A pre-plating lead frame and a method for manufacturing the same

Abstract

The application relates to the technical field of lead frames, and discloses a pre-electroplated lead frame and a preparation method thereof, which comprises an integrated card frame, a plurality of lead frame bodies are fixedly connected in the integrated card frame, a plurality of bending support pieces are arranged, a circular buckling piece is arranged on the integrated card frame and corresponds to the bending support pieces, the bending support pieces are connected with the circular buckling pieces, the bending support pieces rotate along the center points of the circular buckling pieces, the top end and the bottom end of the bending support pieces are support end faces, the lead frame bodies are supported by the bending support pieces when the surfaces of the lead frame bodies are treated, the integrated card frame is taken, a plurality of integrated card frames can be stacked by the bending support pieces, and the two bending support pieces corresponding in the vertical direction can abut against each other, and the technical scheme can solve the problem that the lead frame before resistance operation is inconvenient to take and place when the surface of the lead frame is treated.

Description

A pre-plated lead frame and its preparation method Technical Field

[0001] This invention relates to the field of lead frame technology, specifically to a pre-plated lead frame and its preparation method. Background Technology

[0002] Leadframes are common metal components on printed circuit boards (PCBs). They serve as chip carriers in integrated circuits, enabling electrical connections between chips and PCBs. A leadframe consists of two parts: chip pads and pins. The chip pads are used to secure the chip, and bonding materials (gold, copper, and aluminum wires) are then used to electrically connect the circuit leads within the chip to the pins on the leadframe. Finally, the leadframe is mounted onto the PCB, creating an electrical circuit between the chip and the PCB.

[0003] In the lead frame manufacturing process, after the lead frame drawings are designed, the lead frame is usually formed by stamping or etching. Because the lead frame needs to undergo multiple processes such as surface treatment, pickling, and electroplating after forming, in order to achieve centralized processing of multiple lead frames, the lead frames formed by stamping or etching are generally composed of multiple integrated and fixedly connected together to form an integrated lead frame board. When used separately in the future, the integrated lead frame board is cut into multiple lead frame boards so that each lead frame can be connected to the corresponding chip.

[0004] However, when electroplating the lead frame, surface treatment and cleaning are required before electroplating. Then, a film needs to be applied to the surface of the lead frame before electroplating. Because the integrated lead frame is a thin plate and has high hardness, it cannot be bent. Therefore, it is not convenient for technicians to handle and operate the integrated lead frame during surface treatment. On the other hand, surface treatment may involve the use of chemical detergents or other substances that are harmful to human skin. Therefore, the lead frame in the prior art is not convenient for workers to handle by hand before electroplating. Summary of the Invention

[0005] This invention proposes a pre-plated lead frame and its preparation method, which solves the problem in the prior art that it is inconvenient to handle and place the lead frame when surface treatment is performed on the lead frame before resistance operation.

[0006] The technical solution of the present invention is as follows: A pre-plated lead frame, comprising an integrated card frame, wherein multiple lead frame bodies are fixedly connected within the integrated card frame, and further comprising:

[0007] A bending support component is provided, wherein there are multiple bending support components. A circular fastening component is provided on the integrated card frame corresponding to the bending support component. The bending support component is connected to the circular fastening component, and the bending support component rotates around the center point of the circular fastening component. The top and bottom ends of the bending support component are both support end faces. When the surface of the lead frame body is processed, the bending support component supports the lead frame for picking up the integrated card frame.

[0008] Multiple integrated card frames can be stacked using the bending support members, and two longitudinally corresponding bending support members can abut against each other.

[0009] To facilitate the handling and placement of the integrated card frame, the bending support includes an inverted V-shaped groove and a regular V-shaped groove. The inverted V-shaped groove is connected to the circular fastener. An extension plate segment is fixedly connected between the regular V-shaped groove and the inverted V-shaped groove. The extension plate segment is provided with a bending section for adjusting the bending angle of the regular V-shaped groove. The opposite sides of the inverted V-shaped groove and the regular V-shaped groove are both designated as the support end face.

[0010] To enable the bending support to connect with the integrated card frame, the circular fastening component further includes a circular fastening cap and an engaging ring. The number of circular fastening caps is set to two, and the two circular fastening caps are longitudinally aligned. An entry gap is left between the two circular fastening caps. The engaging ring is fixedly connected inside each of the two circular fastening caps, and multiple engaging protrusions are provided on the circumference of the corresponding section of the two engaging rings.

[0011] To further connect the circular snap-fit ​​caps to the integrated card frame, a connecting clamp is fixedly connected between the two circular snap-fit ​​caps and the integrated card frame, and the connecting clamp is capable of accommodating the two circular snap-fit ​​caps to approach each other.

[0012] To concentrate the clamping force on the two circular clamping parts, each of the two circular clamping caps is further fixedly connected to a clamping groove at the opposite end, with the center point of the clamping groove corresponding to the center point of the circular clamping cap.

[0013] To further connect the bending support to the two circular snap caps, a connecting piece is fixedly connected to the middle of the inverted V-shaped groove. The connecting piece enters between the two circular snap caps through the entry gap. Engaging ring sleeves are fixedly connected to both the upper and lower sides of the connecting piece. After the engaging protrusion enters the engaging ring sleeve, the engaging ring sleeve connects with the engaging ring.

[0014] To enable the stacking of multiple integrated card frames and allow the two longitudinally corresponding bent support members to abut against each other, furthermore, abutment strips are fixedly connected to both sides of the inner wall of the positive V-shaped groove, and multiple T-shaped meshing strips are fixedly connected to the inner bottom wall of the positive V-shaped groove, with tension grooves opened in the middle of the T-shaped meshing strips.

[0015] In order to achieve the engagement of the two longitudinally corresponding bent support members, furthermore, multiple connecting strips adapted to the abutment strip are fixedly connected to both sides of the bottom of the positive V-shaped groove, and multiple chamfered fixing strips adapted to the T-shaped engagement strip are fixedly connected to the inner bottom wall of the positive V-shaped groove, with the chamfered fixing strips having a hollow center.

[0016] To facilitate the use of clamps to pick up the integrated card frame, a connecting card frame is further fixedly connected between the two circular snap caps on the upper side, and an inclined picking piece is fixedly connected inside the connecting card frame. A slope is also provided on one side of the top of the connecting card frame.

[0017] A method for preparing a pre-plated lead frame includes the following steps:

[0018] Step 1, Forming: The lead frame body of the integrated card frame is formed using stamping or etching technology;

[0019] Step 2, Installation: Snap the bent support onto the circular clip inside the integrated card frame. Use the upper and lower support ends of the bent support to lift and place the integrated card frame.

[0020] Step 3, Surface treatment: Chemically clean the surfaces of the multiple lead frame bodies in the integrated card frame, then perform multi-stage water washing, and then dry. During the chemical cleaning and multi-stage water washing processes, the integrated card frame and lead frame bodies are placed into the corresponding equipment by bending the support components.

[0021] Step 4, Multi-layer electroplating process: The electroplating layer on the surface of the lead frame body is formed by a multi-layer composite electroplating process. The bottom layer of the lead frame body is a high-adhesion nickel layer, the middle layer of the lead frame body is an anti-oxidation palladium layer, and the top layer of the lead frame body is a high-wetting tin layer.

[0022] The working principle and beneficial effects of this invention are as follows:

[0023] 1. In this invention, when it is necessary to pick up and place the integrated card frame to perform coating and surface treatment on the multiple lead frame bodies within the integrated card frame, the lead frame bodies within the integrated card frame can be manipulated by picking up the bending support part first. Then, by bending the support part, both sides of the integrated card frame can be placed on the worktable without worrying about scratches on the lead frame bodies within the integrated card frame. The bending angle of the bending support part can also be adjusted, which can adapt to the differences in the working area of ​​the equipment used for different electroplating operations when performing multiple electroplating operations on the lead frame bodies in the future.

[0024] 2. In this invention, the use of circular clamping parts and bending support parts on the integrated card frame allows for all subsequent processing steps of the lead frame body after the lead frame body is formed. This effectively improves the convenience of processing the lead frame body within the integrated card frame. After all processing of the lead frame body is completed, and after the lead frame body is cut out from the integrated card frame and soldered to the chip, the bending support part can be removed from the circular clamping parts for multiple uses.

[0025] 3. In this invention, when it is necessary to use chemical cleaning agents to treat the surface of the lead frame body, in order to prevent injury to the workers, tweezers or pliers can be used to grip the tilted pick and pick the integrated card frame vertically, so that there is a sufficient safe distance between the workers and the integrated card frame when using chemical cleaning agents to treat the surface of the lead frame body. Attached Figure Description

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0027] Figure 1 is a 3D physical image of a pre-plated lead frame and its preparation method according to the present invention;

[0028] Figure 2 is a schematic diagram of the overall structure of the present invention;

[0029] Figure 3 is a schematic diagram of the overall planar structure of the present invention;

[0030] Figure 4 is a schematic diagram of the structure of the bent support, the circular fastener and the connecting frame in this invention.

[0031] Figure 5 is a partially enlarged structural schematic diagram of point A in Figure 4 of the present invention;

[0032] Figure 6 is a schematic diagram of the structure of the connecting piece, the bent support and the T-shaped meshing strip in this invention;

[0033] Figure 7 is a partially enlarged structural schematic diagram of point B in Figure 6 of the present invention;

[0034] Figure 8 is a partial cross-sectional schematic diagram of the dispersive structure of the connecting piece and the circular fastening member in this invention.

[0035] In the diagram: 1. Integrated card frame; 2. Lead wire frame body; 3. Bending support; 4. Circular snap-fit ​​component; 5. Support end face; 6. Inverted V-groove; 7. Positive V-groove; 8. Extension plate segment; 9. Bending section; 10. Circular snap-fit ​​cap; 11. Engaging ring; 12. Engaging protrusion; 13. Connecting clamp; 14. Snap-fit ​​groove; 15. Connecting piece; 16. Engaging ring sleeve; 17. Abutment strip; 18. T-shaped engagement strip; 19. Connecting strip; 20. Chamfered fixing strip; 21. Connecting card frame; 22. Inclined pick-up piece; 23. Angled surface. Detailed Implementation

[0036] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0037] Example 1, as shown in Figures 1 to 8, proposes a pre-plated lead frame, including an integrated card frame 1. Multiple lead frame bodies 2 are fixedly connected within the integrated card frame 1. The lead frame bodies 2 are metal structures formed within the integrated card frame 1 using existing stamping or etching techniques. They are used to make electrical connections with the chip, allowing the circuit leads of the chip to be connected to the pins of the lead frame bodies 2 using wire bonding technology. This forms an electrical circuit between the chip and the printed circuit board, enabling the printed circuit board to be used normally in electrical equipment.

[0038] It also includes bending support members 3, and the number of bending support members 3 is set to multiple. The top and bottom ends of the bending support members 3 are both support end faces 5. The bending support members 3 include an inverted V-shaped groove 6 and a positive V-shaped groove 7. The inverted V-shaped groove 6 is connected to the circular clamping member 4. An extension plate segment 8 is fixedly connected between the positive V-shaped groove 7 and the inverted V-shaped groove 6. A bending segment 9 is provided on the extension plate segment 8 to adjust the bending angle of the positive V-shaped groove 7. The opposite sides of the inverted V-shaped groove 6 and the positive V-shaped groove 7 are both set as support end faces 5. When actually operating the lead frame body 2, it is usually necessary to perform targeted surface treatment on both end faces of the lead frame body 2. Therefore, by using the support end faces 5 on the opposite sides of the inverted V-shaped groove 6 and the positive V-shaped groove 7, the lead frame body 2 can avoid direct contact with the workbench or other platforms during the placement of the integrated card frame 1, thus avoiding damage to the lead frame body 2.

[0039] The thinner bending section 9 is designed to allow for adjustment of the bending angle between the inverted V-shaped groove 6 and the positive V-shaped groove 7 during subsequent pickling or other immersion processes on the lead frame body 2. This allows for adjustment of the overall longitudinal thickness of the bending support 3, facilitating compatibility with the corresponding processing equipment volume. Additionally, the bending curvature of the different bending support 3 on both sides can be specifically adjusted. When using an immersion process on the lead frame body 2, only one side of the lead frame body 2 can be immersed in the chemical cleaning agent, rather than immersing the entire lead frame. This enables targeted immersion treatment of different areas on the lead frame.

[0040] A circular fastening component 4 is provided on the integrated card frame 1 corresponding to the bending support component 3. The circular fastening component 4 includes a circular fastening cap 10 and an engaging ring 11. There are two circular fastening caps 10, and the two circular fastening caps 10 are longitudinally aligned. An entry gap is left between the two circular fastening caps 10. An engaging ring 11 is fixedly connected inside each of the two circular fastening caps 10. A plurality of engaging protrusions 12 are provided on the circumference of the corresponding section of the two engaging rings 11. In order to achieve the connection of the bending support component 3, while ensuring that the bending support component 3 has a detachable function, the following measures are taken. Under the premise of being able to, it is also possible to adjust the angle of the position of the bending support 3 relative to the integrated card frame 1. When the staff takes the bending support 3 on one side to perform detailed processing on the lead frame body 2 in the integrated card frame 1, the bending support 3 on one side can be swung to make the bending support 3 offset along the center point of the circular buckle cap 10. This makes it easier for the staff to operate the lead frame body 2 at different positions when taking the bending support 3, which greatly ensures the comfort of the inner surface treatment of the lead frame body 2.

[0041] A connecting clamp 13 is fixedly connected between the two circular snap-fit ​​caps 10 and the integrated card frame 1. The connecting clamp 13 can accommodate the two circular snap-fit ​​caps 10 to approach each other. When the two circular snap-fit ​​caps 10 are snapped, they need to be perpendicular to each other. By setting the flexible connecting clamp 13, it is easy to cooperate with the two circular snap-fit ​​caps 10 to perform the snap-fit ​​operation.

[0042] Each of the two circular snap-fit ​​caps 10 has a snap-fit ​​groove 14 fixedly connected to one end facing away from the other. The center point of the snap-fit ​​groove 14 corresponds to the center point of the circular snap-fit ​​cap 10. In order for the two circular snap-fit ​​caps 10 to be able to approach each other vertically, the snap-fit ​​groove 14 is designed as a funnel-shaped groove. When the staff uses their hands to snap-fit, it can ensure that the circular snap-fit ​​caps 10 are subjected to vertical force, so as to achieve precise snap-fit ​​between the two circular snap-fit ​​caps 10.

[0043] The bending support 3 is connected to the circular clamping member 4, and the bending support 3 rotates along the center point of the circular clamping member 4. During the surface treatment of the lead frame body 2, the bending support 3 supports the lead frame for picking up the integrated card frame 1. A connecting piece 15 is fixedly connected to the middle of the inverted V-shaped groove 6. The connecting piece 15 enters between the two circular clamping caps 10 through the entry gap. Engaging rings 11 are fixedly connected to both the upper and lower sides of the connecting piece 15. Engaging protrusions 12 enter into the engaging rings 11. Then, the engagement ring 11 is connected to the engagement ring 11, and the connecting piece 15 is inserted between the two circular snap caps 10 through the entry gap. The engagement ring 11 is inserted into the corresponding circular snap cap 10. When the two circular snap caps 10 are squeezed, the engagement protrusion 12 is pressed into the engagement ring 11. Then the engagement ring 11 is connected to the engagement ring 11, so that the bending support 3 is connected to the circular snap cap 4. The bending support 3 can adjust the angle along the center point of the circular snap cap 4.

[0044] Multiple integrated card frames 1 can be stacked by bending support members 3. Two longitudinally corresponding bending support members 3 can abut against each other. Abutment strips 17 are fixedly connected to both sides of the inner wall of the positive V-shaped groove 7. Multiple T-shaped meshing strips 18 are fixedly connected to the inner bottom wall of the positive V-shaped groove 7. Tension grooves are opened in the middle of the T-shaped meshing strips 18. Because some pickling equipment has a large enough volume, in order to improve the pickling efficiency of a large number of lead frame bodies 2, multiple integrated card frames 1 can be stacked together and put into the pickling tank or other chemical cleaning agent tank for surface treatment.

[0045] Multiple connecting strips 19, adapted to the abutment strips 17, are fixedly connected to both sides of the bottom of the V-shaped groove 7. Multiple chamfered fixing strips 20, adapted to the T-shaped meshing strips 18, are fixedly connected to the inner bottom wall of the V-shaped groove 7. The chamfered fixing strips 20 have a hollow center. When two longitudinally corresponding V-shaped grooves 7 are brought close together, the bottom of one V-shaped groove 7 extends into the inside of the other V-shaped groove 7. After the abutment strips 17 and connecting strips 19 align, because the V-shaped grooves 7... The slight deformation characteristic allows the abutment strip 17 and the connecting strip 19 to maintain engagement. The T-shaped engagement strip 18 can also undergo adaptive deformation through the tension groove. Multiple chamfered fixing strips 20 can enter between multiple T-shaped engagement strips 18 to maintain engagement between the two bent support members 3. The chamfered fixing strip 20 has a hollow center and has metallic elastic potential energy, which can not only engage smoothly with the T-shaped engagement strip 18, but also provide shock absorption for the bent support member 3 when the integrated card frame 1 is placed.

[0046] A connecting frame 21 is fixedly connected between the two circular snap caps 10 on the upper side. An inclined pick-up piece 22 is fixedly connected inside the connecting frame 21. An inclined surface 23 is also provided on one side of the top of the connecting frame 21. The inclined angle of the inclined pick-up piece 22 is the same as the inclined angle of the inclined surface 23. When it is necessary to use chemical cleaning agent to treat the surface of the lead frame body 2, in order to prevent injury to the staff, tweezers or pliers can be used to grasp the inclined pick-up piece 22. The middle part of the tweezers grasps the inclined pick-up piece 22, and then the bottom of the tweezers contacts the inclined surface 23 to vertically pick up the integrated card frame 1. This makes it convenient to use chemical cleaning agent to treat the surface of the lead frame body 2, so that there is a sufficient safe distance between the staff and the integrated card frame 1, and also saves the physical effort of picking up the integrated card frame 1.

[0047] In addition, when performing electroplating on the lead frame body 2 mentioned in this invention, a multi-layer electroplating process is adopted. The electroplating layer on the surface of the lead frame body 2 is formed by a multi-layer composite electroplating process. The bottom layer of the lead frame body 2 is a high-adhesion nickel layer, the middle layer of the lead frame body 2 is an anti-oxidation palladium layer, and the top layer of the lead frame body 2 is a high-wetting tin layer, which can effectively improve the solderability and corrosion resistance of the lead frame body 2.

[0048] Example 2: Based on a pre-plated lead frame, the present invention also proposes a method for preparing the pre-plated lead frame, the specific steps of which are as follows:

[0049] Step 1, Forming: The lead frame body 2 of the integrated card frame 1 is formed using stamping or etching technology;

[0050] Step 2, Installation: Snap the bent support 3 onto the circular snap-fit ​​4 inside the integrated card frame 1. Use the upper and lower support ends 5 of the bent support 3 to lift and place the integrated card frame 1.

[0051] Step 3, Surface treatment: Chemically clean the surfaces of multiple lead frame bodies 2 within the integrated card frame 1, followed by multi-stage water washing and drying. During both the chemical cleaning and multi-stage water washing processes, the integrated card frame 1 and lead frame bodies 2 are placed into the corresponding equipment by bending the support member 3.

[0052] Step 4, Multi-layer electroplating process: The electroplating layer on the surface of the lead frame body 2 is formed by a multi-layer composite electroplating process. The bottom layer of the lead frame body 2 is a high-adhesion nickel layer, the middle layer of the lead frame body 2 is an anti-oxidation palladium layer, and the top layer of the lead frame body 2 is a high-wetting tin layer.

[0053] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A pre-plated lead frame, comprising an integrated card frame (1), wherein a plurality of lead frame bodies (2) are fixedly connected within the integrated card frame (1), characterized in that, It also includes: a bending support (3), the number of which is set to multiple, and a circular fastening part (4) is provided on the integrated card frame (1) corresponding to the bending support (3). The bending support (3) is connected to the circular fastening part (4), and the bending support (3) rotates along the center point of the circular fastening part (4). The top and bottom ends of the bending support (3) are both support end faces (5). When the surface of the lead frame body (2) is processed, the lead frame is supported by the bending support (3) for taking the integrated card frame (1). Multiple integrated card frames (1) are stacked by the bending support (3), and two bending support (3) corresponding in the longitudinal direction can abut against each other. The bending support (3) includes: an inverted V-shaped groove (6), the inverted V-shaped groove (6) and the circular fastening part (4) are connected. The pressure member (4) is connected; a positive V-shaped groove (7) is fixedly connected to the positive V-shaped groove (7) and the inverted V-shaped groove (6), and an extension plate segment (8) is provided on the extension plate segment (8) for adjusting the bending angle of the positive V-shaped groove (7); wherein, the opposite side of the inverted V-shaped groove (6) and the positive V-shaped groove (7) are both provided as the support end face (5); the circular clamping member (4) includes: a circular clamping cap (10), the number of the circular clamping cap (10) is set to two, and the two circular clamping caps (10) are longitudinally corresponding, and an entry gap is left between the two circular clamping caps (10); a meshing ring (11), the meshing ring (11) is fixedly connected in the two circular clamping caps (10), and a plurality of meshing protrusions (12) are provided on the circumference of the corresponding section of the two meshing rings (11).

2. The pre-plated lead frame according to claim 1, characterized in that, A connecting clamp (13) is fixedly connected between the two circular snap caps (10) and the integrated card frame (1), and the connecting clamp (13) can accommodate the two circular snap caps (10) to approach each other.

3. A pre-plated lead frame according to claim 2, characterized in that, Each of the two circular snap-fit ​​caps (10) has a snap-fit ​​groove (14) fixedly connected to one of its opposite ends, and the center point of the snap-fit ​​groove (14) corresponds to the center point of the circular snap-fit ​​cap (10).

4. A pre-plated lead frame according to claim 3, characterized in that, A connecting piece (15) is fixedly connected to the middle of the inverted V-shaped groove (6). The connecting piece (15) enters between the two circular snap caps (10) through the entry gap. Engaging rings (11) are fixedly connected to both the upper and lower sides of the connecting piece (15). After the engagement protrusion (12) enters the engagement ring (11) sleeve, the engagement ring (11) sleeve is connected to the engagement ring (11).

5. A pre-plated lead frame according to claim 4, characterized in that, The inner walls of the positive V-shaped groove (7) are fixedly connected with abutment strips (17) on both sides. Multiple T-shaped meshing strips (18) are fixedly connected to the inner bottom wall of the positive V-shaped groove (7). Tension grooves are opened in the middle of the T-shaped meshing strips (18).

6. A pre-plated lead frame according to claim 5, characterized in that, The bottom sides of the positive V-shaped groove (7) are fixedly connected with multiple connecting strips (19) that are compatible with the abutment strip (17). Multiple chamfered fixing strips (20) that are compatible with the T-shaped meshing strip (18) are fixedly connected to the inner bottom wall of the positive V-shaped groove (7). The chamfered fixing strips (20) are hollowed out in the middle.

7. A pre-plated lead frame according to claim 6, characterized in that, A connecting frame (21) is fixedly connected between the two circular snap caps (10) located on the upper side. An inclined pick-up piece (22) is fixedly connected inside the connecting frame (21). A slope (23) is also provided on one side of the top of the connecting frame (21).

8. A method for preparing a pre-plated lead frame, using the pre-plated lead frame described in claim 7, characterized in that, Includes the following steps: Step 1, Forming: The lead frame body (2) of the integrated card frame (1) is formed by stamping or etching technology; Step 2, Installation: The bending support (3) is pressed onto the circular fastener (4) inside the integrated card frame (1), and the integrated card frame (1) is picked up and placed using the upper and lower support end faces (5) of the bending support (3); Step 3, Surface Treatment: The surfaces of the multiple lead frame bodies (2) inside the integrated card frame (1) are chemically cleaned, then subjected to multi-stage water washing, and then dried. During the chemical cleaning and multi-stage water washing processes, the integrated card frame (1) and the lead frame body (2) are placed into the corresponding equipment through the bending support (3); Step 4, Multi-layer Electroplating Process: The electroplating layer on the surface of the lead frame body (2) is formed by a multi-layer composite electroplating process. The bottom layer of the lead frame body (2) is a high-adhesion nickel layer, the middle layer of the lead frame body (2) is an anti-oxidation palladium layer, and the top layer of the lead frame body (2) is a high-wetting tin layer.

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