Display module and display device

Abstract

The invention discloses a display module and a display device.The display module comprises a substrate, a driving substrate and a touch substrate, the driving substrate comprises a first inorganic layer and a first flat layer which are sequentially arranged on the substrate, and a groove is formed in the portion, located in an edge area, of the driving substrate; the touch substrate comprises a second inorganic layer and a second flat layer which are sequentially arranged on the driving substrate, a through groove is formed in the part, located in the edge area, of the touch substrate, and the through groove and the groove are overlapped in the thickness direction of the display module; the first filling part is at least filled in the groove, and one of the first flat layer and the second flat layer is integrally connected with the first filling part. According to the display module, bubbles and dust entering the display panel can be reduced, and the stability of the internal structure of the display module is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display module and a display device. BACKGROUND

[0002] In the related art, in order to meet the demand of narrow frame, it is necessary to compress the width of the cutting channel of the display panel, so that the cutting line is close to the inside of the display panel. After cutting, the inorganic layer and the organic layer in the cutting channel are all removed, and there is a pit compared to other areas. In the process of bonding the polarizing sheet to the display panel, bubbles appear at the pit in the cutting channel. During secondary cutting, due to the heat source of laser cutting, the above-mentioned bubbles and dust generated by cutting will mix into the inside of the display module, affecting the stability of the internal structure of the display module.

[0003] Therefore, it is necessary to propose a new technical solution to solve the above technical problems. SUMMARY

[0004] The purpose of the present application is to provide a display module and a display device, which can reduce the entry of bubbles and dust into the inside of the display panel and improve the stability of the internal structure of the display module.

[0005] To solve the above problems, the technical solution of the present application is as follows:

[0006] In a first aspect, the present application provides a display module having an edge area,

[0007] The display module comprises:

[0008] a substrate;

[0009] a driving substrate comprising a first inorganic layer and a first planar layer arranged on the substrate in sequence, and a part of the driving substrate located in the edge area is formed with a groove;

[0010] a touch substrate comprising a second inorganic layer and a second planar layer arranged on the driving substrate in sequence, and a part of the touch substrate located in the edge area is formed with a through slot, and the through slot overlaps with the groove in the thickness direction of the display module; and

[0011] a first filling portion at least filled in the groove, one of the first planar layer and the second planar layer being integrally connected with the first filling portion.

[0012] In an embodiment of the present application, the first filling portion is integrally connected with the first planar layer;

[0013] The first inorganic layer is formed with the groove in the part located in the edge area, and the material of the first filling portion is the same as that of the first planar layer.

[0014] In an embodiment of the present application, the first filling portion is flush with the second planar layer away from a surface of the substrate.

[0015] In an embodiment of the present application, the second inorganic layer is formed with the through groove in the part of the edge region.

[0016] The display module further comprises a second filling portion, the second filling portion is filled in at least the through groove, and the second filling portion is integrally connected with the second planar layer.

[0017] In an embodiment of the present application, the material of the second filling portion is the same as the material of the second planar layer, and a surface of the second filling portion away from the substrate is flush with a surface of the second planar layer away from the substrate.

[0018] In an embodiment of the present application, the first filling portion is integrally connected with the second planar layer.

[0019] The part of the first inorganic layer in the edge region and the part of the first planar layer in the edge region are formed with the recess, and the part of the second inorganic layer in the edge region is formed with the through groove.

[0020] The first filling portion is filled in at least the recess and the through groove, and the material of the first filling portion is the same as the material of the second planar layer.

[0021] In an embodiment of the present application, a surface of the first filling portion away from the substrate is flush with a surface of the second planar layer away from the substrate.

[0022] In an embodiment of the present application, the display module further has a display region and a retaining wall region, and the retaining wall region connects the display region and the edge region.

[0023] The display module further comprises an encapsulation layer between the driving substrate and the touch substrate, and the encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer which are stacked.

[0024] Part of the organic encapsulation layer is located in the display region, an edge of the organic encapsulation layer is cut off in the retaining wall region, the first filling portion is located in the edge region, and the organic encapsulation layer is separated from the first filling portion.

[0025] In an embodiment of the present application, the display module further comprises an alignment mark, the alignment mark is arranged in the retaining wall region and located on a side of the edge of the organic encapsulation layer close to the edge region, and the alignment mark is used for positioning a position of the edge region away from the display region.

[0026] In an embodiment of the present application, the display module further comprises:

[0027] A first barrier wall is arranged on the substrate and located in the barrier wall region.

[0028] A second barrier wall is arranged on the substrate and located in the barrier wall region, the second barrier wall is located on a side of the first barrier wall away from the display region, and an edge of the organic encapsulation layer is located on a side of the first barrier wall close to the display region or a side of the second barrier wall close to the display region.

[0029] A crack prevention structure is arranged on the substrate and located in the barrier wall region, the crack prevention structure is located on a side of the second barrier wall away from the display region, and the alignment mark is located between the second barrier wall and the crack prevention structure.

[0030] In an embodiment of the present application, the display module comprises:

[0031] A main body portion; and

[0032] A bending portion comprising a first bending sub-portion and a second bending sub-portion, the first bending sub-portion being connected to a side of the main body portion, and the second bending sub-portion being connected to a side of the first bending sub-portion away from the main body portion.

[0033] In a plan view of the display module, a width of the first bending sub-portion increases in a direction away from the main body portion, an edge of the first bending sub-portion and an edge of the main body portion are connected, and a recessed portion is formed.

[0034] The recess is arranged at an outer side of the main body portion, an outer side of the bending portion, and the recessed portion, and a part of the first filling portion is filled in the recessed portion.

[0035] In a second aspect, the present application provides a display device comprising a display module, the display module having an edge region, the display module comprising a substrate, a driving substrate and a touch substrate, the driving substrate being arranged on the substrate, the driving substrate comprising a first inorganic layer and a first planar layer arranged on the substrate in sequence, and a part of the driving substrate located in the edge region being formed with a recess; the touch substrate being arranged on the driving substrate, the touch substrate comprising a second inorganic layer and a second planar layer arranged on the driving substrate in sequence, and a part of the touch substrate located in the edge region being formed with a through groove, the through groove and the recess overlapping in a thickness direction of the display module; a first filling portion being filled at least in the recess, and one of the first planar layer and the second planar layer being integrally connected with the first filling portion.

[0036] In the present application, the recess of the cutting groove is filled with a first filling part before the secondary cutting, after the first filling part is filled, the bubbles in the recess are reduced, in the process of the secondary cutting, the bubbles infiltrating into the display module are reduced, after the cutting is completed, the edge area is formed. The recess corresponds to form a groove and a through groove after the secondary cutting. The present application reduces the bubbles in the recess before the secondary cutting by filling the first filling part in the groove at least, reduces the bubbles infiltrating into the display module in the process of the secondary cutting, and improves the stability of the internal structure of the display module. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 is a schematic diagram of an embodiment of a display module in the related art;

[0038] Figure 2 is a schematic diagram of an embodiment of an edge area of a display module of the present application;

[0039] Figure 3 is a schematic diagram of an embodiment of a display module of the present application before secondary cutting;

[0040] Figure 4 is a schematic diagram of a mother board and a daughter board in the first cutting in the present application;

[0041] Figure 5 is a schematic diagram of an embodiment of a display module of the present application;

[0042] Figure 6 is a schematic diagram of an embodiment of a display module in the related art;

[0043] Figure 7 is a schematic diagram of an embodiment of a display module of the present application;

[0044] Figure 8 is a schematic diagram of a display module of the first embodiment of the present application;

[0045] Figure 9 is a schematic diagram of a display module of the first embodiment of the present application before secondary cutting;

[0046] Figure 10 is another schematic diagram of a display module of the first embodiment of the present application;

[0047] Figure 11 is another schematic diagram of a display module of the first embodiment of the present application before secondary cutting;

[0048] Figure 12 is a schematic diagram of a display module of the second embodiment of the present application;

[0049] Figure 13 is a schematic diagram of a display module of the second embodiment of the present application before secondary cutting;

[0050] Figure 14 This is another schematic diagram of the display module according to the second embodiment of this application;

[0051] Figure 15 This is another schematic diagram of the display module of the second embodiment of this application before secondary cutting;

[0052] Figure 16 This is a schematic diagram of a display module according to a third embodiment of this application;

[0053] Figure 17 This is a schematic diagram of the display module of the third embodiment of this application before secondary cutting;

[0054] Figure 18 This is another schematic diagram of the display module according to the third embodiment of this application;

[0055] Figure 19 This is another schematic diagram of the display module before secondary cutting, which is the third embodiment of this application. Detailed Implementation

[0056] The terms used in this specification and claims have the meanings that are commonly understood by one of ordinary skill in the art to which this application pertains. The terms used in this specification and claims are for the purpose of facilitating the description and understanding of this application only, and are not intended to limit this application to the narrow interpretation of the specific terms used in the specification and claims.

[0057] Please see Figure 1 In related technologies, to achieve the requirement of narrow bezels, the width of the CUT (cut surface) of the display panel needs to be compressed, causing the cutting line to be close to the interior of the display panel. After cutting, both the inorganic and organic layers within the CUT are removed, leaving a recess compared to other areas. During the process of bonding the polarizer to the display panel, air bubbles appear at the recess C' within the CUT. During the secondary cutting, due to the heat source from laser cutting, these air bubbles and dust generated during cutting mix and enter the interior of the display module 100', affecting the stability of the internal structure of the display module 100'.

[0058] This application discloses a display device, which can be a tablet computer, e-reader, electronic display screen, laptop computer, mobile phone, augmented reality (AR) / virtual reality (VR) device, media player, wearable device, digital camera, car navigation system, etc. The display device includes a display module 100.

[0059] Please see Figure 2This application discloses a display module 100. The display module 100 has an edge region NA2. The display module 100 includes a substrate 10, a driving substrate 20, a touch substrate 30, and a first filling portion 40.

[0060] A driving substrate 20 is disposed on a substrate 10. The driving substrate 20 includes a first inorganic layer 21 and a first planarization layer 22 sequentially disposed on the substrate 10. A groove C1 is formed in the edge region NA2 of the driving substrate 20.

[0061] A touch substrate 30 is disposed on a driving substrate 20. The touch substrate 30 includes a second inorganic layer 31 and a second planarization layer 32 sequentially disposed on the driving substrate 20. A through groove C2 is formed in the edge region NA2 of the touch substrate 30. The through groove C2 and the recess C1 overlap in the thickness direction Z of the display module 100.

[0062] The first filling portion 40 fills at least the groove C1. One of the first planarization layer 22 and the second planarization layer 32 is integrally connected to the first filling portion 40.

[0063] In this embodiment, please refer to Figure 3 Before the secondary cutting, the first filling part 40 fills the recesses C of the cutting path CUT. After the first filling part 40 fills, the number of air bubbles in the recesses C is reduced. During the secondary cutting process, the number of air bubbles penetrating into the display module 100 is reduced. After the cutting is completed, the edge area NA2 is formed. Please refer to... Figure 2 After the second cutting, the pit C forms a groove C1 and a through groove C2. In this embodiment, by filling the groove C1 with at least the first filling part 40, the air bubbles in the pit C before the second cutting are reduced, and the air bubbles that seep into the display module 100 during the second cutting process are reduced, thereby improving the stability of the internal structure of the display module 100.

[0064] Optionally, the material of the first planarization layer 22 is an organic material.

[0065] Optionally, the material of the second planarization layer 32 is an organic material.

[0066] It should be understood that light-emitting devices can be disposed on the driving substrate 20, the encapsulation layer covers the light-emitting devices, and the touch substrate 30 is disposed on the encapsulation layer. The touch substrate 30 and the encapsulation layer are two different structures, and the touch substrate 30 should not be equated with the encapsulation layer here. Optionally, the encapsulation layer can be a three-layer stack formed by an inorganic layer / organic layer / inorganic layer. In this application, the encapsulation layer ends at the barrier region NA1, that is, the encapsulation layer cannot extend to the edge region NA2.

[0067] It is important to understand that you should refer to [the relevant documentation / reference]. Figure 4 The first cutting process involves cutting a mother board into multiple daughter boards.

[0068] It is important to understand that you should refer to [the relevant documentation / reference]. Figure 5 During the second cutting, the outline of each sub-board is cut into the outline of the corresponding display module 100.

[0069] Please see Figure 5 Optionally, the display module 100 includes a main body 80 and a bent portion 90.

[0070] The bending portion 90 includes a first bending portion 91 and a second bending portion 92. The first bending portion 91 is connected to one side of the main body portion 80. The second bending portion 92 is connected to the side of the first bending portion 91 away from the main body portion 80.

[0071] In the plan view of the display module 100, the width of the first bent portion 91 increases in the direction away from the main body portion 80. The edge of the first bent portion 91 connects with the edge of the main body portion 80, forming a recess 93.

[0072] Grooves C1 are provided on the outer side of the main body 80, the outer side of the bent portion 90, and the recessed portion 93. A portion of the first filling portion 40 fills the recessed portion 93.

[0073] In this embodiment, the arrangement direction of the main body 80, the first bending portion 91, and the second bending portion 92 is a first direction, and the width direction W of the first bending portion 91 is perpendicular to the first direction in the plan view of the display module 100. In this embodiment, a recessed portion 93 is provided at the edge where the main body 80 and the bending portion 90 connect, and a first filling portion 40 is filled within the recessed portion 93. Since the material of the first filling portion 40 filling the recessed portion 93 is an organic material, the stress at the connection between the main body 80 and the bending portion 90 after the display module 100 is bent can be improved, thereby enhancing the stability of the internal structure of the display module 100.

[0074] Please see Figure 6 In related technologies, no recess is formed between the main body 80' and the bending part 90', nor is any organic material filled there. Therefore, after the display module 100' is bent, the stress at the connection between the main body 80' and the bending part 90' is relatively large, which can easily lead to peeling or cracking, affecting the stability of the internal structure of the display module 100'.

[0075] Please see Figure 7 Optionally, the display module 100 also has a display area AA and a retaining wall area NA1. The retaining wall area NA1 connects the display area AA and the edge area NA2.

[0076] The display module 100 also includes an encapsulation layer. The encapsulation layer is located between the driving substrate 20 and the touch substrate 30. The encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer 60, and a second inorganic encapsulation layer stacked together.

[0077] A portion of the organic encapsulation layer 60 is located in the display area AA. The edge of the organic encapsulation layer 60 ends at the barrier area NA1, and the first filling portion 40 is located in the edge area NA2, separating the organic encapsulation layer 60 from the first filling portion 40.

[0078] In this application, although the organic encapsulation layer 60 located between the touch substrate 30 and the driving substrate 20 is made of organic material, this application does not adopt a scheme in which the organic encapsulation layer 60 is integrally connected with the first filling portion 40. The reason is that the organic encapsulation layer 60 is usually formed by inkjet printing. The organic encapsulation layer 60 has strong fluidity. After printing in the edge area NA2, it will overflow outward during cutting, polluting the environment and affecting the stability of the display module 100. The first planarization layer 22 and the second planarization layer 32 are usually formed by coating. Their fluidity is weaker than that of the organic encapsulation layer 60 formed by inkjet printing. Therefore, they are suitable as the material for the first filling portion 40.

[0079] It is important to understand that the touch substrate 30, the driving substrate 20, and the encapsulation layer are three different structures. The touch substrate 30 should not be equated with the encapsulation layer, nor should the driving substrate 20 be equated with the encapsulation layer, nor should the encapsulation layer be regarded as part of the touch substrate 30, nor should the encapsulation layer be regarded as part of the driving substrate 20.

[0080] Please see Figure 7 Optionally, the display module 100 also includes an alignment mark 71. The alignment mark 71 is located in the barrier area NA1 and on the edge of the organic encapsulation layer 60 near the edge area NA2. The alignment mark 71 is used to locate the position P of the edge area NA2 away from the display area AA.

[0081] Before cutting, the cutting path (CUT) needs to be positioned so that the laser cutting equipment can accurately cut the display module 100 and avoid damage to the internal structure of the display module 100 due to excessive cutting errors. However, in related technologies, because there is a pit C at the cutting path CUT, air bubbles will appear in the pit C when the polarizer is attached to the display module 100'. During the secondary cutting, the laser cutting has a heat source, and the aforementioned air bubbles and dust generated during cutting will mix into the interior of the display module 100', resulting in the phenomenon that air bubbles and dust block the alignment mark 71, affecting the subsequent use of the alignment mark 71 for cutting accuracy detection.

[0082] In this embodiment, since the pit C is filled with the first filling part 40 before cutting, air bubbles in the pit C can be reduced during the bonding of the polarizer. During cutting, the amount of air bubbles and dust penetrating into the display module 100 is reduced. After cutting, the alignment mark 71 is clearly identifiable, improving the accuracy of subsequent cutting precision detection using the alignment mark 71.

[0083] Optionally, the material for the alignment mark 71 can be ink.

[0084] Please see Figure 7 Optionally, the display module 100 may further include a first retaining wall 72, a second retaining wall 73, and a crack-resistant structure 74.

[0085] The first barrier wall 72 is disposed on the substrate 10 and located in the barrier wall region NA1.

[0086] The second barrier 73 is disposed on the substrate 10 and located in the barrier region NA1. The second barrier 73 is located on the side of the first barrier 72 away from the display area AA. The edge of the organic encapsulation layer 60 terminates on the side of the first barrier 72 near the display area AA or the side of the second barrier 73 near the display area AA.

[0087] The anti-crack structure 74 is disposed on the substrate 10 and located in the barrier area NA1. The anti-crack structure 74 is located on the side of the second barrier 73 away from the display area AA. The alignment mark 71 is located between the second barrier 73 and the anti-crack structure 74.

[0088] In this embodiment, the organic encapsulation layer 60 is formed by inkjet printing, and the material of the organic encapsulation layer 60 is organic ink. The first barrier 72 is used to prevent organic ink from overflowing. The second barrier 73 is disposed at a distance from the first barrier 72, and an overflow groove is formed between the two to collect the organic ink overflowing from the display area AA.

[0089] The crack-prevention structure 74 is located at the edge of the retaining wall area NA1 and is used to block cracks that extend from the edge area NA2 to the retaining wall area NA1 during cutting, thereby improving the stability of the internal structure of the display module 100.

[0090] The alignment mark 71 of this application is disposed between the crack-prevention structure 74 and the second retaining wall 73. On the one hand, due to the protective effect of the first retaining wall 72 and the second retaining wall 73, organic ink can be prevented from covering the alignment mark 71, thereby improving the identification accuracy and precision of the alignment mark 71. On the other hand, due to the setting of the crack-prevention structure 74, cracks can be prevented from extending to the retaining wall area NA1, causing the alignment mark 71 to crack, thereby improving the identification accuracy and precision of the alignment mark 71.

[0091] In the first embodiment of this application:

[0092] Please see Figure 8 Optionally, the first filling portion 40 is integrally connected to the first planarization layer 22.

[0093] The first inorganic layer 21 has a groove C1 formed in the edge region NA2. The material of the first filling part 40 is the same as the material of the first planarization layer 22.

[0094] In the first embodiment of this application, please refer toFigure 9 Before the secondary cutting, the first filling part 40 fills the recesses C of the cutting path CUT. After the first filling part 40 fills, the number of air bubbles in the recesses C is reduced. During the secondary cutting process, the number of air bubbles penetrating into the display module 100 is reduced. After the cutting is completed, the edge area NA2 is formed. Please refer to... Figure 8 After the second cutting, the pit C forms a groove C1 and a through groove C2. The first embodiment reduces the air bubbles in the pit C before the second cutting by filling at least the groove C1 with a first filling part 40, and reduces the air bubbles that seep into the display module 100 during the second cutting process, thereby improving the stability of the internal structure of the display module 100.

[0095] Please see Figure 10 Optionally, the surface of the first filling portion 40 away from the substrate 10 is flush with the surface of the first flattening layer 22 away from the substrate 10.

[0096] In this embodiment, please refer to Figure 11 Before the secondary cutting, the recesses C of the cutting path CUT are filled with the first filling part 40. Compared with the previous embodiment, the space filled in the recesses C is relatively larger. After the first filling part 40 fills, the air bubbles in the recesses C are further reduced. During the secondary cutting process, the air bubbles that penetrate into the display module 100 are further reduced. After the cutting is completed, the edge area NA2 is formed. Please refer to Figure 10 After the second cutting, the pit C forms a groove C1 and a through groove C2. In this embodiment, by filling the groove C1 with at least more of the first filling part 40, the air bubbles in the pit C before the second cutting are further reduced, the air bubbles that seep into the display module 100 during the second cutting process are further reduced, and the stability of the internal structure of the display module 100 is further improved.

[0097] In the second embodiment of this application:

[0098] To avoid redundancy, the second embodiment of this application will be described in terms of its differences from the first embodiment of this application.

[0099] The second embodiment of this application differs from the first embodiment of this application in that:

[0100] Please see Figure 12 Optionally, the portion of the second inorganic layer 31 located in the edge region NA2 has a through groove C2.

[0101] The display module 100 also includes a second filling portion 50. The second filling portion 50 fills at least the through groove C2. The second filling portion 50 is integrally connected to the second planarization layer 32.

[0102] In the second embodiment of this application, please refer to Figure 13Before the secondary cutting, the recesses C of the cutting path CUT are filled simultaneously using the first filling part 40 and the second filling part 50. After the first filling part 40 and the second filling part 50 are filled, the air bubbles in the recesses C are further reduced. During the secondary cutting process, the air bubbles penetrating into the display module 100 are further reduced. After the cutting is completed, the edge area NA2 is formed. Please refer to Figure 12 After the second cutting, the pit C forms a groove C1 and a through groove C2. In the second embodiment, by filling the groove C1 with a first filling part 40 and the through groove C2 with a second filling part 50, compared with the first embodiment, the second embodiment further reduces the air bubbles in the pit C before the second cutting, further reduces the air bubbles that seep into the display module 100 during the second cutting process, and improves the stability of the internal structure of the display module 100.

[0103] Please see Figure 14 Optionally, the material of the second filling portion 50 is the same as the material of the second planarization layer 32. The surface of the second filling portion 50 away from the substrate 10 is flush with the surface of the second planarization layer 32 away from the substrate 10.

[0104] In this embodiment, please refer to Figure 15 Before the secondary cutting, the recesses C of the cutting path CUT are filled with the first filling portion 40 and the second filling portion 50. Compared with the previous embodiment, the space filled in the recesses C is relatively larger. After the first filling portion 40 and the second filling portion 50 are filled, the air bubbles in the recesses C are reduced to the maximum extent. During the secondary cutting process, the air bubbles that penetrate into the display module 100 are reduced to the maximum extent. After the cutting is completed, the edge area NA2 is formed. Please refer to Figure 14 After the second cutting, the pit C forms a groove C1 and a through groove C2. In this embodiment, by filling the groove C1 and the through groove C2 with more of the first filling part 40 and the second filling part 50 respectively, the air bubbles in the pit C before the second cutting are reduced to the greatest extent, and the air bubbles that seep into the display module 100 during the second cutting process are reduced to the greatest extent, thereby further improving the stability of the internal structure of the display module 100.

[0105] In the third embodiment of this application:

[0106] Please see Figure 16 Optionally, the first filling portion 40 is integrally connected to the second planarization layer 32.

[0107] The first inorganic layer 21 and the first planarization layer 22 located in the edge region NA2 have grooves C1 formed therein. The second inorganic layer 31 located in the edge region NA2 has through grooves C2 formed therein.

[0108] The first filling portion 40 fills at least the groove C1 and the through groove C2. The material of the first filling portion 40 is the same as the material of the second planarization layer 32.

[0109] In the third embodiment of this application, please refer to Figure 17 Before the secondary cutting, the first filling part 40 fills the recesses C of the cutting path CUT. After the first filling part 40 fills, the number of air bubbles in the recesses C is reduced. During the secondary cutting process, the number of air bubbles penetrating into the display module 100 is reduced. After the cutting is completed, the edge area NA2 is formed. Please refer to... Figure 16 After the second cutting, the pit C forms a groove C1 and a through groove C2. Compared with the first embodiment where only the first filling part 40 is filled in the groove C1, the second embodiment further reduces the air bubbles in the pit C before the second cutting by filling the groove C1 and the through groove C2 with the first filling part 40, and further reduces the air bubbles that seep into the display module 100 during the second cutting process, thereby improving the stability of the internal structure of the display module 100.

[0110] Please see Figure 18 Optionally, a surface of the first filling portion 40 away from the substrate 10 is flush with a surface of the second flattening layer 32 away from the substrate 10.

[0111] In this embodiment, please refer to Figure 19 Before the secondary cutting, the recess C of the cutting slit CUT is filled with the first filling part 40. Compared to the previous embodiment, the space filled in the recess C is relatively larger, and after the first filling part 40 fills it, the number of air bubbles in the recess C is reduced to the maximum extent. Compared to the second embodiment, which requires two steps to fill the recess C with organic material, the third embodiment of this application only requires one step to fill the recess C with organic material. During the secondary cutting process, the number of air bubbles penetrating into the display module 100 is reduced to the maximum extent, and after the cutting is completed, the edge region NA2 is formed. Please refer to... Figure 18 After the second cutting, the pit C forms a groove C1 and a through groove C2. In this embodiment, by filling more of the first filling part 40 into the groove C1 and the through groove C2, the air bubbles in the pit C before the second cutting are minimized, the air bubbles that seep into the display module 100 during the second cutting process are minimized, and the stability of the internal structure of the display module 100 is maximized.

[0112] The specific embodiments of this application have been described in detail above. The embodiments disclosed above are merely preferred embodiments of this application. Those skilled in the art can make many modifications and improvements without departing from the concept of this application. All such modifications and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A display module having an edge region, characterized in that, The display module includes: Substrate; A driving substrate includes a first inorganic layer and a first planarization layer sequentially disposed on the substrate, wherein a groove is formed in the portion of the first inorganic layer located in the edge region; A touch substrate includes a second inorganic layer and a second planarization layer sequentially disposed on the driving substrate. A through-groove is formed in the edge region of the touch substrate, and the through-groove overlaps with the recess in the thickness direction of the display module. The first filling portion fills at least the groove, and one of the first flat layer and the second flat layer is integrally connected to the first filling portion.

2. The display module as described in claim 1, characterized in that, The first filling portion is integrally connected to the first planarization layer; The first inorganic layer has the groove formed in the portion of the edge region, and the material of the first filling portion is the same as the material of the first planar layer.

3. The display module as described in claim 2, characterized in that, The surface of the first filling portion away from the substrate is flush with the surface of the first flat layer away from the substrate.

4. The display module as described in claim 2, characterized in that, The second inorganic layer has the through groove formed in the portion located in the edge region; The display module further includes a second filling portion, which fills at least the through slot and is integrally connected to the second planarization layer.

5. The display module as described in claim 4, characterized in that, The material of the second filling portion is the same as the material of the second planarization layer, and the surface of the second filling portion away from the substrate is flush with the surface of the second planarization layer away from the substrate.

6. The display module as described in claim 1, characterized in that, The first filling portion is integrally connected to the second planarization layer; The first inorganic layer has the groove formed in the portion of the edge region and the first flat layer has the groove formed in the portion of the edge region; the second inorganic layer has the through groove formed in the portion of the edge region. The first filling portion fills at least the groove and the through groove, and the material of the first filling portion is the same as the material of the second planarization layer.

7. The display module as described in claim 6, characterized in that, The surface of the first filling portion away from the substrate is flush with the surface of the second flat layer away from the substrate.

8. The display module as described in any one of claims 1-7, characterized in that, The display module also has a display area and a retaining wall area, wherein the retaining wall area connects the display area and the edge area; The display module further includes an encapsulation layer, which is located between the driving substrate and the touch substrate. The encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked together. Wherein, a portion of the organic encapsulation layer is located in the display area, the edge of the organic encapsulation layer ends at the barrier area, the first filling portion is located in the edge area, and the organic encapsulation layer is separated from the first filling portion.

9. The display module as described in claim 8, characterized in that, The display module also includes alignment marks, which are disposed in the barrier area and located on the edge of the organic encapsulation layer near the edge area. The alignment marks are used to locate the edge area on the side away from the display area.

10. The display module as described in claim 9, characterized in that, The display module also includes: The first barrier wall is disposed on the substrate and located in the barrier wall area; A second barrier wall is disposed on the substrate and located in the barrier wall area. The second barrier wall is located on the side of the first barrier wall away from the display area. The edge of the organic encapsulation layer terminates at either the side of the first barrier wall near the display area or the side of the second barrier wall near the display area. A crack-resistant structure is disposed on the substrate and located in the barrier area. The crack-resistant structure is located on the side of the second barrier away from the display area, and the alignment mark is located between the second barrier and the crack-resistant structure.

11. The display module as described in any one of claims 1-7, characterized in that, The display module includes: Main body; and The bending portion includes a first bending portion and a second bending portion, wherein the first bending portion is connected to one side of the main body portion, and the second bending portion is connected to the side of the first bending portion away from the main body portion; In the plan view of the display module, the width of the first bent portion increases in the direction away from the main body, and the edge of the first bent portion connects with the edge of the main body to form a recess. The groove is provided on the outer side of the main body, the outer side of the bent portion, and the recessed portion, and a portion of the first filling portion fills the recessed portion.

12. A display device, characterized in that, Includes the display module as described in any one of claims 1-11.

Images