A wafer map display method, computer device, medium and product

Abstract

A wafer Map display method, computer equipment, medium and product, relate to the technical field of graphic visualization. Implementing the method, the computer equipment establishes a wafer Die data list in the memory and draws a drawing board bitmap, avoiding the resource consumption of creating independent UI controls for each Die in the wafer. When the Die state changes, only the fixed-point pixel modification in the memory is needed, and the modified unified display after a certain time is accumulated and submitted through the delay timer, greatly reducing the burden of the UI thread. This bitmap-based implementation makes the system resource occupation controllable even in the scene of tens of thousands of Dies, and the interface response is smooth and smooth. At the same time, the design of the delay timer ensures the real-time performance of the display and avoids too frequent interface refresh.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of graphic visualization, and in particular to a wafer Map display method, a computer device, a medium and a product. BACKGROUND

[0002] In the semiconductor industry, a wafer is the basic material for integrated circuit manufacturing. The electrical or optical parameters of each die in the wafer are tested to evaluate the performance and yield of the wafer. To visually monitor the testing process and analyze the test results, a wafer Map is usually used as a graphical interface. The wafer Map displays the status (such as "pass", "fail", "untested", etc.) of all dies in the wafer in real time or quasi-real time through a two-dimensional matrix or circular layout, and distinguishes them by different colors or symbols.

[0003] In related technologies, the wafer Map display method is to first place a grid or table as a container on the interface, then create an independent UI control (such as a color block or label) for each die in the wafer, and fill them into the container one by one. The status (such as "pass", "fail", "untested", etc.) of each die is displayed by directly modifying the color or symbol of its corresponding UI control.

[0004] However, the fundamental defect of this method is that when the number of dies reaches tens of thousands, its performance will deteriorate sharply. This is because each UI control is an object that consumes system resources, and creating and managing thousands of controls will consume a huge amount of memory and system handles. More seriously, frequently updating a large number of independent controls in high-speed testing will put a heavy burden on the UI thread, eventually leading to slow program response, interface refresh lag, even death, and it is difficult to meet the requirements of high-speed, real-time display of modern wafer detection. SUMMARY

[0005] The present application provides a wafer Map display method, a computer device, a medium and a product, which are used to improve the real-time performance and resource utilization of wafer Map display in large-scale die scenarios.

[0006] In a first aspect, the application provides a wafer Map chart display method applied to a computer device, the method comprising: establishing a wafer Die data list in a memory, the wafer Die data list comprising a plurality of wafer Die data units, the wafer Die data units being used to record logical coordinates, detection identifiers and detection results of individual Dies in a wafer; determining a pixel point region corresponding to the wafer Die data units based on the logical coordinates, determining a pixel point color corresponding to the wafer Die data units based on the detection identifiers and the detection results, and drawing a palette bitmap in the memory according to the pixel point region and the pixel point color, the palette bitmap being used to save real-time state display information of the wafer Dies; when a change in the detection identifier and / or the detection result of any wafer Die data unit is detected, performing a fixed-point pixel modification on the palette bitmap in the memory and resetting a preset time delay timer, the fixed-point pixel modification comprising updating the pixel point color corresponding to the wafer Die data unit whose detection identifier and / or detection result has changed; and when the time delay timer ends counting, submitting the palette bitmap with the fixed-point pixel modification accumulated in the preset time to a display device to display a wafer Map chart.

[0007] By adopting the above technical solution, the computer device establishes a wafer Die data list in the memory and draws a palette bitmap, thereby avoiding resource consumption caused by creating independent UI controls for each Die in the wafer. When the state of a Die changes, only a fixed-point pixel modification needs to be performed in the memory, and the modification in a certain time is accumulated and then uniformly submitted for display through a time delay timer, thereby greatly reducing the burden of a UI thread. This bitmap-based implementation makes the system resource occupation controllable and the interface response smooth and fluent even in a scenario of tens of thousands of Dies.

[0008] In combination with some embodiments of the first aspect, in some embodiments, the wafer Die data list is established in the memory, the wafer Die data list comprising a plurality of wafer Die data units, the wafer Die data units being used to record logical coordinates, detection identifiers and detection results of individual Dies in a wafer, and specifically comprising: obtaining wafer physical information and wafer detection data, the wafer physical information comprising wafer Die layout and a center Die of the wafer, and the wafer detection data comprising detection identifiers and detection results of the Dies in the wafer; establishing a coordinate system with the center Die of the wafer as an origin, with a direction of a wafer positioning groove as a positive direction of a y-axis, and with a direction perpendicular to the positive direction of the y-axis and to the right as a positive direction of an x-axis; calculating the logical coordinates of the Dies in the wafer based on the wafer Die layout and the coordinate system; and storing the logical coordinates, the detection identifiers and the detection results of the Dies in the wafer in the memory to obtain the plurality of wafer Die data units, thereby establishing the wafer Die data list.

[0009] By adopting the technical solution, the computer device establishes a coordinate system with the wafer center Die as the origin, the direction in which the wafer positioning groove is located as the positive direction of the y-axis, and the direction perpendicular to the positive direction of the y-axis and to the right as the positive direction of the x-axis, so that wafers of different sizes and different layouts can be organized and displayed in the same way. This standardized data structure design can flexibly adapt to various wafer types, improving the reusability and maintainability of the code. At the same time, the introduction of logical coordinates provides a reliable mathematical foundation for subsequent pixel mapping and region selection functions.

[0010] In some embodiments of the first aspect, based on the logical coordinates, the pixel point region corresponding to the wafer Die data unit is determined, based on the detection identifier and the detection result, the pixel point color corresponding to the wafer Die data unit is determined, and according to the pixel point region and the pixel point color, a drawing board bitmap is drawn in the memory, the drawing board bitmap is used to save the real-time state display information of the wafer Die, and specifically includes: loading the pixel point size, the pixel point spacing, and a pixel point color mapping table, the pixel point color mapping table includes the corresponding relationship between the combination of the detection identifier and the detection result and the pixel point color; according to the logical coordinates, the X-axis range and the Y-axis range are determined, and the drawing board size is calculated in combination with the pixel point size and the pixel point spacing; based on the drawing board size, a blank drawing board is created in the memory; each wafer Die data unit is traversed, and according to the corresponding logical coordinates, pixel point size and pixel point spacing, the pixel point region of the wafer Die data unit on the blank drawing board is determined; according to the detection identifier and the detection result of the wafer Die data unit, the corresponding pixel point color is found in the pixel point color mapping table; the pixel point region is filled with the pixel point color to obtain the drawing board bitmap.

[0011] By adopting the technical solution, the computer device calculates the drawing board size and the pixel point region of the wafer Die data unit on the blank drawing board, realizes accurate positioning, and uniformly manages the display style through the pixel point color mapping table, which can flexibly configure the display effect of the Die and support different combinations of detection identifiers and detection results. This way of creating a blank drawing board in memory and filling pixels one by one avoids the performance overhead caused by repeatedly creating UI controls, and the entire drawing process adopts a batch processing idea, which not only ensures the uniformity and aesthetics of the display effect, but also realizes efficient memory usage and processing performance.

[0012] In some embodiments of the first aspect, in some embodiments, when a change in the detection identifier and / or the detection result of any wafer Die data unit is detected, a point pixel modification is performed on the palette bitmap in the memory and a delay timer with a preset time length is reset, the point pixel modification includes updating the pixel color corresponding to the wafer Die data unit whose detection identifier and / or detection result has changed, and specifically includes: receiving one or more Die state update information, the Die state update information including the logical coordinates of a single Die in the wafer whose detection identifier and / or detection result has changed; determining a pixel update area according to the logical coordinates of the single Die in the wafer whose detection identifier and / or detection result has changed; searching for a corresponding updated pixel color in a pixel color mapping table according to the changed detection identifier and / or detection result; filling the pixel update area with the updated pixel color to complete the point pixel modification; and resetting the delay timer with a preset time length.

[0013] By adopting the above technical solution, the computer device receives the Die state update information and directly performs the point pixel modification in the memory, avoiding the overhead of redrawing the entire palette bitmap. At the same time, the computer device uses the delay timer to combine multiple updates in a short time, effectively reducing the frequency of UI refresh. This method is suitable for the case of a large number of Die state changes that may exist in a high-speed detection scenario. Combined with point pixel modification and delayed submission, it not only ensures the real-time performance of the display, but also significantly reduces the system resource consumption, so that the data update can be smoothly performed and a smooth visual effect can be provided.

[0014] In some embodiments of the first aspect, after the step of submitting the palette bitmap of the point pixel modification accumulated in the preset time length to the display device to display the wafer Map diagram when the delay timer ends, the method further includes: in response to a click operation of a user, determining a target pixel point area based on the click position of the user; positioning a floating selection box to the target pixel point area and displaying the target logical coordinates, the target detection identifier and the target detection result of the target wafer Die data unit in the floating selection box, the floating selection box being used to provide a selected state display of the wafer Die.

[0015] By adopting the above technical solution, when the user performs a click operation, the computer device can accurately position the target pixel point area and display the target logical coordinates, the target detection identifier and the target detection result of the target wafer Die data unit. This instant response interaction mode enables the user to intuitively understand the state of any Die in the wafer, effectively improving the efficiency of data analysis and problem positioning. At the same time, the floating selection box enhances the user interaction experience and does not affect the basic display of the palette bitmap, ensuring the overall performance of the interface.

[0016] In some embodiments of the first aspect, after the step of positioning the floating selection box to the target pixel point region and displaying the target logical coordinates of the target wafer Die data unit, the target detection mark and the target detection result in the floating selection box, the method further comprises: in response to a display mode switching instruction of the user, switching the display mode of the wafer Map between a grid mode and a physical mode; and keeping the position and display content of the floating selection box unchanged when switching the display mode.

[0017] By adopting the above technical solutions, the display requirements in different scenarios are met, and the grid mode and the physical mode can be flexibly switched. The grid mode is suitable for accurate positioning and data comparison, and the physical mode can provide a more intuitive overall distribution view. The position and display content of the floating selection box are kept unchanged during mode switching, ensuring the continuity of user operation and avoiding the trouble of repeated selection. The support of such multi-mode display greatly improves the practicability of the system and better meets the visualization requirements of different users in different working scenarios.

[0018] In some embodiments of the first aspect, after the step of submitting the accumulated stencil pixel modification palette within the preset time period to the display device to display the wafer Map when the delay timer ends, the method further comprises: in response to a drag operation of the user, determining a polygon selection region based on the drag start position and the drag end position of the user; identifying all wafer Die data units in the polygon selection region and counting the number of detection marks and detection results in all wafer Die data units to generate a statistical result pop-up window, wherein the wafer Die total number in the polygon selection region and the number distribution of detection marks and detection results are displayed in the statistical result pop-up window.

[0019] By adopting the above technical solutions, the user can define a region of interest (polygon selection region) through a drag operation, and the computer device can automatically identify all Dies in the region of interest (polygon selection region) and generate statistical information. The statistical result pop-up window clearly shows the total number of Dies in the polygon selection region and the distribution of various states, providing strong support for yield analysis and quality control. The flexible selection of the region and the instant statistics function enable the user to quickly find and analyze abnormal distribution patterns on the wafer, significantly improving the efficiency and accuracy of data analysis.

[0020] In a second aspect, an embodiment of the present application provides a computer device, comprising: one or more processors and a memory; the memory is coupled to the one or more processors, and the memory is configured to store computer program codes, the computer program codes comprising computer instructions, and the one or more processors are configured to invoke the computer instructions to cause the computer device to perform the method described in the first aspect and any possible implementation manner of the first aspect.

[0021] In a third aspect, an embodiment of the present application provides a computer program product comprising instructions which, when executed on a computer device, cause the computer device to perform the method described in the first aspect and any possible implementation manner of the first aspect.

[0022] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium comprising instructions which, when executed on a computer device, cause the computer device to perform the method described in the first aspect and any possible implementation manner of the first aspect.

[0023] It can be understood that the computer device provided in the second aspect, the computer program product provided in the third aspect and the computer storage medium provided in the fourth aspect are all used to execute the method provided in the embodiments of the present application. Therefore, the beneficial effects that can be achieved by them can refer to the beneficial effects in the corresponding method, which will not be described here.

[0024] The one or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0025] 1. By using the above technical solution, the computer device establishes a wafer Die data list and draws a drawing board bitmap in the memory, avoiding the resource consumption of creating independent UI controls for each Die in the wafer. When the Die state changes, only the fixed-point pixel modification in the memory is needed, and the modification after a certain time is uniformly submitted for display through the delay timer, greatly reducing the burden of the UI thread. This bitmap-based implementation makes the system resource occupation controllable even in the scene of tens of thousands of Dies, and the interface response is smooth and smooth. At the same time, the design of the delay timer ensures the real-time performance of the display, and avoids too frequent interface refresh.

[0026] 2. By adopting the above technical solution, the computer device receives the Die state update information and directly performs the fixed-point pixel modification in the memory, avoiding the overhead of re-drawing the entire drawing board bitmap. At the same time, the computer device uses the delay timer to perform the merging processing on the multiple updates in a short time, effectively reducing the frequency of UI refreshing. This method is suitable for the case of a large number of Die state rapid changes that may exist in the high-speed detection scene, and in combination with the fixed-point pixel modification and the delayed submission, the real-time performance of the display is ensured, and the system resource consumption is significantly reduced, so that the data update can be smoothly performed, and a smooth visual effect is provided.

[0027] 3. By adopting the above technical solution, the display requirements in different scenes are met, and the grid mode and the entity mode can be flexibly switched. The grid mode is suitable for accurate positioning and data comparison, and the entity mode can provide a more intuitive overall distribution view. The position and the display content of the floating selection box are kept unchanged in the mode switching process, ensuring the continuity of the user operation and avoiding the trouble of repeated selection. The support of such multi-mode display greatly improves the practicability of the system, and better meets the visualization requirements of different users in different working scenes. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a flowchart of a wafer Map chart display method in an embodiment of the present application;

[0029] Figure 2 is another flowchart of a wafer Map chart display method in an embodiment of the present application;

[0030] Figure 3 is a schematic diagram of an entity device structure of a computer device in an embodiment of the present application. DETAILED DESCRIPTION

[0031] The terms used in the following embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to be limiting on the present application. As used in the specification of the present application, the singular expression "one", "a", "the", "said" and "this" are intended to also include the plural expression, unless there is clear indication to the contrary in the context. It should also be understood that the term "and / or" used in the present application means any or all possible combinations of one or more listed items.

[0032] Hereinafter, the terms "first" and "second" are only for the purpose of description, and cannot be understood as implying or suggesting relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features, and in the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise specified.

[0033] The method provided by the embodiment is described below in a flow. Please refer to Figure 1 FIG. 1 is a flowchart of a method for displaying a wafer Map provided by an embodiment of the present application.

[0034] S101, establishing a wafer Die data list in a memory, the wafer Die data list including a plurality of wafer Die data units, each wafer Die data unit being used to record logical coordinates, a detection identifier and a detection result of a single Die in a wafer;

[0035] Wherein, wafer refers to a circular silicon wafer substrate in a semiconductor manufacturing process, which is a basic material for integrated circuit manufacturing, and the diameter is usually 8 inches or 12 inches; Die refers to a single independent chip unit formed on a wafer through processes such as photolithography and etching, and a wafer usually contains hundreds to tens of thousands of Dies; wafer Die data list refers to a data structure stored in a memory, which is used to store a plurality of wafer Die data units in order; wafer Die data unit refers to a single record in the wafer Die data list; logical coordinates refer to row and column coordinate values describing the position of a Die in a standardized coordinate system; detection identifier is used to indicate the state mark of whether a Die has been detected, such as "detected" and "undetected"; detection result refers to the test determination result of a Die, such as "pass" and "fail"; and memory refers to the random access memory of a computer device, which is used to temporarily store programs and data.

[0036] Specifically, first, the computer device obtains wafer physical information, which includes wafer Die layout and wafer center Die. Then, the computer device establishes a coordinate system with the wafer center Die as the origin, the direction of the wafer positioning groove as the positive direction of the y-axis, and the direction perpendicular to the positive direction of the y-axis and to the right as the positive direction of the x-axis. Next, the computer device calculates the row and column offset of each Die relative to the wafer center Die to obtain the logical coordinates. At the same time, the computer device obtains the detection identifier and the detection result of each Die through a detection device. Finally, the computer device packs the logical coordinates, the detection identifier and the detection result of each Die into a wafer Die data unit, and stores it in the wafer Die data list in the memory in order, to complete the initialization of the data structure.

[0037] Optionally, generally, a wafer Die data list is established in the memory, and the wafer Die data list includes a plurality of wafer Die data units. The wafer Die data unit is used to record the logical coordinates, detection identifiers and detection results of a single Die in the wafer. The detection results can be achieved in the following manner, which is not limited herein: obtaining wafer physical information and wafer detection data. The wafer physical information includes wafer Die layout and wafer center Die. The wafer detection data includes detection identifiers and detection results of each Die in the wafer. A coordinate system is established with the wafer center Die as the origin, with the direction of the wafer positioning groove as the positive direction of the y-axis, and with the direction perpendicular to the positive direction of the y-axis and to the right as the positive direction of the x-axis. Based on the wafer Die layout and the coordinate system, the logical coordinates of each Die in the wafer are calculated. The logical coordinates, detection identifiers and detection results of each Die in the wafer are stored in the memory to obtain a plurality of wafer Die data units, so as to establish the wafer Die data list.

[0038] Suppose there is an 8-inch wafer, and the Die is arranged in a rectangular array. The data is as follows:

[0039] Wafer physical information:

[0040] The wafer Die layout is a 15-row x 15-column rectangular array.

[0041] The wafer center Die is located at the 8th row and the 8th column.

[0042] The wafer positioning groove is at the top of the wafer.

[0043] Wafer detection data (partially shown):

[0044] The Die at the 8th row and the 8th column: detected, passed.

[0045] The Die at the 8th row and the 9th column: detected, failed.

[0046] The Die at the 7th row and the 8th column: not detected, unknown.

[0047] …

[0048] (1) Establish the coordinate system:

[0049] Origin: the wafer center Die corresponds to the origin (0, 0).

[0050] Positive direction of Y-axis: towards the wafer positioning groove direction (i.e. upwards, because the wafer positioning groove is at the top of the wafer).

[0051] Positive direction of X-axis: perpendicular to the Y-axis and to the right.

[0052] (2) Calculate the logical coordinates of each Die (partially shown):

[0053] Die in row 8 and column 8 -> (0, 0) / / origin

[0054] Die in row 8 and column 9 -> (1, 0) / / one grid to the right of the origin

[0055] Die in row 7 and column 8 -> (0, 1) / / one grid above the origin (towards the wafer positioning slot direction)

[0056] …

[0057] (3) Wafer Die data list (partial display):

[0058] Wafer Die data list = [{logical coordinates: (0, 0); detection identifier: "detected"; detection result: "pass"}, {logical coordinates: (1, 0); detection identifier: "detected"; detection result: "fail"}, {logical coordinates: (0, 1); detection identifier: "undetected"; detection result: "unknown"} …]

[0059] S102, based on the logical coordinates, determine the pixel point region corresponding to the wafer Die data unit, based on the detection identifier and the detection result, determine the pixel point color corresponding to the wafer Die data unit, according to the pixel point region and the pixel point color, draw the palette bitmap in the memory, the palette bitmap is used to save the real-time state display information of the wafer Die;

[0060] Wherein, the pixel point region refers to the pre-display region corresponding to the Die; the pixel point color refers to the pre-display color used to represent the state of the Die; the palette bitmap refers to the bitmap data stored in the memory for pre-display; the real-time state display information refers to the visualization information of the state of all Dies on the wafer at the current time.

[0061] Specifically, first, the computer device loads the pre-display parameter configuration, including the pixel point size, the pixel point spacing and the pixel point color mapping table. Secondly, the computer device scans the logical coordinates of all Dies in the wafer Die data list to determine the horizontal and vertical range of the entire pre-display region. Then, the computer device calculates and creates a blank bitmap of appropriate size in the memory based on the horizontal and vertical range of the pre-display region, combined with the pixel point size and the pixel point spacing. Next, the computer device traverses each wafer Die data unit and converts its logical coordinates to the pixel point region of the pre-display region. The computer device looks up the corresponding display color in the pixel point color mapping table according to the detection identifier and detection result of the Die, fills the display color into the corresponding pixel point region in the blank bitmap, and finally generates a complete palette bitmap containing the real-time state display information of all Dies in the wafer.

[0062] Optionally, generally, based on the logical coordinates, the pixel point region corresponding to the wafer Die data unit is determined, based on the detection mark and the detection result, the pixel point color corresponding to the wafer Die data unit is determined, and the drawing board bitmap in the memory is drawn according to the pixel point region and the pixel point color. The drawing board bitmap is used to save the real-time state display information of the wafer Die, which can be realized in the following way, which is not limited here: loading the pixel point size, the pixel point spacing, and the pixel point color mapping table, the pixel point color mapping table including the corresponding relationship between the combination of the detection mark and the detection result and the pixel point color; determining the X-axis range and the Y-axis range according to the logical coordinates, and combining the pixel point size and the pixel point spacing to calculate the drawing board size; creating a blank drawing board in the memory based on the drawing board size; traversing each wafer Die data unit, determining the pixel point region of the wafer Die data unit on the blank drawing board according to the corresponding logical coordinates, pixel point size and pixel point spacing; finding the corresponding pixel point color in the pixel point color mapping table according to the detection mark and the detection result of the wafer Die data unit; filling the pixel point region with the pixel point color to obtain the drawing board bitmap.

[0063] The following lists a pixel point color mapping example:

[0064] The detection mark "detected" corresponds to green with the detection result "pass";

[0065] The detection mark "detected" corresponds to red with the detection result "fail";

[0066] The detection mark "not detected" corresponds to gray with the detection result "unknown"

[0067] …

[0068] S103, when the detection mark and / or the detection result of any wafer Die data unit is changed, the drawing board bitmap in the memory is executed for point pixel modification and the preset time delay timer is reset, the point pixel modification includes updating the pixel point color corresponding to the wafer Die data unit whose detection mark and / or detection result is changed;

[0069] Wherein, the point pixel modification refers to the operation of updating only the pixel point color of a specific pixel point region in the drawing board bitmap; the delay timer represents a program component for timing and triggering an event after a specified time; the preset time length refers to a preconfigured time interval, usually tens to hundreds of milliseconds; reset means restoring the timing value of the delay timer to the initial state; the change of the detection mark refers to the change of Die from "not detected" to "detected"; the change of the detection result refers to the change of the test judgment of Die from one state to another, such as from "unknown" to "pass" or "fail".

[0070] Specifically, the computer device starts an event listening thread to receive the Die state update information from the detection device in real time. When detecting that the detection identifier or the detection result of a certain Die changes, the computer device first calculates the pixel point region corresponding to the pixel update region in the drawing board bitmap according to the logical coordinates of the Die, and then looks up the corresponding updated pixel point color in the pixel point color mapping table according to the changed detection identifier and / or detection result, and directly modifies the drawing board bitmap accordingly without redrawing the entire drawing board bitmap. After each execution of the point pixel modification, the computer device resets the delay timer to a preset time length (such as 200 milliseconds). If new Die state update information is received during the countdown of the delay timer, the computer device accumulates these updates but does not refresh the display temporarily, and only resets the delay timer. This mechanism can combine multiple updates in a short period of time for processing, avoiding too frequent display refresh.

[0071] Optionally, generally, when detecting that the detection identifier and / or the detection result of any wafer Die data unit changes, the drawing board bitmap is executed for point pixel modification in the memory and the delay timer of the preset time length is reset. The point pixel modification includes updating the pixel point color corresponding to the wafer Die data unit whose detection identifier and / or detection result changes, which can be implemented in the following manner, which is not limited herein: receiving one or more Die state update information, the Die state update information including the logical coordinates of a single Die in the wafer whose detection identifier and / or detection result changes; determining a pixel update region according to the logical coordinates of the single Die in the wafer whose detection identifier and / or detection result changes; looking up the corresponding updated pixel point color in the pixel point color mapping table according to the changed detection identifier and / or detection result; filling the pixel update region with the updated pixel point color to complete the point pixel modification; and resetting the delay timer of the preset time length.

[0072] S104, when the delay timer ends, submitting the drawing board bitmap of the point pixel modification accumulated in the preset time length to the display device to display the wafer Map graph.

[0073] Wherein, the end of the delay timer indicates that the waiting time has ended; the accumulation refers to all pixel modifications collected within the waiting time; the drawing board bitmap refers to the memory bitmap data containing the latest Die state information; the display device refers to a hardware device for displaying images, such as a display; the submission refers to transmitting the drawing board bitmap to the display device for display; and the wafer Map graph refers to a visual graph that visually displays the state distribution of all Dies on the wafer.

[0074] Specifically, when the delay timer expires and no new state update triggers a reset during the period, the computer device submits the current memory bitmap to the display device. The display device is responsible for converting the bitmap to the actual screen display content, refreshing the display device to show the latest wafer Map. The resolution and refresh characteristics of the display device are considered during the submission process to ensure clear and smooth image display. Through this delayed submission mechanism, both timeliness of display and avoidance of too frequent refresh operations are ensured, and good display performance is maintained in the case of frequent state updates.

[0075] By adopting the technical solution, the computer device establishes a wafer Die data list and draws a bitmap in the memory, avoiding resource consumption for creating independent UI controls for each Die in the wafer. When the Die state changes, only point pixel modification in the memory is needed, and the modified data is uniformly submitted for display through the delay timer, greatly reducing the burden of the UI thread. This bitmap-based implementation enables the system resource occupation to be controllable even in the case of tens of thousands of Dies, and the interface response is smooth and smooth. At the same time, the design of the delay timer ensures the real-time performance of the display and avoids too frequent interface refresh.

[0076] The method provided by the embodiment is further described in a more specific flow. Please refer to Figure 2 , which is another flowchart of the wafer Map display method in the embodiment.

[0077] The following steps can also be performed after step S104, or can not be performed, which is not limited here:

[0078] S201, in response to the user's click operation, determining a target pixel point area based on the user's click position.

[0079] The user's click operation indicates the user's click action on the wafer Map through a mouse, touch screen or other input device; the click position refers to the position of the mouse pointer or touch point on the wafer Map when the user performs the click operation; and the target pixel point area refers to the pixel point area occupied by the wafer Die corresponding to the click position in the bitmap.

[0080] Specifically, when the computer device detects the user's click operation on the wafer Map, the user's click position is obtained. Then, the computer device converts the click position to a relative coordinate in the bitmap. Next, the computer device scans the wafer Die data list to find the target pixel point area containing the relative coordinate by comparing the pixel point area range of each Die. This accurate coordinate mapping mechanism ensures that the user can accurately select any Die for viewing and analysis.

[0081] S202, position the floating selection frame to the target pixel point area, and display the target logical coordinates, target detection identifier and target detection result of the target wafer Die data unit in the floating selection frame, the floating selection frame is used to provide the selected state display of the wafer Die.

[0082] Wherein, the floating selection frame refers to a movable semi-transparent information display frame, which is used to highlight the currently selected Die; the target wafer Die data unit represents the data record corresponding to the selected Die; the target logical coordinates refer to the position of the selected Die in the coordinate system; the target detection identifier refers to the detection state of the selected Die; the target detection result refers to the specific test judgment of the selected Die; the selected state display is used to provide the detailed information of the currently selected Die to the user.

[0083] Specifically, after determining the target pixel point area, the computer device first calculates the display position of the floating selection frame, which is usually positioned directly above or to the right of the target pixel point area to avoid blocking the display of other Dies. Then, the computer device retrieves the target logical coordinates, target detection identifier and target detection result of the target wafer Die data unit from the wafer Die data list. Next, the computer device creates a floating selection frame, in which the target logical coordinates (such as "X: 5, Y: 3"), the target detection identifier (such as "detected") and the target detection result (such as "pass") are displayed in sequence. The floating selection frame adopts a semi-transparent effect to ensure that it does not completely block the underlying wafer Map diagram, while highlighting the currently selected Die, facilitating user information viewing and analysis.

[0084] S203, in response to the display mode switching instruction of the user, switch the display mode of the wafer Map diagram between the grid mode and the entity mode.

[0085] Wherein, the display mode switching instruction represents the display mode changing command triggered by the user through the interface button, shortcut key or menu item; the grid mode refers to the mode in which grid lines are displayed between the Dies when displaying the wafer Die, which is used for precise positioning and comparative analysis; the entity mode refers to the mode in which the grid lines are hidden and only the Die body is displayed when displaying the wafer Die, which is used for overall distribution observation; the display mode switching refers to the process of switching between the two display modes.

[0086] Specifically, when the computer device receives a user-triggered display mode switching instruction, it first identifies the current display mode. If the current display mode is grid mode, the computer device recalculates the drawing board bitmap, removes the grid line spacing between the dies, and makes the adjacent dies closely connected to form a solid mode display effect. If the current display mode is solid mode, the computer device adds a preset width (usually 1-2 pixels) of grid line spacing between the dies when recalculating the drawing board bitmap to restore the grid mode display effect. During the mode switching process, the computer device keeps the relative position and display color of each die unchanged, and only adjusts the display spacing between the dies and the visibility of the grid lines to ensure the continuity and smoothness of the display mode switching.

[0087] S204, during the switching of the display mode, the position and display content of the floating selection box are kept unchanged.

[0088] wherein the switching of the display mode refers to the conversion process between the grid mode and the solid mode; the position of the floating selection box represents the display coordinates of the floating selection box on the screen; and the display content refers to the detailed information of the target wafer Die data unit displayed in the floating selection box, including the target logical coordinates, the target detection identifier, and the target detection result.

[0089] Specifically, during the display mode switching process, the computer device saves the screen coordinate position of the current floating selection box and all the information displayed therein. Then, the computer device performs the switching operation of the display mode and updates the display effect of the drawing board bitmap. Finally, the computer device re-adds the floating selection box to the saved screen coordinate position and keeps the information displayed therein unchanged. This processing mechanism ensures that the user will not lose the currently selected Die information when switching the display mode, and can continue to analyze the selected Die in different display modes, improving the continuity of operation and user experience. For example, if the user selects a Die in the grid mode and is viewing its detailed information, the selected state and detailed information of the Die are still clearly visible after switching to the solid mode, facilitating the user to continue to observe and analyze.

[0090] S205, in response to the user's drag operation, a polygon selection region is determined based on the user's drag start position and drag end position.

[0091] wherein the drag operation represents the continuous action of the user holding and moving on the wafer Map by the mouse or touch screen; the drag start position refers to the screen coordinate point when the user starts dragging; the drag end position refers to the screen coordinate point when the user releases the dragging; and the polygon selection region represents a closed region formed by the dragging trajectory, which is used to frame a plurality of dies for batch analysis.

[0092] Specifically, when the computer device detects that the user presses the mouse or touch screen on the wafer Map, it starts recording the starting position of the drag trajectory. During the user's dragging process, the computer device captures the key coordinate points on the drag path in real time and draws a trajectory preview line on the canvas bitmap. When the user releases the mouse or finger, the computer device records the end position of the drag trajectory and automatically connects the starting position and the end position to form a closed polygonal region. The computer device highlights the polygonal selection region using a semi-transparent effect, allowing the user to intuitively see the selection range. This free-drawing selection method allows the user to flexibly select an area of any shape for analysis.

[0093] S206, identify all wafer Die data units in the polygonal selection region, count the number of detection marks and detection results in all wafer Die data units to generate a statistical result pop-up window, and display the total number of wafer Dies in the polygonal selection region and the number distribution of detection marks and detection results in the statistical result pop-up window.

[0094] Wherein, all wafer Die data units refer to the data records of all Dies located in the polygonal selection region; the number of detection marks and detection results represents the number statistics of various detection state combinations; the statistical result pop-up window refers to an independent window for displaying statistical information; the total number of wafer Dies represents the total number of Dies in the polygonal selection region; and the number distribution refers to the number of Dies in different detection states and their proportion.

[0095] Specifically, after determining the polygonal selection region, the computer device uses a geometric algorithm to determine whether the center point of each wafer Die data unit is located within the polygonal selection region. Then, the computer device creates a statistical table to count the number of Dies in the polygonal selection region according to different combinations of detection marks and detection results. Finally, the computer device creates a statistical result pop-up window to display the total number of Dies in the polygonal selection region (such as "Total selected: 1000") and detailed statistical information of various detection states (such as "Detected and passed: 800 (80%)", "Detected and failed: 150 (15%)", "Not detected: 50 (5%)"). This statistical analysis function helps the user quickly understand the yield distribution of the selected region, providing an important reference for quality control and problem diagnosis. The statistical result pop-up window supports user dragging and can be closed at any time through the close button, providing a flexible interaction method.

[0096] The computer device in the embodiments of the present application will be described from the perspective of hardware processing. Please refer to Figure 3 , which is a schematic diagram of an entity device structure of the computer device in the embodiments of the present application.

[0097] It should be noted that,Figure 3 The structure of the computer device shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of the present invention.

[0098] like Figure 3 As shown, the computer device includes a CPU 301, which can perform various appropriate actions and processes according to a program stored in the read-only memory ROM 302 or a program loaded from the storage section 308 into the random access memory RAM 303, such as performing the methods described in the above embodiments. The RAM 303 also stores various programs and data required for system operation. The CPU 301, ROM 302, and RAM 303 are interconnected via a bus 304. An I / O interface 305 is also connected to the bus 304.

[0099] The following components are connected to I / O interface 305: input section 306 including audio input devices, push-button switches, etc.; output section 307 including a liquid crystal display (LCD) and audio output devices, indicator lights, etc.; storage section 308 including a hard disk, etc.; and communication section 309 including a network interface card such as a LAN (Local Area Network) card, modem, etc. Communication section 309 performs communication processing via a network such as the Internet. Drive 310 is also connected to I / O interface 305 as needed. Removable media 311, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., are installed on drive 310 as needed so that computer programs read from them can be installed into storage section 308 as needed.

[0100] In particular, according to embodiments of the present invention, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of the present invention include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing computer programs for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via communication section 309, and / or installed from removable medium 311. When the computer program is executed by CPU 301, it performs the various functions defined in the present invention.

[0101] It should be noted that specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), flash memory, optical fiber, portable compact disc read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this invention, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0102] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. Each block in a flowchart or block diagram may represent a module, program segment, or portion of code, which contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those shown in the drawings.

[0103] Specifically, the computer device in this embodiment includes a processor and a memory. The memory stores a computer program, and when the computer program is executed by the processor, it implements the wafer map display method provided in the above embodiment.

[0104] In another aspect, the present invention also provides a computer-readable storage medium, which may be included in the computer device described in the above embodiments; or it may exist independently and not assembled into the computer device. The storage medium carries one or more computer programs that, when executed by a processor of the computer device, cause the computer device to implement the wafer map display method provided in the above embodiments.

[0105] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0106] In the above embodiments, the term "when" can be interpreted to mean "if" or "after" or "in response to determining" or "in response to detecting" depending on the context. Similarly, the phrase "on determining" or "if detecting (a stated condition or event)" can be interpreted to mean "if determining" or "in response to determining" or "on detecting (a stated condition or event)" or "in response to detecting (a stated condition or event)" depending on the context.

[0107] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be implemented by a computer program instructing the relevant hardware to complete, and the program can be stored in a computer readable storage medium. When the program is executed, it can include the processes of the above-mentioned embodiments. The aforementioned storage medium includes ROM or random storage memory RAM, magnetic disk or optical disk and various storage program codes.

Claims

1. A wafer map display method characterized by comprising: The method is applied to a computer device and comprises the following steps: establishing a wafer Die data list in memory, wherein the wafer Die data list comprises a plurality of wafer Die data units, and each wafer Die data unit is used for recording the logical coordinates, detection identifier and detection result of a single Die in a wafer; based on the logical coordinates, determining the pixel point region corresponding to the wafer Die data unit, based on the detection identifier and the detection result, determining the pixel point color corresponding to the wafer Die data unit, and drawing a palette bitmap in memory according to the pixel point region and the pixel point color, wherein the palette bitmap is used for saving the real-time state display information of the wafer Die; when it is detected that the detection identifier and / or detection result of any wafer Die data unit changes, performing a fixed-point pixel modification on the palette bitmap in memory and resetting a delay timer with a preset time length, wherein the fixed-point pixel modification comprises updating the pixel point color corresponding to the wafer Die data unit whose detection identifier and / or detection result changes; when the delay timer ends, submitting the palette bitmap with the fixed-point pixel modification accumulated in the preset time length to a display device to display a wafer Map graph.

2. The method of claim 1, wherein, The wafer Die data list is established in memory, and the wafer Die data list comprises a plurality of wafer Die data units, and each wafer Die data unit is used for recording the logical coordinates, detection identifier and detection result of a single Die in a wafer, and specifically comprises the following steps: obtaining wafer physical information and wafer detection data, wherein the wafer physical information comprises wafer Die layout and wafer center Die, and the wafer detection data comprises the detection identifier and detection result of each Die in the wafer; establishing a coordinate system with the wafer center Die as the origin, with the direction of the wafer positioning groove as the positive direction of the y-axis, and with the direction perpendicular to the positive direction of the y-axis and to the right as the positive direction of the x-axis; based on the wafer Die layout and the coordinate system, calculating the logical coordinates of each Die in the wafer; storing the logical coordinates, detection identifier and detection result of each Die in the wafer in memory to obtain the plurality of wafer Die data units, thereby establishing the wafer Die data list.

3. The method of claim 1, wherein, The wafer Die data list is established in memory, and the wafer Die data list comprises a plurality of wafer Die data units, and each wafer Die data unit is used for recording the logical coordinates, detection identifier and detection result of a single Die in a wafer, and specifically comprises the following steps: loading the pixel point size, pixel point spacing and pixel point color mapping table, wherein the pixel point color mapping table comprises the corresponding relationship between the combination of the detection identifier and the detection result and the pixel point color; based on the logical coordinates, determining the X-axis range and the Y-axis range, and combining the pixel point size and the pixel point spacing to calculate the palette size; based on the palette size, creating a blank palette in memory; Traverse each wafer Die data unit, according to the corresponding logical coordinates, the pixel size and the pixel spacing, determine the pixel area of the wafer Die data unit on the blank canvas; According to the detection identifier and the detection result of the wafer Die data unit, find the corresponding pixel color in the pixel color mapping table; Fill the pixel area with the pixel color to obtain the canvas bitmap.

4. The method of claim 3, wherein, When any wafer Die data unit detection identifier and / or detection result changes are detected, perform a point pixel modification on the canvas bitmap in the memory and reset the delay timer for a preset time period, the point pixel modification includes updating the pixel color corresponding to the wafer Die data unit whose detection identifier and / or detection result have changed, specifically including: Receive one or more Die state update information, the Die state update information includes the logical coordinates of a single Die in the wafer whose detection identifier and / or detection result have changed; According to the logical coordinates of a single Die in the wafer whose detection identifier and / or detection result have changed, determine the pixel update area; according to the changed detection identifier and / or detection result, find the corresponding updated pixel color in the pixel color mapping table; Fill the pixel update area with the updated pixel color to complete the point pixel modification; Reset the delay timer for a preset time period.

5. The method of claim 1, wherein, After the step of submitting the canvas bitmap accumulated in the preset time period to the display device to display the wafer Map graph when the delay timer ends, the method further comprises: In response to the user's click operation, determine the target pixel area based on the user's click position; Position the floating selection box to the target pixel area, and display the target logical coordinates, target detection identifier and target detection result of the target wafer Die data unit in the floating selection box, the floating selection box is used to provide the selected state display of the wafer Die.

6. The method of claim 5, wherein, After the step of positioning the floating selection box to the target pixel area and displaying the target logical coordinates, target detection identifier and target detection result of the target wafer Die data unit in the floating selection box, the method further comprises: In response to the user's display mode switching instruction, switch the display mode of the wafer Map graph between the grid mode and the entity mode; When switching the display mode, keep the position and display content of the floating selection box unchanged.

7. The method of claim 1, wherein, After the step of submitting the canvas bitmap accumulated in the preset time period to the display device to display the wafer Map graph when the delay timer ends, the method further comprises: In response to the user's drag operation, determine the polygon selection area based on the user's drag start position and drag end position; Identify all wafer Die data units in the polygon selection area, and count the number of detection marks and detection results in the all wafer Die data units to generate a statistical result pop-up window, which displays the total number of wafer Dies in the polygon selection area and the number distribution of detection marks and detection results.

8. A computer device, comprising: The computer device comprises one or more processors and a memory; the memory is coupled with the one or more processors; the memory is configured to store computer program codes, the computer program codes comprise computer instructions, and the one or more processors invoke the computer instructions to enable the computer device to execute the method according to any one of claims 1-7.

9. A computer-readable storage medium comprising instructions, characterized in that, The instructions enable the computer device to execute the method according to any one of claims 1-7 when the instructions run on the computer device.

10. A computer program product, characterised in that, The computer program product enables the computer device to execute the method according to any one of claims 1-7 when the computer program product runs on the computer device.

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