Device support, light-emitting device and light-emitting module

Abstract

The invention discloses a device support, a light-emitting device and a light-emitting module, and relates to the technical field of semiconductor devices.The device support comprises a support body and an annular box dam, a first groove is formed in the support body, and the inner wall of the annular box dam is arranged along a groove opening of the first groove; a box dam space in the annular box dam is communicated with a groove space in the first groove to form a cup-shaped groove; the light-emitting device comprises a device support and a lens, the bottom of the lens is suspended above a support body, and the lens is bonded to the outer wall of the cup-shaped box dam and covers the upper portion of a cup opening of the cup-shaped groove. The support body is provided with the first groove and the annular box dam, the first groove and the annular box dam are combined to form the cup-shaped groove, the annular box dam can serve as a clamping structure to be clamped and bonded with the lens in a matched mode, the binding force of the lens and the device support is strengthened, the lens is suspended above the support body, the stress of bonding glue is effectively released, and the structural stability of a device is improved; and the light-emitting performance of the device is optimized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor devices, in particular to a device support, a light-emitting device and a light-emitting module. BACKGROUND

[0002] In the prior art of semiconductor device technology, the structure of a light-emitting device applied to a backlight module generally comprises a device support, a light-emitting chip and a lens. The device support is provided with a groove, the light-emitting chip is arranged at the bottom of the groove of the device support, and the lens is arranged on the device support and covers the groove. The light-emitting angle of the light emitted by the light-emitting chip can be adjusted through the lens to achieve better light-emitting effect. The lens is usually arranged on the device support by means of adhesive to bond the bottom of the lens to the surface of the device support. However, the bonding force between the lens and the device support is insufficient when the lens is fixed in this way, and the lens is prone to falling off when it is knocked. In addition, during the curing process in the production process, the lens is completely attached to the top surface of the device support, and the stress of the adhesive cannot be released, which causes the position of the lens to deviate and affects the structural stability of the device. SUMMARY

[0003] The present application aims to overcome the shortcomings of the prior art. The present application provides a device support, a light-emitting device and a light-emitting module. A first groove and an annular dam are arranged on the support body to form a cup-shaped groove. The annular dam can be used as a clamping structure to clamp and bond with the lens, thereby strengthening the bonding force between the lens and the device support. Moreover, the lens is suspended above the support body, which effectively releases the stress of the adhesive and improves the structural stability of the device, thereby optimizing the light-emitting performance of the device.

[0004] The present application provides a device support, which comprises a support body and an annular dam. The support body is provided with a first groove, and the inner wall of the annular dam is arranged along the groove opening of the first groove. The dam space in the annular dam and the groove space in the first groove are in communication to form a cup-shaped groove.

[0005] Further, the inner wall of the cup-shaped groove is inclined, and the cup-shaped groove has a cup inner wall diameter d3. The cup inner wall diameter d3 of the cup-shaped groove is larger closer to the cup opening of the cup-shaped groove.

[0006] Further, the groove inner wall surface of the first groove and the extension direction of the central axis of the first groove form an included angle a, and the dam inner wall surface of the annular dam and the extension direction of the central axis of the first groove form an included angle β. The value of the included angle a is equal to the value of the included angle β.

[0007] Further, the top ring width d4 of the annular dam is in the range of 0.6mm-1.0mm.

[0008] Further, the outer wall of the annular dam is inclined, the annular dam has a dam outer wall ring width d5, and the closer to the top of the annular dam, the greater the dam outer wall ring width d5.

[0009] Further, the height h2 of the slot opening to the slot bottom of the first groove ranges from 0.3 mm to 0.8 mm.

[0010] Further, the support body is further provided with a plurality of exhaust holes, the plurality of exhaust holes are arranged at intervals and arranged between the outer wall of the annular dam and the edge of the support body.

[0011] Further, the number of exhaust holes ranges from 1 to 10.

[0012] Further, the length L1 of the exhaust hole ranges from 0.1 mm to 2 mm.

[0013] Further, the bottom surface of the support body is provided with a plurality of fixed glue points.

[0014] The application further provides a light emitting device, which comprises a light emitting chip, a lens and the device support described above, the light emitting chip is arranged at the slot bottom of the first groove, the bottom of the lens is suspended above the support body, the lens is bonded on the dam top surface and the dam outer wall of the cup-shaped dam and covers above the cup mouth of the cup-shaped groove.

[0015] Further, the lens is provided with a second groove, the groove inner wall surface of the second groove is matched and clamped with the dam outer wall surface of the cup-shaped dam, and the groove inner wall surface of the second groove is bonded on the dam outer wall surface of the cup-shaped dam based on the bonding glue.

[0016] Further, the suspended distance h3 of the bottom of the lens to the surface of the support body ranges from 50 um to 100 um.

[0017] Further, the thickness h4 of the lens ranges from 1 mm to 3 mm.

[0018] The application further provides a light emitting module, which comprises the light emitting device described above.

[0019] The application provides a device support, a light-emitting device and a light-emitting module. A first recess and an annular dam are arranged on a support body to form a cup-shaped groove. A light-emitting chip is arranged at the bottom of the cup-shaped groove, and a lens can be arranged above the cup-shaped groove. The annular dam can be used as a clamping structure to clamp and bond with the lens, thereby enhancing the bonding force between the lens and the device support. The lens is suspended above the support body. In the curing process of the production process, the adhesive stress is effectively released, the assembly precision of the lens and the device support is improved, the stability of the device structure is improved, and the light-emitting performance of the device is optimized. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0021] Figure 1 is a top view of the device support structure in the embodiment of the present application; Figure 2 is a sectional view of the device support structure in the embodiment of the present application; Figure 3 is a sectional view of the device support structure in the embodiment of the present application; Figure 2 is an enlarged view of p in Figure 4 is a bottom view of the device support structure in the embodiment of the present application; Figure 5 is a schematic view of the light-emitting device structure in the embodiment of the present application; Figure 6 is a sectional view of the light-emitting device structure in the embodiment of the present application; Figure 7 is a sectional view of the light-emitting device structure in the embodiment of the present application; Figure 6 is an enlarged view of q in Figure 8 is a schematic view of the light intensity distribution of the light-emitting device at different light-emitting angles in the embodiment of the present application. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0023] In the present application, it should be understood that terms such as "including" or "having" are intended to indicate the presence of features, numbers, steps, actions, components, parts or combinations thereof disclosed in the specification, and do not exclude the possibility of one or more other features, numbers, steps, actions, components, parts or combinations thereof existing or being added.

[0024] In addition, it should be further pointed out that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] The device support provided by the embodiments of the present application comprises a support body and an annular dam, a first recess is arranged in the support body, the inner wall of the annular dam is arranged along the recess opening of the first recess, and the dam space in the annular dam and the recess space in the first recess are communicated to form a cup-shaped groove.

[0026] In one optional implementation manner of the present embodiment, as shown in Figure 1 and Figure 2 shown, Figure 1 a top view of the device support structure in the embodiments of the present application is shown, Figure 2 a cross-sectional view of the device support structure in the embodiments of the present application is shown, wherein Figure 2 is Figure 1 a cross-sectional view along the A-A direction, the device support comprises a support body 1 and an annular dam 2, a first recess 3 is arranged in the support body 1, the inner wall of the annular dam 2 is arranged along the recess opening of the first recess 3, and the dam space in the annular dam 2 and the recess space in the first recess 3 are communicated to form a cup-shaped groove 4.

[0027] Specifically, the first recess 3 is arranged at the center position of the support body 1, the shape of the first recess 3 is a circular recess, the inner wall of the annular dam 2 is arranged in a circular ring along the recess opening of the first recess 3, a dam space is formed in the annular dam 2, a recess space is formed in the first recess 3, the dam space is above, and the recess space is below, and the two are combined and communicated to form a cup-shaped groove 4.

[0028] Here, by forming the annular dam 2 at the recess opening of the first recess 3, a shielding structure can be formed based on the annular dam 2 to the recess opening of the first recess 3, and in the subsequent production process, the bonding glue can be effectively blocked from flowing into the inside of the annular dam 2 and flowing into the cup-shaped groove 4 along the recess opening of the first recess 3 in the bonding process, so as to avoid affecting the structural stability and light emitting performance of the device.

[0029] In an optional implementation of the embodiment, the cup opening diameter d1 of the cup-shaped groove 4 is in the range of 2.7mm-3.3mm, and can be set to one of 2.7mm, 2.9mm, 3.18mm and 3.3mm according to actual design requirements.

[0030] In an optional implementation of the embodiment, the cup bottom diameter d2 of the cup-shaped groove 4 is in the range of 1.4mm-2.0mm, and can be set to one of 1.4mm, 1.6mm, 1.8mm and 2.0mm according to actual design requirements.

[0031] In an optional implementation of the embodiment, the cup inner wall of the cup-shaped groove 4 is inclined, and the cup-shaped groove 4 has a cup inner wall diameter d3, and the cup inner wall diameter d3 is larger closer to the cup opening of the cup-shaped groove 4.

[0032] Specifically, from the perspective of light emitting performance, the structure of the cup-shaped groove 4 is preferably that the cup top area is larger than the cup bottom area, that is, the cup inner wall of the cup-shaped groove 4 is inclined outward in the radial direction from the cup bottom to the cup top, and from the value of the cup inner wall diameter d3 of the cup-shaped groove 4, the cup inner wall diameter d3 is larger closer to the cup opening of the cup-shaped groove 4, so that the cup-shaped groove 4 forms a circular truncated cone-shaped groove with a wide top and a narrow bottom, which can make the light emitting angle of the light emitted by the light emitting chip arranged at the groove bottom of the cup-shaped groove 4 larger, and improve the light emitting performance of the device.

[0033] In an optional implementation of the embodiment, the inner wall surface of the first groove 3 and the extension direction of the central axis of the first groove 3 form an included angle α, the inner wall surface of the ring-shaped dam 2 and the extension direction of the central axis of the first groove 3 form an included angle β, and the value of the included angle α is equal to the value of the included angle β.

[0034] Specifically, as shown in FIG. 4, Figure 3 Figure 3 is Figure 2 the enlarged view at point p in FIG. 4, the inner wall surface of the first groove 3 and the extension direction of the central axis of the first groove 3 form an included angle α, the inner wall surface of the ring-shaped dam 2 and the extension direction of the central axis of the first groove 3 form an included angle β, and the value of the included angle α is equal to the value of the included angle β.

[0035] Here, it is indicated that the inclination angles of the inner wall surface of the first groove 3 and the inner wall surface of the ring-shaped dam 2 are completely consistent, and the connection between the inner wall surface of the first groove 3 and the inner wall surface of the ring-shaped dam 2 is a smooth surface.

[0036] Further, the values of the included angle α and the included angle β are in the range of 0°<α=β<90°. ​

[0037] In an optional implementation of the embodiment, the top ring width d4 of the annular dam 2 is in the range of 0.6mm-1.0mm, and can be set to one of 0.6mm, 0.7mm, 0.8mm, 0.9mm and 1.0mm according to actual design requirements.

[0038] In an optional implementation of the embodiment, the outer wall of the annular dam 2 is inclined, and the annular dam 2 has a dam outer wall ring width d5, and the dam outer wall ring width d5 of the annular dam 2 is larger as it is closer to the top of the annular dam 2.

[0039] Specifically, in the radial direction from the dam bottom to the top of the annular dam 2, the dam outer wall of the annular dam 2 is inclined inward, and in terms of the value of the dam outer wall ring width d5 of the annular dam 2, the dam outer wall ring width d5 is larger as it is closer to the top of the annular dam 2.

[0040] In an optional implementation of the embodiment, the dam height h1 of the annular dam 2 is in the range of 0.2mm-0.3mm, and can be set to one of 0.2mm, 0.22mm, 0.25mm, 0.28mm and 0.3mm according to actual design requirements.

[0041] In an optional implementation of the embodiment, the height h2 from the slot opening to the slot bottom of the first groove 3 is in the range of 0.3mm-0.8mm, and can be set to one of 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm and 0.8mm according to actual design requirements.

[0042] Further, the slot depth of the cup-shaped slot 4 is h1+h2.

[0043] Here, the adhesion area of the lens and the annular dam is calculated in priority to the requirement of the combination of the lens and the device support and the adhesion strength of the adhesive, and after the dam height h1 of the annular dam is determined under the condition of the circumference of the annular dam, the slot depth of the cup-shaped slot is determined considering the requirement of the device on the light emitting angle of the light emitting chip, and finally the groove height h2 of the first groove is determined.

[0044] In an optional implementation of the embodiment, as shown in Figure 1 the surface of the support body 1 is rectangular.

[0045] Further, the surface side length a of the support body 1 is in the range of 50mm-70mm, and can be set to one of 50mm, 55mm, 60mm, 65mm and 70mm according to actual design requirements, and in the embodiment, the surface side length of 60mm is adopted.

[0046] Here, compared with the size of 30mm*30mm of the conventional device support, the device support in the embodiment adopts the support body size of 60mm*60mm, and further improves the combination force of the lens and the support body.

[0047] In an optional implementation of the embodiment, a plurality of exhaust holes 5 are further arranged on the support body 1, and the plurality of exhaust holes 5 are arranged at intervals between the outer wall of the annular dam 2 and the edge of the support body 1.

[0048] In an optional implementation of the embodiment, the number of the exhaust holes 5 is 1-10.

[0049] Specifically, in the embodiment, the number of the exhaust holes 5 is 4, and the exhaust holes 5 are arranged on the lines from the center point of the first groove 3 to the four corners of the support body 1.

[0050] Further, the length L1 of the exhaust hole 5 is in the range of 0.1mm-2mm, and can be set to one of 0.1mm, 0.5mm, 1mm, 1.5mm and 2mm, and is set according to the actual design requirement, and is preferably 1mm.

[0051] Here, by arranging the exhaust holes, the gas in the adhesive is exhausted when the adhesive is pressed during the production process, the stress of the adhesive is released, the lens and the support body are combined more closely, the combination force is greater, and the device structure stability is improved.

[0052] In an optional implementation of the embodiment, as shown in Figure 4 and Figure 4 a bottom view schematic diagram of the device support structure in the embodiment is shown, and the bottom surface of the support body 1 is provided with a plurality of fixed glue points 6.

[0053] Specifically, in the embodiment, the number of the fixed glue points 6 is 8.

[0054] Here, the fixed glue points are arranged to provide a fulcrum for the combination of the lens and the support body, and further improve the stability of the device structure.

[0055] The embodiment of the application further provides a light emitting device, which comprises a light emitting chip, a lens and the above-mentioned device support, the light emitting chip is arranged at the groove bottom of the first groove, the bottom of the lens is suspended above the support body, the lens is bonded on the dam top surface and the dam outer wall of the cup-shaped dam and covers above the cup mouth of the cup-shaped groove.

[0056] In an optional implementation of the embodiment, as shown in Figure 5 and Figure 6 a bottom view schematic diagram of the device support structure in the embodiment is shown, and the bottom surface of the support body 1 is provided with a plurality of fixed glue points 6. Figure 5Fig. 1 shows a schematic diagram of a light emitting device structure in an embodiment of the present application, Figure 6 Fig. 1 shows a schematic diagram of a light emitting device structure in an embodiment of the present application,

[0057] Further, the lens 8 is provided with a second groove 81, the groove inner wall surface of the second groove 81 is matched and connected with the dam outer wall surface of the annular dam 2, and the groove inner wall surface of the second groove 81 is connected with the dam outer wall surface of the cup-shaped dam 2 based on the adhesive.

[0058] Specifically, in the conventional device structure, the lens is usually connected with the device support through the adhesive, and the lens is easy to fall off when the device is bumped. Therefore, in the embodiment, the second groove is arranged at the bottom of the lens, and the lens is matched and connected with the annular dam, the lens is limited by the annular dam, and the groove inner wall surface of the second groove of the lens is connected with the dam outer wall surface of the annular dam based on the adhesive, so that the combination of the lens and the device support is strengthened, and the stability of the device structure is effectively improved.

[0059] Further, the lens is matched and connected with the annular dam through the second groove of the lens, so that the cup mouth diameter of the cup-shaped groove can be smaller, the near-field optical design is better optimized, the light emitting angle of the device is greatly opened, the number of backlights is reduced, and the product cost is reduced from the product design.

[0060] Further, the lens is matched and connected with the annular dam through the second groove of the lens, so that the cup mouth diameter of the cup-shaped groove can be smaller, the near-field optical design is better optimized, the light emitting angle of the device is greatly opened, the number of backlights is reduced, and the product cost is reduced from the product design.

[0061] In an optional implementation manner of the embodiment, as shown in Figure 7 Figure 7 is Figure 6 ​The distance h3 between the bottom of the lens 8 and the surface of the support body 1 is 50-100um, and can be set to 50um, 60um, 70um, 80um, 90um or 100um.

[0062] In an optional implementation of the embodiment, the lens 8 is made of silica gel.

[0063] Here, the traditional lens material is usually made of polymethyl methacrylate (PMMA), which is prone to yellowing and aging in long-term use, resulting in a decrease in light transmittance and light efficiency. In addition, the PMMA material has poor temperature resistance, which cannot meet the temperature requirements in the curing process, resulting in deformation and damage in a high-temperature preparation environment, affecting the production efficiency and reliability of the lens product. Therefore, in this embodiment, the lens material is silica gel, which has the characteristics of high temperature resistance and yellowing resistance. The silica gel lens can withstand a high temperature of about 200℃ for a long time, while the traditional PMMA lens can only withstand a high temperature of about 90℃ for a long time, so that the light decay of the light-emitting device using the silica gel lens is smaller in a long-term high-temperature working environment.

[0064] In an optional implementation of the embodiment, the thickness h4 of the lens 8 is 1-3mm, and can be set to 1mm, 1.5mm, 2mm, 2.5mm or 3mm according to actual design requirements.

[0065] Further, the thickness of the lens made of silica gel is about one fourth of the thickness of the traditional reflective lens, which provides space for the ultra-thin design of the light-emitting device, especially the backlight device, and is conducive to the development of the light and thin trend of the device.

[0066] In an optional implementation of the embodiment, the curvature of the lens 8 is 0.35-0.75, and can be set to 0.35, 0.45, 0.55, 0.65 or 0.75 according to actual design requirements.

[0067] In an optional implementation of the embodiment, the device support, the lens and the light-emitting chip are integrally packaged.

[0068] Specifically, based on the integrally packaged device support, lens and light-emitting chip, the lens can occupy less space on the PCB layout, increase the utilization rate of the PCB circuit layer, and save the lens pasting and curing process in the pasting process, so that the overall production process is shortened and the production efficiency is improved.

[0069] In an optional implementation of the embodiment, the embodiment of the application further provides a light-emitting module, which comprises the light-emitting device described above.

[0070] Further, as shown in Figure 8 Figure 8 The light intensity distribution diagram of the light emitting device in the embodiment of the application at different light emitting angles is shown, and in the case of power supply of the light emitting chip, there are light intensity peaks between-70°-(-60°) and 60°-70°, and the relative light intensity is greater than 50% between-75°-75°, so it can be judged that the effective light emitting angle of the light emitting device in the embodiment is greater than 150°, and good light emitting performance is exhibited.

[0071] In summary, the embodiment of the application provides a device support, a light emitting device and a light emitting module, the first groove and the annular dam are arranged on the support body to form a cup-shaped groove, the light emitting chip is arranged at the bottom of the cup-shaped groove, the lens can be covered above the cup-shaped groove, the annular dam can be used as a clamping structure to be clamped and bonded with the lens, the combination of the lens and the device support is strengthened, and the lens is suspended above the support body, the adhesive stress is effectively released in the curing process of the production process, the assembly precision of the lens and the device support is improved, the stability of the device structure is improved, and the light emitting performance of the device is optimized.

[0072] The device support, the light emitting device and the light emitting module provided by the application are described in detail above, and those skilled in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by programs instructing related hardware, and the programs can be stored in a computer readable storage medium, and the storage medium can include a read only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0073] In addition, the embodiments of the application are described in detail above, and specific examples are used in this paper to describe the principles and implementation modes of the application, and the above embodiment descriptions are only used to help understand the method of the application and its core idea; at the same time, for those skilled in the art, according to the idea of the application, the specific implementation mode and application range will be changed, and the above description should not be understood as a limitation of the application.​

Claims

1. A device holder, characterized in that The device support comprises a support body and an annular dam, the support body is provided with a first groove, the inner wall of the annular dam is arranged along the groove opening of the first groove, and the dam space in the annular dam and the groove space in the first groove are communicated to form a cup-shaped groove.

2. The device holder of claim 1, wherein, The inner wall of the cup-shaped groove is inclined, the cup-shaped groove has a cup inner wall diameter d3, and the cup inner wall diameter d3 is larger closer to the cup opening of the cup-shaped groove.

3. The device holder according to any of claims 1-2, wherein The inner wall surface of the first groove and the extension direction of the central axis of the first groove form an angle α, the inner wall surface of the annular dam and the extension direction of the central axis of the first groove form an angle β, and the value of the angle α is equal to the value of the angle β.

4. The device holder of claim 1, wherein, The top ring width d4 of the annular dam ranges from 0.6 mm to 1.0 mm.

5. The device holder of claim 1, wherein, The outer wall of the annular dam is inclined, the annular dam has a dam outer wall ring width d5, and the dam outer wall ring width d5 is larger closer to the top of the annular dam.

6. The device holder of claim 1, wherein, The height h2 of the groove opening to the groove bottom of the first groove ranges from 0.3 mm to 0.8 mm.

7. The device holder of claim 1, wherein, A plurality of exhaust holes are further arranged on the support body, and the plurality of exhaust holes are arranged in intervals between the outer wall of the annular dam and the edge of the support body.

8. The device holder of claim 7, wherein, The number of the exhaust holes is 1-10.

9. The device holder of claim 7, wherein, The length L1 of the exhaust hole ranges from 0.1 mm to 2 mm.

10. The device holder of claim 1, wherein, The bottom surface of the support body is provided with a plurality of fixed glue points.

11. A light-emitting device, characterized in that, The light emitting device comprises a light emitting chip, a lens and the device support according to any one of claims 1-10, the light emitting chip is arranged at the groove bottom of the first groove, the bottom of the lens is suspended above the support body, the lens is bonded to the dam top surface and the dam outer wall of the cup-shaped dam and covers the cup opening of the cup-shaped groove.

12. The light emitting device of claim 11, wherein, The lens is provided with a second groove, the inner wall surface of the second groove is matched and clamped with the outer wall surface of the cup-shaped dam, and the inner wall surface of the second groove is bonded to the outer wall surface of the cup-shaped dam based on the bonding glue.

13. The light emitting device of claim 11, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. The suspended distance h3 between the bottom of the lens and the surface of the support body ranges from 50 um to 100 um.

14. The light emitting device of claim 11, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. The thickness h4 of the lens ranges from 1 mm to 3 mm.

15. A light emitting module, characterized in that The light emitting module comprises the light emitting device according to any one of claims 11-14.

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