Solid state disk synchronous pressing test method, device, equipment and storage medium

Abstract

The application discloses a kind of solid state disk synchronous pressing test method, device, equipment and storage medium.It is described as follows:The method comprises: initial performance calibration is carried out to the solid state disk to be measured;Synchronous pressing test of multiple preset points is carried out to the solid state disk to be measured after initial performance calibration, and the pressure deformation data of each preset point of the solid state disk to be measured is collected;Appearance consistency detection and performance detection are carried out to the solid state disk to be measured after synchronous pressing test respectively, and the appearance detection defect and performance attenuation index of the solid state disk to be measured are obtained;Red ink dyeing test is carried out to the solder joint of the solid state disk to be measured after appearance consistency detection and performance detection, and the solder joint state of the solid state disk to be measured is obtained;The relevance of the pressure deformation data of each preset point of the solid state disk to be measured and appearance detection defect, performance attenuation index and solder joint state is analyzed, and whether the solid state disk to be measured reaches preset qualified standard is judged.The application effectively improves the overall efficiency of solid state disk pressing test.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solid state disks, in particular to a synchronous pressing test method, device and equipment of a solid state disk and a storage medium. BACKGROUND

[0002] As a core data storage component, the mechanical robustness and long-term soldering reliability of a solid state disk directly affect data security and service life. In the production test link, simulating the mechanical stress such as extrusion and bending that may be encountered in actual use and accurately evaluating it become the key link to ensure the product quality of the solid state disk.

[0003] At present, there are some basic schemes for mechanical stress testing of solid state disks. A typical pressing test method usually places the back of the solid state disk upward on a supporting clamp, sets a fixed span, and then uses a specific diameter pressure head to perform rod pressing test at the specified position at a constant speed. When the bending force reaches the preset threshold, the corresponding displacement deformation variable is recorded. However, the existing test method focuses on the verification of single or partial performance indicators, and it is difficult to accurately classify the comprehensive mechanical performance and storage reliability of the solid state disk. In addition, the current method mainly judges whether the sample has visible bending or damage, and cannot finely depict the mechanical response performance of the material at different pressure stages, resulting in low pressing test efficiency of the solid state disk.

[0004] Therefore, how to improve the pressing test efficiency of the solid state disk has become a technical problem to be solved. SUMMARY

[0005] The present application provides a synchronous pressing test method, device and equipment of a solid state disk and a storage medium to solve the technical problem of low pressing test efficiency of the existing solid state disk.

[0006] In a first aspect, the present application provides a synchronous pressing test method of a solid state disk, comprising:

[0007] Obtaining a to-be-tested solid state disk and performing initial performance calibration on the to-be-tested solid state disk;

[0008] Performing synchronous pressing test of multiple preset points on the to-be-tested solid state disk after initial performance calibration, and collecting pressure deformation data of each preset point of the to-be-tested solid state disk;

[0009] Respectively performing appearance consistency detection and performance detection on the to-be-tested solid state disk after synchronous pressing test, and obtaining appearance detection defects and performance attenuation indicators of the to-be-tested solid state disk;

[0010] Performing red ink dyeing test on the solder joint of the to-be-tested solid state disk after appearance consistency detection and performance detection, and obtaining the solder joint state of the to-be-tested solid state disk;

[0011] The correlation between the pressure deformation data of each preset point of the to-be-tested solid state disk and the appearance detection defects, performance degradation indicators and solder state is analyzed, and it is determined whether the to-be-tested solid state disk reaches the preset qualified standard.

[0012] Optionally, the to-be-tested solid state disk is acquired, and initial performance calibration is performed on the to-be-tested solid state disk, including:

[0013] The initial performance of the to-be-tested solid state disk is scanned, at least one key performance parameter of the continuous read-write speed, the random read-write speed and the random access time of the to-be-tested solid state disk is collected, and the baseline performance data of the to-be-tested solid state disk is generated;

[0014] A full life cycle digital archive of the to-be-tested solid state disk is established, and the life cycle digital archive at least records the production batch information, the hardware configuration information and the baseline performance data of the to-be-tested solid state disk.

[0015] Optionally, the to-be-tested solid state disk after initial performance calibration is subjected to synchronous pressing test of multiple preset points, and the pressure deformation data of each preset point of the to-be-tested solid state disk is collected, including:

[0016] Based on the hardware configuration information in the full life cycle digital archive, the key chip area on the back of the to-be-tested solid state disk is dynamically identified, and the pressing test point is preset in the identified key chip area;

[0017] The multiple pressure head arrays perform synchronous incremental pressing test on each preset point of the to-be-tested solid state disk for a preset number of times, and the pressure value and the corresponding multi-dimensional deformation data of each preset point are collected in real time;

[0018] The correlation mapping between the pressure value and the corresponding multi-dimensional deformation data of the to-be-tested solid state disk and the hardware configuration information is established, and the deformation behavior analysis matrix of the to-be-tested solid state disk is generated.

[0019] Optionally, the to-be-tested solid state disk after synchronous pressing test is subjected to appearance consistency detection and performance detection respectively, and the appearance detection defects and performance degradation indicators of the to-be-tested solid state disk are obtained, including:

[0020] The to-be-tested solid state disk after synchronous pressing test is subjected to multi-angle image collection, and the appearance defects of the to-be-tested solid state disk are automatically identified based on a defect identification algorithm;

[0021] The to-be-tested solid state disk after appearance defect identification is subjected to multi-dimensional performance scanning, and the performance data of the to-be-tested solid state disk after synchronous pressing test is obtained;

[0022] The performance data of the to-be-tested solid state disk after the synchronous press test is compared with the benchmark performance data after the initial performance calibration, and the decay rate of each performance index of the to-be-tested solid state disk is calculated.

[0023] Optionally, the solder joint of the to-be-tested solid state disk after the appearance consistency detection and performance detection is subjected to red ink dyeing test to obtain the solder joint state of the to-be-tested solid state disk, including:

[0024] The ball grid array package chip of the to-be-tested solid state disk after the appearance consistency detection and performance detection is immersed in red ink dye, and the ball grid array package chip is subjected to penetration treatment in a vacuum;

[0025] The ball grid array package chip after the penetration treatment is subjected to solidification treatment, and the solidified ball grid array package chip is separated from the printed circuit board;

[0026] The chip solder ball and the printed circuit board pad of the separated to-be-tested solid state disk are subjected to image acquisition to obtain the solder joint dyeing morphology characteristics of the to-be-tested solid state disk;

[0027] Based on the solder joint dyeing morphology characteristics of the to-be-tested solid state disk, the crack propagation degree, the fracture mode and the dyeing area ratio of the solder joint of the to-be-tested solid state disk are quantitatively analyzed, and the solder joint failure state of the to-be-tested solid state disk is determined.

[0028] Optionally, the correlation between the pressure deformation data of each preset point of the to-be-tested solid state disk and the appearance detection defects, the performance decay index and the solder joint state is analyzed, and whether the to-be-tested solid state disk meets the preset qualified standard is determined, including:

[0029] Based on the pressure deformation data of each preset point of the to-be-tested solid state disk, feature parameters of each preset point of the to-be-tested solid state disk are extracted, and the feature parameters include the pressure peak value, the deformation amount and the deformation rate of each preset point of the to-be-tested solid state disk;

[0030] An association model between the feature parameters of each preset point and the appearance detection defects, the performance decay index and the solder joint state is constructed, and the reliability score of the to-be-tested solid state disk is calculated based on the constructed association model;

[0031] The calculated reliability score of the to-be-tested solid state disk is compared with the preset reliability score threshold, and whether the to-be-tested solid state disk meets the preset qualified standard is determined.

[0032] Optionally, after the correlation between the pressure deformation data of each preset point of the to-be-tested solid state disk and the appearance detection defects, the performance decay index and the solder joint state is analyzed, and whether the to-be-tested solid state disk meets the preset qualified standard is determined, the method further includes:

[0033] The pressure deformation data, appearance detection defects, performance attenuation indexes and solder state of each preset point of the to-be-tested solid state disk are input into the pre-trained health prediction model to predict the residual life prediction value and the corresponding confidence interval of the to-be-tested solid state disk under the working load.

[0034] The predicted residual life prediction value and the corresponding confidence interval are updated to the corresponding full life cycle digital archives of the to-be-tested solid state disk.

[0035] In a second aspect, the present application provides a synchronous pressing test device for a solid state disk, comprising:

[0036] An acquisition module is configured to acquire a to-be-tested solid state disk and perform initial performance calibration on the to-be-tested solid state disk.

[0037] A first test module is configured to perform synchronous pressing tests on a plurality of preset points of the to-be-tested solid state disk after initial performance calibration, and collect pressure deformation data of each preset point of the to-be-tested solid state disk.

[0038] A detection module is configured to perform appearance consistency detection and performance detection on the to-be-tested solid state disk after the synchronous pressing test, respectively, to obtain appearance detection defects and performance attenuation indexes of the to-be-tested solid state disk.

[0039] A second test module is configured to perform red ink dyeing test on the solder points of the to-be-tested solid state disk after the appearance consistency detection and the performance detection, to obtain the solder state of the to-be-tested solid state disk.

[0040] A determination module is configured to analyze the correlation between the pressure deformation data of each preset point of the to-be-tested solid state disk and the appearance detection defects, the performance attenuation indexes and the solder state, and determine whether the to-be-tested solid state disk meets a preset qualified standard.

[0041] In a third aspect, the present application provides a computer device, which comprises a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory complete mutual communication through the communication bus.

[0042] The memory is configured to store a computer program.

[0043] The processor is configured to execute the program stored on the memory, to realize the steps of the synchronous pressing test method for the solid state disk according to any one of the first aspect.

[0044] In a fourth aspect, the present application provides a computer readable storage medium, which stores a computer program, and the computer program is executed by the processor to realize the steps of the synchronous pressing test method for the solid state disk according to any one of the first aspect.

[0045] Compared with the prior art, the application provides a solid state disk synchronous pressing test method, device, equipment and storage medium, which can more truly simulate the complex multi-point pressing scene that the solid state disk may face in actual application by performing synchronous pressing test on multiple preset points of the solid state disk after initial performance calibration; by arranging test points in different key areas, the weak links of the structure of the printed circuit board of the solid state disk can be accurately identified. In addition, by analyzing the correlation between the pressure deformation data of each preset point and the appearance detection defects, performance attenuation indicators and solder state, the comprehensive and accurate evaluation of the mechanical reliability of the solid state disk can be realized, so that the products with normal performance in the test but with potential high failure risk can be effectively identified and screened out, the long-term reliability of the products is significantly improved, and the overall efficiency of the pressing test of the solid state disk is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only show some of the embodiments of the application, and not all the embodiments. For those skilled in the art, other drawings obtained according to these drawings without creative labor are within the protection scope of the present application.

[0047] Figure 1 is a flowchart of a solid state disk synchronous pressing test method provided by an embodiment of the application.

[0048] Figure 2 is a flowchart of synchronous pressing test on multiple preset points provided by an embodiment of the application.

[0049] Figure 3 is a flowchart of solid state disk performance detection provided by an embodiment of the application.

[0050] Figure 4 is a flowchart of red ink test on a solid state disk sample provided by an embodiment of the application.

[0051] Figure 5 is a solid state disk synchronous pressing test device provided by an embodiment of the application.

[0052] Figure 6 is a structural schematic diagram of a computer device provided by an embodiment of the application.

[0053] Figure 7 is a structural schematic diagram of a computer readable storage medium provided by an embodiment of the application. DETAILED DESCRIPTION

[0054] In order to make the objectives, technical solutions and advantages of the present application clearer, further detailed description will be given below in conjunction with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0055] In order to make the description of the present disclosure more detailed and complete, the following describes the embodiments of the present application and specific examples; but this is not the only form of implementation or use of the specific embodiments of the present application. The embodiments include the features of the specific embodiments and the method steps and their order for constructing and operating these specific embodiments. However, other specific embodiments can also be used to achieve the same or equivalent functions and step sequences. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0056] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0057] In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in the text only describes the relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two, and other quantifiers similar thereto should be understood. The preferred embodiments described herein are only used to illustrate and explain the present application, and do not limit the present application, and the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0058] In order to solve the technical problem of low efficiency of the existing solid state disk synchronous pressing test, the embodiment of the present application provides a solid state disk synchronous pressing test method, which comprises the steps of Figure 1 The flow chart of the solid state disk synchronous pressing test method provided by the embodiment of the present application comprises the following steps.

[0059] S10: Obtain a to-be-tested solid state disk and perform initial performance calibration on the to-be-tested solid state disk. Specifically, in the embodiment of the present application, the performance test software can be used to obtain the benchmark values of key parameters such as continuous read-write speed and random access time, so as to improve the test from qualitative judgment to quantitative analysis, provide an analysis basis for subsequent performance degradation calculation, and consider the initial performance differences of different solid state disks caused by production batch, main control chip, flash memory type, etc., so as to ensure the accuracy of the test results.

[0060] S20: Perform synchronous pressing test on the to-be-tested solid state disk after initial performance calibration at multiple preset points, and collect pressure deformation data of each preset point of the to-be-tested solid state disk. Specifically, in the embodiment of the present application, compared with single-point pressing, the synchronous pressing test can more truly simulate the complex stress scenarios in reality, such as uneven extrusion of the hard disk and installation in a deformed case, and avoids the defect of single working condition of the traditional test method. By arranging test points in different key areas, the structural weak points of the PCB of the solid state disk can be accurately found, and multi-dimensional pressure deformation data can be provided.

[0061] S30: Perform appearance consistency detection and performance detection on the to-be-tested solid state disk after the synchronous pressing test, and obtain appearance detection defects and performance degradation indexes of the to-be-tested solid state disk. Specifically, in the embodiment of the present application, by performing appearance consistency detection on the to-be-tested solid state disk after the synchronous pressing test, it can be detected whether the to-be-tested solid state disk has appearance defects such as cracks and deformation; by performing performance detection on the to-be-tested solid state disk after the synchronous pressing test, it can be detected whether the read-write function of the to-be-tested solid state disk is normal and whether the performance is decreased.

[0062] S40: Perform red ink dyeing test on the welding points of the to-be-tested solid state disk after the appearance consistency detection and performance detection, and obtain the welding point state of the to-be-tested solid state disk. Specifically, in the embodiment of the present application, the red ink test can effectively analyze the potential fracture and micro-cracks of the ball grid array packaging chip welding points, and the welding point defects of the to-be-tested solid state disk may not be found in appearance inspection and function test, and the potential fracture and micro-cracks can be found through the red ink dyeing test.

[0063] S50: analyze the correlation between the pressure deformation data of each preset point of the to-be-tested solid state disk and the appearance detection defects, performance decay indicators and solder joint states, and determine whether the to-be-tested solid state disk meets the preset qualified standard. Specifically, in the embodiment of the present application, the traditional qualified determination may only focus on whether it is pressed off or whether the function is normal. The present application performs correlation analysis on the pressure deformation data of each preset point and the appearance detection defects, performance decay indicators and solder joint states, so that the detection of the to-be-tested solid state disk is more accurate. For example, even if the function of the to-be-tested solid state disk is normal, if there is a strong correlation between the deformation data and the solder joint micro-cracks, it is also determined as unqualified, so as to screen out those products that pass the test but have high risk of future failure, and significantly improve the long-term reliability of the product.

[0064] As an optional implementation, in step S10, the to-be-tested solid state disk is obtained, and the to-be-tested solid state disk is subjected to initial performance calibration, including:

[0065] S11: performing initial performance scanning on the to-be-tested solid state disk, collecting at least one key performance parameter of the to-be-tested solid state disk, such as continuous read-write speed, random read-write speed and random access time, and generating baseline performance data of the to-be-tested solid state disk. Specifically, in the embodiment of the present application, by collecting key performance parameters such as continuous read-write speed, random read-write speed and random access time, a detection standard can be set for each to-be-tested solid state disk. The initial performance difference caused by the inherent factors such as the slight difference of flash memory particles and the individual characteristics of the master control chip of different solid state disks is quantified. For example, a hard disk with a faster initial read-write speed and a slower hard disk may exhibit the same absolute performance value after being subjected to the same stress, but the damage degree represented by them is different. The relative decay index based on itself can more truly reflect the actual impact of mechanical stress on it.

[0066] S12: establishing a full life cycle digital file for the to-be-tested solid state disk, and the life cycle digital file at least records the production batch information, hardware configuration information and baseline performance data of the to-be-tested solid state disk. Specifically, in the embodiment of the present application, by establishing a full life cycle digital file for the to-be-tested solid state disk, when batch unqualified test occurs, the specific production batch or certain hardware configuration can be traced back through the file, effectively shortening the problem positioning time in the solid state disk test.

[0067] As an optional implementation, Figure 2 The, Figure 2 is a flowchart of a plurality of preset point synchronous pressing tests provided by an embodiment of the present application. In step S20, the to-be-tested solid state disk subjected to initial performance calibration is subjected to synchronous pressing test of a plurality of preset points, and the pressure deformation data of each preset point of the to-be-tested solid state disk is collected, including:

[0068] S21: dynamically identify the key chip area on the back of the to-be-tested solid state disk based on the hardware configuration information in the full life cycle digital archive, and preset a pressing test point in the identified key chip area. Specifically, in the embodiment of the present application, by calling the hardware configuration information in the full life cycle digital archive, the test can automatically identify the most critical and fragile functional areas such as the master control chip, flash memory and power management chip, and accurately preset the test point in these areas, so as to ensure that the test stress can be applied to the key components and avoid missed detection due to point deviation, thereby significantly improving the test coverage and efficiency.

[0069] S22: performing synchronous incremental pressing test on each preset point of the to-be-tested solid state disk by a multi-pressure head array, and collecting the pressure value and corresponding multi-dimensional deformation data of each preset point in real time. Specifically, in the embodiment of the present application, the multi-pressure head array can be used to simultaneously perform synchronous incremental pressing test on multiple predetermined areas on the back of the to-be-tested solid state disk, for example, the left, middle and right points of the to-be-tested solid state disk and the positions corresponding to the master control and flash memory chips can be pressed. Each preset point can be synchronously pressed by a pressure head with a diameter of 3mm, for example, 5N, 15N and 23N, until the displacement deformation value under the preset deformation limit or pressure limit is reached, and then the pressure value and displacement deformation value of each preset point are collected. In addition, temperature-coupled mechanical stress test can be performed on the to-be-tested solid state disk, the entire pressing test platform is placed in a programmable temperature control box, and the above pressing test is repeated under three typical working conditions of low temperature, normal temperature and high temperature, wherein the low temperature can be-10℃, the normal temperature can be 25℃ and the high temperature can be 60℃.

[0070] S23: establishing the association mapping between the pressure value and corresponding multi-dimensional deformation data of the to-be-tested solid state disk and the hardware configuration information, and generating a deformation behavior analysis matrix of the to-be-tested solid state disk. Specifically, in the embodiment of the present application, the collected pressure value and corresponding multi-dimensional deformation data are associated with the hardware configuration information to generate a deformation behavior analysis matrix, which can form a knowledge base that can be analyzed and queried.

[0071] As an optional implementation, Figure 3 The, Figure 3 is a flowchart of a solid state disk performance detection provided by the embodiment of the present application. In step S30, the to-be-tested solid state disk after synchronous pressing test is detected for appearance consistency and performance, to obtain appearance detection defects and performance attenuation indexes of the to-be-tested solid state disk, including:

[0072] S31: After the synchronous pressing test of the to-be-tested solid state disk, multi-angle image acquisition is performed, and the appearance defects of the to-be-tested solid state disk are automatically identified based on a defect identification algorithm. Specifically, in the embodiment of the present application, multi-angle image acquisition is performed on the to-be-tested solid state disk after the synchronous pressing test, so that deformations or cracks that can be observed from different angles can be captured. Through the defect identification algorithm, the appearance defects of the to-be-tested solid state disk are automatically identified, not only the existence of the defects can be identified, but also the type, size and accurate position of the defects can be recorded and quantified, providing rich structured data for subsequent correlation analysis.

[0073] S32: After the appearance defect identification of the to-be-tested solid state disk, multi-dimensional performance scanning is performed, and the performance data of the to-be-tested solid state disk after the synchronous pressing test is obtained. Specifically, in the embodiment of the present application, the pressing test of the solid state disk can cause multiple performance degradation modes, for example, the virtual welding of the main control chip can affect the random read-write ability, and the damage of the storage chip channel can affect the continuous read-write speed. Multi-dimensional testing ensures that various potential functional damages can be captured comprehensively, avoiding missed detection.

[0074] S33: The performance data of the to-be-tested solid state disk after the synchronous pressing test is compared with the benchmark performance data after the initial performance calibration, and the decay rate of each performance index of the to-be-tested solid state disk is calculated. Specifically, in the embodiment of the present application, the comparison of the performance data after the test and the benchmark performance data after the initialization can calculate the accurate performance decay rate, for example, the read-write speed is decreased by 5%. The traditional test may only satisfy the qualitative judgment of normal function. However, the present application can detect the performance decline of the to-be-tested solid state disk in the case of not completely failing, effectively improving the accuracy of the pressing test of the to-be-tested solid state disk.

[0075] As an optional implementation, Figure 4 The, Figure 4 is a flowchart for red ink test of a solid state disk sample provided by the embodiment of the present application. In step S40, the solder joints of the to-be-tested solid state disk after the appearance consistency detection and performance detection are subjected to red ink dyeing test, and the state of the solder joints of the to-be-tested solid state disk is obtained, including:

[0076] S41: The ball grid array package chip of the to-be-tested solid state disk after the appearance consistency detection and performance detection is immersed in red ink dye, and the ball grid array package chip is subjected to penetration treatment in vacuum. Specifically, in the embodiment of the present application, the penetration is performed in vacuum environment. The vacuum can eliminate air resistance, so that the red ink dye can penetrate into the deep crack under the capillary action, and the potential crack that is completely invisible in X-ray or appearance inspection can be found.

[0077] S42: solidifying the BGA package chip after the permeation treatment, and separating the solidified BGA package chip from the printed circuit board. Specifically, in the embodiment of the present application, the solidification treatment locks the permeated dye firmly inside the crack, preventing loss or contamination in subsequent operations. The solidified BGA package chip is separated from the printed circuit board, which can expose the real, undamaged fracture surface, and clearly distinguish whether the fracture occurs between the chip and the solder ball, inside the solder ball, or between the solder ball and the PCB pad.

[0078] S43: image acquisition of the chip solder ball and the printed circuit board pad of the separated solid state drive to be tested, to obtain the solder joint dyeing morphology characteristics of the solid state drive to be tested. Specifically, in the embodiment of the present application, image acquisition is performed on both sides of the chip solder ball and the PCB pad to obtain complete dyeing morphology characteristics, replacing the old mode of subjective observation and description by engineers under a microscope, so that the analysis results are reviewable and traceable.

[0079] S44: quantitative analysis of the crack propagation degree, fracture mode and dyeing area ratio of the solder joint of the solid state drive to be tested based on the solder joint dyeing morphology characteristics of the solid state drive to be tested, and determination of the solder joint failure state of the solid state drive to be tested. Specifically, in the embodiment of the present application, the crack propagation degree, fracture mode and dyeing area ratio are quantitatively analyzed, and the severity of the damage is quantified, providing more refined judgment criteria for the press test of the solid state drive to be tested.

[0080] As an optional implementation, in step S50, the analysis of the correlation between the pressure deformation data of each preset point of the solid state drive to be tested and the appearance detection defects, performance degradation indicators and solder joint state, and the determination of whether the solid state drive to be tested meets the preset qualified standard, includes:

[0081] S51: extracting feature parameters of each preset point of the solid state drive to be tested based on the pressure deformation data of each preset point of the solid state drive to be tested, the feature parameters including the pressure peak value, deformation amount and deformation rate of each preset point of the solid state drive to be tested. Specifically, in the embodiment of the present application, the complex pressure deformation data is extracted into quantifiable feature parameters, providing a measurement standard for comparison between different samples and different tests.

[0082] S52: build the correlation model between the characteristic parameters of each preset point and the appearance detection defects, performance decay indicators and the welding point state, and calculate the reliability score of the to-be-tested solid state disk based on the built correlation model. Specifically, in the embodiment of the present application, the four-dimensional information of the characteristic parameters of each preset point of the to-be-tested solid state disk, the appearance defects, the performance decay and the welding point state is deeply fused through the correlation model. The model can learn the complex and nonlinear relationship between them. The traditional determination is isolated, for example, no cracks in appearance, but if the deformation data is abnormal, there is no risk of welding point, and the product reliability may not be qualified, which more comprehensively evaluates the health status of the to-be-tested solid state disk.

[0083] S53: compare the calculated reliability score of the to-be-tested solid state disk with the preset reliability score threshold to determine whether the to-be-tested solid state disk meets the preset qualified standard. Specifically, in the embodiment of the present application, the preset reliability score threshold is set to 70 points. When the reliability score of the to-be-tested solid state disk exceeds 70 points, it is determined to be qualified; otherwise, it is determined to be unqualified. Comparing the calculated score with the preset reliability score threshold effectively prevents the determination difference caused by experience and subjective judgment of different quality inspection personnel, and ensures the high uniformity of product quality standard.

[0084] In the embodiment of the present application, the reliability score The results of each key test index are calculated by weighting, and the calculation formula is shown as formula (1):

[0085] (1)

[0086] Wherein, is the deformation consistency score of the to-be-tested solid state disk, is the performance retention rate score of the to-be-tested solid state disk, is the welding point state score of the to-be-tested solid state disk, which is calculated based on the proportion of the broken area of the welding point in the red ink test; 、 、 is a weight coefficient, and In the embodiment of the present application, it is preferably 、 、 .

[0087] As an optional implementation, after the correlation between the pressure deformation data of each preset point of the to-be-tested solid state disk and the appearance detection defects, performance decay indicators and welding point state is analyzed, and whether the to-be-tested solid state disk meets the preset qualified standard is determined, the method further comprises:

[0088] S61: input the pressure deformation data of each preset point of the to-be-tested solid state disk, the appearance detection defects, the performance attenuation indicators and the solder joint state into the pre-trained health prediction model, and predict the residual life prediction value of the to-be-tested solid state disk under the working load and the corresponding confidence interval. Specifically, in the embodiment of the present application, the pre-trained health prediction model is a machine learning model trained based on historical data, such as a random forest or a gradient boosting decision tree regression model. The training data of the model is derived from the test and tracking of a large number of known historical samples. Each historical sample needs to obtain feature data and label data in the test, wherein the feature data includes pressure deformation curve characteristic value, deformation consistency index, appearance defect parameter, performance attenuation rate, solder joint fracture area and mode, etc. The label data includes the actual service life recorded by each historical sample under the simulated or real working load until failure. The test data of the to-be-tested solid state disk is input into the pre-trained health prediction model, and the output is no longer a simple qualified or unqualified label, but a residual life prediction value of the to-be-tested solid state disk under a specific working load, which enables customers to foresee the future of the product, thereby upgrading the quality management from passive screening at the time of factory shipment to active planning and risk control throughout the product life cycle.

[0089] S62: update the predicted residual life prediction value and the corresponding confidence interval to the corresponding full life cycle digital archive of the to-be-tested solid state disk. Specifically, in the embodiment of the present application, the predicted residual life and the production batch, hardware configuration and all test data results of the product are integrated in a unified digital archive, and all the basic information and test information of the to-be-tested solid state disk are traceable.

[0090] Based on the above-mentioned synchronous pressing test method of the solid state disk, the embodiment of the present application provides a synchronous pressing test device of the solid state disk, as shown in Figure 5 , the structural schematic diagram is as shown in Figure 5 , the synchronous pressing test device of the solid state disk comprises: an acquisition module 51, configured to acquire a to-be-tested solid state disk and perform initial performance calibration on the to-be-tested solid state disk; a first test module 52, configured to perform synchronous pressing test on a plurality of preset points of the to-be-tested solid state disk after initial performance calibration, and collect pressure deformation data of each preset point of the to-be-tested solid state disk; a detection module 53, configured to respectively perform appearance consistency detection and performance detection on the to-be-tested solid state disk after the synchronous pressing test, and obtain appearance detection defects and performance attenuation indicators of the to-be-tested solid state disk; a second test module 54, configured to perform red ink dyeing test on the solder joint of the to-be-tested solid state disk after the appearance consistency detection and the performance detection, and obtain the solder joint state of the to-be-tested solid state disk; and a determination module 55, configured to analyze the correlation between the pressure deformation data of each preset point of the to-be-tested solid state disk and the appearance detection defects, the performance attenuation indicators and the solder joint state, and determine whether the to-be-tested solid state disk meets the preset qualified standard.

[0091] For other details of the implementation of the above technical solutions by the modules in the synchronous pressing test device of the solid state disk, refer to the description in the synchronous pressing test method of the solid state disk provided in the above embodiments, which will not be repeated here.

[0092] Please refer to Figure 6 A structural schematic diagram of a computer device provided by the embodiments of the present application is shown in FIG. 1. The device includes a processor 601, which can be implemented in the form of a general-purpose central processing unit (CPU), a microprocessor, an application specific integrated circuit (ASIC), or one or more integrated circuits, etc., for executing relevant programs to implement the technical solutions provided by the embodiments of the present application; a memory 602, which can be implemented in the form of a read only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM), etc. The memory 602 can store an operating system and other application programs. When the technical solutions provided by the embodiments of the present application are implemented by software or firmware, the relevant program codes are saved in the memory 602 and are called and executed by the processor 601 to implement the synchronous pressing test method of the solid state disk according to the embodiments of the present application; an input / output interface 603 for realizing information input and output; a communication interface 604 for realizing the communication interaction between the device and other devices, which can realize communication through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.); a bus 605 for transmitting information between the various components (such as the processor 601, the memory 602, the input / output interface 603, and the communication interface 604) of the device; and wherein the processor 601, the memory 602, the input / output interface 603, and the communication interface 604 are connected to each other through the bus 605 for internal communication within the device.

[0093] Please refer to Figure 7Fig. 7 is a schematic diagram of a computer-readable storage medium according to an embodiment of the present application. The storage medium 70 according to the embodiment of the present application stores program instructions 71 for implementing the synchronous pressing test method of the solid state disk. The program instructions 71 can be stored in the storage medium in the form of a software product, and include instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to execute all or part of the steps of the method according to the embodiments of the present application. The storage medium includes a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc., and can be a computer, a server, a mobile phone, a tablet, etc.

[0094] In the several embodiments of the present application, it should be understood that the disclosed device and method can be implemented in other ways. For example, the device embodiments described above are only schematic. The division of the units is only a logical function division. There can be another division manner in actual implementation. For example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interface, device or unit, and can be electrical, mechanical or in other forms.

[0095] In addition, each function unit in the embodiments of the present application can be integrated into a processing unit, or each unit can exist alone physically, or two or more units can be integrated into one unit. The integrated unit can be realized in the form of hardware, or can be realized in the form of a software function unit. The above is only an implementation manner of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent flow transformation made by using the content of the specification and drawings of the present application, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

[0096] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Although the present application has been disclosed as above with reference to the preferred embodiments, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed technical content to obtain equivalent embodiments, as long as the changes or modifications do not deviate from the technical solution of the present application. Any simplification, modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application are still within the scope of the technical solution of the present application.

Claims

1. A synchronous press test method of a solid state drive, characterized by, The method comprises the following steps: obtaining a to-be-tested solid state disk and performing initial performance calibration on the to-be-tested solid state disk; performing synchronous pressing tests on multiple preset points of the to-be-tested solid state disk after initial performance calibration, and collecting pressure deformation data of each preset point of the to-be-tested solid state disk; respectively performing appearance consistency detection and performance detection on the to-be-tested solid state disk after the synchronous pressing tests, and obtaining appearance detection defects and performance attenuation indexes of the to-be-tested solid state disk; performing red ink dyeing tests on the solder joints of the to-be-tested solid state disk after the appearance consistency detection and performance detection, and obtaining the solder joint state of the to-be-tested solid state disk; analyzing the correlation between the pressure deformation data of each preset point of the to-be-tested solid state disk and the appearance detection defects, the performance attenuation indexes and the solder joint state, and determining whether the to-be-tested solid state disk meets the preset qualified standard. 2.The method of claim 1, wherein, The step of obtaining the to-be-tested solid state disk and performing initial performance calibration on the to-be-tested solid state disk comprises the following steps: performing initial performance scanning on the to-be-tested solid state disk, collecting at least one key performance parameter in continuous read-write speed, random read-write speed and random access time of the to-be-tested solid state disk, and generating baseline performance data of the to-be-tested solid state disk; establishing a full life cycle digital file of the to-be-tested solid state disk, and recording at least production batch information, hardware configuration information and baseline performance data of the to-be-tested solid state disk in the full life cycle digital file. 3.The method of claim 2, wherein, The step of performing synchronous pressing tests on multiple preset points of the to-be-tested solid state disk after initial performance calibration, and collecting pressure deformation data of each preset point of the to-be-tested solid state disk comprises the following steps: based on the hardware configuration information in the full life cycle digital file, dynamically identifying the key chip area on the back of the to-be-tested solid state disk, and presetting pressing test points in the identified key chip area; performing synchronous incremental pressing tests on each preset point of the to-be-tested solid state disk for a preset number of times by a multi-pressure head array, and collecting pressure values and corresponding multi-dimensional deformation data of each preset point in real time; establishing a correlation mapping between the pressure values and the corresponding multi-dimensional deformation data of the to-be-tested solid state disk and the hardware configuration information, and generating a deformation behavior analysis matrix of the to-be-tested solid state disk. 4.The method of claim 3, wherein, The step of respectively performing appearance consistency detection and performance detection on the to-be-tested solid state disk after the synchronous pressing tests, and obtaining appearance detection defects and performance attenuation indexes of the to-be-tested solid state disk comprises the following steps: performing multi-angle image collection on the to-be-tested solid state disk after the synchronous pressing tests, and automatically identifying appearance defects of the to-be-tested solid state disk based on a defect recognition algorithm; performing multi-dimensional performance scanning on the to-be-tested solid state disk after appearance defect recognition, and obtaining performance data of the to-be-tested solid state disk after the synchronous pressing tests; comparing the performance data of the to-be-tested solid state disk after the synchronous pressing tests with the baseline performance data after the initial performance calibration, and calculating the attenuation rate of each performance index of the to-be-tested solid state disk. 5.The synchronous press test method of a solid state drive according to claim 1, wherein, The step of performing red ink dyeing tests on the solder joints of the to-be-tested solid state disk after the appearance consistency detection and performance detection, and obtaining the solder joint state of the to-be-tested solid state disk comprises the following steps: immersing the ball grid array package chip of the to-be-tested solid state disk after the appearance consistency detection and performance detection in red ink dye, and performing penetration treatment on the ball grid array package chip in a vacuum. The ball grid array package chip after the penetration treatment is subjected to a solidification treatment, and the ball grid array package chip after the solidification is separated from the printed circuit board; Image acquisition is performed on the chip solder balls and the printed circuit board pads of the separated solid state disk to be tested to obtain the solder joint dyeing morphology characteristics of the solid state disk to be tested; Based on the solder joint dyeing morphology characteristics of the solid state disk to be tested, the crack propagation degree, the fracture mode and the dyeing area ratio of the solder joint of the solid state disk to be tested are quantitatively analyzed, and the solder joint failure state of the solid state disk to be tested is determined. 6.The method of claim 1, wherein, The correlation between the pressure deformation data of each preset point of the solid state disk to be tested and the appearance detection defects, the performance attenuation indicators and the solder joint state is analyzed, and whether the solid state disk to be tested reaches the preset qualified standard is determined, including: Based on the pressure deformation data of each preset point of the solid state disk to be tested, the characteristic parameters of each preset point of the solid state disk to be tested are extracted, and the characteristic parameters include the pressure peak value, the deformation amount and the deformation rate of each preset point of the solid state disk to be tested; An association model between the characteristic parameters of each preset point and the appearance detection defects, the performance attenuation indicators and the solder joint state is constructed, and the reliability score of the solid state disk to be tested is calculated based on the constructed association model; The calculated reliability score of the solid state disk to be tested is compared with the preset reliability score threshold value, and whether the solid state disk to be tested reaches the preset qualified standard is determined.

7. The method of claim 6, wherein, After the correlation between the pressure deformation data of each preset point of the solid state disk to be tested and the appearance detection defects, the performance attenuation indicators and the solder joint state is analyzed, and whether the solid state disk to be tested reaches the preset qualified standard is determined, the method further includes: The pressure deformation data of each preset point of the solid state disk to be tested, the appearance detection defects, the performance attenuation indicators and the solder joint state are input into the pre-trained health prediction model to predict the residual life prediction value and the corresponding confidence interval of the solid state disk to be tested under the working load; The predicted residual life prediction value and the corresponding confidence interval are updated to the corresponding full life cycle digital archives of the solid state disk to be tested.

8. A synchronous pressing test device for a solid-state drive, characterized in that, It includes: An acquisition module is configured to acquire a solid state disk to be tested and perform initial performance calibration on the solid state disk to be tested; A first test module is configured to perform synchronous pressing tests on a plurality of preset points of the solid state disk to be tested after initial performance calibration, and to collect pressure deformation data of each preset point of the solid state disk to be tested; A detection module is configured to perform appearance consistency detection and performance detection on the solid state disk to be tested after the synchronous pressing tests, and to obtain appearance detection defects and performance attenuation indicators of the solid state disk to be tested; A second test module is configured to perform red ink dyeing tests on solder joints of the solid state disk to be tested after the appearance consistency detection and the performance detection, and to obtain solder joint states of the solid state disk to be tested; A determination module is configured to analyze the correlation between the pressure deformation data of each preset point of the solid state disk to be tested and the appearance detection defects, the performance attenuation indicators and the solder joint state, and to determine whether the solid state disk to be tested reaches the preset qualified standard.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, The processor executes the computer program to implement the steps of the synchronous pressing test method of the solid state disk according to any one of claims 1 to 7.

10. A computer-readable storage medium storing a computer program, the computer program comprising instructions that, when executed by a computer, cause the computer to perform the method of any one of claims 1 to 9. The computer program, when executed by a processor, implements the steps of the method for synchronously pressing test of the solid state disk according to any one of claims 1 to 7.

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