Packaging method, device and equipment of color-changing light source based on dispensing parameter adjustment

Abstract

This invention relates to the field of semiconductor packaging technology, solving the problem in existing technologies that cannot improve the accuracy of dispensing control during the packaging process based on feedback from the light source's structural characteristics and luminous performance. It provides a method, apparatus, and device for packaging iridescent light sources based on dispensing parameter adjustment. The method includes: determining preset packaging size information, preset pad size information, and preset pad layout information according to the light source type of the iridescent light source to be packaged; obtaining initial dispensing parameters corresponding to the iridescent light source type; performing initial dispensing treatment on the iridescent light source according to the initial dispensing parameters and detecting its luminous performance to obtain the detection value; adjusting the initial dispensing parameters according to the deviation between the detection value and the target value to obtain target dispensing parameters; and performing dispensing and die bonding treatment on light sources of the same type as the iridescent light source according to the target dispensing parameters to complete the packaging process of the iridescent light source. This invention improves the accuracy of dispensing control.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a method, apparatus and equipment for packaging a holographic light source based on dispensing parameter adjustment. Background Technology

[0002] Multicolor light sources are light-emitting devices capable of displaying a variety of color changes, widely used in stage lighting, smart homes, advertising signage, and consumer electronics. To achieve high brightness, multiple colors, and high consistency in light emission, the packaging quality of multicolor light sources directly impacts their luminous performance. Especially in the packaging process, dispensing is a critical step, requiring precise control of parameters such as adhesive quantity, dispensing speed, and dispensing path to ensure uniform adhesive layer, unobstructed pads, and consistent light transmission, thus avoiding impacts on luminous efficiency and stability. Therefore, achieving precise dispensing control for different types of multicolor light sources has become an important research direction for improving product yield and performance.

[0003] Currently, most iridescent light source packaging processes employ fixed dispensing parameters for batch operations. Dynamic adjustments to these parameters still rely on manual judgment, making it difficult to accurately adapt to individual differences in different light source types. Furthermore, existing packaging processes often lack effective feedback mechanisms to correct dispensing process parameters, leading to issues such as uneven brightness, wavelength shifts, or excessive leakage current in some packaged products. In addition, the settings for dispensing paths, dispensing height, and speed are primarily static configurations, making it difficult to intelligently optimize based on actual luminous performance, resulting in poor product consistency and low yield. Existing technologies suffer from three key problems in dispensing control: first, a lack of comprehensive adaptation strategies for light source types and packaging structures, making it impossible to automatically generate effective dispensing paths and parameters based on structural parameters; second, the absence of a closed-loop feedback between the dispensing process and luminous performance testing, preventing dynamic adjustment of dispensing parameters based on test results; and third, the inability to specifically optimize luminous deviations in different color channels within the light channel, resulting in packaging consistency and optical performance failing to meet the demands of high-end applications.

[0004] Therefore, how to improve the accuracy of dispensing control during the packaging process based on the structural characteristics and luminous performance feedback of the light source is an urgent problem to be solved. Summary of the Invention

[0005] In view of this, the present invention provides a method, apparatus and equipment for packaging a multi-colored light source based on dispensing parameter adjustment, in order to solve the problem in the prior art that the accuracy of dispensing control during the packaging process cannot be improved based on the feedback of the light source's structural characteristics and luminous performance.

[0006] The technical solution adopted in this invention is:

[0007] In a first aspect, the present invention provides a method for encapsulating a multi-colored light source based on dispensing parameter adjustment, the method comprising:

[0008] Based on the light source type of the iridescent light source to be packaged, determine the preset package size information, preset pad size information, and preset pad layout information;

[0009] Based on the preset package size information, preset pad size information, and preset pad layout information, obtain the initial dispensing parameters corresponding to the RGB light source type;

[0010] Based on the initial dispensing parameters, the iridescent light source is subjected to initial dispensing and die bonding, and the luminous performance of the iridescent light source after die bonding is tested to obtain the test values ​​of the preset luminous parameters.

[0011] Based on the deviation between the detected value and the target value of the preset luminescence parameter, the initial dispensing parameters are adjusted to obtain the target dispensing parameters;

[0012] Based on the target dispensing parameters, dispensing and die bonding processes are performed on light sources of the same type as the iridescent light source to complete the encapsulation process of the iridescent light source.

[0013] Secondly, the present invention provides a color-changing light source packaging device based on dispensing parameter adjustment, the device comprising:

[0014] The packaging structure and pad structure determination module is used to determine the preset packaging size information, preset pad size information and preset pad layout information based on the light source type of the iridescent light source to be packaged.

[0015] The initial dispensing parameter acquisition module is used to acquire the initial dispensing parameters corresponding to the RGB light source type based on the preset package size information, preset pad size information, and preset pad layout information.

[0016] The luminescence parameter detection module is used to perform initial dispensing and die bonding on the iridescent light source according to the initial dispensing parameters, and to detect the luminescence performance of the iridescent light source after die bonding, so as to obtain the detection values ​​of the preset luminescence parameters.

[0017] The dispensing strategy adjustment module is used to adjust the initial dispensing parameters according to the deviation between the detected value and the target value of the preset luminescence parameters, so as to obtain the target dispensing parameters.

[0018] The encapsulation module is used to perform dispensing and die bonding processes on light sources of the same type as the iridescent light source according to the target dispensing parameters, thereby completing the encapsulation process of the iridescent light source.

[0019] Thirdly, embodiments of the present invention also provide a color light source packaging device, including: at least one processor, at least one memory, and computer program instructions stored in the memory, which, when executed by the processor, implement the method of the first aspect described above.

[0020] In summary, the beneficial effects of the present invention are as follows:

[0021] This invention provides a method, apparatus, and device for encapsulating a holographic light source based on dispensing parameter adjustment. The method includes: determining preset encapsulation size information, preset pad size information, and preset pad layout information according to the light source type of the holographic light source to be encapsulated; obtaining initial dispensing parameters corresponding to the holographic light source type based on the preset encapsulation size information, preset pad size information, and preset pad layout information; performing initial dispensing and die bonding on the holographic light source according to the initial dispensing parameters, and detecting the luminous performance of the holographic light source after die bonding to obtain the detection value of the preset luminous parameter; adjusting the initial dispensing parameters according to the deviation between the detection value and the target value of the preset luminous parameter to obtain the target dispensing parameter; and performing dispensing and die bonding on a light source of the same type as the holographic light source according to the target dispensing parameter to complete the encapsulation of the holographic light source. This invention introduces a structural parameter identification and matching mechanism based on light source type. First, it automatically determines the corresponding package size, pad size, and pad layout information according to the type of the iridescent light source to be packaged, thereby obtaining suitable initial dispensing parameters and achieving precise matching between dispensing control and the light source structure. Subsequently, it performs luminous performance testing on the light source after initial dispensing, collecting detection values ​​of key luminous parameters such as forward voltage, luminous brightness, wavelength, and reverse leakage current, and comparing the detection values ​​with preset target values ​​to obtain performance deviation information for each optical channel. Based on the deviation results, it dynamically adjusts the dispensing parameters, forming a closed-loop control process of structural parameter driving—dispensing execution—performance testing—parameter feedback—optimization adjustment. Ultimately, it achieves refined control of the iridescent light source dispensing process and ensures consistent luminous performance, improving the accuracy of dispensing control during the packaging process. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments of the present invention will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, and these are all within the protection scope of the present invention.

[0023] Figure 1 This is a schematic diagram of the overall operation of the iridescent light source packaging method based on dispensing parameter adjustment in Embodiment 1 of the present invention;

[0024] Figure 2This is a schematic diagram of the process for obtaining the initial dispensing parameters corresponding to the type of iridescent light source in Embodiment 1 of the present invention;

[0025] Figure 3 This is a schematic diagram of the process for calculating the dispensing speed and dispensing amount in Embodiment 1 of the present invention;

[0026] Figure 4 This is a schematic diagram of the process for obtaining the detection value of the preset luminescence parameter in Embodiment 1 of the present invention;

[0027] Figure 5 This is a flowchart illustrating the process of determining the deviation between the detected value and the target value of the preset luminescence parameter in Embodiment 1 of the present invention.

[0028] Figure 6 This is a schematic diagram of the process of adjusting the initial dispensing parameters to obtain the target dispensing parameters in Embodiment 1 of the present invention;

[0029] Figure 7 This is a schematic diagram of a three-channel breakpoint resume 5V series holographic light source in Embodiment 1 of the present invention;

[0030] Figure 8 This is a schematic diagram of a four-channel 5V series holographic light source in Embodiment 1 of the present invention;

[0031] Figure 9 This is a schematic diagram of a three-channel, 12V series color-changing light source with breakpoint resume capability in Embodiment 1 of the present invention.

[0032] Figure 10 This is a structural block diagram of the iridescent light source packaging device based on dispensing parameter adjustment in Embodiment 2 of the present invention;

[0033] Figure 11 This is a schematic diagram of the structure of the iridescent light source packaging device in Embodiment 3 of the present invention;

[0034] The numbers in the diagram are as follows:

[0035] 1-First light-emitting chip; 2-First metal electrode pad; 3-First solder joint; 4-First bottom solder foot; 5-Photosensitive sensor; 6-Second light-emitting chip; 7-Second solder joint; 8-Second bottom solder foot; 9-Second metal electrode pad; 10-Third light-emitting chip; 11-Third solder joint; 12-Encapsulation housing; 13-Third bottom solder foot. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. In the description of the present invention, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, the element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. Where there is no conflict, embodiments of the present invention and the various features thereof can be combined with each other, all of which are within the scope of protection of the present invention.

[0037] Example 1

[0038] Please see Figure 1 Embodiment 1 of the present invention discloses a method for encapsulating a multi-colored light source based on dispensing parameter adjustment, the method comprising:

[0039] Based on the light source type of the iridescent light source to be packaged, determine the preset package size information, preset pad size information, and preset pad layout information;

[0040] Specifically, firstly, based on the light source type of the RGB light source to be packaged, such as RGB 3-in-1 LEDs, 4-in-1 LEDs, or high-density micro LEDs, the system automatically matches the corresponding packaging structure feature parameters by calling a pre-built light source type database. These parameters include preset package size information, preset pad size information, and preset pad layout information. The packaging structure feature parameters specifically include: light source dimensions (e.g., length, width, and height), package housing type (e.g., flip-chip, surface mount, COB, etc.), pad geometry (e.g., circular, rectangular, and their specific values), pad spacing, and the specific layout of the pads on the substrate (e.g., linear, matrix, or staggered arrangement). This process provides structural data support for subsequent dispensing path generation and adhesive distribution.

[0041] Based on the preset package size information, preset pad size information, and preset pad layout information, obtain the initial dispensing parameters corresponding to the RGB light source type;

[0042] Specifically, based on the preset package size information, preset pad size information, and preset pad layout information determined in the previous step, initial dispensing parameters adapted to the structural characteristics of this type of RGB light source are obtained. The package size information refers to the three-dimensional physical dimensions of the LED chip and its package housing, such as length, width, and height, which determines the overall boundary of the dispensing area and the adhesive coverage. The pad size information refers to the area, shape (e.g., circular, rectangular), and boundary contour of the metal pads, which directly affects the areas the adhesive needs to avoid and the required precise dispensing accuracy. The pad layout information refers to the arrangement of the pads on the bottom of the package or on the substrate, such as a straight line, L-shape, ring, or matrix distribution, affecting the dispensing path planning and sequence control. Based on the above information, the initial dispensing path (e.g., U-shaped distribution along the edge, central dotted distribution, or uniform matrix distribution) and dispensing quantity parameters (e.g., adhesive quantity per point, dispensing time, needle height, speed, etc.) can be automatically generated. This process enables rapid and intelligent matching of dispensing parameters under different light source structures, avoiding errors in manual parameter setting and repeated trial and error, improving the success rate and efficiency of initial dispensing, and laying the foundation for subsequent closed-loop calibration and precise control.

[0043] In one embodiment, please refer to Figure 2 The step of obtaining the initial dispensing parameters corresponding to the RGB light source type based on the preset package size information, preset pad size information, and preset pad layout information includes:

[0044] Based on the preset package size information, the preset pad size information, and the preset pad layout information, the pad avoidance area and non-pad avoidance area in the dispensing path are divided to obtain the effective dispensing area and the dispensing avoidance area.

[0045] Specifically, according to the position, size and arrangement form of the pads in the encapsulation structure, the dispensing area is accurately classified, and the pad avoidance area and the effective dispensing area are divided; among them, the pad avoidance area refers to the area where dispensing is not allowed, usually the metal pads for electrical connection and their surrounding safety buffer areas, to prevent the glue from covering and affecting the welding or causing short circuits; while the effective dispensing area is the range of the encapsulation space where glue deposition is allowed, mainly concentrated in non-conductive areas such as between pads and at the encapsulation edge. For example, for an RGB LED bead with a three-pad circular layout, the system will mark the central area and the rectangular area on the pad connection line as the avoidance area through coordinate calibration and encapsulation pattern analysis, and the remaining area as the effective area. This classification not only achieves high-precision avoidance control of the dispensing operation, but also avoids glue contamination of the pads, improves the stability of subsequent welding quality and optoelectronic performance, and is the basis for realizing a highly reliable encapsulation process.

[0046] According to the effective dispensing area and the pad avoidance area, plan the dispensing path to obtain the dispensing path coordinate information;

[0047] Specifically, within the effective dispensing area, an optimized dispensing trajectory is generated according to the contour of the avoidance area and the encapsulation shape, and the dispensing path coordinate information is output. The dispensing path coordinate information includes the exact path nodes and order of the dispensing needle moving in the X-Y plane, usually arranged in a curve, broken line or dot matrix form to cover all effective areas and ensure uniform dispensing; for example, in the case of avoiding the three pads distributed in a "pin" shape, the path planning can adopt an enclosed U-shaped path or a peripheral surrounding path, and automatically plan the start-stop points and turning point coordinates of each segment of the path. This path planning ensures the complete coverage of the dispensing area and the precise avoidance of the pad area, reduces the errors and inconsistencies caused by manual path setting, and at the same time improves the automation encapsulation efficiency, providing a standardized input basis for subsequent closed-loop regulation.

[0048] According to the encapsulation height parameter in the preset encapsulation size information, adjust the vertical height of the dispensing to obtain the dispensing height value;

[0049] Specifically, the encapsulation height parameter usually refers to the thickness or height value of the light source housing or substrate, which is an important factor determining the descent distance of the dispensing head and the dispensing accuracy. According to the encapsulation height parameter in the preset encapsulation size information, automatically set the appropriate height value between the dispensing head and the workpiece surface, usually between 0.1mm and 0.5mm, to ensure accurate glue landing and natural colloid formation. For example, for a 5050 LED bead with an encapsulation height of 1.6mm, set the needle height to 1.7mm to achieve non-contact dispensing and avoid the needle hitting the surface of the component. Through height adjustment, the dispensing accuracy can be significantly improved, preventing glue splashing or uneven accumulation, and at the same time ensuring the operation safety of the equipment and the consistency of the product, which is one of the key parameters for high-precision encapsulation control.

[0050] Based on the dispensing path coordinates and the dispensing height, combined with the preset adhesive layer thickness and the preset dispensing speed of the dispensing equipment, the dispensing speed and dispensing amount are calculated.

[0051] Specifically, by comprehensively considering the dispensing path coordinates, dispensing height, preset adhesive layer thickness, and preset dispensing speed of the dispensing equipment, the optimal dispensing speed and dispensing volume parameters are calculated to achieve high-precision and highly consistent adhesive deposition. The dispensing path coordinates determine the needle's movement trajectory and path length; the dispensing height affects the accuracy of the adhesive deposition point and the diffusion radius; and the preset adhesive layer thickness is set according to the light source encapsulation requirements, such as for moisture protection, enhancing optical lens effects, or fixing the light source position. These parameters are input into the model, and combined with the dispensing head's dispensing characteristics, a matching needle movement speed (e.g., 3 mm / s) and dispensing volume per unit time (e.g., 0.02 ml / s) are calculated. For example, for a 10 mm long path with a target adhesive layer thickness of 0.3 mm, a reasonable movement speed and dispensing rate are dynamically matched based on the adhesive viscosity and equipment response characteristics to ensure uniform adhesive distribution without dispensing breaks or overflow. The introduction of this calculation step can significantly improve dispensing accuracy and consistency, avoid deviations caused by manual parameter adjustment, and achieve adaptive dispensing control based on structural and process requirements.

[0052] In one embodiment, please refer to Figure 3 The step of calculating the dispensing speed and dispensing amount based on the dispensing path coordinate information and the dispensing height value, combined with the preset adhesive layer thickness and preset dispensing speed, includes:

[0053] Based on the dispensing path coordinate information, the total length of the dispensing path is calculated to obtain the total length of the dispensing path;

[0054] Specifically, by analyzing each trajectory point recorded in the dispensing path coordinate information, geometric algorithms (such as line segment distance accumulation or spline curve fitting) are used to calculate the length of the entire dispensing path, thus obtaining the total length of the complete dispensing path. The dispensing path coordinate information typically consists of multiple consecutive coordinate points, reflecting the movement trajectory of the dispensing head in the XY plane. This step allows for understanding the path span of the entire encapsulation area, providing a foundation for subsequent glue volume and speed calculations. For example, for complex encapsulation structures, such as irregular ring or polygonal pad avoidance paths, accurate path length calculation can prevent excessive or insufficient glue volume, thereby improving dispensing uniformity and encapsulation reliability.

[0055] Based on the dispensing height value and the preset adhesive layer thickness, the dispensing volume required per unit path length is calculated to obtain the adhesive amount per unit path.

[0056] Specifically, spatial volume is estimated using the dispensing height (the vertical distance between the dispensing needle and the encapsulation surface) and the preset adhesive layer thickness (the thickness of the target adhesive layer), thereby deriving the adhesive volume required per unit path length. The adhesive volume per unit path is considered the amount of adhesive dispensed per millimeter or per pixel along the path, taking into account the actual spread of the adhesive on the encapsulation surface after deposition; for example, a larger dispensing height may lead to a larger adhesive diffusion area, which will correspondingly reduce the adhesive volume per unit path to prevent adhesive overflow. This calculation allows dispensing to better match the target thickness requirements, effectively ensuring the uniformity of the encapsulation adhesive layer and the consistency of optical performance.

[0057] The amount of adhesive dispensed is calculated based on the amount of adhesive dispensed per unit path and the total length of the dispensing path.

[0058] Specifically, the total adhesive amount per unit path is multiplied by the total length of the dispensing path to obtain the total adhesive amount required for the light source encapsulation task. This dispensing amount is the target amount the equipment needs to achieve in subsequent dispensing processes, directly affecting the quantitative settings of the dispensing control module. For example, for longer paths or complex encapsulation structures, the dispensing amount will increase accordingly. Sufficient adhesive can be prepared in advance, and the equipment dispensing program can be optimized to avoid problems such as dispensing interruptions or incomplete encapsulation due to insufficient adhesive. This step can significantly improve adhesive utilization efficiency and reduce material waste.

[0059] The dispensing speed is obtained by calculating the moving speed of the dispensing head based on the unit path glue volume and the preset dispensing speed.

[0060] Specifically, based on the amount of adhesive required per unit path and the dispensing speed supported by the equipment (i.e., the volume of adhesive that can be output per second), the appropriate moving speed of the dispensing head can be deduced. If the amount of adhesive required per unit path is large, but the dispensing speed is limited, the moving speed of the dispensing head will be slowed down to ensure sufficient adhesive coverage; conversely, the speed can be appropriately increased to improve efficiency. For example, precision white light encapsulation areas require higher adhesive thickness, so the moving speed should be lower to ensure uniform deposition. By dynamically adjusting the dispensing speed, real-time matching of adhesive volume and path movement is achieved, significantly improving encapsulation consistency and finished product yield.

[0061] The initial dispensing parameters are determined based on the dispensing path coordinates, the dispensing speed, the dispensing height, and the dispensing amount.

[0062] Specifically, based on four core parameters—dispensing path coordinates, dispensing speed, dispensing height, and dispensing volume—a preliminary model of the entire dispensing process is constructed to determine initial dispensing parameters. These initial dispensing parameters include key execution commands such as the dispensing head's movement trajectory, movement speed, dispensing rhythm, and height control strategy. Dispensing path coordinates define the dispensing head's movement path in three-dimensional space; dispensing speed ensures the dispensing rhythm is synchronized with the path movement; dispensing height controls the gap between the needle and the encapsulation surface, thus affecting the accuracy of adhesive deposition; and dispensing volume represents the total material distribution target that the dispensing system must achieve. Taking the encapsulation of RGB three-color LEDs as an example, different color blocks may differ in path, thickness, and optical requirements. Therefore, through this multi-parameter fusion modeling, differentiated settings for dispensing strategies in different areas can be achieved, thereby improving the accuracy and adaptability of the initial dispensing scheme and laying the foundation for subsequent closed-loop parameter tuning and luminous performance feedback optimization.

[0063] Based on the initial dispensing parameters, the iridescent light source is subjected to initial dispensing and die bonding, and the luminous performance of the iridescent light source after die bonding is tested to obtain the test values ​​of the preset luminous parameters.

[0064] Specifically, the process begins with dispensing the iridescent light source according to initial dispensing parameters, accurately depositing the encapsulating adhesive into the designated effective area to meet the requirements of structural fixation and optical control. After dispensing, the process proceeds to the die-bonding stage, where the adhesive is cured by heating or ultraviolet light, ensuring a stable connection between the chip and the package structure and providing a reliable foundation for subsequent performance testing. Once the adhesive has cured, the iridescent light source is tested for luminous performance, obtaining the measured values ​​of key optical parameters such as brightness, color coordinates, and luminous flux under preset driving conditions such as current and voltage. This process achieves an effective connection from dispensing to testing, providing a basis for subsequent parameter optimization and improving packaging consistency and luminous quality.

[0065] In one embodiment, please refer to Figure 4 The step of performing initial dispensing and die bonding on the iridescent light source according to the initial dispensing parameters, and then testing the luminous performance of the iridescent light source after die bonding to obtain the detection values ​​of the preset luminous parameters includes:

[0066] Obtain the preset forward drive current value and reverse bias voltage value;

[0067] Specifically, standard electrical driving conditions matching the type of iridescent light source are extracted from a pre-set database or empirical parameter library. These include forward drive current values ​​and reverse bias voltage values. The forward drive current value is the current required for the light source to operate normally, used to excite LEDs or other light-emitting units to produce light. The reverse bias voltage value is the voltage applied when testing its reverse electrical characteristics, used to evaluate the reverse leakage current of the device. By obtaining these standard test electrical conditions, the consistency and comparability of subsequent tests can be ensured, which helps to establish a unified evaluation standard.

[0068] Using the forward drive current value as a test condition, the forward voltage detection value, luminous brightness detection value, and luminous detection wavelength of the target power supply are obtained.

[0069] Specifically, a forward driving current is applied to the packaged RGB LED to simulate its actual operating state. Under this driving condition, the forward voltage value (i.e., voltage drop when conducting), luminance (in cd or lm, reflecting light output intensity), and emission wavelength (representing color characteristics) exhibited by the target LED are collected using testing equipment. For example, for an RGB LED, the main emission wavelengths and corresponding luminance of the red, green, and blue channels can be measured separately. This process enables precise evaluation of key performance characteristics such as photoelectric conversion efficiency and color shift.

[0070] Using the reverse bias voltage value as a test condition, the reverse leakage current detection value of the target power supply is obtained.

[0071] Specifically, under conditions of no light output, a reverse bias voltage is applied to the target light source to evaluate its reverse conduction performance, i.e., the leakage current of the device in its non-operating state. Ideally, light sources such as LEDs should have almost no current flowing through them under reverse bias; therefore, the level of leakage current directly reflects the electrical integrity and insulation quality of the chip and its package. If an abnormally high leakage current is detected, it may indicate chip defects, improper dispensing, or a short circuit in the package, helping to identify potential failure hazards early.

[0072] The detection values ​​of the preset luminescence parameters are determined based on the forward voltage detection value, luminescence brightness detection value, luminescence detection wavelength, and reverse leakage current detection value.

[0073] Specifically, the four key test indicators mentioned above are summarized to form the current sample's luminescence performance test value, which is then compared with the preset target value. These test values ​​not only cover electrical characteristics (such as forward voltage and reverse leakage current) but also optical performance (such as brightness and emission wavelength), comprehensively reflecting the impact of dispensing and die bonding quality on the luminescence effect. Through this comprehensive evaluation, the system can determine whether the current packaging parameters meet the standards, providing a quantitative basis for subsequent dispensing parameter optimization or anomaly analysis, thereby achieving precise closed-loop control based on performance feedback.

[0074] Based on the deviation between the detected value and the target value of the preset luminescence parameter, the initial dispensing parameters are adjusted to obtain the target dispensing parameters;

[0075] Specifically, the detected luminescence performance parameters (such as forward voltage, brightness, wavelength, and leakage current) are compared with preset target performance parameters, and the deviation between the two is calculated. If the deviation exceeds the acceptable range, the system will analyze the possible dispensing problems based on the type and trend of the deviation (such as insufficient dispensing leading to reduced brightness, uneven adhesive layer causing wavelength shift, etc.), and automatically adjust the initial dispensing parameters accordingly, such as modifying the dispensing speed, adhesive amount, and path coverage area, thereby generating more optimized target dispensing parameters. This performance feedback-based adjustment mechanism can improve the adaptability and accuracy of dispensing, and achieve dynamic optimization of the light source packaging performance.

[0076] In one embodiment, please refer to Figure 5 Before adjusting the initial dispensing parameters based on the deviation between the detected value and the preset value to obtain the target dispensing parameters, the method further includes:

[0077] Based on the light source type of the iridescent light source, target values ​​of preset luminescence parameters are obtained, wherein the target values ​​include a target value for forward voltage, a target value for luminescence brightness, a target wavelength for luminescence, and a target value for reverse leakage current.

[0078] Specifically, the first step is to identify the type of the RGB light source being processed, such as RGB packaged LEDs, white LEDs, or multi-chip integrated LEDs. Different types of light sources have different target luminous performance parameters due to variations in their internal chip structure, electrode layout, and material properties. Ideal luminous performance indicators corresponding to this light source type are retrieved from the database as target values, including: target forward voltage (representing the voltage the chip should exhibit under forward drive), target luminous intensity (representing the luminous intensity under normal drive), target wavelength (representing the dominant wavelength value that the color output should achieve), and target reverse leakage current (representing the minimum leakage current behavior that should exist under reverse bias). This step provides a benchmark for subsequent error assessment and dispensing parameter adjustment.

[0079] The forward voltage deviation value is calculated based on the forward voltage target value and the forward voltage detection value.

[0080] Specifically, the voltage deviation is determined by comparing the forward voltage detection value obtained after packaging testing with the target voltage value for that light source type. For example, if the target voltage is a certain value, but the actual detection value is higher, it may indicate problems such as excessive adhesive thickness, poor electrode connection, or increased thermal resistance. This deviation value is an important indicator for evaluating the consistency of electrical performance and can be used to determine the compatibility of the packaging process.

[0081] The luminance deviation value is calculated based on the target luminance value and the detected luminance value.

[0082] Specifically, the difference between the target brightness and the measured brightness is calculated. For example, if the measured brightness is lower than expected, it may be due to problems such as uneven dispensing, adhesive material obstruction, insufficient die bonding precision, or impurities in the encapsulation. This deviation helps determine whether the dispensing coverage is appropriate and whether it affects light output, thus providing feedback for adjusting the amount of adhesive, path density, or thickness, effectively improving product consistency and yield.

[0083] The emission deviation wavelength is calculated based on the emission target wavelength and the emission detection wavelength;

[0084] Specifically, the wavelength deviation value is obtained by comparing the target wavelength with the actual detected main emission wavelength. For example, the target main wavelength of a blue LED may be a certain nanometer value, but the actual measured wavelength is longer or shorter, reflecting the interference of the colloid material on the spectrum, chip position error, or scattering problems in the light channel during the encapsulation process. This deviation value can be used as a basis for adjustments such as dispensing path optimization (e.g., avoiding critical light paths) and colloid selection (e.g., low absorption materials).

[0085] The reverse leakage current deviation value is calculated based on the target value of the reverse leakage current and the detected value of the reverse leakage current.

[0086] Specifically, the electrical insulation performance of the packaged device is determined by comparing the target reverse leakage current value (which is generally low) with the measured value. If the measured leakage current is much higher than the target, it may indicate adhesive leakage, lead short circuit, or contamination during the dispensing process. This deviation can guide the system to detect whether the dispensing is excessive or leads to abnormal conductive path connections, thus helping to improve the overall electrical reliability of the device.

[0087] The deviation value is determined based on the forward voltage deviation value, the luminous brightness deviation value, the luminous wavelength deviation value, and the reverse leakage current deviation value.

[0088] Specifically, the above four types of deviation data are aggregated and analyzed using a weighted model or a rule-matching model to quantitatively assess the overall degree of deviation. This deviation value can be understood as the degree to which the overall luminescent performance deviates from the expected target, and is used to drive the adaptive optimization and adjustment of dispensing parameters. Through this closed-loop evaluation mechanism, the system can accurately identify key factors affecting packaging quality, improving the accuracy of automated packaging and product consistency.

[0089] In one embodiment, adjusting the initial dispensing parameters based on the deviation between the detected value and the target value of the preset luminescence parameters to obtain the target dispensing parameters includes:

[0090] The positive voltage deviation value, the luminance deviation value, and the luminance deviation wavelength are classified respectively to determine the deviation value corresponding to each optical channel;

[0091] Specifically, a multi-color light source typically contains multiple optical channels (such as R, G, and B channels), each representing the light emitted by a different color chip. Therefore, each channel is analyzed independently. The previously acquired overall deviation data is categorized by channel, assigning them to the corresponding red, green, and blue light channels to determine the deviation value for each channel. For example, the voltage deviation, brightness deviation, and wavelength deviation values ​​of the red light channel are managed separately from those of the green and blue light channels. This categorization method facilitates the system's accurate identification of the specific luminous state of each sub-channel, enabling targeted analysis and optimization of the dispensing quality or positional consistency of each chip.

[0092] Obtain the preset forward voltage tolerance range, luminance tolerance range, and luminance wavelength tolerance range for each optical channel, and obtain the preset maximum reverse leakage current.

[0093] Specifically, performance tolerance ranges set for different optical channels are extracted from the database, that is, the allowable deviation range of voltage, brightness, and wavelength for each channel. For example, the brightness of the red light channel may be allowed to fluctuate within a small range, while the wavelength deviation cannot exceed a certain nanometer range. At the same time, the maximum allowable reverse leakage current uniformly applicable to the entire device is also extracted. The purpose of obtaining these tolerance ranges is to establish a set of objective testing standards, so that the judgment process has a clear basis and facilitates automated screening.

[0094] Select any target optical channel among the optical channels. If the forward voltage deviation value corresponding to the target optical channel is not within the forward voltage tolerance range corresponding to the target optical channel, and / or the luminous brightness deviation value corresponding to the target optical channel is not within the luminous brightness tolerance range corresponding to the target optical channel, and / or the luminous wavelength deviation value corresponding to the target optical channel is not within the luminous wavelength tolerance range corresponding to the target optical channel, and / or the reverse leakage current deviation value is greater than the maximum value of the reverse leakage current, then it is identified as luminous abnormality.

[0095] Specifically, the detection value of each optical channel is compared one by one with its corresponding preset tolerance range to determine if any anomaly exists. If the forward voltage deviation value corresponding to any target optical channel is not within the forward voltage tolerance range corresponding to the target optical channel, and / or the luminous brightness deviation value corresponding to the target optical channel is not within the luminous brightness tolerance range corresponding to the target optical channel, and / or the luminous wavelength deviation value corresponding to the target optical channel is not within the luminous wavelength tolerance range corresponding to the target optical channel, and / or the reverse leakage current deviation value is greater than the maximum value of the reverse leakage current, then the luminous performance of that channel is considered abnormal. For example, although the brightness of the blue light channel is normal, if its wavelength deviates too far, it may cause visual color difference; or although the wavelengths of the three channels are normal, if the overall leakage current is too large, it may also affect stability. By comparing one by one and verifying each item, the anomaly identification has high accuracy and high robustness.

[0096] When an abnormal luminescence is detected, the initial dispensing parameters are adjusted to obtain the target dispensing parameters.

[0097] Specifically, once an abnormal luminescence is detected, a dispensing parameter adjustment mechanism is triggered. This adjustment is based on the deviation trend exhibited by the abnormal channel. For example, if the wavelength of a certain channel is generally longer, it means that the dispensing thickness or position is too thick or off-center; or if the brightness is low, it means that too much light-blocking adhesive or air bubbles are interfering with the luminescence channel. Through attribution analysis of these deviation types, parameters such as dispensing path coordinates, dispensing speed, and dispensing height are reset to achieve a dispensing effect that better matches the target values ​​in subsequent production. This process establishes a closed-loop mechanism of detection-feedback-correction, which helps improve product consistency and the stability of luminescence quality.

[0098] In one embodiment, please refer to Figure 6 When an abnormal luminescence is detected, adjusting the initial dispensing parameters to obtain the target dispensing parameters includes:

[0099] If the forward voltage deviation value corresponding to the target optical channel is not within the forward voltage tolerance range corresponding to the target optical channel, then reduce the dispensing height value to obtain the target dispensing height value.

[0100] Specifically, forward voltage deviation is often related to the thermal or electrical conductivity between the chip and the adhesive. When the dispensing height is high, the adhesive forms a thicker insulating layer between the chip and the substrate, which may affect the chip's heat dissipation efficiency and current path formation during power-on, leading to an increase or shift in the forward voltage. By reducing the dispensing height, i.e., bringing the dispensing head closer to the substrate, the adhesive layer thickness can be reduced while maintaining adhesive coverage, thereby improving thermal conductivity and electrical connection between the chip and the package structure, ultimately achieving fine-tuning control of voltage deviation. This method does not require changes to materials or large-scale structures; rapid response and compensation can be achieved simply by adjusting process parameters, improving production line flexibility.

[0101] If the luminance deviation value corresponding to the target light channel is not within the luminance tolerance range corresponding to the target light channel, increase the dispensing amount to obtain the target dispensing amount value.

[0102] Specifically, if the luminance deviation value corresponding to the target optical channel is not within the luminance tolerance range of the target optical channel, one common reason is uneven coverage or insufficient adhesive thickness during the dispensing process. This leads to reduced diffuse reflection of light within the encapsulating adhesive, thereby reducing overall light extraction efficiency. By appropriately increasing the dispensing amount, the uniformity and integrity of the adhesive above the chip can be improved, creating a more ideal optical encapsulation environment. Good adhesive filling enhances the light shaping capability in the chip's light extraction path, increasing light concentration and transmittance, thus improving brightness. Furthermore, in multi-chip arrays, appropriately increasing the dispensing amount also helps to offset minor mounting height errors, improving luminous consistency. This strategy optimizes optical performance through quantity control, offering advantages of high compatibility and low intervention.

[0103] If the emission deviation wavelength corresponding to the target optical channel is not within the emission wavelength tolerance range corresponding to the target optical channel and / or the reverse leakage current deviation value is greater than the preset maximum reverse leakage current value, then the dispensing path coordinate information is adjusted to obtain the target dispensing path coordinate information.

[0104] Specifically, deviations in emission wavelength are often related to chip stress, uneven heat dissipation, or the distribution of colloidal optical properties. If the emission wavelength deviation corresponding to the target optical channel is outside the tolerance range of the emission wavelength corresponding to the target optical channel and / or the reverse leakage current deviation is greater than the preset maximum reverse leakage current, the high reverse leakage current may originate from short circuit hazards or electrical contamination caused by chip edge stress, dispensing offset, etc. Such problems require more in-depth dispensing position adjustments. By optimizing the dispensing path coordinate information, such as adjusting the start or end coordinates, optimizing the relative position of the adhesive line and the chip center, or appropriately bypassing the edge of the critical light-emitting area, the adhesive distribution area can be precisely controlled, thereby reducing stress concentration, improving packaging consistency, and enhancing the electrical insulation of the device. This type of coordinate-level fine-tuning scheme has extremely high controllability, can finely adapt to different chip layouts and sizes, and improve the overall product yield.

[0105] If the luminance deviation value corresponding to the target light channel is not within the luminance tolerance range corresponding to the target light channel, the dispensing speed is adjusted to obtain the target dispensing speed.

[0106] Specifically, abnormal luminance usually reflects problems with light extraction efficiency or encapsulation uniformity. During the dispensing process, dispensing speed is one of the key factors affecting the uniformity of adhesive deposition and the actual adhesive distribution. If the dispensing speed is too fast, it may lead to adhesive tailing, incomplete coverage, or insufficient thickness, thus affecting the light refraction path and reducing luminance. Conversely, a speed that is too slow may cause localized adhesive buildup, resulting in abnormal optical scattering. Therefore, when the brightness deviation exceeds the tolerance range, fine-tuning the dispensing speed can indirectly control the adhesive distribution per unit path, achieving a more uniform and reasonable optical encapsulation effect, thereby calibrating the brightness deviation. This strategy does not involve changing materials or devices; it only requires software-level adjustments to the dispensing process parameters, offering advantages such as fast response and strong adaptability.

[0107] The target dispensing parameters are determined based on the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount.

[0108] Specifically, after adjusting a single parameter (such as speed), it is still necessary to reintegrate all process parameters related to the dispensing of that light channel to form a set of coordinated and highly matched dispensing settings, i.e., the target dispensing parameters. These parameters are interdependent: path coordinate information determines the position and shape of the adhesive distribution, dispensing height affects the accuracy of the adhesive landing point and thickness control, dispensing speed determines the dispensing rhythm per unit time, and dispensing volume ultimately determines the volume of the encapsulated adhesive. Therefore, a new set of balanced parameters needs to be fitted under the new process conditions to ensure that the adhesive can cover the effective area in practical applications while guaranteeing the stability and consistency of luminescent performance. Through this parameter integration process, the chain of deviations caused by adjusting a single parameter can be effectively avoided, achieving overall process optimization.

[0109] In one embodiment, determining the target dispensing parameters based on the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount includes:

[0110] Based on the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount, the iridescent light source is dispensed and die-bonded to determine the encapsulated iridescent light source.

[0111] Specifically, the dispensing operation is first performed based on the acquired dispensing parameters, including the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount. The dispensing path coordinates refer to the precise sequence of nozzle positions on the substrate during the dispensing process, which determines the spatial distribution trajectory of the adhesive. The dispensing speed refers to the rate at which the nozzle moves along the path, affecting the continuity and density of the adhesive deposition. The dispensing height is the vertical distance between the nozzle and the target substrate, directly affecting the droplet shape and diffusion area. The dispensing amount is the output volume of the adhesive per unit time, determining the material coverage thickness within the dispensing area. Multi-color light sources typically refer to LED light sources with multi-channel light emission capabilities that can display dynamic or gradient colors, such as RGB three-color chips or RGBW four-color combination chips. Based on the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount, the purpose of dispensing the iridescent light source is to accurately apply the adhesive to the target area while ensuring that the luminous performance (such as forward voltage and wavelength) is qualified, and to complete die bonding (i.e., fixing the LED chip onto the substrate), thus achieving preliminary encapsulation. This is the foundational step for subsequent luminous efficacy testing and optimization. Before dispensing, a vision positioning system is typically used to identify the coordinate system on the target substrate, and then the nozzle is controlled to move in three dimensions along a predetermined path to accurately apply the adhesive. After dispensing, the die bonding stage begins, where chip fixation and adhesive curing can be completed through hot pressing, cold pressing, or UV curing. This step ensures high initial encapsulation quality and good parameter consistency of the iridescent light source, providing a reliable foundation for subsequent luminous efficacy testing. It also avoids problems such as chip misalignment, color difference, or abnormal brightness caused by uneven adhesive application, improving overall yield and stability.

[0112] Based on the light source type of the packaged iridescent light source, determine the preset luminous effect requirement parameters corresponding to the light source type;

[0113] Specifically, light source types are classified according to the structure and functional characteristics of the iridescent light source, including: such as Figure 7The three-channel breakpoint resume 5V series shown includes a first light-emitting chip 1, which emits light of a specific wavelength (such as red, green, or infrared light) for optical detection, communication, or lighting functions. The first metal electrode pad 2 is a metal pad connected to the first light-emitting chip 1, used to transmit external electrical signals to the chip, providing power or control signals, and also supporting the chip and ensuring electrical connection. The first solder point 3 connects the electrodes of the first light-emitting chip to the electrode pad via metal leads (such as gold or aluminum wire), achieving electrical connection between the chip and the packaged circuit. The first bottom solder foot 4 is a metal lead-out terminal located at the bottom of the device, used to transmit the electrical signals from the first light-emitting chip to an external circuit board (such as a PCB), connecting to the motherboard via reflow soldering. The photosensitive sensor 5 is a device that receives light signals, capable of sensing ambient light or reflected light, used to construct closed-loop feedback control, detect user status, or identify the surrounding environment. Figure 8 The four-channel 5V series shown features a second light-emitting chip 6 that can emit light of different wavelengths (such as red, green, white, and infrared) for multi-band measurement or to enhance detection accuracy. The second solder joint 7 connects the metal leads between the second light-emitting chip and its electrode pads, ensuring a stable electrical path. The second bottom solder pad 8 connects the signal from the second light-emitting chip to external metal solder pads, ensuring normal conduction of the second chip's operating voltage and signal output. Figure 9The three-channel breakpoint resume 12V RGB series shown features a second metal electrode pad 9, a metal surface for connecting the second light-emitting chip, forming a connection point with the external circuit, providing power and control signal interfaces for the chip; a third light-emitting chip 10, an internal chip for emitting light of a specific wavelength (such as red, green, or infrared light), used for optical detection, communication, or lighting functions; a third solder joint 11, a lead solder joint connecting the third light-emitting chip and its metal electrode pad, ensuring stable chip operation and maintaining the integrity of the electrical path; a package housing 12, the external structure of the entire device, for mechanical protection of the internal chip, leads, and electrodes, possessing certain optical transparency, thermal conductivity, and structural stability; and a third bottom solder pad 13, a bottom lead providing electrical connection to the third light-emitting chip, soldered to the main circuit board using surface mount technology, enabling signal transmission and power supply between the chip and the motherboard. Different types of RGB light sources differ significantly in their emission modes, control methods, and expected effects. The 12V RGB series with three-channel breakpoint resume capability refers to each light source module having three independent control channels (red, green, and blue) for RGB, enabling multi-color emission effects. It uses 12V DC power supply. The breakpoint resume function of this series ensures that even if one LED fails or communication is interrupted, subsequent LEDs can still receive signals and operate normally, effectively improving system stability. Due to the strong voltage drop resistance of 12V, it is particularly suitable for large-scale lighting projects, outdoor lighting projects, or advertising signs requiring long wiring distances. The 5V series with three-channel breakpoint resume capability is similar in function and structure to the 12V series, featuring three control channels (red, green, and blue) and breakpoint resume capability, enabling rich color variations and good fault tolerance. However, it uses a 5V low-voltage power supply, which is safer and has a more compact circuit design, making it suitable for short-distance wiring environments. Due to its low power consumption and easy-to-drive characteristics, this type of light source is commonly found in small or sophisticated applications such as indoor intelligent lighting systems, wearable devices, and DIY lighting projects. The four-channel 5V series adds a white light channel (W) to the traditional RGB three-channel system, forming an RGBW structure. This allows it to maintain the dynamic color effect while providing a more realistic and softer white light performance. This four-channel configuration not only enhances color mixing accuracy but also meets the needs of occasions with higher requirements for natural light effects. This series also uses a 5V low-voltage power supply, making it more suitable for delicate and safe electronic environments. It is often used in film and television lighting sets, high-end interior decoration, and ambient lighting for music, where both white and colored light are required. Light effect requirement parameters refer to the requirements for the final light effect performance, including target luminous intensity, target color temperature, and target luminous angle.First, obtain the light source type of the currently packaged iridescent light source, for example, by reading the product code of the packaged iridescent light source; then determine the light source type based on the read product code; then match the pre-set light effect requirement template in the pre-collected light effect template parameter database according to the light source type to determine the light effect requirement parameters corresponding to the light source type. The light effect template parameter database may be derived from experience data, user feedback, or lighting industry standards, etc.

[0114] The luminous efficacy of the packaged iridescent light source is tested to obtain luminous efficacy test parameters;

[0115] Specifically, luminous efficacy testing refers to the process of objectively and quantitatively analyzing the visual luminous effect of a packaged iridescent light source when it is lit. When testing the luminous efficacy of a packaged iridescent light source, a multi-point detection method based on photoresistors or photodiode modules is used to obtain key luminous efficacy testing parameters. The specific method includes: lighting the packaged iridescent light source under standard constant current conditions, and arranging multiple calibrated photosensitive devices in front of it and at different angles to collect light intensity values ​​from different directions, calculating the actual luminous intensity and actual emission angle distribution information; simultaneously, by placing photosensitive elements responding to different wavelengths at these detection points, calculating the actual color temperature of the light source. Using the actual luminous intensity, actual emission angle distribution information, and actual color temperature as luminous efficacy testing parameters, this scheme can quickly output luminous efficacy testing parameters, providing basic data support for subsequent luminous efficacy optimization, ensuring that the iridescent light source achieves the user's expected visual effect in terms of brightness, color, and emission angle.

[0116] The luminous efficacy deviation parameter is calculated based on the luminous efficacy requirement parameter and the luminous efficacy detection parameter.

[0117] Specifically, after obtaining the luminous efficacy requirement parameters and luminous efficacy detection parameters, a comparative analysis is performed on both to calculate the luminous efficacy deviation parameters, which are used to quantify the difference between the current luminous efficacy performance of the iridescent light source and the target requirements. Specifically, firstly, the detection parameters and their corresponding target values ​​are standardized. For example, the luminous intensity is uniformly converted to unit luminous intensity, the color temperature is uniformly converted to Kelvin units, and the emission angle is converted into a distribution function of a set of angle-luminous intensity pairs. Then, error analysis is used to calculate the deviation value: the luminous intensity deviation is expressed as the difference between the actual luminous intensity and the target luminous intensity or as a percentage error; the color temperature deviation is measured by the color temperature drift value or color difference index; the emission angle deviation can be obtained by integrating the difference in angular luminous intensity distribution to obtain an angle deviation score, or by extracting key indicators such as the offset of the main emission direction and the edge attenuation trend. To improve the comprehensive judgment of the overall light effect deviation, the three types of deviation can be assigned weights to calculate a comprehensive deviation score, such as by using a weighted average deviation or a normalized scoring model. The resulting light effect deviation parameters will form a clear set of values, which can be used to determine whether the current light source meets product standards or user needs, and can also serve as a basis for dispensing process optimization or personalized correction. This supports automatic adjustment of dispensing parameters according to different light source types, thereby continuously improving the consistency, aesthetics, and user visual experience of the light source without increasing hardware complexity.

[0118] Based on the light effect deviation parameters and the preset light effect deviation threshold, determine whether it is necessary to fine-tune and optimize the target dispensing path coordinate information, target dispensing speed, target dispensing height value and target dispensing amount.

[0119] Specifically, after obtaining the luminous efficacy deviation parameters, they are compared with preset luminous efficacy deviation thresholds to determine whether there are significant deviations in the encapsulated iridescent light source. Based on this, it is determined whether to fine-tune and optimize the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount. Specifically, firstly, a deviation threshold template matching the current light source type is invoked. This template sets acceptable error ranges for different luminous efficacy dimensions based on product standards, user experience requirements, or historical process experience. For example, brightness deviation does not exceed ±10%, color temperature deviation does not exceed ±300K, and emission angle offset does not exceed ±5 degrees. Then, the current luminous efficacy deviation parameters are compared with these thresholds item by item. If any item exceeds the tolerance range, the encapsulation effect of the light source is determined to be substandard, triggering the fine-tuning mechanism.

[0120] If it is necessary to fine-tune and optimize the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount, then determine the type of light effect deviation based on the light effect deviation parameter.

[0121] Specifically, if fine-tuning and optimization of the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount are required, the luminous efficacy deviation must first be classified to formulate targeted optimization strategies, provided that the dispensing parameters need to be fine-tuned and optimized. The luminous efficacy deviation data is then converted into identifiable luminous efficacy deviation types, including brightness deviation, color temperature deviation, and emission angle deviation. Each deviation type reflects specific problems that may exist during the encapsulation process. Based on the comparison between the acquired luminous efficacy detection parameters and the preset target value, numerical deviations are extracted and categorized according to dimensions. For example: if the actual brightness is significantly lower than the target brightness (e.g., deviation exceeds ±10%), it is identified as a brightness deviation type; if the detected color temperature deviates significantly from the target value (e.g., too cool or too warm exceeding ±300K), it is classified as a color temperature deviation type; if the brightness distribution in different directions detected by the photosensitive device is abnormal, deviating from the target emission angle or exhibiting excessively narrow / wide phenomena, it is judged as an emission angle deviation type. Furthermore, by analyzing multi-dimensional deviation combinations, composite deviation types can be identified. For example, low brightness combined with a narrow emission angle may be attributed to process issues such as insufficient adhesive layer coverage or insufficient encapsulation adhesive height. After classification, the deviation type is passed as input to the subsequent optimization decision module, enabling a linked logic for dispensing parameter correction strategies based on the deviation type. This structure not only improves the system's responsiveness but also makes process adjustments more precise and efficient.

[0122] Based on the light effect deviation type, the target dispensing path coordinate information, target dispensing speed, target dispensing height value, and target dispensing amount are finely adjusted and optimized, and the optimized dispensing path information, dispensing speed, dispensing height value, and dispensing amount are used as the target dispensing parameters.

[0123] Specifically, after identifying the type of luminous efficacy deviation, targeted fine-tuning and optimization of the dispensing process parameters are performed based on this deviation type to reduce key process errors in the final luminous efficacy performance. Specifically, if the deviation is identified as a brightness deviation (e.g., low brightness), insufficient dispensing height or amount leads to inadequate light source encapsulation, which is compensated for by appropriately increasing the target dispensing height and / or target dispensing amount. If the deviation is a color temperature deviation (e.g., too cool or too warm), uneven chip encapsulation thickness and adhesive penetration path deviation result in fine-tuning of the target dispensing path coordinates and target dispensing speed to ensure consistent light refraction across all chips, thereby improving color mixing. All adjustments use fine-grained variations to ensure micro-correction without affecting the overall structure. Finally, the finely tuned and optimized dispensing path, speed, height, and amount are output as new target dispensing parameters and applied to the next encapsulation cycle, achieving closed-loop self-optimization control and significantly improving product consistency and light emission quality.

[0124] In one embodiment, the step of fine-tuning and optimizing the target dispensing path coordinate information, target dispensing speed, target dispensing height value, and target dispensing amount according to the type of light effect deviation, and using the optimized dispensing path information, dispensing speed, dispensing height value, and dispensing amount as the target dispensing parameters, includes:

[0125] If the light effect deviation type is the brightness deviation type, then the actual brightness value and the brightness requirement value are obtained according to the light effect requirement parameter and the light effect detection parameter;

[0126] Specifically, if the luminous efficacy deviation type is a brightness deviation type, then the current actual brightness value and brightness requirement value are obtained based on the luminous efficacy requirement parameter and the luminous efficacy detection parameter. The actual brightness value and the brightness requirement value together constitute the basic data for evaluating luminous efficacy deviation. Both are expressed in a unified brightness unit, and the detection area and the requirement area are ensured to be completely aligned in spatial position to guarantee data consistency and comparability.

[0127] Based on the actual brightness value and the brightness requirement value, calculate the brightness deviation value between the actual brightness and the expected brightness requirement;

[0128] Specifically, the difference between the acquired actual brightness value and the corresponding brightness requirement value is calculated to obtain the brightness deviation value; this deviation value is expressed as ΔL = L_actual - L_target, where L_actual is the actual brightness and L_target is the brightness requirement value. To improve the sensitivity and stability of the adjustment, the brightness deviation value can be further normalized or a weighting factor can be introduced to reflect the sensitivity of the human eye to different brightness changes.

[0129] Based on the brightness deviation value, combined with the preset first brightness deviation threshold and second brightness deviation threshold, the brightness deviation is divided into a mild deviation range and a severe deviation range, wherein the first brightness deviation threshold is less than the second brightness deviation threshold.

[0130] Specifically, to achieve differentiated adjustment for different brightness deviations, two preset brightness deviation thresholds are obtained: a first brightness deviation threshold L_th1 and a second brightness deviation threshold L_th2, where L_th1 < L_th2. When L_th1 < |ΔL| ≤ L_th2, it is determined to be a slight brightness deviation; while when |ΔL| > L_th2, it is considered a severe brightness deviation. This classification provides a basis for the hierarchical execution of the control strategy, ensuring that adjustments at different deviation levels are targeted, energy-efficient, and stable.

[0131] If the range is divided into a slight deviation range, the dispensing adjustment amount is calculated based on the preset linear function model and the brightness deviation value.

[0132] Specifically, when the brightness deviation value is within the slight deviation range, a preset linear function model will be invoked to adjust the deviation accordingly. This linear function model takes the brightness deviation value as input and outputs a dispensing adjustment amount ΔQ, representing the amount of adhesive that should be increased or decreased. For example... ,in This is the linear adjustment coefficient. This linear function model can be obtained through empirical data or prior training, and is suitable for scenarios requiring small adjustments, in order to achieve optimized control with low energy consumption and high response.

[0133] Based on the dispensing adjustment amount, the target dispensing amount and target dispensing height value are adjusted to determine the fine-tuned and optimized dispensing amount and dispensing height value, wherein the dispensing height and dispensing amount maintain a fixed proportional relationship.

[0134] Specifically, after calculating the dispensing adjustment amount ΔQ using the linear function model, the current target dispensing amount is... Adding this to ΔQ yields the finely adjusted and optimized dispensing amount. Simultaneously, the dispensing height H and dispensing volume Q have a fixed proportional relationship (e.g., H = αQ, where α is a preset proportionality constant), and the target dispensing height value is updated synchronously to H′ = αQ′. This strategy of maintaining a positive proportional relationship between height and volume avoids glue overflow or uneven application caused by inconsistent dispensing heights, ensuring a stable and reliable adjustment process.

[0135] If the range is divided into severely biased ranges, the target dispensing amount is non-linearly supplemented according to the exponential function model, and the target dispensing height is synchronously non-linearly adjusted according to the change in dispensing amount, so as to determine the fine-tuned and optimized dispensing amount and the fine-tuned and optimized dispensing height.

[0136] Specifically, if the brightness deviation value exceeds the second brightness deviation threshold (i.e., ΔL>L_th2), the system will enter a severe deviation compensation mode, invoking an exponential function model to non-linearly adjust the dispensing amount; the exponential function form is as follows: Where A is the baseline increment, As an exponential adjustment coefficient, this model can more effectively cope with significant brightness deficiencies and achieve rapid compensation. After the glue volume change value ΔQ is calculated, the dispensing height is simultaneously adjusted based on the nonlinear relationship function H=β√Q between glue volume and height, and updated accordingly. This non-linear adjustment mechanism allows the colloid coverage to more accurately match the actual light-emitting area, avoiding localized over-coating that could lead to color spots or halos.

[0137] If the light effect deviation type is the color temperature deviation type, then the color temperature difference between the actual color temperature value and the color temperature requirement value is obtained according to the light effect requirement parameter and the light effect detection parameter.

[0138] Specifically, if the luminous efficacy deviation type is a color temperature deviation type, then firstly, based on the luminous efficacy requirement parameters and the luminous efficacy detection parameters, the current actual color temperature value (T_actual) and the corresponding target color temperature requirement value (T_target) are extracted. The color temperature deviation value ΔT is then obtained using the difference calculation formula ΔT=T_actual-T_target. This color temperature difference directly reflects the degree to which the current color temperature deviates from the target. This step provides a basic quantitative basis for subsequent color temperature correction strategies and is the first step in achieving precise adjustment.

[0139] The direction of the color temperature deviation is determined based on the color temperature difference value;

[0140] Specifically, after obtaining the color temperature difference value ΔT, its sign and numerical range are further identified to clarify the direction and level of deviation. If ΔT>0, it is determined to be a color temperature deviation in the cool direction, that is, too much cool color component. If ΔT<0, it is a color temperature deviation in the warm direction, that is, too much warm color component. This step ensures that the adjustment is not only directional, but also has the ability to control in stages, preventing over-adjustment or under-adjustment.

[0141] When the color temperature deviation direction is towards the cooler direction, the target dispensing path coordinate information is shifted towards the warmer chip area according to the path offset distance to obtain the fine-tuned and optimized dispensing path coordinate information. The path offset distance is calculated based on the color temperature difference and a preset proportional coefficient.

[0142] Specifically, when the deviation direction is determined to be towards the cooler direction, i.e., ΔT is positive, the target dispensing path coordinates are adjusted to be biased towards the warmer chip region. The specific operation is as follows: Calculate the path offset distance d_offset = k_path × ΔT based on the product of ΔT and the preset proportional coefficient k_path. Then, translate the current target path coordinate point (x, y) to a new coordinate point (x′, y′), where (x′, y′) = (x + dx, y + dy), and (dx, dy) is the offset direction towards the warmer chip region. This strategy increases the proportion of warmer light chips participating in light emission through physical position adjustment, thereby effectively neutralizing the cooler light color temperature and achieving color temperature balance.

[0143] When the color temperature deviation direction is warmer, the target dispensing path coordinate information is shifted towards the cool-colored chip area according to the path offset distance to obtain the fine-tuned and optimized dispensing path coordinate information.

[0144] Specifically, when the color temperature deviation direction is towards the warmer side, i.e., ΔT is negative, it indicates that the cool color component in the current emitting area is insufficient. Similarly, the offset distance d_offset = k_path × |ΔT| is calculated based on |ΔT| and the preset proportional coefficient k_path. However, this time the offset direction is towards the cool color chip area, and the updated coordinate point is (x′, y′) = (x + dx, y + dy), where dx and dy correspond to the offset direction of the cool color area. This fine-tuning of the path coordinates allows more cool color colloid to be applied to the emitting area, effectively enhancing the cool color light output to achieve overall color temperature adjustment.

[0145] Based on the fine-tuned and optimized dispensing path coordinate information, the target dispensing height value is synchronously adjusted to determine the fine-tuned and optimized dispensing height value. The synchronously adjusted dispensing height value is positively correlated with the path offset distance, forming a path-height coupling function.

[0146] Specifically, after obtaining the fine-tuned and optimized dispensing path coordinates, the target dispensing height (H_target) is further adjusted synchronously based on the path offset distance (d_offset). Since path offset implies a slight change in the spatial structure of the dispensing target area (e.g., moving from the chip edge to the center or from the warm / cool boundary to a specific color gamut), the dispensing height needs to be adjusted synchronously to ensure uniform dispensing thickness and consistent light efficiency. To this end, a path-height coupling function H_adj = H_target + k_h × d_offset is constructed, where k_h is the height adjustment coefficient. This model achieves dynamic coordination between path changes and height variations, avoiding new deviations in color temperature or brightness caused by height mismatch.

[0147] The dispensing area change rate is calculated based on the dispensing path offset distance and the dispensing height adjustment value.

[0148] Specifically, when the dispensing path deviates, resulting in a change in height, the effective area of ​​the dispensing region may also change, thus affecting the adhesive distribution density and light output characteristics. The rate of change in dispensing area (S_ratio) caused by the path deviation and height adjustment is calculated using the formula S_ratio=(S_new−S_origin) / S_origin. Here, S_origin is the original dispensing area, and S_new is the adjusted dispensing area. The dispensing area is calculated from the dispensing path deviation distance and the adjusted dispensing height. This rate of change serves as a key indicator for determining whether subsequent speed-linked adjustments are needed, helping to prevent problems such as over-coverage or sparse dispensing.

[0149] When the area change rate is greater than a preset area change rate threshold, the dispensing speed adjustment amount is determined based on the area change rate, wherein the dispensing speed adjustment amount is negatively correlated with the area change rate;

[0150] Specifically, when the area change rate S_ratio exceeds the preset area change rate threshold S_th, it indicates that the geometric characteristics of the dispensing area have changed significantly. At this point, the dispensing speed adjustment is calculated using the negative correlation model V_adj = V_target × (1 − k_v × S_ratio), where V_target is the target dispensing speed and k_v is the speed adjustment coefficient. This strategy is based on the principle that dispensing speed should be reduced when the dispensing area expands and can be moderately accelerated when the dispensing area shrinks, ensuring that the deposition density of the dispensing adhesive remains stable per unit time and avoiding uneven light effect performance caused by adjustments to the movement path.

[0151] The target dispensing speed is adjusted according to the dispensing speed adjustment amount to obtain a fine-tuned and optimized dispensing speed.

[0152] Specifically, finally, based on the dispensing speed adjustment calculated above, the current target dispensing speed is updated synchronously to obtain the fine-tuned and optimized dispensing speed V_opt. This step ensures that the path, dispensing height, and speed form a closed-loop adjustment, comprehensively improving the consistency, uniformity, and control precision of light output during color temperature correction. The entire control process can be embedded into the dispensing control module in real time, forming a closed-loop feedback adjustment system in conjunction with the online light effect detection system to ensure product consistency.

[0153] If it is not necessary to optimize the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount, then the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount shall be used as the target dispensing parameters.

[0154] Based on the target dispensing parameters, dispensing and die bonding processes are performed on light sources of the same type as the iridescent light source to complete the encapsulation process of the iridescent light source.

[0155] Specifically, once the target dispensing parameters are set, they can be applied to the mass production process of the same batch or type of iridescent light source products. Since the manufacturing conditions of the light source chips are basically the same, and the structural parameters and photoelectric characteristics of products of the same model are also largely similar, the target dispensing parameters have good reproducibility and generalization ability. When performing dispensing, using these target dispensing parameters can significantly improve packaging consistency, avoid the random occurrence of problems such as brightness, color difference, and current abnormalities, and thus improve the yield of the entire batch of products' luminous performance. Furthermore, these target dispensing parameters can also serve as an experience template in the process database, providing a rapid initialization solution for subsequent batches or similar models, shortening the debugging cycle, and improving production efficiency.

[0156] Example 2

[0157] Please see Figure 10 Embodiment 2 of the present invention also provides a multi-colored light source packaging device based on dispensing parameter adjustment, the device comprising:

[0158] The packaging structure and pad structure determination module is used to determine the preset packaging size information, preset pad size information and preset pad layout information based on the light source type of the iridescent light source to be packaged.

[0159] The initial dispensing parameter acquisition module is used to acquire the initial dispensing parameters corresponding to the RGB light source type based on the preset package size information, preset pad size information, and preset pad layout information.

[0160] The luminescence parameter detection module is used to perform initial dispensing and die bonding on the iridescent light source according to the initial dispensing parameters, and to detect the luminescence performance of the iridescent light source after die bonding, so as to obtain the detection values ​​of the preset luminescence parameters.

[0161] The dispensing strategy adjustment module is used to adjust the initial dispensing parameters according to the deviation between the detected value and the target value of the preset luminescence parameters, so as to obtain the target dispensing parameters.

[0162] The encapsulation module is used to perform dispensing and die bonding processes on light sources of the same type as the iridescent light source according to the target dispensing parameters, thereby completing the encapsulation process of the iridescent light source.

[0163] Specifically, the RGB light source packaging device based on dispensing parameter adjustment provided in this embodiment of the invention includes: a packaging structure and pad structure determination module, used to determine preset packaging size information, preset pad size information, and preset pad layout information according to the light source type of the RGB light source to be packaged; an initial dispensing parameter acquisition module, used to acquire initial dispensing parameters corresponding to the RGB light source type according to the preset packaging size information, preset pad size information, and preset pad layout information; a light emission parameter detection module, used to perform initial dispensing and die bonding on the RGB light source according to the initial dispensing parameters, and to perform light emission performance detection on the RGB light source after die bonding to acquire the detection value of the preset light emission parameter; a dispensing strategy adjustment module, used to adjust the initial dispensing parameters according to the deviation between the detection value and the target value of the preset light emission parameter to obtain the target dispensing parameter; and a packaging module, used to perform dispensing and die bonding on a light source of the same type as the RGB light source according to the target dispensing parameters to complete the packaging process of the RGB light source. This device introduces a structural parameter identification and matching mechanism based on light source type. First, it automatically determines the corresponding package size, pad size, and pad layout information according to the type of the iridescent light source to be packaged, thereby obtaining suitable initial dispensing parameters and achieving precise matching between dispensing control and the light source structure. Subsequently, it performs luminous performance testing on the light source after initial dispensing, collecting detection values ​​of key luminous parameters such as forward voltage, luminous brightness, wavelength, and reverse leakage current, and comparing the detection values ​​with preset target values ​​to obtain performance deviation information for each optical channel. Based on the deviation results, it dynamically adjusts the dispensing parameters, forming a closed-loop control process of structural parameter driving—dispensing execution—performance testing—parameter feedback—optimization adjustment. Ultimately, it achieves refined control of the iridescent light source dispensing process and ensures consistent luminous performance, improving the accuracy of dispensing control during the packaging process.

[0164] Example 3

[0165] In addition, combined Figure 1 The iridescent light source encapsulation method based on dispensing parameter adjustment described in Embodiment 1 of the present invention can be implemented by an iridescent light source encapsulation device. Figure 11 A schematic diagram of the hardware structure of the iridescent light source packaging device provided in Embodiment 3 of the present invention is shown.

[0166] The iridescent light source packaging device may include a processor and a memory storing computer program instructions.

[0167] Specifically, the processor may include a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement embodiments of the present invention.

[0168] The memory may include a large-capacity storage device for data or instructions. For example, and not limitingly, the memory may include a hard disk drive (HDD), a floppy disk drive, flash memory, an optical disk drive, a magneto-optical disk drive, magnetic tape, or a Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory may include removable or non-removable (or fixed) media. Where appropriate, the memory may be internal or external to a data processing device. In a particular embodiment, the memory is a non-volatile solid-state memory. In a particular embodiment, the memory includes a read-only memory (ROM). Where appropriate, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically rewritable ROM (EAROM), or flash memory, or a combination of two or more of these.

[0169] The processor reads and executes computer program instructions stored in the memory to implement any of the above embodiments of the iridescent light source encapsulation method based on dispensing parameter adjustment.

[0170] In one example, the iridescent light source packaging device may also include a communication interface and a bus. For example, Figure 11 As shown, the processor, memory, and communication interface are connected via a bus and communicate with each other.

[0171] The communication interface is mainly used to enable communication between various modules, devices, units and / or equipment in the embodiments of the present invention.

[0172] A bus, including hardware, software, or both, couples components of the device together. For example, and not limitingly, a bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth Interconnect, a Low Pin Count (LPC) bus, a memory bus, a Microchannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses, or combinations of two or more of these. Where appropriate, a bus may include one or more buses. While specific buses are described and illustrated in embodiments of the invention, the invention contemplates any suitable bus or interconnect.

[0173] In summary, the embodiments of the present invention provide a method, apparatus, and device for packaging iridescent light sources based on dispensing parameter adjustment.

[0174] It should be clarified that the present invention is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of the present invention.

[0175] The functional blocks shown in the above-described structural diagram can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application-specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of this invention are programs or code segments used to perform the required tasks. The programs or code segments can be stored on a machine-readable medium or transmitted over a transmission medium or communication link via data signals carried in a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio frequency (RF) links, etc. Code segments can be downloaded via computer networks such as the Internet, intranets, etc.

[0176] The user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties. Furthermore, the collection, use and processing of the relevant data shall comply with the relevant laws, regulations and standards of the relevant locality, and corresponding operation entry points shall be provided for the user to choose to authorize or refuse.

[0177] It should also be noted that the exemplary embodiments mentioned in this invention describe methods or systems based on a series of steps or apparatus. However, this invention is not limited to the order of the steps described above; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0178] The above description is merely a specific embodiment of the present invention. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the protection scope of the present invention.

Claims

1. A method for encapsulating a multi-colored light source based on dispensing parameter adjustment, characterized in that, The method includes: Based on the light source type of the iridescent light source to be packaged, determine the preset package size information, preset pad size information, and preset pad layout information; Based on the preset package size information, preset pad size information, and preset pad layout information, obtain the initial dispensing parameters corresponding to the RGB light source type; Based on the initial dispensing parameters, the iridescent light source is subjected to initial dispensing and die bonding, and the luminous performance of the iridescent light source after die bonding is tested to obtain the test values ​​of the preset luminous parameters. Based on the deviation between the detected value and the target value of the preset luminescence parameter, the initial dispensing parameters are adjusted to obtain the target dispensing parameters; According to the target dispensing parameters, dispensing and die bonding processes are performed on light sources of the same type as the iridescent light source to complete the encapsulation process of the iridescent light source. The step of obtaining the initial dispensing parameters corresponding to the iridescent light source type based on the preset package size information, preset pad size information, and preset pad layout information includes: Based on the preset package size information, the preset pad size information, and the preset pad layout information, the pad avoidance area and non-pad avoidance area in the dispensing path are divided to obtain the effective dispensing area and the dispensing avoidance area. Based on the effective dispensing area and the dispensing avoidance area, the dispensing path is planned, and the dispensing path coordinate information is obtained. Based on the packaging height parameter in the preset packaging size information, the vertical height of the dispensing is adjusted to obtain the dispensing height value; Based on the dispensing path coordinates and the dispensing height, combined with the preset adhesive layer thickness and the preset dispensing speed of the dispensing equipment, the dispensing speed and dispensing amount are calculated. The initial dispensing parameters are determined based on the dispensing path coordinates, the dispensing speed, the dispensing height, and the dispensing amount.

2. The method for encapsulating a multi-colored light source based on dispensing parameter adjustment according to claim 1, characterized in that, The step of calculating the dispensing speed and dispensing amount based on the dispensing path coordinate information and the dispensing height value, combined with the preset adhesive layer thickness and preset dispensing speed, includes: Based on the dispensing path coordinate information, the total length of the dispensing path is calculated to obtain the total length of the dispensing path; Based on the dispensing height value and the preset adhesive layer thickness, the dispensing volume required per unit path length is calculated to obtain the adhesive amount per unit path. The amount of adhesive dispensed is calculated based on the amount of adhesive dispensed per unit path and the total length of the dispensing path. The dispensing speed is obtained by calculating the moving speed of the dispensing head based on the unit path glue volume and the preset dispensing speed.

3. The method for encapsulating a multi-colored light source based on dispensing parameter adjustment according to claim 1, characterized in that, The step of performing initial dispensing and die bonding on the iridescent light source according to the initial dispensing parameters, and then testing the luminous performance of the iridescent light source after die bonding to obtain the detection values ​​of the preset luminous parameters includes: Obtain the preset forward drive current value and reverse bias voltage value; Using the forward drive current value as a test condition, the forward voltage detection value, luminous brightness detection value, and luminous detection wavelength of the target power supply are obtained. Using the reverse bias voltage value as a test condition, the reverse leakage current detection value of the target power supply is obtained. The detection values ​​of the preset luminescence parameters are determined based on the forward voltage detection value, luminescence brightness detection value, luminescence detection wavelength, and reverse leakage current detection value.

4. The method for encapsulating a multi-colored light source based on dispensing parameter adjustment according to claim 3, characterized in that, Before adjusting the initial dispensing parameters based on the deviation between the detected value and the target value of the preset luminescence parameters to obtain the target dispensing parameters, the method further includes: Based on the light source type of the iridescent light source, target values ​​of preset luminescence parameters are obtained, wherein the target values ​​include a target value for forward voltage, a target value for luminescence brightness, a target wavelength for luminescence, and a target value for reverse leakage current. The forward voltage deviation value is calculated based on the forward voltage target value and the forward voltage detection value. The luminance deviation value is calculated based on the target luminance value and the detected luminance value. The emission deviation wavelength is calculated based on the emission target wavelength and the emission detection wavelength; The reverse leakage current deviation value is calculated based on the target value of the reverse leakage current and the detected value of the reverse leakage current. The deviation between the detected value and the target value of the preset luminescence parameter is determined based on the forward voltage deviation value, the luminescence brightness deviation value, the luminescence deviation wavelength, and the reverse leakage current deviation value.

5. The method for encapsulating a multi-colored light source based on dispensing parameter adjustment according to claim 4, characterized in that, The step of adjusting the initial dispensing parameters based on the deviation between the detected value and the target value of the preset luminescence parameters to obtain the target dispensing parameters includes: The positive voltage deviation value, the luminance deviation value, and the luminance deviation wavelength are classified respectively to determine the deviation value corresponding to each optical channel; Obtain the preset forward voltage tolerance range, luminance tolerance range, and luminance wavelength tolerance range for each optical channel, and obtain the preset maximum reverse leakage current. Select any target optical channel among the optical channels. If the forward voltage deviation value corresponding to the target optical channel is not within the forward voltage tolerance range corresponding to the target optical channel, and / or the luminous brightness deviation value corresponding to the target optical channel is not within the luminous brightness tolerance range corresponding to the target optical channel, and / or the luminous wavelength deviation value corresponding to the target optical channel is not within the luminous wavelength tolerance range corresponding to the target optical channel, and / or the reverse leakage current deviation value is greater than the maximum value of the reverse leakage current, then it is identified as luminous abnormality. When an abnormal luminescence is detected, the initial dispensing parameters are adjusted to obtain the target dispensing parameters.

6. The method for encapsulating a multi-colored light source based on dispensing parameter adjustment according to claim 5, characterized in that, When an abnormal luminescence is detected, the initial dispensing parameters are adjusted to obtain the target dispensing parameters, including: If the forward voltage deviation value corresponding to the target optical channel is not within the forward voltage tolerance range corresponding to the target optical channel, then reduce the dispensing height value to obtain the target dispensing height value. If the luminance deviation value corresponding to the target light channel is not within the luminance tolerance range corresponding to the target light channel, increase the amount of adhesive to obtain the target amount of adhesive. If the emission deviation wavelength corresponding to the target optical channel is not within the emission wavelength tolerance range corresponding to the target optical channel and / or the reverse leakage current deviation value is greater than the preset maximum reverse leakage current value, then the dispensing path coordinate information is adjusted to obtain the target dispensing path coordinate information. If the luminance deviation value corresponding to the target light channel is not within the luminance tolerance range corresponding to the target light channel, the dispensing speed is adjusted to obtain the target dispensing speed. The target dispensing parameters are determined based on the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount.

7. The method for encapsulating a multi-colored light source based on dispensing parameter adjustment according to claim 6, characterized in that, The step of determining the target dispensing parameters based on the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount includes: Based on the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount, the iridescent light source is dispensed and die-bonded to determine the encapsulated iridescent light source. Based on the light source type of the packaged iridescent light source, determine the preset luminous effect requirement parameters corresponding to the light source type; The luminous efficacy of the packaged iridescent light source is tested to obtain luminous efficacy test parameters; The luminous efficacy deviation parameter is calculated based on the luminous efficacy requirement parameter and the luminous efficacy detection parameter. Based on the light effect deviation parameters and the preset light effect deviation threshold, determine whether it is necessary to fine-tune and optimize the target dispensing path coordinate information, target dispensing speed, target dispensing height value and target dispensing amount. If it is necessary to fine-tune and optimize the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount, then determine the type of light effect deviation based on the light effect deviation parameter. Based on the light effect deviation type, the target dispensing path coordinate information, target dispensing speed, target dispensing height value, and target dispensing amount are finely adjusted and optimized, and the optimized dispensing path information, dispensing speed, dispensing height value, and dispensing amount are used as the target dispensing parameters. If it is not necessary to optimize the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount, then the target dispensing path coordinates, target dispensing speed, target dispensing height, and target dispensing amount shall be used as the target dispensing parameters.

8. A color-changing light source packaging device based on dispensing parameter adjustment, characterized in that, The device includes: The packaging structure and pad structure determination module is used to determine the preset packaging size information, preset pad size information and preset pad layout information based on the light source type of the iridescent light source to be packaged. The initial dispensing parameter acquisition module is used to acquire the initial dispensing parameters corresponding to the RGB light source type based on the preset package size information, preset pad size information, and preset pad layout information. The luminescence parameter detection module is used to perform initial dispensing and die bonding on the iridescent light source according to the initial dispensing parameters, and to detect the luminescence performance of the iridescent light source after die bonding, so as to obtain the detection values ​​of the preset luminescence parameters. The dispensing strategy adjustment module is used to adjust the initial dispensing parameters according to the deviation between the detected value and the target value of the preset luminescence parameters, so as to obtain the target dispensing parameters. The encapsulation module is used to perform dispensing and die bonding processes on light sources of the same type as the iridescent light source according to the target dispensing parameters, thereby completing the encapsulation process of the iridescent light source. The step of obtaining the initial dispensing parameters corresponding to the iridescent light source type based on the preset package size information, preset pad size information, and preset pad layout information includes: Based on the preset package size information, the preset pad size information, and the preset pad layout information, the pad avoidance area and non-pad avoidance area in the dispensing path are divided to obtain the effective dispensing area and the dispensing avoidance area. Based on the effective dispensing area and the dispensing avoidance area, the dispensing path is planned, and the dispensing path coordinate information is obtained. Based on the packaging height parameter in the preset packaging size information, the vertical height of the dispensing is adjusted to obtain the dispensing height value; Based on the dispensing path coordinates and the dispensing height, combined with the preset adhesive layer thickness and the preset dispensing speed of the dispensing equipment, the dispensing speed and dispensing amount are calculated. The initial dispensing parameters are determined based on the dispensing path coordinates, the dispensing speed, the dispensing height, and the dispensing amount.

9. A multi-colored light source packaging device, characterized in that, include: At least one processor, at least one memory, and computer program instructions stored in the memory, which, when executed by the processor, implement the method as described in any one of claims 1-7.

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