Lead frame and chip structure packaging method

Abstract

The invention relates to the field of semiconductor packaging, and provides a lead frame and a chip structure packaging method. Comprising an outer frame; the first pin is connected with the outer frame; the supporting rod is connected with the first pin and the outer frame in a crossed manner; wherein the first pin comprises a first pin connecting part, a first pin inner side part and a first pin outer side part, the first pin inner side part and the first pin outer side part are respectively connected with two ends of the first pin connecting part, and one end, far away from the first pin connecting part, of the first pin outer side part is connected with the outer frame; the supporting rod is connected with the first pin connecting part so as to be connected with the first pin in a crossed manner; the inner side part of the first pin is provided with a bending area used for bending, and the inner side part of the first pin is provided with a widened part which at least extends from the bending area to the supporting rod. By using the lead frame provided by the invention, not only can the excessive glue be removed, but also more cost can be saved and the preparation period can be shortened.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging, and discloses a lead frame and a chip structure packaging method. BACKGROUND

[0002] Some device products produce overflow glue extending to the support rod after plastic packaging, and the design of the bending point of some product leads is inside the support rod, and the overflow glue is left on the side of the bending foot, but the overflow glue is generally not allowed to extend beyond the bending point, so an additional laser delamination process on the side is needed to remove the overflow glue on the side, which increases the additional cost and preparation period. SUMMARY

[0003] The present application aims to solve the problem that some device products cannot make the overflow glue extend beyond the support rod after plastic packaging, which increases the additional cost and preparation period, and provides a lead frame and a chip structure packaging method. In order to achieve the above-mentioned purpose, the present application provides a lead frame, comprising: an outer frame; a first lead connected with the outer frame; a support rod cross-connecting the first lead and the outer frame; wherein the first lead comprises a first lead connecting part and a first lead inner side part and a first lead outer side part connected with both ends of the first lead connecting part respectively, one end of the first lead inner side part away from the first lead connecting part is used for connecting a chip structure, and one end of the first lead outer side part away from the first lead connecting part is connected with the outer frame; the support rod connects the first lead connecting part so as to cross-connect the first lead; the first lead inner side part has a bending area for bending, and the first lead inner side part has a widened part extending from the bending area to the support rod.

[0004] As an implementable manner, the bending area is located in the side area of the first lead inner side part close to the first lead connecting part, the widened part is located in the side area of the first lead inner side part close to the first lead connecting part, the width of the first lead outer side part and the side area of the first lead inner side part away from the first lead connecting part is the same, and the length of the area of the first lead inner side part with the widened part is greater than the length of other areas of the first lead inner side part.

[0005] As an implementable manner, one end of the first lead inner side part away from the first lead connecting part has a first chip structure connecting part, and the first chip structure connecting part is used for connecting a chip structure through a lead.

[0006] As an implementation, the outer frame is a hollow metal sheet, the outer frame comprises a pair of horizontal beams and a pair of vertical beams, the first pin is connected with the corresponding horizontal beam, and the support rod is connected with the pair of vertical beams.

[0007] As an implementation, the first pin is parallel to the vertical beam, the support rod is parallel to the horizontal beam, and the first pin and the support rod are perpendicular to each other.

[0008] As an implementation, the first pin is at least one, and when the first pin is a plurality of pins, the plurality of first pins are arranged in at least one row.

[0009] As an implementation, the outer frame, the first pin and the support rod are integrally formed.

[0010] As an implementation, the outer frame, the first pin and the support rod are integrally formed. At least two second pins are connected to the outer frame. The second pin comprises a second pin connecting portion, a second pin inner side portion and a second pin outer side portion connected to both ends of the second pin connecting portion, respectively; the end of the second pin inner side portion away from the second pin connecting portion is used for connecting the chip structure, and the end of the second pin outer side portion away from the second pin connecting portion is connected with the outer frame; the support rod is connected to the second pin connecting portion so as to cross-connect the second pin, and the widths of the second pin outer side portion and the first pin inner side portion are the same.

[0011] As an implementation, the end of the second pin inner side portion away from the second pin connecting portion has a second chip structure connecting portion, and the second chip structure connecting portion is used for directly connecting with the chip structure, so as to fix the chip structure.

[0012] As an implementation, the second pin is at least two, the second pin is arranged in two opposite rows, and at least one of the second pins is arranged in parallel with at least one of the first pins.

[0013] The application further provides a chip structure packaging method, comprising: providing the lead frame as described above; arranging the chip structure on the lead frame; connecting the chip structure with the end of the first pin inner side portion away from the first pin connecting portion by using a lead; encapsulating the chip structure, the lead and the end of the first pin inner side portion away from the first pin connecting portion by using encapsulating material, and exposing the first pin inner side portion with the widened portion; remove the outer frame and the support bar, and remove the widened portion of the inner side of the first pin, thereby removing the excess glue.

[0014] As an implementation, the step of removing the outer frame and the support bar further comprises: bending the bending area of the inner side of the first pin.

[0015] As an implementation, the removing of the outer frame, the support bar and the widened portion of the inner side of the first pin connecting the side area of the first pin connecting portion are completed in the same process.

[0016] As an implementation, when the lead frame further comprises at least two second pins connecting the outer frame, the second pin comprises a second pin connecting portion and a second pin inner side and a second pin outer side respectively connecting both ends of the second pin connecting portion; the end of the second pin inner side away from the second pin connecting portion is used to connect the chip structure, and the end of the second pin outer side away from the second pin connecting portion is connected with the outer frame; the support bar connects the second pin connecting portion so as to cross-connect the second pin, and when the width of the second pin outer side and the first pin inner side is the same, the chip structure arranged on the lead frame comprises: arranging the chip structure at the end of the second pin inner side away from the second pin connecting portion, so that the end of the second pin inner side away from the second pin connecting portion and the chip structure are directly connected, thereby fixing the chip structure through the second pin inner side.

[0017] As an implementation, when the chip structure comprises a chip, the end of the first pin inner side away from the first pin connecting portion is connected with the lead wire and the chip.

[0018] As an implementation, when the chip structure comprises a chip and a substrate, the chip is located on the front surface of the substrate, and the end of the first pin inner side away from the first pin connecting portion is sequentially connected with the lead wire, the substrate and the chip.

[0019] As an implementation, the chip is at least one, and at least one chip is located on the front surface of the substrate.

[0020] As an implementation, the substrate is a ceramic substrate.

[0021] As an implementation, the ceramic substrate is a ceramic copper-clad plate.

[0022] The first pin inner side of the support rod is widened, and the widened protruding part on both sides of the first pin inner side is removed in the subsequent support rod removal process, so that the side edges of the pin are completely free of overflow glue. Therefore, additional laser degreasing process is not needed to remove the side overflow glue, which can save more cost and reduce the preparation period. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 A structure diagram of a lead frame 1 according to some embodiments of the present application is shown. Figure 2 A structure effect diagram of a part of a plastic package 60 of the lead frame 1 according to some embodiments of the present application is shown. Figure 3 A structure diagram of a lead frame 2 according to some embodiments of the present application is shown. Figure 2 A structure diagram of a part of the lead frame 2 for removing the overflow glue 50 is shown. Figure 4 A structure diagram of a lead frame 2 according to some embodiments of the present application is shown. Figure 5 A structure effect diagram of a part of a plastic package 60 of the lead frame 2 according to some embodiments of the present application is shown. Figure 6 A step flow chart of a chip structure packaging method according to some embodiments of the present application is shown. Figure 7 A structure diagram of the lead frame 2 after removing the outer frame 10, the support rod 30 and the widened part 224 is shown. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the protection scope of the present application.

[0025] It should be understood that, as used herein, terms such as "first", "second", and the like, describe various elements, components, regions, layers and / or sections and do not connote an order or a ranking of importance, unless the content clearly dictates otherwise. Spatially relative terms, such as "top", "bottom", "front", "back", "side", "upper", "lower", "horizontal", "vertical", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures.

[0026] In the present application, unless otherwise explicitly specified and limited, the terms "connected", "connection" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms is not necessarily for the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or features of the embodiments or examples described in the present application without contradiction. It should be noted that the terms "include" and "have" and their variants involved in the present application are intended to cover non-exclusive inclusion.

[0028] In some embodiments, referring to Figure 1 , a lead frame 1 is provided, comprising: an outer frame 10; at least one first pin 210 connected with the outer frame 10; a support rod 30 cross-connecting the first pin 210 and the outer frame 10. The first pin 210 comprises a first pin connecting portion 212 and a first pin inner side portion 213 and a first pin outer side portion 211 connected with both ends of the first pin connecting portion respectively. The first pin inner side portion 213 is used to connect a chip structure 80, such as Figure 1As shown in the position diagram of the chip structure 80, the plastic package 60 and the lead 90, in some embodiments, the chip structure 80 can include a substrate 81 and a chip 82 located on the front of the substrate 81, the front of the substrate 81 and the first lead inner side 213 far from one end of the first lead connecting part 212 are connected by the lead 90, and the front of the substrate 81 and the surface of the chip 82 are connected by the lead 90; wherein the width of the first lead inner side 213 and the first lead outer side 211 is the same, the support rod 30 can also be called a glue blocking rod, and the glue blocking rod is formed by filling plastic packaging material Figure 2 After the plastic package 60 is shown, the surface of the first lead inner side 213 will form overflow glue 50, but in some embodiments, the first lead inner side 213 also has a bending area 201 for bending, and the bending area 201 of the first lead inner side 213 will be bent to form a bent lead in the subsequent bending operation, and the quality requirement generally requires that the overflow glue 50 does not exceed the bending area 201, so as to prevent the overflow glue 50 from exceeding the bending area, see Figure 3 Generally, the laser glue removal process of the glue removal machine 100 is used to remove the overflow glue on the side, but the additional laser glue removal process increases the additional cost and preparation period.

[0029] Therefore, in order to solve the above problems, see Figure 4 Some embodiments of the present application provide a lead frame 2, comprising: an outer frame 10; a first lead 220 connected with the outer frame 10; a support rod 30 cross-connecting the first lead 220 and the outer frame 10; wherein the first lead 220 comprises a first lead connecting part 222 and a first lead inner side 223 and a first lead outer side 221 connected with both ends of the first lead connecting part 222 respectively, the first lead inner side 223 far from one end of the first lead connecting part 222 is used to connect the chip structure 80, and the first lead outer side 221 far from one end of the first lead connecting part 222 is connected with the outer frame 10; the support rod 30 connects the first lead connecting part 222 so as to cross-connect the first lead 220; the first lead inner side 223 has a bending area 201 for bending, and the first lead inner side 223 has a widened part 224 extending from the bending area 201 to the support rod 30 for widening treatment.

[0030] In some embodiments, see Figure 4 The outer frame 10 is a hollow metal sheet. In some embodiments, the material of the first lead 220 and the support plate 30 is metal. The metal can be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold and silver.

[0031] In some embodiments, seeFigure 4 The outer frame 10 includes a pair of horizontal beams 11 and a pair of vertical beams 12, the first pin 220 is connected to the corresponding horizontal beam 11, and the support rod 30 is connected to the pair of vertical beams 12. In some embodiments, the first pin 220 is parallel to the vertical beam 12, the support rod 30 is parallel to the horizontal beam 11, and the first pin 220 and the support rod 30 are perpendicular to each other.

[0032] In some embodiments, referring to Figure 4 The first pin 220 is at least one, and when the first pin 220 is a plurality, the plurality of first pins 220 are arranged in at least one row. For example, referring to Figure 4 The plurality of first pins 220 are spaced and arranged in parallel. In some embodiments, the first pin 220 can be a control pin or other pin type in which the first pin inner side portion 223 is inside the first pin.

[0033] In some embodiments, referring to Figure 4 The outer frame 10, the first pin 220, and the support rod 30 are integrally formed.

[0034] In some embodiments, referring to Figure 4 The first chip structure connecting portion 225 is used to connect the chip structure 80 through the lead 90.

[0035] In some embodiments, as Figure 4 The position of the chip structure 80, the plastic package 60, and the lead 90 is shown. In some embodiments, the chip structure 80 includes a chip 82, and the first pin inner side portion 223 away from the first pin connecting portion 222 can be electrically connected to the chip 82 through the lead 90. In some embodiments, the chip structure 80 includes a chip 82 and a substrate 81, the chip 82 is located on the front surface of the substrate 81, and the first pin inner side portion 223 away from the first pin connecting portion 222 is electrically connected in sequence through the lead 90, the substrate 81, and the chip 82. However, in other embodiments, when the chip structure 80 includes a chip 82 and a substrate 81, the first pin inner side portion 223 away from the first pin connecting portion 222 can also be connected through the lead 90 and the chip on the substrate 81. In some embodiments, when the chip structure 80 includes a chip 82 and a substrate 81, the chip 82 can be at least one, and at least one chip 82 is located on the front surface of the substrate 81.

[0036] In some embodiments, referring to Figure 4The chip 82 can include a power chip, a logic chip, or a memory chip. In some embodiments, the logic chip can include a gate array, a cell substrate array, an embedded array, a structured application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a complex programmable logic device (CPLD), a central processing unit (CPU), a micro processing unit (MPU), a micro controller unit (MCU), a logic integrated circuit (IC), an application processor (AP), a display driver IC (DDI), a radio frequency (RF) chip, a power chip, or a complementary metal oxide semiconductor (CMOS) image sensor. In some embodiments, the memory chip can include a volatile memory chip such as a dynamic random access memory (DRAM) or a static RAM (SRAM), or a non-volatile memory chip such as a flash memory, a phase change RAM (PRAM), a magnetoresistive RAM (MRAM), a ferroelectric RAM (FeRAM), or a resistive RAM (ReRAM). In a specific embodiment, the memory chip can include a high bandwidth memory (HBM) including a DRAM chip.

[0037] In some embodiments, referring to Figure 4 The substrate 81 is a ceramic substrate. In some embodiments, the ceramic substrate is a ceramic copper clad plate, and the chip is located on the front side of the ceramic copper clad plate. The back side of the ceramic copper clad plate can be used for heat dissipation of the chip. In some embodiments, the ceramic material of the ceramic copper clad plate can be alumina, aluminum nitride, silicon nitride, sapphire, or silicon carbide, etc. In other embodiments, the substrate can be a rigid substrate or a flexible substrate.

[0038] In some embodiments, referring to Figure 4 For a partial area structure effect diagram of the plastic package 60 after plastic packaging, the bending area 201 is located at one side area of the first pin inner side 223 close to the first pin connecting part 222, and the widened part 225 is located at one side area of the first pin inner side 223 close to the first pin connecting part 222. The width of the first pin outer side 221 and the first pin inner side 223 away from the first pin connecting part 222 is the same, and the length of the area of the first pin inner side 223 with the widened part 224 is greater than the length of other areas of the first pin inner side 223.

[0039] In some embodiments, the first pin inner side 223 inside the support rod 30 is widened, as shown in Figure 5As shown, although the widened portion 224 of the first lead inner side portion 223 has excess glue outside, the widened portion 224 of the first lead inner side portion 223 on both sides can be removed together in the subsequent support rod 30 removal process, so as to remove the excess glue. In some embodiments, the first lead inner side portion 223 can be provided with the widened portion 224 which is widened at least from the bending area 201 to the support rod 30, so that the excess glue on the side of the bending area 201 extending to the support rod 30 can be removed. In some embodiments, the length of the widened portion 224 can be set to achieve the effect of no excess glue on the first lead inner side portion.

[0040] In some embodiments, referring to Figure 5 , the lead frame 2 further comprises at least two second leads 40 connected to the outer frame 10; wherein the second lead 40 comprises a second lead connecting portion 42, and a second lead inner side portion 43 and a second lead outer side portion 41 connected to both ends of the second lead connecting portion 42 respectively; the end of the second lead inner side portion 43 away from the second lead connecting portion 42 is used to connect the chip structure 80, and the end of the second lead outer side portion 41 away from the second lead connecting portion 42 is connected to the outer frame 10; the support rod 30 is connected to the second lead connecting portion 42 so as to cross-connect the second lead 40, and the width of the second lead outer side portion 41 is the same as that of the first lead inner side portion 43.

[0041] In some embodiments, referring to Figure 4 , the material of the second lead 40 is metal, and the metal can be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver. In some embodiments, the second lead 40 and the outer frame 10, the first lead 220, and the support rod 30 are integrally formed. In some embodiments, the second lead 40 can be a power lead. In some embodiments, the bending area of the second lead 40 is located in the second lead outer side portion 41 or does not need to be bent after plastic packaging, so that the first lead inner side portion 43 does not need to be widened.

[0042] In some embodiments, when the chip structure 80 comprises a chip 82, the end of the second lead inner side portion 43 away from the second lead connecting portion 42 can be directly connected to the chip 82, so as to fix the chip structure 80. In some embodiments, referring to Figure 4When the chip structure 80 comprises a chip 82 and a substrate 81, the chip 82 is located on the front side of the substrate 81, and the second pin inner side part 43 can be directly connected to the substrate 81 at the end away from the second pin connecting part 42, thereby fixing the chip structure 80. In some embodiments, the upper surface of the chip structure 80 can be directly connected to the lower surface of the second pin inner side part 43. In some embodiments, the lower surface of the chip structure 80 can be directly connected to the upper surface of the second pin inner side part 43.

[0043] In some embodiments, referring to Figure 4 , the end of the second pin inner side part 43 away from the second pin connecting part 42 has a second chip structure connecting part 44 for directly connecting to the chip structure 80, thereby fixing the chip structure 80.

[0044] In some embodiments, referring to Figure 4 , the second pins 40 are at least two, and the second pins 40 are arranged in two opposite rows, and at least one of the second pins 40 is arranged in parallel with at least one of the first pins 220. For example, one second pin 40 and a plurality of first pins 220 are arranged in parallel in a row and are connected to one of the horizontal beams 11 of the outer frame 10, and a plurality of second pins 40 are arranged in parallel in a row and are connected to another horizontal beam 11 of the outer frame 10.

[0045] In some embodiments, referring to Figure 4 , the width of the second pin 40 is greater than the width of the first pin 220. In some embodiments, the second pin 40 is parallel to the vertical beam, and the second pin 40 is perpendicular to the support rod 30.

[0046] In some embodiments, referring to Figure 4 , a chip structure packaging method is also provided, comprising: Referring to step S10, the lead frame 2 is provided; wherein, referring to Figure 6, the lead frame 2 comprises: an outer frame 10; a first pin 220 connected with the outer frame 10; a support rod 30 cross-connecting the first pin 220 and the outer frame 10; wherein the first pin 220 comprises a first pin connecting portion 222 and a first pin inner side portion 223 and a first pin outer side portion 221 connected with both ends of the first pin connecting portion 222 respectively, the first pin inner side portion 223 is used for connecting a chip structure 80 away from one end of the first pin connecting portion 222, and the first pin outer side portion 221 is connected with the outer frame 10 away from one end of the first pin connecting portion 222; the support rod 30 connects the first pin connecting portion 222 so as to cross-connect the first pin 220; the first pin inner side portion 223 has a bending area 201 for bending, and the first pin inner side portion 223 has a widened portion 224 widened at least from the bending area 201 to the support rod 30.

[0047] In some embodiments, referring to Figure 4 , the outer frame 10 is a hollow metal sheet. In some embodiments, the material of the first pin 220 and the support rod 30 is metal. The metal can be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver.

[0048] In some embodiments, referring to Figure 4 , the outer frame 10 comprises a pair of cross beams 11 and a pair of vertical beams 12, the first pin 220 is connected with the corresponding cross beam 11, and the support rod 30 is connected with the pair of vertical beams 12. In some embodiments, the first pin 220 is parallel to the vertical beam 12, the support rod 30 is parallel to the cross beam 11, and the first pin 220 and the support rod 30 are perpendicular to each other.

[0049] In some embodiments, referring to Figure 4 , the first pin 220 is at least one, and when the first pin 220 is a plurality, the plurality of first pins 220 are arranged in at least one row. For example, referring to Figure 4 , the plurality of first pins 220 are spaced and arranged in parallel. In some embodiments, the first pin 220 can be a control pin or other types of pins in the first pin inner side portion 223.

[0050] In some embodiments, referring to Figure 4 , the outer frame 10, the first pin 220, and the support rod 30 are integrally formed.

[0051] In some embodiments, referring to Figure 4The first pin inner portion 223 has a first chip structure connecting portion 225 at the end away from the first pin connecting portion 222, which is used to connect the chip structure 80 through a lead.

[0052] In some embodiments, referring to Figure 4 The lead frame 20 further comprises at least two second pins 40 connected to the outer frame 10, wherein the second pin 40 comprises a second pin connecting portion 42 and a second pin inner portion 43 and a second pin outer portion 41 connected to both ends of the second pin connecting portion 42 respectively; the end of the second pin inner portion 43 away from the second pin connecting portion 42 is used to connect the chip structure 80, and the end of the second pin outer portion 41 away from the second pin connecting portion 42 is connected to the outer frame 10; the support rod 30 is connected to the second pin connecting portion 42 so as to cross-connect the second pin 40, and the width of the second pin outer portion 41 and the first pin inner portion 43 is the same.

[0053] In some embodiments, referring to Figure 4 The second pin 40 is made of metal, which can be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver. In some embodiments, the second pin 40 is integrally formed with the outer frame 10, the first pin 220, and the support rod 30. In some embodiments, the second pin 40 can be a power pin. In some embodiments, the second pin 40 has a bending region at the second pin outer portion 41 or does not need to be bent after plastic packaging, so the second pin inner portion 43 does not need to be widened.

[0054] In some embodiments, referring to Figure 4 The end of the second pin inner portion 43 away from the second pin connecting portion 42 has a second chip structure connecting portion 44, which is used to directly connect the chip structure 80, thereby fixing the chip structure 80.

[0055] In some embodiments, referring to Figure 4 The second pin 40 is at least two, and the second pins 40 are arranged in two opposite rows, and at least one of the second pins 40 and at least one of the first pins 220 are arranged in parallel. For example, referring to Figure 4 One second pin 40 and a plurality of first pins 220 are arranged in parallel in a row and are connected to one of the cross beams 11 of the outer frame 10, and a plurality of second pins 40 are arranged in parallel in a row and are connected to another cross beam 11 of the outer frame 10.

[0056] In some embodiments, referring to Figure 4 , the second pin 40 has a width greater than that of the first pin 220. In some embodiments, the second pin 40 is parallel to the vertical beam, and the second pin 40 and the support rod 30 are perpendicular to each other.

[0057] Referring to step S20, a chip structure 80 is disposed on the lead frame 2, and the chip structure 80 is close to the first pin inner side 223 away from the first pin connecting portion 222. In some embodiments, the chip structure 80 includes a chip 82. In some embodiments, referring to Figure 4 , the chip structure 80 includes a chip 82 and a substrate 81, and the chip 82 is located on the front surface of the substrate 81.

[0058] In some embodiments, referring to Figure 4 , the chip 82 can include a power chip, a logic chip, or a memory chip. In some embodiments, the logic chip can include a gate array, a cell base array, an embedded array, a structured application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a complex programmable logic device (CPLD), a central processing unit (CPU), a micro processing unit (MPU), a micro controller unit (MCU), a logic integrated circuit (IC), an application processor (AP), a display driver IC (DDI), a radio frequency (RF) chip, a power chip, or a complementary metal oxide semiconductor (CMOS) image sensor. In some embodiments, the memory chip can include a volatile memory chip (such as a dynamic random access memory (DRAM) or a static RAM (SRAM)) or a non-volatile memory chip (such as a flash memory, a phase change RAM (PRAM), a magnetoresistive RAM (MRAM), a ferroelectric RAM (FeRAM), or a resistive RAM (ReRAM)). In a specific embodiment, the memory chip can include a high bandwidth memory (HBM) including a DRAM chip.

[0059] In some embodiments, referring to Figure 4 , the substrate 81 is a ceramic substrate. In some embodiments, the ceramic substrate is a ceramic copper clad plate, and the chip is located on the front surface of the ceramic copper clad plate, and the back surface of the ceramic copper clad plate can be used for heat dissipation of the chip. In some embodiments, the ceramic material of the ceramic copper clad plate can be alumina, aluminum nitride, silicon nitride, sapphire, or silicon carbide, etc. However, in other embodiments, the substrate can be a hard substrate or a flexible substrate.

[0060] In some embodiments, when the leadframe 2 further comprises a second pin 40, disposing the chip structure 80 on the leadframe 2 comprises: disposing the chip structure 80 inside the second pin inner side 43 away from the second pin connecting part 42, so that the end of the second pin inner side 43 away from the second pin connecting part 42 is directly connected with the chip structure 80, thereby fixing the chip structure 80 through the second pin inner side 43. In some embodiments, when the chip structure 80 comprises a chip 82, the end of the second pin inner side 43 away from the second pin connecting part 42 can be directly connected with the chip 82, thereby fixing the chip structure 80. In some embodiments, when the chip structure 80 comprises a chip 82 and a substrate 81, the chip 82 is located on the front side of the substrate 81, the end of the second pin inner side 43 away from the second pin connecting part 42 can be directly connected with the substrate 81, thereby fixing the chip structure 80. In some embodiments, the upper surface of the chip structure 80 can be directly connected with the lower surface of the second pin inner side 43. In some embodiments, the lower surface of the chip structure 80 can be directly connected with the upper surface of the second pin inner side 43.

[0061] Referring to step S30, the chip structure 80 is connected with the end of the first pin inner side 223 away from the first pin connecting part 222 using a lead 90; In some embodiments, as Figure 5As shown in the position diagram of the chip structure 80 and the lead 90, in some embodiments, the chip structure 80 comprises a chip 82; connecting the chip structure 80 and the first lead inner side 223 away from one end of the first lead connecting part 222 using the lead 90 comprises connecting the first lead inner side 223 away from one end of the first lead connecting part 222 and the surface of the chip 82 using the lead 90, so that one end of the first lead inner side 223 away from the first lead connecting part 222 can be electrically connected through the lead 90 and the chip 82. In some embodiments, the chip structure 80 comprises a chip 82 and a substrate 81, and the chip 82 is located on the front surface of the substrate 81; connecting the chip structure 80 and the first lead inner side 223 away from one end of the first lead connecting part 222 using the lead 90 comprises connecting the first lead inner side 223 away from one end of the first lead connecting part 222 and the front surface of the substrate 81 using the lead 90, connecting the front surface of the substrate 81 and the surface of the chip 82 using the lead 90, so that one end of the first lead inner side 223 away from the first lead connecting part 222 is electrically connected in sequence through the lead 90, the substrate 81, the lead 90 and the chip 82. However, in other embodiments, when the chip structure 80 comprises a chip 82 and a substrate 81, the lead 90 can also be used to connect the first lead inner side 223 away from one end of the first lead connecting part 222 and the surface of the chip 82. In some embodiments, when the chip structure 80 comprises a chip 82 and a substrate 81, the chip 82 can be at least one, and at least one chip 82 is located on the front surface of the substrate 81.

[0062] In some embodiments, the material of the lead 90 is metal, which can be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver.

[0063] Referring to step S40, as Figure 7 As shown in the position diagram of the plastic package 60, the chip structure 80, the lead 90 and one end of the first lead inner side 223 away from the first lead connecting part 222 are plasticized using plastic material, and the first lead inner side 223 with the widened part 224 is exposed; thereby forming the plastic package 60 as shown in Figure 7 .

[0064] In some embodiments, the plastic material can be epoxy resin, polyimide resin, benzocyclobutene resin or polybenzoxazole resin, etc., and the forming process can be injection molding process or transfer molding process.

[0065] In some embodiments, after molding, a portion of the inner side 223 of the first pin without the widened portion 224 is also exposed, so that there is still a certain gap between the widened portion 224 and the molding body 60, which is more conducive to removing the widened portion 224.

[0066] In some embodiments, when the lead frame further includes a second pin 40, the process of encapsulating the chip structure 80, the lead 90, and the end of the inner side portion 223 of the first pin away from the first pin connection portion 222 using a molding compound further includes: encapsulating the chip structure 80, the lead 90, and the end of the inner side portion 43 of the second pin away from the second pin connection portion 42 using a molding compound.

[0067] Referring to step S50, the outer frame 10 and support rod 30 are removed, and the widened portion 224 of the inner side 223 of the first pin is removed, for example, see Figure 7 (a) in the figure refers to the punched area 70 where the outer frame 10, the support rod 30, and the widened portion 224 are removed. By punching the punched area 70, the following is obtained: Figure 5 The structure shown in (b) is used to remove excess adhesive. In some embodiments, the structure is then... ​ The bending area 201 shown in (b) is bent.

[0068] In some embodiments, the inner side portion 223 of the first pin inside the support rod 30 is widened, such as... ​ As shown, although there is still excess adhesive on the outer side of the widened portion 224 of the inner side 223 of the first pin, the widened protruding portions 224 on both sides of the inner side 223 of the first pin can be removed together in the subsequent process of removing the support rod 30, thereby removing the excess adhesive. In some embodiments, the inner side 223 of the first pin can be configured to have a widened portion 224 that extends at least from the bending region 201 to the support rod 30, so that at least the excess adhesive on the side of the bending region 201 extending to the support rod 30 can be removed. In some embodiments, the length of the widened portion 224 can also be set to achieve the effect of no excess adhesive on the inner side of the first pin.

[0069] In some embodiments, removing the outer frame 10 and support rod 30 and removing the widened portion 224 of the region where the inner side portion 223 of the first pin connects to the side portion 222 of the first pin are completed in the same process.

[0070] Although the present application has been disclosed with reference to the preferred embodiments, it is not intended to limit the present application, and any person skilled in the art can make possible changes and modifications to the technical solutions of the present application by using the disclosed methods and technical contents without departing from the spirit and scope of the present application. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application without departing from the technical solutions of the present application shall fall within the protection scope of the technical solutions of the present application.

Claims

1. A lead frame, characterized in that, include: outer frame; The first pin connected to the outer frame; A support rod that cross-connects the first pin and the outer frame; The first pin includes a first pin connection portion and a first pin inner portion and a first pin outer portion respectively connecting the two ends of the first pin connection portion. The end of the first pin inner portion away from the first pin connection portion is used to connect to the chip structure, and the end of the first pin outer portion away from the first pin connection portion is connected to the outer frame. The support rod connects to the first pin connection portion to cross-connect the first pin. The first pin inner portion has a bending area for bending, and the first pin inner portion has a widened portion extending at least from the bending area to the support rod.

2. The lead frame according to claim 1, characterized in that, The bending area is located on the inner side of the first pin near the first pin connection portion. The widened portion is located on the inner side of the first pin near the first pin connection portion. The outer side of the first pin and the inner side of the first pin away from the first pin connection portion have the same width. The length of the area with the widened portion on the inner side of the first pin is greater than the length of other areas on the inner side of the first pin.

3. The lead frame according to claim 1, characterized in that, The inner side of the first pin, away from the first pin connection portion, has a first chip structure connection portion, which is used to connect the chip structure via a lead.

4. The lead frame according to claim 1, characterized in that, The outer frame is a hollow metal sheet, and the outer frame includes a pair of horizontal beams and a pair of vertical beams. The first pin is connected to the corresponding horizontal beam, and the support rod is connected to the pair of vertical beams.

5. The lead frame according to claim 4, characterized in that, The first pin is parallel to the vertical beam, the support rod is parallel to the horizontal beam, and the first pin and the support rod are perpendicular to each other.

6. The lead frame according to claim 1, characterized in that, The first pin is at least one, and when there are multiple first pins, the multiple first pin arrays are arranged in at least one row.

7. The lead frame according to claim 1, characterized in that, The outer frame, the first pin, and the support rod are integrally formed.

8. The lead frame according to claim 1, characterized in that, Also includes: At least two second pins are connected to the outer frame; The second pin includes a second pin connection portion and an inner part and an outer part of the second pin respectively connecting the two ends of the second pin connection portion; the end of the inner part of the second pin away from the second pin connection portion is used to connect the chip structure, and the end of the outer part of the second pin away from the second pin connection portion is connected to the outer frame; the support rod connects the second pin connection portion to cross-connect the second pin, and the outer part of the second pin and the inner part of the first pin have the same width.

9. The lead frame according to claim 8, characterized in that, The inner side of the second pin away from the second pin connection portion has a second chip structure connection portion, which is used to directly connect with the chip structure to fix the chip structure.

10. The lead frame according to claim 8, characterized in that, The second pin is at least two, arranged in two opposite rows, and at least one second pin and at least one first pin are arranged in parallel.

11. A chip structure packaging method, characterized in that, include: Provide a lead frame as described in any one of claims 1-10; The chip structure is placed on the lead frame; Use a lead wire to connect the chip structure to the end of the inner side of the first pin that is away from the first pin connection portion; The chip structure, the leads, and the end of the inner side of the first pin away from the first pin connection portion are encapsulated using molding compound, exposing the inner side of the first pin with a widened portion. Remove the outer frame and support rod, and remove the widened portion inside the first pin to remove excess adhesive.

12. The chip structure packaging method according to claim 11, characterized in that, After removing the outer frame and support rods, the process further includes: The bending area on the inner side of the first pin is bent.

13. The chip structure packaging method according to claim 11, characterized in that, Removing the outer frame, the support rod, and the widened portion of the area connecting the inner side of the first pin to the first pin connection portion are all completed in the same process.

14. The chip structure packaging method according to claim 11, characterized in that, When the lead frame further includes at least two second pins connecting the outer frame, each second pin includes a second pin connecting portion and an inner and outer portion of the second pin respectively connecting both ends of the second pin connecting portion; the end of the inner portion of the second pin away from the second pin connecting portion is used to connect the chip structure, and the end of the outer portion of the second pin away from the second pin connecting portion is connected to the outer frame; the support rod connects the second pin connecting portion to cross-connect the second pins, and the widths of the outer portion of the second pin and the inner portion of the first pin are the same, placing the chip structure on the lead frame includes: The chip structure is located on the inner side of the second pin, away from the connection part of the second pin, so that the inner side of the second pin and the chip structure are directly connected, thereby fixing the chip structure through the inner side of the second pin.

15. The chip structure packaging method according to claim 11, characterized in that, When the chip structure includes a chip; connecting the chip structure and the end of the inner side of the first pin away from the first pin connection portion using a lead includes connecting the end of the inner side of the first pin away from the first pin connection portion to the chip surface using a lead.

16. The chip structure packaging method according to claim 11, characterized in that, When the chip structure includes a chip and a substrate, and the chip is located on the front side of the substrate; connecting the chip structure and the end of the inner side of the first pin away from the first pin connection portion using leads includes: connecting the end of the inner side of the first pin away from the first pin connection portion to the front side of the substrate using leads, and connecting the front side of the substrate to the chip surface using leads.

17. The chip structure packaging method according to claim 16, characterized in that, The chip is at least one, and at least one chip is located on the front side of the substrate.

18. The chip structure packaging method according to claim 16, characterized in that, The substrate is a ceramic substrate.

19. The chip structure packaging method according to claim 18, characterized in that, The ceramic substrate is a copper-clad ceramic plate.

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