Storage module and storage module group

Abstract

The invention discloses a storage module and a storage module group, and relates to the technical field of storage equipment. The storage module comprises a main body and a connector, the main body comprises two side surfaces which are oppositely arranged in the thickness direction of the main body and two end surfaces which are connected with the two side surfaces, one of the two end surfaces is a connecting end surface, and the connecting end surface is provided with edge areas which are adjacent to the two side surfaces and a middle area which is positioned between the two edge areas; the connector is arranged on the connecting end face and corresponds to the middle area so as to fix the main body to the substrate; in the thickness direction of the main body, the size of the edge area is A; a is larger than or equal to 3.27 mm and smaller than or equal to 7.81 mm. Thus, the storage module is arranged on the substrate on the basis that the overall structure of the storage module is not adjusted, the distance difference between the storage module and the two adjacent heat dissipation structures can be reduced, and therefore it is ensured that the two heat dissipation structures can effectively dissipate heat of the storage module; the heat dissipation performance of the storage module provided with the storage module in the embodiment of the invention is improved.

Description

Technical Field

[0001] This invention relates to the field of storage device technology, and in particular to a storage module and storage assembly. Background Technology

[0002] As data storage demands increasingly prioritize device durability and reliability, Phase Change Memory (PCM) is gradually emerging as a potential alternative to traditional NAND flash memory modules due to its superior read / write performance and high durability. However, PCM storage media has a significant technical limitation in practical applications: its sensitivity to operating temperature. Specifically, the junction temperature of PCM storage media typically needs to be controlled below 70°C to ensure normal operation, while enterprise-grade NAND chips can generally withstand junction temperatures up to approximately 85°C. This temperature difference means that, under similar power consumption and external heat dissipation conditions, storage modules using PCM media must undergo additional heat dissipation optimization to achieve operating temperature conditions comparable to NAND modules.

[0003] Given the aforementioned temperature constraints, if the power consumption level and external heat dissipation conditions of the storage module remain constant, storage modules composed of PCM storage media must achieve more efficient thermal control to maintain the operating temperature within a reliable range. Therefore, thermal optimization design at the storage module level is urgently needed to effectively reduce its operating temperature, bridging the gap in temperature resistance between PCM and NAND, and thus meeting the higher heat dissipation performance requirements of actual PCM storage media-based storage modules. Summary of the Invention

[0004] The main objective of this invention is to propose a storage module and storage assembly, which aims to solve the problem of poor heat dissipation performance of storage modules composed of PCM storage media.

[0005] To achieve the above objectives, the present invention proposes a storage module disposed between two adjacent heat dissipation structures, the storage module comprising:

[0006] The main body includes two side surfaces disposed opposite each other in its thickness direction and two end surfaces connecting the two side surfaces, one of the two end surfaces being a connecting end surface, the connecting end surface having an edge region adjacent to the two side surfaces and an intermediate region located between the two edge regions; and

[0007] A connector is disposed on the connection end face and corresponding to the middle area to fix the main body to the substrate;

[0008] In the thickness direction of the main body, the dimension of the edge region is A; A satisfies: 3.27mm≤A≤7.81mm.

[0009] In one embodiment, A further satisfies:

[0010] 7.41mm≤A≤7.765mm.

[0011] In one embodiment, in the thickness direction of the body, the distance difference between the centerline of the connector and the two sides of the body is less than or equal to 0.4 mm.

[0012] In one embodiment, the centerline of the connector coincides with the centerline of the body in the thickness direction of the body.

[0013] In one embodiment, the thickness of the main body is 16.8 mm;

[0014] In the thickness direction of the body, the distance between the centerline of the connector and any of the sides of the body is B; wherein B satisfies: 8.2mm≤B≤8.6mm.

[0015] In one embodiment, the connector has a dimension C in the thickness direction of the body; C satisfies: 1.27mm ≤ C ≤ 1.87mm.

[0016] In one embodiment, storage particles are provided on both sides of the main body.

[0017] In one embodiment, the storage particles are phase change storage media.

[0018] In one embodiment, the size of the storage module conforms to the E3.S interface standard.

[0019] This application also proposes a storage module, which includes:

[0020] Back panel;

[0021] Two heat dissipation structures are disposed on the back plate and spaced apart from each other; and

[0022] The aforementioned storage module is disposed on the backplate and located between two heat dissipation structures.

[0023] In the technical solution of this application, by setting the connector connected to the motherboard in the middle area of ​​the connection end face, and controlling the size A of the edge area to satisfy the range of 3.27mm≤A≤7.765mm, the storage module is set on the substrate without adjusting the overall structure of the storage module. This reduces the distance difference between the storage module and two adjacent heat dissipation structures, thereby ensuring that both heat dissipation structures can effectively dissipate heat from the storage module, thus improving the heat dissipation performance of the storage module with the storage module in the embodiment of this application. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the storage module provided in an embodiment of this application;

[0026] Figure 2 This is a schematic diagram of the structure of the storage module provided in an embodiment of this application.

[0027] Explanation of icon numbers:

[0028] 100. Storage module; 1. Main body; 11. Side; 12. Connecting end face; 121. Edge area; 122. Middle area; 2. Connector.

[0029] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0031] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0032] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0033] As data storage demands increasingly prioritize device durability and reliability, Phase Change Memory (PCM) is gradually emerging as a potential alternative to traditional NAND flash memory modules due to its superior read / write performance and high durability. However, PCM storage media has a significant technical limitation in practical applications: its sensitivity to operating temperature. Specifically, the junction temperature of PCM storage media typically needs to be controlled below 70°C to ensure normal operation, while enterprise-grade NAND chips can generally withstand junction temperatures up to approximately 85°C. This temperature difference means that, under similar power consumption and external heat dissipation conditions, storage modules using PCM media must undergo additional heat dissipation optimization to achieve operating temperature conditions comparable to NAND modules.

[0034] Given the aforementioned temperature constraints, if the power consumption level and external heat dissipation conditions of the storage module remain constant, storage modules composed of PCM storage media must achieve more efficient thermal control to maintain the operating temperature within a reliable range. Therefore, thermal optimization design at the storage module level is urgently needed to effectively reduce its operating temperature, bridging the gap in temperature resistance between PCM and NAND, and thus meeting the higher heat dissipation performance requirements of actual PCM storage media-based storage modules.

[0035] In view of this, this application proposes a storage module, Figures 1 to 2 These are some embodiments of this application.

[0036] Please see Figures 1 to 2 In some embodiments of this application, the storage module 100 is disposed between two adjacent heat dissipation structures. That is, when the storage module 100 is applied in the storage module, heat dissipation structures are provided on both sides of the storage module 100 to dissipate heat from the storage module 100, thereby controlling the junction temperature of the storage medium on the storage module 100.

[0037] In some embodiments of this application, two heat dissipation structures are located on opposite sides of the storage module 100 in its thickness direction.

[0038] In some embodiments of this application, the storage module 100 includes a main body 1, which includes two side surfaces 11 disposed opposite to each other in its thickness direction and two end surfaces connecting the two side surfaces 11; wherein, the main body 1 is partially used to dispose of a storage medium; that is, the storage medium can be disposed on at least one of the two side surfaces 11 of the main body 1.

[0039] In some embodiments of this application, one of the two end faces is a connecting end face 12; the connecting end face 12 has an edge region 121 adjacent to the two side faces 11 and an intermediate region 122 located between the two edge regions 121; the storage module 100 further includes a connector 2, which is disposed on the connecting end face 12 and corresponding to the intermediate region 122 to fix the main body 1 to the substrate; wherein, the connector 2 serves as the physical connection and electrical structure between the storage module 100 and the substrate, and by disposing the connector 2 in the intermediate region 122 of the connecting end face 12, the distance difference between the storage module 100 and the two adjacent heat dissipation structures can be reduced when the storage module 100 is mounted on the substrate, thereby reducing the spatial difference in heat dissipation space between the storage module 100 and the heat dissipation structures on both sides, so as to ensure the heat dissipation effect of the two heat dissipation structures on the two side faces 11 of the main body 1.

[0040] Among them, such as Figure 2 As shown in the diagram, the dotted line represents the boundary between the middle region 122 and the edge region 121.

[0041] In some embodiments of this application, the dimension of the edge region 121 in the thickness direction of the body 1 is A; the dimension A satisfies: 3.27mm≤A≤7.765mm.

[0042] In the technical solution of this application, by setting the connector 2 connected to the motherboard in the middle region 122 of the connection end face 12, and controlling the size A of the edge region 121 to satisfy the range of 3.27mm≤A≤7.765mm, the storage module 100 is set on the substrate without adjusting the overall structure of the storage module. This can reduce the distance difference between the storage module 100 and two adjacent heat dissipation structures, thereby ensuring that both heat dissipation structures can effectively dissipate heat from the storage module 100, thereby improving the heat dissipation performance of the storage module with the storage module 100 in the embodiment of this application.

[0043] It is understood that the type of storage module 100 in the embodiments of this application is not limited, and it can be a PCM storage module 100 or a NAND flash memory module, etc.

[0044] It should be noted that if the junction temperature of the storage medium in the storage module 100 is too high, the storage module 100 may suffer from risks such as decreased data reliability, drastically reduced lifespan, decreased performance, and physical damage. The adjustment of the installation position of the connector 2 on the main body 1 in this embodiment can effectively avoid the above risks when the storage module 100 is installed into the storage module.

[0045] In the above embodiments, A satisfies the numerical range of 3.27mm ≤ A ≤ 7.81mm. The value of A can be 3.27mm, 3.5mm, 3.7mm, 3.9mm, 4.1mm, 4.3mm, 4.5mm, 4.7mm, 4.9mm, 5.0mm, 5.1mm, 5.3mm, 5.5mm, 5.7mm, 5.9mm, 6.1mm, 6.3mm, 6.5mm, 6.7mm, 6.9mm, 7.1mm, 7.3mm, 7.5mm, 7.7mm, or 7.81mm. The value of A is not limited to the listed values; other unlisted values ​​within this range are also applicable.

[0046] In some embodiments of this application, A also satisfies: 7.41mm≤A≤7.765mm. That is, by setting the connector 2 connected to the motherboard in the middle region 122 of the connection end face 12, and controlling the size A of the edge region 121 to satisfy the range of 7.41mm≤A≤7.765mm, the storage module 100 can be set on the substrate without adjusting the overall structure of the storage module. This can further reduce the distance difference between the storage module 100 and the two adjacent heat dissipation structures, thereby ensuring that both heat dissipation structures can effectively dissipate heat from the storage module 100, thereby improving the heat dissipation performance of the storage module with the storage module 100 in the embodiments of this application.

[0047] In this embodiment, A satisfies the numerical range of 7.41mm ≤ A ≤ 7.765mm. The value of A can be 7.41mm, 7.42mm, 7.43mm, 7.44mm, 7.45mm, 7.46mm, 7.47mm, 7.48mm, 7.49mm, 7.50mm, 7.51mm, 7.52mm, 7.53mm, 7.54mm, 7.55mm, or 7.56mm. The values ​​for A are 7.57mm, 7.58mm, 7.59mm, 7.60mm, 7.61mm, 7.62mm, 7.63mm, 7.64mm, 7.65mm, 7.66mm, 7.67mm, 7.68mm, 7.69mm, 7.70mm, 7.71mm, 7.72mm, 7.73mm, 7.74mm, 7.75mm, 7.76mm, and 7.765mm. The value of A is not limited to the listed values; other unlisted values ​​within this range also apply.

[0048] In some embodiments of this application, in the thickness direction of the main body 1, the distance difference between the center line of the connector 2 and the two side surfaces 11 of the main body 1 is less than or equal to 0.2 mm. With this configuration, the storage module 100 is placed on the substrate without adjusting the overall structure of the storage module, which can reduce the distance difference between the storage module 100 and the two adjacent heat dissipation structures to within 0.4 mm. This ensures that both heat dissipation structures can effectively dissipate heat from the storage module 100, thereby improving the heat dissipation performance of the storage module with the storage module 100 in the embodiments of this application.

[0049] In some embodiments of this application, the centerline of the connector 2 and the centerline of the main body 1 coincide in the thickness direction of the main body 1. With this configuration, the storage module 100 can be placed on the substrate without adjusting the overall structure of the storage module. This reduces the distance difference between the storage module 100 and two adjacent heat dissipation structures to 0, thereby ensuring that both heat dissipation structures can effectively dissipate heat from the storage module 100, thus improving the heat dissipation performance of the storage module with the storage module 100 in the embodiments of this application.

[0050] In some embodiments of this application, the thickness of the main body 1 is 16.8 mm; in the thickness direction of the main body 1, the distance between the center line of the connector 2 and any side 11 of the main body 1 is B; the distance B satisfies: 8.2 mm ≤ B ≤ 8.6 mm; in this embodiment, based on the thickness of the motherboard being 16.8 mm, B is set to satisfy this range, so that the distance difference between the center line of the connector 2 and the two side 11 of the main body 1 is less than or equal to 0.4 mm, thereby ensuring that both heat dissipation structures can effectively dissipate heat from the storage module 100, thereby improving the heat dissipation performance of the storage module equipped with the storage module 100 in the embodiments of this application.

[0051] In this embodiment, B satisfies the numerical range of 8.2mm ≤ B ≤ 8.6mm. The value of B can be 8.2mm, 8.21mm, 8.22mm, 8.23mm, 8.24mm, 8.25mm, 8.26mm, 8.27mm, 8.28mm, 8.29mm, 8.3mm, 8.31mm, 8.32mm, 8.33mm, 8.34mm, 8.35mm, 8.36mm, 8.37mm, or 8.3mm. 8mm, 8.39mm, 8.4mm, 8.41mm, 8.41mm, 8.42mm, 8.43mm, 8.44mm, 8.45mm, 8.46mm, 8.47mm, 8.48mm, 8.49mm, 8.5mm, 8.51mm, 8.52mm, 8.53mm, 8.54mm, 8.55mm, 8.56mm, 8.57mm, 8.58mm, 8.59mm, 8.6mm. The value of B is not limited to the listed values; other unlisted values ​​within this range also apply.

[0052] In some embodiments of this application, the dimension of the connector 2 in the thickness direction of the main body 1 is C; the dimension C satisfies: 1.27mm≤C≤1.87mm; in this embodiment, based on the thickness of the motherboard being 16.8mm, the dimension C of the connector 2 satisfies: 1.27mm≤C≤1.87mm. Setting B to satisfy this range ensures that the distance difference between the centerline of the connector 2 and the two sides 11 of the main body 1 is less than or equal to 0.4mm, thereby ensuring that both heat dissipation structures can effectively dissipate heat from the storage module 100, thereby improving the heat dissipation performance of the storage module equipped with the storage module 100 in the embodiments of this application.

[0053] In this embodiment, C satisfies the numerical range of 1.27mm ≤ C ≤ 1.87mm. The value of C can be 1.27mm, 1.3mm, 1.35mm, 1.4mm, 1.45mm, 1.5mm, 1.55mm, 1.6mm, 1.65mm, 1.7mm, 1.75mm, 1.8mm, 1.85mm, or 1.87mm. The value of C is not limited to the listed values; other unlisted values ​​within this range are also applicable.

[0054] In some embodiments of this application, storage particles are provided on both sides 11 of the main body 1; this arrangement can increase the storage capacity of the storage module 100 within the limited size of the main body 1.

[0055] It is understandable that, since storage particles are provided on both sides 11 of the main body 1 in this embodiment, it is necessary to control the distance between the two heat dissipation structures and the storage module 100 to ensure the heat dissipation effect of the two heat dissipation structures on the storage particles on both sides 11 of the main body 1, to ensure that the junction temperature of the storage particles is controlled at the maximum tolerance temperature, and thus to ensure the performance of the storage module 100.

[0056] In some embodiments of this application, the storage particles are phase change storage media.

[0057] In some embodiments of this application, the size of the storage module 100 conforms to the E3.S interface standard.

[0058] In one specific embodiment of this application, the size of the storage module 100 conforms to the E3.S2T interface standard.

[0059] This application also proposes a storage module, which includes a backplate, two heat dissipation structures, and a storage module 100. The two heat dissipation structures are disposed on the backplate and spaced apart from each other. The storage module 100 is disposed on the backplate and located between the two heat dissipation structures. As described above, since this storage module adopts all the technical solutions of all the above embodiments, it has at least the beneficial effects brought by the technical solutions of the above embodiments, which will not be described in detail here.

[0060] It should be noted that, since the position of the connector 2 in the storage module 100 in this embodiment has changed on the main body 1, the slot on the substrate that matches the connector 2 has also been adjusted accordingly, so that the substrate can be adapted to install the storage module 100 in this embodiment.

[0061] That is, in the embodiments of this application, by adjusting the position of the connector 2 on the main body 1 and adjusting the position of the slot corresponding to the connector 2 on the substrate, the storage module can reduce the distance difference between the storage module 100 and the two adjacent heat dissipation structures without changing the overall structure of the storage module, thereby ensuring that both heat dissipation structures can effectively dissipate heat from the storage module 100, so as to improve the heat dissipation performance of the storage module.

[0062] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A storage module disposed between two adjacent heat dissipation structures, characterized in that, The storage module comprises: a main body comprising two side surfaces arranged opposite to each other in a thickness direction of the main body, and two end surfaces connecting the two side surfaces, one of the two end surfaces being a connecting end surface, the connecting end surface having edge regions adjacent to the two side surfaces, and a middle region between the two edge regions; and a connector arranged on the connecting end surface and corresponding to the middle region to fix the main body to a substrate; in the thickness direction of the main body, a size of the edge region is A; the A satisfies: 3.27 mm≤A≤7.81 mm.

2. The memory module of claim 1, wherein, The A further satisfies: 7.41 mm≤A≤7.765 mm.

3. The memory module of claim 1, wherein, In the thickness direction of the main body, a distance difference between a center line of the connector and the two side surfaces of the main body is less than or equal to 0.4 mm.

4. The memory module of claim 3, wherein, In the thickness direction of the main body, a center line of the connector and a center line of the main body coincide.

5. The memory module of claim 3, wherein, The thickness of the main body is 16.8 mm; In the thickness direction of the main body, a distance between the center line of the connector and any one of the side surfaces of the main body is B; the B satisfies: 8.2 mm≤B≤8.6 mm.

6. The memory module of claim 5, wherein, In the thickness direction of the main body, a size of the connector is C; the C satisfies: 1.27 mm≤C≤1.87 mm.

7. The memory module of any of claims 1 to 6, wherein, The two side surfaces of the main body are both provided with storage particles.

8. The memory module of claim 6, wherein, The storage particles are phase change storage media.

9. The memory module of any of claims 1 to 6, wherein, The size of the storage module meets the interface standard of E3.S.

10. A storage module, comprising: a back plate; two heat dissipation structures arranged on the back plate and spaced apart from each other; and the storage module according to any one of claims 1 to 9, the storage module being arranged on the back plate and located between the two heat dissipation structures.

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