A twist micro drill and its laser processing trajectory design and processing method
By using a three-section main cutting edge and spiral groove collaborative design, the problem of insufficient geometric matching in complex structure micro-drills by existing laser processing methods is solved, realizing efficient and precise machining of twist micro-drills and improving tool performance and machining efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-28
- Publication Date
- 2026-03-06
AI Technical Summary
Existing laser processing methods struggle to accurately match the geometric relationship between the micro-drill's spiral grooves and the main cutting edge when fabricating complex superhard micro-drills. This results in inaccurate micro-drill structural features, affecting the cutting performance and lifespan of the tool. Furthermore, traditional precision grinding processes are inefficient, difficult to prepare shaped grinding wheels, and prone to processing interference.
By employing a three-segment main cutting edge and spiral groove collaborative design, the laser processing trajectory is established by constructing the main cutting edge curve, drill edge curve, and groove back curve of the twist micro-drill, forming a precise laser processing area, achieving self-centering, smooth entry, and load segmentation, which is suitable for micro-hole processing of brittle materials such as single crystal silicon.
It extends the effective cutting edge length, improves machining stability and hole wall quality, ensures precise forming of micro-drill structures, enhances machining efficiency and tool performance, and shortens the research and development cycle.
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Figure CN121199345B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of superhard twist micro-drill technology, and more specifically, to a twist micro-drill and its laser processing trajectory design and processing method. Background Technology
[0002] Brittle materials such as single-crystal silicon are widely used in semiconductors and microelectromechanical systems (MEMS), and their micro-hole machining places stringent requirements on hole shape accuracy, edge quality, and processing efficiency. While traditional laser, reactive ion etching, and focused ion beam methods can achieve small hole diameters, they have significant limitations in terms of processing efficiency and cost control. Using superhard cutting tools such as polycrystalline diamond micro-drills for micro-hole machining in brittle materials is the most economical, efficient, and high-precision method.
[0003] In recent years, laser processing technology has gradually replaced traditional grinding processes, becoming the main method for manufacturing superhard tools. However, existing laser processing methods still have shortcomings in fabricating superhard micro-drills with complex structures. Laser scanning trajectories often employ regular geometric shapes, such as circles or straight lines, making it difficult to accurately match the geometric relationship between the micro-drill's helical flutes and the main cutting edge. This simplistic trajectory design results in inaccurate micro-drill structural features, affecting the tool's cutting performance and lifespan.
[0004] Meanwhile, traditional precision grinding processes are inefficient, difficult to prepare shaped grinding wheels, and prone to machining interference, which further limits the realization of complex micro-drill structures. Summary of the Invention
[0005] This invention provides a twist micro drill and its laser processing trajectory design and processing method to improve at least one of the above-mentioned technical problems.
[0006] In a first aspect, the present invention provides a laser processing trajectory design method for twisted micro-drills, which includes steps S1 to S3.
[0007] S1. Construct the main cutting edge curve of the twist drill. The main cutting edge curve consists of three cutting edge curves.
[0008] S2. Obtain the end face curve of the twist micro drill based on the main cutting edge curve. The end face curve consists of two parts: the drill bit curve and the groove back curve.
[0009] S3. Using the end face curve as the laser processing profile, fill the laser processing area to form the laser processing trajectory.
[0010] Preferably, the three-segment three-dimensional spatial curve of the main cutting edge curve is as follows:
[0011] .
[0012] .
[0013] .
[0014] In the formula, and The first and The spatial position vector of the endpoint of the segment cutting edge. For the first Vector increment of the segment cutting edge. and The first and The height of the cutting edge in the Z-axis direction. For the first The segment cutting edge increments in the Y-axis direction. For the first The angle of the apex of the cutting edge.
[0015] Preferably, the drill bit curve and the groove back curve are tangent at the drill core circle. In a three-dimensional coordinate system, the end face of the helical groove is set as the Z=0 plane, i.e., the XY plane, to solve for the drill bit curve and the groove back curve respectively. Here, the end face is the plane containing the end face curve.
[0016] Preferably, the drill bit curve is solved by rotating the three-segment main cutting edge curve along the helix angle to the end face, taking the set of all intersection points to form the drill bit curve, and establishing a mathematical model for solving it.
[0017] Preferably, the drill bit curve is solved, specifically including:
[0018] Discretize the main cutting edge curve to obtain points . For the first discrete points They are respectively The X, Y, and Z axis coordinates.
[0019] All discrete points are spiraled into the XY plane along the angular direction of the spiral groove, and the set of all intersection points forms a planar curve, namely the drill bit curve.
[0020] .
[0021] .
[0022] .
[0023] In the formula, for The corresponding point on the drill bit curve. For the first The spiral expansion angle corresponding to each discrete point. For the first The polar radius of a discrete point. This refers to the helix angle of the micro-drill.
[0024] Preferably, the groove back curve is constructed as a circular arc.
[0025] Preferably, solving the back groove curve specifically includes:
[0026] Define the groove back curve as tangent to the core thickness circle at point [point missing]. The coordinates are .
[0027] Define the center of the groove back curve In the positive X-axis direction, the coordinates are .
[0028] Introducing the back groove design angle . Defined as a point The angle with the positive Y-axis direction, due to the line segment and When they are equal, we get the following equation:
[0029] .
[0030] .
[0031] .
[0032] In the formula, The endpoint of the flank edge The corresponding point on the end face curve has the following coordinates: . The radius of the twist drill.
[0033] Solve the equation We obtain two real roots, and select the one closer to the midpoint (i.e., the axis) as the coordinate value of the true center of the circle on the X-axis.
[0034] The true center of the circle on the X-axis .
[0035] radius of arc for .
[0036] Arc starting angle for .
[0037] End angle of the arc for .
[0038] The expression for the groove back curve is obtained by refining the expression. , .
[0039] Preferably, the laser processing trajectory is formed by filling the laser processing area with the end face curve as the laser processing profile, specifically as follows:
[0040] The end face curve is composed of two parts: the drill bit curve and the groove back curve. The entire curve is parameterized into a single-parameter curve, which serves as the laser processing profile to fill the laser processing area and form the laser processing trajectory. This is denoted as... ,in Let be the two-dimensional coordinates of a point on the end face curve. and These represent the X-axis and Y-axis coordinates of a point on the end face curve, respectively. It is the normalized path parameter along the end face curve direction.
[0041] Secondly, the present invention provides a method for processing twisted micro-drills, which includes steps A1 to A2.
[0042] A1. Based on the laser processing trajectory design method for a twist micro-drill described in any paragraph of the first aspect, obtain the laser processing trajectory.
[0043] A2. Perform laser processing on the twist drill according to the laser processing trajectory.
[0044] Thirdly, the present invention provides a twist micro-drill, which is suitable for being processed by the twist micro-drill processing method described in the second aspect.
[0045] By adopting the above technical solution, the present invention can achieve the following technical effects:
[0046] By employing a synergistic design of a three-segment main cutting edge and spiral grooves, the effective cutting edge length is extended, achieving multiple functions such as self-centering, smooth entry, load segmentation, and hole wall finishing. This makes it suitable for micro-hole machining of brittle materials such as single-crystal silicon, resulting in superior performance in terms of forming stability and hole wall quality. These functions stem from the geometric constraints and division of labor of the first, second, and third cutting edges and their corresponding apex angles arranged sequentially along the apex of the micro-drill tip. This allows the cutting load to be transferred segmentally and maintains force and geometric continuity during the entry and forming stages, meeting the high requirements of superhard twist micro-drills in semiconductor micro-hole applications.
[0047] In terms of machining path generation, the method is based on the geometric relationship of "main cutting edge - helical groove". First, an end-face curve is established, consisting of the drill bit curve and the groove back curve, tangent at the core circle. Then, this curve is parameterized as a single-parameter curve and directly used as the laser profile for region filling, forming an executable laser machining trajectory. The groove back curve uses a circular arc model with a design angle γ and is tangent to the drill bit curve, ensuring a consistent expression of the trajectory with respect to the tool end-face geometry. The end face is set to Z=0 (XY plane) to facilitate integration with CNC trajectories. This path description is clear and the parameters are controllable, which is beneficial for stably reproducing the machining contour according to the design geometry and reducing deviations between the path and the target profile. Attached Figure Description
[0048] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the specific embodiments of the present invention will be briefly introduced below. It should be understood that the following drawings only show some specific embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.
[0049] Figure 1 This is a schematic diagram of a typical cutting edge structure for a micro drill.
[0050] Figure 2 This is a schematic diagram of the main cutting edge curve of a micro drill.
[0051] Figure 3 This is a schematic diagram of the end face curve of a micro drill.
[0052] Figure 4 This is a schematic diagram of the back curve of a micro-drill.
[0053] Figure 5 This is a schematic diagram of the laser processing trajectory for a micro-drill. Detailed Implementation
[0054] The technical solutions of the present invention will now be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention.
[0055] Please see Figures 1 to 5 The first embodiment of the present invention provides a twist micro drill and a method for designing the laser processing trajectory of the same. The laser processing trajectory design method for the twist micro drill can be executed by a laser processing trajectory design device for the twist micro drill (hereinafter referred to as: trajectory design device). Specifically, it is executed by one or more processors in the trajectory design device to implement steps S1 to S3.
[0056] This embodiment of the twist micro-drill enables high-performance drilling of brittle materials like single-crystal silicon using polycrystalline diamond micro-drills. The twist micro-drill incorporates a three-segment main cutting edge and a spiral groove structure design. Compared to the traditional single-segment main cutting edge design, the three-segment main cutting edge design primarily extends the effective cutting edge length through a multi-segment, progressively varying cutting edge design, achieving multiple functions such as self-centering, smooth entry, load segmentation, and hole wall finishing.
[0057] S1. Construct the main cutting edge curve of the twist drill. The main cutting edge curve consists of three cutting edge curves.
[0058] like Figure 1 As shown, the main cutting edge curve consists of three cutting edge curves. The three-segment main cutting edge curve design is as follows: starting from the tip of the micro drill, it is designed as the first cutting edge, the second cutting edge, and the third cutting edge in sequence, with the corresponding micro drill apex angles being the first apex angle, the second apex angle, and the third apex angle, respectively.
[0059] The main cutting edge is defined as a piecewise space curve consisting of three consecutive straight line segments AC, CD and DE.
[0060] The length of the first segment AC is The direction angle of the YX plane relative to the Y-axis is Its spatial parametric equation is:
[0061] .
[0062] .
[0063] .
[0064] The length of the second CD segment is Its direction angle is Its spatial equation is:
[0065] .
[0066] .
[0067] .
[0068] The length of the third segment DE is Its direction angle is And satisfy the condition that endpoint E falls on the outer circle. In the formula Let be the radius of the twist drill. Its spatial equation is:
[0069] .
[0070] .
[0071] .
[0072] In the formula , and These are the XYZ axis coordinates of the first segment of the main cutting edge curve. , and These are the XYZ axis coordinates of the second segment of the main cutting edge curve. , and These are the XYZ axis coordinates of the third segment of the main cutting edge curve. , and These are the XYZ axis coordinates of the endpoint of the first cutting edge. , and These are the XYZ axis coordinates of the endpoint of the second cutting edge. , and These are the XYZ axis coordinates of the endpoint of the third cutting edge. These are the path parameters for the first cutting edge curve. These are the path parameters for the second cutting edge curve. These are the path parameters for the third cutting edge curve.
[0073] like Figure 2 As shown, the end face curve is composed of the drill bit curve and the back groove curve. The center of the circle is at the origin. The radius of the core circle. Line segment The main cutting edge curve. Line segment This is the first cutting edge, corresponding to the first vertex angle. (Line segment) This is the second cutting edge, corresponding to the second vertex angle. (Line segment) This is the third cutting edge, corresponding to the third vertex. (Line segment) For the flank edge. The main cutting edge curve. As the spiral surface advances into the Z=0 plane, the set of all intersection points forms the end face curve. ,say This is the drill bit curve. endpoints of the main cutting edge curve The corresponding point on the end face curve.
[0074] The three-segment three-dimensional spatial curve of the main cutting edge curve is represented as follows:
[0075] .
[0076] .
[0077] .
[0078] In the formula, and The first and The spatial position vector of the endpoint of the segment cutting edge. For the first Vector increment of the segment cutting edge. and The first and The height of the cutting edge in the Z-axis direction. For the first The segment cutting edge increments in the Y-axis direction. For the first The angle of the apex of the cutting edge.
[0079] S2. Obtain the end face curve of the twist micro drill based on the main cutting edge curve. The end face curve consists of two parts: the drill bit curve and the groove back curve.
[0080] Furthermore, in order to obtain the laser processing trajectory of the spiral groove, a mathematical equation for the end face curve of the twist micro-drill is established. The end face curve includes the drill bit curve and the groove back curve, and the two are tangent at the drill core circle.
[0081] Based on the objective principle that the three-segment main cutting edge must be located on the helical groove surface, there is a certain geometric and mathematical relationship between the main cutting edge and the helical groove. In the three-dimensional coordinate axis, the end face of the helical groove is set as the Z=0 plane, i.e., the XY plane. Here, the end face is the plane containing the end face curve. The end face curve consists of two parts: the drill bit curve and the groove back curve, which are tangent at the drill core circle. These are solved separately.
[0082] Based on the above embodiments, in an optional embodiment of the present invention, the drill bit curve is solved by rotating the three-segment main cutting edge curve along the helix angle direction to the end face, i.e., the XY plane, and taking the set of all intersection points to form the drill bit curve, and establishing a solution mathematical model accordingly.
[0083] Solving the drill bit curve specifically includes steps S21 to S22.
[0084] S21. Discretize the main cutting edge curve to obtain points. . For the first discrete points They are respectively The X, Y, and Z axis coordinates.
[0085] S22. Rotate all discrete points along the spiral groove angle direction to the XY plane. The set of all intersection points constitutes a plane curve, i.e., the drill bit curve.
[0086] The expression for the drill bit curve is:
[0087] .
[0088] .
[0089] .
[0090] In the formula, for The corresponding point on the drill bit curve. For the first The spiral expansion angle corresponding to each discrete point. For the first The polar radius of a discrete point. This refers to the helix angle of the micro-drill.
[0091] Preferably, the back groove curve is solved: the back groove curve is constructed as a standard circular arc.
[0092] like Figure 4 As shown, solving the back groove curve specifically includes:
[0093] S23. Define the groove back curve as tangent to the core thickness circle at point [point missing]. The coordinates are .
[0094] S24. Define the center of the groove curve. In the positive X-axis direction, the coordinates are .
[0095] S25, Introducing the back groove design angle . Defined as a point The angle with the positive Y-axis direction, due to the line segment and When they are equal, we get the following equation:
[0096] .
[0097] .
[0098] .
[0099] In the formula, The endpoint of the flank edge The corresponding point on the end face curve has the following coordinates: . The radius of the twist drill.
[0100] This invention will improve the edge curve of the flank face. In the part corresponding to the end face curve It is called the back groove curve.
[0101] S26. Solve the equation We obtain two real roots, and select the one closer to the midpoint (i.e., the axis) as the coordinate value of the true center of the circle on the X-axis.
[0102] The true center of the circle on the X-axis .
[0103] radius of arc for .
[0104] Arc starting angle for .
[0105] End angle of the arc for .
[0106] The expression for the groove back curve is obtained by refining the expression. , .
[0107] S27. Combine the drill bit curve with the back groove curve to obtain the complete end face curve.
[0108] S3. Using the end face curve as the laser processing profile, fill the laser processing area to form the laser processing trajectory.
[0109] Specifically, the end-face curve is composed of two parts: the drill bit curve and the groove back curve. The entire curve is parameterized into a single-parameter curve, which serves as the laser processing profile to fill the laser processing area and form the laser processing trajectory. This is denoted as... ,in Let be the two-dimensional coordinates of a point on the end face curve. and These represent the X-axis and Y-axis coordinates of a point on the end face curve, respectively. It is the normalized path parameter along the end face curve direction.
[0110] Represents the relative position along the entire end-face curve (from the start point to the end point). When When =0, it is located at the starting point of the curve. When the value is 1, the point is at the end of the curve. Using normalized parameters facilitates trajectory planning and control by the computer.
[0111] This method offers significant technical advantages in laser processing trajectory design. By establishing a precise mathematical model of the main cutting edge and the end face curve, the parameterized solution of the laser scanning trajectory is achieved, fundamentally overcoming the inefficiencies and error-prone nature of traditional manual trial-and-error methods. This design method ensures a high degree of consistency between the laser processing trajectory and the theoretical geometric characteristics of the micro-drill, thereby directly guaranteeing the structural accuracy of the fabricated micro-drill.
[0112] Twist micro-drills, machined using this trajectory, exhibit superior performance when machining brittle materials due to their precisely formed three-segment main cutting edge and helical grooves. This structural design effectively extends the cutting edge length, achieving self-centering, smooth entry, and load segmentation, ultimately reducing workpiece chipping, suppressing micro-crack formation, and improving hole wall quality. Simultaneously, this method provides a rapid and reliable design tool for new product development, significantly shortening the R&D cycle and improving production efficiency.
[0113] Example 2: The present invention provides a method for processing twisted micro-drills, which includes steps A1 to A2.
[0114] A1. According to any paragraph of Example 1, a laser processing trajectory design method for a twisted micro-drill is used to obtain the laser processing trajectory.
[0115] A2. Perform laser processing on the twist drill according to the laser processing trajectory.
[0116] Example 3: The present invention provides a twist micro-drill, which is suitable for being processed by the twist micro-drill processing method described in Example 2.
[0117] It is understood that the trajectory design device can be an electronic device with computing power, such as a portable laptop computer, desktop computer, server, smartphone, or tablet computer.
[0118] Obviously, the embodiments described above are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0119] In the several embodiments provided in this invention, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus and method embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.
[0120] In addition, the functional modules in the various embodiments of the present invention can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.
[0121] If the aforementioned functions are implemented as software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, electronic device, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory, random access memory, magnetic disks, or optical disks. It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0122] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular forms “a,” “the,” and “the” used in the embodiments of this invention are also intended to include the plural forms unless the context clearly indicates otherwise.
[0123] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.
[0124] Depending on the context, the word "if" as used here can be interpreted as "when," "when," "in response to determination," or "in response to detection." Similarly, depending on the context, the phrase "if determination" or "if detection (of the stated condition or event)" can be interpreted as "when determination," "in response to determination," "when detection (of the stated condition or event)," or "in response to detection (of the stated condition or event)."
[0125] The terms "first" and "second" used in the embodiments are merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first" and "second" can be interchanged in a specific order or sequence where permitted. It should be understood that the objects distinguished by "first" and "second" can be interchanged where appropriate so that the embodiments described herein can be implemented in an order other than those illustrated or described herein.
[0126] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A method for designing a laser machining trajectory of a twist micro drill, characterized in that, Comprise: Construct the main cutting edge curve of the twist micro drill; the main cutting edge curve is composed of three cutting edge curves; According to the main cutting edge curve, the end surface curve of the twist micro drill is obtained; the end surface curve is composed of two parts of drill edge curve and groove back curve; According to the end surface curve as the laser processing profile, fill the laser processing area to form the laser processing track; The three-dimensional space curve of the three-segment main cutting edge curve is: ; ; ; In the formula, and The first and The spatial position vector of the endpoint of the segment cutting edge; For the first The vector increment of the segment cutting edge; and The first and The height of the cutting edge in the Z-axis direction; For the first The incremental change in the cutting edge along the Y-axis; For the first The angle of the apex of the cutting edge; The main cutting edge is defined as a segmented space curve composed of three straight line segments AC, CD and DE connected in turn; The length of the first segment AC is The direction angle of the YX plane relative to the Y axis is The spatial parameter equation of the YX plane is ; ; ; The length of the second segment CD is with a directional angle of with a spatial equation of ; ; ; The length of the third segment DE is with a direction angle and with the end point E falling on the outer circle with the end point E falling on the outer circle is the radius of the twist drill. Its space equation is: ; ; ; wherein , and are XYZ axis coordinate values of the first segment of the main cutting edge curve, respectively; , and are XYZ axis coordinate values of the second segment of the main cutting edge curve, respectively; , and are XYZ axis coordinate values of the third segment of the main cutting edge curve, respectively; , and are XYZ axis coordinate values of the end point of the first cutting edge, respectively; , and are XYZ axis coordinate values of the end point of the second cutting edge, respectively; , and are XYZ axis coordinate values of the end point of the third cutting edge, respectively; is a path parameter of the first cutting edge curve; is a path parameter of the second cutting edge curve; is a path parameter of the third cutting edge curve; The drill edge curve and the groove back curve are tangent at the drill core circle; In the three-dimensional space coordinate axis, the end surface of the spiral groove is set as the Z=0 plane, that is, the XY plane, to solve the drill edge curve and the groove back curve respectively; wherein, the end surface is the plane where the end surface curve is located; Solving the drill edge curve: rotate the three-segment main cutting edge curve along the spiral angle direction to the end surface, take all intersection point sets to constitute the drill edge curve, and establish a mathematical model for solving accordingly; Solving the drill edge curve, specifically including: Discretize the main cutting edge curve to obtain points ; For the first discrete points They are respectively X, Y, Z coordinates; Rotate all discrete points into the XY plane along the spiral groove angle direction, and the set of all intersection points constitutes a plane curve, that is, the drill edge curve; ; ; ; wherein is a point on the corresponding drill bit curve; is the helix angle corresponding to the th discrete point; is the polar radius of the th discrete point; is the helix angle of the micro drill.
2. The method of claim 1, wherein, The groove back curve is constructed as a circular arc.
3. The method of claim 2, wherein, Solving the groove back curve specifically includes: The groove back curve is tangent to the core thickness circle at the point with coordinates ; Center of the circle defining the groove back curve In the positive direction of the X axis, the coordinates are ; Introducing the groove back design angle ; defined as a point with the Y-axis positive direction angle, since the line segment and are equal, the following equation is obtained: ; ; ; wherein is the end point of the relief edge is the corresponding point on the end surface curve with coordinates ; is the radius of the twist drill Solve the equation Get two real roots, select more closer to the midpoint as the real center of the X-axis coordinate value; Real center of the circle on the X axis coordinate value ; Radius of the circular arc To ; Arc start angle To ; Arc end angle To ; The expression of the groove-back curve is obtained as , .
4. The method according to any one of claims 1 to 3, wherein According to the end surface curve as the laser processing profile, fill the laser processing area to form the laser processing track, specifically: The end surface curve is spliced by a drill bit curve and a groove back curve, and the whole is parameterized as a single parameter curve to serve as a laser processing profile to fill a laser processing region to form a laser processing track, denoted as wherein is a two-dimensional coordinate of a point on the end surface curve; and respectively represent an X-axis coordinate and a Y-axis coordinate of a point on the end surface curve; is a normalized path parameter in the direction of the end surface curve.
5. A method of manufacturing a twist micro drill, characterized by, Comprise: According to the laser processing track design method of the twist micro drill according to any one of claims 1 to 4, the laser processing track is obtained; According to the laser processing track, the twist drill is processed by laser.
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