High-precision assembly and soldering equipment and tooling fixtures for semiconductor equipment frames

By using high-precision assembly and welding equipment and tooling fixtures for semiconductor equipment frames, the problem of low welding efficiency for semiconductor equipment frames has been solved, enabling fast and efficient welding operations and improving product reliability and service life.

CN121199348BActive Publication Date: 2026-05-26NANTONG JIASHENG PRECISION MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NANTONG JIASHENG PRECISION MANUFACTURING CO LTD
Filing Date
2025-09-25
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

The welding efficiency of semiconductor device frames in existing technologies is low, requiring two angle adjustments for welding, resulting in low efficiency.

Method used

It adopts high-precision assembly and welding equipment and tooling fixtures for semiconductor equipment skeletons. The clamping components hold the semiconductor equipment skeleton and assist in its rotation. The threaded rod controls the movement of the slider to achieve fast and efficient welding operations. The light-shielding components prevent the influence of laser rays, and the dust-removing components remove dust.

Benefits of technology

It enables rapid and efficient welding of semiconductor device skeletons, improves welding quality and efficiency, prevents the influence of laser rays on clamping components, removes dust, and enhances product reliability and service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a high-precision assembly and welding device and fixture for semiconductor device skeletons, relating to the field of semiconductor skeleton welding technology. It includes a base with a support mounted on its top. A laser welder is mounted on the support via an electric push rod. A track is mounted inside the base, and a clamping assembly is slidably mounted inside the track. This application first clamps the semiconductor device skeleton using a skeleton fixture. Then, the rotation of a threaded rod controls the movement of a slider. As the slider moves, rollers move on a shaped plate, pushing a connecting plate upwards to match the height of the laser welder. After the initial welding, the slider moves in the opposite direction until the push rod pushes a rectangular rod, causing the elastic telescopic rod to rotate and change its orientation. This causes the slider to move again, moving the repositioned semiconductor device skeleton below the laser welder for secondary welding, achieving a fast and efficient welding operation.
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