of the chassis after conductive spraying is first input into an impedance analysis device. By applying test signals of different frequencies, the impedance curves of the grounding loop are obtained, identifying abnormal points of impedance abrupt changes in the high-frequency band. Next, the flexible shielded cable is placed in a standard electromagnetic radiation environment, and the shielding effectiveness index of the cable in a specific frequency band is calculated by comparing the field strength difference before and after shielding. Simultaneously, the clock channel status data output from the dynamic signal control module is imported into an electromagnetic simulation model to simulate the attenuation of near-field radiation intensity when the clock channel is turned off without connected equipment. Finally, the three types of evaluation data are weighted according to preset weighting coefficients, such as grounding effectiveness accounting for 40%, shielding effectiveness for 35%, and signal suppression for 25%, generating a quantified overall radiation suppression effect score.

[0095] In some specific implementations, grounding impedance effectiveness analysis can combine multi-point contact resistance detection with cross-connector inductance measurement, for example, by arranging multiple probes between chassis grounding points to simultaneously collect data. Electromagnetic shielding effectiveness verification can employ a dual-antenna method for near-field scanning, for example, measuring the difference in electric field strength before and after shielding in 100MHz steps within the 1GHz to 10GHz frequency band. Weighted fusion processing can utilize a dynamic weight adjustment mechanism, for example, automatically adjusting the weight allocation ratio of the three types of data based on the server's operating load.

[0096] Compared to existing technologies, traditional methods only employ single grounding measures or partial shielding structures for radiation suppression, lacking synergistic optimization of chassis grounding quality, cable shielding performance, and dynamic signal control. For example, conventional techniques typically reduce grounding impedance simply by increasing the area of ​​the grounding copper strip, without considering the impedance increase caused by the skin effect under high-frequency signals. This solution, however, identifies high-frequency impedance anomalies through impedance effectiveness analysis, optimizes spraying process parameters accordingly, and combines shielding cable effectiveness verification with dynamic signal control simulation to achieve a synergistic effect of multi-dimensional suppression measures. Through this technical solution, this application effectively addresses the problems of high-frequency impedance mismatch in the grounding system, frequency response mismatch in shielding materials, and lack of quantitative evaluation of dynamic signal control in traditional server radiation suppression methods. By quantitatively analyzing the impedance characteristics of the grounding conductive path, the actual effectiveness of the shielding cable, and the radiation attenuation effect of the signal control strategy, and employing a weighted fusion algorithm to comprehensively evaluate the overall suppression capability, it provides data support for optimizing conductive spraying process parameters, improving shielding cable structure design, and adjusting dynamic signal control logic, thereby enhancing the radiation suppression stability of the server in complex electromagnetic environments.

[0097] In the embodiments of this application, the server radiation suppression method based on conductive spraying and dynamic signal management constructs a stable grounding path through a layered conductive spraying process, uses a gridded shielded cable to suppress high-frequency interference, combines dynamic signal closed-loop control to achieve real-time radiation optimization, and improves the overall suppression effect through multi-dimensional data collaborative processing. This method can improve grounding stability, enhance high-frequency interference suppression capability, achieve dynamic radiation optimization, and improve overall suppression synergy.

[0098] It should be noted that the above examples are only for understanding this application and do not constitute a limitation on the server radiation suppression method based on conductive spraying and dynamic signal management in this application. Any simple modifications based on this technical concept are within the protection scope of this application.

[0099] This application also provides a server radiation suppression system based on conductive spraying and dynamic signal management, referenced... Figure 2 The system includes a memory 10, a processor 20, and a computer program stored on the memory 10 and executable on the processor 20, the computer program being configured to implement the steps of the server radiation suppression method based on conductive spraying and dynamic signal management.

[0100] The server radiation suppression system based on conductive spraying and dynamic signal management provided in this application employs the server radiation suppression method based on conductive spraying and dynamic signal management described in the above embodiments. This system can improve grounding stability, enhance high-frequency interference suppression capabilities, achieve dynamic radiation optimization, and improve overall suppression synergy. Compared with the prior art, the beneficial effects of the server radiation suppression system based on conductive spraying and dynamic signal management provided in this application are the same as those of the server radiation suppression method based on conductive spraying and dynamic signal management provided in the above embodiments. Furthermore, other technical features of the server radiation suppression system based on conductive spraying and dynamic signal management are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0101] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0102] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. All equivalent structural transformations made under the technical concept of this application using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the scope of patent protection of this application.

Claims

1. A server radiation suppression method based on conductive spraying and dynamic signal management, characterized in that, The method includes: Impurities on the surface of the server chassis plastic components are removed by sandblasting pretreatment to obtain clean chassis surface data. The clean chassis surface data is then processed by a layered conductive spraying process, sequentially spraying a base coat, a main coat, and a top coat to obtain multi-layer conductive coating data. The multi-layer conductive coating data is then subjected to segmented heating and curing treatment to obtain cured conductive layer data. Finally, the cured conductive layer data is processed by conductive treatment of the inner wall of the mounting holes and installation of conductive gaskets to generate chassis grounding conductive path data. Composite cable material data was obtained by laminating polyimide substrate, meshing copper foil shielding layer and adhesive processing; the composite cable material data was processed by etching wiring to generate cable layout data including differential signal lines and start and end ground pins; the cable layout data was processed by edge sealing and bending reinforcement to obtain flexible shielded cable performance verification data; The system uses programmable logic devices to scan the presence status of standard slots for the server's high-speed peripheral interconnect (HSI) components, acquiring device presence status data. This data is then processed through logic decision-making to generate a clock channel shutdown command when a device is not connected. This command is transmitted to a clock signal buffer and processed to shut down the corresponding clock channel. Near-field probes are used to collect server radiation signals, generating radiation monitoring data. This data is then processed through feedback optimization to generate logic decision-optimized parameter data. Based on these optimization parameters, the system adjusts the logic decision-making parameters to generate radiation-optimized dynamic signal control results. The chassis grounding conductive path data, flexible shielded cabling performance verification data, and radiation-optimized dynamic signal control result data are processed through common-mode interference collaborative suppression to generate overall electromagnetic radiation suppression effect data.

2. The server radiation suppression method based on conductive spraying and dynamic signal management as described in claim 1, characterized in that, The layered conductive spraying process includes: The clean frame surface data is processed by plasma cleaning and surface activator spraying to obtain activated surface data; The activated surface data was sequentially processed by spraying a silver epoxy resin composite primer, a main coating, and a top coating to obtain the layered coating adhesion data; The data on the adhesion of the layered coating is processed by a staged heating and heat curing process to generate the data of the cured conductive layer.

3. The server radiation suppression method based on conductive spraying and dynamic signal management as described in claim 2, characterized in that, The steps for generating cured conductive layer data by using segmented heating thermal curing to process the layered coating adhesion data include: The adhesion data of the layered coating is obtained by pre-curing it in a preset first temperature range to obtain preliminary curing data; The preliminary curing data is then subjected to a primary curing process within a preset second temperature range to obtain stable conductive layer data. The stable conductive layer data is cooled to generate solidified conductive layer data.

4. The server radiation suppression method based on conductive spraying and dynamic signal management as described in claim 1, characterized in that, The gridded copper foil shielding layer treatment includes: The copper foil shielding material is processed by laser etching to form a grid-like structure, and the gridded copper foil data is obtained. The gridded copper foil data is combined with a polyimide substrate through hot-pressing lamination to generate composite cable material data.

5. The server radiation suppression method based on conductive spraying and dynamic signal management as described in claim 1, characterized in that, The process of obtaining device in-situ status data through scanning and processing using programmable logic devices includes: Initialization configuration data is obtained through initialization configuration processing using programmable logic devices; Based on the initial configuration data, the clock signal buffer control link is verified by executing a self-test program to obtain self-test verification data. Based on self-test verification data, in-situ status detection data is generated by sampling and processing the standard slot voltage signal of the peripheral component interconnection standard. The in-situ status detection data is converted into binary logical values ​​to obtain the device in-situ status data.

6. The server radiation suppression method based on conductive spraying and dynamic signal management as described in claim 1, characterized in that, The step of generating clock channel shutdown command data by processing device in-situ status data through logical decision-making includes: The device presence status data is processed through logical judgment, and when the judgment result is that the device is not connected, channel shutdown decision data is generated. The channel shutdown decision data is converted into a high-level signal and processed to generate clock channel shutdown command data.

7. The server radiation suppression method based on conductive spraying and dynamic signal management as described in claim 1, characterized in that, The method further includes: At the input end of the server signal line, a tunable filter is used to analyze and process signal noise to obtain noise spectrum data. The noise spectrum data is processed through dynamic parameter matching to generate filter adjustment command data; The filter adjustment command data is fed back to the tunable filter for processing to obtain broadband noise suppression result data; The broadband noise suppression results data are integrated into the radiation-optimized dynamic signal control results data.

8. The server radiation suppression method based on conductive spraying and dynamic signal management as described in claim 1, characterized in that, The step of generating logical decision optimization parameter data from radiation monitoring data through feedback optimization processing includes: Radiation monitoring data is processed by threshold comparison to obtain radiation intensity deviation data; The radiation intensity deviation data is processed using a proportional-integral-differential algorithm to generate logical decision optimization parameter data.

9. The server radiation suppression method based on conductive spraying and dynamic signal management as described in claim 1, characterized in that, The steps involved in generating overall electromagnetic radiation suppression effect data by processing common-mode interference collaborative suppression data, including chassis grounding conductive path data, flexible shielded cab performance verification data, and radiation-optimized dynamic signal control results data, are as follows: The grounding conductivity path data of the chassis is processed through grounding impedance effectiveness analysis to obtain grounding effectiveness assessment data; The performance verification data of the flexible shielded cabling is processed through electromagnetic shielding effectiveness verification to obtain the cabling shielding effectiveness verification data; The optimized dynamic signal control results data are processed by radiation source attenuation simulation to obtain signal radiation suppression evaluation data. The grounding effectiveness assessment data, cable shielding effectiveness verification data, and signal radiation suppression assessment data are weighted and fused to generate overall electromagnetic radiation suppression effect data.

10. A server radiation suppression system based on conductive spraying and dynamic signal management, characterized in that, The system includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the server radiation suppression method based on conductive spraying and dynamic signal management as described in any one of claims 1 to 9.

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