Isolated circuit and withstand voltage test method thereof
By employing a winding structure with at least three layers of insulation in the transformer windings, combined with power factor correction and resonant conversion circuits, the problems of high transformer material cost, large space occupation, and low withstand voltage are solved, realizing an isolated circuit with high withstand voltage, low height, and high power density.
Patent Information
- Application Number
- CN202411220419.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-06-07
- Filing Date
- 2024-09-02
- Publication Date
- 2025-12-16
AI Technical Summary
While existing transformers meet safety regulations, they suffer from high material costs, large space requirements, and low withstand voltage, making it difficult to meet the requirements of low height and high withstand voltage for thin transformers.
By employing a winding structure containing at least three layers of insulation, and forming an isolated circuit through winding wires in parallel and perpendicular directions, combined with a power factor correction circuit and a resonant conversion circuit, the withstand voltage of the transformer is improved, and the cost is reduced through automated processing.
It achieves a high withstand voltage isolated circuit that meets safety requirements, reduces material costs, reduces the height and volume of the transformer, and increases power density.
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Figure CN121148867A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of power electronics technology, and in particular to an isolated circuit and its withstand voltage test method. Background Technology
[0002] Transformers can typically have their inductance increased by adding external inductors, which adjusts the transformer's electrical characteristics. This improves the transformer's load adaptability and stability, enabling it to operate more effectively under various working conditions. Furthermore, increasing the inductance reduces the transformer's short-circuit current, thereby reducing current losses in the transformer coils, which helps improve transformer efficiency and reduce energy loss.
[0003] The inventors learned that the transformer structure could increase the distance between the primary and secondary windings by adding slots between them, thus replacing the need for external inductors. However, the slots would increase the transformer's height, making it unsuitable for the low-height requirements of thin transformers.
[0004] Furthermore, to meet safety regulations, most transformers in existing switching power supplies use triple-insulated kraft wire as the winding to satisfy insulation requirements. While this meets safety requirements, the material cost of triple-insulated kraft wire is high, hindering cost reduction in production. Additionally, the high rigidity of triple-insulated kraft wire can lead to excessive space in the transformer during winding, hindering power density improvement. Simultaneously, the large space occupied by triple-insulated kraft wire results in closer proximity between the primary and secondary windings, leading to lower withstand voltage between the input and output terminals, failing to meet high-voltage application requirements. Another method of winding using a spirally wrapped insulation layer, which the inventors are aware of, also suffers from the aforementioned problems.
[0005] In view of the above-mentioned problems, the present invention proposes an isolated circuit and a method for testing its withstand voltage. Summary of the Invention
[0006] To overcome the above problems, the present invention aims to provide an isolated circuit comprising a power factor correction circuit and a resonant converter circuit connected in series. The resonant converter circuit comprises a primary circuit, a resonant circuit, and a secondary circuit connected in series. The resonant circuit comprises a resonant inductor, a resonant capacitor, and a transformer. The transformer comprises a primary winding and a secondary winding, with the resonant inductor, resonant capacitor, and primary winding connected in series, and the secondary winding electrically connected to the secondary circuit. The primary winding and / or the secondary winding comprises a winding, and the winding comprises a conductor and an insulating layer covering the conductor. The insulating layer is fixed to a conductor parallel to the X-axis direction, and then wound around the conductor in a Y-axis direction perpendicular to the X-axis direction, until the number of insulating layers covering the conductor is at least three. The withstand voltage between the input and output terminals of the isolated circuit is 4000VAC to 5000VAC.
[0007] This invention also provides a method for testing the withstand voltage of an isolated circuit, comprising the following steps: An isolated circuit is provided comprising a power factor correction circuit and a resonant converter circuit connected in series. The resonant converter circuit comprises a primary circuit, a resonant circuit, and a secondary circuit connected in series. The resonant circuit comprises a resonant inductor, a resonant capacitor, and a transformer. The transformer comprises a primary winding and a secondary winding, and the resonant inductor, resonant capacitor, and primary winding are connected in series. The secondary winding is electrically connected to the secondary circuit. The primary winding and / or the secondary winding comprises a winding, and the winding comprises a conductor and an insulating layer covering the conductor. The insulating layer is fixed to the conductor parallel to the X-axis direction on one side, and then wound around the conductor in the Y-axis direction perpendicular to the X-axis direction until the number of insulating layers covering the conductor is at least three. The method further involves short-circuiting the input and output terminals of the isolated circuit to perform a high-voltage test and determining the withstand voltage value between the input and output terminals of the isolated circuit, wherein the withstand voltage value is between 4000VAC and 5000VAC.
[0008] The isolated circuit of the present invention uses a winding that is easy to automate to process, is covered with at least three layers of insulation, and has a final wire diameter smaller than that of known three-layer insulation wire. It has advantages such as high withstand voltage and compliance with safety regulations. Furthermore, by using a winding with a small final wire diameter, it helps to reduce the volume of the winding assembly and increase the space between the winding assemblies. In addition to reducing the overall height of the transformer, it can also increase the leakage inductance. Attached Figure Description
[0009] Figure 1 This is a schematic diagram of the structure of the first embodiment of the winding of the present invention.
[0010] Figure 2 yes Figure 1 Side view.
[0011] Figure 3This is a schematic diagram of the second embodiment of the winding of the present invention.
[0012] Figure 4 yes Figure 3 Side view.
[0013] Figure 5 yes Figure 1 A flowchart of the method for preparing the winding.
[0014] Figure 6 yes Figure 5 The step-by-step flowchart of step S12.
[0015] Figure 7 yes Figure 3 A flowchart of the method for preparing the winding.
[0016] Figure 8 This is a schematic diagram of the third embodiment of the winding of the present invention.
[0017] Figure 9 yes Figure 1 The diagram shows a cross-sectional view of the winding.
[0018] Figure 10 yes Figure 8 The diagram shows a cross-sectional view of the winding.
[0019] Figure 11 This is a cross-sectional view of a single conductor in a winding comprising multiple conductors according to the fourth embodiment of the winding according to the present invention.
[0020] Figure 12 It is a side view of multiple spirally twisted wires.
[0021] Figure 13 This is a side view of the fourth embodiment of the winding of the present invention, wherein the winding has an insulating layer wound. Figure 12 Multiple wires that have been spirally twisted together.
[0022] Figure 14 yes Figure 13 Cross-sectional view of the winding.
[0023] Figures 15A-15B This is a schematic diagram of the winding fixture, wrapping fixture, and winding process of the present invention.
[0024] Figure 15C This is a schematic diagram of a wire that has been covered with an insulating layer.
[0025] Figure 15D This is a schematic diagram showing the result after the ends of an insulated wire have been cut off.
[0026] Figure 16 This is a schematic diagram of the stranding fixture of the present invention performing stranding operations.
[0027] Figure 17 This is a schematic diagram of the exposed end of the stranded wire of the present invention.
[0028] Figure 18 This is a schematic diagram of the soldering operation performed by the present invention.
[0029] Figure 19A This is a schematic diagram of the winding after the soldering operation of the present invention.
[0030] Figure 19B This is a schematic diagram of the winding that has undergone soldering in this invention, when it bends.
[0031] Figure 20 This is a three-dimensional schematic diagram of the thin transformer of the present invention.
[0032] Figure 21 This is a three-dimensional exploded view of the thin transformer of the present invention.
[0033] Figure 22 This is a three-dimensional schematic diagram of the winding frame of the present invention.
[0034] Figure 23A This is a cross-sectional view of T1-T1' of an embodiment of the thin transformer of the present invention.
[0035] Figure 23B This is a cross-sectional view of T2-T2' of an embodiment of the thin transformer of the present invention.
[0036] Figure 24A This is a cross-sectional view of T1-T1' of another embodiment of the thin transformer of the present invention.
[0037] Figure 24B This is a cross-sectional view of T2-T2' of another embodiment of the thin transformer of the present invention.
[0038] Figure 25 This is a schematic diagram of an embodiment of the isolated circuit of the present invention.
[0039] Figure 26 This is a schematic diagram of another embodiment of the isolated circuit of the present invention.
[0040] Figure 27 This is a flowchart of the withstand voltage test method for the isolated circuit of the present invention.
[0041] The attached figures are labeled as follows:
[0042] 11, 21, 31, 41: Conductors
[0043] 12, 22: Insulation structure
[0044] 121, 321: First insulating layer
[0045] 122: Second insulating layer
[0046] 1221, 2221: First fixing part
[0047] 1222, 2222: Overlapping parts
[0048] 1223, 2223: Second fixing part
[0049] 123: First colloidal layer
[0050] 124: Second colloidal layer
[0051] 125: Third colloidal layer
[0052] 100: Winding fixture
[0053] 101: Fixing part
[0054] 110: Wire wrapping jig
[0055] 111: First component
[0056] 112: Second component
[0057] 200: Stranding fixture
[0058] 210: First twisted part
[0059] 220: Second twisted part
[0060] 230: Depression
[0061] 221: First insulating tape
[0062] 222: Second insulating tape
[0063] 300, 300a: Isolated circuits
[0064] 310: Power Factor Correction Circuit
[0065] 311: Rectifier circuit
[0066] 312: Boost circuit
[0067] 320: Resonant Converter Circuit
[0068] 321: Primary circuit
[0069] 322: Resonant Circuit
[0070] 323: Secondary circuit
[0071] 310a: Primary circuit
[0072] 311a: Rectifier circuit
[0073] 312a: RCD snubber circuit
[0074] 320a: Secondary circuit
[0075] 411: Core wire
[0076] 412: Coating
[0077] 42: Insulation layer
[0078] 5, 5a: Thin-film transformer
[0079] 50, 50a: Winding frame
[0080] 51: First Plate
[0081] 52: Second plate
[0082] 53, 53a: Hollow column
[0083] 60, 60a: Iron core
[0084] 61: First Iron Core
[0085] 611: First Plinth
[0086] 612: First Core Pillar
[0087] 62: Second iron core
[0088] 621: Second Plinth
[0089] 622: Second core pillar
[0090] 70, 70a: First winding group
[0091] 80, 80a: Second winding group
[0092] 90, 90a: Spacing
[0093] A: Wire
[0094] A1: First exposed part
[0095] A2: Covered portion
[0096] A3: Second exposed part
[0097] Aa: First exposed end
[0098] Ab: Second exposed end
[0099] Aa1: First solder section
[0100] Ab1: Second solder section
[0101] B1: First adhesive layer
[0102] B2: Second adhesive layer
[0103] C1: Discharge capacitor
[0104] Cf: First output capacitor
[0105] Cfa: Filter capacitor
[0106] Co: Second output capacitor
[0107] Coa: Output capacitor
[0108] Cr: Resonant capacitor
[0109] d1, d2, d3, d4: Diodes
[0110] D1: First wire diameter
[0111] D2: Second wire diameter
[0112] D3: Third wire diameter
[0113] E: Insulation layer
[0114] E1: Edge
[0115] F: Gap
[0116] G: Grounding terminal
[0117] I1: First insulating substrate layer
[0118] I2: Second insulating substrate layer
[0119] Ia: Insulating layer
[0120] Lf: Energy storage inductor
[0121] Lr: Resonant inductance
[0122] Np: Primary winding
[0123] Ns: Secondary winding
[0124] Q1: First switch
[0125] Q1a: Switch
[0126] Q2: Second switch
[0127] Q3: Third switch
[0128] Q4: Fourth Switch
[0129] Q5: Fifth Switch
[0130] R: Resistance
[0131] S11, S12, S13, S121, S122, S21, S22, S23, S100, S200: Steps
[0132] T: Transformer
[0133] T1, T1', T2, T2': Section lines
[0134] V: Carrier
[0135] W11, W21: First width
[0136] W12, W22: Second width
[0137] X, Y, Z: Axes Detailed Implementation
[0138] Some typical embodiments of the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be varied in different ways without departing from the scope of the invention, and the description and drawings therein are for illustrative purposes only and not for limiting the invention.
[0139] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: This embodiment is implemented under the premise of the technical solution of the present invention, and provides implementation methods and operation processes, but the protection scope of the present invention is not limited to the following embodiments.
[0140] Please refer to Figures 1-2 , Figure 1 This is a schematic diagram of the structure of the first embodiment of the winding of the present invention, and Figure 2 for Figure 1 A side view. (e.g.) Figures 1-2 As shown, the winding of the present invention includes a conductor 11 and an insulation structure 12. The conductor 11 can be a basic insulated single-strand wire or a basic insulated multi-strand wire, etc. The insulation structure 12 is wound around and covers the conductor 11. The insulation structure 12 includes: a first insulation layer 121 and a second insulation layer 122. The first insulation layer 121 has a first width W11; the second insulation layer 122 has a second width W12. The second insulation layer 122 has an X-axis direction and a Y-axis direction perpendicular to the X-axis direction. The first insulation layer 121 is disposed on the second insulation layer 122 along the X-axis direction. The first width W11 is smaller than the second width W12. The conductor 11 is disposed on the second insulation layer 122 along the X-axis direction and is not covered by the first insulation layer 121. The first insulation layer 121 and the second insulation layer 122 are wound around and cover the conductor 11 along the Y-axis direction. In some embodiments of the present invention, the first insulation layer 121 and the second insulation layer 122 are wound around and cover the conductor 11, so that the number of insulation layers of the winding is at least three layers to meet safety requirements. By controlling the first width W11 and / or the second width W2, and the position of the first insulation layer 121 on the second insulation layer 122, the number of insulation layers of the winding can be controlled. The processing method is simple, and the cost is lower than that of three-layer insulated wire.
[0141] Furthermore, after the first insulating layer 121 is bonded to the second insulating layer 122, the second insulating layer 122 is sequentially divided into a first fixing portion 1221, an overlapping portion 1222, and a second fixing portion 1223 along the Y-axis direction. The conductor 11 is disposed on the second fixing portion 1223 along a direction parallel to the X-axis. The width of the first fixing portion 1221 and / or the second fixing portion 1223 can be greater than or equal to the outer perimeter of the conductor 11, and the width of the overlapping portion 1222 can also be greater than or equal to the outer perimeter of the conductor 11. In some embodiments of the present invention, the widths of the first fixing portion 1221, the second fixing portion 1223, and the overlapping portion 1222 can all be set to be equal to the outer perimeter of the conductor 11, so that the number of insulating layers for winding is exactly three, which is beneficial for further saving materials and reducing costs, and is easy to automate. It should be noted that the influence of the insulation layer thickness is ignored here.
[0142] Furthermore, the insulating structure 12 also includes a first adhesive layer 123 and a second adhesive layer 124; the first adhesive layer 123 is disposed on the first fixing portion 1221 and / or the second fixing portion 1223, and the wire 11 is disposed on the first adhesive layer 123, which is used to more securely fix the wire 11 to the second insulating layer 122; the second adhesive layer 124 is disposed between the overlapping portion 1222 and the first insulating layer 121, and is used to bond the first insulating layer 121 and the second insulating layer 122; the wire 11 is wound and wrapped around the second fixing portion 1223 where the wire 11 is disposed until it is bonded to the first fixing portion 1221. In some embodiments of the present invention, such as Figure 2 As shown, the thickness of the first colloidal layer 123 and the second colloidal layer 124 can be controlled to be consistent.
[0143] It is worth noting that in other embodiments, the wire 11 may also be disposed on the first fixing part 1221 in a direction parallel to the X-axis, and the wire 11 may be wound around and covered from the first fixing part 1221 where the wire 11 is disposed until it is bonded to the second fixing part 1223.
[0144] It should be noted that the winding process of the present invention can also be carried out by direct contact between the wire 11 and the first insulation layer 121, so that the insulation structure 12 can more easily and smoothly wind the wire 11, ensuring that the surface of the processed wire is flat and tight, but the present invention is not limited thereto.
[0145] Furthermore, the insulation structure 12 also includes a third colloidal layer 125 disposed on the first insulation layer 121. Compared with the aforementioned direct contact between the wire 11 and the first insulation layer 121, the advantage of this method is that the wire 11 can be better fixed during the winding process.
[0146] Please refer to Figures 3-4 , Figure 3This is a schematic diagram of the structure of the second embodiment of the winding of the present invention. Figure 4 for Figure 3 A side view. (e.g.) Figures 3-4 As shown, the winding of the present invention includes a conductor 21 and an insulation structure 22. The insulation structure 22 is wound around and covers the conductor 21. The conductor 21 can be a basic insulated single-strand wire or a basic insulated multi-strand wire, etc. The insulation structure 22 includes: a first insulating tape 221 and a second insulating tape 222. The first insulating tape 221 has a first width W21; the second insulating tape 222 has a second width W22. The second insulating tape 222 has an X-axis direction and a Y-axis direction perpendicular to the X-axis direction. The first insulating tape 221 is parallel to the X-axis. The first insulating tape 221 is attached to the second insulating tape 222 in a directional direction. The first width W21 is smaller than the second width W22. The conductor 21 is disposed on the second insulating tape 22 in a direction parallel to the X-axis and is not covered by the first insulating tape 221. The first insulating tape 221 and the second insulating tape 222 are wound around and cover the conductor 21 in a direction along the Y-axis. In some embodiments of the present invention, the first insulating tape 221 and the second insulating tape 222 are wound around and cover the conductor 21 so that the number of insulation layers of the winding is at least three layers to meet safety requirements.
[0147] The first insulating tape 221 includes a first adhesive layer B1 and a first insulating substrate layer I1 arranged opposite to each other. The second insulating tape 222 includes a second adhesive layer B2 and a second insulating substrate layer I2 arranged opposite to each other. The first adhesive layer B1 and the second adhesive layer B2 are bonded together. That is, after the first insulating tape 221 is bonded to the second insulating tape 222, the insulating substrate layer I2 of the second insulating tape 222 is divided into three parts along the Y-axis direction: a first fixing part 2221, an overlapping part 2222, and a second fixing part 2223. In other words, the first insulating substrate layer I1 and the second insulating substrate layer I2 are the first insulating layer 121 and the second insulating layer 122, respectively.
[0148] The conductor 21 is positioned on the second fixing part 2223 parallel to the X-axis. Because there is a second adhesive layer B2 between the second fixing part 2223 and the conductor 21, the conductor 21 can be more securely fixed to the second insulating substrate layer I2 before winding. When winding and covering the conductor 21, if the part of the first insulating tape 221 that contacts the winding is the insulating substrate layer I1, the contact surface is a smooth plane, making it easier to smoothly wind the conductor 21, ensuring a flat and tight surface of the processed wire. Furthermore, because the first fixing part 2221 also has an adhesive layer B2, it can be more easily bonded to the second insulating substrate layer I2, ultimately completing the winding and obtaining a winding containing an insulating layer. In addition, the relatively soft texture of the insulating tape allows for a smaller gap between windings compared to three-layer insulated wire when used to wind transformer windings or other magnetic component windings, thereby reducing the volume of the magnetic component and further increasing power density. It is worth noting that in other embodiments, the wire 21 may also be disposed on the first fixing part 2221 in a direction parallel to the X-axis, and the wire 21 may be wound around and covered from the first fixing part 2221 where the wire 21 is disposed until it is bonded to the second fixing part 2223.
[0149] In another embodiment of the present invention, the first insulating substrate layer I1 and the second adhesive backing layer B2 are bonded together to sequentially divide the insulating substrate layer I2 of the second insulating tape 222 into a first fixing portion 2221, an overlapping portion 2222, and a second fixing portion 2223.
[0150] The widths of the first fixing portion 2221 and / or the second fixing portion 2223 can be greater than or equal to the outer perimeter of the conductor 21, and the width of the overlapping portion 2222 can also be greater than or equal to the outer perimeter of the conductor 21. In some embodiments of the present invention, the widths of the first fixing portion 2221, the second fixing portion 2223, and the overlapping portion 2222 can all be equal to the outer perimeter of the conductor 11, so that the number of insulation layers of the winding is exactly three, which is beneficial to further save materials and reduce costs, and is easy to automate. It should be noted that the influence of the thickness of the insulating tape is ignored here.
[0151] Please refer to Figures 5-6 , Figure 5 for Figure 1 Flowchart of the method for preparing the winding wire. Figure 6 for Figure 5 The step-by-step flowchart for step S12. (See attached flowchart.) Figures 5-6 As shown, the method for preparing the winding of the present invention includes:
[0152] Step S11: A first insulating layer with a first width is disposed on a second insulating layer along the X-axis direction of a second insulating layer with a second width, wherein the first width is smaller than the second width. In one embodiment of the present invention, after the first insulating layer is disposed on the second insulating layer, the second insulating layer is sequentially divided into a first fixing part, an overlapping part, and a second fixing part along the Y-axis direction. The width of the first fixing part and / or the second fixing part can be greater than or equal to the outer perimeter of the conductor, and the width of the overlapping part can also be greater than or equal to the outer perimeter of the conductor. In some embodiments of the present invention, the widths of the first fixing part, the second fixing part, and the overlapping part can all be set to be equal to the outer perimeter of the conductor, so that the number of insulation layers of the winding is exactly three, which is beneficial to further save materials and reduce costs, and is easy to automate. In another embodiment of the present invention, after the first insulating layer is disposed on the second insulating layer, the second insulating layer is divided into a first fixing part and an overlapping part along the Y-axis direction. The present invention is not limited thereto.
[0153] Step S12: Place the wire on the portion of the second insulating layer that is not covered by the first insulating layer, parallel to the X-axis direction; In one embodiment of the present invention, after the first insulating layer is placed on the second insulating layer, the second insulating layer is sequentially divided into a first fixed part, an overlapping part and a second fixed part along the Y-axis direction, and then the wire is placed on the first fixed part or the second fixed part. The wire can be a basic insulated single-strand wire or a basic insulated multi-strand wire, etc.
[0154] Step S13: The first insulating layer and the second insulating layer are wound around and cover the wire in the Y-axis direction perpendicular to the X-axis direction, wherein the winding and covering of the wire starts from the first fixing part where the wire is provided and ends at the second fixing part; or the winding and covering of the wire starts from the second fixing part where the wire is provided and ends at the first fixing part.
[0155] Furthermore, step S12 also includes:
[0156] Step S121: Apply the first colloid layer to the first fixing part and / or the second fixing part;
[0157] Step S122: The wire is placed on the first colloidal layer.
[0158] Furthermore, in step S11, a second colloid layer is provided between the overlapping portion and the first insulating layer, and / or in step S11, a third colloid layer is provided on the first insulating layer.
[0159] In some embodiments of the present invention, the first insulating layer and the second insulating layer are wound around and cover the wire, such that the number of insulating layers of the winding is at least three.
[0160] Please refer to Figure 7 , Figure 7 for Figure 3 A flowchart of the winding preparation method. (e.g.) Figure 7As shown, the method for preparing the winding of the present invention includes:
[0161] Step S21: Place a first insulating tape with a first width on the second insulating tape along the X-axis direction of the second insulating tape with a second width, wherein the first width is smaller than the second width;
[0162] Step S22: Place the wire along the direction parallel to the X-axis on the second insulating tape and the portion not covered by the first insulating tape. The wire is a basic insulated single-strand wire or a basic insulated multi-strand wire.
[0163] Step S23: The first insulating tape and the second insulating tape are wound around and wrapped around the conductor along the Y-axis direction, which is perpendicular to the X-axis direction.
[0164] Furthermore, in step S21, the first insulating tape includes a first backing layer and a first insulating substrate layer disposed opposite to each other, and the second insulating tape includes a second backing layer and a second insulating substrate layer disposed opposite to each other. In step S21, the first backing layer and the second backing layer are bonded together, that is, after the first insulating tape is bonded to the second insulating tape, the insulating substrate layer of the second insulating tape is divided into three parts along the Y-axis direction: a first fixing part, an overlapping part, and a second fixing part. In other words, the first insulating substrate layer and the second insulating substrate layer are respectively the first insulating layer and the second insulating layer.
[0165] Furthermore, in step S22, the wire is positioned on the second fixing part parallel to the X-axis. Because there is a second adhesive layer between the second fixing part and the wire, the wire can be more securely fixed to the second insulation layer before winding begins. In step S23, starting from the second fixing part where the wire is positioned, the wire is wound and wrapped up to the first fixing part. First and second insulating tapes are used to wrap the wire. When winding the wire, because the part of the first insulating tape that contacts the winding is the insulating substrate layer, which is a smooth plane, it is easier to smoothly wind the wire, ensuring a flat and tight surface on the processed wire. Furthermore, because the first fixing part also has an adhesive layer, it can be more easily bonded to the second insulating substrate layer, finally completing the winding and obtaining a wound wire containing an insulating layer.
[0166] It is worth noting that in other embodiments, the wire may also be disposed on the first fixing part in a direction parallel to the X-axis, and the wire may be wound around and covered from the first fixing part where the wire is disposed until it is bonded to the second fixing part.
[0167] In another embodiment of the present invention, the first insulating substrate layer and the second adhesive backing layer are bonded together to sequentially divide the insulating substrate layer of the second insulating tape into a first fixing portion, an overlapping portion, and a second fixing portion.
[0168] In some embodiments of the present invention, the width of the first fixing part and / or the second fixing part may be greater than or equal to the wire diameter, and the width of the overlapping part may be greater than or equal to the wire diameter. When the widths of the first fixing part, the second fixing part, and the overlapping part are all equal to the wire diameter, the number of insulation layers of the winding is exactly three, which is beneficial for further saving materials and reducing costs, and is easy to automate.
[0169] Please refer to Figure 8 , Figure 8 This is a schematic diagram of the third embodiment of the winding mechanism of the present invention. Figure 8 As shown, the winding of the present invention includes: a conductor 31 and a first insulating layer 321. The conductor 31 is a basically insulated single-strand wire or a basically insulated multi-strand wire. The first insulating layer 321 has an X-axis direction and a Y-axis direction perpendicular to the X-axis direction. The conductor 31 is disposed on the first insulating layer 321 in a direction parallel to the X-axis direction. The first insulating layer 321 is wound around and covers the conductor 31 in the Y-axis direction.
[0170] By setting the width of the first insulating layer 321, the number of insulating layers after the first insulating layer 321 is wound around and covers the wire 31 can be at least three. In some embodiments of the present invention, the first insulating layer 321 can be an insulating substrate layer of an insulating tape, the wire 31 is disposed on the first insulating layer 321 in a direction parallel to the X-axis, and the backing layer of the insulating tape is between the wire 31 and the first insulating layer 321.
[0171] Please refer to the following: Figure 1 and Figure 9 , Figure 9 for Figure 1 The diagram shows a cross-sectional view of the winding. (See attached diagram.) Figure 9 As shown, the first insulating layer 121 and the second insulating layer 122 are wound around and cover the wire 11, so that the number of insulating layers of the winding is at least three.
[0172] Please refer to the following: Figure 8 and Figure 10 , Figure 10 for Figure 8 The diagram shows a cross-sectional view of the winding. (See attached diagram.) Figure 10 As shown, the first insulating layer 321 is wound around and covers the wire 31, so that the number of insulating layers of the winding is at least three.
[0173] The present invention also discloses a winding assembly of a magnetic element, comprising the aforementioned Figure 1 or Figure 3 or Figure 8 The winding shown is the winding assembly made from the aforementioned winding.
[0174] Please see Figures 11 to 14In another embodiment, the present invention further discloses a winding comprising a plurality of conductors 41 and an insulating layer 42. The conductors 41 may be one of the aforementioned conductors 11, 21, and 31, and the insulating layer 42 may be one of the aforementioned insulating structures 12, 22, and insulating layer 321.
[0175] like Figure 11 As shown, each conductor 41 comprises a core wire 411 and a coating 412. The core wire 411 may be made of copper and has a first wire diameter D1 of less than or equal to 0.2 mm, thereby providing good flexibility. The coating 412 has a thickness of less than or equal to 0.1 mm, preferably between 0.02 mm and 0.03 mm, and an elongation of greater than or equal to 15%, allowing the conductor 41 formed by coating the core wire 411 with the coating 412 to be easily bent. Furthermore, the coating 412 has a withstand voltage of greater than or equal to 1 kV, giving the conductor 41 good insulation properties.
[0176] Multiple conductors 41 are arranged close together and twisted spirally, and as... Figure 12 As shown, multiple wires 41 are intertwined in a spiral twist at least thirty-three times within a length of one meter. In other words, the multiple wires 41 intertwined together will be twisted 360 degrees in a clockwise or counterclockwise direction until at least 33 twists are achieved within a length of one meter. Specifically, the number of spiral twists of the multiple wires 41 can be between 33 and 85 within a length of one meter. It should be noted that... Figure 12 The diagram shown is for illustrative purposes only and does not represent the actual winding situation.
[0177] After helical twisting, the multiple conductors 41 will be brought close together by the force, and the interval between adjacent conductors 41 will be less than 0.1 mm. Furthermore, the multiple conductors 41, after helical twisting, can form a circle with a second wire diameter D2 in the cross-sectional direction, where D2 ≤ C*√N*D1, C is a constant related to the number of twists, and N is the number of conductors 41. In some embodiments, for example, when the multiple conductors 41 are helically twisted 33 times within a length of one meter, C is 1.115, where the value of C is inversely proportional to the number of helical twists of the bundled conductors.
[0178] After multiple wires 41 are spirally twisted together, as Figure 13 As shown, the insulating layer 42 is then wound around the outside of the conductor 41, and the insulating layer 42 is implemented to continuously wind the conductor 41 until the number of insulating layers covering the conductor 41 reaches at least three layers.
[0179] The insulating layer 42 tightly winds the conductor 41, such that the distance between each conductor 41 on the circumference of the circle formed by the stranding of the multiple conductors 41 and the insulating layer 42 is less than 0.1 mm. Furthermore, among the multiple insulating layers 42 covering the conductor 41, adjacent insulating layers 42 form a smooth and tight overlap without wrinkles or gaps. The winding formed by the insulating layer 42 winding the multiple conductors 41 has a third wire diameter D3, which is smaller than the bus diameter of at least three layers of each conductor 41 covered by the insulating layer 42, i.e., smaller than the wire diameter of a known three-layer insulated wire. Simultaneously, the third wire diameter D3 is also smaller than the bus diameter of at least three layers of the insulating layer 42 spirally wrapping the multiple conductors 41. In some embodiments of the present invention, the thickness of the insulating layer 42 is less than or equal to 0.1 mm. The total thickness of the multiple insulating layers 42 covering the multiple conductors 41 is the thickness of the insulating layer 42 multiplied by the number of layers covering the conductors 41.
[0180] Furthermore, as shown in the table below, taking the diameter of a single conductor 41 as approximately 0.1 mm as an example, when the second diameter D2 of multiple conductors 41 after spiral twisting reaches approximately 0.55-0.58 mm, the final diameter of the winding formed by the continuous winding method of the insulation layer 42 of the present invention, i.e., the third diameter D3, is smaller than the diameter of known triple-insulated wires and the diameter of the insulation layer 42 spirally covering the conductors 41. In other words, when the number of strands of conductor 41 reaches 33 or more, the winding formed by the method of the present invention can provide a smaller final diameter than the prior art.
[0181]
[0182] More specifically, this invention, by continuously winding the conductor with an insulating layer / structure to a winding method having at least three insulating layers, can effectively increase the thickness of the outer insulation layer of the conductor while simultaneously reducing the final wire diameter. After winding to the winding frame, the reduced wire diameter helps to decrease the volume of the winding assembly, increase the distance between different winding assemblies, and further increase leakage inductance, thereby reducing the need for external inductors or even completely replacing them.
[0183] Furthermore, by forming a single-strand conductor by coating the core wire with an outer coating, and then coating the stranded multi-strand conductors with at least three layers of insulation to form a winding, the present invention further improves the withstand voltage of the winding. For example, compared to the known triple-insulated wire with an outer film thickness of 0.09 mm and a withstand voltage of approximately 3100 VAC, the insulation layer thickness of the winding of the present invention can reach approximately 0.15 mm, and the withstand voltage can reach approximately 5000 VAC. Experiments have confirmed that the winding of the present invention can withstand an arc current of 7.7 mA for 60 seconds, meeting the safety requirements of IEC65960 and IEC60065. Therefore, the winding proposed in this invention significantly improves upon the shortcomings of known triple-insulated wires.
[0184] In practice, winding jigs can be further used to assist in the process of covering the conductor with insulation / insulation structure. For example... Figures 15A-15D As shown, the winding fixture 100 includes two fixing parts 101 for fixing the two ends of the conductor A. That is, the two fixing parts 101 are arranged along the X-axis direction so that the conductor A fixed thereon is also arranged along the X-axis direction. Here, conductor A refers to a multi-strand conductor that has been twisted as described above, such as a multi-strand conductor 41 twisted at least 33 times within one meter.
[0185] The insulating layer E has an X-axis direction and a Y-axis direction perpendicular to the X-axis direction. One side E1 parallel to the X-axis direction is fixed to the conductor A in a manner parallel to the conductor A. Then, the insulating layer E is wound around and covers the conductor A along the Y-axis direction, so that the number of insulating layers is at least three. It should be noted that the insulating layer E can be the aforementioned insulating structures 12, 22 or insulating layers 321, 42, and is not limited to those shown in the figure.
[0186] Furthermore, a winding jig 110 can be used to assist in the process of winding and covering the conductor A with the insulation layer E. The winding jig 110 includes a first component 111 and a second component 112 at approximately an angle to the first component 111, forming an angular space between them to accommodate the insulation layer E and the conductor A. For example, the angle between the first component 111 and the second component 112 can be approximately 90 degrees, or the angle can be determined according to the diameter of the conductor A. In operation, firstly, the insulation layer E is fixed to the conductor A by the edge E1 and initially covers the conductor A. Then, the conductor A and the insulation layer E are positioned together in the angular space formed by the first component 111 and the second component 112. One of the first component 111 and the second component 112 provides fixing and bonding force, while the other provides a guiding function for the insulation layer E. The covering operation of the insulation layer E is completed by rotating the winding jig 110. This helps to smoothly wind the insulation layer E around the conductor A, ensuring that the surface of the processed wire is flat and tight.
[0187] After the insulation layer E is completed, for example, after at least three insulation layers have been applied to the outside of conductor A, such as... Figure 15C As shown, the wire A set on the winding fixture 100 is divided into a first exposed portion A1, a covered portion A2 and a second exposed portion A3 along the X-axis direction.
[0188] Then, the first exposed portion A1 and the second exposed portion A3 are cut off to form the first exposed end Aa and the second exposed end Ab, respectively, and the covered wire is then detached from the winding fixture 100. And after cutting, as... Figure 15D As shown, the wires at the first exposed end Aa and the second exposed end Ab are in a dispersed state.
[0189] Next, the first exposed end Aa and the second exposed end Ab undergo stranding and soldering operations respectively to complete the preparation for winding onto the winding frame. Here, since the stranding operations for the first exposed end Aa and the second exposed end Ab are the same, only the first exposed end Aa will be described.
[0190] The stranding process involves forming multiple strands of wire into a single strand. Figure 12-14 The spiral stranded wire shown is, for example, a spiral stranded wire with a length of one meter that is spirally twisted at least thirty-three times. In one embodiment, the stranding operation is performed using a stranding fixture. Figure 16 As shown, the stranding fixture 200 includes a first stranding portion 210 and a second stranding portion 220. A first exposed end Aa to be stranded is disposed between the first stranding portion 210 and the second stranding portion 220. The stranding operation is completed by clamping both sides of the first exposed end Aa with the first stranding portion 210 and the second stranding portion 220 and rotating them simultaneously. In one embodiment, the first stranding portion 210 and the second stranding portion 220 each have a longitudinally oriented recess 230, for example, an arc-shaped recess, to form a space for accommodating the exposed end to be stranded when they are opposite each other. After the stranding operation is completed, the end of the first exposed end Aa forms a conical shape (e.g., ...). Figure 17 (As shown) and the conductors at the first exposed end Aa are close to each other, for example, the interval between adjacent conductors is less than 0.1 mm. In addition, by performing the stranding operation in this way, the wire diameter tolerance after stranding falls within + / -0.18 mm.
[0191] Next, the first exposed end Aa and the second exposed end Ab, which are twisted into a cone shape, are further subjected to soldering operations. In one embodiment, the soldering operation can be performed in the following manner. Figure 18 As shown, multiple stranded wires are arranged at intervals and sandwiched in a carrier V, with the conical ends to be soldered exposed on opposite sides of the carrier V. Then, by moving the carrier V, the multiple strands are simultaneously reflowed for soldering. The soldering conditions can vary depending on the requirements and are not limited.
[0192] After the soldering operation is completed, the first exposed end Aa and the second exposed end Ab form the first solder portion Aa1 and the second solder portion Ab1, respectively, to serve as pins after winding the wire to the winding frame. For example... Figure 19A and Figure 19BAs shown, in this invention, during the soldering process, when covering the first exposed end Aa and the second exposed end Ab, a portion near the covered portion A2 is left un-soldered. That is, a gap F is left between both ends of the covered portion A2 and the first solder portion Aa1 and the second solder portion Ab1. The purpose of this gap F is to ensure sufficient space for the solder portion to bend into a lead when the finished wire is wound onto the winding frame, preventing the lead from being unable to bend to the required angle due to the solder and / or insulation layer covering it. Simultaneously, the gap F also prevents the insulating tape from tearing during bending due to the covering. Here, the bending angle α is defined as the angle between the solder portions Aa1 and Ab1 of the winding and the covered portion A2. Therefore, this gap F is approximately inversely proportional to the required bending angle α of the lead; that is, the smaller the required bending angle α of the lead, the larger the gap F needs to be. On the other hand, this gap F is also directly proportional to the wire diameter of the conductor A; that is, the larger the wire diameter, the larger the gap F needs to be. In one embodiment, when the gap F is between 0.5 mm and 3 mm, the bending angle α is greater than or equal to 90 degrees.
[0193] Next, the winding operation is performed on the wires that have been twisted and soldered at both ends. This explanation uses two windings as an example, but is not limited to this. One end of the winding (the soldered end) is first placed on the winding frame. Different windings can be marked for differentiation. Then, depending on the type of transformer, the corresponding winding operation is performed. After winding is completed, the other end of the winding (the soldered end) is placed on the winding frame again and then secured with tape. It should be noted that, depending on the requirements, the two ends of the winding can be fixed on the same side or opposite sides of the winding frame; there are no restrictions.
[0194] In summary, the process of this invention from the formation of the wire winding to the winding frame is as follows: multiple strands of wire are spirally twisted at least thirty-three times within one meter to form a stranded wire. The stranded wire is covered with at least three layers of insulation. Both ends of the covered portion are cut to form exposed ends. The exposed ends undergo stranding and soldering to complete the pre-winding preparation. Then, the prepared winding is wound onto the winding frame to form a winding assembly, with the soldered end serving as the lead. It should be noted that the winding of this invention can be applied to the structures of magnetic components such as transformers and inductors.
[0195] In some embodiments of the present invention, by employing the winding method of the present invention and further designing the transformer structure, it is possible to effectively reduce the overall height of the transformer while maintaining the inductance of the switching power supply.
[0196] Please refer to Figure 20 , Figure 21 and Figure 22These figures respectively show a three-dimensional schematic diagram of the thin transformer of the present invention, an exploded three-dimensional schematic diagram of the thin transformer, and a three-dimensional schematic diagram of the winding frame. The thin transformer 5 of the present invention includes a winding frame (Bobbin) 50, a pair of iron cores 60, a first winding group 70, and a second winding group 80. The winding frame 50 has a first plate 51 and a hollow post 53 protruding from the first plate 51. Specifically, the winding frame 50 has a second plate 52 relative to the first plate 51. The hollow post 53 is located between the first plate 51 and the second plate 52.
[0197] The pair of iron cores 60 are disposed on opposite sides of the winding frame 50, and include a first iron core 61 and a second iron core 62. The first iron core 61 has a first base 611 and a first core post 612 connected to the first base 611. The second iron core 62 has a second base 621 and a second core post 622 connected to the second base 621. In addition, the first base 611 is attached to the first plate 51. The second base 621 is attached to the second plate 52. The first core post 612 and the second core post 622 pass through a hollow post 53.
[0198] Furthermore, the first winding group 70 (or primary winding) surrounds the hollow column 53 and is disposed on the first plate 51, located between the pair of iron cores 60. The second winding group 80 (or secondary winding) surrounds the first winding group 70 and is disposed on the first plate 51. The second winding group 80 and the first winding group 70 are spaced apart by a distance 90. In practice, the distance 90 is not less than 0.2 mm and not more than 13.5 mm, but is not limited thereto. In practice, the first winding group 70 and / or the second winding group 80 use windings with the aforementioned structure, which provides characteristics such as small wire diameter and easy tight winding. Therefore, under this architecture, the thickness of the thin transformer 5 can be less than 20 mm. More specifically, the high-voltage winding in the first winding group 70 or the second winding group 80 can use windings with the aforementioned structure.
[0199] Please refer to another source. Figure 22 , Figure 23A and Figure 23B ,in Figure 23A and Figure 23B The figures show cross-sectional views T1-T1' and T2-T2' of an embodiment of the thin transformer of the present invention. As can be seen from the figures, the first winding group 70 and the second winding group 80 surround the hollow column 53 in the radial direction of the hollow column 13, and the first winding group 70 and the second winding group 80 are arranged concentrically on the first plate 51.
[0200] Please refer to again Figure 24A and Figure 24BThe figures show cross-sectional views T1-T1' and T2-T2' of another embodiment of the thin transformer of the present invention. In this embodiment, the thin transformer 5a includes a winding frame 50a, a pair of iron cores 60a, a first winding group 70a, and a second winding group 80a. The winding frame 50a has a hollow column 53a. The pair of iron cores 60a are disposed on opposite sides of the winding frame 50a. The first winding group 70a and the second winding group 80a are arranged in a concentric ring around the hollow column 53a in the radial direction and are located between the pair of iron cores 60a. In addition, there is a gap distance 90a between the second winding group 80a and the first winding group 70a.
[0201] The difference in this embodiment is that the thin transformer 1a also includes an insulating layer Ia. The insulating layer Ia is made of insulating material and is disposed within a spacing distance 90a. Furthermore, the thickness of the insulating layer Ia is not less than 0.2 mm and not more than 13.5 mm. Accordingly, the two sides of the insulating layer Ia abut against the first winding group 70a and the second winding group 80a respectively, ensuring the spacing distance 90a between the first winding group 70a and the second winding group 80a, thereby increasing the leakage inductance of the thin transformer 5a.
[0202] In practical implementation, the setting of spacing or insulation layer can increase leakage inductance by more than 15%, which can replace the resonant inductance of the LLC circuit set by the traditional transformer. That is, the function of LLC circuit can be achieved without adding an external resonant inductor.
[0203] On the other hand, the windings covered with at least three insulating layers in this invention can be applied to isolated circuits, such as the primary windings (e.g., the aforementioned first winding groups 70, 70a), secondary windings (e.g., the aforementioned second winding groups 80, 80a), and / or inductor windings of a transformer constituting an isolated circuit, thereby enabling the isolated circuit to have high voltage resistance characteristics.
[0204] In one embodiment, the switching power supply may be an isolated circuit, such as... Figure 25 As shown, the isolated circuit 300 may include a power factor correction (PFC) circuit 310 and a resonant converter circuit 320, wherein the resonant converter circuit 320 may be an LLC resonant circuit. The power factor correction circuit 310 includes a rectifier circuit 311 and a boost circuit 312 connected in series. The rectifier circuit 311 is electrically connected to the input terminal of the isolated circuit 300 to receive AC input voltage and convert it into DC voltage. The boost circuit 312 is electrically connected to the rectifier circuit 311 to increase the DC voltage.
[0205] The resonant converter circuit 320 includes a primary circuit 321, a resonant circuit 322, and a secondary circuit 323 connected in series. The primary circuit 321 is electrically connected to the power factor correction circuit 310. The resonant circuit 322 includes a resonant inductor Lr, a resonant capacitor Cr, and a transformer T. The transformer T includes a primary winding Np and a secondary winding Ns, wherein the primary winding Np and the secondary winding Ns are electromagnetically coupled, and the resonant inductor Lr, the resonant capacitor Cr, and the primary winding Np are connected in series. The secondary winding Ns induces a secondary voltage based on the voltage across the primary winding Np. The secondary circuit 323 is electrically connected between the secondary winding Ns and the output terminal of the isolation circuit 300, used to receive the secondary voltage generated by the secondary winding Ns and convert it into an output voltage, which is output at the output terminal of the isolation circuit 300. The resonant inductor Lr can be an externally added solid inductor element, or it can be formed by the leakage inductance created by the spacing between the primary and secondary windings or by an insulating layer. When the resonant inductor Lr can be an external solid inductor element, the resonant inductor can include the aforementioned winding, that is, a winding having a conductor (e.g., one of the aforementioned conductors 11, 21, 31, 41 and A) and an insulating layer covering the conductor (e.g., one of the aforementioned insulating structures 12, 22 and insulating layers 321, E).
[0206] In some embodiments of the present invention, the primary winding Np and / or secondary winding Ns in the aforementioned isolated circuit include the aforementioned winding, that is, a winding having a conductor (e.g., one of the aforementioned conductors 11, 21, 31, 41, and A) and an insulating layer covering the conductor (e.g., one of the aforementioned insulating structures 12, 22 and insulating layers 321, E). The present invention achieves the effect of increasing the withstand voltage of the winding by covering the conductor with at least three insulating layers. For example, compared to a known three-layer insulated wire with an outer film thickness of 0.09 mm and a withstand voltage of approximately 3100 VAC, the insulation layer thickness of the winding of the present invention is approximately 0.15 mm, and the withstand voltage can reach approximately 5000 VAC. Therefore, when an isolated circuit uses the winding covered with at least three insulating layers of the present invention to construct an inductive component, when the input and output terminals of the isolated circuit are short-circuited for high-voltage testing, the withstand voltage between the primary and secondary circuits can reach approximately 4000 VAC to 5000 VAC.
[0207] Specifically, the rectifier circuit 311 is electrically connected to the input terminal of the isolated circuit 300 and includes a full-bridge rectifier architecture composed of four diodes d2. In other embodiments of the present invention, the rectifier circuit may also be composed of four controllable switches such as MOSFETs to form a full-bridge rectifier architecture, or it may be a half-bridge rectifier architecture. The boost circuit 312 includes an energy storage inductor Lf, a first switch Q1, a first output capacitor Cf, and a diode d1. The first terminal of the energy storage inductor Lf is electrically connected to the rectifier circuit 311. The first power terminal of the first switch Q1 is electrically connected to the second terminal of the energy storage inductor Lf, and the second power terminal of the first switch Q1 is electrically connected to the ground terminal G. The anode of the diode d1 is electrically connected to the first power terminal of the first switch Q1 and the second terminal of the energy storage inductor Lf. The first terminal of the first output capacitor Cf is electrically connected to the cathode of the diode d1, and the second terminal of the first output capacitor Cf is electrically connected to the ground terminal G. The primary-side circuit 321 is an inverter circuit including a second switch Q2 and a third switch Q3. The second switch Q2 and the third switch Q3 are connected in series between the cathode of diode d1 and the ground terminal G. The resonant inductor Lr and the resonant capacitor Cr are connected in series with the primary winding Np between the connection point of the second switch Q2 and the third switch Q3 and the ground terminal G. In other embodiments of the invention, the inverter circuit can also be a full-bridge inverter architecture. The secondary circuit 323 includes a fourth switch Q4, a fifth switch Q5, and a second output capacitor Co. The first power terminal of the fourth switch Q4 is connected to the first terminal of the secondary winding Ns, and the second power terminal of the fourth switch Q4 is connected to the negative output terminal of the output terminal of the isolation circuit 300. The first power terminal of the fifth switch Q5 is connected to the second terminal of the secondary winding Ns, and the second power terminal of the fifth switch Q5 is connected to the negative output terminal of the output terminal of the isolation circuit 300. The secondary winding Ns also has a center tap terminal, which is connected to the positive output terminal of the output terminal of the isolation circuit 300. The second output capacitor Co is connected between the positive and negative output terminals.
[0208] It should be noted that when the spacing between the primary and secondary windings or the leakage inductance formed by the insulating layer constitutes the resonant inductance Lr, the primary winding Np and / or secondary winding Ns in the LLC circuit include the aforementioned windings, that is, windings having conductors (e.g., one of the aforementioned conductors 11, 21, 31, 41, and A) and an insulating layer covering the conductors (e.g., one of the aforementioned insulating structures 12, 22 and insulating layers 321, E). This can further increase the leakage inductance, or in other words, the magnitude of the resonant inductance Lr, depending on...
[0209] Where Q is the quality factor, Lr is the resonant inductance, Cr is the resonant capacitance, and R is the load, it can be seen that increasing Lr can improve the quality factor of the circuit.
[0210] In another embodiment, such as Figure 26As shown, the isolated circuit 300a can be a flyback circuit, and includes a primary circuit 310a, a transformer T, and a secondary circuit 320a. The structure and function of the transformer T are similar to those of... Figure 25 The structure and function of the transformer T shown are only indicated by the same symbols here and will not be described again. The primary circuit 310a includes a rectifier circuit 311a, a filter capacitor Cfa, a switch Q1a, and an RCD snubber circuit 312a composed of a resistor R, a bleeder capacitor C1, and a diode d3. The rectifier circuit 311a is electrically connected to the input terminal of the isolation circuit 300a and includes a full-bridge rectifier architecture composed of four diodes d2. In other embodiments of the present invention, the rectifier circuit may also be composed of a full-bridge rectifier architecture composed of four controllable switches such as MOSFETs, or it may be a half-bridge rectifier architecture. The first terminal of the filter capacitor Cfa is electrically connected to the rectifier circuit 313a and the first terminal of the primary winding Np, and the second terminal of the filter capacitor Cfa is electrically connected to the ground terminal G. The switch Q1a is electrically connected between the second terminal of the primary winding Np and the ground terminal G. The resistor R and the bleeder capacitor C1 are connected in parallel between the first terminal of the filter capacitor Cfa and the cathode of the diode d3. The anode of diode d3 is connected between switch Q1a and the second terminal of the primary winding Np.
[0211] In some embodiments, the secondary circuit 320a includes a diode d4 and an output capacitor Coa. The anode of diode d4 is electrically connected to the first terminal of the secondary winding Ns, and the cathode of diode d4 is electrically connected to the positive output terminal of the output terminal of the isolation circuit 300a. The output capacitor Coa is electrically connected between the positive and negative output terminals. Furthermore, the second terminal of the secondary winding Ns is electrically connected to the negative output terminal of the output terminal of the isolation circuit 300a.
[0212] Please see Figure 27 The method for withstand voltage testing applied to the isolated circuit of this invention includes the following steps.
[0213] Step S100: Provide an isolated circuit (e.g., the aforementioned isolated circuits 300 and 300a), wherein the isolated circuit includes a power factor correction circuit and a resonant converter circuit connected in series, wherein the resonant converter circuit includes, in series: a primary circuit electrically connected to the power factor correction circuit; a resonant circuit including a resonant inductor, a resonant capacitor, and a transformer, wherein the transformer includes a primary winding and a secondary winding, and the resonant inductor, the resonant capacitor, and the primary winding are connected in series; and a secondary circuit electrically connected to the secondary winding; wherein at least one of the primary winding, the secondary winding, and the resonant inductor has a winding comprising a conductor and an insulating layer / insulation structure covering the conductor, and the insulating layer / insulation structure is fixed on a conductor arranged parallel to the X-axis direction with one side parallel to the X-axis direction, and then wound around the conductor in the Y-axis direction perpendicular to the X-axis direction until the number of insulating layers covering the conductor is at least 3 layers.
[0214] Step S200: Short-circuit the input and output terminals of the isolation circuit to perform a high-voltage test and obtain the withstand voltage value between the input and output terminals of the isolation circuit.
[0215] As mentioned above, when an isolated circuit includes a primary winding and / or a secondary winding with at least three layers of insulation using the present invention, the withstand voltage between its input and output terminals can be increased to 4000VAC to 5000VAC.
[0216] In summary, the winding method of the present invention has advantages such as easy automation, smooth winding, and a flat and dense wire surface after processing, which helps to improve the power density of magnetic components and meets the requirements of enhanced insulation while maintaining low material manufacturing costs. Furthermore, the winding preparation method of the present invention, by increasing the thickness of the outer insulation layer of the conductor by covering it with at least three insulation layers, achieves the goal of reducing the final wire diameter. This not only helps to reduce the volume of the winding assembly and increase the space between winding assemblies, but also achieves the effect of reducing the overall height of the transformer and increasing leakage inductance. Moreover, the winding prepared by the present invention, covered with at least three insulation layers, further provides advantages such as high withstand voltage and compliance with safety regulations.
[0217] It should be noted that the above are merely preferred embodiments for illustrating the present invention, and the present invention is not limited to these embodiments. The scope of the present invention is determined by the appended claims. Furthermore, the present invention can be modified in various ways by those skilled in the art, without departing from the protection sought by the appended claims.
Claims
1. An isolated circuit, characterized in that, It includes a power factor correction circuit and a resonant converter circuit connected in series, wherein the resonant converter circuit comprises, in series: A primary-side circuit is electrically connected to the power factor correction circuit; A resonant circuit includes a resonant inductor, a resonant capacitor, and a transformer, wherein the transformer includes a primary winding and a secondary winding, and the resonant inductor, the resonant capacitor, and the primary winding are connected in series; and A secondary circuit is electrically connected to the secondary winding; The primary winding and / or the secondary winding includes a winding, and the winding includes a conductor and an insulating layer covering the conductor. The insulating layer is fixed to the conductor arranged parallel to the X-axis direction on one side, and then wound around the conductor in the Y-axis direction perpendicular to the X-axis direction until the number of insulating layers covering the conductor is at least 3 layers. The withstand voltage between the input and output terminals of the isolated circuit is 4000VAC to 5000VAC.
2. The isolated circuit of claim 1, wherein the power factor correction circuit comprises, in series: A rectifier circuit; and A boost circuit, which includes: An energy storage inductor, a first terminal of which is electrically connected to the rectifier circuit; A first switch, wherein a first power terminal of the first switch is electrically connected to a second terminal of the energy storage inductor, and a second power terminal of the first switch is electrically connected to a ground terminal; A diode, one anode of which is electrically connected to the first power terminal of the first switch; and A first output capacitor, a first terminal of which is electrically connected to a cathode terminal of the diode, and a second terminal of which is electrically connected to the ground terminal.
3. The isolated circuit as described in claim 2, wherein, The primary-side circuit includes an inverter circuit electrically connected to the boost circuit. The inverter circuit includes: A second switch; and A third switch is connected in series with the second switch and electrically between the cathode of the diode and the ground terminal; The secondary circuit includes: A fourth switch, wherein a first power terminal of the fourth switch is electrically connected to a first terminal of the secondary winding, and a second power terminal of the fourth switch is electrically connected to a negative output terminal of the isolated circuit; A fifth switch, wherein a first power terminal of the fifth switch is electrically connected to a second terminal of the secondary winding, and a second power terminal of the fifth switch is electrically connected to the negative output terminal of the isolated circuit; and A second output capacitor is electrically connected between a positive output terminal and a negative output terminal of the isolated circuit; and The secondary winding also has a center tap that is electrically connected to the positive output terminal of the isolated circuit.
4. The isolated circuit as claimed in claim 1, wherein the winding comprises a plurality of wires that are spirally twisted together at least 33 times over a length of one meter.
5. The isolated circuit of claim 4, wherein each of the plurality of conductors comprises a core wire and a coating, the core wire having a first wire diameter, the plurality of conductors spirally twisted having a second wire diameter, the winding having a third wire diameter, and the third wire diameter being smaller than the bus diameter of the insulating layer covering at least three layers of each of the plurality of conductors, and the third wire diameter being smaller than the bus diameter of the insulating layer spirally covering at least three layers of the plurality of conductors.
6. The isolated circuit as claimed in claim 5, wherein the number of strands of the plurality of wires is greater than or equal to 33, and the second wire diameter is at least 0.55 mm.
7. The isolated circuit of claim 1, wherein the insulating layer comprises an insulating tape.
8. The isolated circuit as claimed in claim 1, wherein there is a gap between the primary winding and the secondary winding.
9. The isolated circuit as claimed in claim 8, wherein an insulating layer is provided between the intervals.
10. The isolated circuit of claim 9, wherein the resonant inductor is formed by leakage inductance created by the spacing or insulating layer.
11. The isolated circuit of claim 1, wherein when the resonant inductor is an external inductor element, the resonant inductor includes the winding.
12. A method for testing the withstand voltage of an isolated circuit, characterized in that, The steps are as follows: An isolated circuit is provided, comprising a power factor correction circuit and a resonant converter circuit connected in series. The resonant converter circuit comprises, in series: a primary circuit electrically connected to the power factor correction circuit; a resonant circuit comprising a resonant inductor, a resonant capacitor, and a transformer, wherein the transformer comprises a primary winding and a secondary winding, the resonant inductor, the resonant capacitor, and the primary winding being connected in series; and a secondary circuit electrically connected to the secondary winding. The primary winding and / or the secondary winding comprises a winding, and the winding comprises a conductor and an insulating layer covering the conductor. The insulating layer is fixed to the conductor parallel to the X-axis direction on one side, and then wound around the conductor in the Y-axis direction perpendicular to the X-axis direction until the number of insulating layers covering the conductor is at least 3 layers. as well as The input and output terminals of the isolated circuit are short-circuited to perform a high-voltage test and determine a withstand voltage value between the input and output terminals of the isolated circuit, wherein the withstand voltage value is between 4000VAC and 5000VAC.