Method, device and equipment for establishing exposure menu of photoetching machine and storage medium

Abstract

The invention discloses a photoetching machine exposure menu establishment method and device, equipment and a storage medium. The method comprises the following steps: S1, acquiring a photoetching process file; s2, verifying the accuracy and integrity of the photoetching process file; s3, running the loaded script, and resetting parameters in the script; s4, processing the photolithographic process file through the script so as to extract parameter information required to be set by the photolithographic equipment and generate target alignment point arrangement information; s5, generating an exposure menu file in an XML (Extensible Markup Language) format through the script on the basis of the parameter information required to be set by the photoetching equipment, the target alignment point arrangement information and a preset exposure menu specification file in the XML format; and S6, transmitting the exposure menu file in the XML format to photoetching equipment. According to the scheme, the generation efficiency of the exposure menu of the photoetching machine can be improved.

Description

Technical Field

[0001] This application relates to the technical field of integrated circuit manufacturing, specifically to a method, apparatus, equipment, and storage medium for establishing an exposure menu for a lithography machine. Background Technology

[0002] The integrated circuit manufacturing process involves dozens of core steps, including epitaxy, etching, doping, and photolithography. Among these, photolithography is the crucial step in transferring circuit patterns "from design to physical substrate," directly determining the chip's linewidth accuracy, functional integrity, and yield. Its core principle is: using a photolithography machine, the design pattern on a photomask is projected onto the surface of a silicon wafer coated with photoresist through an exposure light source (such as deep ultraviolet (DUV) or extreme ultraviolet (EUV)). Subsequent processes such as development and etching then permanently transfer the pattern to the semiconductor or metal layer of the silicon wafer.

[0003] The lithography process involves a large number of process parameters. Each time a New Tape-Out (NTO) chip comes off the production line, a lithography machine exposure menu needs to be created. Currently, the industry generally uses manual operation to create lithography machine exposure menus for NTO chips. On the one hand, the exposure menu for a single NTO chip needs to include hundreds of chip coordinates, dozens of sets of process parameters, and alignment instructions, resulting in a huge workload for manual input and format adjustment. On the other hand, manual operation is prone to problems such as incorrect parameter input and missing symbols leading to format errors, making it difficult to meet the high efficiency and high precision requirements of integrated circuit manufacturing. Summary of the Invention

[0004] This application provides a method, apparatus, device, and storage medium for creating exposure menus for a lithography machine, which can improve the generation efficiency of exposure menus for lithography machines.

[0005] In a first aspect, embodiments of this application provide a method for establishing an exposure menu for a lithography machine, comprising: S1: Obtain the photolithography process file; S2: Verify the accuracy and completeness of the photolithography process document; S3: Run the loaded script and reset the parameters in the script; S4: The lithography process file is processed by the script to extract the parameter information required to be set by the lithography equipment and generate the target alignment point arrangement information; S5: Using the script, based on the parameter information required to be set by the lithography equipment, the target alignment point arrangement information, and the preset XML format exposure menu specification file, an XML format exposure menu file is generated; S6: Transmit the exposure menu file in XML format to the lithography equipment.

[0006] In some embodiments, the lithography process documents include a process manual recording lithography process parameters, an application form recording core information of the current batch of wafers, and lithography machine data.

[0007] In some embodiments, the core information of the current batch of wafers includes wafer size, and the lithography machine data includes exposure unit size, chip size, dicing width, number of alignment points, and relative coordinates of the alignment points within the exposure unit. In step S4, the process of generating the site information includes: The script extracts wafer size, exposure unit size, chip size, dicing width, and alignment point number from the application form and lithography machine data. Using the script, an exposure unit distribution map is generated based on the wafer size, exposure unit size, chip size, and dicing width. The exposure unit distribution map contains a number of exposure units, and records the absolute coordinates of the center of each exposure unit relative to the center of the wafer. Using the script, based on the absolute coordinates of the center of each exposure unit relative to the wafer center and the relative coordinates of the alignment point within the exposure unit, the absolute coordinates of the alignment point in each exposure unit relative to the wafer center are obtained, and the distance between the alignment point and the wafer center is calculated. Using the script, a predetermined number of exposure units are selected as target exposure units within several annular regions on the wafer, and the alignment points in the target exposure units are used as target alignment points, wherein different annular regions do not overlap; The script generates target alignment information, which records the absolute coordinates of the target alignment points.

[0008] In some embodiments, selecting a predetermined number of exposure units as target exposure units within a plurality of annular regions on the wafer using the script includes: Within a region at a distance of A*R from the center of the wafer, a first number of exposure units are selected as target exposure units, where R is the wafer radius and A is a scaling factor. Within a region at a distance of (A+a)*R from the center of the wafer, a second number of exposure units are selected as target exposure units; Within a region at a distance of (Aa)*R from the center of the wafer, a third number of exposure units are selected as target exposure units; Within a region at a distance of (A+2a)*R from the center of the wafer, a fourth number of exposure units are selected as the target exposure units; Within a region at a distance of (A-2a)*R from the center of the wafer, a fifth number of exposure units are selected as the target exposure unit; This process continues until a predetermined total number of exposure units are selected as the target exposure units.

[0009] In some embodiments, the nearby region refers to an annular region at a distance of ±0.5a*R from the corresponding radius ratio, where the corresponding radius ratio refers to A*R, (A+a)*R, (Aa)*R, (A+2a)*R, and (A-2a)*R in sequence.

[0010] In some embodiments, the distance between the outermost target alignment point and the center of the wafer is not greater than a preset maximum allowable distance threshold.

[0011] In some embodiments, the script generates an exposure preview image in Excel format based on the target alignment information.

[0012] Secondly, embodiments of this application provide an apparatus for creating an exposure menu for a lithography machine, comprising: The data acquisition module is used to acquire photolithography process files; The data verification module is used to verify the accuracy and completeness of the photolithography process document; The script calling module is used to run the loaded script and reset the parameters in the script; The script execution module is used to process the lithography process file through the script, thereby extracting the parameter information of the lithography equipment and generating target alignment point arrangement information; The script execution module is also used to generate an XML-formatted exposure menu file based on the setting parameters of the lithography equipment, the target alignment point arrangement information, and a preset XML-formatted exposure menu specification file. The information sending module is used to transmit the exposure menu file in XML format to the lithography equipment.

[0013] Thirdly, embodiments of this application provide an intelligent device, characterized in that the intelligent device includes a processor and a memory, the memory stores a computer program, and the processor executes the computer program to implement the method for establishing the lithography machine exposure menu described in the first aspect.

[0014] Fourthly, embodiments of this application provide a storage medium storing a program, which, when executed by a processor, is used to implement the method for establishing the lithography machine exposure menu as described in the first aspect.

[0015] The technical solution of this application has at least the following advantages: 1. By acquiring the lithography process file, and using a script to extract the parameter information of the lithography equipment and generate the target alignment point arrangement information based on the lithography process file, an exposure menu file in XML format is finally obtained. After the exposure menu file in XML format is sent to the lithography equipment, the lithography equipment can automatically generate the final exposure menu, avoiding manual input by the staff and improving the efficiency and accuracy of the lithography machine's exposure menu generation. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a flowchart of a method for creating an exposure menu for a lithography machine according to an exemplary embodiment of this application; Figure 2 This is a flowchart illustrating S40 of a method for creating an exposure menu for a lithography machine, provided in an exemplary embodiment of this application. Figure 3 This is a schematic diagram illustrating an exposure unit and an annular region provided in an exemplary embodiment of this application; Figure 4 This is a schematic diagram illustrating an exposure preview image provided in an exemplary embodiment of this application; Figure 5 This is a system block diagram of an apparatus for creating an exposure menu for a lithography machine, provided in an exemplary embodiment of this application; Figure 6 This is a system block diagram of a smart device provided in an exemplary embodiment of this application. Detailed Implementation

[0018] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal connection between two components; and they can refer to wireless connections or wired connections. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0021] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0022] This application provides a method for creating an exposure menu for a lithography machine, which can be executed by a smart terminal, such as a computer, connected to the lithography equipment. (See reference...) Figure 1 The method includes the following processing: S1: Obtain the photolithography process file.

[0023] The lithography process documentation can include a process manual recording lithography process parameters, an application form containing core information about the current batch of wafers, and lithography machine data. Lithography process parameters can include exposure dose range, focus accuracy requirements, alignment point type, and acceptable defect rate. Core information about the current batch of wafers can include wafer size, chip model, layer ID, layer stacking order, mask ID, etc. Lithography machine data can include exposure unit size, chip size, dicing width, number of alignment points, and the relative coordinates of the alignment points within their respective exposure units. This data is recorded in corresponding files according to a fixed format and order, with corresponding labels.

[0024] For example, after each NTO rolls off the production line, the process integration engineer provides a process handbook and application form, and the data designer provides lithography machine data (Stepper Data) and enters it into the smart terminal, so that the smart terminal can obtain the lithography process documents.

[0025] S2: Verify the accuracy and completeness of the photolithography process documentation.

[0026] For example, after obtaining the lithography process file, the smart terminal can verify its accuracy and completeness. For instance, lithography machine data is typically in Excel format; the smart terminal can verify whether the format of the lithography machine data is accurate and confirm whether there is any missing data.

[0027] S3: Runs the loaded script and resets the parameters in the script.

[0028] For example, after the photolithography process file is verified, the smart terminal can run the loaded script and reset the parameters in the script, such as historical running data.

[0029] S4: Process the lithography process file through scripts to extract the parameter information required for the lithography equipment and generate target alignment point arrangement information.

[0030] For example, the smart terminal processes the aforementioned lithography process file via a script, enabling the script to extract the parameter information required for the lithography equipment through a preset data interface, such as the exposure dose range, focusing accuracy requirements, and focusing depth. Simultaneously, the script generates target alignment point arrangement information.

[0031] Furthermore, in this step, the process of generating target alignment information via script may include: S41: Extract wafer size, exposure unit size, chip size, dicing width, and alignment point number from the application form and lithography machine data using a script.

[0032] For example, the smart terminal runs a script that extracts information such as wafer size, exposure unit size, chip size, dicing width, and number of alignment points from the application form and lithography machine data, respectively. The wafer size can include the wafer diameter and the width of the invalid edge region. The exposure unit is the smallest area exposed in a single exposure by the lithography equipment, and its shape is generally rectangular. The dicing width is the spacing between adjacent exposure units. The exposure unit size includes the length and width of the exposure unit, which can be directly extracted from the lithography machine data or calculated from the chip size and dicing width.

[0033] S42: Using a script, an exposure unit distribution map is generated based on the wafer size, exposure unit size, chip size, and dicing width. The exposure unit distribution map contains several exposure units, and records the absolute coordinates of the center of each exposure unit relative to the center of the wafer.

[0034] For example, the script generates an exposure unit distribution map based on information such as wafer size, exposure unit size, chip size, and dicing width. In the exposure unit distribution map, a Cartesian coordinate system is established with the wafer center as the origin, and several exposure units are evenly distributed throughout the map. Simultaneously, when generating the exposure unit distribution map, the script can sequentially number each exposure unit and calculate the absolute coordinates of the center of each exposure unit in the Cartesian coordinate system with the wafer center as the origin, based on the exposure unit size and dicing width.

[0035] S43: Using a script, based on the absolute coordinates of the center of each exposure unit relative to the center of the wafer, and the relative coordinates of the alignment point within the exposure unit, the absolute coordinates of the alignment point relative to the center of the wafer are obtained, and the distance between the alignment point and the center of the wafer is calculated.

[0036] For any given exposure unit, the position of the alignment point within it is fixed, and the relative coordinates of the alignment point with respect to the exposure unit are given.

[0037] For example, by running a script, the smart terminal can obtain the absolute coordinates of the alignment point in each exposure unit relative to the wafer center, based on the absolute coordinates of the center of each exposure unit and the relative coordinates of the alignment point within the exposure unit. For instance, if the absolute coordinates of the center of an exposure unit are (x, y), and the relative coordinates of an alignment point in that unit are (x0, y0), then the absolute coordinates of that alignment point relative to the wafer center are (x+x0, y+y0).

[0038] S44: Using a script, a predetermined number of exposure units are selected as target exposure units within several annular regions on the wafer, and the alignment points within the target exposure units are used as target alignment points. Different annular regions do not overlap.

[0039] For example, a smart terminal can use a script to select a predetermined number of exposure units as target exposure units within several annular regions on a wafer, with the alignment points within these target exposure units serving as target alignment points. Different annular regions do not overlap. During the selection process, the uniformity and symmetry of the target exposure units' distribution on the wafer must be satisfied. For instance, within the same annular region, multiple target exposure units can be distributed at equal angles. For different annular regions, the closer the annular region is to the outer edge of the wafer, the more target exposure units it contains.

[0040] Furthermore, refer to Figure 2 Step S44 above may include the following processing procedure: S441: In the vicinity of the wafer center at a distance of A*R, select a first number of exposure units as target exposure units.

[0041] Where R is the wafer radius, A is the scaling factor, and the nearby region refers to the annular region within ±0.5a*R of the corresponding radius. In step S441, the corresponding radius is A*R. In subsequent steps S442 to S445, the corresponding radii are (A+a)*R, (Aa)*R, (A+2a)*R, and (A-2a)*R, respectively. In this embodiment, we will use a value of 70% (i.e., 0.7) for A and a value of 10% (i.e., 0.1) as an example for explanation.

[0042] For example, the script first identifies the region near the wafer center at a distance of 0.7R, that is, a ring-shaped region at a distance of 0.65R to 0.75R from the center. Figure 3 As shown, in Figure 3 In the diagram, each rectangle represents an exposure unit, the outermost circle represents the wafer outline, and the inner two dashed circles enclose a ring-shaped region with a radius of 0.65R to 0.75R. The script then identifies all exposure units falling within this ring-shaped region based on information such as the distance between the center of the exposure unit and the wafer center, and the size of the exposure unit. Next, the script selects a first number of exposure units evenly distributed within this ring-shaped region as target exposure units, with the alignment points within these target units serving as target alignment points. For example, the script might initially set the first number to 6 and check if there are 6 exposure units evenly distributed within the ring-shaped region. If so, these 6 exposure units are selected as target exposure units; if not, the first number is increased to 8, and so on, until the first number of target exposure units is obtained.

[0043] S442: In the vicinity of the wafer center at a distance of (A+a)*R, select the second number of exposure units as the target exposure units.

[0044] For example, in the area near the center of the circle at a distance of 0.8R, that is, in the annular area at a distance of 0.75R to 0.85R from the center of the circle, a process similar to that in S441 is performed until a second number of exposure units are selected as target exposure units.

[0045] S443: In the vicinity of the wafer center at a distance of (Aa)*R, select the third number of exposure units as the target exposure units.

[0046] For example, in the area near the center of the circle at a distance of 0.6R, that is, in the annular area at a distance of 0.55R to 0.65R from the center of the circle, a process similar to that in S441 is performed until a third number of exposure units are selected as the target exposure units.

[0047] S444: In the vicinity of the wafer center at a distance of (A+2a)*R, select the fourth number of exposure units as the target exposure unit.

[0048] For example, in the area near the center of the circle at a distance of 0.9R, that is, in the annular area at a distance of 0.85R to 0.95R from the center of the circle, a process similar to that in S441 is performed until a fourth number of exposure units are selected as the target exposure units.

[0049] S445: In the vicinity of the wafer center at a distance of (A-2a)*R, select the fifth number of exposure units as the target exposure unit.

[0050] For example, in the area near the center of the circle at a distance of 0.5R, that is, in the annular area at a distance of 0.45R to 0.55R from the center of the circle, a process similar to that in S441 is performed until a fifth number of exposure units is selected as the target exposure unit.

[0051] This process continues until a predetermined total number of exposure units are selected as the target exposure units.

[0052] S45: Generate target alignment information with absolute coordinates of the target alignment points using a script.

[0053] For example, a smart terminal can generate target alignment information that records the absolute coordinates of the target alignment points obtained in the above steps through a script.

[0054] Furthermore, in step S4 above, the distance between the target alignment point located in the outermost annular region and the center of the wafer is not greater than a preset maximum allowable distance threshold, in order to prevent the target alignment point from falling into the invalid edge region of the wafer. For example, this maximum allowable distance threshold can be 0.95R.

[0055] Furthermore, after step S4 above, the following processing may also be included: The script generates an exposure preview image in Excel format based on the target alignment information.

[0056] For example, an exposure preview image in Excel format can be as follows: Figure 4 As shown, it contains information such as the wafer outline, the position of all exposure units (represented by rectangles), and the position of the target alignment point, thus realizing the visualization of wafer exposure information and making it easy for engineers to view.

[0057] S5: Using a script, an XML-formatted exposure menu file is generated based on the parameter information required by the lithography equipment, the target alignment point arrangement information, and the preset XML-formatted exposure menu specification file.

[0058] For example, the smart terminal stores an exposure menu specification file in XML format provided by the lithography machine manufacturer, including tags, attributes, value ranges, and other information. The smart terminal can use a script to sequentially write the lithography equipment settings and target alignment point arrangement information obtained in the preceding steps into the exposure menu specification file in XML format according to predetermined rules and order, thereby obtaining an exposure menu file in XML format.

[0059] S6: Transmit the exposure menu file in XML format to the lithography equipment.

[0060] For example, the smart terminal transmits an XML-formatted exposure menu file to the lithography equipment, enabling the lithography equipment to directly generate an exposure menu based on the XML-formatted exposure menu file, thereby improving the efficiency and accuracy of exposure menu generation.

[0061] The method for creating an exposure menu for a lithography machine provided in this application involves obtaining a lithography process file, using a script to extract parameter information of the lithography equipment based on the lithography process file, and generating target alignment point arrangement information. Finally, an exposure menu file in XML format is obtained. After the exposure menu file in XML format is sent to the lithography equipment, the lithography equipment can automatically generate the final exposure menu, avoiding manual input by the staff and improving the generation efficiency and accuracy of the lithography machine exposure menu.

[0062] Reference Figure 5 This application also provides an apparatus for creating an exposure menu for a lithography machine, as described above. Figure 5 The apparatus for creating the exposure menu for this lithography machine includes: The data acquisition module is used to acquire photolithography process files.

[0063] The data verification module is used to verify the accuracy and completeness of the photolithography process file.

[0064] The script calling module is used to run loaded scripts and reset the parameters in those scripts.

[0065] The script execution module is used to process the lithography process file through the script, thereby extracting the parameter information of the lithography equipment and generating target alignment point arrangement information.

[0066] The script execution module is also used to generate an XML-formatted exposure menu file based on the setting parameters of the lithography equipment, the target alignment point arrangement information, and a preset XML-formatted exposure menu specification file.

[0067] The information sending module is used to transmit the exposure menu file in XML format to the lithography equipment.

[0068] refer to Figure 6 This application also provides an intelligent device, which includes a processor 610 and a memory 620.

[0069] Processor 610 may include one or more processing cores. Processor 610 connects various parts of the device using various interfaces and lines, and performs various functions and processes data by running or executing instructions, programs, code sets, or instruction sets stored in memory 620, and by calling data stored in memory 620. Optionally, processor 610 may be implemented using at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). Processor 610 may integrate one or more of a Central Processing Unit (CPU) and a modem. The CPU primarily handles operating devices and applications; the modem is used for wireless communication. It is understood that the modem may also not be integrated into processor 610 and may be implemented as a separate chip.

[0070] Optionally, when the processor 610 executes the program instructions in the memory 620, it implements the hybrid engine idle speed control method provided in the above-described method embodiments.

[0071] The memory 620 may include random access memory (RAM) or read-only memory. Optionally, the memory 620 may include a non-transitory computer-readable storage medium. The memory 620 may be used to store instructions, programs, code, code sets, or instruction sets. The memory 620 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing the device, instructions for at least one function, instructions for implementing the various method embodiments described above, etc.; the data storage area may store data created according to the use of the device, etc.

[0072] Optionally, this application also provides a storage medium storing at least one instruction, at least one program, code set, or instruction set, wherein the at least one instruction, the at least one program, the code set, or the instruction set is loaded and executed by the processor to implement the method for establishing the lithography machine exposure menu provided in the above method embodiments.

[0073] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this application.

Claims

1. A method for establishing an exposure menu for a lithography machine, characterized in that, include: S1: Obtain the photolithography process file; S2: Verify the accuracy and completeness of the photolithography process document; S3: Run the loaded script and reset the parameters in the script; S4: The lithography process file is processed by the script to extract the parameter information required to be set by the lithography equipment and generate the target alignment point arrangement information; S5: Using the script, based on the parameter information required to be set by the lithography equipment, the target alignment point arrangement information, and the preset XML format exposure menu specification file, an XML format exposure menu file is generated; S6: Transmit the exposure menu file in XML format to the lithography equipment.

2. The method for establishing the exposure menu of a lithography machine according to claim 1, characterized in that, The lithography process documents include a process manual recording lithography process parameters, an application form recording core information of the current batch of wafers, and lithography machine data.

3. The method for establishing the exposure menu of a lithography machine according to claim 2, characterized in that, The core information of the current batch of wafers includes wafer size, and the lithography machine data includes exposure unit size, chip size, dicing width, number of alignment points, and relative coordinates of the alignment points within the exposure unit. In step S4, the process of generating the site information includes: The script extracts wafer size, exposure unit size, chip size, dicing width, and alignment point number from the application form and lithography machine data. Using the script, an exposure unit distribution map is generated based on the wafer size, exposure unit size, chip size, and dicing width. The exposure unit distribution map contains a number of exposure units, and records the absolute coordinates of the center of each exposure unit relative to the center of the wafer. Using the script, based on the absolute coordinates of the center of each exposure unit relative to the wafer center and the relative coordinates of the alignment point within the exposure unit, the absolute coordinates of the alignment point in each exposure unit relative to the wafer center are obtained, and the distance between the alignment point and the wafer center is calculated. Using the script, a predetermined number of exposure units are selected as target exposure units within several annular regions on the wafer, and the alignment points in the target exposure units are used as target alignment points, wherein different annular regions do not overlap; The script generates target alignment information, which records the absolute coordinates of the target alignment points.

4. The method for establishing the exposure menu of a lithography machine according to claim 3, characterized in that, The step of selecting a predetermined number of exposure units as target exposure units within several annular regions on the wafer using the script includes: Within a region at a distance of A*R from the center of the wafer, a first number of exposure units are selected as target exposure units, where R is the wafer radius and A is a scaling factor. Within a region at a distance of (A+a)*R from the center of the wafer, a second number of exposure units are selected as target exposure units; Within a region at a distance of (Aa)*R from the center of the wafer, a third number of exposure units are selected as target exposure units; Within a region at a distance of (A+2a)*R from the center of the wafer, a fourth number of exposure units are selected as the target exposure units; Within a region at a distance of (A-2a)*R from the center of the wafer, a fifth number of exposure units are selected as the target exposure unit; This process continues until a predetermined total number of exposure units are selected as the target exposure units.

5. The method for establishing the exposure menu of a lithography machine according to claim 4, characterized in that, The nearby area refers to an annular area within ±0.5a*R of the corresponding radius ratio, where the corresponding radius ratios are A*R, (A+a)*R, (Aa)*R, (A+2a)*R, and (A-2a)*R, respectively.

6. The method for establishing the exposure menu of a lithography machine according to any one of claims 4 to 5, characterized in that, The distance between the outermost target alignment point and the center of the wafer is not greater than a preset maximum allowable distance threshold.

7. The method for establishing the exposure menu of a lithography machine according to claim 3, characterized in that, Also includes: The script generates an exposure preview image in Excel format based on the target alignment information.

8. A device for creating an exposure menu for a lithography machine, characterized in that, include: The data acquisition module is used to acquire photolithography process files; The data verification module is used to verify the accuracy and completeness of the photolithography process document; The script calling module is used to run the loaded script and reset the parameters in the script; The script execution module is used to process the lithography process file through the script, thereby extracting the parameter information of the lithography equipment and generating target alignment point arrangement information; The script execution module is also used to generate an XML-formatted exposure menu file based on the setting parameters of the lithography equipment, the target alignment point arrangement information, and a preset XML-formatted exposure menu specification file. The information sending module is used to transmit the exposure menu file in XML format to the lithography equipment.

9. A smart device, characterized in that, The smart device includes a processor and a memory, the memory storing a computer program, and the processor executing the computer program to implement the method of any one of claims 1 to 7.

10. A storage medium storing a program that, when executed by a processor, implements the method as described in any one of claims 1-7.

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