A uniformity adjusting tool for a magnetron sputtering coater

Abstract

The application belongs to the technical field of magnetron sputtering coating, and particularly relates to a uniformity adjusting tool of a magnetron sputtering coating machine, which comprises coaxial tool seat disc, probe section and probe head; the tool seat disc is disc-shaped; one end of the probe head is conical, and is connected with the center of the tool seat through a plurality of probe sections; when the tool seat disc is detachably installed to the sputtering cathode target material of the sputtering target head of the magnetron sputtering coating machine, the probe head and the probe section are both located on the central axis path of the sputtering coating area of the sputtering target head; so as to facilitate the reference when the sputtering coating area is adjusted. The adjusting tool in the scheme can perform position reference in the stage of adjusting the position and orientation of the sputtering target head, so that the staff can judge the position of the sputtering coating area of the sputtering target head in use through the pointing position of the probe head on the base, which is beneficial to improving the accuracy and efficiency when the position of the sputtering target head is adjusted, and reducing the requirement for the experience of the staff.

Description

Technical Field

[0001] This invention belongs to the field of magnetron sputtering coating technology, specifically relating to a uniformity adjustment tool for a magnetron sputtering coating machine. Background Technology

[0002] In recent years, magnetic thin films and superlattice thin films have attracted much attention due to their excellent electrical, optical, magnetic, mechanical, and thermal properties, making them promising for applications in semiconductors, solar energy, nanodevices, sensors, and lasers. During the processing of semiconductor wafers, magnetron sputtering deposition is often required to meet specific production process requirements.

[0003] However, before using a magnetron sputtering coating machine, the position and orientation of the sputtering target often need to be adjusted. In existing technologies, due to the large distance between the sputtering target and the substrate on which the semiconductor wafer is placed, experienced personnel are generally required to initially adjust the pitch angle and height of the sputtering target. After experimental verification, multiple fine adjustments are made repeatedly to ensure the uniformity of the magnetron coating. During the adjustment process, personnel rely on visual judgment to determine the orientation of the sputtering target and the magnetron sputtering range on the substrate, which introduces significant errors. This requires a high level of experience from the technicians and negatively impacts the accuracy and efficiency of the sputtering target position adjustment. Summary of the Invention

[0004] To address the aforementioned problems in the existing technology, this solution provides a uniformity adjustment tool for a magnetron sputtering coating machine.

[0005] The technical solution adopted in this invention is as follows:

[0006] A uniformity adjustment tool for a magnetron sputtering coating machine includes a coaxial tool holder, probe sections, and a probe head; the tool holder is disc-shaped; one end of the probe head is tapered and connected to the center of the tool holder through several probe sections;

[0007] The magnetron sputtering coating machine includes a sputtering target, a position adjustment mechanism, and a base. The position adjustment mechanism is installed on the cavity wall of the vacuum chamber of the magnetron sputtering coating machine. The sputtering target is installed on the position adjustment mechanism, and its pitch angle and vertical height are adjusted by the position adjustment mechanism. The base is horizontally arranged in the vacuum chamber of the magnetron sputtering coating machine and is used to place wafers. The sputtering coating area of ​​the sputtering target is projected onto the base at a designated position on the base.

[0008] When the tool holder is detachably installed onto the sputtering cathode target of the sputtering target head, both the probe head and the probe section are located on the axial path of the sputtering coating area of ​​the sputtering target head; during the commissioning stage of the magnetron sputtering coating machine, the position of the probe head on the base is adjusted to provide a position reference for the adjustment of the sputtering coating area.

[0009] As an alternative or supplement to the above structure: the position adjustment mechanism includes a mounting flange, a height adjuster, a pipe seat, an upper adjustment seat, an angle adjustment rod, and a lower adjustment seat;

[0010] The mounting flange is fixedly connected to the cavity wall of the vacuum chamber of the magnetron sputtering coating machine; the tube seat can move through the mounting flange and its vertical movement is controlled by a height adjuster; the upper adjusting seat is located at the lower end of the tube seat, and the lower adjusting seat is located at the handle end of the sputtering target head; the upper adjusting seat and the lower adjusting seat are rotatably connected; the two ends of the angle adjusting rod have threads with opposite directions, and the two ends of the angle adjusting rod are threadedly connected to the upper adjusting seat and the lower adjusting seat respectively.

[0011] As an alternative or supplement to the above structure: a rotatable upper rotating rod is provided on the side of the upper adjusting seat, and a rotatable lower rotating rod is provided on the side of the lower adjusting seat; the upper and lower ends of the angle adjusting rod are respectively threaded to the middle of the upper rotating rod and the lower rotating rod.

[0012] As an alternative or supplement to the above structure: the upper end of the tube seat is equipped with a power inlet connector, and the wires connected to the sputtering target head are connected to the outside through the power inlet connector, and the wires are routed through the cavity of the tube seat.

[0013] As an alternative or supplement to the above structure: a corrugated pipe is provided between the lower end of the tube seat and the sputtering target head, and the wire is also routed through the corrugated pipe.

[0014] As an alternative or supplement to the above structure: the mounting flange is provided with a target surface air inlet connector, which is connected to an argon gas source and is used to inject argon gas into the magnetron sputtering coating machine.

[0015] As an alternative or supplement to the above structure: the sputtering cathode end of the sputtering target head is provided with a target baffle, which is controlled to rotate by a baffle adjustment mechanism and rotates on a parallel surface to the end face of the sputtering cathode end of the sputtering target head.

[0016] As an alternative or supplement to the above structure: the baffle adjustment mechanism includes a swing cylinder, an upper swing telescopic rod, a universal connector, a lower swing control rod, and an upper swing control rod; the swing cylinder is mounted on the outside of the mounting flange via a cylinder mounting seat; the upper end of the upper swing control rod is connected to the piston rod of the swing cylinder, and the lower end is slidably connected to the upper swing telescopic rod; the lower swing control rod is rotatably disposed on the outside of the sputtering target head, the upper end of the lower swing telescopic rod is connected to the upper swing telescopic rod via a universal connector, and the lower end is connected to the target baffle; the universal connector is located on the rotation axis of the sputtering target head.

[0017] As an alternative or supplement to the above structure: the sputtering target head is provided with an anode cover, and when the target baffle rotates to the sputtering cathode target of the sputtering target head, the target baffle and the cover opening of the anode cover fit together.

[0018] As an alternative or supplement to the above structure: one end of the probe section has a threaded post and the other end has a threaded hole, and the tool seat disk and the probe section, adjacent probe sections, and the probe section and the probe head are connected by threads.

[0019] The beneficial effects of this invention are as follows: The adjustment tool in this solution can provide a position reference. During the stage of adjusting the position and orientation of the sputtering target head, the sputtering cathode target material installed on the sputtering target head allows the tip of the adjustment tool to point towards the base. This makes it convenient for the operator to determine the position of the sputtering coating area of ​​the sputtering target head during use by using the pointing position of the probe head on the base. This helps to improve the accuracy and efficiency of sputtering target head position adjustment and reduces the requirements for operator experience. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this scheme or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0021] Figure 1 This is a structural diagram of the adjustment tool in this solution;

[0022] Figure 2 This is a 3D view showing the usage status of the adjustment tools in this solution;

[0023] Figure 3 This is a side view showing the usage status of the adjustment tool in this solution;

[0024] Figure 4 This is another side view of the usage status of the adjustment tool in this solution.

[0025] In the diagram: 1-Base; 2-Adjustment tool; 201-Tool seat plate; 202-Probe section; 203-Probe head; 3-Sputtering target head; 4-Target baffle; 5-Mounting flange; 6-Cylinder mounting seat; 7-Height adjuster; 8-Swing cylinder; 9-Power connector; 10-Upper adjustment seat; 11-Angle adjustment rod; 12-Lower adjustment seat; 13-Target surface air inlet connector; 14-Pipe seat; 15-Upper swing telescopic rod; 16-Universal connector; 17-Lower swing control rod; 18-Upper swing control rod. Detailed Implementation

[0026] The technical solutions in this embodiment will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only a part of the embodiments, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments in this solution without creative effort are within the protection scope of this solution.

[0027] Example

[0028] like Figures 1 to 4 As shown in the figure, this embodiment designs a uniformity adjustment tool for a magnetron sputtering coating machine.

[0029] The magnetron sputtering coating machine includes components such as a sputtering target head 3, a position adjustment mechanism, and a base 1.

[0030] The base 1 is a disk-shaped platform. In use, the base 1 is horizontally arranged in the vacuum chamber of the magnetron sputtering coating machine and is used to place wafers.

[0031] The sputtering target 3 is cylindrical and used to sputter and deposit coatings onto the wafers on the substrate 1. Multiple sputtering targets 3 are typically arranged around the perimeter of the substrate 1. When there are two sputtering targets 3, they are usually arranged one on the left and one on the right; when there are three or more sputtering targets 3, they are usually arranged in a ring. Each sputtering target 3 is positioned diagonally above the substrate 1. A laser emitter is located at the center of each sputtering target 3, used to emit laser light diagonally downwards for laser position scanning. An anode and a cathode are also located within the sputtering target 3, with the anode located on the outer periphery of the cathode to facilitate magnetron sputtering. The distance between the sputtering target 3 and the substrate 1 determines the size of the sputtering coating area; the pointing position of the sputtering target 3 towards the substrate 1 determines the position of the wafer for sputtering coating.

[0032] The position adjustment mechanism is installed on the cavity wall of the vacuum chamber of the magnetron sputtering coating machine; the sputtering target 3 is installed on the position adjustment mechanism, and the position adjustment mechanism adjusts the pitch angle and vertical height, thereby changing the distance between the sputtering target 3 and the base 1 and the orientation of the sputtering target 3; the projection point of the sputtering coating area of ​​the sputtering target 3 on the base 1 is located at a designated position on the base.

[0033] The position adjustment mechanism includes components such as mounting flange 5, height adjuster 7, pipe seat 14, upper adjustment seat 10, angle adjustment rod 11, and lower adjustment seat 12.

[0034] The mounting flange 5 is fixedly connected to the cavity wall of the vacuum chamber of the magnetron sputtering coating machine; the tube seat 14 can movably pass through the mounting flange 5 and its vertical movement is controlled by the height adjuster 7; the upper adjusting seat 10 is located at the lower end of the tube seat 14, and the lower adjusting seat 12 is located at the handle end of the sputtering target head 3; the upper adjusting seat 10 and the lower adjusting seat 12 are rotatably connected; the two ends of the angle adjusting rod 11 have threads with opposite directions, and the two ends of the angle adjusting rod 11 are threadedly connected to the upper adjusting seat 10 and the lower adjusting seat 12 respectively. The height adjuster 7 can be a linear module or a vertically arranged lead screw structure.

[0035] The upper adjusting seat 10 has a rotatable upper rotating rod on its side, and the lower adjusting seat 12 has a rotatable lower rotating rod on its side; the upper and lower ends of the angle adjusting rod 11 are threadedly connected to the middle of the upper rotating rod and the lower rotating rod, respectively.

[0036] A power inlet connector 9 is installed at the upper end of the tube base 14. The wires connected to the sputtering target head 3 are connected to the outside through the power inlet connector 9, and the wires are routed through the cavity of the tube base 14. A corrugated pipe is provided between the lower end of the tube base 14 and the sputtering target head 3, and the wires are also routed through the corrugated pipe.

[0037] The mounting flange 5 is provided with a target surface air inlet connector 13, which is connected to an argon gas source and is used to inject argon gas into the magnetron sputtering coating machine.

[0038] The sputtering target head 3 has a target baffle 4 at its sputtering cathode end. The target baffle 4 is controlled to rotate by a baffle adjustment mechanism and rotates on a parallel surface to the sputtering cathode end face of the sputtering target head 3.

[0039] The baffle adjustment mechanism includes a swing cylinder 8, an upper swing telescopic rod 15, a universal connector 16, a lower swing control rod 17, and an upper swing control rod 18. The swing cylinder 8 is mounted on the outside of the mounting flange 5 via a cylinder mounting seat 6. The upper end of the upper swing control rod 18 is connected to the piston rod of the swing cylinder 8, and the lower end is slidably connected to the upper swing telescopic rod 15. The lower swing control rod 17 is rotatably disposed on the outside of the sputtering target head 3. The upper end of the lower swing telescopic rod is connected to the upper swing telescopic rod 15 via the universal connector 16, and the lower end is connected to the target baffle 4. The universal connector 16 is located on the rotation axis of the sputtering target head 3.

[0040] The sputtering target head 3 is covered with an anode cover. When the target baffle 4 rotates to the sputtering cathode target of the sputtering target head 3, the target baffle 4 and the opening of the anode cover fit together.

[0041] The adjustment tool 2 is a detachable component, comprising a coaxial tool base 201, probe sections 202, and a probe head 203. The tool base 201 is disc-shaped; one end of the probe head 203 is tapered and connected to the center of the tool base via several probe sections 202. When the tool base 201 is detachably installed at the sputtering cathode target position of the sputtering target head 3, both the probe head 203 and the probe sections 202 are located on the axial path of the sputtering coating area of ​​the sputtering target head 3. During the commissioning phase of the magnetron sputtering coating machine, the position of the probe head 203 on the base 1 is adjusted to provide a positional reference for adjusting the sputtering coating area. One end of the probe section 202 has a threaded post, and the other end has a threaded hole. Threaded connections are made between the tool base 201 and the probe section 202, between adjacent probe sections 202, and between the probe section 202 and the probe head 203. By increasing or decreasing the number of probe sections 202, the length of the adjustment tool 2 can be changed, so that the probe head 203 is closer to the base 1 without collision.

[0042] When using the uniformity adjustment tool 2 in this solution:

[0043] 1. Rotate the target baffle 4 to a position offset from the sputtering target head 3, and fix the tool seat disk 201 of the adjustment tool 2 onto the sputtering target head 3 so that the probe section 202 and the probe head 203 are aligned with the axial path of the sputtering coating area.

[0044] 2. Manually adjust the left and right rotation position of the tube base 14 so that the sputtering target head 3 is tilted towards the base 1; then tighten the clamp on the lifting end of the height adjuster 7 so that the height adjuster 7 is fixed to the tube base 14; adjust the vertical height of the sputtering target head 3 through the height adjuster 7.

[0045] 3. Then, the technicians rotate the angle adjustment rod 11 to make the lower adjustment seat 12 and the upper adjustment seat 10 rotate relative to each other, thereby changing the pitch position of the sputtering target head 3.

[0046] 4. Repeat steps 2 and 3 above to make the pointing position of the probe head 203 of the adjustment tool 2 on the base 1 consistent with the preset position; when the distance between the probe head 203 and the base 1 is too large, the probe section 202 can be increased; when the probe head 203 may collide with the base 1, the probe section 202 can be reduced.

[0047] 5. After adjusting the vertical and horizontal positions of the sputtering target head 3, disassemble the adjustment tool 2; install the sputtering target and set the parameters for the magnetron sputtering coating machine; then place and transfer the wafer onto the base 1 manually or automatically; evacuate the equipment; and after the specified working conditions are met, start the magnetron sputtering coating process control program according to the specified parameters to complete the sputtering coating operation.

[0048] It should be noted that during the alignment of the sputtering target 3 and the base 1, the sputtering target 3 uses the base 1 as a reference. When a wafer is placed on the base 1 as the workpiece for coating, if its thickness is less than 1 mm, its thickness will not affect the sputtering coating operation, and there is no need to set the control parameters of the magnetron sputtering coating machine separately. However, when other workpieces for coating are placed on the base 1, if their thickness is larger, the control parameters of the magnetron sputtering coating machine need to be adjusted accordingly to avoid the influence of the workpiece thickness on the sputtering coating operation error.

[0049] The above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation; it is neither necessary nor possible to exhaustively list all possible implementations. However, obvious variations or modifications derived therefrom remain within the scope of this technology.

Claims

1. A uniformity adjustment tool for a magnetron sputtering coating machine, characterized in that: It includes a coaxial tool base disk (201), probe sections (202), and probe head (203); the tool base disk (201) is disc-shaped; one end of the probe head (203) is tapered and connected to the center of the tool base through several probe sections (202); The magnetron sputtering coating machine includes a sputtering target (3), a position adjustment mechanism, and a base (1); the position adjustment mechanism is installed on the cavity wall of the vacuum chamber of the magnetron sputtering coating machine; the sputtering target (3) is installed on the position adjustment mechanism and the pitch angle and vertical height are adjusted by the position adjustment mechanism; the base (1) is horizontally arranged in the vacuum chamber of the magnetron sputtering coating machine and is used to place wafers; the sputtering coating area of ​​the sputtering target (3) is projected onto the base (1) at a designated position on the base; When the tool holder (201) is detachably installed onto the sputtering cathode target of the sputtering target head (3), the probe head (203) and the probe section (202) are both located on the axial path of the sputtering coating area of ​​the sputtering target head (3); during the commissioning stage of the magnetron sputtering coating machine, the position of the probe head (203) on the base (1) is adjusted to provide a position reference for the adjustment of the sputtering coating area.

2. The uniformity adjustment tool for a magnetron sputtering coating machine according to claim 1, characterized in that: The position adjustment mechanism includes a mounting flange (5), a height adjuster (7), a pipe seat (14), an upper adjustment seat (10), an angle adjustment rod (11), and a lower adjustment seat (12). The mounting flange (5) is fixedly connected to the cavity wall of the vacuum chamber of the magnetron sputtering coating machine; the tube seat (14) can move through the mounting flange (5) and its up and down movement position is controlled by the height adjuster (7); the upper adjustment seat (10) is set at the lower end of the tube seat (14), and the lower adjustment seat (12) is set at the handle end of the sputtering target head (3); the upper adjustment seat (10) and the lower adjustment seat (12) are rotatably connected; the two ends of the angle adjustment rod (11) have threads with opposite thread directions, and the two ends of the angle adjustment rod (11) are threadedly connected to the upper adjustment seat (10) and the lower adjustment seat (12) respectively.

3. The uniformity adjustment tool for a magnetron sputtering coating machine according to claim 2, characterized in that: The upper adjusting seat (10) is provided with a rotatable upper rotating rod on its side, and the lower adjusting seat (12) is provided with a rotatable lower rotating rod on its side; the upper and lower ends of the angle adjusting rod (11) are respectively threaded to the middle of the upper rotating rod and the lower rotating rod.

4. The uniformity adjustment tool for a magnetron sputtering coating machine according to claim 2, characterized in that: The upper end of the tube seat (14) is equipped with a power inlet connector (9), and the wire connected to the sputtering target head (3) is connected to the outside through the power inlet connector (9), and the wire is routed through the cavity of the tube seat (14).

5. The uniformity adjustment tool for a magnetron sputtering coating machine according to claim 4, characterized in that: A corrugated pipe is provided between the lower end of the tube seat (14) and the sputtering target head (3), and the wire is also routed through the corrugated pipe.

6. The uniformity adjustment tool for a magnetron sputtering coating machine according to claim 2, characterized in that: The mounting flange (5) is provided with a target surface air inlet connector (13), which is connected to an argon gas source and is used to inject argon gas into the magnetron sputtering coating machine.

7. The uniformity adjustment tool for a magnetron sputtering coating machine according to any one of claims 1-6, characterized in that: The sputtering target head (3) is provided with a target baffle (4) at the sputtering cathode end. The target baffle (4) is controlled to rotate by the baffle adjustment mechanism and rotates on the parallel surface of the sputtering cathode end face of the sputtering target head (3).

8. The uniformity adjustment tool for a magnetron sputtering coating machine according to claim 7, characterized in that: The baffle adjustment mechanism includes a swing cylinder (8), an upper swing telescopic rod (15), a universal connector (16), a lower swing control rod (17), and an upper swing control rod (18). The swing cylinder (8) is mounted on the outside of the mounting flange (5) of the position adjustment mechanism via a cylinder mounting seat (6). The upper end of the upper swing control rod (18) is connected to the piston rod of the swing cylinder (8), and the lower end is slidably connected to the upper swing telescopic rod (15). The lower swing control rod (17) is rotatably disposed on the outside of the sputtering target head (3). The upper end of the lower swing telescopic rod is connected to the upper swing telescopic rod (15) via a universal connector (16), and the lower end is connected to the target baffle (4). The universal connector (16) is located on the rotation axis of the sputtering target head (3).

9. The uniformity adjustment tool for a magnetron sputtering coating machine according to claim 8, characterized in that: The sputtering target head (3) is covered with an anode cover. When the target baffle (4) rotates to the sputtering cathode target of the sputtering target head (3), the target baffle (4) and the opening of the anode cover fit together.

10. The uniformity adjustment tool for a magnetron sputtering coating machine according to claim 1, characterized in that: The probe section (202) has a threaded post at one end and a threaded hole at the other end. The tool seat disk (201) and the probe section (202) are connected by threads, as are adjacent probe sections (202) and the probe section (202) and the probe head (203).

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