AI computing power card HDI step gold finger dispensing method and structure thereof

By embedding stepped gold fingers in the power or ground layer and connecting signal lines through vias, combined with laser cutting and chemical gold plating, the problem of exposed copper in signal lines is solved, the manufacturing process is simplified, and the reliability and consistency of products are improved.

CN121218459BActive Publication Date: 2026-07-24VICTORY GIANT TECH HUIZHOU CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
VICTORY GIANT TECH HUIZHOU CO LTD
Filing Date
2025-10-11
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

In the production process of HDI stepped gold fingers, traditional methods lead to the problem of exposed copper on the signal lines, which requires adhesive dispensing, affecting the complexity of the production process and the reliability of the product.

Method used

The stepped gold fingers are embedded in the power or ground layer and connected to the signal lines through vias. They are covered with high-temperature tape and then subjected to laser cutting, sandblasting, and electroless nickel plating to ensure that the signal lines do not expose copper, thus simplifying the production process.

Benefits of technology

This avoids the problem of exposed copper on signal lines, simplifies the manufacturing process, improves product reliability and consistency, and reduces the production cycle.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121218459B_ABST
    Figure CN121218459B_ABST
Patent Text Reader

Abstract

The application relates to an AI computing card HDI step gold finger dispensing method, which comprises the following steps: embedding a step gold finger on a power layer or a ground layer of a core plate; signal lines electrically connected with the step gold finger are guided to a lower layer of the power layer or the ground layer through a via hole for wiring; a high-temperature adhesive tape is covered on a step gold finger area of the power layer or the ground layer of the core plate; the core plate, a prepreg and other inner core plates are pressed to form a multilayer board; the multilayer board is subjected to forming roughing, and a laser uncovering area containing the step gold finger area is preliminarily formed; the laser uncovering area is subjected to laser cutting along a preset laser uncovering line, and an ink layer and a medium layer covered are ablated and removed to expose a lower step gold finger copper surface. The application has the beneficial effects of simplifying a production process and improving product reliability and consistency.
Need to check novelty before this filing date? Find Prior Art