Synchronous pressing test method and device for solid state disk, equipment and storage medium

Abstract

The invention discloses a synchronous pressing test method and device for a solid state disk, equipment and a storage medium. The method comprises the following steps: carrying out initial performance calibration on a to-be-tested solid state disk; executing a synchronous pressing test of a plurality of preset point locations on the to-be-tested solid state disk after initial performance calibration, and collecting pressure deformation data of each preset point location of the to-be-tested solid state disk; respectively carrying out appearance consistency detection and performance detection on the to-be-detected solid state disk after the synchronous pressing test to obtain an appearance detection defect and a performance degradation index of the to-be-detected solid state disk; performing a red ink dyeing test on the welding spot of the to-be-tested solid state disk after the appearance consistency detection and the performance detection to obtain a welding spot state of the to-be-tested solid state disk; and analyzing the relevance between the pressure deformation data of each preset point location of the to-be-detected solid state disk and the appearance detection defect, the performance attenuation index and the welding spot state, and judging whether the to-be-detected solid state disk reaches a preset qualified standard or not. The overall efficiency of the solid state disk pressing test is effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solid state disks, and particularly relates to a synchronous pressing test method, device and equipment of a solid state disk and a storage medium. BACKGROUND

[0002] As a core data storage component, the mechanical robustness and long-term soldering reliability of a solid state disk directly affect data security and service life. In the production test link, simulating the mechanical stress such as extrusion and bending that may be encountered in actual use and accurately evaluating it become key links to ensure the product quality of the solid state disk.

[0003] At present, there are some basic schemes for mechanical stress testing of solid state disks. A typical pressing test method usually places the back of the solid state disk upward on a supporting clamp, sets a fixed span, and then uses a specific diameter pressing head to perform rod pressing test at a specified position at a constant speed. When the bending force reaches a preset threshold, the corresponding displacement deformation variable is recorded. However, the existing test method focuses on the verification of a single or partial performance index, and it is difficult to accurately grade the comprehensive mechanical performance and storage reliability of the solid state disk. In addition, the current method mainly judges whether the sample has visible bending or damage, and cannot finely depict the mechanical response performance of the material at different pressure stages, resulting in low pressing test efficiency of the solid state disk.

[0004] Therefore, how to improve the pressing test efficiency of the solid state disk becomes a technical problem to be solved. SUMMARY

[0005] The present application provides a synchronous pressing test method, device, equipment and storage medium of a solid state disk to solve the technical problem of low pressing test efficiency of the existing solid state disk.

[0006] In a first aspect, the present application provides a synchronous pressing test method of a solid state disk, comprising: acquiring a to-be-tested solid state disk and performing initial performance calibration on the to-be-tested solid state disk; performing synchronous pressing test of a plurality of preset points on the to-be-tested solid state disk after initial performance calibration, and collecting pressure deformation data of each preset point of the to-be-tested solid state disk; respectively performing appearance consistency detection and performance detection on the to-be-tested solid state disk after synchronous pressing test, and obtaining appearance detection defects and performance attenuation indexes of the to-be-tested solid state disk; performing red ink dyeing test on the solder joint of the to-be-tested solid state disk after appearance consistency detection and performance detection, and obtaining the solder joint state of the to-be-tested solid state disk; Analyze the correlation between the pressure deformation data of each preset point of the to-be-tested solid state disk and the appearance detection defects, performance degradation indicators and solder joint state, and determine whether the to-be-tested solid state disk meets the preset qualified standard.

[0007] Optionally, the to-be-tested solid state disk is acquired, and initial performance calibration is performed on the to-be-tested solid state disk, including: The initial performance of the to-be-tested solid state disk is scanned, at least one key performance parameter of the continuous read-write speed, the random read-write speed and the random access time of the to-be-tested solid state disk is collected, and the baseline performance data of the to-be-tested solid state disk is generated; A full life cycle digital archive of the to-be-tested solid state disk is established, and the life cycle digital archive at least records the production batch information, the hardware configuration information and the baseline performance data of the to-be-tested solid state disk.

[0008] Optionally, the to-be-tested solid state disk after initial performance calibration is subjected to synchronous pressing test of multiple preset points, and the pressure deformation data of each preset point of the to-be-tested solid state disk is collected, including: Based on the hardware configuration information in the full life cycle digital archive, the key chip area on the back of the to-be-tested solid state disk is dynamically identified, and the pressing test point is preset on the identified key chip area; The multiple pressure head arrays are used to perform synchronous incremental pressing test on each preset point of the to-be-tested solid state disk for a preset number of times, and the pressure value and the corresponding multi-dimensional deformation data of each preset point are collected in real time; The correlation mapping between the pressure value and the corresponding multi-dimensional deformation data of the to-be-tested solid state disk and the hardware configuration information is established, and a deformation behavior analysis matrix of the to-be-tested solid state disk is generated.

[0009] Optionally, the to-be-tested solid state disk after the synchronous pressing test is subjected to appearance consistency detection and performance detection respectively, and the appearance detection defects and the performance degradation indicators of the to-be-tested solid state disk are obtained, including: The to-be-tested solid state disk after the synchronous pressing test is subjected to multi-angle image collection, and the appearance defects of the to-be-tested solid state disk are automatically identified based on a defect identification algorithm; The to-be-tested solid state disk after the appearance defect identification is subjected to multi-dimensional performance scanning, and the performance data of the to-be-tested solid state disk after the synchronous pressing test is obtained; The performance data of the to-be-tested solid state disk after the synchronous pressing test is compared with the baseline performance data after the initial performance calibration, and the degradation rate of each performance indicator of the to-be-tested solid state disk is calculated.

[0010] Optionally, the solder joint of the to-be-tested solid state disk after the appearance consistency detection and performance detection is subjected to red ink dyeing test, and the solder joint state of the to-be-tested solid state disk is obtained, including: The ball grid array package chip of the to-be-tested solid state disk after appearance consistency detection and performance detection is immersed in red ink dye, and the ball grid array package chip is subjected to penetration treatment in a vacuum; The ball grid array package chip after the penetration treatment is subjected to solidification treatment, and the solidified ball grid array package chip is separated from the printed circuit board; Image acquisition is performed on the chip solder ball and the printed circuit board pad of the separated to-be-tested solid state disk, and a solder joint dyeing morphology feature of the to-be-tested solid state disk is obtained; Based on the solder joint dyeing morphology feature of the to-be-tested solid state disk, crack propagation degree, fracture mode and dyeing area ratio of the solder joint of the to-be-tested solid state disk are quantitatively analyzed, and the solder joint failure state of the to-be-tested solid state disk is determined.

[0011] Optionally, the method further comprises: Based on the pressure deformation data of each preset point of the to-be-tested solid state disk, feature parameters of each preset point of the to-be-tested solid state disk are extracted, and the feature parameters include pressure peak value, deformation amount and deformation rate of each preset point of the to-be-tested solid state disk; An association model between the feature parameters of each preset point and the appearance detection defects, the performance attenuation indicators and the solder joint state is constructed, and the reliability score of the to-be-tested solid state disk is calculated based on the constructed association model; The calculated reliability score of the to-be-tested solid state disk is compared with a preset reliability score threshold, and it is determined whether the to-be-tested solid state disk meets the preset qualified standard.

[0012] Optionally, after the method of analyzing the correlation between the pressure deformation data of each preset point of the to-be-tested solid state disk and the appearance detection defects, the performance attenuation indicators and the solder joint state, and determining whether the to-be-tested solid state disk meets the preset qualified standard, the method further comprises: The pressure deformation data of each preset point of the to-be-tested solid state disk, the appearance detection defects, the performance attenuation indicators and the solder joint state are input into a pre-trained health prediction model to predict a remaining life prediction value and a corresponding confidence interval of the to-be-tested solid state disk under a working load; The predicted remaining life prediction value and the corresponding confidence interval are updated to a corresponding full life cycle digital archive of the to-be-tested solid state disk.

[0013] In a second aspect, the present application provides a synchronous pressing test device for a solid state disk, comprising: An acquisition module is configured to acquire a to-be-tested solid state disk and perform initial performance calibration on the to-be-tested solid state disk; The first test module is configured to perform a synchronous pressing test on the initial performance calibrated SSD at multiple preset points, and collect pressure deformation data of each preset point of the SSD. The detection module is configured to perform appearance consistency detection and performance detection on the SSD after the synchronous pressing test, and obtain appearance detection defects and performance attenuation indexes of the SSD. The second test module is configured to perform red ink dyeing test on the solder joints of the SSD after the appearance consistency detection and performance detection, and obtain solder joint states of the SSD. The determination module is configured to analyze the correlation between the pressure deformation data of each preset point of the SSD and the appearance detection defects, the performance attenuation indexes and the solder joint states, and determine whether the SSD meets a preset qualified standard.

[0014] In a third aspect, the present application provides a computer device, which comprises a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory complete mutual communication through the communication bus. The memory is configured to store a computer program. The processor is configured to execute the program stored on the memory, and realize the steps of the synchronous pressing test method of the SSD according to any one of the first aspect.

[0015] In a fourth aspect, the present application provides a computer readable storage medium, which stores a computer program, and the computer program is executed by the processor to realize the steps of the synchronous pressing test method of the SSD according to any one of the first aspect.

[0016] Compared with the prior art, the synchronous pressing test method, device, equipment and storage medium of the SSD provided by the present application can more realistically simulate the complex multi-point pressing scene that the SSD may face in actual application by performing a synchronous pressing test on the initial performance calibrated SSD at multiple preset points. By arranging test points in different key areas, the weak links of the printed circuit board of the SSD can be accurately identified. In addition, by analyzing the correlation between the pressure deformation data of each preset point and the appearance detection defects, the performance attenuation indexes and the solder joint states, the comprehensive and accurate evaluation of the mechanical reliability of the SSD can be realized, so that the products with normal performance in the test but with potential high failure risk can be effectively identified and screened out, the long-term reliability of the products is significantly improved, and the overall efficiency of the pressing test of the SSD is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only represent some of the embodiments of the present application, rather than all the embodiments. For those skilled in the art, other drawings obtained according to these drawings without creative labor are within the protection scope of the present application.

[0018] Figure 1 is a flow chart of a synchronous pressing test method of a solid state disk provided by an embodiment of the present application.

[0019] Figure 2 is a flow chart of a synchronous pressing test of multiple preset points provided by an embodiment of the present application.

[0020] Figure 3 is a flow chart of a performance detection of a solid state disk provided by an embodiment of the present application.

[0021] Figure 4 is a flow chart of a red ink test of a solid state disk sample provided by an embodiment of the present application.

[0022] Figure 5 is a synchronous pressing test device of a solid state disk provided by an embodiment of the present application.

[0023] Figure 6 is a structural schematic diagram of a computer device provided by an embodiment of the present application.

[0024] Figure 7 is a structural schematic diagram of a computer readable storage medium provided by an embodiment of the present application. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0026] In order to make the description of the present disclosure more detailed and complete, the following describes the embodiments of the present application; but this is not the only form of implementation or use of the specific embodiments of the present application. The embodiments include the features of the specific embodiments and the method steps and their order used to construct and operate these specific embodiments. However, other specific embodiments can also be used to achieve the same or equivalent functions and step sequences. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0027] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the application described herein can be implemented in an order other than that illustrated or described herein.

[0028] In the description of the embodiments of the present application, unless otherwise specified, " / " represents the meaning of or, for example, A / B can represent A or B; "and / or" in the text only describes the relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two, and other quantifiers similar thereto should be understood. The preferred embodiments described herein are only used to illustrate and explain the present application, and do not limit the present application, and the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0029] To solve the technical problem of low efficiency of the existing solid state disk synchronous pressing test, the embodiment of the present application provides a solid state disk synchronous pressing test method, which comprises the following steps. Figure 1 The flowchart of the solid state disk synchronous pressing test method provided by the embodiment of the present application comprises the following steps.

[0030] S10: Obtain the solid state disk to be tested, and calibrate the initial performance of the solid state disk to be tested. Specifically, in the embodiment of the present application, the reference value of the continuous read / write speed, random access time and other key parameters can be obtained through performance test software, which improves the test from qualitative judgment to quantitative analysis level, provides analysis basis for subsequent performance decay calculation, and considers the initial performance difference of different solid state disks caused by production batch, main control chip, flash memory type and the like, so as to ensure the accuracy of the test result.

[0031] S20: Perform synchronous pressing test on the solid state disk to be tested after initial performance calibration, and collect pressure deformation data of each preset point of the solid state disk to be tested. Specifically, in the embodiment of the present application, compared with single-point pressing, synchronous pressing test can more truly simulate the complex stress scenarios in reality, such as uneven extrusion of hard disk and installation in a deformed case, and avoids the defect of single working condition of traditional test method. By arranging test points in different key areas, the structural weak points of the PCB of the solid state disk can be accurately found, and multi-dimensional pressure deformation data can be provided.

[0032] S30: respectively, the appearance consistency detection and performance detection are carried out on the to-be-tested solid state disk after the synchronous pressing test, and appearance detection defects and performance attenuation indexes of the to-be-tested solid state disk are obtained. Specifically, in the embodiment of the application, by performing appearance consistency detection on the to-be-tested solid state disk after the synchronous pressing test, whether the to-be-tested solid state disk has appearance defects such as cracks and deformation can be detected; by performing performance detection on the to-be-tested solid state disk after the synchronous pressing test, whether the read-write function of the to-be-tested solid state disk is normal and whether the performance is decreased can be detected.

[0033] S40: red ink dyeing test is performed on the solder joints of the to-be-tested solid state disk after the appearance consistency detection and performance detection, and the solder joint state of the to-be-tested solid state disk is obtained. Specifically, in the embodiment of the application, the red ink test can effectively analyze the potential fracture and micro-cracks of the ball grid array package chip solder joints, and the solder joint defects of the to-be-tested solid state disk can not be found in appearance inspection and function test, and the potential fracture and micro-cracks can be found through the red ink dyeing test.

[0034] S50: the correlation of the pressure deformation data of each preset point of the to-be-tested solid state disk with the appearance detection defects, the performance attenuation indexes and the solder joint state is analyzed, and whether the to-be-tested solid state disk reaches a preset qualified standard is determined. Specifically, in the embodiment of the application, the traditional qualified determination can only focus on whether it is pressed or the function is normal. The application performs correlation analysis on the pressure deformation data of each preset point and the appearance detection defects, the performance attenuation indexes and the solder joint state, so that the detection of the to-be-tested solid state disk is more accurate. For example, even if the function of the to-be-tested solid state disk is normal, if there is a strong correlation between the deformation data and the solder joint micro-cracks, it is also determined as unqualified, so that those products that pass the test but have high future failure risk are screened out, and the long-term reliability of the product is significantly improved.

[0035] As an optional implementation, in step S10, the to-be-tested solid state disk is obtained, and initial performance calibration is performed on the to-be-tested solid state disk, including: S11: initial performance scanning is performed on the to-be-tested solid state disk, at least one key performance parameter of continuous read-write speed, random read-write speed and random access time of the to-be-tested solid state disk is collected, and reference performance data of the to-be-tested solid state disk is generated. Specifically, in the embodiment of the application, by collecting key performance parameters such as continuous read-write speed, random read-write speed and random access time, a detection standard can be set for each to-be-tested solid state disk. The initial performance difference caused by the inherent factors such as the slight difference of flash memory particles and the individual characteristics of the master control chip of different solid state disks is quantified. For example, a hard disk with a faster initial read-write speed and a slower hard disk, after being subjected to the same stress, even if they show the same absolute performance value, the damage degree they represent is different. The relative attenuation index based on itself can more truly reflect the actual impact of mechanical stress.

[0036] S12: Establish a full life cycle digital archive for the to-be-tested solid state disk, and the life cycle digital archive at least records production batch information, hardware configuration information and benchmark performance data of the to-be-tested solid state disk. Specifically, in the embodiment of the present application, when batch unqualified test occurs, the specific production batch or certain hardware configuration can be traced through the archive, and the time for problem positioning in the solid state disk test is effectively shortened.

[0037] As an optional implementation, Figure 2 Said, Figure 2 is a flowchart of a plurality of preset point synchronous pressing tests provided by the embodiment of the present application. In step S20, the to-be-tested solid state disk after initial performance calibration is subjected to a plurality of preset point synchronous pressing tests, and the pressure deformation data of each preset point of the to-be-tested solid state disk is collected, including: S21: Based on the hardware configuration information in the full life cycle digital archive, the key chip area on the back of the to-be-tested solid state disk is dynamically identified, and the pressing test point is preset in the identified key chip area. Specifically, in the embodiment of the present application, by calling the hardware configuration information in the full life cycle digital archive, the test can automatically identify the most critical and fragile functional areas such as the master control chip, the flash memory and the power management chip, and the test point is accurately preset in these areas, so that the test stress can be applied to the key components, and the missed detection caused by point deviation is avoided, and the test coverage and efficiency are significantly improved.

[0038] S22: The plurality of preset points of the to-be-tested solid state disk are subjected to a preset number of synchronous incremental pressing tests by the multi-press head array, and the pressure value and the corresponding multi-dimensional deformation data of each preset point are collected in real time. Specifically, in the embodiment of the present application, the multi-press head array specially made can be used to simultaneously perform synchronous incremental pressing tests on a plurality of predetermined areas on the back of the to-be-tested solid state disk, for example, the left, middle and right points of the to-be-tested solid state disk and the positions corresponding to the master control and flash memory chips can be pressed. Each preset point can be subjected to synchronous incremental pressing by a 3mm diameter press head, for example, 5N, 15N, 23N, until the displacement deformation value under the preset deformation limit or pressure limit is reached, and then the pressure value and displacement deformation value of each preset point are collected. In addition, the to-be-tested solid state disk can be subjected to temperature coupling mechanical stress test, and the entire pressing test platform is placed in a programmable temperature control box, and the above pressing test is repeated under three typical working conditions of low temperature, normal temperature and high temperature. The low temperature can be selected as-10℃, the normal temperature can be selected as 25℃, and the high temperature can be selected as 60℃.

[0039] S23: Establish the association mapping of the pressure value of the to-be-tested solid state disk and the corresponding multi-dimensional deformation data and the hardware configuration information, and generate a deformation behavior analysis matrix of the to-be-tested solid state disk. Specifically, in the embodiment of the present application, the collected pressure value and the corresponding multi-dimensional deformation data are associated and mapped with the hardware configuration information to generate a deformation behavior analysis matrix, which can form an analyzable and queryable knowledge base.

[0040] As an optional implementation, Figure 3 Said, Figure 3 is a flowchart for performance detection of a solid state disk provided by an embodiment of the present application. In step S30, the appearance consistency detection and performance detection of the to-be-tested solid state disk after the synchronous pressing test are performed respectively to obtain appearance detection defects and performance attenuation indexes of the to-be-tested solid state disk, including: S31: Multi-angle image acquisition is performed on the to-be-tested solid state disk after the synchronous pressing test, and appearance defects of the to-be-tested solid state disk are automatically identified based on a defect identification algorithm. Specifically, in the embodiment of the present application, multi-angle image acquisition is performed on the to-be-tested solid state disk after the synchronous pressing test, which can capture deformations or cracks that can be observed from different angles. The appearance defects of the to-be-tested solid state disk are automatically identified by the defect identification algorithm, which not only identifies the existence of the defects, but also records and quantifies the types, sizes and accurate positions of the defects, thereby providing rich structured data for subsequent correlation analysis.

[0041] S32: Multi-dimensional performance scanning is performed on the to-be-tested solid state disk after the appearance defect identification to obtain performance data of the to-be-tested solid state disk after the synchronous pressing test. Specifically, in the embodiment of the present application, the pressing test on the solid state disk may cause various performance degradation modes, for example, the virtual soldering of the main control chip may affect the random read-write capability, and the damage of the storage chip channel may affect the continuous read-write speed. Multi-dimensional testing ensures that various potential functional damages can be captured comprehensively, thereby avoiding missed detection.

[0042] S33: The performance data of the to-be-tested solid state disk after the synchronous pressing test is compared with the reference performance data after the initial performance calibration to calculate the attenuation rate of each performance index of the to-be-tested solid state disk. Specifically, in the embodiment of the present application, the comparison of the performance data after the test and the reference performance data after the initialization can calculate the accurate performance attenuation rate, for example, the read-write speed is decreased by 5%. The traditional test may only satisfy the qualitative judgment of normal function. However, the present application can detect the performance decline of the to-be-tested solid state disk in the case of not completely failing, thereby effectively improving the accuracy of the pressing test of the to-be-tested solid state disk.

[0043] As an optional implementation, Figure 4 Said, Figure 4This is a flowchart of a red ink test for a solid-state drive (SSD) sample provided by an embodiment of the present invention. In step S40, the solder joints of the SSD under test after appearance consistency inspection and performance inspection are subjected to red ink staining test to obtain the solder joint status of the SSD under test, including: S41: The ball grid array (BGA) packaged chip of the solid-state drive under test, after appearance consistency inspection and performance testing, is immersed in red ink dye, and the BGA packaged chip is then permeated in a vacuum. Specifically, in this embodiment of the invention, permeation is performed in a vacuum environment. The vacuum eliminates air resistance, ensuring that the red ink dye can penetrate deep into the cracks under capillary action, thus discovering potential cracks that are completely invisible under X-ray or visual inspection.

[0044] S42: The ball grid array (BGA) packaged chip after the infiltration treatment is cured, and the cured BGA packaged chip is separated from the printed circuit board. Specifically, in this embodiment of the invention, the curing treatment firmly locks the infiltrated dye inside the crack, preventing it from being lost or contaminated in subsequent operations. Separating the cured BGA packaged chip from the printed circuit board exposes the actual fracture surface, which has not been damaged by secondary forces, and clearly distinguishes whether the fracture occurred between the chip and the solder ball, inside the solder ball, or between the solder ball and the PCB pad.

[0045] S43: Images are acquired of the chip solder balls and printed circuit board pads of the separated solid-state drive under test to obtain the solder joint staining morphology features. Specifically, in this embodiment of the invention, images are acquired from both sides of the chip solder balls and PCB pads to obtain complete staining morphology features, replacing the old mode of subjective observation and description by engineers under a microscope, making the analysis results verifiable and traceable.

[0046] S44: Based on the solder joint staining morphology characteristics of the solid-state drive under test, the crack propagation degree, fracture mode, and staining area ratio of the solder joints are quantitatively analyzed to determine the solder joint failure state of the solid-state drive under test. Specifically, in this embodiment of the invention, the crack propagation degree, fracture mode, and staining area ratio are quantitatively analyzed to quantify the severity of the damage, providing a more refined judgment standard for the pressure test of the solid-state drive under test.

[0047] As an optional implementation, in step S50, analyzing the correlation between the pressure deformation data of each preset point of the solid-state drive under test and the appearance inspection defects, performance degradation indicators, and solder joint status, and determining whether the solid-state drive under test meets the preset qualification standard, includes: S51: Based on the pressure deformation data at each preset point of the solid-state drive under test, extract the feature parameters of each preset point of the solid-state drive under test. The feature parameters include the pressure peak value, deformation amount, and deformation rate at each preset point of the solid-state drive under test. Specifically, in this embodiment of the invention, complex pressure deformation data is extracted into quantifiable feature parameters, providing a metric for comparison between different samples and different tests.

[0048] S52: Construct a correlation model between the feature parameters of each preset point and the appearance defects, performance degradation indicators, and solder joint status. Based on the constructed correlation model, calculate the reliability score of the solid-state drive under test. Specifically, in this embodiment of the invention, the correlation model deeply integrates information from four dimensions of the solid-state drive under test: feature parameters, appearance defects, performance degradation, and solder joint status. The model can learn the complex, non-linear relationships between them. Traditional judgments are isolated; for example, if there are no cracks in the appearance, it passes, but if the deformation data is abnormal and the solder joints are not at risk, the product's reliability may still be unqualified. This provides a more comprehensive assessment of the health status of the solid-state drive under test.

[0049] S53: Compare the calculated reliability score of the solid-state drive under test with a preset reliability score threshold to determine whether the solid-state drive under test meets the preset pass standard. Specifically, in this embodiment of the invention, the preset reliability score threshold is set to 70 points. When the reliability score of the solid-state drive under test exceeds 70 points, it is judged as pass; otherwise, it is judged as fail. Comparing the calculated score with the preset reliability score threshold effectively prevents differences in judgment caused by the experience and subjective judgment of different quality inspectors, ensuring a high degree of consistency in product quality standards.

[0050] In this embodiment of the invention, reliability scoring The calculation is performed by weighting and combining the results of each key test indicator, and the calculation formula is as shown in formula (1): (1) in, The deformation consistency score is given to the solid-state drive under test. The performance retention rate of the tested solid-state drive is scored. The solder joint condition score for the solid-state drive under test is calculated based on the proportion of the fractured area of ​​the solder joint in the red ink test. , , These are the weighting coefficients, and In this embodiment of the invention, it is preferred that... , , .

[0051] As an optional implementation, after analyzing the correlation between the pressure deformation data of each preset point of the solid-state drive under test and the appearance defects, performance degradation indicators, and solder joint status, and determining whether the solid-state drive under test meets the preset pass criteria, the method further includes: S61: Input the pressure deformation data, appearance defects, performance degradation indicators, and solder joint status of each preset point of the solid-state drive under test into a pre-trained health prediction model to predict the remaining lifespan of the solid-state drive under workload and the corresponding confidence interval. Specifically, in this embodiment of the invention, the pre-trained health prediction model is a machine learning model trained based on historical data, such as a random forest or gradient boosting decision tree regression model. The training data of the model comes from testing and tracking a large number of known historical samples. Each historical sample needs to acquire feature data and label data during testing. The feature data includes the feature values ​​of the pressure deformation curve, deformation consistency index, appearance defect parameters, various performance degradation rates, solder joint fracture area and pattern, etc. The label data includes the actual lifespan recorded for each historical sample under simulated or real workload until failure. By inputting the test data of the solid-state drive under test into a pre-trained health prediction model, the output is no longer a simple pass or fail label, but a predicted value of the remaining life of the solid-state drive under a specific workload. This allows customers to foresee the future of the product, thereby upgrading quality management from passive screening at the time of delivery to proactive planning and risk control throughout the entire product lifecycle.

[0052] S62: Update the predicted remaining lifespan and corresponding confidence interval to the full lifecycle digital file corresponding to the solid-state drive under test. Specifically, in this embodiment of the invention, the predicted remaining lifespan is integrated with the product's production batch, hardware configuration, and all test data results into a unified digital file, ensuring traceability of all basic and test information of the solid-state drive under test.

[0053] Based on the above-described synchronous pressure testing method for solid-state drives (SSDs), this invention provides a synchronous pressure testing device for SSDs, such as... Figure 5 As shown, its structural diagram is as follows: Figure 5As shown, the synchronous pressure testing device for the solid-state drive includes: an acquisition module 51, used to acquire the solid-state drive under test and perform initial performance calibration on the solid-state drive under test; a first testing module 52, used to perform synchronous pressure tests on multiple preset points of the solid-state drive under test after initial performance calibration, and collect pressure deformation data of each preset point of the solid-state drive under test; a detection module 53, used to perform appearance consistency detection and performance detection on the solid-state drive under test after synchronous pressure testing, and obtain appearance detection defects and performance degradation indicators of the solid-state drive under test; a second testing module 54, used to perform red ink staining test on the solder joints of the solid-state drive under test after appearance consistency detection and performance detection, and obtain the solder joint status of the solid-state drive under test; and a judgment module 55, used to analyze the correlation between the pressure deformation data of each preset point of the solid-state drive under test and appearance detection defects, performance degradation indicators and solder joint status, and determine whether the solid-state drive under test meets the preset qualification standard.

[0054] For further details regarding the implementation of the above-mentioned technical solution by each module in the synchronous pressing test device for solid-state drives, please refer to the description of the synchronous pressing test method for solid-state drives provided in the above-mentioned embodiments of the invention, which will not be repeated here.

[0055] Please refer to Figure 6This is a schematic diagram of the structure of a computer device provided in an embodiment of the present invention. The device includes a processor 601, which can be implemented using a general-purpose central processing unit (CPU), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, for executing relevant programs to implement the technical solutions provided in the embodiments of this application; and a memory 602, which can be implemented using a read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM), etc. The memory 602 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 602 and is called and executed by the processor 601 to execute the synchronous pressing test method of the solid-state drive in the embodiments of this application. The input / output interface 603 is used to realize information input and output. The communication interface 604 is used to realize communication interaction between this device and other devices. Communication can be realized through wired means (such as USB, network cable, etc.) or through wireless means (such as mobile network, WIFI, Bluetooth, etc.). The bus 605 transmits information between the various components of the device (such as the processor 601, memory 602, input / output interface 603 and communication interface 604). The processor 601, memory 602, input / output interface 603 and communication interface 604 realize communication connection between each other within the device through the bus 605.

[0056] Please refer to Figure 7 This is a schematic diagram of a computer-readable storage medium structure according to an embodiment of the present invention. The storage medium 70 of this embodiment stores program instructions 71 capable of implementing the aforementioned synchronous press-to-test method for a solid-state drive. These program instructions 71 can be stored in the storage medium in the form of a software product, including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods described in various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks, or terminal devices such as computers, servers, mobile phones, and tablets.

[0057] In the several embodiments provided by this invention, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0058] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated units described above can be implemented in hardware or as software functional units. The above are merely embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

[0059] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A synchronous press test method of a solid state drive, characterized by, The method comprises the following steps: obtaining a to-be-tested solid state disk and performing initial performance calibration on the to-be-tested solid state disk; performing synchronous pressing tests on multiple preset points of the to-be-tested solid state disk after initial performance calibration, and collecting pressure deformation data of each preset point of the to-be-tested solid state disk; respectively performing appearance consistency detection and performance detection on the to-be-tested solid state disk after the synchronous pressing tests, and obtaining appearance detection defects and performance attenuation indexes of the to-be-tested solid state disk; performing red ink dyeing tests on the solder joints of the to-be-tested solid state disk after the appearance consistency detection and performance detection, and obtaining the solder joint state of the to-be-tested solid state disk; analyzing the correlation between the pressure deformation data of each preset point of the to-be-tested solid state disk and the appearance detection defects, the performance attenuation indexes and the solder joint state, and determining whether the to-be-tested solid state disk meets the preset qualified standard. 2.The method of claim 1, wherein, The step of obtaining the to-be-tested solid state disk and performing initial performance calibration on the to-be-tested solid state disk comprises the following steps: performing initial performance scanning on the to-be-tested solid state disk, collecting at least one key performance parameter in continuous read-write speed, random read-write speed and random access time of the to-be-tested solid state disk, and generating baseline performance data of the to-be-tested solid state disk; establishing a full life cycle digital file of the to-be-tested solid state disk, and recording at least production batch information, hardware configuration information and baseline performance data of the to-be-tested solid state disk in the full life cycle digital file. 3.The method of claim 2, wherein, The step of performing synchronous pressing tests on multiple preset points of the to-be-tested solid state disk after initial performance calibration, and collecting pressure deformation data of each preset point of the to-be-tested solid state disk comprises the following steps: based on the hardware configuration information in the full life cycle digital file, dynamically identifying the key chip area on the back of the to-be-tested solid state disk, and presetting pressing test points in the identified key chip area; performing synchronous incremental pressing tests on each preset point of the to-be-tested solid state disk for a preset number of times by a multi-pressure head array, and collecting pressure values and corresponding multi-dimensional deformation data of each preset point in real time; establishing a correlation mapping between the pressure values and the corresponding multi-dimensional deformation data of the to-be-tested solid state disk and the hardware configuration information, and generating a deformation behavior analysis matrix of the to-be-tested solid state disk. 4.The method of claim 3, wherein, The step of respectively performing appearance consistency detection and performance detection on the to-be-tested solid state disk after the synchronous pressing tests, and obtaining appearance detection defects and performance attenuation indexes of the to-be-tested solid state disk comprises the following steps: performing multi-angle image collection on the to-be-tested solid state disk after the synchronous pressing tests, and automatically identifying appearance defects of the to-be-tested solid state disk based on a defect recognition algorithm; performing multi-dimensional performance scanning on the to-be-tested solid state disk after appearance defect recognition, and obtaining performance data of the to-be-tested solid state disk after the synchronous pressing tests; comparing the performance data of the to-be-tested solid state disk after the synchronous pressing tests with the baseline performance data after the initial performance calibration, and calculating the attenuation rate of each performance index of the to-be-tested solid state disk. 5.The synchronous press test method of a solid state drive according to claim 1, wherein, The step of performing red ink dyeing tests on the solder joints of the to-be-tested solid state disk after the appearance consistency detection and performance detection, and obtaining the solder joint state of the to-be-tested solid state disk comprises the following steps: immersing the ball grid array package chip of the to-be-tested solid state disk after the appearance consistency detection and performance detection in red ink dye, and performing penetration treatment on the ball grid array package chip in a vacuum. The ball grid array package chip after the penetration treatment is subjected to a solidification treatment, and the ball grid array package chip after the solidification is separated from the printed circuit board; Image acquisition is performed on the chip solder balls and the printed circuit board pads of the separated solid state disk to be tested to obtain the solder joint dyeing morphology characteristics of the solid state disk to be tested; Based on the solder joint dyeing morphology characteristics of the solid state disk to be tested, the crack propagation degree, the fracture mode and the dyeing area ratio of the solder joint of the solid state disk to be tested are quantitatively analyzed, and the solder joint failure state of the solid state disk to be tested is determined. 6.The method of claim 1, wherein, The correlation between the pressure deformation data of each preset point of the solid state disk to be tested and the appearance detection defects, the performance attenuation indicators and the solder joint state is analyzed, and whether the solid state disk to be tested reaches the preset qualified standard is determined, including: Based on the pressure deformation data of each preset point of the solid state disk to be tested, the characteristic parameters of each preset point of the solid state disk to be tested are extracted, and the characteristic parameters include the pressure peak value, the deformation amount and the deformation rate of each preset point of the solid state disk to be tested; An association model between the characteristic parameters of each preset point and the appearance detection defects, the performance attenuation indicators and the solder joint state is constructed, and the reliability score of the solid state disk to be tested is calculated based on the constructed association model; The calculated reliability score of the solid state disk to be tested is compared with the preset reliability score threshold value, and whether the solid state disk to be tested reaches the preset qualified standard is determined.

7. The method of claim 6, wherein, After the correlation between the pressure deformation data of each preset point of the solid state disk to be tested and the appearance detection defects, the performance attenuation indicators and the solder joint state is analyzed, and whether the solid state disk to be tested reaches the preset qualified standard is determined, the method further includes: The pressure deformation data of each preset point of the solid state disk to be tested, the appearance detection defects, the performance attenuation indicators and the solder joint state are input into the pre-trained health prediction model to predict the residual life prediction value and the corresponding confidence interval of the solid state disk to be tested under the working load; The predicted residual life prediction value and the corresponding confidence interval are updated to the corresponding full life cycle digital archives of the solid state disk to be tested.

8. A synchronous pressing test device for a solid-state drive, characterized in that, It includes: An acquisition module is configured to acquire a solid state disk to be tested and perform initial performance calibration on the solid state disk to be tested; A first test module is configured to perform synchronous pressing tests on a plurality of preset points of the solid state disk to be tested after initial performance calibration, and to collect pressure deformation data of each preset point of the solid state disk to be tested; A detection module is configured to perform appearance consistency detection and performance detection on the solid state disk to be tested after the synchronous pressing tests, and to obtain appearance detection defects and performance attenuation indicators of the solid state disk to be tested; A second test module is configured to perform red ink dyeing tests on solder joints of the solid state disk to be tested after the appearance consistency detection and the performance detection, and to obtain solder joint states of the solid state disk to be tested; A determination module is configured to analyze the correlation between the pressure deformation data of each preset point of the solid state disk to be tested and the appearance detection defects, the performance attenuation indicators and the solder joint state, and to determine whether the solid state disk to be tested reaches the preset qualified standard.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, The processor executes the computer program to implement the steps of the synchronous pressing test method of the solid state disk according to any one of claims 1 to 7.

10. A computer-readable storage medium storing a computer program, the computer program comprising instructions that, when executed by a computer, cause the computer to perform the method of any one of claims 1 to 9. The computer program, when executed by a processor, implements the steps of the method for synchronously pressing test of the solid state disk according to any one of claims 1 to 7.

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