High-performance thermosetting resin plugging material and preparation method and water-based drilling fluid

Abstract

The application discloses a high-performance thermosetting resin plugging material and a preparation method thereof and a water-based drilling fluid, relates to the technical field of oil field chemistry, and discloses the following steps in the preparation method of the plugging material: stirring and reacting an aromatic compound containing two double bonds with sodium tungstate, a transfer catalyst and a hydrogen peroxide solution at room temperature, purifying to obtain an epoxy compound, reacting an aromatic compound containing an aldehyde group with ammonium formate and a palladium-carbon catalyst under heating of nitrogen, obtaining an amine compound, transferring the epoxy compound and the amine compound into a size-adjustable mold, performing a temperature rising curing treatment, performing low-temperature ball milling on a crude product, obtaining plugging material particles, and using the plugging material particles to configure the water-based drilling fluid; the specific aromatic rigid skeleton monomer is selected, and the molar ratio of the epoxy and the curing agent is accurately controlled, so that the mechanical strength and the thermal stability of the material are significantly optimized, and the plugging material in the application has a good treatment effect on cracks and pores in complex strata.

Description

Technical Field

[0001] This invention relates to the field of oilfield chemical technology, specifically to a high-performance thermosetting resin plugging material and its preparation method, and a water-based drilling fluid. Background Technology

[0002] In oil drilling operations, well leakage is a common and serious technical problem that significantly restricts drilling efficiency, safety, and profitability. This problem often occurs in formations with fractures, pores, or caverns, where high pressure leads to significant drilling fluid loss, potentially causing wellbore instability or blowouts. While fibrous, granular, and gel-based materials are traditional plugging methods, they have significant limitations. For example, fibrous materials are prone to settling and difficult to seal wide fractures; granular materials are easily deformed and degraded under high temperature and pressure; and gel-based materials have low strength and poor temperature resistance. As exploration and development delve deeper into complex, high-temperature, high-pressure, and high-salt formations, well leakage problems become more prominent. Furthermore, with increasing well depth, formation pressure increases, while the performance of traditional plugging materials deteriorates rapidly, limiting the development of rapid, efficient, and safe drilling and failing to meet practical engineering requirements.

[0003] As oil and gas exploration advances into high-temperature, high-pressure, and deep formations, well leakage has led to drilling fluid losses accounting for over 50% of the time spent on treatment. Wellbore instability and reservoir blockage have severely constrained drilling efficiency and economic benefits. Traditional plugging agents such as cement slurry, bridging materials, and rigid materials lack sufficient pressure resistance. While epoxy resins, due to their high strength and heat resistance from benzene rings and the chemical resistance of ether bonds, show potential, the high density, complex curing process, and poor compatibility of existing thermosetting resins still require breakthroughs. Currently, some high-temperature, high-pressure plugging agents and their preparation methods exist. For example, patent CN114573792A discloses a dynamically crosslinked biodegradable epoxy resin, its preparation method, and its application in high-temperature plugging. This plugging agent, with epoxy resin and curing agent as its main components, has some temperature resistance but still has room for improvement. Moreover, its pressure resistance under high-temperature and high-pressure conditions is only 8–12 MPa, which is insufficient to meet the plugging requirements of deep and ultra-deep wells. In addition, patent CN116948611B discloses a method for preparing branched epoxy resin pressure-bearing plugging material and an oil-based drilling fluid. The resin plugging material is obtained by using tetrahalophenyl, tetrahalonaphthalene, epichlorohydrin, hexagonal boron nitride, and silane coupling agent. It can only meet the density requirements of drilling plugging formulations in some drilling field construction processes, and there is still room for improvement in the density of the plugging material.

[0004] Therefore, this invention innovatively selects specific aromatic monomers, uses double-bonded aromatic compounds to generate a rigid skeleton through epoxidation, and combines it with aldehyde-containing aromatic compounds to synthesize amine curing agents through reduction amination, providing a high-performance organic thermosetting resin plugging material that can meet the plugging requirements of low-pressure and high-pressure formations, has an extremely wide range of plugging slurry densities, and can efficiently plug complex fractured and porous formations. Summary of the Invention

[0005] In view of this, the present invention proposes a high-performance thermosetting resin plugging material and its preparation method, as well as a water-based drilling fluid. The resin material achieves low density, high strength and excellent high temperature resistance through optimized formulation and curing process. It exhibits excellent suspension at low density and strong chemical plugging properties at high density. The prepared water-based drilling fluid has a good treatment effect on fractures and pores in complex formations.

[0006] This invention discloses a method for preparing a high-performance thermosetting resin sealing material, comprising the following steps:

[0007] Step S1: Dissolve the aromatic compound containing two double bonds in the first solvent, add sodium tungstate and transfer catalyst, stir evenly at room temperature, and continue to add hydrogen peroxide solution and stir for 5h~12h. After the reaction is completed, remove the aqueous phase, wash the organic phase with sodium bisulfite solution for 5min~60min, purify the washed reaction solution by molecular sieve adsorption, and remove the solvent by vacuum distillation to obtain epoxy compounds.

[0008] Step S2: The aromatic compound containing the aldehyde group is stirred evenly with ammonium formate and palladium catalyst on carbon in the second solvent. The mixture is heated to 60℃~80℃ under nitrogen and stirred for 6h~12h. After the reaction is completed and cooled, the palladium catalyst on carbon and the second solvent are removed. The remaining reaction solution is extracted with dichloromethane, dried and filtered. The solid obtained is collected and dried at 45℃ for 6h~8h to obtain amine compounds.

[0009] Step S3: Heat the epoxy compound obtained in step S1 to a viscous state at 60℃~80℃, add the amine compound obtained in step S2 after it has been melted by heat, and stir until there are no bubbles to obtain a curable aromatic epoxy resin prepolymer.

[0010] Step S4: Transfer the curable aromatic epoxy resin prepolymer obtained in step S3 to an adjustable-size mold and heat it to 120℃~160℃. After curing for 10h~12h, quickly cool and demold for 1min~3min to obtain a rough product. Then, ball mill the rough product at -25℃~-5℃ to obtain resin plugging material particles with a particle size range of 6~100 mesh.

[0011] One embodiment of the present invention is that the aromatic compound containing two double bonds includes at least one of 1,4-divinylbenzene, 4,4'-divinylbiphenyl, and 1,2-bis(4-vinylphenyl)ethane.

[0012] The transfer catalyst is at least one of tetrabutylammonium bromide, trioctylmethylammonium chloride, and hexadecyltrimethylammonium bromide.

[0013] One embodiment of the present invention is that the aldehyde-containing aromatic compound includes at least one of 4-(diethylamino)-2-hydroxybenzaldehyde, 2-methoxy-1-naphthoaldehyde, and 6-methoxy-2-naphthoaldehyde.

[0014] In one embodiment of the present invention, the molar ratio of the aromatic compound containing two double bonds to the aromatic compound containing an aldehyde group is 1:1.8~2.2. The molar ratio of the aromatic compound containing two double bonds to sodium tungstate is 1:0.01~0.1; the molar ratio of the aromatic compound containing two double bonds to the transfer catalyst is 1:0.05~0.2; the molar ratio of the aromatic compound containing an aldehyde group to ammonium formate is 1:2~6; and the mass ratio of the aromatic compound containing an aldehyde group to the palladium on carbon catalyst is 1:0.005~0.03.

[0015] In one embodiment of the present invention, in step S1, the first solvent is a 1:1 mixture of ethyl acetate and deionized water; the hydrogen peroxide solution has a mass fraction of 30% and is added in an amount of 10-50 mL; the sodium bisulfite solution has a mass fraction of 5%.

[0016] In step S2, the second solvent is a 1:1 mixture of methanol and tetrahydrofuran.

[0017] And the high-performance thermosetting resin sealing material prepared according to the above method.

[0018] Furthermore, this invention also discloses a method for preparing water-based drilling fluid, using the aforementioned high-performance thermosetting resin plugging material as raw material, comprising the following steps:

[0019] By weight, 5-12 parts of bentonite are added to 300 parts of water and stirred and dispersed for 20-30 minutes. Then, 15-22 parts of sulfonated methyl phenolic resin SMP-3, 15-22 parts of sulfonated lignite SMC, 0.5-2 parts of high-temperature filtration reduction agent HF-1, 8-16 parts of NaCl, and 12-18 parts of KCl are added sequentially. Under continuous stirring, 30-950 parts of barite are added to obtain the base slurry. Finally, a high-performance thermosetting resin sealing material (1.30-1.50 g / cm³) is added to the base slurry. 3 Control the drilling fluid density to 1.17~2.30 g / cm³. 3 Continue stirring for 10-20 minutes to obtain the final product.

[0020] Furthermore, the high-performance thermosetting resin sealing material is composed of particles with four particle size ranges: 6-10 mesh, 10-16 mesh, 16-30 mesh, and 30-100 mesh.

[0021] Furthermore, by mass fraction, the amount of 6-10 mesh particles accounts for more than 3% of the base slurry; the amount of 10-16 mesh particles accounts for more than 3% of the base slurry; the amount of 16-30 mesh particles accounts for 1%-2% of the base slurry; and the amount of 30-100 mesh particles accounts for 1%-2% of the base slurry.

[0022] And the water-based drilling fluid prepared using the above method.

[0023] The technical advantages of this invention are as follows:

[0024] 1. The thermosetting sealing material provided by this invention has the characteristics of low density, ultra-high temperature resistance up to 360℃, and high pressure resistance of 160-180Mpa. It has the advantages of excellent suspension at low density and strong chemical sealing at high density.

[0025] 2. This invention selects specific aromatic rigid skeleton monomers and precisely controls the molar ratio of epoxy to curing agent, which significantly optimizes the mechanical strength and thermal stability of the material, making the plugging material of this invention have a good treatment effect on cracks and pores in complex formations. Attached Figure Description

[0026] Figure 1 The structural formula of the high-performance thermosetting resin sealing material in Embodiment 3 of the present invention is shown below.

[0027] Figure 2 This is a thermogravimetric analysis result diagram of the high-performance thermosetting resin plugging material in Example 1 of the present invention;

[0028] Figure 3 This is a thermogravimetric analysis result diagram of the high-performance thermosetting resin plugging material in Example 2 of the present invention;

[0029] Figure 4 The thermogravimetric analysis results of the high-performance thermosetting resin plugging material in Example 3 of the present invention are shown in the figure. Detailed Implementation

[0030] The present invention will be further described in detail below with reference to the embodiments. However, the implementation of the present invention is not limited thereto. Unless otherwise specified, the experimental methods used in the following embodiments are conventional methods, and the materials and reagents used are commercially available unless otherwise specified.

[0031] Example 1

[0032] (1) Dissolve 0.1 mol of 1,4-divinylbenzene in a mixed solvent of 100 mL of ethyl acetate and 100 mL of deionized water (1:1), add 1 g of sodium tungstate and 2 g of tetrabutylammonium bromide, stir at room temperature, add 30 mL of 30% hydrogen peroxide solution, and continue stirring for 6 h; after the reaction is completed, separate the aqueous phase and wash the organic phase with 5% sodium bisulfite solution under stirring for 30 min. The resulting reaction solution is purified by molecular sieve adsorption and then the solvent is removed by vacuum distillation to obtain epoxy compounds;

[0033] (2) 0.2 mol of 4-(diethylamino)-2-hydroxybenzaldehyde and a mixed solvent of 100 mL methanol and 100 mL tetrahydrofuran (1:1) were added to a round-bottom flask equipped with a stir bar. 30 g of ammonium formate and 0.5 g of 10% Pd / C catalyst were added. The mixture was heated to 70 °C under nitrogen and stirred for 8 hours. After the reaction was completed, the mixture was cooled to room temperature. The Pd / C catalyst was removed by filtration through a diatomaceous earth liner. The filtrate was concentrated under reduced pressure to remove the solvent. After extraction with dichloromethane, the solid was dried with anhydrous Na2SO4 for 30 min. The solid was collected by filtration and dried in a vacuum oven at 45 °C for 7 hours to obtain amine compounds.

[0034] (3) Add the epoxy compound prepared in step (1) into a three-necked flask, heat to 70°C until it becomes viscous, then heat and melt the amine compound obtained in step (2) and slowly add it into the flask, stir thoroughly until it is mixed evenly and without bubbles, and obtain curable aromatic epoxy resin prepolymer.

[0035] (4) Pour the curable aromatic epoxy resin prepolymer obtained in (3) into an adjustable size mold. Heat the mold to 120°C and cure for 11 hours. Then immerse it in liquid nitrogen for rapid cooling and demold for 2 minutes. Finally, ball mill it at -15°C and control the particle size to 6-100 mesh to obtain thermosetting resin particles.

[0036] Example 2

[0037] (1) Dissolve 0.2 mol of 4,4'-divinylbiphenyl in a mixed solvent of 150 mL of ethyl acetate and 150 mL of deionized water (1:1), add 3 g of sodium tungstate and 1.8 g of trioctylmethylammonium chloride, stir at room temperature, add 40 mL of 30% hydrogen peroxide solution, and stir for 10 h; after the reaction is completed, separate the aqueous phase, wash the organic phase with 5% sodium bisulfite solution under stirring, mix for 40 min, and purify the resulting reaction solution by molecular sieve adsorption and then remove the solvent by vacuum distillation to obtain epoxy compounds;

[0038] (2) 0.36 mol of 2-methoxy-1-naphthaldehyde and a mixed solvent of 150 mL methanol and 150 mL tetrahydrofuran (1:1) were added to a round-bottom flask equipped with a stir bar. 70 g of ammonium formate and 1.5 g of 10% Pd / C were added. The mixture was heated to 65 °C and stirred for 10 hours under nitrogen. After the reaction was completed, the mixture was cooled to room temperature. The Pd / C catalyst was removed by filtration through a diatomaceous earth liner. The filtrate was concentrated under reduced pressure to remove the solvent. After extraction with dichloromethane, the solid was dried with anhydrous Na2SO4 for 30 min. The solid was collected by filtration and dried in a vacuum oven at 45 °C for 8 hours to obtain amine compounds.

[0039] (3) Add the epoxy compound prepared in step (1) into a three-necked flask, heat it to 75°C until it becomes viscous, then heat and melt the amine compound prepared in step (2) and add it into the flask. Stir and mix thoroughly until there are no bubbles to obtain a curable aromatic epoxy resin prepolymer.

[0040] (4) Pour the curable aromatic epoxy resin prepolymer obtained in step (3) into an adjustable size mold. Heat the mold to 140°C and cure for 12 hours. Then immerse it in liquid nitrogen for rapid cooling and demold for 1 minute. Finally, ball mill it at -20°C and control the particle size to 6-100 mesh to obtain thermosetting resin particles.

[0041] Example 3

[0042] (1) Dissolve 0.15 mol of 1,2-bis(4-vinylphenyl)ethane in a mixed solvent of 120 mL of ethyl acetate and 120 mL of deionized water (1:1), add 2 g of sodium tungstate and 3.6 g of hexadecyltrimethylammonium bromide, stir at room temperature, add 35 mL of 30% hydrogen peroxide solution, and continue stirring for 8 h; after the reaction is completed, separate the aqueous phase and wash the organic phase with 5% sodium bisulfite solution under stirring for 30 min. The resulting reaction solution is purified by molecular sieve adsorption and then the solvent is removed by vacuum distillation to obtain epoxy compounds;

[0043] (2) 0.33 mol of 6-methoxy-2-naphthaldehyde and a mixed solvent of 120 mL methanol and 120 mL tetrahydrofuran (1:1) were added to a round-bottom flask equipped with a stir bar. 50 g of ammonium formate and 1 g of 10% Pd / C catalyst were added. The mixture was heated to 75 °C under nitrogen and stirred for 7 hours. After the reaction was completed, the mixture was cooled to room temperature. The Pd / C catalyst was removed by filtration through a diatomaceous earth liner. The filtrate was concentrated under reduced pressure to remove the solvent. The filtrate was then extracted with dichloromethane and dried with anhydrous Na2SO4 for 30 min. The solid was collected by filtration and dried in a vacuum oven at 45 °C for 6 hours to obtain amine compounds.

[0044] (3) Add the epoxy compound prepared in step (1) into a three-necked flask, heat to 80°C until it becomes viscous, then heat and melt the amine compound obtained in step (2) and slowly add it into the flask, stir thoroughly until it is mixed evenly and without bubbles, and obtain curable aromatic epoxy resin prepolymer.

[0045] (4) Pour the curable aromatic epoxy resin prepolymer obtained in (3) into an adjustable-size mold. Heat the mold to 160°C and cure for 10 hours. Then, immerse it in liquid nitrogen for rapid cooling and demold for 3 minutes. Finally, ball mill it at -10°C to control the particle size to 6-100 mesh to obtain thermosetting resin particles. The specific structural formula of the polymer particles is as follows: Figure 1 As shown.

[0046] Example 4

[0047] Measure 300mL of water and pour it into a high-speed stirring cup. Place the high-speed stirring cup on a high-speed stirrer and stir at 12000rpm. Weigh 8.0g of bentonite using cellophane. While stirring, slowly add the bentonite to the high-speed stirring cup to prevent splashing, and stir for 25min. While stirring, slowly add 18.5g of sulfonated methyl phenolic resin SMP-3 to the high-speed stirring cup and stir for 10min. While stirring, slowly add 18.5g of sulfonated lignite SMC to the high-speed stirring cup and stir for 10min. While stirring, slowly add 1.0g of high-temperature filtration reducer HF-1 to the high-speed stirring cup and stir for 10min. While stirring, slowly add 12.0g of NaCl to the high-speed stirring cup and stir for 10min. While stirring, add 15.0g of... KCl was slowly added to the high-speed stirring cup and stirred for 10 minutes. While stirring, 110.0 g of barite was slowly added to the high-speed stirring cup and stirred for another 20 minutes to obtain the base slurry.

[0048] The thermosetting resin particles obtained in Example 1 were ball-milled into particles with four particle size distributions: A, B, C, and D. The particle size distribution ranges are shown in Table 1.

[0049] Table 1. Particle size range of thermosetting resin particles in each embodiment.

[0050]

[0051] Based on this, a water-based drilling fluid system was prepared by mixing thermosetting resin particles of four different particle sizes with the base slurry at a mass ratio of 3%A+3%B+1%C+1%D for 20 minutes.

[0052] Example 5

[0053] The base slurry was prepared using the same method and dosage as in Example 4. The thermosetting resin particles from Example 1 were mixed with the base slurry at a mass ratio of 3%A+3%B+2%C+2%D for 20 minutes to obtain a water-based drilling fluid system.

[0054] Example 6

[0055] The base slurry was prepared using the same method and dosage as in Example 4. The thermosetting resin particles from Example 2 were ball-milled into particles with four particle size distributions (A, B, C, and D) using the same method as in Example 1. The particles were then mixed with the base slurry at a mass ratio of 3%A + 3%B + 1%C + 1%D for 20 minutes to prepare a water-based drilling fluid system.

[0056] Example 7

[0057] The base slurry was prepared using the same method and dosage as in Example 4. The thermosetting resin particles from Example 2 were ball-milled into particles with four particle size distributions (A, B, C, and D) using the same method as in Example 1. The particles were then mixed with the base slurry at a mass ratio of 3%A + 3%B + 2%C + 2%D for 20 minutes to prepare a water-based drilling fluid system.

[0058] Example 8

[0059] The base slurry was prepared using the same method and dosage as in Example 4. The thermosetting resin particles from Example 3 were ball-milled into particles with four particle size distributions (A, B, C, and D) using the same method as in Example 1. The particles were then mixed with the base slurry at a mass ratio of 3%A + 3%B + 1%C + 1%D for 20 minutes to prepare a water-based drilling fluid system.

[0060] Example 9

[0061] The base slurry was prepared using the same method and dosage as in Example 4. The thermosetting resin particles from Example 3 were ball-milled into particles with four particle size distributions (A, B, C, and D) using the same method as in Example 1. The particles were then mixed with the base slurry at a mass ratio of 3%A + 3%B + 2%C + 2%D for 20 minutes to prepare a water-based drilling fluid system.

[0062] Performance Evaluation

[0063] 1. Test of compressive strength

[0064] The products from Examples 1-3 were subjected to compressive strength tests, with three samples taken for each material. The compression test followed the standard ASTM D6641. Two strain gauges, one longitudinal and one transverse, were attached to each of the front and rear surfaces of the test specimen to obtain the average compressive strain and Poisson's ratio on both surfaces. An Instron 5882 testing machine (range 100kN) was used, along with a combined loading compression fixture (CLC), to apply compressive load to the test specimen. The average value of the test data was taken to determine the compressive strength of the high-performance thermosetting resin sealing materials in each example. The results are shown in Table 2.

[0065] Table 2. Compressive Strength Test of High-Performance Thermosetting Resin Sealing Materials

[0066]

[0067] As the structural complexity of the raw material molecules in Examples 1-3 gradually increases, and combined with the results in Table 2, it can be seen that the higher the rigidity of the polymer particle molecular structure, the higher the crosslinking density, the better the flexibility of the crosslinking network, and the greater the compressive strength of the high-performance thermosetting resin sealing material.

[0068] 2. Testing of thermogravimetric properties

[0069] Thermogravimetric analysis (TGA) was performed on samples of the products from Examples 1-3. One sample from each example and a reference were placed in separate crucibles and heated according to a pre-set heating program. The instrument recorded the heat absorption or release signals of the sample relative to the reference in real time. The mass change of the sample was then monitored using a precision balance, and the weight loss rate curves for Examples 1-3 could be obtained, as detailed below. Figures 2-4 As shown in Table 3, the results of the thermogravimetric test are as follows.

[0070] Table 3. Thermogravimetric properties test of high-performance thermosetting resin plugging materials

[0071]

[0072] As can be seen from Table 3, the highest decomposition temperature at the beginning of Example 3 is 364.55℃, and the decomposition temperatures of Examples 1 and 2 are also above 300℃, indicating that the high-performance thermosetting resin sealing material of the present invention has ultra-high temperature resistance up to about 360℃.

[0073] 3. Crack sealing test

[0074] The high-performance organic thermosetting resin plugging materials obtained in Examples 1 to 3 were ball-milled into particles of the aforementioned four particle size ranges A, B, C, and D, and mixed with the base slurry in Example 4 to prepare different drilling fluid systems. The drilling fluid systems of Examples 4 to 9 were then used to conduct crack plugging experiments at 200°C.

[0075] The simulated rock core used in the plugging experiment had a vertical crack length of 10 cm and a crack width of 3-4 mm. The crack was wedge-shaped. The specific experimental results are shown in Tables 4-6.

[0076] Table 4. Experimental test of the drilling fluid system formed in Example 1 on pressure-bearing plugging of wedge-shaped 3-4mm fracture cores.

[0077]

[0078] Table 5. Experimental test of the drilling fluid system formed in Example 2 on pressure-bearing plugging of core samples with wedge-shaped 3-4mm fractures.

[0079]

[0080] Table 6. Experimental test of the drilling fluid system formed in Example 3 on pressure-bearing plugging of core samples with wedge-shaped 3-4mm fractures.

[0081]

[0082] The experimental results shown in Tables 4, 5, and 6 indicate that the sealing effect of Example 5 was as follows: the sealing layer was 1.3 cm from the inlet (3 mm) and 7.5 cm from the outlet (4 mm), with a blockage position of 1.2–7.5 cm. The sealing effect of Example 7 was as follows: the sealing layer was 1.0 cm from the inlet (3 mm) and 7.8 cm from the outlet (4 mm), with a blockage position of 0.4–8.5 cm. The sealing effect of Example 9 was as follows: the sealing layer was 0.7 cm from the inlet (3 mm) and 8.5 cm from the outlet (4 mm), with a blockage position of 0.7–8.5 cm.

[0083] Therefore, it can be seen that the sealing effect of the drilling fluid improves with the increase of the amount of plugging material. Under the condition of low plugging material concentration, the main reason why the drilling fluid systems prepared in Examples 1-3 failed to seal successfully was that the concentration of bridging particles A and B was insufficient. Therefore, the plugging was successful when the concentration of particles A and B was increased to 3%. That is, the concentration of small particles was increased to fill the gaps between the bridging particles on the basis of the low concentration of small particles in the system, thereby meeting the requirements of large particles bridging and small particles filling, and a stable sealing layer can be formed.

[0084] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the embodiments of the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the claims.

Claims

1. A method for preparing a high performance thermoset resin lost circulation material, characterized in that, The method comprises the following steps: Step S1: dissolving the aromatic compound containing two double bonds in a first solvent, adding sodium tungstate and a transfer catalyst, stirring uniformly at room temperature, then adding hydrogen peroxide solution and stirring for 5-12 hours, removing the water phase after the reaction is completed, washing the organic phase with sodium bisulfite solution for 5-60 minutes, purifying the washed reaction liquid by molecular sieve adsorption, and removing the solvent by reduced pressure distillation to obtain an epoxy compound; Step S2: stirring the aromatic compound containing an aldehyde group, ammonium formate, and palladium-carbon catalyst uniformly in a second solvent, heating to 60-80°C under nitrogen, stirring for 6-12 hours, removing the palladium-carbon catalyst and the second solvent after the reaction is completed, extracting the remaining reaction liquid with dichloromethane, drying and filtering the extraction liquid, collecting the obtained solid, and drying at 45°C for 6-8 hours to obtain an amine compound; Step S3: heating the epoxy compound obtained in step S1 to a viscous state at 60-80°C, adding the amine compound obtained in step S2 after hot melting, stirring until there are no air bubbles, and obtaining a curable aromatic epoxy resin prepolymer; Step S4: transferring the curable aromatic epoxy resin prepolymer obtained in step S3 to a mold with adjustable size, heating to 120-160°C, and after 10-12 hours of heating and curing treatment, quickly cooling and demolding for 1-3 minutes to obtain a crude product, then performing low-temperature ball milling of the crude product under the condition of -25°C to -5°C to obtain resin plugging material particles, and the particle size range is 6-100 mesh; The aromatic compound containing two double bonds includes at least one of 1,4-divinylbenzene, 4,4'-divinylbiphenyl, and 1,2-bis(4-vinylphenyl)ethane. The transfer catalyst is at least one of tetrabutylammonium bromide, trioctylmethylammonium chloride, and cetyltrimethylammonium bromide. The aromatic compound containing an aldehyde group includes at least one of 4-(diethylamino)-2-hydroxybenzaldehyde, 2-methoxy-1-naphthaldehyde, and 6-methoxy-2-naphthaldehyde. The molar ratio of the aromatic compound containing two double bonds to the aromatic compound containing an aldehyde group is 1:1.8-2.2, the molar ratio of the aromatic compound containing two double bonds to sodium tungstate is 1:0.01-0.1, the molar ratio of the aromatic compound containing two double bonds to the transfer catalyst is 1:0.05-0.2, the molar ratio of the aromatic compound containing an aldehyde group to ammonium formate is 1:2-6, and the mass ratio of the aromatic compound containing an aldehyde group to the palladium-carbon catalyst is 1:0.005-0.

03.

2. A process for the preparation of a high performance thermoset resin plugging material as claimed in claim 1, wherein: The first solvent in step S1 is a 1:1 mixed solution of ethyl acetate and deionized water; the mass fraction of the hydrogen peroxide solution is 30%, and the amount added is 10-50 mL; and the mass fraction of the sodium bisulfite solution is 5%. The second solvent in step S2 is a 1:1 mixed solution of methanol and tetrahydrofuran.

3. The high-performance thermosetting resin plugging material prepared by the method according to any one of claims 1-2.

4. A water-based drilling fluid, characterized by The raw materials for preparation include the high-performance thermosetting resin plugging material according to claim 3.

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