Display panel and display device

Abstract

The embodiment of the invention provides a display panel and a display device. The display panel comprises a first area and a second area, and the second area is located on the side, close to the edge of the display panel, of the first area; a light-emitting layer in the display panel comprises a plurality of insulating layers, a first area comprises a part of the insulating layers, and a second area does not comprise a part of the insulating layers; the first organic packaging layer is located on one side of the light-emitting layer and packages a light-emitting device in the light-emitting layer, and the light shielding layer is located on one side, away from the light-emitting layer, of the first organic packaging layer and comprises a plurality of hollow parts exposing the light-emitting device; a first edge adjacent to the second region in the first organic encapsulation layer is located on a side of a boundary of the first region and the second region away from the second region. According to the embodiment of the invention, a redundant space is equivalently arranged between the edge of the first organic packaging layer and the boundary of the first region and the second region, so that the light shielding layer cannot overflow to the second region, or the light shielding layer overflowing to the second region is relatively thin in thickness, relatively small in area and convenient to remove.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0002] In order to avoid the light emitting device in the display panel from being damaged by external force or pollutants in subsequent processes, it is necessary to encapsulate the light emitting device by using an encapsulation layer. In order to ensure the encapsulation effect and the normal emission of display light by the display panel, the encapsulation layer is usually a transparent optical glue. In addition, after the process of encapsulating the light emitting device by the optical glue, a light shielding layer is prepared to reduce the ambient light entering the display panel, thereby reducing the reflection of the ambient light by the display panel to improve the contrast of the display panel.

[0003] However, due to the large thickness of the encapsulation layer, the step difference of the edge of the encapsulation layer is large, which causes the light shielding layer to overflow out of the encapsulation layer, resulting in process defects, for example, the light shielding layer overflows to the step area, which causes the binding of the pins in the step area to the circuit board to be poor. SUMMARY

[0004] To solve the above problems, the embodiments of the present application provide a display panel and a display device to solve the above problems.

[0005] In a first aspect, the embodiments of the present application provide a display panel, comprising a first area and a second area, the second area being located on one side of the first area close to the edge of the display panel, and the first area comprising an outer boundary close to the second area; the display panel comprises:

[0006] a light emitting layer, the light emitting layer comprising an array layer and a light emitting device layer, the array layer comprising a plurality of driving devices and the light emitting device layer comprising a plurality of light emitting devices, the light emitting devices being located in the first area; the light emitting layer further comprising a plurality of insulating layers, part of the insulating layers being included in the first area and not included in the second area;

[0007] a first organic encapsulation layer located on a side of the light emitting device layer away from the array layer; the first organic encapsulation layer encapsulating the light emitting devices;

[0008] a light shielding layer located on a side of the first organic encapsulation layer away from the light emitting layer; the light shielding layer comprising a plurality of hollow parts and the hollow parts exposing the light emitting devices;

[0009] wherein the first organic encapsulation layer comprises a first edge adjacent to the second area, the first edge being located on a side of the outer boundary away from the second area and the distance between the first edge and the outer boundary being d, d>0.

[0010] In a second aspect, the embodiments of the present application provide a display device comprising the display panel provided in the first aspect.

[0011] The embodiment of the present application is equivalent to setting a redundant space between the edge of the first organic encapsulation layer and the boundary of the first area and the second area, so that the light shielding layer cannot overflow to the second area, or the thickness of the light shielding layer overflowing to the second area is thin and the area is small, which is convenient to remove, and the process yield of the display panel and the display device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0013] Figure 1 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1.

[0014] Figure 2 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1. Figure 1 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1.

[0015] Figure 3 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1.

[0016] Figure 4 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1.

[0017] Figure 5 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1.

[0018] Figure 6 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1.

[0019] Figure 7 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1.

[0020] Figure 8 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1.

[0021] Figure 9 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1.

[0022] Figure 10 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1.

[0023] Figure 11 A schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 1.

[0024] Figure 12 A local cross-sectional schematic view of part of a structure in a display panel is provided for an embodiment of the present application.

[0025] Figure 13 A schematic view of part of a structure in a display panel is provided for an embodiment of the present application.

[0026] Figure 14 A schematic view of a mask corresponding to the structure shown in Figure 13

[0027] Figure 15 A schematic view of part of a structure in a display panel is provided for an embodiment of the present application.

[0028] Figure 16 A schematic view of part of a structure in a display panel is provided for an embodiment of the present application.

[0029] Figure 17 A schematic view of a mask corresponding to the structure shown in Figure 16

[0030] Figure 18 A schematic view of a mask corresponding to the structure shown in Figure 16

[0031] A schematic view of part of a structure in a display panel is provided for an embodiment of the present application. Figure 19

[0032] A local cross-sectional schematic view of a display panel is provided for an embodiment of the present application. Figure 20

[0033] A local cross-sectional schematic view of a display panel is provided for an embodiment of the present application. Figure 21

[0034] A schematic view of a display device is provided for an embodiment of the present application. Figure 22

[0035] A schematic view of another display device is provided for an embodiment of the present application. Figure 23 DETAILED DESCRIPTION In order to better understand the technical solutions of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0036] It should be clear that the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0037] It should be clear that the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0038] ​​The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the description of the application and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0039] It should be understood that the term "and / or" used in the present application only describes an association relationship of associated objects, which means that there can be three relationships, for example, A and / or B can represent three cases of A existing alone, A and B existing together, and B existing alone. In addition, the character " / " in the present application generally represents an "or" relationship between the front and rear associated objects.

[0040] In the description of the specification, it should be understood that the words "substantially", "approximately", "about", "approximately", "approximately", "approximately", "approximately" and the like described in the claims and embodiments of the application mean that they can be generally recognized within a reasonable process operation range or tolerance range, but not an exact value.

[0041] It should be understood that although the terms first, second, etc. may be used in the embodiments of the present application to describe regions, etc., these should not be limited to these terms. These terms are only used to distinguish regions from each other. For example, the first region can also be referred to as the second region, and similarly, the second region can also be referred to as the first region without departing from the scope of the embodiments of the present application. The present applicant provides a solution to the problems existing in the prior art through careful and in-depth research.

[0042] Figure 1 A schematic diagram of a display panel provided in the embodiments of the present application is shown in Figure 2 For Figure 1 A cross-sectional schematic view along the direction M1-M2.

[0043] The embodiments of the present application provide a display panel 01, as shown in Figure 1 The display panel 01 includes a first region A1 and a second region A2, and the second region A2 is located on one side of the first region A1 close to the edge of the display panel 01. The second region A2 can be regarded as an edge region in the display panel 01, and the edge away from the first region A1 of the second region A2 can also coincide with the edge of the display panel 01. The first region A1 can be a display region for emitting light display, and the second region A2 can be a frame region for setting peripheral circuits and peripheral traces. The display panel 01 can be a narrow frame display panel, and then the second region A2 for setting the frame circuit and the peripheral trace has a relatively narrow width. When the width of the second region A2 is narrow and the human eye cannot easily perceive, the display panel 01 can be regarded as a frameless display panel.

[0044] In combination with Figure 1 With Figure 2The display panel 01 comprises a light-emitting layer 10, a first organic encapsulation layer 20 and a light-blocking layer 30. The light-emitting layer 10 is a composite film layer comprising an array layer 11 and a light-emitting device layer 12 and is used to realize light-emitting display. The first organic encapsulation layer 20 is located on the side of the light-emitting device layer 12 away from the array layer 11 and is used to encapsulate and protect the light-emitting device layer 12. The light-blocking layer 30 is located on the side of the first organic encapsulation layer 20 away from the light-emitting layer 10.

[0045] The array layer 11 comprises a plurality of driving devices 110, and the light-emitting device layer 12 comprises a plurality of light-emitting devices 120. The driving devices 110 can be used to drive the light-emitting devices 120 to emit light for display. The light-emitting devices 120 can be organic light-emitting diodes (OLEDs). In this case, the light-emitting devices 120 can be prepared by evaporation or other processes. The light-emitting devices 120 can also be sub-millimeter light-emitting diodes or micro light-emitting diodes (Micro-LEDs). In this case, the light-emitting devices 120 can be electrically connected to the driving devices 110 in the array layer 11 by plug-in, soldering, bonding or other methods. The light-emitting devices 120 are located in the first area A1, which can be a display area in the display panel 01. The part of the array layer 11 located in the first area A1 can comprise driving devices 110 such as pixel circuits DR. The pixel circuits DR can comprise transistors 111, capacitors 112 and the like. The pixel circuits DR can be electrically connected to the light-emitting devices 120 and drive the light-emitting devices 120 to emit light. The part of the array layer 11 located in the second area A2 can comprise driving devices 110 such as shift registers and multiplexing switches (not shown in the figure).

[0046] The first organic encapsulation layer 20 is located on the side of the light-emitting device layer 12 away from the array layer 11. Therefore, the first organic encapsulation layer 20 can be located on the side of the light-emitting device layer 12 facing the light-emitting surface of the display panel 01. Therefore, the first organic encapsulation layer 20 can be a light-transmitting structure. When the first organic encapsulation layer 20 is a light-transmitting structure, the light emitted by the light-emitting devices 120 can be emitted from the light-emitting surface of the display panel 01 after passing through the first organic encapsulation layer 20. The first organic encapsulation layer 20 encapsulates and protects the light-emitting devices 120, which can prevent subsequent processes from damaging the light-emitting devices 120 and can prevent water and oxygen from the outside from invading the light-emitting devices 120 and the array layer 11. The first organic encapsulation layer 20 can be prepared from transparent optical glue. The process for preparing the first organic encapsulation layer 20 can be coating or inkjet printing.

[0047] The light shielding layer 30 is located on the side of the first organic encapsulation layer 20 away from the light emitting layer 10, and is prepared after the first organic encapsulation layer 20 is formed. The first organic encapsulation layer 20 in at least the first area A1 can provide a relatively flat bearing surface for the light shielding layer 30. The light shielding layer 30 includes a plurality of hollow parts 31 and exposes the light emitting device 120 to ensure that the light emitted by the light emitting device 120 can be emitted by the light shielding layer 30 through the hollow part 31. The periphery of the hollow part 31 can be a solid part in the light shielding layer 30, that is, the periphery of the hollow part 31 can be a light shielding part, and the projection of the light shielding part in the direction perpendicular to the plane in which the display panel 01 is located can overlap the area between the adjacent light emitting devices 120. The light shielding part can improve the light crosstalk problem of the light emitted by different light emitting devices 120 from the side of the light emitting surface of the display panel 01. Optionally, the hollow part 31 can be filled with a color resist (not shown in the figure), which can filter the light emitted by the light emitting device 120 below it to ensure the color purity of the emitted light; at the same time, it can also filter the ambient light to be incident to the display panel 01 to reduce the reflection of the ambient light on the light emitting device layer 12 and the array layer 11, thereby improving the reflection problem of the display panel 01 to the ambient light, and improving the contrast of the display panel 01.

[0048] The light emitting layer 10 further includes a plurality of insulating layers JC, and the part of the insulating layers JC is included in the first area A1 and is not included in the second area A2, that is, the part of the insulating layers JC included in the light emitting layer 10 is cut off near the boundary position of the second area A2 and the first area A1, as shown in Figure 2 The light emitting layer 10 forms a stepped structure with the first area A1 being thick and the second area A2 being thin near the boundary position of the first area A1 and the second area A2. Please continue to refer to Figure 2The first area A1 includes an outer boundary L1 close to the second area A2. The outer boundary L1 can be regarded as a boundary line between the first area A1 and the second area A2. The portion of the insulating layer JC included in the light-emitting layer 10 is truncated to form a stepped structure near the outer boundary L1. For example, the insulating layer JC between the light-emitting device layer 12 and the array layer 11 includes a first planarization layer JC1 and a second planarization layer JC2. The first planarization layer JC1 and the second planarization layer JC2 are located in the first area A1 and are not arranged in the second area A2, that is, the first planarization layer JC1 and the second planarization layer JC2 are truncated in the second area A2. It should be noted that the side surface of the insulating layer JC truncated in the second area A2 is generally a surface with a certain inclination angle, which leads to the side surface of the stepped structure being a surface with a certain inclination angle. The side surface with a certain inclination angle is caused by the limitation of process precision, that is, the insulating layer JC that should be truncated at the boundary between the first area A1 and the second area A2 may remain in the second area A2 due to the limitation of process precision. Therefore, the position of the upper edge of the stepped structure can be regarded as the outer boundary L1. For example, the second planarization layer JC2 is located on the side of the first planarization layer JC1 close to the first organic encapsulation layer 20, and the side surfaces of the first planarization layer JC1 and the second planarization layer JC2 are both inclined surfaces. Therefore, the edge of the upper surface of the second planarization layer JC2 can be regarded as the outer boundary L1.

[0049] It should be noted that, Figure 2 Only one possible stack structure of the first area A1 is shown, and other stack structures can also be used in other embodiments, which are not limited in the present application.

[0050] The first organic encapsulation layer 20 includes a first edge L2 adjacent to the second area A2. The first edge L2 can be regarded as an edge of the first organic encapsulation layer 20 facing the second area A2, and the first organic encapsulation layer 20 is also truncated before reaching the second area A2. In the technical solution provided in the embodiments of the present application, the first edge L2 is located on the side of the outer boundary L1 away from the second area A2, and the distance between the first edge L2 and the outer boundary L1 is d, d>0. Therefore, the edge of the first organic encapsulation layer 20 is inwardly recessed relative to the boundary position of the first area A1 and the second area A2 away from the second area A2, that is, the first organic encapsulation layer 20 is inwardly recessed in the first area A1 away from the position of the stepped structure.

[0051] In order to better encapsulate the light emitting device 120, the thickness of the first organic encapsulation layer 20 is usually large. For example, when the light emitting device 120 is a micro light emitting diode, the total thickness of the light emitting device 120 and the bonding layer is usually greater than or equal to 10 μm, and in order to effectively reduce the damage of external force and dust to the light emitting device 120, the thickness of the first organic encapsulation layer 20 is greater than 10 μm; further, when the display panel 01 is a transparent screen and includes a light transmission area in addition to a plurality of pixel areas, part of the insulating layer JC needs to be hollow designed in the light transmission area to ensure that the light transmission area has higher light transmittance, which will cause the difference between the upper surface of the light emitting device 120 and the upper surface of the light transmission area to be greater than or equal to 16 μm, and then the thickness of the first organic encapsulation layer 20 needs to be greater than or equal to 18 μm to fill the difference to better encapsulate the light emitting device 120. The first edge L2 of the first organic encapsulation layer 20 has a large drop, and the light shielding layer 30 is prepared above the first organic encapsulation layer 20, and the light shielding layer 30 will experience a large drop when it overflows to the outside of the first organic encapsulation layer 20, thereby making the area of the light shielding layer 30 overflowing to the second area A2 larger, and causing the second area A2 to have process defects.

[0052] In the embodiment of the present application, the first organic encapsulation layer 20 is inwardly retracted in the first area A1 away from the outer boundary L1, which is equivalent to setting a redundant space between the edge of the first organic encapsulation layer 20 and the outer boundary L1. When the light shielding layer 30 overflows the first organic encapsulation layer 20, it will first overflow to the redundant space. Therefore, the probability of the light shielding layer 30 overflowing to the second area A2 is reduced; in addition, even if the light shielding layer 30 overflows into the second area A2, the thickness of the light shielding layer 30 in the second area A2 will be thinned relative to the prior art and the area will be relatively reduced, which is convenient for removing in the subsequent patterning process. The technical solution of the present application can reduce the risk of residual light shielding layer 30 in the second area A2, thereby improving the process defects.

[0053] In an embodiment of the present application, the second area A2 includes a plurality of pins 41, and the pins 41 are electrically connected to a circuit board 42. The circuit board 42 can be an integrated circuit board (IC) or a flexible circuit board (FPC). For example, the pins 41 close to the first area A1 can be electrically connected to the IC, and the pins 41 away from the first area A1 can be electrically connected to the FPC; in addition, the pins 41 in the first area A1 can also be electrically connected only to the FPC. The signal interaction between the signal lines in the display panel 01 and the driving module can be realized through the pins 41, and the second area A2 can be regarded as a step area of the display panel 01.

[0054] When the second area A2 is a step area including the pin 41, the pin 41 is at risk of being covered by the light shielding layer 30 when the light shielding layer 30 overflows into the second area A2; and the more the light shielding layer 30 overflows into the second area A2, the larger the area and the thicker the thickness of the pin 41 covered by the light shielding layer 30. Therefore, due to the presence of the first organic encapsulation layer 20, the area and the thickness of the pin 41 of the step area in the prior art covered by the light shielding layer 30 are large, and the possibility of the light shielding layer 30 above the pin 41 being effectively etched when the light shielding layer 30 in the first area A1 is etched to form the hollow part 31 is reduced.

[0055] The first edge L2 of the first organic encapsulation layer 20 is arranged on the side of the outer boundary L1 away from the second area A2, and the distance between the first edge L2 and the outer boundary L1 is greater than 0, so that when the light shielding layer 30 overflows out of the first organic encapsulation layer 20, the light shielding layer 30 can first pass through the redundant space between the first edge L2 and the outer boundary L1, so that the overflow action of the light shielding layer 30 is slowed down, and at least part of the overflowed light shielding layer 30 remains in the redundant space, thereby reducing the thickness and area of the light shielding layer 30 appearing in the step area. The pin 41 is not covered by the light shielding layer 30; or even if the pin 41 is covered by the light shielding layer 30, the area and thickness covered are small, and the light shielding layer 30 above the pin 41 is easily removed during the etching process of the light shielding layer 30 in the first area A1 to form the hollow part 31.

[0056] The second area A2 can also include a positioning mark, which is at risk of being covered by the light shielding layer 30 when the light shielding layer 30 overflows into the second area A2. If the thickness of the light shielding layer 30 covering the positioning mark is thick, the possibility of the light shielding layer 30 above the positioning mark being effectively etched is reduced, affecting the accuracy of subsequent positioning, and further affecting the yield of the structure prepared by subsequent processes. The technical solution provided by the embodiment of the present application can effectively reduce the possibility of the light shielding layer 30 overflowing into the positioning mark or the amount of the light shielding layer 30 overflowing into the second area A2, thereby avoiding the problem that the positioning mark is covered by the light shielding layer 30 and cannot be exposed.

[0057] In addition, the edge of the second area A2 can be a cutting line, that is, the edge of the second area A2 coincides with the cutting line when a plurality of display panels 01 are obtained by cutting a mother board. If the light shielding layer 30 overflows into the second area A2, it will increase the difficulty of cutting and easily produce cutting burrs, thereby affecting the appearance of the edge of the display panel 01; if the display panel 01 is applied to a spliced screen, it can further increase the splicing difficulty, make the splicing gap not tight or the splicing gap obvious. The technical solution provided by the embodiment of the present application can effectively reduce the possibility of the light shielding layer 30 overflowing into the position of the cutting line or the amount of the light shielding layer 30 overflowing into the position of the cutting line, thereby improving the cutting yield.

[0058] In an embodiment of the present application, d≥5μm, that is, the edge of the first organic encapsulation layer 20 is inwardly recessed by at least 5μm relative to the outer boundary L1. When the edge of the first organic encapsulation layer 20 is inwardly recessed by at least 5μm relative to the outer boundary L1, a clear redundant space is formed between the edge of the first organic encapsulation layer 20 and the outer boundary L1, thereby slowing down the speed of the light-blocking layer 30 overflowing to the second area A2. For example, d=10μm.

[0059] In one technical solution, d≥40μm, that is, the edge of the first organic encapsulation layer 20 is inwardly recessed by at least 40μm relative to the outer boundary L1. The redundant space between the edge of the first organic encapsulation layer 20 and the outer boundary L1 can accommodate more light-blocking layer 30. Therefore, not only the speed of the light-blocking layer 30 overflowing to the second area A2 is slowed down by setting the redundant space, but also the light-blocking layer 30 is accommodated by the sufficiently spacious redundant space, thereby effectively reducing the light-blocking layer 30 overflowing to the second area A2.

[0060] In an embodiment of the present application, the first organic encapsulation layer 20 is a negative photosensitive layer.

[0061] When the first organic encapsulation layer 20 is a photosensitive layer, in the process of patterning the first organic encapsulation layer 20, the first organic encapsulation layer 20 can be exposed by using a mask plate and developed by using a developing solution, that is, a patterned first organic encapsulation layer 20 is obtained. Therefore, the process and steps of preparing the first organic encapsulation layer 20 are simpler.

[0062] The negative photosensitive layer has better corrosion resistance. Therefore, when the light-blocking layer 30 including the hollow part 31 is prepared thereon, it can still have a relatively flat surface, thereby reducing the influence of the surface topography on the light emitted by the light-emitting device 120. In addition, since the thickness of the first organic encapsulation layer 20 is large, when the first organic encapsulation layer 20 is prepared by using a negative photosensitive material, a first organic encapsulation layer 20 with better uniformity and stability can be obtained, and the first organic encapsulation layer 20 has lower cost and higher mechanical strength.

[0063] The speed and amount of the light-blocking layer 30 overflowing to the second area A2 can be slowed down by setting the inclination angle of the side surface of the first organic encapsulation layer 20 to be smaller, that is, the slope of the side surface is gentler. However, since it is difficult to achieve high-resolution patterning of the negative photosensitive layer, it is basically impossible to use optical proximity correction (OPC) technology to form a gentler slope in the edge area of the first organic encapsulation layer 20.

[0064] The present application reduces the amount of light-shielding layer 30 overflowing to the second area A2 by inwardly retracting the edge of the first organic encapsulation layer 20 relative to the outer boundary L1. Therefore, the technical solution provided by the present embodiment uses a negative photosensitive material to prepare the first organic encapsulation layer 20, that is, the advantages of the negative photosensitive layer are utilized, and the problem of the light-shielding layer 30 overflowing to the second area A2 is improved by inwardly retracting the first organic encapsulation layer 20 relative to the outer boundary L1.

[0065] In an embodiment of the present application, as shown in Figure 2 The inclination angle of the side surface of the first organic encapsulation layer 20 is α, and α < 90°. If the side surface of the first organic encapsulation layer 20 is a vertical surface, the speed of the light-shielding layer 30 overflowing outside the first organic encapsulation layer 20 will be very fast, and the risk of the light-shielding layer 30 breaking at the side surface of the first organic encapsulation layer 20 will greatly increase. The side surface of the first organic encapsulation layer 20 in the present embodiment is an inclined surface, which can slow down the speed of the light-shielding layer 30 overflowing outside the first organic encapsulation layer 20, thereby avoiding too much light-shielding layer 30 overflowing to the second area A2; and can also alleviate the problem of the light-shielding layer 30 breaking near the edge of the first organic encapsulation layer 20, so as to ensure the visual effect near the outer boundary L1.

[0066] In one technical solution, the inclination angle of the side surface of the first organic encapsulation layer 20 is α, and 70° ≤ α < 90°. When the inclination of the side surface of the first organic encapsulation layer 20 is greater than or equal to 70°, the projected area of the side surface in the direction perpendicular to the plane of the display panel 01 is small, which avoids the side surface occupying too much space to affect the display effect and visual effect of the display area. In addition, if the first organic encapsulation layer 20 is a negative photosensitive layer, the inclination angle of the side surface of the first organic encapsulation layer 20 is greater than or equal to 70°, which is also relatively easy to achieve.

[0067] In an embodiment of the present application, as shown in Figure 2As shown, the light shielding layer 30 covers the edge of the first organic encapsulation layer 20. When the edge of the first organic encapsulation layer 20 is inwardly recessed relative to the outer boundary L1, the distance between the edge of the first organic encapsulation layer 20 and the light emitting device 120 in the display area is closer. If the edge of the first organic encapsulation layer 20 is not covered by the light shielding layer 30, the metal structure in the light emitting device 120 near the edge position of the display area and the metal structure near the light emitting device 120 will reflect light, and then be perceived by the human eye, affecting the visual effect. In the embodiment of the present application, although the first organic encapsulation layer 20 is designed to be inwardly recessed, the light shielding layer 30 is covered on the edge of the first organic encapsulation layer 20, which can improve the problem of light leakage and visibility of metal structure in the area where the edge of the first organic encapsulation layer 20 is located. It should be noted that the side surface of the first organic encapsulation layer 20 can be an inclined surface, and the edge of the upper surface of the first organic encapsulation layer 20 does not coincide with the edge of the lower surface. The light shielding layer 30 covering the edge of the first organic encapsulation layer 20 can be understood as the light shielding layer 30 covering the edge of the upper surface, the edge of the lower surface and the side surface of the first organic encapsulation layer 20.

[0068] Figure 3 A partial schematic view of a part of a structure in a display panel is provided in the embodiment of the present application.

[0069] In an embodiment of the present application, as shown in Figure 3 The first edge L2 includes a first protrusion 21, and the first protrusion 21 protrudes away from the position where the first area A1 is located. The first protrusion 21 can be regarded as a structure in which the first organic encapsulation layer 20 protrudes from the first area A1 to the second area A2. When the first edge L2 includes a plurality of first protrusions 21, the shape of the first edge L2 can be regarded as a curve or a broken line, etc.

[0070] Figure 4 A schematic view of light leakage in the related art is provided.

[0071] The light shielding layer 30 on the side surface of the first organic encapsulation layer 20 can have a phenomenon similar to climbing a slope, and the risk of the light shielding layer 30 on the side surface of the first organic encapsulation layer 20 breaking to form a crack 32 is higher. In addition, when the light shielding layer 30 is prepared, the light shielding layer 30 will overflow from the upper surface of the first organic encapsulation layer 20 to the second area A2 via the side surface of the first organic encapsulation layer 20, and the light shielding layer 30 on the edge of the upper surface of the first organic encapsulation layer 20 will have a phenomenon of thinning or even breaking. When the light shielding layer 30 is etched subsequently, the risk of the light shielding layer 30 on the edge position of the upper surface of the first organic encapsulation layer 20 being etched to form a crack 32 is increased. As shown in Figure 4As shown, due to the inwardly recessed design of the first edge L2 of the first organic encapsulation layer 20 towards the display area, the likelihood of the metal structures 100 included in the light emitting device 120 and signal lines and the like near the edge of the first organic encapsulation layer 20 overlapping the crack 32 increases. If the crack 32 overlaps the metal structures 100, the light rays RL reflected by the metal structures 100 are visible to the human eye through the crack 32 of the light shielding layer 30, that is, the metal structures 100 overlapping the crack 32 are obviously visible, thereby affecting the visual effect. When the crack 32 appears on the side surface of the first organic encapsulation layer 20 and / or on the edge of the upper surface of the first organic encapsulation layer 20, the extension direction of the crack 32 is basically consistent with the extension direction of the edge of the first organic encapsulation layer 20. Since the metal structures such as signal lines below are usually linearly extended, the human eye can easily perceive the obvious bright line, that is, the metal structures 100 overlapping the crack 32 can be obviously seen.

[0072] Figure 5 An effect schematic diagram of a display panel provided by an embodiment of the present application.

[0073] By setting the first edge L2 of the first organic encapsulation layer 20 to include the first protrusions 21, the visibility of the reflected light is reduced, the shadow of the metal structures 100 is eliminated, and the visual effect is improved. As shown, Figure 5 As shown, when the first edge L2 includes a plurality of first protrusions 21, since the extension direction of the crack 32 is basically the same as the extension direction of the edge of the first organic encapsulation layer 20, even if the light shielding layer 30 on the side surface of the first organic encapsulation layer 20 has a continuous crack 32, or the light shielding layer 30 near the edge position of the upper surface of the first organic encapsulation layer 20 has a continuous crack 32, the extension direction of the crack 32 is basically a broken line or a curve. The area where the crack 32 overlaps the metal structures 100 and the like which basically extend along a straight line is not a continuous structure, but a point-like structure. Therefore, the problem that the reflected light rays passing through the crack 32 are obviously visible is improved, that is, the problem that the metal structures 100 are obviously seen through the crack 32 is improved, and the visual effect of the display panel 01 is improved.

[0074] As shown, Figure 3As shown, the included angle of the first protrusion 21 can be β, β≥150°, wherein the included angle of the first protrusion 21 is the included angle opening towards the first area A1. When the angle of the included angle β of the first protrusion 21 is greater than or equal to 150°, the first protrusion 21 is easy to be prepared by etching or other processes. In addition, when the angle of the included angle β of the first protrusion 21 is greater than or equal to 150°, the width of the first protrusion 21 in the direction parallel to the extension direction of the outer boundary L1 is larger, which reduces the distance between the breaking position of the light shielding layer 30 and the area overlapping the straightly extended metal structure, and further weakens the visibility of the reflected light. Moreover, the greater the included angle β of the first protrusion 21 is, the narrower the width of the first protrusion 21 protruding from the first area A1 towards the second area A2 can be, under the premise of avoiding the influence of the first protrusion 21 on the display effect of the display area, the edge of the first organic encapsulation layer 20 has the opportunity to shrink by a larger width relative to the outer boundary L1, thereby effectively improving the overflow problem of the light shielding layer 30.

[0075] Figure 6 A local schematic diagram of a part of a structure in a display panel is provided for the embodiments of the present application.

[0076] In one technical solution, as shown in Figure 6 The first protrusion 21 and the light emitting device 120 overlap in the first direction X, the first direction X is parallel to the direction of the plane where the display panel 01 is located and parallel to the arrangement direction of the first area A1 and the second area A2, then the orthographic projection of the first protrusion 21 and the light emitting device 120 in the direction perpendicular to the plane where the display panel 01 is located is arranged in the first direction X, at this time, the orthographic projection of the two can exist partially overlapping. That is, along the arrangement direction of the first area A1 and the second area A2, the first protrusion 21 is located between the area where the light emitting device 120 is located and the second area A2, or the first protrusion 21 protrudes from the position near the light emitting device 120 to the position of the second area A2.

[0077] In the technical solution, the area between the light emitting device 120 near the edge of the display area and the second area A2 includes the first protrusion 21 of the first organic encapsulation layer 20, in combination with Figure 5 and Figure 6If the light shielding layer 30 has a crack 32 near the edge of the first organic encapsulation layer 20, the crack 32 between the light emitting device 120 near the edge of the display area and the second area A2 is further away from the light emitting device 120 due to the first protrusion 21. On the one hand, the probability of the crack 32 overlapping the light emitting device 120 is reduced as much as possible to avoid the light reflecting structure such as eutectic alloy corresponding to the light emitting device 120 from reflecting light to the light exit surface of the display panel 01 through the crack 32; on the other hand, when the first protrusion structure 21 is formed on the edge of the first organic encapsulation layer 20 by patterning, the farther the edge of the mask from the light emitting device 120, the lower the risk of the light reflecting structure such as eutectic alloy corresponding to the light emitting device 120 reflecting the exposed light to the position that does not need to be exposed, thereby avoiding the risk of over-etching or mis-etching the first organic encapsulation layer. In order to better achieve the above effect, the distance between the end of the first protrusion 21 near the second area A2 and the light emitting device 120 can be greater than or equal to 5 μm, for example, it can be 10 μm.

[0078] Figure 7 A local schematic diagram of a part of a structure in a display panel is provided in an embodiment of the present application.

[0079] In an embodiment of the present application, as shown in Figure 7 , the first edge L2 not only includes the first protrusion 21, but also includes a second protrusion 22, the second protrusion 22 protrudes away from the position where the first area A1 is located, and the topography of the second protrusion 22 is different from that of the first protrusion 21. The second protrusion 22 can be regarded as a structure of the first organic encapsulation layer 20 protruding from the first area A1 to the second area A2 and different from the first protrusion 21. Wherein, the topography of the second protrusion 22 being different from that of the first protrusion 21 can mean that the shape of the orthographic projection of the second protrusion 22 in the direction perpendicular to the plane where the display panel 01 is located is the same as that of the orthographic projection of the first protrusion 21 in the direction perpendicular to the plane where the display panel 01 is located, and the size is different or the shape is different. Wherein, the shape being different can mean that the pattern types are different, for example, one is triangular and the other is semicircular; or it can mean that the pattern types are the same, but the angle size or the side length is different, for example, both are triangular and the included angle of one is larger than that of the other, or both are triangular and the side lengths are different.

[0080] The arrangement of the second protrusions 22 can also improve the problem that the reflected light is obviously visible due to the fracture of the light-shielding layer 30 near the edge position of the first organic encapsulating layer 20. In addition, since the second protrusions 22 have different topographies from the first protrusions 21, the extension direction of the crack 32 of the light-shielding layer 30 due to the fracture near the edge position of the first organic encapsulating layer 20 is more variable, and thus the position of the overlap with the metal structure 100 or the like capable of reflecting light below the crack 32 is more variable, so as to reduce the possibility that the light reflected by the metal structure 100 forms a bright line obviously through the crack 32, that is, to further increase the shadow elimination effect on the metal structure 100.

[0081] In one technical solution, as shown in Figure 7 the inner included angle of the second protrusion 22 can be γ, and γ≤β, that is, the inner included angle γ of the second protrusion 22 can be less than or equal to the inner included angle β of the first protrusion 21. Therefore, the first edge L2 of the first organic encapsulating layer 20 can include protrusions with different inner included angles, so that the extension direction of the crack 32 of the light-shielding layer 30 due to the fracture near the edge position of the first organic encapsulating layer 20 is more variable, and thus the position of the overlap with the metal structure 100 or the like capable of reflecting light below the crack 32 is more variable, so as to improve the shadow elimination effect on the metal structure 100.

[0082] In one technical solution, as shown in Figure 7 the width W2 of the second protrusion 22 along the second direction Y is less than the width W1 of the first protrusion 21 along the second direction Y, and the second direction Y is perpendicular to the first direction X. Therefore, the first edge L2 of the first organic encapsulating layer 20 can include protrusions with different widths, so that the extension direction of the crack 32 of the light-shielding layer 30 due to the fracture near the edge position of the first organic encapsulating layer 20 is more variable, and thus the position of the overlap with the metal structure 100 or the like capable of reflecting light below the crack 32 is more variable, so as to improve the shadow elimination effect on the metal structure 100.

[0083] In one technical solution, as shown in Figure 7 the length S2 of the second protrusion 22 along the first direction X is less than the length S1 of the first protrusion 21 along the first direction X, that is, the height of the second protrusion 22 protruding in the direction from the first region A1 to the second region A2 is less than the height of the first protrusion 21 protruding in the direction from the first region A1 to the second region A2. Therefore, the first edge L2 of the first organic encapsulating layer 20 can include protrusions with different widths, so that the extension direction of the crack 32 of the light-shielding layer 30 due to the fracture near the edge position of the first organic encapsulating layer 20 is more variable, and thus the position of the overlap with the metal structure 100 or the like capable of reflecting light below the crack 32 is more variable, so as to improve the shadow elimination effect on the metal structure 100.

[0084] Figure 8A local schematic view of part of a structure in a display panel is provided in an embodiment of the present application.

[0085] In one technical solution, as shown in Figure 8 the second protrusion 22 is offset from the light emitting device 120 in the first direction X, i.e., the second protrusion 22 protrudes in the direction from the region in the first area A1 between the adjacent light emitting devices 120 to the second area A2. Therefore, the first edge L2 of the first organic encapsulation layer 20 includes both the first protrusion 21 overlapping the light emitting device 120 in the first direction X and the second protrusion 22 not overlapping the light emitting device 120 in the first direction X, and thus the protrusion can be effectively used to eliminate the metal structure 100.

[0086] Figure 9 A schematic view of part of a structure in a display panel is provided in an embodiment of the present application.

[0087] In one embodiment of the present application, as shown in Figure 9 the display panel 01 further includes a third area A3, and the first organic encapsulation layer 20 further includes a second edge L3 adjacent to the third area A3; wherein the second edge L3 includes a third protrusion 23 protruding away from the position of the first area A1 along the second direction Y, and the third area A3 is arranged along the second direction Y from the first area A1 and the second area A2 is arranged along the first direction X from the first area A1. Therefore, the shape of the second edge L3 can be regarded as a curve or a broken line, which can alleviate the problem that the metal structure 100 near the second edge L3 is visible due to the crack 32 of the light shielding layer 30.

[0088] In addition, the second edge L3 can further include other protrusions different from the topography of the third protrusion 23.

[0089] Figure 10 A local cross-sectional schematic view of part of a structure in a display panel is provided in an embodiment of the present application.

[0090] In one embodiment of the present application, as shown in Figure 10 the first organic encapsulation layer 20 includes a first part 201 and a second part 202, the second part 202 is located in the first area A1, and the first part 201 is located on the side of the second part 202 facing the second area A2, i.e., the first part 201 is closer to the edge of the first organic encapsulation layer 20 than the second part 202. Wherein the second part 202 can be regarded as the main part of the first organic encapsulation layer 20 and the first part 201 can be regarded as the edge part of the first organic encapsulation layer 20 adjacent to the second area A2.

[0091] The thickness of the first portion 201 is H1, and the thickness of the second portion 202 is H2, H1 < H2, that is, the thickness of the edge portion of the first organic encapsulation layer 20 adjacent to the second area A2 is thinned relative to the main body portion of the first organic encapsulation layer 20. Through the thinning design, the speed of the light shielding layer 30 overflowing out of the first organic encapsulation layer 20 can be slowed down, and the speed of the light shielding layer 30 overflowing to the second area A2 is slowed down, and then the amount and area of the light shielding layer 30 overflowing to the second area A2 are reduced, which facilitates subsequent removal of the light shielding layer 30 in the second area A2.

[0092] Figure 11 A local cross-sectional schematic view of a partial structure in a display panel is provided for an embodiment of the present application.

[0093] In an embodiment of the present application, as shown in Figure 11 The first portion 201 includes a first sub-portion 2011 and a second sub-portion 2012, and the first sub-portion 2011 is located on the side of the second sub-portion 2012 facing the second area A2, wherein the thickness of the first sub-portion 2011 is H11, the thickness of the second sub-portion 2012 is H12, and H11 is less than H12, that is, the thickness of the first sub-portion 2011 is less than the thickness of the second sub-portion 2012. That is, the edge portion of the first organic encapsulation layer 20 adjacent to the second area A2 also has a structure similar to a step, which can further buffer the speed of the light shielding layer 30 overflowing out of the first organic encapsulation layer 20.

[0094] In an embodiment of the present application, as shown in Figure 10 and Figure 11 The surface of the first portion 201 away from the light-emitting layer 10 can be a flat surface. Due to the inward retraction of the edge of the first organic encapsulation layer 20, the distance between the edge portion of the first organic encapsulation layer 20 and the light-emitting device 120 in the display area is closer, and at least part of the light emitted by the light-emitting device 120 in the display area located in the edge portion can be emitted through the first portion 201. The surface of the first portion 201 away from the light-emitting layer 10 is a flat surface, which can avoid the light emitted through the first portion 201 being affected by the surface topography of the first portion 20 as much as possible.

[0095] Figure 12 A local cross-sectional schematic view of a partial structure in a display panel is provided for an embodiment of the present application.

[0096] In an embodiment of the present application, as shown in Figure 12As shown, the first part 201 away from the surface of the light-emitting layer 10 includes a plurality of grooves HL, and the upper surface of the first part 201 for bearing the light-blocking layer 30 includes a plurality of grooves HL. A part of the light-blocking layer 30 can be accommodated in the grooves HL, which can reduce the amount of the light-blocking layer 30 overflowing out of the first organic encapsulation layer 20; in addition, the second groove can also provide an obstacle for the light-blocking layer 30 overflowing out of the first organic encapsulation layer 20, slowing down the speed of the light-blocking layer 30 overflowing out of the first organic encapsulation layer 20.

[0097] In one technical solution, as shown in Figure 12 In the direction parallel to the plane on which the display panel 01 is located, the distance between the groove HL and the light-emitting device 120 is d1, and d1≥5μm, that is, the distance between the groove HL and the light-emitting device 120 is greater than or equal to 5μm. By setting the groove HL outside the position of the light-emitting device 120 by 5μm, the groove HL can be avoided from overlapping with the light-emitting device 120, so as to reduce the influence of the groove HL on the light emitted by the light-emitting device 120.

[0098] Figure 13 A schematic diagram of a part of the structure in a display panel is provided for the embodiments of the present application, Figure 14 A schematic diagram of a mask corresponding to the structure shown in Figure 13 .

[0099] In one technical solution, as shown in Figure 13 The plurality of grooves HL are arranged in a chessboard pattern. The grooves HL arranged in a chessboard pattern can increase the obstruction to the overflow of the light-blocking layer 30 from the first organic encapsulation layer 20.

[0100] In addition, the thinning design of the first part 201 relative to the second part 202 can be realized by using a half-tone mask 02. That is, as shown in Figure 14 When the first organic encapsulation layer 20 is exposed, the light leakage part 021 and the light-blocking part 022 of the region 02A corresponding to the first part 201 in the mask 02 can be arranged in a chessboard pattern to control the light leakage area ratio of the region, for example, the light leakage area of the region 02A is less than or equal to 60%. When the first organic encapsulation layer 20 is a negative photosensitive layer, the position where the first organic encapsulation layer 20 overlaps with the light-blocking part 022 in the region 02A can receive a part of light due to the diffraction of light, and therefore the groove HL formed at this position can not penetrate the first organic encapsulation layer 20. In addition, while the mask 02 shown in Figure 14 is used to realize the thickness thinning of the first part 201, the groove HL that hinders the overflow of the light-blocking layer 30 can also be obtained.

[0101] Figure 15 A schematic diagram of a part of the structure in a display panel is provided for the embodiments of the present application.

[0102] When the first edge L2 includes a plurality of first protrusions 21, the first portion 201 includes the first protrusions 21, where the first protrusions 21 can be at least a part of the first portion 201. Then, as shown in FIG. 2B, when the first portion 201 includes a plurality of grooves HL away from the surface of the light-emitting layer 10, at least part of the grooves HL is located away from the surface of the light-emitting layer 10 at the first protrusions 21. Figure 15

[0103] In addition, when the second edge L3 includes a plurality of second protrusions 22, the first portion 201 includes the second protrusions 22, where the second protrusions 22 can be a part of the first portion 201, for example, the first protrusions 21 and the second protrusions 22 are the first portion 201. Then, when the first portion 201 includes a plurality of grooves HL away from the surface of the light-emitting layer 10, part of the grooves HL is located away from the surface of the light-emitting layer 10 at the second protrusions 22, for example, the first protrusions 21 and the second protrusions 22 away from the surface of the light-emitting layer 10 both include the grooves HL.

[0104] Figure 16 FIG. 1 is a schematic diagram of a display panel according to an embodiment of the present application, Figure 17 FIG. 2A is a schematic diagram of a display panel according to an embodiment of the present application, Figure 16 FIG. 2B is a schematic diagram of a cross section along N1-N2 direction in FIG. 2A.

[0105] In an embodiment of the present application, in combination with Figure 16 and Figure 17 The first portion 201 includes a plurality of sawteeth ST. That is, the first portion 201 includes a plurality of valleys and peaks arranged alternately along the second direction Y, and in the process of spreading of the light-shielding layer 30, the light-shielding layer 30 spreads from the peaks to the valleys of the first portion 201. Therefore, the positions where the cracks 32 of the light-shielding layer 30 appear are mainly near the positions where the valleys and the peaks of the first portion 201 meet, that is, a plurality of small cracks 32 arranged along the arrangement direction of the valleys and the peaks appear in the light-shielding layer 30. If the small cracks 32 overlap with the reflective light metal structure 100 and the like below, the light reflected by the small cracks 32 can be regarded as point light arranged along the arrangement direction of the valleys and the peaks, which is beneficial to the de-saturation of the reflective light metal structure 100 and the like.

[0106] In one technical solution, as shown in FIG. 3B, the gap (valley) between the sawteeth ST does not penetrate the first organic encapsulation layer 20, and the gap (valley) between the sawteeth ST can be regarded as a groove HL to reduce the step difference between the valleys and the peaks, thereby reducing the risk of the light-shielding layer 30 appearing cracks 32 near the positions where the valleys and the peaks meet. Figure 17

[0107] ​​In one technical solution, the gap (valley) between the sawteeth ST can also penetrate the first organic encapsulation layer 20, so that the gap between the sawteeth ST can accommodate more light-shielding layer 30 overflowing from the first organic encapsulation layer 20, further reducing the risk of the light-shielding layer 30 overflowing to the second area A2.

[0108] In one technical solution, the width W3 of the sawteeth ST is less than or equal to 10 μm, and / or the distance W4 between adjacent sawteeth ST is less than or equal to 10 μm.

[0109] Figure 18 For the structure shown in Figure 16 A schematic diagram of a mask corresponding to the structure shown in

[0110] In order to make the first part 201 include a plurality of sawteeth ST, the plurality of light leakage portions 021 and the plurality of light shielding portions 022 of the area 02A corresponding to the first part 201 in the mask plate 02 are arranged alternately. In addition, the width of the light leakage portion 021 is less than or equal to 10 μm and / or the width of the light shielding portion 022 is less than or equal to 10 μm. When the width of the light leakage portion 021 is less than or equal to 10 μm, the width of the sawteeth ST is less than or equal to 10 μm, which is beneficial to form the first part 201 with reduced thickness. When the width of the light shielding portion 022 is less than or equal to 10 μm, the light shielding portion 022 will also receive a part of the light due to the diffraction phenomenon, which is beneficial to form the groove HL of the first organic encapsulation layer 20 that does not penetrate between the sawteeth ST. In addition, the proportion of the light leakage area of the area 02A corresponding to the first part 021 in the mask plate 02 can be adjusted by controlling the width of the light shielding portion 022 and the width of the light leakage portion 021, for example, the light leakage area of the area 02A is less than or equal to 60% and when the first organic encapsulation layer 20 is a negative photosensitive layer, which is beneficial to realize the thickness reduction of the first part 201.

[0111] Figure 19 A schematic diagram of a part of the structure of a display panel provided by an embodiment of the present application.

[0112] When the first edge L2 includes a plurality of first protrusions 21, the first part 201 includes the first protrusions 21, wherein the first protrusions 21 can be at least a part of the first part 201. Then, as shown in Figure 19 When the first part 201 includes a plurality of sawteeth ST, at least the sawteeth ST are located in the first protrusions 21.

[0113] In addition, when the second edge L2 includes a plurality of second protrusions 22, the first part 201 includes the second protrusions 22, wherein the second protrusions 22 can be a part of the first part 201, for example, the first protrusions 21 and the second protrusions 22 are the first part 201. Then, when the first part includes a plurality of sawteeth ST, part of the sawteeth ST are located in the second protrusions 22, for example, the first protrusions 21 and the second protrusions both include sawteeth ST.

[0114] Figure 20 A partial cross-sectional view of a display panel is provided in an embodiment of the present application.

[0115] In an embodiment of the present application, as shown in Figure 20 The display panel 01 further includes a second organic encapsulation layer 40, which is located on the side of the light shielding layer 30 away from the first organic encapsulation layer 20 and encapsulates the light shielding layer 30. The hollow part 31 of the light shielding layer 30 can be filled with color resist (not shown in the figure), which can filter the light emitted by the light emitting device 120 to obtain light with higher purity, and can also filter the ambient light entering the display panel 01 to reduce the reflection of the display panel 01 to the ambient light, and the second organic encapsulation layer 40 can also encapsulate and protect the color resist.

[0116] In the embodiment, the second organic encapsulation layer 40 covers the edge of the first organic encapsulation layer 20. Since the edge of the first organic encapsulation layer 20 is recessed relative to the outer boundary L1 of the first area A1, the second organic encapsulation layer 40 covers the edge of the first organic encapsulation layer 20, and when the first organic encapsulation layer 20 and the second organic encapsulation layer 40 are regarded as a whole, the edge of the organic encapsulation layer above the light emitting layer 10 can extend to the outer boundary L2. The second organic encapsulation layer 20 can make the first area A1 and the second area A2 have a more regular boundary. When the first organic encapsulation layer 20 includes the first protrusion 21, the second organic encapsulation layer 20 can not only cover the edge of the first organic encapsulation layer 20, but also can be linear.

[0117] The materials of the first organic encapsulation layer 20 and the second organic encapsulation layer 40 can be the same, so the first organic encapsulation layer 20 and the second organic encapsulation layer 40 can be prepared by basically the same process, which has low process difficulty; and since the refractive index of the first organic encapsulation layer 20 is the same as that of the second organic encapsulation layer 40, the light emitted by the light emitting device 120 has low light loss when passing through the first organic encapsulation layer 20 and the second organic encapsulation layer 40 in turn.

[0118] In addition, the second organic encapsulation layer 40 can also cover the edge of the light shielding layer 30, so the second organic encapsulation layer 40 is also used to protect the light shielding layer 30.

[0119] As shown in Figure 20As shown, the inclination angle of the side surface of the second organic encapsulation layer 40 is θ, where θ > a, that is, the inclination angle θ of the side surface of the second organic encapsulation layer 40 is greater than the inclination angle a of the side surface of the first organic encapsulation layer 20. If the inclination angle of the side surface of the encapsulation layer above the light-emitting layer 10 is smaller, the width of the side surface in the arrangement direction of the first area A1 and the second area A2 is larger, and in order to avoid the influence of the side surface on the light-emitting device 120, the two need to be designed to avoid, which leads to an increase in the distance between the light-emitting device 120 and the second area A2, affecting the display area of the display panel 01. When the first organic encapsulation layer 20 and the second organic encapsulation layer 40 are considered as a whole, the inclination angle of the side surface of the organic encapsulation layer above the light-emitting layer 10 is the side surface of the second organic encapsulation layer 40, that is, the inclination angle of the side surface of the encapsulation layer above the light-emitting layer 10 is larger, which can improve the above problems.

[0120] Figure 21 A partial cross-sectional schematic view of a display panel is provided for an embodiment of the present application.

[0121] In one technical solution, as shown in Figure 21 the inclination angle θ of the side surface of the second organic encapsulation layer 40 is 90°. The influence of the side surface of the organic encapsulation layer above the light-emitting layer 10 on the display area of the display panel 01 can be more effectively reduced, and the width of the frame of the display panel 01 can be effectively reduced. In addition, when the display panel 01 is used for a spliced screen, the visibility of the splicing seam of the spliced screen can be weakened.

[0122] Figure 22 A schematic view of a display device is provided for an embodiment of the present application, Figure 23 A schematic view of another display device is provided for an embodiment of the present application.

[0123] As shown in Figure 22 the present application also provides a display device 001, which includes the display panel 01 provided by any of the above embodiments. Figure 22 The display device 001 shown is only for illustrative purposes, and the display device 001 can be any electronic device with display function, such as a mobile phone, a tablet computer, a notebook computer, an e-paper, a television, etc. As shown in Figure 23 The display device is a spliced display device including the above display panel 01.

[0124] The risk of the light-shielding layer 30 remaining in the area corresponding to the second area A2 of the display panel 01 in the display device 001 provided by the embodiments of the present application is reduced, and the process yield is increased. When the display device 001 is a spliced display device, the risk of process failure in the second area A2 due to the flow of the light-shielding layer 30 to the second area A2 is reduced, and therefore, the width of the second area A2 can be made narrower, and the visibility of the splicing seam is reduced.

[0125] The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that, The display panel includes a first area and a second area, wherein the second area is located on the side of the first area near the edge of the display panel, and the first area includes an outer boundary near the second area; the display panel includes: The light-emitting layer includes an array layer and a light-emitting device layer. The array layer includes multiple driving devices and the light-emitting device layer includes multiple light-emitting devices, which are located in the first region. The light-emitting layer also includes multiple insulating layers, a portion of which is included in the first region and a portion of which is not included in the second region. A first organic encapsulation layer is located on the side of the light-emitting device layer away from the array layer; the first organic encapsulation layer encapsulates the light-emitting device. A light-shielding layer is located on the side of the first organic encapsulation layer away from the light-emitting layer; the light-shielding layer includes a plurality of cutouts and the cutouts expose the light-emitting device; The first organic encapsulation layer includes a first edge adjacent to the second region, the first edge being located on the side of the outer boundary away from the second region and the distance between the first edge and the outer boundary being d, where d > 0.

2. The display panel according to claim 1, characterized in that, The second area includes multiple pins that are electrically connected to the circuit board.

3. The display panel according to claim 1, characterized in that, d≥5μm.

4. The display panel according to claim 3, characterized in that, d≥40μm.

5. The display panel according to claim 1, characterized in that, The tilt angle of the side surface of the first organic encapsulation layer is less than 90°.

6. The display panel according to claim 1, characterized in that, The light-shielding layer covers the edge of the first organic encapsulation layer.

7. The display panel according to claim 1, characterized in that, The first organic encapsulation layer is a negative photosensitive layer.

8. The display panel according to claim 1, characterized in that, The first edge includes a first protrusion that protrudes away from the location of the first region.

9. The display panel according to claim 8, characterized in that, The included angle of the first protrusion is ≥150°.

10. The display panel according to claim 9, characterized in that, The first edge also includes a second protrusion, which protrudes away from the location of the first area, and the shape of the second protrusion is different from that of the first protrusion.

11. The display panel according to claim 10, characterized in that, The included angle of the second protrusion is less than or equal to the included angle of the first protrusion.

12. The display panel according to claim 10, characterized in that, The width of the second protrusion along the second direction is less than the width of the first protrusion along the second direction. The second direction is perpendicular to the first direction, and the first direction is parallel to the plane where the display panel is located and parallel to the arrangement direction of the first area and the second area.

13. The display panel according to claim 10, characterized in that, The length of the second protrusion along the first direction is less than the length of the first protrusion along the first direction. The first direction is parallel to the plane where the display panel is located and is parallel to the arrangement direction of the first area and the second area.

14. The display panel according to claim 8, characterized in that, The first protrusion overlaps with the light-emitting device in a first direction, which is parallel to the plane of the display panel and parallel to the arrangement direction of the first area and the second area.

15. The display panel according to any one of claims 10-13, characterized in that, The second protrusion is misaligned with the light-emitting device in a first direction, which is parallel to the plane of the display panel and parallel to the arrangement direction of the first area and the second area.

16. The display panel according to claim 8, characterized in that, The display panel further includes a third region, and the first organic encapsulation layer further includes a second edge adjacent to the third region; The second edge includes a third protrusion, which protrudes outward from the location of the first area along a second direction. The second direction is parallel to the plane of the display panel and perpendicular to the arrangement direction of the third area and the first area.

17. The display panel according to claim 1, characterized in that, The first organic encapsulation layer includes a first portion and a second portion, wherein the second portion is located in the first region, and the first portion is located on the side of the second portion facing the second region; The thickness of the first part is less than the thickness of the second part.

18. The display panel according to claim 17, characterized in that, The first part includes a first sub-part and a second sub-part, wherein the first sub-part is located on the side of the second sub-part facing the second region; The thickness of the first sub-part is less than the thickness of the second sub-part.

19. The display panel according to claim 17, characterized in that, The surface of the first portion facing away from the light-emitting layer includes multiple grooves.

20. The display panel according to claim 19, characterized in that, In a direction parallel to the plane of the display panel, the distance between the groove and the light-emitting device is greater than or equal to 5 μm.

21. The display panel according to claim 19, characterized in that, The multiple grooves are arranged in a checkerboard pattern.

22. The display panel according to claim 19, characterized in that, Its features are, The first part includes multiple serrations.

23. The display panel according to claim 21, characterized in that, The width of the saw teeth is less than or equal to 10 μm, and / or, The distance between adjacent saw teeth is less than or equal to 10 μm.

24. The display panel according to claim 1, characterized in that, The display panel further includes a second organic encapsulation layer, which is located on the side of the light-shielding layer away from the first organic encapsulation layer. The second organic encapsulation layer covers the edge of the first organic encapsulation layer.

25. The display panel according to claim 24, characterized in that, The tilt angle of the side surface of the second organic encapsulation layer is greater than the tilt angle of the side surface of the first organic encapsulation layer.

26. The display panel according to claim 24, characterized in that, The tilt angle of the side surface of the second organic encapsulation layer is 90°.

27. The display panel according to claim 24, characterized in that, The second organic encapsulation layer covers the edge of the light-shielding layer.

28. The display panel according to claim 24, characterized in that, The first organic encapsulation layer is made of the same material as the second organic encapsulation layer.

29. A display device, characterized in that, Includes the display panel as described in any one of claims 1-28.

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