Middle frame assembly, electronic equipment and assembling method

Abstract

The invention relates to a middle frame assembly, electronic equipment and an assembling method. The middle frame assembly comprises a ground layer; the first connecting piece comprises a connecting part and a fixing part which are connected with each other, the connecting part penetrates through the stratum and is in interference fit with the stratum, and the fixing part is located on the first side of the stratum; the fixing piece is arranged on the side face of the fixing part so as to fix the fixing part; and the circuit board is arranged on the first side of the ground layer, the circuit board is provided with a grounding part, and the grounding part is grounded through the ground layer via the first connecting piece. The first connecting piece in interference connection with the stratum and the fixing piece arranged on the side face of the first connecting piece are arranged on the stratum, so that the connecting stability between the first connecting piece and the stratum is improved, the electric connecting performance between the first connecting piece and the stratum is guaranteed, the required space of the first connecting piece is reduced, and the stacking design of the whole machine is facilitated.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device assembly technology, and in particular to a mid-frame assembly, an electronic device, and an assembly method. Background Technology

[0002] With the rapid development of mobile communication technology, electronic devices such as mobile phones and tablets have become indispensable in people's daily lives. The mid-frame of these electronic devices has a ground plane, and the circuit board is connected to this ground plane to ground the circuit board. To ensure the grounding performance of the circuit board, the reliability of the connection between the circuit board and the ground plane must be guaranteed. Summary of the Invention

[0003] To overcome the problems existing in the related technologies, this disclosure provides a mid-frame assembly, an electronic device, and an assembly method.

[0004] According to a first aspect of the present disclosure, a mid-frame assembly is provided, the mid-frame assembly comprising: a ground layer; a first connector, the first connector including a connecting portion and a fixing portion connected to each other, the connecting portion passing through the ground layer and being interference-connected to the ground layer, the fixing portion being located on a first side of the ground layer; a fixing member disposed on the side of the fixing portion to fix the fixing portion; and a circuit board disposed on the first side of the ground layer, the circuit board having a grounding portion, the grounding portion being grounded through the ground layer via the first connector.

[0005] In some embodiments, the formation includes a through-hole, and the connecting portion is disposed in the through-hole and is interference-fitted with the through-hole.

[0006] In some embodiments, the fastener is in contact with the formation and is disposed around the side of the fastener portion.

[0007] In some embodiments, the side of the fixing portion is provided with a groove, and the fixing member fills at least a portion of the groove.

[0008] In some embodiments, the surface of the connecting portion that contacts the formation is provided with a plurality of protrusions, and the plurality of protrusions are interference-fitted with the through hole.

[0009] In some embodiments, the protrusion extends along the axial direction of the through hole.

[0010] In some embodiments, the cross-sectional shape of the protrusion on the radial surface of the connection is one or more of a triangle, an arc, and a rectangle.

[0011] In some embodiments, the outer diameter of the fixing part is larger than the outer diameter of the connecting part, and the fixing part includes a stepped surface that abuts against the first side of the stratum.

[0012] In some embodiments, the mid-frame assembly includes an antenna electrically connected to the circuit board and grounded through the ground portion of the circuit board.

[0013] In some embodiments, the mid-frame assembly further includes a second connector connected to the first connector to secure the circuit board to the ground plane.

[0014] In some embodiments, the first connector is a nut; the second connector is a screw.

[0015] According to a second aspect of the present disclosure, an electronic device is provided, the electronic device comprising: the mid-frame component as described in any of the first aspects.

[0016] According to a third aspect of the present disclosure, a method for assembling a mid-frame assembly is provided, applicable to the assembly of the mid-frame assembly according to any one of the first aspects. The assembly method includes: interference-fitting a connecting portion of a connecting accessory to a ground plane, wherein the connecting accessory includes the connecting portion and a fixing portion connected to each other; injection molding the fixing portion on the side surface to form the fixing member; and connecting the circuit board to the ground plane so that the ground portion of the circuit board is grounded through the ground plane.

[0017] In some embodiments, the connecting fitting includes a positioning part, the connecting part is located between the positioning part and the fixing part, the formation is provided with an assembly hole, and the step of interfering the connecting part of the connecting fitting with the formation includes: aligning the positioning part with the assembly hole; and pushing the connecting fitting into the assembly hole to make the connecting part interfering the connection with the assembly hole of the formation.

[0018] In some embodiments, the outer diameter of the fixing part is larger than the outer diameter of the connecting part, the fixing part includes a stepped surface, the stratum is provided with an assembly hole, and the step of interfering the connecting part of the connecting accessory with the stratum includes: pushing the connecting accessory into the assembly hole until the stepped surface abuts against the first side of the stratum.

[0019] In some embodiments, the connecting portion is provided with a protrusion, and pushing the connecting fitting into the mounting hole to make the connecting portion and the mounting hole of the formation interference fit includes: pushing the connecting fitting into the mounting hole to make the protrusion squeeze the mounting hole, wherein the connecting fitting and the mounting hole form a mounting hole adapted to the shape of the protrusion after assembly, and the maximum diameter of the connecting portion is greater than the maximum diameter of the mounting hole.

[0020] In some embodiments, the difference between the maximum diameter of the connecting portion and the maximum diameter of the mounting hole is 0.26 mm to 0.34 mm.

[0021] In some embodiments, the formation includes a second side opposite to the first side, and the assembly method further includes: cutting a portion of the connecting fitting protruding from the second side of the formation, so that the connecting fitting is flush with the second side of the formation to form the first connector.

[0022] In some embodiments, the diameter of the positioning portion is smaller than the diameter of the mounting hole.

[0023] In some embodiments, the difference between the diameter of the positioning part and the diameter of the mounting hole is 0.04 mm to 0.08 mm.

[0024] In some embodiments, the fastener is injection molded on the side of the fixing portion to form the fastener, and the assembly method includes: injection molding around the side of the fixing portion to form the fastener surrounding the fixing portion and in contact with a first side of the formation.

[0025] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: By setting a first connector that is interference-connected to the ground layer and a fixing member set on the side of the first connector, this disclosure improves the connection stability between the first connector and the ground layer, ensures the electrical connection performance between the first connector and the ground layer, reduces the required space of the first connector, and is beneficial to the stacking design of the whole machine.

[0026] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0028] Figure 1 This is a cross-sectional view of a mid-frame assembly according to an exemplary embodiment.

[0029] Figure 2 This is a structural schematic diagram of a first connector, a fastener, and a ground layer of a mid-frame assembly according to an exemplary embodiment.

[0030] Figure 3 This is a cross-sectional view of a first connector, fastener, and ground layer of a mid-frame assembly according to an exemplary embodiment.

[0031] Figure 4 This is a schematic diagram of the structure of a mid-frame component according to an exemplary embodiment.

[0032] Figure 5This is a structural schematic diagram illustrating the assembly process of a mid-frame assembly according to an exemplary embodiment.

[0033] Figure 6 This is a flowchart illustrating an assembly method according to an exemplary embodiment.

[0034] Figure 7 This is a flowchart illustrating an assembly method according to an exemplary embodiment.

[0035] Figure 8 This is a flowchart illustrating an assembly method according to an exemplary embodiment.

[0036] Figure 9 This is a flowchart illustrating an assembly method according to an exemplary embodiment.

[0037] Figure 10 This is a flowchart illustrating an assembly method according to an exemplary embodiment.

[0038] Figure 11 This is a flowchart illustrating an assembly method according to an exemplary embodiment. Detailed Implementation

[0039] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0040] In related technologies, a nut is installed in the ground plane. The circuit board is locked to the nut by connecting it with a screw, thus connecting the circuit board to the ground plane through the nut. Laser welding or thermoforming is commonly used to connect the nut and the ground plane. However, the connection structure at the laser-welded or thermo-fused location is often weak and has poor conductivity, thus affecting the grounding effect of the circuit board.

[0041] In another design, the nut can be integrally formed with the ground plane. However, since aluminum alloy is often used for the ground plane to reduce the weight of the mid-frame components, the volume of the nut needs to be increased to ensure the structural strength of the nut. This increases the space occupied by the nut and is not conducive to the overall stacking design of electronic devices.

[0042] To address the aforementioned technical problems, an embodiment of this disclosure provides a mid-frame assembly, comprising: a ground plane; a first connector, the first connector including a connecting portion and a fixing portion interconnected, the connecting portion penetrating the ground plane and being interference-connected to the ground plane, the fixing portion being located on a first side of the ground plane; a fixing member disposed on the side of the fixing portion to fix the fixing portion; and a circuit board disposed on the first side of the ground plane, the circuit board having a grounding portion, the grounding portion being grounded through the ground plane via the first connector.

[0043] This disclosure improves the connection stability between the first connector and the ground by setting a first connector that is interference-fitted to the ground and a fixing member set on the side of the first connector, ensuring the electrical connection performance between the first connector and the ground, reducing the space required for the first connector, and facilitating the stacking design of the whole machine.

[0044] It is understood that the mid-frame component disclosed herein can be used in any of the following types of terminals.

[0045] It is understood that the terminal involved in this disclosure may also be referred to as a terminal device, user equipment (UE), mobile station (MS), mobile terminal (MT), etc., and is a device that provides voice and / or data connectivity to a user. For example, a terminal may be a handheld device with wireless connectivity, an in-vehicle device, etc. Currently, some examples of terminals include: smartphones (Mobile Phones), pocket personal computers (PPCs), handheld computers, personal digital assistants (PDAs), laptops, tablets, wearable devices, or in-vehicle devices, etc. In addition, when it is a vehicle-to-everything (V2X) communication system, the terminal device may also be an in-vehicle device. It should be understood that the embodiments of this disclosure do not limit the specific technology or specific device form adopted by the terminal.

[0046] Figure 1 This is a cross-sectional view of a mid-frame assembly according to an exemplary embodiment. Figure 2 This is a structural schematic diagram of a first connector, a fastener, and a ground layer of a mid-frame assembly according to an exemplary embodiment. Figure 3 This is a cross-sectional view of a first connector, fastener, and ground layer of a mid-frame assembly according to an exemplary embodiment. Figure 4 This is a schematic diagram of the structure of a mid-frame component according to an exemplary embodiment.

[0047] In some embodiments, such as Figure 1-4 As shown, the mid-frame assembly includes: a ground layer 200, a first connector 100, a fastener 300, and a circuit board 400.

[0048] Ground plane 200 can be a zero-potential layer in the circuit. Ground plane 200 can serve as a conductive path to ensure current return, thereby maintaining the normal operation of the circuit. For example, ground plane 200 can be a metal component.

[0049] The first connector 100 can be used to connect the circuit board 400 and the ground layer 200, so that the circuit board 400 can form an electrical connection with the ground layer 200 through the first connector 100, thereby grounding the circuit of the circuit board 400.

[0050] The first connector 100 may include a connecting portion 10 and a fixing portion 20 that are interconnected. The connecting portion 10 may penetrate the ground layer 200 and be interference-fitted with the ground layer 200. By making the first connector 100 interference-fitted with the ground layer 200, the structural strength of the connection between the first connector 100 and the ground layer 200 is improved, and the contact area between the first connector 100 and the ground layer 200 is larger and the contact state is more stable, resulting in good electrical conductivity between the first connector 100 and the ground layer 200.

[0051] By separating the first connector 100 from the ground layer 200, the range of materials that can be selected for the first connector 100 is expanded. For example, when the ground layer 200 is an aluminum alloy plate, the first connector 100 can be a stainless steel component, thereby ensuring sufficient structural strength for a stable connection with the ground layer 200 within a smaller volume.

[0052] The fixing part 20 can be located on the first side of the formation 200. The fixing member 300 can be provided on the side of the fixing part 20 to fix the fixing part 20 of the first connector 100, reduce the shaking between the first connector 100 and the formation 200, and thus improve the connection stability between the first connector 100 and the formation 200.

[0053] The circuit board 400 can be disposed on the first side of the ground layer 200. For example, the circuit board 400 can be a motherboard or a sub-board of an electronic device. The circuit board 400 can have a grounding part, and the grounding part of the circuit board 400 can form an electrical connection with the ground layer 200 through the first connector 100, so that the circuit board 400 can achieve a grounding effect through the ground layer 200.

[0054] For example, the first connector 100 can be a conductive element. The first connector 100 achieves an electrical connection with the ground layer 200 through an interference fit. The grounding portion of the circuit board 400 can contact the first connector 100, making the base electrically connected to the first connector 100. Furthermore, through the electrical connection between the first connector 100 and the ground layer 200, the grounding portion of the circuit board 400 is electrically connected to the ground layer 200, thereby enabling the circuit board 400 to achieve a grounding effect.

[0055] This disclosure improves the connection strength and conductivity of the connection structure between the first connector 100 and the ground layer 200 by providing a first connector 100 that is interference-fitted with the ground layer 200. The fixing member 300 provided on the side of the first connector 100 reduces the shaking of the first connector 100 relative to the ground layer 200, improves the connection stability between the first connector 100 and the ground layer 200, ensures the electrical connection performance between the first connector 100 and the ground layer 200, reduces the space required for the first connector 100, and is beneficial to the stacking design of the whole machine.

[0056] In some embodiments, such as Figure 1-4 As shown, the formation 200 may include a through hole 201, which can penetrate the formation 200, and the connecting part 10 may be disposed in the through hole 201 and interference connected to the through hole 201.

[0057] By making the first connector 100 and the through hole 201 interference fit, the connection structure strength between the first connector 100 and the ground layer 200 is improved, and the contact area between the first connector 100 and the ground layer 200 is larger and the contact state is stable, resulting in good conductivity between the first connector 100 and the ground layer 200.

[0058] In some embodiments, such as Figure 1-4 As shown, the fastener 300 is in contact with the stratum 200, and the fastener 300 is arranged around the side of the fixing part 20.

[0059] By bringing the fastener 300 into contact with the ground 200, the ground 200 can provide support for the fastener 300, making the positional relationship between the fastener 300 and the ground 200 relatively stable. Thus, the connection stability between the first connector 100 and the ground 200 can be improved through the contact relationship between the fastener 300 and the ground 200 and the connection relationship between the fastener 300 and the fixing part 20 of the first connector 100.

[0060] The fastener 300 is arranged around the side of the fixing part 20 so that the fastener 300 provides support in all directions of the side of the fixing part 20, thereby reducing the shaking between the first connector 100 and the ground layer 200 and improving the connection stability between the first connector 100 and the ground layer 200.

[0061] In some embodiments, such as Figure 1-4 As shown, the side of the fixing part 20 may be provided with a groove 21, and the fixing member 300 may fill at least a part of the groove 21. By filling at least a part of the groove 21 with the fixing member 300, the fixing member 300 can provide support for the groove 21 surfaces distributed in different directions, thereby enabling the fixing member 300 to provide support for the first connecting member 100 in different directions through the groove 21.

[0062] For example, the fastener 300 can generate a supporting force parallel to the surface of the formation 200 on the first connector 100 through the groove 21, and the fastener 300 can also generate a supporting force perpendicular to the surface of the formation 200 on the first connector through the groove 21.

[0063] In some embodiments, such as Figure 1-4 As shown, the surface of the connecting portion 10 that contacts the ground layer 200 is provided with a plurality of protrusions 11, which can be interference-fitted with the through hole 201. By providing a plurality of protrusions 11 on the surface of the connecting portion 10, the contact area between the connecting portion 10 and the through hole 201 can be increased, thereby improving the structural strength of the connection between the first connector 100 and the ground layer 200, stabilizing the contact state between the first connector 100 and the ground layer 200, and ensuring good electrical conductivity between the first connector 100 and the ground layer 200.

[0064] In some embodiments, such as Figure 1-4 As shown, the protrusion 11 can extend along the axial direction of the through hole 201. When the first connector 100 is inserted into the through hole 201, the protrusion 11 is configured to extend along the axial direction of the through hole 201, so that the structure of the protrusion 11 can restrict the first connector 100 from moving radially in the through hole 201 and rotating about the central axis of the through hole 201, so that the first connector 100 can only move smoothly in the axial direction of the through hole 201, thereby guiding the first connector 100 when it enters the through hole 201.

[0065] In some embodiments, such as Figure 1-4 As shown, the cross-sectional shape of the protrusion 11 on the radial surface of the connecting part 10 is one or more of the following: triangular, arc-shaped, and rectangular.

[0066] For example, the cross-sectional shape of the protrusion 11 on the radial surface of the connecting part 10 can be triangular. The hole wall of the through hole 201, which matches the shape, provides greater resistance to the triangular protrusion 11. This allows the through hole 201 to prevent the first connector 100 from rotating within the through hole 201, thereby improving the connection stability between the first connector 100 and the formation 200.

[0067] In some embodiments, such as Figure 1-4 As shown, the outer diameter of the fixing part 20 is larger than the outer diameter of the connecting part 10. The fixing part 20 may include a stepped surface 22, which abuts against the first side of the ground layer 200. This allows the ground layer 200 to provide a support force perpendicular to the surface of the ground layer 200 to the first connector 100 through the stepped surface 22, which can improve the connection stability between the first connector 100 and the ground layer 200. Furthermore, this also increases the contact area between the first connector 100 and the ground layer 200, improving the conductivity of the connection structure between the first connector 100 and the ground layer 200.

[0068] In some embodiments, the mid-frame assembly may include an antenna that is electrically connected to the circuit board 400 and electrically connected to the ground layer 200 through the ground portion of the circuit board 400, thereby enabling the antenna to achieve a grounding effect to ensure the return flow of the antenna current and thus maintain the normal operation of the antenna.

[0069] In some embodiments, such as Figure 1-4 As shown, the mid-frame assembly may further include a second connector 500, which is connected to the first connector 100 to fix the circuit board 400 to the ground layer 200. For example, the first connector 100 and the second connector 500 can be fixedly connected to fix the circuit board 400 to the first connector 100. Since the connection relationship between the first connector 100 and the ground layer 200 is fixed, the circuit board 400 and the ground layer 200 are fixedly connected, thereby making the connection structure between the circuit board 400 and the ground layer 200 stable and the electrical connection relationship stable.

[0070] In some embodiments, such as Figure 1-4 As shown, the first connector 100 can be a nut, and the second connector 500 can be a screw. The first connector 100 can include a threaded hole 40. The second connector 500 can be inserted into the threaded hole 40. The first connector 100 and the second connector 500 can be connected by threads, thereby fixing the circuit board 400 to the first connector 100. Since the connection relationship between the first connector 100 and the ground layer 200 is fixed, the circuit board 400 and the ground layer 200 are fixedly connected, thereby making the connection structure between the circuit board 400 and the ground layer 200 stable and the electrical connection relationship stable.

[0071] Based on the same concept, embodiments of this disclosure also provide an electronic device.

[0072] The electronic device can be a laptop computer, desktop computer, mobile phone, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness device, personal digital assistant, translator, and wearable device such as watch and bracelet, etc., and can be any electronic device with a mid-frame component. In the following description, a mobile phone is used as an example, but this disclosure is not limited to this.

[0073] In some embodiments, an electronic device may include a mid-frame component.

[0074] Based on the same concept, this disclosure also provides an assembly method for a mid-frame component, applicable to the assembly of mid-frame components.

[0075] Figure 5 This is a structural schematic diagram illustrating the assembly process of a mid-frame assembly according to an exemplary embodiment. Figure 6 This is a flowchart illustrating an assembly method according to an exemplary embodiment.

[0076] In some embodiments, such as Figure 5 and Figure 6 As shown, the assembly method may include:

[0077] S10: The connecting part 10 of the connecting fitting 100' is interference-fitted to the formation 200, wherein the connecting fitting 100' includes a connecting part 10 and a fixing part 20 that are interconnected;

[0078] S20: Injection molding is performed on the side of the fixing part 20 to form the fixing member 300;

[0079] S30: Connect the circuit board 400 to the ground plane 200 so that the ground part of the circuit board 400 is grounded through the ground plane 200.

[0080] By interfering the connection part 10 of the connecting accessory 100' with the ground layer 200, the strength of the connection structure between the connecting accessory 100' and the ground layer 200 is improved, and the contact area between the connecting accessory 100' and the ground layer 200 is larger and the contact state is stable, resulting in good conductivity between the connecting accessory 100' and the ground layer 200.

[0081] The fastener 300 can be an injection molded part, which can be formed by injection molding on the side of the fixing part 20. The fastener 300 can be provided on the side of the fixing part 20 to fix the fixing part 20 of the connecting accessory 100', reduce the shaking between the connecting accessory 100' and the ground layer 200, thereby improving the connection stability between the connecting accessory 100' and the ground layer 200.

[0082] The connecting accessory 100' can be used to connect the circuit board 400 and the ground layer 200, so that the circuit board 400 can form an electrical connection with the ground layer 200 through the connecting accessory 100', thereby grounding the circuit of the circuit board 400.

[0083] The connecting accessory 100' can be a conductive component. The connecting accessory 100' achieves an electrical connection with the ground layer 200 through an interference fit. The grounding portion of the circuit board 400 can contact the connecting accessory 100', making the base electrically connected to the connecting accessory 100'. Furthermore, through the electrical connection between the connecting accessory 100' and the ground layer 200, the grounding portion of the circuit board 400 is electrically connected to the ground layer 200, thereby enabling the circuit board 400 to achieve a grounding effect.

[0084] This disclosure improves the structural strength and conductivity of the connection between the connector 100' and the ground layer 200 by interference-fitting the connector 100' and the ground layer 200. The fixing member 300 is injection-molded on the side of the connector 100', thereby reducing the shaking of the connector 100' relative to the ground layer 200, improving the connection stability between the connector 100' and the ground layer 200, ensuring the electrical connection performance between the connector 100' and the ground layer 200, reducing the space required for the connector 100', and facilitating the stacking design of the whole machine.

[0085] In some embodiments, the connecting fitting 100' may include a connecting portion 10 and a fixing portion 20 that are interconnected. The connecting portion 10 may penetrate the ground layer 200 and be interference-fitted with the ground layer 200. By making the connecting fitting 100' interference-fitted with the ground layer 200, the structural strength of the connection between the connecting fitting 100' and the ground layer 200 is improved, and the contact area between the connecting fitting 100' and the ground layer 200 is larger and the contact state is more stable, resulting in good electrical conductivity between the connecting fitting 100' and the ground layer 200.

[0086] By separating the connecting fitting 100' from the ground layer 200, the range of materials that can be selected for the connecting fitting 100' is expanded. For example, when the ground layer 200 is an aluminum alloy plate, the connecting fitting 100' can be made of stainless steel, thereby ensuring sufficient structural strength for a stable connection with the ground layer 200 within a smaller volume.

[0087] Figure 7 This is a flowchart illustrating an assembly method according to an exemplary embodiment.

[0088] In some embodiments, such as Figure 5 and Figure 7As shown, the connecting accessory 100' may include a positioning part 30, a connecting part 10 located between the positioning part 30 and the fixing part 20, and the layer 200 is provided with an assembly hole 201'.

[0089] Assembly methods may include:

[0090] S11: Align the positioning part 30 with the assembly hole 201';

[0091] S12: Push the connecting fitting 100' into the assembly hole 201' so that the connecting part 10 is interference-fitted with the assembly hole 201' of the formation 200;

[0092] S20: Injection molding is performed on the side of the fixing part 20 to form the fixing member 300;

[0093] S30: Connect the circuit board 400 to the ground plane 200 so that the ground part of the circuit board 400 is grounded through the ground plane 200.

[0094] The positioning part 30 can be aligned with the mounting hole 201' to determine the relative position of the connecting part 100' and the mounting hole 201', so as to facilitate subsequent operations on the connecting part 100' and the mounting hole 201'.

[0095] Pushing the connecting fitting 100' into the mounting hole 201' requires overcoming the resistance between the connecting part 10 and the mounting hole 201', pressing the connecting fitting 100' into the mounting hole 201', thereby achieving an interference fit between the connecting fitting 100' and the mounting hole 201'. This can improve the structural strength of the connection between the connecting fitting 100' and the ground layer 200, and make the contact area between the connecting fitting 100' and the ground layer 200 larger and the contact state more stable, resulting in good conductivity between the connecting fitting 100' and the ground layer 200.

[0096] The fastener 300 can be an injection molded part, which can be formed by injection molding on the side of the fixing part 20. The fastener 300 can be provided on the side of the fixing part 20 to fix the fixing part 20 of the connecting accessory 100', reduce the shaking between the connecting accessory 100' and the ground layer 200, thereby improving the connection stability between the connecting accessory 100' and the ground layer 200.

[0097] The connecting accessory 100' can be used to connect the circuit board 400 and the ground layer 200, so that the circuit board 400 can form an electrical connection with the ground layer 200 through the connecting accessory 100', thereby grounding the circuit of the circuit board 400.

[0098] The connecting accessory 100' can be a conductive component. The connecting accessory 100' achieves an electrical connection with the ground layer 200 through an interference fit. The grounding portion of the circuit board 400 can contact the connecting accessory 100', making the base electrically connected to the connecting accessory 100'. Furthermore, through the electrical connection between the connecting accessory 100' and the ground layer 200, the grounding portion of the circuit board 400 is electrically connected to the ground layer 200, thereby enabling the circuit board 400 to achieve a grounding effect.

[0099] This disclosure improves the structural strength and conductivity of the connection between the connector 100' and the ground layer 200 by interference-fitting the connector 100' and the ground layer 200. The fixing member 300 is injection-molded on the side of the connector 100', thereby reducing the shaking of the connector 100' relative to the ground layer 200, improving the connection stability between the connector 100' and the ground layer 200, ensuring the electrical connection performance between the connector 100' and the ground layer 200, reducing the space required for the connector 100', and facilitating the stacking design of the whole machine.

[0100] In some embodiments, the diameter of the positioning part 30 may be smaller than the diameter of the mounting hole 201', so that the positioning part 30 can smoothly enter the mounting hole 201' when the connecting accessory 100' is pushed into the mounting hole 201', thereby limiting the tilt angle of the connecting accessory 100' relative to the mounting hole 201' through the mounting hole 201', and thus producing a guiding effect on the connecting accessory 100'.

[0101] In some embodiments, the difference between the diameter of the positioning part 30 and the diameter of the mounting hole 201' can be 0.04 mm to 0.08 mm.

[0102] Figure 8 This is a flowchart illustrating an assembly method according to an exemplary embodiment.

[0103] In some embodiments, such as Figure 5 and Figure 8 As shown, the outer diameter of the fixing part 20 is larger than the outer diameter of the connecting part 10. The fixing part 20 may include a stepped surface 22. The ground layer 200 is provided with an assembly hole 201' to interference fit the connecting part 10 of the connecting accessory 100' to the ground layer 200.

[0104] Assembly methods may include:

[0105] S101: Push the connecting fitting 100' into the assembly hole 201' until the step surface 22 abuts against the first side of the ground layer 200;

[0106] S20: Injection molding is performed on the side of the fixing part 20 to form the fixing member 300;

[0107] S30: Connect the circuit board 400 to the ground plane 200 so that the ground part of the circuit board 400 is grounded through the ground plane 200.

[0108] Pushing the connecting fitting 100' into the mounting hole 201' requires overcoming the resistance between the connecting part 10 and the mounting hole 201'. For example, the connecting fitting 100' can be riveted to the ground layer 200 through the mounting hole 201'. By pressing the connecting fitting 100' into the mounting hole 201', an interference fit is achieved between the connecting fitting 100' and the mounting hole 201', thereby improving the structural strength of the connection between the connecting fitting 100' and the ground layer 200, and making the contact area between the connecting fitting 100' and the ground layer 200 larger and the contact state more stable, resulting in good electrical conductivity between the connecting fitting 100' and the ground layer 200.

[0109] By abutting the step surface 22 against the first side of the ground layer 200, the ground layer 200 can provide a support force perpendicular to the surface of the ground layer 200 to the first connector 100 through the step surface 22, which can improve the connection stability between the first connector 100 and the ground layer 200. Furthermore, this also increases the contact area between the first connector 100 and the ground layer 200, improving the conductivity of the connection structure between the first connector 100 and the ground layer 200.

[0110] The fastener 300 can be an injection molded part, which can be formed by injection molding on the side of the fixing part 20. The fastener 300 can be provided on the side of the fixing part 20 to fix the fixing part 20 of the connecting accessory 100', reduce the shaking between the connecting accessory 100' and the ground layer 200, thereby improving the connection stability between the connecting accessory 100' and the ground layer 200.

[0111] The connecting accessory 100' can be used to connect the circuit board 400 and the ground layer 200, so that the circuit board 400 can form an electrical connection with the ground layer 200 through the connecting accessory 100', thereby grounding the circuit of the circuit board 400.

[0112] The connecting accessory 100' can be a conductive component. The connecting accessory 100' achieves an electrical connection with the ground layer 200 through an interference fit. The grounding portion of the circuit board 400 can contact the connecting accessory 100', making the base electrically connected to the connecting accessory 100'. Furthermore, through the electrical connection between the connecting accessory 100' and the ground layer 200, the grounding portion of the circuit board 400 is electrically connected to the ground layer 200, thereby enabling the circuit board 400 to achieve a grounding effect.

[0113] This disclosure improves the structural strength and conductivity of the connection between the connector 100' and the ground layer 200 by interference-fitting the connector 100' and the ground layer 200. The fixing member 300 is injection-molded on the side of the connector 100', thereby reducing the shaking of the connector 100' relative to the ground layer 200, improving the connection stability between the connector 100' and the ground layer 200, ensuring the electrical connection performance between the connector 100' and the ground layer 200, reducing the space required for the connector 100', and facilitating the stacking design of the whole machine.

[0114] Figure 9 This is a flowchart illustrating an assembly method according to an exemplary embodiment.

[0115] In some embodiments, such as Figure 5 and Figure 9 As shown, the connecting part 10 is provided with a protrusion 11, which pushes the connecting fitting 100' into the mounting hole 201' to make the connecting part 10 and the mounting hole 201' of the formation 200 interference fit. This may include:

[0116] S11: Align the positioning part 30 with the assembly hole 201';

[0117] S1002: Push the connecting fitting 100' into the mounting hole 201' so that the protrusion 11 presses the mounting hole 201', wherein, after the connecting fitting 100' and the mounting hole 201' are assembled, a mounting hole 201' that matches the shape of the protrusion 11 is formed, and the maximum diameter of the connecting part 10 is greater than the maximum diameter of the mounting hole 201'.

[0118] S20: Injection molding is performed on the side of the fixing part 20 to form the fixing member 300;

[0119] S30: Connect the circuit board 400 to the ground plane 200 so that the ground part of the circuit board 400 is grounded through the ground plane 200.

[0120] The maximum diameter of the connecting part 10 can be the distance from the top of the protrusion 11 to the axis of the connecting part 10.

[0121] During the process of pushing the connecting accessory 100' into the assembly hole 201', since the maximum diameter of the connecting part 10 is larger than that of the assembly hole 201', the connecting accessory 100' can deform the assembly hole 201' as it enters, making the shape of the assembly hole 201' match the shape of the connecting part 10. Furthermore, because the shape of the assembly hole 201' after being compressed matches the shape of the connecting part 10, the shape of the assembly hole 201' also matches the shape of the protrusion 11. Therefore, the cooperation between the assembly hole 201' and the protrusion 11 can restrict the rotation of the connecting accessory 100' within the assembly hole 201', thereby improving the connection stability between the connecting accessory 100' and the assembly hole 201'.

[0122] Pushing the connecting fitting 100' into the mounting hole 201' requires overcoming the resistance between the connecting part 10 and the mounting hole 201', pressing the connecting fitting 100' into the mounting hole 201', thereby achieving an interference fit between the connecting fitting 100' and the mounting hole 201'. This can improve the structural strength of the connection between the connecting fitting 100' and the ground layer 200, and make the contact area between the connecting fitting 100' and the ground layer 200 larger and the contact state more stable, resulting in good conductivity between the connecting fitting 100' and the ground layer 200.

[0123] The fastener 300 can be an injection molded part, which can be formed by injection molding on the side of the fixing part 20. The fastener 300 can be provided on the side of the fixing part 20 to fix the fixing part 20 of the connecting accessory 100', reduce the shaking between the connecting accessory 100' and the ground layer 200, thereby improving the connection stability between the connecting accessory 100' and the ground layer 200.

[0124] The connecting accessory 100' can be used to connect the circuit board 400 and the ground layer 200, so that the circuit board 400 can form an electrical connection with the ground layer 200 through the connecting accessory 100', thereby grounding the circuit of the circuit board 400.

[0125] The connecting accessory 100' can be a conductive component. The connecting accessory 100' achieves an electrical connection with the ground layer 200 through an interference fit. The grounding portion of the circuit board 400 can contact the connecting accessory 100', making the base electrically connected to the connecting accessory 100'. Furthermore, through the electrical connection between the connecting accessory 100' and the ground layer 200, the grounding portion of the circuit board 400 is electrically connected to the ground layer 200, thereby enabling the circuit board 400 to achieve a grounding effect.

[0126] This disclosure improves the structural strength and conductivity of the connection between the connector 100' and the ground layer 200 by interference-fitting the connector 100' and the ground layer 200. The fixing member 300 is injection-molded on the side of the connector 100', thereby reducing the shaking of the connector 100' relative to the ground layer 200, improving the connection stability between the connector 100' and the ground layer 200, ensuring the electrical connection performance between the connector 100' and the ground layer 200, reducing the space required for the connector 100', and facilitating the stacking design of the whole machine.

[0127] In some embodiments, the difference between the maximum diameter of the connecting portion 10 and the maximum diameter of the mounting hole 201' is 0.26 mm to 0.34 mm.

[0128] The maximum diameter of the connecting part 10 can be the distance from the top of the protrusion 11 to the axis of the connecting part 10.

[0129] During the process of pushing the connecting accessory 100' into the assembly hole 201', since the maximum diameter of the connecting part 10 is larger than that of the assembly hole 201', the connecting accessory 100' can deform the assembly hole 201' as it enters, making the shape of the assembly hole 201' match the shape of the connecting part 10. Furthermore, because the shape of the assembly hole 201' after being compressed matches the shape of the connecting part 10, the shape of the assembly hole 201' also matches the shape of the protrusion 11. Therefore, the cooperation between the assembly hole 201' and the protrusion 11 can restrict the rotation of the connecting accessory 100' within the assembly hole 201', thereby improving the connection stability between the connecting accessory 100' and the assembly hole 201'.

[0130] Figure 10 This is a flowchart illustrating an assembly method according to an exemplary embodiment.

[0131] In some embodiments, such as Figure 5 and Figure 10 As shown, the formation 200 may include a second side opposite to the first side, and the assembly method may further include:

[0132] S10: The connecting part 10 of the connecting fitting 100' is interference-fitted to the formation 200, wherein the connecting fitting 100' includes a connecting part 10 and a fixing part 20 that are interconnected;

[0133] S20: Injection molding is performed on the side of the fixing part 20 to form the fixing member 300;

[0134] S30: Connect the circuit board 400 to the ground plane 200 so that the ground part of the circuit board 400 is grounded through the ground plane 200;

[0135] S40: Cut the portion of the connecting fitting 100' that protrudes from the second side of the formation 200, so that the connecting fitting 100' is flush with the second side of the formation 200 to form the first connecting member 100.

[0136] By interfering the connection part 10 of the connecting accessory 100' with the ground layer 200, the strength of the connection structure between the connecting accessory 100' and the ground layer 200 is improved, and the contact area between the connecting accessory 100' and the ground layer 200 is larger and the contact state is stable, resulting in good conductivity between the connecting accessory 100' and the ground layer 200.

[0137] The fastener 300 can be an injection molded part, which can be formed by injection molding on the side of the fixing part 20. The fastener 300 can be provided on the side of the fixing part 20 to fix the fixing part 20 of the connecting accessory 100', reduce the shaking between the connecting accessory 100' and the ground layer 200, thereby improving the connection stability between the connecting accessory 100' and the ground layer 200.

[0138] The connecting accessory 100' can be used to connect the circuit board 400 and the ground layer 200, so that the circuit board 400 can form an electrical connection with the ground layer 200 through the connecting accessory 100', thereby grounding the circuit of the circuit board 400.

[0139] The connecting accessory 100' can be a conductive component. The connecting accessory 100' achieves an electrical connection with the ground layer 200 through an interference fit. The grounding portion of the circuit board 400 can contact the connecting accessory 100', making the base electrically connected to the connecting accessory 100'. Furthermore, through the electrical connection between the connecting accessory 100' and the ground layer 200, the grounding portion of the circuit board 400 is electrically connected to the ground layer 200, thereby enabling the circuit board 400 to achieve a grounding effect.

[0140] By clearly cutting the part of the connecting fitting 100' protruding from the second side of the ground layer 200, the connecting fitting 100' can be flush with the second side of the ground layer 200 to form the first connecting member 100, thus avoiding the connecting fitting 100' occupying the installation space on the second side of the ground layer 200 and providing installation space for other components on the second side of the ground layer 200.

[0141] This disclosure improves the structural strength and conductivity of the connection between the connector 100' and the ground layer 200 by interference-fitting the connector 100' and the ground layer 200. The fixing member 300 is injection-molded on the side of the connector 100', thereby reducing the shaking of the connector 100' relative to the ground layer 200, improving the connection stability between the connector 100' and the ground layer 200, ensuring the electrical connection performance between the connector 100' and the ground layer 200, reducing the space required for the connector 100', and facilitating the stacking design of the whole machine.

[0142] Figure 11 This is a flowchart illustrating an assembly method according to an exemplary embodiment.

[0143] In some embodiments, such as Figure 5 and Figure 11 As shown, the fastener 300 is formed by injection molding on the side of the fastening portion 20, and may include:

[0144] S10: The connecting part 10 of the connecting fitting 100' is interference-fitted to the formation 200, wherein the connecting fitting 100' includes a connecting part 10 and a fixing part 20 that are interconnected;

[0145] S21: A fastener 300 is formed by injection molding around the side of the fixing part 20 to form a fastener 300 that surrounds the fixing part 20 and contacts the first side of the formation 200;

[0146] S30: Connect the circuit board 400 to the ground plane 200 so that the ground part of the circuit board 400 is grounded through the ground plane 200.

[0147] By interfering the connection part 10 of the connecting accessory 100' with the ground layer 200, the strength of the connection structure between the connecting accessory 100' and the ground layer 200 is improved, and the contact area between the connecting accessory 100' and the ground layer 200 is larger and the contact state is stable, resulting in good conductivity between the connecting accessory 100' and the ground layer 200.

[0148] The fastener 300 can be an injection molded part, which can be formed by injection molding around the side of the fixing part 20. The fastener 300 can be provided on the side of the fixing part 20 to fix the fixing part 20 of the connecting accessory 100', reduce the shaking between the connecting accessory 100' and the ground layer 200, thereby improving the connection stability between the connecting accessory 100' and the ground layer 200.

[0149] The fastener 300 is arranged around the side of the fixing part 20 so that the fastener 300 provides support in all directions of the side of the fixing part 20, thereby reducing the shaking between the first connector 100 and the ground layer 200 and improving the connection stability between the first connector 100 and the ground layer 200.

[0150] The connecting accessory 100' can be used to connect the circuit board 400 and the ground layer 200, so that the circuit board 400 can form an electrical connection with the ground layer 200 through the connecting accessory 100', thereby grounding the circuit of the circuit board 400.

[0151] The connecting accessory 100' can be a conductive component. The connecting accessory 100' achieves an electrical connection with the ground layer 200 through an interference fit. The grounding portion of the circuit board 400 can contact the connecting accessory 100', making the base electrically connected to the connecting accessory 100'. Furthermore, through the electrical connection between the connecting accessory 100' and the ground layer 200, the grounding portion of the circuit board 400 is electrically connected to the ground layer 200, thereby enabling the circuit board 400 to achieve a grounding effect.

[0152] This disclosure improves the structural strength and conductivity of the connection between the connector 100' and the ground layer 200 by interference-fitting the connector 100' and the ground layer 200. The fixing member 300 is injection-molded on the side of the connector 100', thereby reducing the shaking of the connector 100' relative to the ground layer 200, improving the connection stability between the connector 100' and the ground layer 200, ensuring the electrical connection performance between the connector 100' and the ground layer 200, reducing the space required for the connector 100', and facilitating the stacking design of the whole machine.

[0153] It is understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. The singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0154] It is further understood that the terms "second," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "second," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, second information can also be referred to as second information, and similarly, second information can also be referred to as second information.

[0155] It is further understood that the terms “center,” “longitudinal,” “lateral,” “front,” “rear,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation.

[0156] It can be further understood that, unless otherwise specified, "connection" includes both direct connections where no other components exist between the two parties and indirect connections where other components exist between them.

[0157] It is further understood that although operations are described in a specific order in the accompanying drawings in the embodiments of this disclosure, this should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all of the shown operations to be performed to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0158] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following scope of claims.

[0159] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A mid-frame component, characterized in that, include: Strata; A first connector, comprising a connecting portion and a fixing portion connected to each other, wherein the connecting portion penetrates the formation and is interference-fitted to the formation, and the fixing portion is located on a first side of the formation; A fastener is disposed on the side of the fixing part to fix the fixing part; A circuit board is disposed on the first side of the ground layer. The circuit board has a grounding portion, which is grounded through the ground layer via the first connector.

2. The mid-frame assembly according to claim 1, characterized in that, The formation includes a through hole, and the connecting part is disposed in the through hole and is interference-fitted with the through hole.

3. The mid-frame assembly according to claim 1, characterized in that, The fastener is in contact with the stratum and is arranged around the side of the fastening part.

4. The mid-frame assembly according to claim 3, characterized in that, The side of the fixing part is provided with a groove, and the fixing member fills at least a portion of the groove.

5. The mid-frame assembly according to claim 2, characterized in that, The surface of the connecting part that contacts the formation is provided with multiple protrusions, and the multiple protrusions are interference-fitted with the through hole.

6. The mid-frame assembly according to claim 5, characterized in that, The protrusion extends along the axial direction of the through hole.

7. The mid-frame assembly according to claim 5, characterized in that, The cross-sectional shape of the protrusion on the radial surface of the connection is one or more of the following: triangular, arc-shaped, and rectangular.

8. The mid-frame assembly according to claim 1, characterized in that, The outer diameter of the fixing part is larger than the outer diameter of the connecting part, and the fixing part includes a stepped surface, which abuts against the first side of the stratum.

9. The mid-frame assembly according to claim 5, characterized in that, The mid-frame component includes: An antenna is electrically connected to the circuit board and grounded through the grounding portion of the circuit board.

10. The mid-frame assembly according to claim 5, characterized in that, The mid-frame assembly further includes a second connector, which is connected to the first connector to secure the circuit board to the ground plane.

11. The mid-frame assembly according to claim 9, characterized in that, The first connecting component is a nut; The second connecting component is a screw.

12. An electronic device, characterized in that, include: The mid-frame assembly as described in any one of claims 1 to 11.

13. A method for assembling a mid-frame component, characterized in that, The assembly method is applicable to the assembly of the mid-frame assembly as described in any one of claims 1 to 11, and includes: The connecting part of the connecting fitting is interference-fitted to the formation, wherein the connecting fitting includes the connecting part and the fixing part that are interconnected; The fastener is formed by injection molding on the side of the fixing part; The circuit board is connected to the ground plane so that the ground portion of the circuit board is grounded through the ground plane.

14. The assembly method according to claim 13, characterized in that, The connecting fitting includes a positioning part, the connecting part is located between the positioning part and the fixing part, the formation is provided with an assembly hole, and the step of interference-fitting the connecting part of the connecting fitting to the formation includes: Align the positioning part with the assembly hole; Push the connecting fitting into the mounting hole to make the connecting part interference-fit with the mounting hole of the formation.

15. The assembly method according to claim 13, characterized in that, The outer diameter of the fixing part is larger than the outer diameter of the connecting part, the fixing part includes a stepped surface, the stratum is provided with an assembly hole, and the step of interference-fitting the connecting part of the connecting accessory to the stratum includes: Push the connecting fitting into the assembly hole until the stepped surface abuts against the first side of the stratum.

16. The assembly method according to claim 14, characterized in that, The connecting portion is provided with a protrusion, and the step of pushing the connecting fitting into the mounting hole to make the connecting portion and the mounting hole of the formation interference fit includes: The connecting fitting is pushed into the mounting hole to cause the protrusion to press against the mounting hole, wherein the connecting fitting, after being assembled with the mounting hole, forms a mounting hole that matches the shape of the protrusion, and the maximum diameter of the connecting portion is greater than the maximum diameter of the mounting hole.

17. The assembly method according to claim 16, characterized in that, The difference between the maximum diameter of the connecting part and the maximum diameter of the mounting hole is 0.26 mm to 0.34 mm.

18. The assembly method according to claim 13, characterized in that, The formation includes a second side opposite to the first side, and the assembly method further includes: Cut the portion of the connecting fitting that protrudes from the second side of the formation so that the connecting fitting is flush with the second side of the formation to form the first connecting member.

19. The assembly method according to claim 14, characterized in that, The diameter of the positioning part is smaller than the diameter of the assembly hole.

20. The assembly method according to claim 19, characterized in that, The difference between the diameter of the positioning part and the diameter of the assembly hole is 0.04 mm to 0.08 mm.

21. The assembly method according to claim 13, characterized in that, The fastener is formed by injection molding on the side of the fixing portion, including: The side of the fixing part is injection molded to form the fixing member that surrounds the fixing part and contacts the first side of the stratum.

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