Light-emitting device

Abstract

The invention discloses a light-emitting device. The light-emitting device comprises a substrate and more than one light-emitting chip arranged on the substrate, the substrate comprises more than two metal parts and a plastic package layer, the metal parts are accommodated in the plastic package layer, the top of each metal part is provided with a top surface electrode, the bottom surface of each metal part is provided with a bottom surface electrode, and each top surface electrode is provided with a metal boss; the top surface electrode is completely accommodated in the plastic packaging layer, and the top surface of the metal boss is exposed out of the plastic packaging layer to form a chip die bonding area of the substrate. The current-carrying capacity of the light-emitting device is improved by adopting the substrate, and the metal boss is arranged at the position of the top surface electrode, so that the size of a chip die bonding area is reduced, the area of an oxidized black area is reduced, the influence of the black area on the light-emitting brightness of the light-emitting chip is reduced, and the light-emitting efficiency of the light-emitting device is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of light emitting devices, in particular to a light emitting device. BACKGROUND

[0002] The existing LED packaging device adopts a light emitting LED chip for device packaging. In order to realize miniaturized packaging, the overall size of the device needs to be reduced, which leads to the relatively increased size of the chip die bonding pad on the top surface of the packaging substrate. For the top surface chip die bonding area formed by the metal frame, the position of the chip die bonding pad on the top surface of the substrate is easily oxidized to form a black area during the device packaging process. The black area will absorb part of the light emitted by the light emitting chip, which reduces the light emitting brightness of the light emitting chip, thereby adversely affecting the light efficiency of the LED packaging device. SUMMARY

[0003] The present application aims to overcome the shortcomings of the prior art. The present application provides a light emitting device. The substrate is used to improve the current-carrying capacity of the light emitting device, and a metal boss is arranged at the position of the top electrode to reduce the size of the chip die bonding area and the area of the black area after oxidation, thereby reducing the influence of the black area on the light emitting brightness of the light emitting chip and improving the light efficiency of the light emitting device.

[0004] The present application provides a light emitting device, which comprises: a substrate, one or more light emitting chips arranged on the substrate;

[0005] The substrate comprises: two or more metal components and a plastic encapsulation layer, the metal components are contained in the plastic encapsulation layer, the top of the metal components is provided with a top electrode, the bottom surface of the metal components is provided with a bottom electrode, and the top electrode is provided with a metal boss;

[0006] The top electrode is completely contained in the plastic encapsulation layer, and the top surface of the metal boss is exposed outside the plastic encapsulation layer to form a chip die bonding area of the substrate.

[0007] Further, the metal components are independently distributed, and the metal components are divided into a plurality of arrangement combinations.

[0008] Any of the arrangement combinations comprises two metal components, and any of the arrangement combinations forms a chip die bonding area.

[0009] Further, the material of the plastic encapsulation layer is one of epoxy resin molding compound, silicone molding compound and silicone resin molding compound.

[0010] Further, the plastic encapsulation layer is wrapped around the circumferential side wall of the metal boss, and when the color of the plastic encapsulation layer is white, the top surface of the plastic encapsulation layer forms a diffuse reflection area around the top surface of the metal boss.

[0011] Furthermore, the metal boss is located at the center of the top electrode.

[0012] Furthermore, the metal component also includes a connecting rib, which is disposed on the side wall of the metal component;

[0013] The cross-section of the connecting rib is exposed on the sidewall of the molding layer.

[0014] Furthermore, the cross-section of the connecting rib is connected to the top surface of the molding compound, and the top surface of the connecting rib is exposed on the top surface of the molding compound; or

[0015] The cross-section of the connecting rib is connected to the bottom surface of the molding layer, and the bottom surface of the connecting rib is exposed on the bottom surface of the molding layer; or

[0016] The molding layer covers the cross-section of the connecting rib.

[0017] Furthermore, the metal component is formed with a plurality of connecting ribs by etching, and the plurality of connecting ribs are provided with one or more horizontal connecting ribs, and / or the plurality of connecting ribs are provided with one or more inclined connecting ribs.

[0018] Furthermore, the surface of the metal component is provided with an electroplated layer, which covers the area outside the cross-section of the metal component;

[0019] Alternatively, the electroplated layer may cover the exposed top and bottom surfaces of the metal component.

[0020] Furthermore, the light-emitting device also includes a fluorescent layer and a white adhesive layer sequentially covering the light-emitting chip;

[0021] The light-emitting chip is completely housed within the fluorescent layer, and the white adhesive layer covers the top surface of the fluorescent layer.

[0022] Furthermore, the light-emitting device also includes a waterproof layer that covers the surfaces of the substrate, the fluorescent layer, and the white adhesive layer.

[0023] This invention provides a light-emitting device that employs a substrate structure. By setting a metal boss structure at the electrode position on the top surface of the substrate as the die-bonding position for the light-emitting chip, the area of ​​exposed metal on the top surface of the substrate is reduced, thereby reducing the impact of the oxidation and blackening of the top surface metal on the light-emitting chip's light-emitting efficiency during the packaging process. The white substrate structure enhances the light reflection on the top surface of the substrate, thereby improving the light-emitting efficiency of the light-emitting device. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the light-emitting device according to Embodiment 1 of the present invention;

[0026] Figure 2 This is a cross-sectional view of the light-emitting device according to Embodiment 1 of the present invention;

[0027] Figure 3 This is a schematic diagram of the light-emitting device substrate structure according to Embodiment 1 of the present invention;

[0028] Figure 4 This is a schematic diagram of the metal component structure of the light-emitting device according to Embodiment 1 of the present invention;

[0029] Figure 5 This is a top view of the structure of the light-emitting device according to Embodiment 1 of the present invention;

[0030] Figure 6 This is a schematic diagram of the metal frame structure according to Embodiment 1 of the present invention;

[0031] Figure 7 This is a top view of the structure of the light-emitting device according to Embodiment 2 of the present invention;

[0032] Figure 8 This is a schematic diagram of the metal component structure of the light-emitting device according to Embodiment 2 of the present invention;

[0033] Figure 9 This is a schematic diagram of the metal frame structure of Embodiment 2 of the present invention;

[0034] Figure 10 This is a flowchart of the light-emitting device fabrication method according to Embodiment 3 of the present invention. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Example 1:

[0037] refer to Figures 1 to 6This invention provides a light-emitting device, which includes: a substrate 1 and one or more light-emitting chips 5 disposed on the substrate 1. The substrate 1 includes: two or more metal components 11 and a molding compound 12. The metal components 11 are housed within the molding compound 12, and a portion of the end face of the metal components 11 is exposed outside the molding compound 12 to form a top electrode and a bottom electrode. The top electrode is provided with a metal boss 111. The two or more metal components 11 cooperate to form a substrate circuit for accommodating the light-emitting chips 5.

[0038] The molding layer 12 is made of one of epoxy molding compound (EMC), silicone molding compound, or silicone resin molding compound. In this embodiment, the molding layer is made of epoxy molding compound. The substrate 1 is a substrate structure formed by using a metal frame 10 and epoxy molding compound. The metal frame 10 is encapsulated and shaped by the epoxy molding compound, so that the metal frame 10 can form the circuit structure of the substrate 1, which has good conductivity and high load characteristics, and can meet the die bonding and mounting requirements of high power devices.

[0039] The top electrode is completely contained within the molding compound 12, and the top surface of the metal protrusion 111 is exposed outside the molding compound 12 to form the chip bonding area of ​​the substrate 1. The metal protrusion 111 structure is provided on the top electrode so that the top surface of the metal protrusion 111 can be formed as the top bonding pad of the substrate 1, allowing the light-emitting chip 5 to be bonded onto the substrate 1. By providing the metal protrusion 111, the size of the chip bonding position on the substrate 1 can be reduced, allowing the substrate 1 to reserve the necessary bonding position for the light-emitting chip 5. This reduces the exposed metal area on the top surface of the substrate 1, thereby reducing the risk of oxidation and blackening of the metal on the top surface of the substrate 1, and thus reducing the impact of black oxide metal on the light emission of the light-emitting chip 5.

[0040] Furthermore, the substrate 1 formed by the metal component 11 and the molding layer 12 uses the arrangement structure of the metal component 11 as the circuit arrangement structure of the substrate 1, so that the light-emitting chip 5 can be electrically connected to the external working circuit through the metal component 11. The metal component 11 has good current carrying capacity and good heat transfer performance, which can improve the heat transfer efficiency of the substrate 1, thereby reducing the heat generation of the substrate 1.

[0041] Specifically, several metal components 11 are independently distributed and divided into several arrangements; any arrangement includes two metal components 11, and any arrangement forms a chip die-bonding area. A mounting area for a single light-emitting chip 5 is formed between the two metal components 11, so that the electrical electrodes of the light-emitting chip 5 can be electrically connected to the metal components 11. In conjunction with the structural design of the substrate 1, electrical pins are formed on the bottom surface of the substrate 1, thereby improving the convenience and reliability of the electrical mounting connection of the light-emitting device.

[0042] Specifically, the color of the molding layer 12 can be black, white, or gray. In this embodiment, the color of the molding layer 12 is white. By adding a white colorant to the epoxy resin molding compound, a white opaque molding material is formed, so that the substrate 1 has a white substrate structure, thereby achieving the reflection effect of the light-emitting chip 5 on the top surface of the substrate 1, thereby increasing the light emission efficiency of the light-emitting device.

[0043] Specifically, the molding compound 12 covers the circumferential sidewall of the metal boss 111, and the top surface of the molding compound 12 forms a diffuse reflection area around the top surface of the metal boss 111. Since the molding compound 12 is made of white epoxy molding compound, the metal boss 111 reduces the size of the exposed electrodes on the top surface of the substrate 1, thereby increasing the distribution area of ​​the white top surface of the substrate 1. The white top surface of the substrate forms a diffuse reflection area around the light-emitting chip 5, effectively increasing the light reflection effect of the substrate 1 on the light-emitting chip 5, and thus effectively improving the light emission efficiency of the light-emitting device.

[0044] Specifically, the metal protrusion 111 is disposed on the top electrode near the central axis of the light-emitting device. The spacing between the two metal protrusions 111 in the arrangement is the same as the spacing between the two metal parts 11, so as to meet the die bonding installation requirements of the light-emitting chip 5. The light-emitting chip 5 can be die bonded and installed in the middle position of the light-emitting device to meet the requirements of light emission uniformity of the light-emitting device.

[0045] Furthermore, the projected area of ​​the metal protrusion 111 is smaller than the projected area of ​​the bottom electrode of the substrate 1. By setting a small-sized metal protrusion 111, the metal protrusion 111 can meet the die bonding requirements of the light-emitting chip 5 and reduce the area of ​​exposed metal on the top surface of the light-emitting device, thereby reducing the risk of oxidation of the exposed metal on the top surface of the light-emitting device interfering with the light emission of the light-emitting chip 5.

[0046] Specifically, the metal component 11 also includes a connecting rib 112. The cross-section of the connecting rib 112 can be connected to the top surface of the molding layer 12. The top surface of the connecting rib 112 is exposed on the top surface of the molding layer 12. The connecting rib 112 is used to realize the physical connection of the arrangement structure between several metal components 11 to form a whole plate metal frame 10. By mounting and molding the light-emitting chip 5 on the whole plate metal frame 10 and dividing it into several light-emitting devices based on the dicing process, the manufacturing efficiency can be improved. The connecting rib 112 can be located at the top of the metal component 11. The top surface of the connecting rib 112 is coplanar with the top surface of the metal component 11, which can meet the physical connection requirements between several metal components 11. When performing the dicing operation of the whole board packaging structure, since the connecting rib 112 is located at the top of the metal component 11, the cross-section of the connecting rib 112 formed by cutting can be in complete contact with the blade of the cutting tool, thereby reducing the risk of burrs forming on the cross-section of the connecting rib 112 and keeping the cross-section of the connecting rib 112 formed by cutting clean.

[0047] Furthermore, the cross-section of the connecting rib 112 can be connected to the bottom surface of the molding layer 12, and the bottom surface of the connecting rib 112 is exposed on the bottom surface of the molding layer 12; that is, the connecting rib 112 is located at the bottom of the metal component 11, and the bottom surface of the connecting rib 112 is coplanar with the bottom surface of the metal component 11. Based on the connecting rib 112, several metal components 11 can maintain a stable physical connection state. Moreover, since the connecting rib 112 is located at the bottom of the metal component 11, the entire metal plate can be etched from top to bottom to form a metal frame 10, thereby improving the fabrication efficiency of the metal frame 10.

[0048] Furthermore, the molding layer 12 covers the periphery of the cross-section of the connecting rib 112. The cross-section of the connecting rib 112 is not connected to the top, bottom, or side surfaces of the molding layer 12, and a gap is formed between the cross-section and the top or bottom edge of the molding layer 12. The connecting rib 112 is disposed within the sidewall of the metal component 11. Several metal components 11 are formed by etching the entire metal plate, and the connecting rib 112 structure is formed in the middle of the sidewall of the metal component 11, which can meet the physical connection requirements between several metal components 11. Since the connecting rib 112 is located in the middle of the metal component 11, the top surface of the connecting rib 112 can be accommodated within the molding layer 12, avoiding the top surface of the connecting rib 112 being exposed on the top surface of the substrate 1. This reduces the exposed area of ​​the metal component 11 on the top surface of the substrate 1, effectively reducing the impact of oxidation and blackening of the exposed metal on the top surface of the substrate 1 on the light emission effect of the light-emitting device.

[0049] Furthermore, since the connecting rib 112 is located in the middle layer of the metal component 11, when the entire board packaging structure is diced by the cutting tool, the blade of the cutting tool can fully contact the cutting section of the connecting rib 112. This allows for adjustment of the shape of the burrs formed by the metal cutting extension of the connecting rib 112, preventing burrs from protruding at the bottom of the device, thereby improving the cleanliness and reliability of the substrate 1.

[0050] Furthermore, since the connecting rib 112 is located in the middle of the metal component 11, the connecting rib 112 can be accommodated in the molding layer 12, avoiding the top surface of the connecting rib 112 being exposed on the top surface of the substrate. This reduces the exposed metal area on the top surface of the substrate 1, reduces the interference of oxidation and blackening of the exposed metal on the top surface of the ECM substrate on the light emission efficiency of the light-emitting device, and thus improves the light emission effect of the light-emitting device.

[0051] Specifically, the metal component 11 is formed with a plurality of connecting ribs 112 by an etching process. The plurality of connecting ribs 112 are provided with one or more horizontal connecting ribs, and / or the plurality of connecting ribs 112 are provided with one or more inclined connecting ribs. The inclined connecting ribs 112 can improve the rigidity of the connection structure between the two metal components 11 in the metal frame structure. When dicing and cutting, the metal component 11 can have sufficient structural rigidity for dicing and cutting, thereby improving the accuracy and reliability of dicing and cutting.

[0052] Specifically, the surface of the metal component 11 is provided with an electroplated layer, which can be a nickel-silver plating layer, a nickel-gold plating layer, a nickel-palladium-gold plating layer, or a tin plating layer. Since the metal component 11 is made of copper alloy, iron alloy, or aluminum alloy, it has good electrical conductivity and low material cost, making it economical. By electroplating the outer surface of the metal component 11 to form a dense electroplated layer, the influence of the oxide layer on the surface of the metal component 11 on the chip bonding can be avoided. By electroplating metals such as tin and silver, which have excellent compatibility with solder, a clean and easy-to-solder surface can be provided for the light-emitting chip 5, ensuring a strong and reliable connection in the bonding and wire bonding processes of the light-emitting chip 5.

[0053] Furthermore, the electroplating layer can reduce the oxidation risk of the exposed metal on the top surface of the substrate 1 and has a certain encapsulation protection effect. The electroplating layer increases the reflectivity of the exposed metal position on the top surface of the substrate 1, so that the exposed metal on the top surface of the substrate 1 has a certain reflective effect, thereby improving the light emission efficiency of the light-emitting chip 5.

[0054] Specifically, the electroplating layer can cover the area outside the cross-section of the metal component 11. That is, the substrate 1 is prepared by pre-plating, the metal frame 10 is electroplated to form an electroplating layer on the surface of the metal frame 10, and then the metal frame 10 is encapsulated with epoxy resin molding compound to obtain the substrate 1 with the electroplating layer. By electroplating the entire metal frame 10, electroplating protection of the metal frame 10 is achieved. The operation process is simple and the processing efficiency is high.

[0055] Specifically, the electroplating layer can cover the exposed top and bottom surfaces of the metal component 11. That is, the substrate 1 is prepared by a post-plating process, the metal frame 10 is encapsulated with epoxy resin molding compound to form a substrate structure, and then electroplating is performed on the exposed metal surface of the substrate structure, which can protect the exposed metal areas.

[0056] Furthermore, based on the post-electroplating process, an electroplating layer can be applied to the exposed metal surface of the substrate 1, and the electroplating layer can fill the gap between the metal component 11 and the molding layer 12, thereby achieving a wrapping connection between the metal component 11 and the molding layer 12. This can improve the bonding force between the metal component 11 and the molding layer 12, thereby improving the structural stability of the substrate 1.

[0057] Specifically, the light-emitting device further includes a fluorescent layer 2 and a white adhesive layer 3 sequentially covering the light-emitting chip 5. The light-emitting chip 5 is completely contained within the fluorescent layer 2, and the white adhesive layer 3 covers the top surface of the fluorescent layer 2. The light emitted by the light-emitting chip 5 of the light-emitting device can be converted into a corresponding light emission efficiency after passing through the light color conversion of the fluorescent layer 2. The white adhesive layer 3 is used to improve the uniformity of the light emission color of the light-emitting device, thereby improving the light emission efficiency of the light-emitting device.

[0058] Furthermore, the fluorescent layer 2 refers to the wavelength conversion layer covering the light-emitting chip 5, which can be made of silicone or epoxy resin doped with phosphor, and is used to convert part or all of the light from the light-emitting chip 5 into the target wavelength to achieve the effect of converting light into color.

[0059] Furthermore, the white adhesive layer 3 refers to the white reflective layer covering the fluorescent layer 2, which can be implemented using silicone with added titanium dioxide, used to reflect light and enhance the sealing of the encapsulation structure.

[0060] Specifically, the light-emitting device also includes a waterproof layer 4, which covers the outer surfaces of the substrate 1, the fluorescent layer 2, and the white light layer. After the light-emitting device completes the molding process, the entire device can be coated with the waterproof layer 4, so that the surfaces of the substrate 1, the fluorescent layer 2, and the white adhesive layer 3 are covered with the waterproof layer 4. Based on the waterproof layer 4, the fluorescent layer 2 can be molded and protected, that is, the fluorescent layer 2 is physically isolated from the external environment, preventing moisture from the external environment from entering the fluorescent layer 2, thereby preventing the phosphor inside the fluorescent layer 2 from contacting the moisture in the external environment, and preventing the phosphor in the fluorescent layer 2 from failing when exposed to water. This can effectively improve the reliability and stability of the overall packaging structure of the light-emitting device and ensure that the light-emitting device has good light emission efficiency.

[0061] Furthermore, the operating parameter data of the product in this embodiment and conventional products in high temperature and high humidity environments, as well as high temperature environments, are shown in the table below.

[0062] Table 1: Test data of the product in this embodiment and conventional products under high temperature and high humidity conditions

[0063]

[0064] Table 2: Test data of the product in this embodiment and conventional products under high temperature conditions

[0065]

[0066] Specifically, the experiment was conducted under high temperature and high humidity conditions. The pretreatment procedures before the experiment were as follows: 1. Baking at 125℃ for 24 hours; 2. Moistening within 12 hours after baking, at 85℃ / 60%RH / 168 hours; 3. Refluxing 3 times within 12 hours after moisture absorption.

[0067] Pretreatment is a mandatory test required by automotive standards before the high temperature and humidity life test. It has a direct impact on reliability results, and the improvement effect of waterproofing on reliability is also reflected in pretreatment, so that the test results can accurately reflect the effect of the waterproofing layer.

[0068] The high temperature and high humidity life test conditions were set as follows: 85℃ / 85%RH, 30mA. The light-emitting device was tested to ensure its reliability. The luminous flux of the light-emitting device was used as the reliability test.

[0069] After the light-emitting device of this embodiment of the invention operates for 500 hours under high temperature and high humidity conditions of 85°C and 85%, the change in the x-coordinate of the light-emitting device is within the range of -0.01 to +0.01, the change in the y-coordinate of the light-emitting device is within the range of -0.01 to +0.01, and the change in the luminous flux of the light-emitting device relative to the luminous flux after preprocessing is between -10% and +20%.

[0070] Furthermore, after the light-emitting device operates for 1000 hours under high temperature and high humidity conditions of 85℃ and 85%, the change in the x-coordinate of the light-emitting device is within the range of -0.008 to +0.01, the change in the y-coordinate of the light-emitting device is within the range of -0.008 to +0.01, and the change in the luminous flux of the light-emitting device relative to the luminous flux after preprocessing is between -10% and +10%.

[0071] Referring to the table above, after 1000 hours of operation under high temperature and high humidity conditions, the absolute value of the change in color coordinate x (compared with the pre-processed data) of the untreated sample is close to 0.01, and the absolute value of the change in y is close to 0.08, indicating that it is on the verge of failure. The absolute value of the change in color coordinate x of the treated sample is less than 0.006, and the absolute value of the change in y is less than 0.003, which are far below the failure threshold.

[0072] After the light-emitting device operates at a high temperature of 100℃ for 1000 hours, the change in the x-coordinate of the light-emitting device is within the range of -0.008 to +0.01, the change in the y-coordinate of the light-emitting device is within the range of -0.008 to +0.01, and the change in the luminous flux of the light-emitting device relative to the luminous flux after preprocessing is between -10% and +10%.

[0073] Referring to the table above, the absolute value of the change in color coordinate x for the untreated sample is less than 0.006, and the absolute value of the change in color coordinate y exceeds 0.01, indicating that it has failed; the absolute value of the change in color coordinate x for the treated sample is less than 0.001, and the absolute value of the change in color coordinate y is less than 0.005, which is still far below the failure threshold.

[0074] In summary, by setting the waterproof layer 4, the working life of the light-emitting device can be effectively extended and the reliability of the light-emitting device can be improved.

[0075] Furthermore, the waterproof layer 4 is a fluorine nano-coating, which has a hydrophobic effect and can meet the waterproof protection requirements of the fluorescent layer 2 of the light-emitting device. The thickness of the waterproof layer 4 is set between 1μm and 10μm. In this embodiment, the thickness of the waterproof layer 4 is set between 6μm and 8μm, specifically 6μm, 7μm and 8μm, which can improve the physical barrier effect and the hydrophobic and waterproof effect of the fluorescent layer 2.

[0076] Specifically, the light-emitting device is cut based on a whole-board packaging structure. The whole-board packaging structure includes: a whole substrate 1 formed by a metal frame 10 and a molding layer 12, a plurality of light-emitting chips 5 disposed on the whole substrate 1, and a fluorescent layer 2 and a white glue layer 3 sequentially covering the light-emitting chips 5.

[0077] The metal frame 10 has a plurality of metal components 11 formed by etching, and a plurality of chip mounting units are formed between the plurality of metal components 11. Any two adjacent chip mounting units are connected by a connecting rib 112.

[0078] The metal frame 10 is formed by etching, which results in a structure arrangement of several metal parts 11 and connecting ribs 112, so that the several metal parts 11 are physically connected to each other, so as to perform chip die bonding and packaging of the whole board structure, thereby improving the processing efficiency of several light-emitting devices.

[0079] Specifically, in this embodiment, the light-emitting device is a monolithic package structure. A metal frame 10 with several metal components 11 and connecting ribs 112 is prepared by etching. The several metal components 11 include several first sub-metal components 101 and several second sub-metal components 102. The several first sub-metal components 101 and several second sub-metal components 102 are arranged in a queue, and the queue of first sub-metal components 101 and the queue of second sub-metal components 102 are arranged alternately.

[0080] The metal frame 10 forms a plurality of chip mounting units based on a plurality of first sub-metal components 101 and a plurality of second sub-metal components 102. Each chip mounting unit includes a first sub-metal component 101 and a second sub-metal component 102, and a mounting area for the light-emitting chip 5 is formed based on the first sub-metal component 101 and the second sub-metal component 102.

[0081] Specifically, any two adjacent chip mounting units are connected by horizontally arranged connecting ribs 112, or any two adjacent chip mounting units are connected by vertically arranged connecting ribs 112. Furthermore, any two adjacent chip mounting units arranged in the horizontal direction are also provided with inclined connecting ribs 112, which can improve the physical connection stability between the metal parts 11 of different chip mounting units.

[0082] Furthermore, the metal frame 10 may be provided with a number of support pillar structures. The support pillar structures improve the stability of the molding and shaping of the metal components 11 within the metal frame 10, and at the same time improve the support performance of the entire substrate 1 structure, so as to meet the die bonding installation requirements of the several light-emitting chips 5.

[0083] This invention provides a light-emitting device using a substrate 1 structure. By setting a metal protrusion 111 structure at the top electrode position of the substrate 1 as the die-bonding position of the light-emitting chip 5, the area of ​​exposed metal on the top surface of the substrate 1 is reduced, thereby reducing the impact of the oxidation and blackening of the top surface metal on the light-emitting chip 5 during the packaging process. The white substrate structure improves the light reflection on the top surface of the substrate 1, thereby improving the light-emitting efficiency of the light-emitting device.

[0084] Example 2:

[0085] refer to Figures 7 to 9 This invention provides another light-emitting device, which is an RGB device. The substrate 1 has three chip mounting areas, so that the substrate 1 can meet the die bonding mounting requirements of red light chip, green light chip and blue light chip.

[0086] Specifically, the overall packaging structure of the light-emitting device includes: a substrate 1 formed by a metal frame 10 and a molding layer 12, a plurality of light-emitting chips 5 disposed on the substrate 1, and a fluorescent layer 2 and a white glue layer 3 sequentially covering the light-emitting chips 5.

[0087] The metal frame 10 has a plurality of metal components 11 formed by etching, and a plurality of chip mounting units are formed between the plurality of metal components 11. Any two adjacent chip mounting units are connected by connecting ribs 112. The plurality of chip mounting units are arranged in an array within the metal frame 10, and any two adjacent chip mounting units are connected by horizontally arranged connecting ribs 112 or by vertically arranged connecting ribs 112. In the horizontal direction, any two adjacent chip mounting units are connected by a plurality of inclined connecting ribs 112.

[0088] In this embodiment, the metal components 11 of the metal frame 10 include a plurality of third sub-metal components 103. The plurality of third sub-metal components 103 are arranged in pairs and form an array within the metal frame 10. The third sub-metal components 103 in any chip mounting unit form at least three chip bonding positions based on the pairwise arrangement to meet the bonding requirements of red light chips, green light chips and blue light chips.

[0089] Furthermore, an inclined connecting rib 112 is provided between the third sub-metal component 103 in any of the chip mounting units and the adjacent third sub-metal component 103 in the adjacent chip mounting units. That is, it is located between the third sub-metal components 103 of the two chip mounting units. The adjacent third sub-metal components 103 form a staggered connection structure based on the connecting rib 112, so as to improve the reliability and stability of the physical connection of the metal components 11 between different chip mounting units and meet the dicing and cutting requirements of the whole board packaging structure.

[0090] This invention provides a light-emitting device. By setting a plurality of inclined connecting ribs 112 in the metal frame 10 within the whole-board packaging structure, the adjacent two columns of metal parts 11 between two adjacent chip mounting units can form a staggered connection arrangement, which effectively improves the stability of the connection between the plurality of metal parts 11 within the metal frame 10 and improves the overall rigidity of the whole-board packaging structure, so as to meet the die bonding and welding requirements of the light-emitting chip 5 and the dicing and cutting requirements of the plurality of light-emitting devices.

[0091] Example 3:

[0092] For details, please refer to Figure 10 This invention provides a flowchart of a method for fabricating a light-emitting device, the method comprising:

[0093] S11: Prepare a substrate and install several light-emitting chips 5 on the mounting positions of the substrate accordingly;

[0094] The substrate can be prepared by using a metal circuit frame and a molding compound. The metal plate is etched according to a preset pattern to form a metal frame 10 with several metal parts 11 and connecting ribs 112. The molding compound is filled in the metal frame 10 to form the substrate 1. Several light-emitting chips 5 are installed on the chip die bonding positions of the substrate 1.

[0095] The metal circuit frame can be made of copper alloy, iron alloy, or aluminum alloy. A preset circuit pattern is formed by stamping or etching. A metal boss 111 is provided on the top surface of the metal component 11, with the top surface of the metal boss 111 exposed on the top surface of the molding layer 12 of the substrate 1, thereby forming the die bonding area of ​​the light-emitting chip 5.

[0096] S12: Cover the surface of the substrate with a phosphor layer, and encapsulate several light-emitting chips 5 within the phosphor layer 2;

[0097] A silicone colloid containing phosphor is filled on the surface of a substrate, and a phosphor layer 2 is formed on the top surface of the substrate by molding. The phosphor layer 2 can completely cover several light-emitting chips 5, and the phosphor layer can meet the light color conversion requirements of the light-emitting chips 5.

[0098] S13: Cover the top surface of the fluorescent layer 2 with a white glue layer 3 to obtain a whole-board encapsulation structure of several light-emitting devices;

[0099] Specifically, the top surface of the fluorescent layer 2 is filled with silicone colloid doped with silica particles, and the white glue layer 3 is obtained by molding. Since the white glue layer 3 is doped with silica particles, it can diffuse the light emitted by the device, thereby improving the uniformity of light emission and the light emission efficiency of the device.

[0100] S14: The entire board packaging structure is diced and cut according to the cutting line to obtain several light-emitting devices.

[0101] A cutting line is provided on the white adhesive layer 3, so that the cutting line is arranged corresponding to the river channel. The cutting line is configured as the dicing line of the whole board packaging structure. The cutting tool is driven to cut along the cutting line, thereby meeting the dicing cutting requirements of the whole board packaging structure and obtaining several light-emitting devices.

[0102] Furthermore, the preparation method also includes: applying a waterproof coating to several cut light-emitting devices to form a waterproof layer 4 on the surface of the light-emitting devices; and covering and protecting the substrate 1, the fluorescent layer 2, and the white glue layer 3 based on the waterproof layer 4 to form a physical isolation, which can prevent the fluorescent layer 2 from being directly exposed to the external environment, reduce the risk of the fluorescent layer 2 being decomposed by moisture intrusion, and improve the reliability of the light-emitting device packaging.

[0103] This invention provides a method for fabricating a light-emitting device. The method involves etching a metal frame 10 and encapsulating it with plastic to form a substrate 1 structure. The design of the metal boss 111 on the metal component 11 reduces the exposed metal area on the top surface of the substrate 1, thereby reducing interference from the black oxide region on the light-emitting device and improving the luminous efficiency of the light-emitting device.

[0104] Furthermore, the above provides a detailed description of a light-emitting device provided by the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A light-emitting device, characterized in that, The light-emitting device includes: a substrate and one or more light-emitting chips disposed on the substrate; The substrate includes: two or more metal components and a molding layer, wherein the metal components are housed within the molding layer, and a top electrode is provided on the top of the metal components, a bottom electrode is provided on the bottom of the metal components, and a metal boss is provided on the top electrode. The top electrode is completely contained within the molding compound, and the top surface of the metal boss is exposed outside the molding compound to form the die bonding region of the substrate.

2. The light-emitting device as described in claim 1, characterized in that, Several metal components are distributed independently of each other, and the several metal components are divided into several arrangements; Each of the aforementioned arrangements includes two of the aforementioned metal components, and each of the aforementioned arrangements forms one of the aforementioned die-bonding regions.

3. The light-emitting device as described in claim 1, characterized in that, The molding compound is made of one of the following materials: epoxy resin molding compound, silicone molding compound, or silicone resin molding compound.

4. The light-emitting device as described in claim 3, characterized in that, The molding layer covers the circumferential sidewall of the metal boss. When the color of the molding layer is white, the top surface of the molding layer forms a diffuse reflection area around the top surface of the metal boss.

5. The light-emitting device as described in claim 1, characterized in that, The metal boss is positioned on the top electrode near the central axis of the light-emitting device.

6. The light-emitting device as described in claim 5, characterized in that, The projected area of ​​the metal boss is smaller than the projected area of ​​the bottom electrode of the substrate.

7. The light-emitting device as described in claim 1, characterized in that, The metal component also includes a connecting rib, which is disposed on the side wall of the metal component; The cross-section of the connecting rib is exposed on the sidewall of the molding layer.

8. The light-emitting device as described in claim 7, characterized in that, The cross-section of the connecting rib is connected to the top surface of the molding layer, and the top surface of the connecting rib is exposed on the top surface of the molding layer; or The cross-section of the connecting rib is connected to the bottom surface of the molding layer, and the bottom surface of the connecting rib is exposed on the bottom surface of the molding layer; or The molding layer covers the cross-section of the connecting rib.

9. The light-emitting device as described in claim 7, characterized in that, The metal component is formed by etching to form a plurality of connecting ribs, wherein the plurality of connecting ribs are provided with one or more horizontal connecting ribs, and / or the plurality of connecting ribs are provided with one or more inclined connecting ribs.

10. The light-emitting device as claimed in claim 1, characterized in that, The surface of the metal component is provided with an electroplated layer, which covers the area outside the cross-section of the metal component; Alternatively, the electroplated layer may cover the exposed top and bottom surfaces of the metal component.

11. The light-emitting device as claimed in claim 1, characterized in that, The light-emitting device further includes a fluorescent layer and a white glue layer sequentially covering the light-emitting chip; The light-emitting chip is completely housed within the fluorescent layer, and the white adhesive layer covers the top surface of the fluorescent layer.

12. The light-emitting device as claimed in claim 11, characterized in that, The light-emitting device also includes a waterproof layer that covers the surfaces of the substrate, the fluorescent layer, and the white adhesive layer.

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