Display device including semiconductor light emitting device and manufacturing method thereof

Abstract

A display device including a semiconductor light emitting device according to an embodiment may include: a first display module and a second display module each including a plurality of semiconductor light emitting device assemblies disposed on a substrate, the first display module and the second display module being disposed adjacent to each other; a resin layer disposed on a lower side between the first display module and the second display module; a transparent resin layer disposed on the resin layer and disposed between the first display module and the second display module; and a refractive layer disposed on the transparent resin layer.

Description

TECHNICAL FIELD

[0001] Embodiments relate to a display apparatus including a semiconductor light emitting device and a manufacturing method thereof. BACKGROUND

[0002] Large-screen display apparatuses include liquid crystal displays (LCDs), OLED displays, and micro-LED displays (Micro-LED displays), etc.

[0003] A micro-LED display is a display that uses micro-LEDs, which are semiconductor light emitting devices having a diameter or a cross-sectional area of 100 μm or less, as display devices.

[0004] A micro-LED display uses micro-LEDs, which are semiconductor light emitting devices, as display devices, and thus has excellent performance in many characteristics such as a contrast ratio, a response speed, a color reproduction rate, a viewing angle, a brightness, a resolution, a lifespan, a light emitting efficiency, or a luminance.

[0005] In particular, a micro-LED display can separate and combine a screen in a module manner, and thus has the advantages of size or resolution adjustment freedom and the advantage of enabling a flexible display.

[0006] However, a large micro-LED display requires several million or more micro-LEDs, and thus has a technical problem in that it is difficult to rapidly and accurately transfer the micro-LEDs to a display panel.

[0007] Recently developed transfer technologies include a pick and place process, a laser lift-off method, or a self-assembly method, etc. Among them, the self-assembly method is a method in which semiconductor light emitting devices find assembly positions by themselves in a fluid, and is a method advantageous for implementing a large-screen display apparatus.

[0008] On the other hand, a conventional display apparatus using semiconductor light emitting devices is manufactured by transferring semiconductor light emitting devices to a module substrate or a wiring substrate or the like, but has a problem in that production efficiency is decreased due to transfer defects of semiconductor light emitting devices, and in particular, the production yield of a large-screen display apparatus is very low.

[0009] In order to solve such a problem, research and development on a "multi-screen display apparatus" that implements a large display apparatus by splicing a plurality of semiconductor light emitting device display modules having a relatively small size have been conducted in recent years.

[0010] However, in the case of the multi-screen display apparatus, since a bezel area exists at the edge of each unit display apparatus, a gap area can be generated between the unit display apparatuses connected to each other. The bezel area exists due to a side electrode (or a side wiring) or the like for electrical connection between a structure configured at the upper portion of the substrate and a structure configured at the lower portion of the substrate.

[0011] In the case of displaying one image in the entire area of the multi-screen display apparatus in terms of the gap area, the gap or the boundary line between the modules can be "visually recognized" as a seam, thereby causing a sense of discontinuity and heterogeneity of the image, resulting in a decrease in the sense of immersion of the image.

[0012] On the other hand, in the related art, there is a study for improving the seam between the modules in the multi-screen display apparatus in which a plurality of display modules are spliced.

[0013] For example, the prior art 1 (Korean Publication No. 10-2019-0046684) adopts a structure in which a light-absorbing layer is disposed at the side portion of each module, but a gap still exists between the light-absorbing layers of the adjacent display modules, thereby having a problem of a seam.

[0014] In addition, the prior art 2 (Korean Publication No. 10-2020-0014057) adopts a structure in which a PR film is disposed on the seam area between the modules, but an empty space still exists between the modules, so that in the case where attachment of the PR film is not good, the seam area can cause a visibility problem. In addition, since the seam area is an empty space, it is not only difficult to attach the PR film on the seam, but in the case where the PR is attached on the pixel, a pixel defect can be caused.

[0015] On the other hand, in the related art, a plurality of display modules are spliced on a prescribed chassis or a case, but there is no attempt to additionally physically combine the side area between the adjacent display modules, so there is a problem of poor mechanical reliability.

[0016] On the other hand, in the display apparatus of the related art, even if the gap between the spliced display modules is physically or mechanically reduced or eliminated, there is still a problem that the boundary line is optically and visually recognized as a seam.

[0017] Therefore, it is necessary to not only physically eliminate the gap between the display modules, but also to optically prevent the seam from being recognized.

[0018] In addition, in the internal technology, in a multi-screen display device in which a plurality of display modules are spliced, a surface step occurs in the display modules due to a height difference in the top surface of the display modules that are spliced.

[0019] Therefore, there is a problem in that even if a gap between the display modules is filled, if a surface step occurs between the display modules, it is optically recognized as a very serious seam. SUMMARY

[0020] PROBLEMS TO BE SOLVED BY THE INVENTION

[0021] One of the problems to be solved by the embodiments is to solve the problem of poor mechanical reliability between the side surface regions of adjacent display modules in the case of splicing a plurality of display modules.

[0022] In addition, one of the problems to be solved by the embodiments is to not physically eliminate the level of the gap such that the gap between the display modules is not optically or visually recognized as a seam.

[0023] In addition, one of the problems to be solved by the embodiments is to solve the problem in which even if the gap between the display modules is filled, in the case in which a surface step occurs between the display modules, it is still optically recognized as a serious seam.

[0024] In addition, one of the problems to be solved by the embodiments is to solve the problem in which in the case in which the gap between the display modules is filled, a seam phenomenon occurs due to the occurrence of a void (V).

[0025] The problems to be solved by the embodiments are not limited to the above-described problems, and include problems that can be understood through the entire specification.

[0026] TECHNICAL SOLUTION TO THE PROBLEMS

[0027] A display device including a semiconductor light emitting device according to an embodiment can include: a first display module and a second display module each including a plurality of semiconductor light emitting device assemblies disposed on a substrate, disposed adjacent to each other; a resin layer disposed on a lower side between the first display module and the second display module; a transparent resin layer disposed on the resin layer, disposed between the first display module and the second display module; and a refractive layer disposed on the transparent resin layer.

[0028] In addition, the embodiments can further include a thin film layer disposed on the plurality of semiconductor light emitting device assemblies.

[0029] The bonding force of the refractive layer and the transparent resin layer can be greater than the bonding force between the refractive layer and the thin film layer.

[0030] In addition, in the display device including a semiconductor light emitting device according to an embodiment, for first and second display modules disposed adjacent to each other, the first and second display modules can each include a substrate, a plurality of semiconductor light emitting device assemblies disposed on the substrate, a side wire disposed on a side of the substrate and electrically connected to the semiconductor light emitting device assemblies, a resin layer including a thin film layer disposed on the plurality of semiconductor light emitting device assemblies and disposed on a lower side between the first and second display modules, a transparent resin layer disposed on the resin layer and disposed between the first and second display modules, and a refractive layer disposed on the transparent resin layer.

[0031] In addition, in an embodiment, the bonding force of the refractive layer and the transparent resin layer can be greater than the horizontal bonding force of the refractive layer.

[0032] In addition, in an embodiment, a top surface of the refractive layer can be located at a height corresponding to a top surface of the thin film layer.

[0033] In addition, in an embodiment, a refractive index of the refractive layer can correspond to a refractive index of the thin film layer.

[0034] In addition, in an embodiment, the resin layer can include at least one of a porous adhesive substance and a time-varying substance.

[0035] In addition, in an embodiment, the first and second display modules can include a frame portion disposed below the substrate.

[0036] In addition, in an embodiment, the transparent resin layer can completely fill between the first and second display modules.

[0037] In addition, a manufacturing method of a display device including a semiconductor light emitting device according to an embodiment can include a step of disposing first and second display modules adjacent to each other, a step of forming a resin layer on a lower side between the first and second display modules, a step of adhering a low-adhesion thin film having a refractive layer to a top surface of the first and second display modules, a step of filling a joint formed between the first and second display modules with a transparent resin, a step of curing so that the transparent resin and the refractive layer are adhered, and a step of removing the low-adhesion thin film from the first and second display modules.

[0038] In addition, in an embodiment, the first display module and the second display module can each include a substrate, a plurality of semiconductor light emitting device assemblies disposed on the substrate, a side wiring disposed on a side of the substrate and electrically connected to the semiconductor light emitting device assemblies, and a thin film layer disposed on the plurality of semiconductor light emitting device assemblies.

[0039] In addition, in an embodiment, a top surface of the refractive layer can be located at a position corresponding to a height of a top surface of the thin film layer.

[0040] In addition, in an embodiment, a refractive index of the refractive layer can correspond to a refractive index of the thin film layer.

[0041] In addition, in an embodiment, a bonding force between the refractive layer and the transparent resin layer can be greater than a horizontal bonding force of the refractive layer.

[0042] Inventive Effects

[0043] The display device including a semiconductor light emitting device according to an embodiment and a manufacturing process thereof have a technical effect capable of solving the problem of poor mechanical reliability between side regions of adjacent display modules in the case of splicing a plurality of display modules.

[0044] For example, according to an embodiment, the modules are directly bonded between each other using a resin layer of a porous bonding material as a medium, and thus there is no gap between the modules, thereby having a technical effect capable of achieving perfect seamless.

[0045] In addition, according to an embodiment, the modules are directly bonded between each other using a resin layer of a porous bonding material or the like as a medium, and thus having a technical effect of not requiring additional fixation of the modules and excellent structural reliability.

[0046] In addition, since the transparent resin layer 185 completely fills a seam region in an embodiment, there is a technical effect capable of solving the problem of the seam being recognized due to diffuse reflection.

[0047] In addition, an embodiment has a technical effect of preventing the seam from being recognized optically and visually by blocking light reflected from the seam.

[0048] For example, with the refractive layer disposed on the transparent resin layer, light reflected from the seam can be blocked.

[0049] In addition, an embodiment also has a special technical effect capable of eliminating the distinction between the seam peripheral region and the seam region.

[0050] For example, the refractive layer disposed on an upper portion of the seam region has a height and a refractive index corresponding to the seam peripheral region, and thus the distinction between the seam peripheral region and the seam region can be eliminated.

[0051] In addition, the embodiment also has the technical effect of solving the problem of being optically identified as a seam even when there is a step difference between the surfaces of the display modules.

[0052] For example, by injecting a transparent resin layer into the seam area and a refractive layer disposed on the transparent resin layer, even if a step difference occurs on the surface between modules, it is possible to prevent it from being identified as a seam by blocking reflection from the seam area.

[0053] The technical effects of the embodiments are not limited to those described above, but include effects that can be understood through the entire specification. Attached Figure Description

[0054] Figure 1 This is an example diagram showing the living room of a residence equipped with the display device of an embodiment.

[0055] Figure 2 This is a block diagram that schematically illustrates a display device according to an embodiment.

[0056] Figure 3 It is shown Figure 2 A circuit diagram of an example of a pixel.

[0057] Figure 4 yes Figure 1 An enlarged view of the first panel area in the display device.

[0058] Figure 5 It is along Figure 4 A sectional view of region A2 taken along line B1-B2.

[0059] Figure 6 This is an example diagram of how the light-emitting device in this embodiment is assembled onto the substrate using a self-assembly method.

[0060] Figure 7 This is an example diagram of a multi-screen display device comprising a plurality of display panels, based on internal technology.

[0061] Figure 8 This is a cross-sectional view of a display device including a semiconductor light-emitting device according to an embodiment.

[0062] Figures 9 to 16 This is a manufacturing process diagram of a display device including a semiconductor light-emitting device according to an embodiment.

[0063] Figure 17 This is a diagram illustrating a method of manufacturing a display device including a semiconductor light-emitting device, depending on whether an embodiment is applied. Detailed Implementation

[0064] The embodiments disclosed in this specification will now be described in detail with reference to the accompanying drawings. The suffixes "module" and "part" used for the constituent elements in the following description are assigned or used interchangeably for ease of writing and do not inherently have a distinguishing meaning or function. Furthermore, the accompanying drawings are provided to facilitate understanding of the embodiments disclosed in this specification, and the technical concepts disclosed herein are not limited to the drawings. Also, when referring to elements such as layers, regions, or substrates existing "on" another constituent element, this includes their direct existence on the other element, or the possible existence of other intermediate elements between them.

[0065] The display devices described in this specification may include digital TVs, mobile phones, smartphones, laptop computers, digital broadcasting terminals, personal digital assistants (PDAs), portable multimedia players (PMPs), navigators, touchscreen tablet PCs, tablet PCs, ultrabooks, desktop computers, etc. However, the configuration of the embodiments described in this specification can also be applied to displayable devices in future new product forms.

[0066] Hereinafter, the light-emitting device and the display device including the light-emitting device of the embodiment will be described.

[0067] Figure 1 The living room of a residence is shown, in which the display device 100 of the embodiment is configured.

[0068] The display device 100 in this embodiment can display the status of various electronic products such as washing machine 101, robot vacuum cleaner 102, and air purifier 103. It can communicate with each electronic product based on IoT and control each electronic product based on user-defined data.

[0069] The display device 100 of the embodiment may include a flexible display manufactured on a thin and flexible substrate. The flexible display not only retains the characteristics of existing flat panel displays, but also can be bent or rolled like paper.

[0070] In flexible displays, visual information can be achieved by individually controlling the emission of unit pixels arranged in a matrix. A unit pixel is the smallest unit used to achieve a color. The unit pixels of a flexible display can be implemented by light-emitting devices. In embodiments, the light-emitting devices can be Micro-LEDs (micrometer-scale light-emitting diodes) or Nano-LEDs (nanometer-scale light-emitting diodes), but are not limited to these.

[0071] Figure 2 This is a block diagram that schematically illustrates a display device according to an embodiment. Figure 3 It is shown Figure 2 A circuit diagram of an example of a pixel.

[0072] Reference Figure 2 and Figure 3 The display device in the embodiment may include a display panel 10, a driving circuit 20, a scanning driving unit 30, and a power supply circuit 50.

[0073] The display device 100 of the embodiment can drive the light-emitting device in an active matrix (AM) or passive matrix (PM) manner.

[0074] The driving circuit 20 may include a data driving unit 21 and a timing control unit 22.

[0075] The display panel 10 can be divided into a display area DA and a non-display area NDA disposed around the display area DA. The display area DA is an area in which a plurality of pixels PX are formed to display an image. The display panel 10 may include a plurality of data lines D1 to Dm (m is an integer greater than or equal to 2), a plurality of scan lines S1 to Sn (n is an integer greater than or equal to 2) that intersect the plurality of data lines D1 to Dm, a high-potential voltage line supplied with a high-potential voltage, a low-potential voltage line supplied with a low-potential voltage, and a plurality of pixels PX connected to the plurality of data lines D1 to Dm and the plurality of scan lines S1 to Sn.

[0076] Each of the plurality of pixels PX can include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. The first sub-pixel PX1 emits light of a first color at a first wavelength, the second sub-pixel PX2 emits light of a second color at a second wavelength, and the third sub-pixel PX3 emits light of a third color at a third wavelength. The first color can be red, the second color can be green, and the third color can be blue, but is not limited to these. Furthermore, Figure 2 The example illustrates that each pixel in a plurality of pixels PX comprises three sub-pixels, but is not limited thereto. That is, each pixel in a plurality of pixels PX may comprise four or more sub-pixels.

[0077] Each of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 can be connected to at least one data line from a plurality of data lines D1 to Dm, at least one scan line from a plurality of scan lines S1 to Sn, and a high-potential voltage line. For example... Figure 3As shown, the first sub-pixel PX1 may include a plurality of light-emitting devices (LDs), a plurality of transistors for supplying current to the plurality of light-emitting devices (LDs), and at least one capacitor Cst.

[0078] Although not illustrated, each of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may also include only one light-emitting device LD and at least one capacitor Cst.

[0079] Each of the plurality of light-emitting devices (LDs) can be a semiconductor light-emitting diode comprising a first electrode, a plurality of conductive semiconductor layers, and a second electrode. Here, the first electrode can be an anode electrode, and the second electrode can be a cathode electrode, but is not limited thereto.

[0080] Reference Figure 3 The plurality of transistors may include: a driving transistor DT, which supplies current to the plurality of light-emitting devices LD; and a scanning transistor ST, which supplies data voltage to the gate electrode of the driving transistor DT. The driving transistor DT may include: a gate electrode connected to the source electrode of the scanning transistor ST; a source electrode connected to a high-potential voltage line to which a high-potential voltage is applied; and a drain electrode connected to the plurality of first electrodes of the plurality of light-emitting devices LD. The scanning transistor ST may include: a gate electrode connected to the scan line Sk (k is an integer satisfying 1≤k≤n); a source electrode connected to the gate electrode of the driving transistor DT; and a drain electrode connected to the data line Dj (j is an integer satisfying 1≤j≤m).

[0081] A capacitor Cst is formed between the gate and source electrodes of the driving transistor DT. The storage capacitor Cst can store the difference between the gate voltage and the source voltage of the driving transistor DT.

[0082] The driving transistor DT and the scanning transistor ST can be formed from thin-film transistors. Additionally, in Figure 3 The description focused on the fact that the driving transistor DT and the scanning transistor ST were formed using P-type MOSFETs (Metal Oxide Semiconductor Field Effect Transistors), but this embodiment is not limited to this. The driving transistor DT and the scanning transistor ST can also be formed using N-type MOSFETs. In this case, the positions of the source and drain electrodes of the driving transistor DT and the scanning transistor ST can be changed.

[0083] In addition, Figure 3The illustration shows that each of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 includes a 2T1C (2 Transistor-1 Capacitor, two transistors and one capacitor) having a driving transistor DT, a scanning transistor ST, and a capacitor Cst, but the invention is not limited thereto. Each of the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may include a plurality of scanning transistors ST and a plurality of capacitors Cst.

[0084] Refer again Figure 2 The driving circuit 20 outputs a plurality of signals and a plurality of voltages for driving the display panel 10. For this purpose, the driving circuit 20 may include a data driving unit 21 and a timing control unit 22.

[0085] The data drive unit 21 receives digital video data DATA and source control signal DCS from the timing control unit 22. Based on the source control signal DCS, the data drive unit 21 converts the digital video data DATA into a plurality of analog data voltages and supplies them to a plurality of data lines D1 to Dm of the display panel 10.

[0086] The timing control unit 22 receives digital video data DATA and a plurality of timing signals from the host system. The plurality of timing signals may include a vertical sync signal, a horizontal sync signal, a data enable signal, and a dot clock. The host system may be an application processor of a smartphone or tablet PC, a display, a system-on-a-chip of a TV, etc.

[0087] The scan driving unit 30 receives a scan control signal SCS from the timing control unit 22. The scan driving unit 30 generates a plurality of scan signals based on the scan control signal SCS and supplies them to a plurality of scan lines S1 to Sn of the display panel 10. The scan driving unit 30 includes a plurality of transistors and can be formed in the non-display area NDA of the display panel 10. Alternatively, the scan driving unit 30 can be formed by an integrated circuit, in which case it can be mounted on a gate flexible film attached to the other side of the display panel 10.

[0088] The power supply circuit 50 can generate high-potential voltage VDD and low-potential voltage VSS from the main power supply to drive the plurality of light-emitting devices (LDs) of the display panel 10, and supply them to the high-potential voltage lines and low-potential voltage lines of the display panel 10. Additionally, the power supply circuit 50 can generate and supply driving voltages from the main power supply to drive the driving circuit 20 and the scanning driving unit 30.

[0089] Figure 4 yes Figure 1 An enlarged view of the first panel area A1 in the display device.

[0090] according to Figure 4 The display device 100 of the embodiment can be manufactured by splicing together a plurality of panel areas, such as a first panel area A1, to mechanically and electrically connect them.

[0091] The first panel area A1 may include units of pixels ( Figure 2 The PX) configuration includes a plurality of light-emitting devices 150.

[0092] For example, a unit pixel PX may include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. For instance, a plurality of red light-emitting devices 150R may be configured in the first sub-pixel PX1, a plurality of green light-emitting devices 150G may be configured in the second sub-pixel PX2, and a plurality of blue light-emitting devices 150B may be configured in the third sub-pixel PX3. A unit pixel PX may also include a fourth sub-pixel without a light-emitting device, but is not limited thereto. On the other hand, the light-emitting device 150 may be a semiconductor light-emitting device.

[0093] then, Figure 5 It is along Figure 4 A sectional view of region A2 taken along line B1-B2.

[0094] Reference Figure 5 The display device 100 in the embodiment may include a substrate 200, assembly lines 201 and 202, a first insulating layer 211a, a second insulating layer 211b, a third insulating layer 206, and a plurality of light-emitting devices 150.

[0095] The assembly line may include a first set of assembly lines 201 and a second set of assembly lines 202 spaced apart from each other. The first set of assembly lines 201 and the second set of assembly lines 202 may generate dielectric forces for assembling the light-emitting device 150. Furthermore, the first set of assembly lines 201 and the second set of assembly lines 202 may also be electrically connected to the electrodes of the light-emitting device, thereby functioning as electrodes of the display panel.

[0096] Assembly lines 201 and 202 may be formed of transparent ITO electrodes, or may include a metallic material with excellent conductivity. For example, assembly lines 201 and 202 may be formed of at least one of titanium (Ti), chromium (Cr), nickel (Ni), aluminum (Al), platinum (Pt), gold (Au), tungsten (W), and molybdenum (Mo), or alloys thereof.

[0097] A first insulating layer 211a may be disposed between the first assembly line 201 and the second assembly line 202, and a second insulating layer 211b may be disposed on the first assembly line 201 and the second assembly line 202. The first insulating layer 211a and the second insulating layer 211b may be an oxide film, a nitride film, etc., but are not limited thereto.

[0098] To form a sub-pixel, the light-emitting device 150 may include a red light-emitting device 150, a green light-emitting device 150G, and a blue light-emitting device 150B0, but is not limited to these. Red phosphors and green phosphors may also be provided to achieve red and green respectively.

[0099] The substrate 200 can be formed of glass or polyimide. Alternatively, the substrate 200 can include flexible materials such as PEN (polyethylene naphthalate) and PET (polyethylene terephthalate). Furthermore, the substrate 200 can be a light-transmitting material, but is not limited to these.

[0100] The third insulating layer 206 may include a material with insulating and flexible properties, such as polyimide, PEN, PET, etc., and may also be integrally formed with the substrate 200 to form a single substrate.

[0101] The third insulating layer 206 can be a conductive adhesive layer with adhesive and conductive properties. This conductive adhesive layer is flexible, thereby enabling the flexible function of the display device. For example, the third insulating layer 206 can be a conductive adhesive layer of anisotropic conductive film (ACF), an anisotropic conductive medium, or a solution containing conductive particles. The conductive adhesive layer can be a layer that is conductive in a direction perpendicular to its thickness and electrically insulating in a direction horizontal to its thickness.

[0102] The third insulating layer 206 may include an assembly hole 203 for inserting the light-emitting device 150 (see reference). Figure 6 Therefore, during self-assembly, the light-emitting device 150 can be easily inserted into the assembly hole 203 of the third insulating layer 206. The assembly hole 203 may be referred to as an insertion hole, a fixing hole, an alignment hole, etc.

[0103] The spacing between assembly lines 201 and 202 can be made smaller than the width of the light-emitting device 150 and the width of the assembly hole 203, so that the assembly position of the light-emitting device 150 utilizing the electric field can be fixed more precisely.

[0104] A third insulating layer 206 can be formed on assembly lines 201 and 202 to protect them from the influence of fluid 1200 and to prevent current leakage. The third insulating layer 206 can be formed as a single layer or multiple layers from inorganic insulators such as silicon dioxide and alumina or organic insulators.

[0105] In addition, the third insulating layer 206 may include a material with insulation and flexibility, such as polyimide, PEN, PET, etc., and may also be integrally formed with the substrate 200 to form a single substrate.

[0106] The third insulating layer 206 can be an adhesive insulating layer or a conductive adhesive layer. The third insulating layer 206 is flexible, thereby enabling the flexible function of the display device.

[0107] The third insulating layer 206 has a partition wall through which the assembly hole 203 can be formed. For example, by removing a portion of the third insulating layer 206 when forming the substrate 200, each of the plurality of light-emitting devices 150 can be assembled into the assembly hole 203 of the third insulating layer 206.

[0108] Assembly holes 203 are formed on the substrate 200 for mounting a plurality of light-emitting devices 150. The surface with the assembly holes 203 can contact the fluid 1200. The assembly holes 203 can guide the light-emitting devices 150 to the accurate assembly position.

[0109] On the other hand, the assembly hole 203 can have a shape and size corresponding to the shape of the light-emitting device 150 to be assembled into the corresponding position. This prevents other light-emitting devices or multiple light-emitting devices from being assembled into the assembly hole 203.

[0110] Figure 6 This is a diagram illustrating an example of a light-emitting device being assembled onto a substrate using a self-assembly method. The self-assembly method of the light-emitting device will be explained with reference to the accompanying drawings.

[0111] The substrate 200 may be a panel substrate of a display device. In the following description, the case where the substrate 200 is a panel substrate of a display device will be described, but the embodiments are not limited thereto.

[0112] Reference Figure 6 A plurality of light-emitting devices 150 can be placed into a chamber 1300 filled with fluid 1200. The fluid 1200 can be water, such as ultrapure water, but is not limited thereto. The chamber can be referred to as a water tank, container, or vessel.

[0113] Next, the substrate 200 can be disposed on the chamber 1300. According to an embodiment, the substrate 200 can also be inserted into the chamber 1300.

[0114] like Figure 5 As shown, a pair of assembly lines 201, 202 corresponding to each of the light-emitting devices 150 to be assembled can be configured on the substrate 200.

[0115] Reference Figure 6 After the substrate 200 is configured, the assembly apparatus 1100, including a magnetic element, can move along the substrate 200. For example, a magnet or electromagnet can be used as the magnetic element. To maximize the area affected by the magnetic field within the fluid 1200, the assembly apparatus 1100 can move in contact with the substrate 200. According to an embodiment, the assembly apparatus 1100 may include a plurality of magnetic elements, or it may include a magnetic element of a size corresponding to the substrate 200. In this case, the moving distance of the assembly apparatus 1100 can also be limited within a specified range.

[0116] The light-emitting device 150 inside the chamber 1300 can move toward the assembly device 1100 using the magnetic field generated by the assembly device 1100.

[0117] During the movement toward the assembly device 1100, the light-emitting device 150 can enter the assembly hole 203 and come into contact with the substrate 200 under the action of dielectric electrophoresis force (DEP force).

[0118] Specifically, the assembly lines 201 and 202 can be powered by an externally supplied electric field, which creates a dielectric force between them. This dielectric force can then be used to fix the light-emitting device 150 to the assembly hole 203 on the substrate 200.

[0119] By applying an electric field through the assembly lines 201 and 202 formed on the substrate 200, the light-emitting devices 150 in contact with the substrate 200 can be prevented from detaching due to the movement of the assembly device 1100. According to the embodiment, by using the self-assembly method utilizing electromagnetic fields described above, the time required to assemble each of the plurality of light-emitting devices 150 onto the substrate 200 can be significantly shortened, thus enabling the realization of large-area high-pixel displays more quickly and economically.

[0120] At this time, a predetermined solder layer (not shown) is formed between the light-emitting device 150 assembled on the assembly hole 203 of the substrate 200 and the assembly electrode, thereby improving the bonding force of the light-emitting device 150.

[0121] Next, a molding layer (not shown) can be formed in the assembly hole 203 of the substrate 200. The molding layer can be a light-transmitting resin or a resin containing reflective or scattering substances.

[0122] Figure 7A multi-screen display device 600 comprising a plurality of display panels is shown, based on internal technology.

[0123] Reference Figure 7 The multi-screen display device 600 can be implemented by splicing together a plurality of display panels 600a to 600d. For example, the multi-screen display device 600 may include a first display panel to a fourth display panel 600a, 600b, 600c, and 600d, but is not limited thereto. Each of the plurality of the display panels 600a to 600d may be a display device manufactured by the aforementioned self-assembly method, but is not limited thereto.

[0124] In the internal technology, the multi-screen display device 600 can be used as a large-screen display device that provides an image through a plurality of display panels 600a to 600d, each of which can reduce the gap area between adjacent display devices by minimizing the side bezel area.

[0125] According to the internal technology, by reducing the gap area between display devices, it is possible to minimize the dark area caused by the gap area when outputting the image, thereby enabling the display of an image with minimized fragmentation across the entire screen of the multi-screen display device 600.

[0126] On the other hand, refer to Figure 7 Even if the gap between the physical spacing of multiple display panels, which is an internal technology, is reduced, there is still a problem that the gap or boundary line is optically "visually recognized" by the seam S1.

[0127] According to internal technology, there is a problem where the gaps between display modules are identified as seams, especially when the display device is in a black screen state, the seams are even more obvious.

[0128] In addition, according to the internal technology, there is an empty space between the display module and the module, which makes it difficult to attach adhesive layers or front covers such as OCA.

[0129] Additionally, according to internal technology, there is a problem that when attaching the front cover, the step difference (empty space) at the seam causes the cover to bend, resulting in a more prominent seam.

[0130] Hereinafter, a display device including a semiconductor light-emitting device and a method for manufacturing the same, according to embodiments, for solving the above-mentioned technical problems, will be described in detail.

[0131] Figure 8 This is a cross-sectional view of a display device including a semiconductor light-emitting device according to an embodiment. (Refer to...) Figure 9The display device 110 in the embodiment may include a first display module 110a and a second display module 110b.

[0132] The first display module 110a and the second display module 110b may each include a display part 105 and a frame part 107. The display part 105 can be spliced ​​and fixed. In order to fix the display part 105, a frame part 107 can be arranged below the display part 105, and the display part 105 and the frame part 107 can be connected by adhesive tape 145.

[0133] The display unit 105 may include a module substrate 130, a semiconductor light-emitting device assembly 150 disposed on the module substrate 130, a planarization layer disposed on the semiconductor light-emitting device assembly 150, and a thin film layer 134.

[0134] On the other hand, refer to Figure 8 The first display module 110a and the second display module 110b can be spaced apart and adjacent to each other, and a second resin layer 165 can be disposed below the space between them. The second resin layer 165 may include at least one of porous foam, thermoplastic material, thermosetting material, and time-varying material, and serves as a light-absorbing layer.

[0135] A transparent resin layer 185 can be disposed on the second resin layer 165 in the space separating the first display module 110a and the second display module 110b. The transparent resin layer 185 directly adheres to the first display module 110a and the second display module 110b, thus eliminating gaps between the modules and achieving a seamless finish. Furthermore, the transparent resin layer 185 eliminates the need for additional fixing modules, improving structural reliability.

[0136] In addition, in this embodiment, the transparent resin layer 185 completely fills the seam area, thereby achieving the technical effect of solving the problem of seams being identified due to diffuse reflection.

[0137] On the other hand, a first refractive layer 175a may be disposed on the transparent resin layer 185. The first refractive layer 175a can serve as an anti-reflective layer. The top surface of the first refractive layer 175a may be at the same height as the top surface of the display portion 105 of the first display module 110a and the second display module 110b. For example, the top surface of the first refractive layer 175a may be at the same height as the thin film layer 134, which serves as the top surface of the display portion 105.

[0138] In addition, the refractive index of the first refractive layer 175a can be similar to that of the thin film layer 134.

[0139] In one embodiment, a first refractive layer 175a is disposed on the seam area, thereby having the technical effect of preventing it from being optically and visually identified as a seam by blocking light reflected from the seam.

[0140] In addition, the refractive layer disposed on the upper part of the seam area has a height and refractive index corresponding to the surrounding area of ​​the seam, thereby having a special technical effect that can eliminate the distinction between the surrounding area of ​​the seam and the seam area.

[0141] then, Figures 9 to 16 This is a process diagram illustrating a method for manufacturing a display device including a semiconductor light-emitting device according to an embodiment. First, referring to... Figure 9 The embodiments may include a first display module 110a and a second display module 110b.

[0142] Figure 9 (a) is a cross-sectional view of the first display module 110a. (Refer to...) Figure 9 (a) The embodiment may include at least one of the following: a first display module substrate 130a, a second display module substrate 130b, a black matrix 147, a semiconductor light-emitting device assembly 150, a side electrode 132, a wiring protection layer 131, an optical adhesive layer 132, and a thin film layer 134.

[0143] The module substrate 130 may include a first display module substrate 130a and a second display module substrate 130b disposed below the first display module substrate 130a. The first display module substrate 130a may be a TFT substrate with TFTs (thin film transistors) and wiring formed thereon, and the second display module substrate 130b may be a PCB with circuits such as a timing controller, memory, and a voltage source for driving the semiconductor light-emitting device assembly 150, or various wirings formed thereon. The thin film transistor (TFT) in the embodiment may include a gate electrode, a source electrode, a drain electrode, and a semiconductor layer, and may be arranged in a bottom-up manner with the gate electrode located below the source / drain electrode, but is not limited thereto.

[0144] Alternatively, the second display module substrate 130b may be a PCB with a driving portion that applies signals to the gate wiring and data wiring of the first display module substrate 130a, respectively. In this case, a plurality of wiring electrodes may be formed on the first display module substrate 130a and the second display module substrate 130b.

[0145] Alternatively, according to the embodiment, the second display module substrate 130b may have TFTs, wiring and various circuits formed thereon, while the first display module substrate 130a may be implemented as a protective substrate for protecting the TFTs and wiring.

[0146] Alternatively, the embodiment may include only one substrate, such as the first display module substrate 130a. In this case, the features associated with the bottom surface of the second display module substrate 130b, which will be described later, can be applied in the same way to the bottom surface of the first display module substrate 130a.

[0147] A plurality of semiconductor light-emitting device components 150 may be arranged in an array on the first display module substrate 130a. For example, a plurality of semiconductor light-emitting device components 150 forming a plurality of rows and columns may be arranged on the first display module substrate 130a.

[0148] Each of the plurality of semiconductor light-emitting device assemblies 150 is configured with a predetermined spacing (PX) and functions as a pixel. At least one semiconductor light-emitting device may be disposed within the semiconductor light-emitting device assembly 150.

[0149] The plurality of semiconductor light-emitting device components 150 may be semiconductor light-emitting devices that emit red, blue, and green colors, and combinations thereof. Even if they emit light of a single color, they may be converted to various colors by configuring phosphors or QDs on them.

[0150] The embodiment may include wiring electrodes electrically connected to a plurality of semiconductor light-emitting device assemblies 150 on a first display module substrate 130a.

[0151] Additionally, a plurality of wiring electrodes (not shown) may be formed on the first display module substrate 130a in a direction perpendicular to the wiring electrodes. For example, if the first display module substrate 130a is a TFT substrate, the wiring electrodes may be implemented as data wiring or gate wiring, etc., and the wiring electrodes formed perpendicular to the wiring electrodes may be implemented as wirings different from the wiring electrodes.

[0152] According to an embodiment, the wiring electrode may also be equivalent to a common electrode connected to the p electrode or n electrode of each of a plurality of semiconductor light-emitting devices.

[0153] On the other hand, the wiring electrodes formed on the first display module substrate 130a can be electrically connected to the voltage source or circuit of the second display module substrate 130b, and receive signals related to the driving of the plurality of semiconductor light-emitting device components 150 or be powered.

[0154] The display device 110 of the embodiment may further include a plurality of electrode plates (not shown) formed on the edge region of the top surface of the first display module substrate 130a, and side electrodes 132 formed on the side of the display module. The plurality of electrode plates and side electrodes 132 may be formed of a conductive metal (Cu, Ag, etc.).

[0155] The side electrode 132 can be formed on the side surfaces of the first display module substrate 130a and the second display module substrate 130b, respectively. One end of the side electrode 132 can be formed to connect with the side surface of the electrode plate on the first display module substrate 130a, while the other end can be connected to the second wiring electrode formed at the lower part of the second display module substrate 130b.

[0156] In addition, in the embodiment, after the semiconductor light-emitting device assembly 150 is formed, the second display module substrate 130b is bonded (attached, etc.) to the lower part of the first display module substrate 130a, and a planarization layer 148 is formed on the first display module substrate 130a.

[0157] The planarization layer 148 can be formed with a specified thickness to cover the top surface of the first display module substrate 130a and the semiconductor light-emitting device assembly 150. The planarization layer 148 can provide a flat surface on the upper part of the display device 110 and fix the position of the semiconductor light-emitting device assembly 150.

[0158] The planarization layer 148 can be equivalent to an encapsulation layer that protects the semiconductor light-emitting device assembly 150.

[0159] This planarization layer 148 can be formed by processes such as molding or hot melt. For example, the planarization layer 148 can be a transparent or fluorescent material, made of acrylic resin, polyimide resin, epoxy resin, polyurethane resin, etc.

[0160] Next, in an embodiment, an optical adhesive layer 133 may be included on the planarization layer 148. The optical adhesive layer 133 may be a transparent adhesive material such as OCA (Optical Clear Adhesive) or OCR (Optically Clear Resin), but is not limited to these.

[0161] Next, in an embodiment, a thin film layer 134 may be included on the optical adhesive layer 133. The thin film layer 134 may include various optical films such as polarizing films, AG films, and AR films to prevent external light incident on the electrodes present on the top surface of the first display module substrate 130a from shining outward together with light emitted from the semiconductor light-emitting device, thus preventing a reduction in quality (e.g., a decrease in black contrast).

[0162] Additionally, in this embodiment, a plate 141 and a frame 140 may be disposed below the display panel 105. The plate 141 is disposed on the frame 140, and adhesive tape 145 is disposed on the plate 141 so that it can be bonded to the second display module substrate 130b. The plate 141 and the frame 140 can be used to support and fix the display panel 105.

[0163] Figure 9 (b) is the second display module 110b, which is the same module as the first display module and can have the same structure and description as the first display module 110a.

[0164] then, Figure 10 This is a conceptual diagram illustrating the process of forming a resin layer on the sides of the first display module 110a and the second display module 110b. (Refer to...) Figure 10 The first display module 110a and the second display module can be configured to face each other. The wiring protection layer 131 of the first display module 110a and the wiring protection layer 131 of the second display module 110b can be configured adjacent to each other at the same height and spaced apart from each other.

[0165] In the side portion of the display device of the embodiment, a first resin layer 160 may be formed between the first display module 110a and the second display module 110b. Furthermore, the first resin layer 160 may include a porous material. For example, the first resin layer 160 may be polyurethane foam, PP (Polypropylene), TPU (Thermoplastic Polyurethane), TPO (Thermoplastic Polyolefin), styrene foam, etc., but is not limited to these.

[0166] In addition, the first resin layer 160 can also serve as an adhesive material, including polyurethane resin, terpene resin, etc. Furthermore, the embodiments may also include thermoplastic resins such as polystyrene, polyethylene, polypropylene, methacrylate, and acrylate, and may be manufactured by mixing black pigment into the thermoplastic resin.

[0167] The first resin layer 160 is a soft, porous material that functions as a light-absorbing layer, thereby reducing the visibility of seams by capturing external light reflections into the porous space. Furthermore, the first resin layer 160, as a porous material, can be a foam series that forms an air layer and can be black in color for light absorption. Additionally, the first resin layer 160 can be a foamed resin or a resin with dispersed air, etc. Because the first resin layer 160 contains a soft resin and is elastic, it can be compressed between the first display module 110a and the second display module 110b to match a predetermined spacing (PX), thereby preventing damage to the structure to be fixed and firmly maintaining the spacing.

[0168] then, Figure 11 This is a conceptual diagram illustrating the process of forming a resin layer on the back side of the first display module 110a and the second display module 110b. (Refer to...) Figure 11 A second resin layer 165 may be formed in the space between the first display module 110a and the second display module 110b. The second resin layer 165 may include at least one of porous foam, thermoplastic material, thermosetting material, and time-varying material, and is black for light absorption.

[0169] The top surface of the second resin layer 165 can be located at a higher position than the top surface of the frame portion, and the bottom surface of the second resin layer 165 can be located at a lower position than the bottom surface of the frame portion. Therefore, the area between the first display module 110a and the second display module 110b on the top surface of the second resin layer 165 can be referred to as the seam area 180.

[0170] Reference Figure 12 A low-adhesion film 170 may be disposed on the first display module 110a and the second display module 110b. The low-adhesion film 170 may include a film substrate 170a and a low-adhesion layer 170b disposed below the film substrate 170a.

[0171] Additionally, a refractive layer 175 may be disposed beneath the low-adhesion film 170. The refractive layer 175 may have a thickness of approximately 100 nm to 130 nm and is attached to the bottom surface of the low-adhesion layer 170b in the form of a coating.

[0172] The refractive layer 175 may have release properties with the material of the transparent resin layer formed in subsequent processes to fill the seam area, and may have adhesion to the module surface. The refractive layer 175 may be an AR (Anti-reflective) coating, but is not limited thereto.

[0173] The refractive layer 175 can be configured to be located above the gap between the first display module 110a and the second display module 110b. Additionally, the refractive layer 175 may include a first region overlapping with the seam region 180 and a second region overlapping with the first display module 110a and the second display module 110b.

[0174] Reference Figure 13 The low-adhesion film 170 can be attached to the top surface of the first display module 110a and the second display module 110b. The low-adhesion layer 170b of the low-adhesion film 170 can contact and adhere to the film layer 134 of the first display module 110a and the second display module 110b.

[0175] Additionally, the refractive layer 175, attached to the bottom surface of the low-adhesion film 170, can be in contact with the film layer 134 and is located above the seam region 180. Thus, the seam region, from the top surface of the second resin layer 165 to the bottom surface of the low-adhesion film 170, is an empty space, which may cause visibility problems.

[0176] Next, refer to Figure 14 A transparent resin layer 185 can be injected into the seam region 180 located between the low-adhesion film 170 and the second resin layer 165. The transparent resin layer 185 can be pushed in and filled into the passage formed in the seam region between the first display module 110a and the second display module 110b by vacuum, and then cured by photocuring.

[0177] The transparent resin layer 185 directly bonds the first display module 110a and the second display module 110b, thus eliminating gaps between the modules and achieving a seamless finish. Furthermore, the transparent resin layer 185 eliminates the need for additional fixing modules, improving structural reliability. In this embodiment, the transparent resin layer 185 completely fills the seam, thereby resolving the issue of seams being visible due to diffuse reflection.

[0178] On the other hand, as the transparent resin layer 185 is injected into the seam area, the refractive layer 175 may include a first refractive layer in contact with the transparent resin layer 185 and a second refractive layer not in contact with the transparent resin layer 185. Subsequently, in the process, the refractive layer 175 may be separated into a first refractive layer 175a and a second refractive layer 175b.

[0179] The following is for reference Figure 15 ,illustrate Figure 14The embodiment includes a device for injecting a transparent resin layer into a seam area in a display device comprising a semiconductor light-emitting device. The display device may include a first display module 190a, a second display module 190b, a third module 190c, and a fourth module 190d.

[0180] In addition, a plurality of injection devices 195 may be configured in the adjacent areas of the first display module 190a, the second display module 190b, the third module 190c and the fourth module 190d.

[0181] At least one of the plurality of injection devices 195 may be a resin injection device.

[0182] In addition, at least one of the plurality of injection devices 195 may be a resin material suction device.

[0183] Furthermore, at least one of the plurality of injection devices 195 may be a resin injection and pressurization device. For example, at least one of the plurality of injection devices 195 may inject resin while simultaneously pressurizing it.

[0184] At least one of the plurality of injection devices 195 may be a resin injection device, at least one suction device may be a suction device, and at least one device may be a resin injection and pressurization device.

[0185] In this embodiment, a transparent resin layer can be injected into the seam area using a resin injection device and a pressurizing device on one side of the display device, and the transparent resin layer can be filled into the seam area using a suction device on the other side of the display device. Thus, even in the space between modules where the intervals are not constant due to manufacturing tolerances of individual modules, a flat transparent resin layer can be formed. What requires approximately two hours of coating in traditional techniques can be achieved in approximately 10 seconds using the manufacturing method of this embodiment, resulting in a significant reduction in process time and ease of manufacturing.

[0186] Reference Figure 16 After the transparent resin layer 185 is applied to the seam area 180, it can be cured. Alternatively, the transparent resin layer 185 can be cured while in contact with the refractive layer 175 attached beneath the low-adhesion film 170. In this case, an adhesive force can be generated between the transparent resin layer 185 and the refractive layer 175, and the contacted portions can be bonded together.

[0187] Furthermore, since the lower part of the low-adhesion film 170 is composed of a low-adhesion layer 170b, the adhesive force between the refractive layer 175 and the low-adhesion layer 170b can be smaller than the adhesive force between the refractive layer 175 and the transparent resin layer 185. Additionally, in the refractive layer 175, the adhesive force in the horizontal direction can be smaller than the adhesive force in the vertical direction.

[0188] Thus, when the low-adhesion film 170 is separated from the first display module 110a and the second display module 110b, the refractive layer 175 can be separated into a first refractive layer 175a that overlaps with the transparent resin layer 185 filling the seam area and a second refractive layer 175b that overlaps with the first display module and the second display module.

[0189] Therefore, the first refractive layer 175a can be formed on the transparent resin layer 185. The top surface of the first refractive layer 175a can be located at a position corresponding to the height of the top surfaces of the first display module 110a and the second display module 110b, and is formed on the upper part of the seam area.

[0190] In the manufacturing method of the display device including the semiconductor light-emitting device according to the embodiment, as a first refractive layer 175a is formed on the seam region, it has the technical effect of preventing the light reflected from the seam from being optically and visually identified as a seam.

[0191] Furthermore, the refractive layer disposed on the upper part of the seam area has a height and refractive index corresponding to the surrounding area of ​​the seam, thereby achieving a special technical effect that eliminates the distinction between the surrounding area of ​​the seam and the seam area.

[0192] Figure 17 This is a diagram illustrating a display device including a semiconductor light-emitting device according to an embodiment. Figure 17 (a) is a diagram of a display device used for internal research. Figure 17 (b) is a diagram of a display device in an application embodiment.

[0193] Reference Figure 17 In (a), a plurality of modules can be arranged in a matrix in the display device, and a plurality of semiconductor light-emitting device assemblies 150 are also arranged there. In this case, a seam region 180 can be formed between the first display module 110a and the second display module 110b. Furthermore, a seam path connecting the seam region 180 can be formed between the plurality of first display modules 110a and second display modules 110b. Since the seam is an empty space between the plurality of modules, the side areas between the modules are not physically joined, resulting in poor mechanical reliability. There is also a problem that the seam path can be identified optically and visually, thus hindering visibility.

[0194] On the other hand, refer to Figure 17 (b) In the seam region B formed between the first display module 110a and the second display module 110b, a transparent resin layer and a refractive layer formed on the transparent resin layer may be disposed. Therefore, the region B between the plurality of first display modules 110a and the plurality of second display modules 110b is completely filled with the transparent resin layer, thereby solving the problem of seam recognition caused by diffuse reflection.

[0195] In addition, with a refractive layer disposed on the transparent resin layer, it has the technical effect of preventing the seam from being optically and visually identified as a seam by blocking light reflected from the seam.

[0196] In addition, the refractive layer is configured at a height corresponding to the thin film layer located in the periphery of the seam and has a similar refractive index, thus having the effect of preventing the seam area and the periphery of the seam from being distinguished.

[0197] The display device including semiconductor light-emitting devices and the manufacturing process thereof according to the embodiments have the technical effect of solving the problem of poor mechanical reliability between the side areas of adjacent display modules when splicing multiple display modules.

[0198] For example, according to an embodiment, modules are directly bonded together using a resin layer of porous adhesive material as a medium, thereby eliminating gaps between the modules and achieving a perfect seamless technical effect.

[0199] Furthermore, according to the embodiments, modules are directly bonded together using a resin layer such as a porous adhesive material as a medium, thereby achieving the technical effect of eliminating the need for additional fixing modules and providing excellent structural reliability.

[0200] In addition, since the transparent resin layer 185 in the embodiment completely fills the seam area, it has the technical effect of solving the problem of seams being identified due to diffuse reflection.

[0201] In addition, the embodiment has the technical effect of preventing the seam from being optically and visually identified as a seam by blocking light reflected from the seam.

[0202] For example, by configuring a refractive layer on the transparent resin layer, it is possible to block light reflected from the seam.

[0203] In addition, the embodiments also have the special technical effect of eliminating the distinction between the periphery area of ​​the seam and the seam area.

[0204] For example, the refractive layer disposed on the upper part of the seam area has a height and refractive index corresponding to the surrounding area of ​​the seam, thereby eliminating the distinction between the surrounding area of ​​the seam and the seam area.

[0205] In addition, the embodiment also has the technical effect of solving the problem of being optically identified as a seam even when there is a step difference between the surfaces of the display modules.

[0206] For example, by injecting a transparent resin layer into the seam area and a refractive layer disposed on the transparent resin layer, even if a step difference occurs on the surface between modules, it is possible to prevent it from being identified as a seam by blocking reflection from the seam area.

[0207] The above description is only intended to illustrate the technical concept of the present invention. Those skilled in the art can make various modifications and variations without departing from the essential characteristics of the present invention.

[0208] Therefore, the embodiments disclosed in this invention are not intended to limit the technical concept of the invention, but are intended to illustrate that the scope of the technical concept of the invention is not limited to these embodiments.

[0209] The scope of protection of this invention shall be interpreted by the appended claims, and all technical ideas within the same scope shall be included within the scope of protection of this invention.

[0210] Explanation of reference numerals in the attached figures

[0211] 105: Display Module; 107: Frame Section

[0212] 110a: First display module; 110b: Second display module

[0213] 130: Module substrate; 130a: First display module substrate

[0214] 130b: Second display module substrate; 131: Wiring protection layer

[0215] 132: Side electrode; 132, 133: Optical adhesive layer

[0216] 134: Thin film layer; 140: Framework

[0217] 141: Board; 145: Adhesive tape

[0218] 147: Black Matrix 148: Planarization Layer

[0219] 150: Semiconductor light-emitting device; 160: First resin layer

[0220] 165: Second resin layer; 170: First film

[0221] 170a: Thin film substrate; 170b: Low adhesion layer

[0222] 175: Refractive layer; 175a: First refractive layer

[0223] 175b: Second refractive layer; 180: Joint area

[0224] 185: Transparent resin layer; 190: Panel

[0225] 195: Pump

[0226] Industrial applicability

[0227] The embodiments can be applied to the field of displays that show images or information.

[0228] The embodiments can be applied to the field of displays that use semiconductor light-emitting devices to display images or information.

[0229] The embodiments can be applied to the field of displays that utilize micron- or nanon-scale semiconductor light-emitting devices to display images or information.

Claims

1. A display device including a semiconductor light-emitting device, wherein, include: The first display module and the second display module each include a plurality of semiconductor light-emitting device components disposed on a substrate, and the first display module and the second display module are arranged adjacent to each other. A resin layer is disposed on the lower side between the first display module and the second display module; A transparent resin layer is disposed on the resin layer and between the first display module and the second display module; as well as A refractive layer is disposed on the transparent resin layer.

2. The display device including a semiconductor light-emitting device according to claim 1, wherein, It also includes a thin film layer disposed on a plurality of the semiconductor light-emitting device components; The bonding force between the refractive layer and the transparent resin layer is greater than the bonding force between the refractive layer and the thin film layer.

3. The display device including a semiconductor light-emitting device according to claim 1, wherein, The top surface of the refractive layer is located at a height corresponding to the top surface of the thin film layer.

4. The display device including a semiconductor light-emitting device according to claim 1, wherein, The refractive index of the refractive layer corresponds to the refractive index of the thin film layer.

5. The display device including a semiconductor light-emitting device according to claim 1, wherein, The resin layer includes at least one of a porous adhesive and a time-varying material.

6. The display device including a semiconductor light-emitting device according to claim 1, wherein, The first display module and the second display module include a frame portion disposed below the substrate.

7. The display device including a semiconductor light-emitting device according to claim 1, wherein, The transparent resin layer completely fills the space between the first display module and the second display module.

8. A method for manufacturing a display device including a semiconductor light-emitting device, wherein, include: The step of configuring the first display module and the second display module to be adjacent; The step of forming a resin layer on the underside between the first display module and the second display module; The step of bonding a low-adhesion thin film with a refractive layer to the top surfaces of the first display module and the second display module; The step of filling the seam formed between the first display module and the second display module with transparent resin; The step of curing the transparent resin and the refractive layer to bond them together; as well as The step of removing the low-adhesion film from the first display module and the second display module.

9. The method for manufacturing a display device including a semiconductor light-emitting device according to claim 8, wherein, The first display module and the second display module each include: substrate; A plurality of semiconductor light-emitting device components are disposed on the substrate; Side wiring, disposed on the side of the substrate, is electrically connected to the semiconductor light-emitting device assembly; and A thin film layer is disposed on a plurality of the semiconductor light-emitting device components.

10. The method for manufacturing a display device including a semiconductor light-emitting device according to claim 9, wherein, The top surface of the refractive layer is located at a position corresponding to the height of the top surface of the thin film layer.

11. The method for manufacturing a display device including a semiconductor light-emitting device according to claim 9, wherein, The refractive index of the refractive layer corresponds to the refractive index of the thin film layer.

12. The method for manufacturing a display device including a semiconductor light-emitting device according to claim 8, wherein, It also includes a thin film layer disposed on a plurality of the semiconductor light-emitting device components; The bonding force between the refractive layer and the transparent resin layer is greater than the bonding force between the refractive layer and the thin film layer.

Images