Apparatus, system and method for aligning flat and film frames

By designing an alignment system that includes an alignment body, a slide, and a corrector, the problem of existing technologies being unable to adapt to various substrate sizes is solved, achieving efficient and low-cost multi-size thin film frames and wafer alignment, and improving chip yield.

CN121175792APending Publication Date: 2025-12-19JABIL INC
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Patent Information

Application Number
CN202480031206.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-05-10
Filing Date
2024-05-01
Publication Date
2025-12-19

AI Technical Summary

Technical Problem

The lack of existing tools that can adapt to various substrate sizes leads to reduced chip yield, and existing tools can usually only handle one size of thin film frame, making it impossible to efficiently handle batches of FF of different sizes.

Method used

A flat panel component aligner is provided, comprising an aligner body, a slide, a corrector, and a drive mechanism, which can accommodate thin film frames and wafers of different sizes by synchronously moving the slide and the corrector, thereby reducing the overall cost by utilizing its flexibility and small footprint.

Benefits of technology

It achieves efficient alignment of thin-film frames and wafers of various sizes, improves chip yield, reduces total cost, and adapts to the needs of substrates of different sizes.

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Abstract

An apparatus, system, and method for providing a flat plate element aligner. An embodiment includes: an aligner body; two opposing carriages disposed along at least first axes parallel to each other, each carriage terminating at a side guide at a distal end away from a center point of the aligner body, and each carriage sliding along a chute in an upper portion of the aligner body; two opposing correctors disposed at least along a second axis parallel to each other and perpendicular to the two opposing slides, each corrector terminating in a roller at a distal end away from a center point of the aligner body, and each corrector sliding along a chute in an upper portion of the aligner body; and at least one drive device located within the aligner body and below the upper portion, the drive device synchronously and symmetrically moving the at least two opposing slides to approach and away from each other and synchronously and symmetrically moving the at least two opposing correctors to approach and away from each other, the opposing side guides and the opposing rollers are enabled to align with the flat plate element.
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Description

Cross Reference to Related Applications

[0001] This application claims priority to U.S. Provisional Application No. 63 / 465,305, filed May 10, 2023, entitled “Apparatus, System, and Method for Aligning Flat Panel and Film Frame,” the entirety of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates generally to the field of manufacturing, and more specifically, to an apparatus, system, and method for aligning flat panel and film frame. BACKGROUND

[0003] The production of microchips involves separating hundreds of discrete chips from the silicon wafer on which they are printed. The wafer is typically placed in a circular film frame, which includes a stretch plastic liner with an adhesive film. The film frame is configured with a 1-2 mm thick stainless steel border with a clearance hole for the wafer, a square edge with a positioning slot on the edge.

[0004] The film frame and wafer are then assembled in subsequent manufacturing steps by a process of sawing individual chips. These steps can include, for example, retrieving finished chips for placement by a robot.

[0005] Furthermore, the automated handling of the film frame (FF) requires an alignment step each time the FF is moved in the process. The FF is typically stored in an FF magazine and picked by a robot for use in other tools. The critical positioning for alignment is often compromised between storage and actual work events. Therefore, the FF or flat panel (FP or FPD) needs to be corrected and positioned when it is picked from storage.

[0006] The standard practice is to use a positioning V-notch to repeatably position the FF so that subsequent placement operations are repeatable. For example, if the FF is not positioned beforehand, resulting in misalignment of the wafer alignment, chip yield is reduced.

[0007] Currently, there are no tools that can accommodate various substrate sizes considering the need for positioning and alignment. With the emergence of multiple wafer and FF sizes, a tool that can handle multiple FF sizes would be very helpful in efficiently handling different sizes of FF batches in one work cell.

[0008] Therefore, compared to the current dedicated FF alignment station that can typically only handle one size, there is a need for a flat panel element aligner that reduces the total cost by taking advantage of its flexibility and smaller footprint. It is additionally noted that the various substrate sizes shown herein are non-limiting, and thus, the sizes detailed in the present disclosure can be scaled in width or length for the purposes discussed herein. SUMMARY

[0009] The present embodiment provides a device, system and method for providing a flat panel component aligner. The present embodiment comprises: an aligner body; two opposing carriages disposed at least along a first axis parallel to each other, each carriage terminating at a distal end away from a center point of the aligner body in a side guide, and each carriage sliding along a slot in an upper portion of the aligner body; two opposing correctors disposed at least along a second axis parallel to each other and perpendicular to the two opposing carriages, each corrector terminating at a distal end away from the center point of the aligner body in a roller, and each corrector sliding along the slot in the upper portion of the aligner body; and at least one drive device located within the aligner body and below the upper portion of the aligner body, the drive device moving the at least two opposing carriages synchronously and symmetrically towards and away from each other, and moving the at least two opposing correctors synchronously and symmetrically towards and away from each other, thereby enabling the opposing side guides and the opposing rollers to align a flat panel component.

[0010] Thus, to meet the above needs, the present embodiment provides a method, system and device for a flat panel component aligner, which reduces the total cost by utilizing its flexibility and smaller footprint compared to the current dedicated film frame aligner station which can only handle one size at a time. BRIEF DESCRIPTION OF DRAWINGS

[0011] The disclosure is illustrated in the accompanying drawings through an example and not limitation. The drawings can illustrate one or more embodiments of the disclosure alone or in combination. The elements shown in the drawings are not necessarily drawn to scale. Reference numerals can be repeated or not repeated in the drawings to indicate corresponding or analogous elements.

[0012] Figure 1 various aspects of the example embodiments of the application are illustrated; Figure 2 various aspects of the example embodiments of the application are illustrated; Figure 3 various aspects of the example embodiments of the application are illustrated; Figure 4 various aspects of the example embodiments of the application are illustrated; Figure 5 various aspects of the example embodiments of the application are illustrated; Figure 6 various aspects of the example embodiments of the application are illustrated; Figure 7 various aspects of the example embodiments of the application are illustrated; Figure 8 various aspects of the example embodiments of the application are illustrated; and Figure 9 various aspects of the example embodiments of the application are illustrated. Detailed Implementation

[0013] The accompanying drawings and descriptions provided herein may be simplified to illustrate aspects relevant to a clear understanding of the devices, systems, and methods described herein, while for clarity, omissions have been made of typical similar devices, systems, and other aspects that may exist. Those skilled in the art will recognize that implementing the devices, systems, and methods described herein may expect and / or require additional elements and / or operations. However, because such elements and operations are well-known in the art and because they do not contribute to a better understanding of this disclosure, a discussion of these elements and operations may not be provided herein. Nevertheless, this disclosure is deemed to inherently include all such elements, variations, and modifications that will be apparent to those skilled in the art upon reading this disclosure.

[0014] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. For example, as used herein, the singular forms "a," "an," and "described" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprising," "including," "containing," and "having" are inclusive and thus specify the presence of the stated feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein should not be construed as having to be performed in the specific order discussed or illustrated, unless the performance order is explicitly identified. It should also be understood that additional or alternative steps may be employed.

[0015] When an element or layer is described as "on," "joined to," "connected to," or "coupled to" another element or layer, it can be directly on, joined to, or coupled to another element or layer, or there may be intermediate elements or layers. Conversely, when an element is described as "directly on," "directly joined to," "directly connected to," or "directly coupled to" another element or layer, there are no intermediate elements or layers. Other terms used to describe relationships between elements should be interpreted similarly (e.g., "between" vs. "directly between," "adjacent" vs. "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0016] While the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can be only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. That is, terms such as "first," "second," and other numerical terms used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

[0017] A thin film frame and flat panel (collectively referred to herein as "flat panel elements") aligner is disclosed. Further, the disclosed tool can not be limited to positioning thin film frames. Rather, by way of non-limiting example, embodiments can also position and correct flat panel panels or circular wafers during manufacturing processes.

[0018] The disclosed tool can include lateral guides that open and close symmetrically about the tool centerline and can have a range of motion of, for example, 90 mm to 400 mm. Longitudinal centering rollers can also be included that open and close symmetrically about the tool centerline and can have a range of motion of, for example, 90 mm to 400 mm.

[0019] The disclosed embodiments can also include thin film frame V-shaped indexing combs. These indexing combs can provide indexable positioning and can be retracted and extended on demand.

[0020] Included guiding lifters can support smaller thin film frames or wafers. The guiding lifters can allow for clearance for picking up smaller objects using narrow end effectors that can otherwise interfere with the lateral guides.

[0021] In-situ sensing of thin film frames or wafers can also be provided in example embodiments. A centrally located ultrasonic sensor can detect the presence or absence of a thin film frame on the tool. The ultrasonic sensor can detect objects regardless of the optical reflectivity of the object.

[0022] In some embodiments, a synchronous drive shaft can also be further included, such as a synchronous belt drive that can be driven by a stepper motor with an encoder. Also notable in example embodiments is an on-board drive and controller for the synchronous drive shaft.

[0023] Pneumatic versions of embodiments can be used, for example, for 150 mm, 200 mm, 300 mm thin film frames. Such embodiments can include, for example, 3 position tray guides, 3 comb finger positions, and thin film frame correction slides.

[0024] A first servo version of the embodiments can include servo positioning tray guides to handle any type of film frame between, for example, 150mm to 300mm in size (non-limiting example). This version of the embodiments can include, for example, 3 pneumatically actuated comb finger positions and one pneumatically actuated film frame correction slide.

[0025] In a fully servo driven film frame embodiment, servo positioning tray guides can handle any type of film frame between 150mm to 300mm (non-limiting example). This embodiment can include 3 servo comb finger positions and one servo film frame correction slide.

[0026] Some of the example embodiments can include optional tray guide lifters. Optional wafer centering and / or optional bar code scanning can also be included.

[0027] In semiconductor processing units, it is often necessary to properly position a film frame for inclusion in a semiconductor process flow. In typical cases, a film frame positioner includes a circular metal ring on which a vinyl film is placed, to which a semiconductor wafer can be adhered.

[0028] There is a need for better alignment of film frames within such semiconductor processing units in order to more effectively use the film frames and semiconductor wafers in the process and subsequent semiconductor processes. Similarly, similar aligners within processing units are used for display panels, and thus a need for improved alignment and higher downstream efficiency is also embodied in such display panel aligners.

[0029] Figure 1 An aligner 10 for film frames 12 and / or display panels is illustrated. The aligner 10 can handle a variety of sizes of film frames, such as 300mm, 200mm, 150mm and smaller sizes. That is, the embodiments provide a universal size film frame and panel aligner 10.

[0030] As shown, the present embodiments include a lateral axis synchronous adjuster 20 that moves to align the film frame along the X-axis. The synchronous adjuster 20 can move the end side guides 22 at the outermost portions of the illustrated X-axis adjustment in unison toward or away from a center point 24 of the aligner base 26, and thus the range of movement of the side guides 22 must cover the range of diameters of the film frames 12 to be aligned. In example embodiments, for film frames with diameters between 100mm and 300mm, the adjustable range can be, for example, specifically between 98mm and 389mm. However, those skilled in the art will appreciate that any diameter size can be used with the present embodiments so long as the side guides have a sufficient lateral range of movement to move inward toward the center or outward away from the center to accommodate the film / wafer size being used.

[0031] A centering Y-axis roller 30 is also shown, which can also move inwardly toward the center 24 along the Y-axis, or outwardly away from the center along the Y-axis, to accommodate the diameter of the film frame 12 or wafer. In the present embodiment, it is preferred that the centering Y-axis adjuster 30 is also internally synchronized, i.e., it moves synchronously toward and in alignment with the center point 24 of the aligner base 26. Notably, Figure 1 The diameter of the film frame 12 shown in

[0032] Reference is now made to Figure 2 , a 150mm film frame 12 is shown on the aligner base 26. Notably, both the X-axis side guides 22 and the centering Y-axis roller 30 have been adjusted synchronously inwardly toward the center point to accommodate the size of the 150mm diameter film frame as compared to the 300mm diameter film frame shown in Figure 1 .

[0033] It is further noted that it can be preferred to automatically detect the wafer / frame / panel size to indicate the required synchronous X and Y axis adjustment. It can also be desirable to perform this detection by sensors that are capable of operating regardless of the reflective properties of the wafer / film frame / panel placed on the aligner. Thus, by way of non-limiting example, ultrasonic sensors can be employed to perform this size and / or position sensing.

[0034] Figure 2 Also illustrated in is a plurality of sets of pins 50, which can engage with the locating details on each film frame 12. Thus, the pins 50 can be raised and lowered, for example by pneumatic or electric means.

[0035] It will be appreciated from the description of the embodiments of Figure 1 and Figure 2 that rectangular display panels, such as those used in cellphones, can also be used with the aligner of the present embodiments. For example, in such a case, the side guides and centering Y-axis roller can be used to "square up" the rectangular display panel, just as the side guides and centering Y-axis roller do for the circular film frame in Figure 1 and Figure 2 .

[0036] Figure 3 A side view of an exemplary flat panel aligner 10 for film frames and / or display panels is illustrated. In this illustration, the staggered arrangement of engagement pins 50 for different film frame sizes is apparent, as is the raising of pins 50a corresponding to the 300mm film frame size, and / or the lowering of pins 50b, 50c corresponding to the 150mm and 200mm film frame sizes.

[0037] Further illustrated is the simultaneous movement of the centering / correction axis rollers 30 (a and b) outward along the aligner base 26 to accommodate larger film frame sizes. Also illustrated is the ability to raise (30a) or retract (30b) the correction axis rollers to accommodate different film frame or wafer features and to avoid film frame drift on the support pins. In the figure, the dual position (raised or retracted) correction rollers on the left most side of the aligner base are in the raised position 30a and are engaged with the film frame (as shown). In contrast, the dual position correction axis rollers on the right side of the aligner are in the retracted position 30b (as shown) and thus are free to move under the film frame as necessary for a particular process.

[0038] Figure 4 Illustrated are various aspects of the flat panel aligner 10 as viewed from the top, with no cover plate on the aligner base 26. As shown, the centering / correction Y-axis rollers 30 can be located on pneumatic cylinders 110 to enable the raising and retracting discussed herein. In addition, the synchronization of the lateral movement of the centering / correction Y-axis rollers can be transmitted by, for example, belt drives 120 driven by motors (e.g., servo motors).

[0039] Similarly, the X-axis side guides can be driven synchronously, for example, by belt drives driven by motors (e.g., servo motors). Those skilled in the art will appreciate that in embodiments a single belt and associated gear train can be used, with one or more drive motors, or alternatively, each adjustment axis (i.e., the X-axis side guides and the centering Y-axis rollers) can have its own dedicated belt and / or its own dedicated drive motor. As Figure 4 shown, the synchronous drives for the X-axis side guides and the centering / correction Y-axis rollers can be staggered in height so as to allow each adjustment axis to operate synchronously without interference with the other adjustment axes.

[0040] Also shown at the bottom of the aligner are one or more fans 130. The one or more fans can be used to draw particulate matter (e.g., from the drive features) out of the bottom of the aligner to avoid the particulate matter escaping from the top of the aligner through, for example, the moving chutes used for axis adjustment. Escaping particulate matter can cause contamination of the film frame, wafer or panel associated with the aligner.

[0041] Figure 5 is another top view schematic of the flat panel aligner 10 disclosed herein (without a cover plate). Again shown in this view are the drive systems for the X-axis side guides 140 and the centering Y-axis rollers 150 at different heights. Also shown in this figure are dual belt drives 120 for each adjustment axis, as well as at least one motor 160 associated with the belt drives.

[0042] It is also clear from this figure that the extendable and retractable engagement pin shaft 50 and its actuator 170 are visible. Also shown are the four staggered linear guides 180, with two linear guides 180 per adjustment axis. It will be appreciated by those skilled in the art that the linear guides can be offset arranged in order to optimize the adjustment range provided by the aligner without enlarging the aligner. Finally, Figure 5 The pneumatic and electrical connection means 190 located on the left side of the aligner (as shown) are illustrated.

[0043] Certain features described above are shown in more detail in the top view (aligner without cover plate) of Figure 6 The two servo motors 160, one per adjustment axis, are shown. Also shown is the offset / staggered nature of the linear guides 180 adjusted by the belt drive arrangement driven by the servo motors 160. It will be appreciated that the offset nature of the linear guides can require the belt drive arrangement to operate in a serpentine fashion, as shown, again in order to minimize the overall width of the aligner device. It goes without saying that if the width of the device is minimized, the device can be adapted for a wider range of work cells. Finally, with regard to Figure 6 The pneumatic valve 200, which can enable the lift function of various aspects discussed herein, is also shown.

[0044] Figure 7 The synchronous positioning of a rectangular display panel 12 on the disclosed aligner 10 is illustrated. The display panel shown is formed of glass, which is held and centered by the side guides 22 and centering / correction shaft rollers 30 shown. It is further noted that since there are no alignment features on the transparent glass panel, the engagement pin shaft 50 is not raised so as not to interact with the panel in any way. Figure 8 A 100 mm wafer 12 is shown in a centered position on the disclosed aligner 10. As Figure 8 The staggered nature of the axial adjustments (in particular in relation to the side guides 22), and the corresponding serpentine nature of the belts driving these axial adjustments, can allow for a very wide range of circular and rectangular objects to be aligned on the disclosed aligner, as shown.

[0045] Figure 9 Another embodiment is illustrated, in which edge access to a wafer 12 is provided using the disclosed aligner 10, for example to enable more efficient access by certain types of end effectors. As shown, the side guides 22 can again center the wafer along the X axis, but in the illustrated embodiment, the wafer is placed "outside" of the centering rollers 30, such that when the centering rollers are moved synchronously outward, the wafer can be pushed outward from its offset position towards the end of the aligner, for example to allow an end effector to grasp along the edge of the wafer.

[0046] Accordingly, in the disclosed embodiments, the elements placed on the aligner can be positioned so as to move to a subsequent chuck or operation in a semiconductor process or similar process. It is additionally noted, and as referenced throughout, that the elements aligned by the aligner can be square or circular, or can be circular but with a cut straight edge, as sometimes occurs in the art. Furthermore, while the above disclosure indicates that some elements can be pneumatically driven, while others are electrically driven (e.g., by a motor), one skilled in the art, upon reading this disclosure, will understand that the reverse is also true, i.e., that elements discussed herein as being motor driven can be pneumatically driven, and elements disclosed herein as being pneumatically driven can be motor driven, to name non-limiting examples.

[0047] In the foregoing Detailed Description, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the embodiments require more features than are explicitly recited in each claim. Rather, inventive embodiments can lie in less than all features of a single disclosed embodiment.

Claims

1. A flat panel element aligner comprising: an aligner body; two opposing carriages disposed at least along first axes parallel to each other, each carriage terminating at a distal end away from a center point of the aligner body in a side guide, and each carriage sliding along a slot of an upper portion of the aligner body; two opposing correctors disposed at least along second axes parallel to each other and perpendicular to the two opposing carriages, each corrector terminating at a distal end away from the center point of the aligner body in a roller, and each corrector sliding along the slot of the upper portion of the aligner body; and at least one drive means within the aligner body and below the upper portion, the drive means moving at least the two opposing carriages synchronously and symmetrically towards and away from each other, and moving at least the two opposing correctors synchronously and symmetrically towards and away from each other, thereby enabling the opposing side guides and the opposing rollers to align a flat panel element. The flat panel element is a film frame.

2. The flat panel component aligner of claim 1, wherein, The flat panel element is a display panel.

3. The flat panel component aligner of claim 1, wherein, The flat panel element is a wafer.

4. The flat panel component aligner of claim 1, wherein, The at least one drive means is two belt drive means, and wherein a first of the two belt drive means is dedicated to the two opposing carriages, and wherein a second of the two belt drive means is dedicated to the two opposing correctors.

5. The flat panel component aligner of claim 1, wherein, 6. The flat panel element aligner of claim 1, further comprising a motor within the aligner body for driving each of the at least one drive means. The motor is a stepper motor.

7. A flat panel component aligner according to claim 6, wherein, Each of the at least one drive means is a belt drive means.

8. The flat panel component aligner of claim 1, wherein, The two opposing carriages have a total range of movement of 90mm to 400mm apart.

9. The flat panel component aligner of claim 1, wherein, The two opposing correctors have a total range of movement of 90mm to 400mm apart.

10. The flat panel component aligner of claim 1, wherein, 11. The flat panel element aligner of claim 1, further comprising a presence sensor on the upper portion capable of detecting presence of the flat panel element. The presence sensor is an ultrasonic sensor.

12. The flat panel component aligner of claim 11, wherein, The flat panel element has a diameter of 300mm, 200mm, 150mm or 100mm.

13. The flat panel component aligner of claim 1, wherein, 14. The flat panel element aligner of claim 1, further comprising engagement pins for engaging with locating features on the flat panel element. A plurality of the engagement pins are each capable of being raised and lowered.

15. A flat panel component aligner according to claim 14, wherein, The engagement pins are operated pneumatically.

16. The flat panel component aligner of claim 15, wherein, The engagement pins are operated electrically.

17. The flat panel component aligner of claim 15, wherein, ​