Reconstituted glass panels for hybrid panel fabrication

Abstract

Embodiments disclosed herein include an apparatus including a first layer having a first surface, a second surface, and a sidewall surface coupling the first surface to the second surface. In an embodiment, the first layer includes a glass layer. In an embodiment, the second layer is on the first surface, the second surface, and the sidewall surface of the first layer. In an embodiment, the second layer is an organic dielectric material. In an embodiment, the third layer is on the second layer, and the third layer is a metal material. In an embodiment, an edge of the third layer is substantially coplanar with an edge of the second layer.

Description

Background Technology

[0001] Electronic packaging substrates typically include a core. Existing core materials include organic dielectrics that may include fiber-reinforced materials. As devices continue to become more complex, there is a growing demand for better core materials. A packaging core comprising a solid glass layer is a potential option. Glass cores provide a stiffer substrate, a flatter surface, and can improve electrical performance.

[0002] However, the fragile nature of glass makes the edges of full-size glass panels extremely susceptible to damage due to frequent contact with the edges during handling and processing. Specific toolsets for handling and processing glass panels require special design and are not widely available in industry. This results in high costs for technological upgrades to enable a switch from core-based processing to glass-core processing in high-volume manufacturing (HVM) environments. Attached Figure Description

[0003] Figure 1A This is a plan view of a hybrid panel having a glass substrate and a frame surrounding the glass substrate according to an embodiment.

[0004] Figure 1B-1E This is a cross-sectional view depicting a process for assembling a hybrid panel having a glass substrate and an organic framework according to an embodiment.

[0005] Figure 2A and Figure 2B This is a cross-sectional view of the hybrid panel according to an additional embodiment.

[0006] Figure 3 This is a flowchart of a process for forming a hybrid panel having a glass substrate and an organic framework, according to an embodiment.

[0007] Figures 4A-4F This is a cross-sectional view depicting a process for assembling a hybrid panel having a glass substrate and an organic framework according to an embodiment.

[0008] Figure 5 This is a flowchart of a process for forming a hybrid panel having a glass substrate and an organic frame with trimmed edges, according to an embodiment.

[0009] Figure 6A This is a cross-sectional view of a reconstructed panel held by a frame according to an embodiment, wherein multiple glass units are within the frame.

[0010] Figure 6B This is a cross-sectional view of a reconstructed panel held by a frame according to an embodiment, wherein a quarter panel unit is within the frame.

[0011] Figure 6C This is a cross-sectional view of a reconstructed panel held by a frame according to an embodiment, wherein the panel-level glass substrate is within the frame.

[0012] Figures 7A-7E This is a cross-sectional view depicting a process for forming units from a hybrid frame according to an embodiment.

[0013] Figures 8A-8C This is a cross-sectional view depicting a process for forming units from a hybrid frame according to an embodiment.

[0014] Figure 9 This is a flowchart of a process for forming a unit device from a hybrid frame, according to an embodiment.

[0015] Figure 10 This is a cross-sectional view of a packaging substrate cut from a hybrid frame according to an embodiment.

[0016] Figure 11 This is a cross-sectional view of an electronic system having a packaging substrate including a glass core, according to an embodiment.

[0017] Figure 12 This is a schematic diagram of a computing device constructed according to an embodiment. Detailed Implementation

[0018] According to various embodiments, this document describes a reconstructed panel having a glass substrate surrounded by a dielectric frame. In the following description, terms commonly used by those skilled in the art will be used to describe various aspects of the illustrative embodiments to convey the essence of their work to those skilled in the art. However, it will be apparent to those skilled in the art that the present disclosure may be practiced using only some of the described aspects. Specific quantities, materials, and configurations are set forth for purposes of explanation to provide a thorough understanding of the illustrative embodiments. However, it will be apparent to those skilled in the art that the present disclosure may be practiced without specific details. In other instances, well-known features have been omitted or simplified so as not to obscure the illustrative embodiments.

[0019] Various operations will be described as multiple discrete operations, and then described in a manner most conducive to understanding this disclosure; however, the order of description should not be construed as implying that these operations necessarily depend on the order. In particular, these operations do not need to be performed in the order presented.

[0020] This document describes various embodiments or aspects of the present disclosure. In some implementations, different embodiments are practiced separately. However, the embodiments are not limited to those practiced in isolation. For example, two or more different embodiments may be combined together to be practiced as a single device, process, structure, etc. In some cases, the entirety of the various embodiments may be combined together. In other cases, a portion of a first embodiment may be combined with portions of one or more different embodiments. For example, a portion of a first embodiment may be combined with a portion of a second embodiment, or a portion of a first embodiment may be combined with portions of a second embodiment and a third embodiment.

[0021] As mentioned above, compared to existing organic core solutions, encapsulation substrates including glass cores have the potential to improve some manufacturing processes and achieve higher-performance devices. However, glass substrates are fragile. For example, contact with the edges of a glass substrate can lead to shattering, cracking, etc. The development of new processing tools is one option for handling glass core substrates, but this approach would be expensive.

[0022] Therefore, the embodiments disclosed herein include the use of hybrid panels. In a hybrid panel, a glass substrate is surrounded by a frame comprising an organic substrate. The glass substrate and the frame can be molded together (e.g., using a deposited film, etc.). Since the outer edge of the hybrid panel is an organic substrate, existing manufacturing tools can be used to process the hybrid panel and protect the fragile glass substrate. In some embodiments, the glass panel can be a slightly smaller panel (SSP), and the frame can have an outer perimeter the size of the panel and an inner perimeter to accommodate the SSP.

[0023] In some embodiments, the stress at the molded joint between the frame and the glass panel may be relatively high at certain processing points. To prevent damage at the joint, the embodiments described herein may also include one or more reinforcing strips provided across the gap between the outer edge of the glass substrate and the inner edge of the frame. The reinforcing strips may include a glass cloth prepreg, a metallic material (e.g., copper), etc.

[0024] In another embodiment, the frame may be oversized, such that its outer perimeter is larger than the standard panel shape factor. After the reinforcing strip is applied over the frame and the glass substrate, the frame can be trimmed to have a panel shape factor. In such an embodiment, the outer edge of the reinforcing strip may be substantially coplanar with the outer edge of the frame.

[0025] In yet another embodiment, a reconstructed glass panel solution can be provided. In such an embodiment, the reconstructed glass panel may include multiple glass cores overmolded within an organic frame. The multiple glass cores can be processed into a larger panel to provide HVM efficiency. During single-cutting, an organic dielectric material (e.g., a deposited film) will remain on the sidewalls of the glass cores as an indication that such a reconstructed panel process is used.

[0026] Now for reference Figure 1A The image shows a plan view of a hybrid panel 100 according to an embodiment. In this embodiment, the hybrid panel 100 may include a glass substrate 120. The glass substrate 120 may be surrounded by a frame 110. In this embodiment, the frame 110 may include an organic dielectric material, such as an organic polymer having a glass fiber reinforcement. In this embodiment, a gap 125 is provided between the outer edge of the glass substrate 120 and the inner edge of the frame 110.

[0027] In one embodiment, the hybrid panel 100 may have a shape factor substantially equal to or a quarter of the standard panel shape factor for semiconductor packaging applications. That is, the outer edge of the frame 110 has an outer perimeter substantially equal to the standard shape factor. Therefore, the glass substrate 120 may have a slightly smaller panel (SSP) shape factor to fit within the frame 110.

[0028] In this embodiment, the glass substrate 120 may be substantially entirely glass. The glass substrate 120 may be a solid block comprising a glass material having an amorphous crystalline structure, wherein the solid glass core may further comprise various structures—such as vias, cavities, channels, or other features—filled with one or more other materials (e.g., metals, metal alloys, dielectric materials, etc.). Thus, the glass substrate 120 can be distinguished from, for example, the “prepreg” or “FR4” core of a printed circuit board (PCB) substrate, which typically comprises glass fibers embedded in a resinous organic material (such as epoxy resin).

[0029] The glass substrate 120 can have any suitable dimensions. In a particular embodiment, the glass substrate 120 can have a thickness of approximately 50 μm or greater. For example, the thickness of the glass substrate 120 can be between approximately 50 μm and approximately 1.4 mm. However, smaller or larger thicknesses can also be used. Individual cells from the glass substrate 120 (after single-cutting) can have an edge dimension (e.g., length, width, etc.) of approximately 10 mm or greater. For example, the edge dimension can be between approximately 10 mm and approximately 250 mm. However, larger or smaller edge dimensions can also be used. More generally, the area dimension (from a top plan view) of the individual cells in the glass substrate 120 can be between approximately 10 mm x 10 mm and approximately 250 mm x 250 mm. In an embodiment, the glass substrate 120 can have a first side perpendicular or orthogonal to the second side. In a more general embodiment, the glass substrate 120 can include a rectangular prism having segments (e.g., vias) that have been removed and filled with other materials (e.g., metal, etc.).

[0030] Glass substrate 120 may comprise a single monolithic glass layer. In other embodiments, glass substrate 120 may comprise two or more discrete glass layers stacked on top of each other. The discrete glass layers may be provided in direct contact with each other, or the discrete glass layers may be mechanically coupled to each other by an adhesive or the like. The discrete glass layers in glass substrate 120 may each have a thickness of less than about 50 μm. For example, the discrete glass layers in glass substrate 120 may have a thickness between about 25 μm and about 50 μm. However, in some embodiments, the discrete glass layers may have a greater or lesser thickness. As used herein, “about” may refer to a range of values ​​within ten percent of a specified value. For example, about 50 μm may refer to a range between 45 μm and 55 μm.

[0031] The glass substrate 120 can be any suitable glass composition that has the necessary mechanical strength and compatibility with semiconductor packaging manufacturing and assembly processes. For example, the glass substrate 120 may include aluminosilicate glass, borosilicate glass, aluminoborosilicate glass, silicon dioxide, fused silica, etc. In some embodiments, the glass substrate 120 may include one or more additives, such as, but not limited to, Al₂O₃, B₂O₃, MgO, CaO, SrO, BaO, SnO₂, Na₂O, K₂O, SrO, P₂O₃, ZrO₂, Li₂O, Ti, or Zn. More generally, the glass substrate 120 may include silicon and oxygen, and any one or more of aluminum, boron, magnesium, calcium, barium, tin, sodium, potassium, strontium, phosphorus, zirconium, lithium, titanium, or zinc. In embodiments, the glass substrate 120 may include at least 23% silicon (by weight) and at least 26% oxygen (by weight). In some embodiments, the glass substrate 120 may further include at least 5% aluminum (by weight).

[0032] exist Figure 1A In the hybrid panel 100 shown, the glass substrate 120 is not directly coupled to the frame 110. However, as will be described in more detail below, the glass substrate 120 can be secured to the frame by a filler material. The filler material can at least partially fill the gap 125 between the frame 110 and the glass substrate 120. Additionally, a reinforcing strip can be provided across the gap 125 to further reduce stress at the joint. This increases the durability and / or reliability of the hybrid panel 100.

[0033] Now for reference Figure 1B-1E The image shows a series of cross-sectional views depicting the process for forming a hybrid panel 100 having a glass substrate 120 and an organic frame 110 according to an embodiment.

[0034] Now for reference Figure 1B A cross-sectional view of a hybrid panel 100 in a manufacturing state according to an embodiment is shown. In the embodiment, the hybrid panel 100 may be similar to the above-described... Figure 1A The hybrid panel 100 is described. For example, the hybrid panel 100 includes a glass substrate 120, which may be similar to any glass substrate described in more detail herein. The glass substrate 120 may be surrounded by a frame 110. The frame 110 may include an organic layer 112. The organic layer 112 may include epoxy resin, resin, or other polymeric materials. In some embodiments, the organic layer 112 may be reinforced using glass fibers, inorganic particles, etc. In embodiments, a layer 114 may be disposed above and / or below the organic layer 112. For example, layer 114 may include copper, etc.

[0035] In an embodiment, the glass substrate 120 may include one or more vias 122 extending through the thickness of the glass substrate 120. The vias 122 may have tapered sidewalls. For example, Figure 1B The sidewalls of the via 122 have an hourglass profile. Such a profile can be produced using a laser-assisted patterning process. However, the via 122 can have any suitable profile. Pads 121 can be disposed above and / or below the via 122. The glass substrate 120 can have an SSP form factor. Therefore, the glass substrate 120 can accommodate multiple devices (not shown separately) all within the same glass substrate 120.

[0036] In one embodiment, the outer edge of the glass substrate 120 may be spaced apart from the inner edge of the frame 110 by a gap 125. The gap 125 may be up to about 50 μm, up to about 100 μm, or up to about 500 μm. However, larger gaps 125 may also be used in some embodiments. For example, in some embodiments, gaps 125 up to about 10 mm may also be used.

[0037] In this embodiment, the glass substrate 120 can be aligned within the frame 110 using any suitable alignment process. For example, alignment can be provided by a reference-based pneumatically driven positioning system, a guide pin system, a roller-based self-alignment, a mechanical push system, an adjustable base stage system, etc. In this embodiment, the relative positions of the frame 110 and the glass substrate 120 can be fixed after alignment.

[0038] Now for reference Figure 1C The diagram shows a cross-sectional view of a hybrid panel 100 after a stacked layer 126 has been provided on the top and bottom surfaces of a glass substrate 120 according to an embodiment. The stacked layer 126 may include an organic material, such as a laminated film. The stacked layer 126 may be laminated onto the glass substrate 120. For example, a rolling laminator or an automatic cutter followed by a rubber press may be used. In an embodiment, the stacked layer 126 may also cover at least a portion of the frame 110. That is, the stacked layer 126 may extend across the gap 125. As shown, the stacked layer 126 may not be as wide as the frame 110. Therefore, space may be available for manufacturing equipment to hold the hybrid panel 100 in place. For example, in some operations, molding processes may clamp the edges of the hybrid panel 100.

[0039] Now for reference Figure 1DThis image shows a cross-sectional view of a hybrid panel 100 after a reinforcing strip 128 has been applied over a stacked layer 126 according to an embodiment. In this embodiment, the reinforcing strip 128 may comprise a material having a high-strength surface layer. For example, the reinforcing strip 128 may comprise a glass cloth prepreg, resin-coated copper (RCC), or any other resin bonded to the high-strength surface layer. In this embodiment, the reinforcing strip 128 may be applied around the periphery of a glass substrate 120. For example, Figure 1D Four reinforcing bands 128 are shown (e.g., two reinforcing bands 128 on the top surface and two reinforcing bands 128 on the bottom surface).

[0040] Although Figure 1D Multiple discrete reinforcing strips 128 are shown, but it should be understood that a single reinforcing strip 128 may be provided on each surface. For example, the reinforcing strip 128 may be a continuous loop extending around the outer periphery of the glass substrate 120. As shown, the reinforcing strip 128 has a width that allows the reinforcing strip 128 to be positioned above both the frame 110 and the glass substrate 120. That is, the reinforcing strip 128 extends across (or across) the gap 125 between the frame 110 and the glass substrate 120.

[0041] Now for reference Figure 1E The figure shows a cross-sectional view of the hybrid panel 100 after a compression molding process according to an embodiment. As shown, compression molding forces the reinforcing strip 128 toward the surfaces of the glass substrate 120 and the frame 110. The reinforcing strip 128 may be at least partially embedded within the stacked layer 126. Additionally, the compression molding process may cause the stacked layer 126 to at least partially fill the gap 125 between the frame 110 and the glass substrate 120. Figure 1E As shown, the edge 129 of the stacked layer 126 is set back from the edge 119 of the frame 110. This allows space to clamp the frame 110 during one or more processing operations.

[0042] Therefore, the hybrid panel 100 is formed with a glass substrate 120 firmly coupled to the frame 110. Furthermore, the reinforcing strip 128 increases the mechanical reliability of the joint across the gap 125. For example, depending on the material composition, placement, etc., of the reinforcing strip 128, the presence of the reinforcing strip 128 can reduce interfacial stress by up to approximately 40% or more.

[0043] Now for reference Figure 2A and Figure 2B The accompanying diagram shows a pair of cross-sectional views depicting an alternative construction of the hybrid panel 200 according to an additional embodiment.

[0044] Now for reference Figure 2A A cross-sectional view of a hybrid panel 200 according to an embodiment is shown. Besides the glass substrate 220, Figure 2AThe hybrid panel 200 in the middle can be similar to Figure 1E Hybrid panel 100. For example, hybrid panel 200 may include a frame 210 (having organic layers 212 and 214) bonded to a glass substrate 220 via a stacked layer 226. A reinforcing strip 228 may also be provided across a gap 225 between the frame 210 and the glass substrate 220.

[0045] However, in addition to the vias 222 and pads 221 on the glass substrate 220, a cavity 227 can be provided through the glass substrate 220. During a compression molding process for compressing the reinforcing strip 228 against the glass substrate 220, the cavity 227 may be filled with a stacked layer 226. The cavity 227 can be used for any suitable purpose. In some embodiments, the cavity 227 can provide a location for embedding one or more components (e.g., passive components, active components, etc.) within the glass substrate 220.

[0046] Now for reference Figure 2B A cross-sectional view of the hybrid panel 200 according to an additional embodiment is shown. In this embodiment, in addition to the material used for the reinforcing strip 228, Figure 2B The hybrid panel 200 is similar to Figure 1E The mixing panel 100 in the example. Figure 2B The reinforcing strip 228 can be made of a completely metallic material, such as copper strip. The use of a higher strength material for the reinforcing strip 228 can further improve stress reduction at the joint across the gap 225.

[0047] Now for reference Figure 3 A flowchart of process 360 for forming a hybrid panel according to an embodiment is shown. The hybrid panel manufactured using process 360 can be similar to that described above. Figure 1A-1E and / or Figure 2A-2B A hybrid panel described in more detail. In an embodiment, process 360 may begin with operation 361, which includes providing a frame around a substrate comprising glass. In an embodiment, the frame comprises an organic dielectric material. A gap may be provided between the outer edge of the substrate and the inner edge of the frame.

[0048] In an embodiment, process 360 may proceed to operation 362, which includes applying a dielectric layer over the surface of the substrate and a portion of the frame. The dielectric layer may span the gap between the substrate and the frame. In an embodiment, the dielectric layer may be a deposited film or the like. In some cases, the dielectric layer may be referred to as a buffer layer. The dielectric layer may be applied using a lamination process or the like.

[0049] In an embodiment, process 360 can proceed to operation 363, which includes applying a reinforcing strip over the dielectric layer. The reinforcing strip may span the gap between the frame and the substrate. In an embodiment, the reinforcing strip may comprise any material having a high-strength surface layer. For example, the reinforcing strip may comprise a glass cloth prepreg, RCC, or any other resin bonded to a high-strength surface layer.

[0050] In one embodiment, process 360 may proceed to operation 364, which includes pressing the reinforcement strip into the dielectric layer. In another embodiment, the reinforcement strip is pressed down until it contacts the frame and / or substrate. Pressing may also cause the dielectric layer to at least partially fill the gap between the frame and the substrate. The pressing process may be part of a compression molding process, etc.

[0051] Now for reference Figures 4A-4F The illustration shows a series of cross-sectional views depicting a process for forming a hybrid panel 400 having a glass substrate 420 and an organic frame 410 according to an embodiment.

[0052] Now for reference Figure 4A A cross-sectional view of a hybrid panel 400 in a manufacturing state according to an embodiment is shown. In the embodiment, the hybrid panel 400 may be similar to the above-described... Figure 1B Hybrid panel 100 is described. For example, hybrid panel 400 includes a glass substrate 420, which may be similar to any glass substrate described in more detail herein. Glass substrate 420 may be surrounded by frame 410. Frame 410 may include an organic layer 412. Organic layer 412 may include epoxy resin, resin, or other polymeric materials. In some embodiments, glass fiber, inorganic particles, etc., may be used to reinforce organic layer 412. In embodiments, layer 414 may be disposed above and / or below organic layer 412. For example, layer 414 may include copper, etc. In embodiments, the outer edge of frame 410 may be larger than a standard panel size (or a quarter panel size). The larger shape factor allows for trimming in subsequent processing operations.

[0053] In an embodiment, the glass substrate 420 may include one or more vias 422 extending through the thickness of the glass substrate 420. The vias 422 may have tapered sidewalls or any other suitable profile. Pads 421 may be disposed above and / or below the vias 422. The glass substrate 420 may have an SSP form factor. Therefore, the glass substrate 420 may accommodate multiple devices (not shown separately) all within the same glass substrate 420.

[0054] In one embodiment, the outer edge of the glass substrate 420 may be spaced apart from the inner edge of the frame 410 by a gap 425. The gap 425 may be up to about 50 μm, about 100 μm, or about 500 μm. However, larger gaps 425 may also be used in some embodiments. For example, in some embodiments, gaps 425 up to about 10 mm may also be used.

[0055] Now for reference Figure 4B This illustration shows a cross-sectional view of a hybrid panel 400 after a stacked layer 426 has been provided over the top and bottom surfaces of a glass substrate 420, according to an embodiment. The stacked layer 426 may include an organic material, such as a deposited film. The stacked layer 426 may be laminated onto the glass substrate 420 using any suitable process, such as those described in more detail herein. In an embodiment, the stacked layer 426 may also cover at least a portion of the frame 410. That is, the stacked layer 426 may extend across the gap 425. As shown, the stacked layer 426 may not be as wide as the frame 410. Therefore, space may be available for manufacturing equipment to hold the hybrid panel 400 in place. For example, in some operations, molding processes may clamp the edges of the hybrid panel 400.

[0056] Now for reference Figure 4C This illustration shows a cross-sectional view of a hybrid panel 400 after a reinforcing strip 428 has been applied over a stacked layer 426 according to an embodiment. In this embodiment, the reinforcing strip 428 may comprise a material having a high-strength surface layer, such as any reinforcing strip 428 material described in more detail herein. In this embodiment, the reinforcing strip 428 may be applied around the periphery of a glass substrate 420. For example, Figure 4C Four reinforcing bands 428 are shown (e.g., two reinforcing bands 428 on the top surface and two reinforcing bands 428 on the bottom surface).

[0057] Although Figure 4C Multiple discrete reinforcing strips 428 are shown, but it should be understood that a single reinforcing strip 428 may be provided on each surface. For example, the reinforcing strip 428 may be a continuous loop extending around the outer periphery of the glass substrate 420. As shown, the reinforcing strip 428 has a width that allows the reinforcing strip 428 to be positioned above both the frame 410 and the glass substrate 420. That is, the reinforcing strip 428 extends across (or across) the gap 425 between the frame 410 and the glass substrate 420.

[0058] Now for reference Figure 4DThe figure shows a cross-sectional view of the hybrid panel 400 after a compression molding process according to an embodiment. As shown, compression molding forces the reinforcing strip 428 toward the surfaces of the glass substrate 420 and the frame 410. The reinforcing strip 428 may be at least partially embedded within the stacked layer 426. Additionally, the compression molding process may cause the stacked layer 426 to at least partially fill the gap 425 between the frame 410 and the glass substrate 420.

[0059] Now for reference Figure 4E A cross-sectional view of a hybrid panel 400 with a highlighted trimming line 411 according to an embodiment is shown. As shown, the trimming line 411 passes through the frame 410 and the reinforcing strip 428. In this embodiment, the hybrid panel 400 is trimmed along the trimming line 411 to produce... Figure 4F The hybrid panel 400 is shown. As illustrated, the outer edge 419 of the frame 410 is substantially coplanar with the outer edge 429 of the reinforcing strip 428 due to a single trimming process used to remove the outer edge of the frame 410 (and a portion of the reinforcing strip 428). The trimmed hybrid panel 400 can have a standard panel shape factor or a standard quarter panel shape factor. The trimming process allows for the formation of a flush surface, which can be beneficial for subsequent processing. Additionally, trimming allows for a wider reinforcing strip without concerns about bleed-out, and the reinforcing strip can cover the entire remaining top and / or bottom surface of the frame 410. Higher surface coverage provides improved stress reduction.

[0060] Now for reference Figure 5 A flowchart of process 570 for forming a hybrid panel according to an embodiment is shown. The hybrid panel manufactured using process 570 can be similar to that described above. Figures 4A-4F The hybrid panel 400 is described in more detail. In an embodiment, process 570 may begin with operation 571, which includes providing a frame around a substrate comprising glass. In an embodiment, the frame comprises an organic dielectric material. A gap may be provided between the outer edge of the substrate and the inner edge of the frame.

[0061] In an embodiment, process 570 can proceed to operation 572, which includes applying a dielectric layer over the surface of the substrate and a portion of the frame. The dielectric layer may span the gap between the substrate and the frame. In an embodiment, the dielectric layer may be a deposited film or the like. In some cases, the dielectric layer may be referred to as a buffer layer. The dielectric layer may be applied using a lamination process or the like.

[0062] In an embodiment, process 570 can proceed to operation 573, which includes applying a reinforcing strip over the dielectric layer. The reinforcing strip may span the gap between the frame and the substrate. In an embodiment, the reinforcing strip may comprise any material having a high-strength surface layer. For example, the reinforcing strip may comprise a glass cloth prepreg, RCC, or any other resin bonded to a high-strength surface layer.

[0063] In one embodiment, process 570 may proceed to operation 574, which includes pressing the reinforcement strip into the dielectric layer. In another embodiment, the reinforcement strip is pressed down until it contacts the frame and / or substrate. Pressing may also cause the dielectric layer to at least partially fill the gap between the frame and the substrate. The pressing process may be part of a compression molding process or the like.

[0064] In an embodiment, process 570 can proceed to operation 575, which includes trimming the reinforcing strip and the frame such that the outer edge of the frame is substantially coplanar with the outer edge of the reinforcing strip. As used herein, “substantially coplanar” can refer to two surfaces oriented at an angle of up to 5° relative to each other. More generally, substantially coplanar surfaces can be formed when a single linear cut (e.g., mechanical, laser, plasma, etc.) is made through two layers. In such an embodiment, the surfaces of the two layers exposed by the single linear cut will be substantially coplanar.

[0065] In the above embodiments, a hybrid panel for a full-panel assembly or a quarter-panel assembly is shown. However, it should be understood that other embodiments described herein may also include hybrid panels as reconfigurable panels. In reconfigurable panel embodiments, one or more glass substrate sheets are embedded in a dielectric layer surrounded by a frame (such as an organic frame). In such embodiments, the geometry of the reconfigurable panel can vary significantly in size as needed. For example, reconfigurable panels ranging from tens of millimeters per edge to hundreds of millimeters per edge can be achieved. Subsequently slicing the reconfigurable panel into units or smaller reconfigurable portions may only require cutting through the dielectric material rather than the glass, making the cutting easier. Furthermore, the resulting units or smaller reconfigurable portions will still retain the dielectric material on the sidewalls of the glass to provide additional downstream protection for the glass core.

[0066] Now for reference Figures 6A-6C This illustrates a series of different reconfigurable hybrid panels 600 according to various embodiments.

[0067] exist Figure 6AIn this embodiment, the reconstructed hybrid panel 600 includes a frame 610 surrounding a plurality of glass substrates 620. The glass substrates 620 may be embedded in a dielectric layer 626, such as a deposited film, epoxy resin, molding material, etc. That is, the glass substrates 620 may be spaced apart from each other, and the dielectric layer 626 fills the gaps between the glass substrates 620. In embodiments, the frame 610 may include an organic dielectric material. The frame 610 may be similar to any frame described in more detail herein. Figure 6A In this embodiment, multiple glass substrates 620 can each be an individual unit. That is, each glass substrate 620 can ultimately be monolithically cut into cores for different packaging substrates. The material composition and / or structure of the glass substrates 620 can be similar to any glass substrate described in more detail herein.

[0068] exist Figure 6B The image shows a reconstructed hybrid panel 600 with a quarter-panel design. As shown, each glass substrate 620 can include a quarter-panel shape factor. In the case of the quarter-panel glass substrate 620, the quarter-panel can ultimately be monocut into smaller units. Figure 6C In this configuration, the reconstructed hybrid panel 600 includes a single panel shape factor glass substrate 620. This reconstructed hybrid panel 600 may have a glass substrate 620 having an SSP shape factor to accommodate a frame 610.

[0069] Now for reference Figures 7A-7E The illustration shows a series of cross-sectional views depicting the process for forming unit 750 from reconstructed hybrid panel 700 according to an embodiment.

[0070] Now for reference Figure 7A A cross-sectional view of a reconstructed hybrid panel 700 in the manufacturing stage according to an embodiment is shown. As shown, a frame 710 may surround a portion of a glass substrate 720. Each glass substrate 720 may include a glass core for single-cutting a single unit 750 from the reconstructed hybrid panel 700. In the illustrated embodiment, each glass substrate 720 is surrounded by a frame 710. However, other embodiments may include glass substrates 720 adjacent to each other without a portion of the frame 710 between them (e.g., similar to...). Figure 6A (Example shown). In this embodiment, the sidewalls of the glass substrate 720 may be spaced apart from the sidewalls of the frame 710 by a gap 725. The glass substrate 720 may be similar to any glass substrate described in more detail herein, and the frame 710 may be similar to any frame described in more detail herein.

[0071] Now for reference Figure 7BThe diagram shows a cross-sectional view of a hybrid panel 700 reconstructed after a reconstruction layer has been applied to the top and bottom surfaces of the frame 710 and the glass substrate 720. In the illustrated embodiment, the reconstruction layer includes a dielectric layer 726 and a metal layer 727 situated above the dielectric layer 726. For example, the reconstruction layer may include an RCC layer. However, any suitable molding material, epoxy resin, etc., can be used for the reconstruction layer.

[0072] Now for reference Figure 7C The illustration shows a cross-sectional view of a reconfigured hybrid panel 700 after a pressing process and lamination of the stacked layer 729, according to an embodiment. The pressing process may include molding processes, etc. During the pressing process, a dielectric layer 726 is pressed into a gap 725. The stacked layer 729 may be applied using a lamination process, etc. In the illustrated embodiment, the dielectric layer 726 and the stacked layer 729 are shown with the same shade. However, in other embodiments, the dielectric layer 726 and the stacked layer 729 may include different materials. After the pressing process, any number of stacked layers 729 (and associated electrical wiring) may be provided on and / or under the reconfigured hybrid panel 700. That is, each package unit can be fabricated at the panel level to improve HVM efficiency.

[0073] Now for reference Figure 7D The image shows a cross-sectional view of a reconstructed hybrid panel 700 with the illustrated dicing line 711 according to an embodiment. In this embodiment, the dicing line 711 is provided adjacent to the glass substrate 720. More specifically, the dicing line 711 passes through a gap 725. Therefore, subsequent cutting processes (e.g., mechanical, laser, plasma, etc.) do not need to pass through any glass.

[0074] Now for reference Figure 7E The figure shows a cross-sectional view of a single-cut cell 750 from a reconstructed hybrid panel 700 according to an embodiment. As shown, the glass substrate 720 includes a first surface 751, a second surface 752, and a sidewall surface 753. Furthermore, all surfaces 751-753 are covered by a dielectric layer 726. Therefore, the glass substrate 720 (which may be referred to as a glass core) is protected along all surfaces during any further downstream processing.

[0075] Now for reference Figures 8A-8C The illustration shows a series of cross-sectional views depicting an alternative process for forming a single-cut cell 850 from a reconstructed hybrid panel 800, according to an embodiment.

[0076] Now for reference Figure 8AA cross-sectional view of a reconstructed hybrid panel 800 having a reconstructed layer applied over a frame 810 and a glass substrate 820, according to an embodiment, is shown. The reconstructed layer may include a dielectric layer 826 and a metal layer 827. However, instead of leaving a blanket of metal layer 827 across the dielectric layer 826, portions of the metal layer 827 have been removed using an etching process. Removal of portions of the metal layer 827 allows for easier electrical access to vias (not shown) that can be formed through the glass substrate 820. In the illustrated embodiment, the metal layer 827 is patterned before the dielectric layer 826 is pressed into the gap 825. However, in other embodiments, the dielectric layer 826 may be pressed into the gap 825 before the metal layer 827 is patterned.

[0077] Now for reference Figure 8B The diagram shows a cross-sectional view of a reconstructed hybrid panel 800 after a pressing operation to fill gap 825 and subsequent lamination of stacked layers 829, according to an embodiment. A cut line 811 is also shown. Similar to the embodiment described above, the cut line 811 does not need to penetrate any glass.

[0078] Now for reference Figure 8C The figure shows a cross-sectional view of a single-cut cell 850 from a reconstructed hybrid panel 800 according to an embodiment. As shown, the glass substrate 820 includes a first surface 851, a second surface 852, and a sidewall surface 853. Furthermore, all surfaces 851-853 are covered by a dielectric layer 826. Therefore, the glass substrate 820 (which may be referred to as a glass core) is protected along all surfaces during any further downstream processing. Additionally, the cell 850 may include the remainder of a metal layer 827. Due to the use of a single linear cut, the remainder of the metal layer 827 may have edge surfaces substantially coplanar with the edge surfaces of the dielectric layer 826. Opposite edges of the remainder of the metal layer 827 may lie within the covered area of ​​the glass substrate 820. That is, in some embodiments, the remainder of the metal layer 827 does not extend across the entire width of the glass substrate 820. In embodiments, the remainder of the metal layer 827 may be electrically floating. That is, the remainder of the metal layer 827 may not be directly contacted by other conductive features within the cell 850.

[0079] Now for reference Figure 9 A flowchart of process 980 for forming a reconstructed hybrid panel unit according to an embodiment is shown. In an embodiment, process 980 may begin with operation 981, which includes providing a frame around a substrate comprising glass. In an embodiment, the frame comprises an organic dielectric material, similar to any frame described in more detail herein. The substrate may be similar to any glass substrate described in more detail herein. In an embodiment, a gap is provided between the outer edge of the substrate and the inner edge of the frame.

[0080] In an embodiment, process 980 can proceed to operation 982, which includes applying RCC (or other dielectric material) over the frame and substrate. In an embodiment, RCC can be applied using a lamination process or the like.

[0081] In one embodiment, process 980 can proceed to operation 983, which includes pressing the RCC onto the substrate and the frame. In another embodiment, the pressing process utilizes the resin of the RCC to at least partially fill the gaps. In yet another embodiment, the pressing process may be part of a molding process or the like.

[0082] In one embodiment, process 980 can proceed to operation 984, which includes slicing the substrate from the frame. In another embodiment, a portion of the RCC resin is held along the top, bottom, and sidewall surfaces of the substrate. The apparatus may be similar to apparatus unit 750 or 850, which is described in more detail herein.

[0083] Now for reference Figure 10 This diagram illustrates a cross-sectional view of device 1050 according to an embodiment. In this embodiment, device 1050 may be formed from a reconfigured hybrid framework using a process similar to process 980, which is described in more detail herein. In this embodiment, device 1050 may sometimes be referred to as a package substrate, interposer, etc. In this embodiment, device 1050 may include a core 1020. In this embodiment, core 1020 includes a glass layer. The glass layer of core 1020 may be similar to any glass layer or glass substrate described in more detail herein. In some embodiments, via 1022 may extend through the thickness of core 1020, and pads 1021 may be provided above and / or below via 1022.

[0084] In this embodiment, a dielectric layer 1026 may be provided around the periphery of the core 1020. The dielectric layer 1026 may be a stacked material, epoxy resin, molding material, etc. The dielectric layer 1026 may form a ring around the periphery of the core 1020. For example, the dielectric layer 1026 may directly contact the top surface 1051, bottom surface 1052, and sidewall surface 1053 of the core 1020.

[0085] In an embodiment, a remainder of the metal layer 1027 may be provided above and / or below the dielectric layer 1026. The remainder of the metal layer 1027 may extend to the edge of the dielectric layer 1026. The remainder of the metal layer 1027 may also extend within the coverage area of ​​the core 1020. The remainder of the metal layer 1027 may be electrically floating. That is, the remainder of the metal layer 1027 may not be directly contacted by other circuitry within the device 1050.

[0086] In embodiments, device 1050 may further include one or more stacked layers 1029 above and / or below dielectric layer 1026. Electrical wiring 1033 (e.g., pads, vias, traces, etc.) may be embedded in and / or provided on one or more stacked layers 1029. In some embodiments, dielectric layer 1026 is a different material from one or more stacked layers 1029. However, in other embodiments, dielectric layer 1026 is the same material as one or more stacked layers 1029. When dielectric layer 1026 and stacked layers 1029 are the same material, the presence of the remaining portion of metal layer 1027 can serve as a separate buffer layer (i.e., dielectric layer 1026) providing an indication above and / or below core 1020.

[0087] Now for reference Figure 11 The image shows a cross-sectional view of an electronic system 1190 according to an embodiment. In this embodiment, the electronic system 1190 may include a board 1191, such as a printed circuit board (PCB), a motherboard, etc. In this embodiment, the board 1191 may be coupled to a package substrate 1150 via an interconnect 1192. The interconnect 1192 may be any suitable secondary interconnect (SLI), such as solder balls, sockets, pins, etc.

[0088] In an embodiment, the package substrate 1150 may include a core 1120. The core 1120 may be a glass core similar to any glass substrate or glass layer described in more detail herein. The glass core 1120 may include vias 1122 having pads 1121 above and / or below the vias 1122. In an embodiment, the glass core 1120 may be surrounded by a protective dielectric layer 1126. The dielectric layer 1126 may be provided on the top surface, bottom surface, and sidewall surfaces of the glass core 1120. In an embodiment, a residual metal layer 1127 may be provided above and / or below the dielectric layer 1126. The residual metal layer 1127 may extend to the edge of the package substrate 1150. In some embodiments, the residual metal layer 1127 may also extend within a covered area of ​​the glass core 1120. In an embodiment, a stacked layer having electrical wiring (e.g., pads, traces, vias, etc.) may be provided above and / or below the dielectric layer 1126.

[0089] In one embodiment, one or more dies 1195 are coupled to a package substrate 1150 via interconnects 1194. In another embodiment, interconnects 1194 may include any suitable first-level interconnect (FLI) architecture. For example, interconnects 1194 may include solder balls, copper bumps, hybrid bonding, etc. In another embodiment, one or more dies 1195 may include any type of die, such as processor (e.g., central processing unit (CPU), graphics processing unit (GPU), etc.), communication die, memory die, etc.

[0090] Figure 12 A computing device 1200 according to one embodiment of the present disclosure is shown. The computing device 1200 houses a board 1202. The board 1202 may include multiple components, including but not limited to a processor 1204 and at least one communication chip 1206. The processor 1204 is physically and electrically coupled to the board 1202. In some embodiments, at least one communication chip 1206 is also physically and electrically coupled to the board 1202. In a further embodiment, the communication chip 1206 is part of the processor 1204.

[0091] These other components include, but are not limited to, volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flash memory, graphics processors, digital signal processors, cryptographic processors, chipsets, antennas, displays, touchscreen displays, touchscreen controllers, batteries, audio codecs, video codecs, power amplifiers, global positioning system (GPS) devices, compasses, accelerometers, gyroscopes, speakers, cameras, and mass storage devices (such as hard disk drives, optical discs (CDs), digital multifunction discs (DVDs), etc.).

[0092] Communication chip 1206 implements wireless communication for transmitting data to and from computing device 1200 and computing system 1200. The term "wireless" and its derivatives can be used to describe circuits, devices, systems, methods, techniques, communication channels, etc., that can communicate data via a non-solid-state medium using modulated electromagnetic radiation. The term does not imply that associated devices do not contain any wires, although in some embodiments they may not contain any wires. Communication chip 1206 may implement any of several wireless standards or protocols, including (but not limited to) Wi-Fi (IEEE 802.11 series), WiMAX (IEEE 802.16 series), IEEE 802.20, LTE, Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, and derivatives thereof, as well as any other wireless protocols designated as 3G, 4G, 5G, and above. Computing device 1200 may include multiple communication chips 1206. For example, the first communication chip 1206 can be dedicated to short-range wireless communication, such as Wi-Fi and Bluetooth, and the second communication chip 1206 can be dedicated to long-range wireless communication, such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO and others.

[0093] The processor 1204 of the computing device 1200 includes an integrated circuit die packaged within the processor 1204. In some embodiments of this disclosure, the processor's integrated circuit die may be a portion of an electronic package including a package substrate having a glass core embedded in a dielectric layer, according to embodiments described herein. The term "processor" may refer to any device or portion of a device that processes electronic data from registers and / or memory to convert that electronic data into other electronic data that can be stored in registers and / or memory.

[0094] The communication chip 1206 also includes an integrated circuit die packaged within the communication chip 1206. According to another embodiment of this disclosure, the integrated circuit die of the communication chip may be part of an electronic package including a packaging substrate having a glass core embedded in a dielectric layer, as described herein.

[0095] In this embodiment, computing device 1200 may be part of any device. For example, computing device may be part of a personal computer, server, mobile device, tablet computer, automobile, etc. That is, computing device 1200 is not limited to use in any particular type of system, and computing device 1200 may be included in any device that can benefit from computing functionality.

[0096] The foregoing description of the embodiments shown in this disclosure (including those described in the abstract) is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. While specific embodiments and examples of this disclosure have been described herein for illustrative purposes, various equivalent modifications are possible within the scope of this disclosure, as will be recognized by those skilled in the art.

[0097] Based on the above detailed description, these modifications can be made to this disclosure. The terminology used in the appended claims should not be construed as limiting this disclosure to the specific embodiments disclosed in the specification and claims. Rather, the scope of this disclosure will be determined entirely by the appended claims, which will be interpreted in accordance with the established principles of claim interpretation.

[0098] Example 1: An apparatus comprising: a first layer having a first surface, a second surface, and a sidewall surface coupling the first surface to the second surface, wherein the first layer comprises a glass layer; a second layer on the first surface, the second surface, and the sidewall surface of the first layer, wherein the second layer is an organic dielectric material; and a third layer on the second layer, wherein the third layer is a metallic material, and wherein the edges of the third layer are substantially coplanar with the edges of the second layer.

[0099] Example 2: According to the apparatus of Example 1, wherein the second edge of the third layer opposite to the edge of the third layer is within the coverage area of ​​the first layer, and the edge of the third layer is substantially coplanar with the edge of the second layer.

[0100] Example 3: The apparatus according to Example 1 or Example 2, wherein the sidewall surface of the first layer is offset from the edge of the third layer.

[0101] Example 4: The apparatus according to Examples 1 to 3 further includes: a fourth layer on the second layer, wherein the third layer is above the first surface of the first layer and the fourth layer is below the second surface of the first layer, and wherein the fourth layer comprises the metallic material.

[0102] Example 5: The apparatus according to Example 4, wherein the edge of the fourth layer is substantially coplanar with the edge of the second layer.

[0103] Example 6: The apparatus according to Examples 1 to 5, wherein the third layer comprises copper.

[0104] Example 7: The apparatus according to Examples 1 to 6, wherein the second layer comprises resin.

[0105] Example 8: The apparatus according to Examples 1 to 7 further includes: a via through the thickness of the first layer.

[0106] Example 9: The apparatus according to Examples 1 to 8 further includes one or more organic stacked layers above the second layer and the third layer.

[0107] Example 10: The apparatus according to Example 9 further includes: a die coupled to the one or more organic stacked layers; and a plate coupled to the first layer.

[0108] Example 11: An apparatus comprising: a substrate, wherein the substrate includes a glass layer; a frame surrounding the substrate, wherein the frame includes a dielectric layer, and wherein a gap is provided between an outer edge of the substrate and an inner edge of the frame; a filling layer in the gap; and a reinforcing strip over the frame and the substrate, wherein the reinforcing strip is over the gap.

[0109] Example 12: The apparatus according to Example 11, wherein the reinforcing strip comprises a glass cloth prepreg material.

[0110] Example 13: The apparatus according to Example 11 or Example 12, wherein the reinforcing strip comprises copper.

[0111] Example 14: The apparatus according to Examples 11 to 13, wherein the edge of the reinforcing strip retracts rearward from the outer edge of the frame.

[0112] Example 15: The apparatus according to Examples 11 to 14, wherein the edge of the reinforcing strip is substantially coplanar with the outer edge of the frame.

[0113] Example 16: The apparatus according to Examples 11 to 15, wherein the substrate is a panel-level substrate, a quarter-panel-level substrate, or a unit-level substrate.

[0114] Example 17: A hybrid panel comprising: a substrate, wherein the substrate includes a glass layer; a frame surrounding a periphery of the substrate, wherein the frame includes a dielectric layer, and wherein a gap is provided between an inner edge of the frame and an outer edge of the substrate; a filler layer above and below the substrate and the frame, wherein the filler layer at least partially fills the gap; and a reinforcing strip across the gap, wherein the reinforcing strip is above both the substrate and the frame.

[0115] Example 18: The hybrid panel according to Example 17, wherein the reinforcing strip comprises a glass fiber prepreg or a copper layer.

[0116] Example 19: A hybrid panel according to Example 17 or Example 18, wherein the exterior of the frame is not covered by the filling layer.

[0117] Example 20: A hybrid panel according to Examples 17 to 19, wherein the edge of the reinforcing strip is substantially coplanar with the outer edge of the frame.

Claims

1. An apparatus comprising: a first layer having a first surface, a second surface, and a sidewall surface coupling the first surface to the second surface, wherein the first layer comprises a glass layer; a second layer on the first surface, the second surface, and the sidewall surface of the first layer, wherein the second layer is an organic dielectric material; and a third layer on the second layer, wherein the third layer is a metallic material, and wherein an edge of the third layer is substantially coplanar with an edge of the second layer.

2. The apparatus of claim 1, wherein, a second edge of the third layer opposite the edge of the third layer is within a footprint of the first layer, the edge of the third layer being substantially coplanar with the edge of the second layer.

3. The apparatus of claim 1 or 2, wherein, the sidewall surface of the first layer is offset from the edge of the third layer.

4. The apparatus of claim 1 or 2, further comprising: a fourth layer on the second layer, wherein the third layer is over the first surface of the first layer and the fourth layer is under the second surface of the first layer, and wherein the fourth layer comprises the metallic material.

5. The apparatus of claim 4, wherein, an edge of the fourth layer is substantially coplanar with the edge of the second layer.

6. The apparatus of claim 1 or 2, wherein, the third layer comprises copper.

7. The apparatus of claim 1 or 2, wherein, the second layer comprises a resin.

8. The apparatus of claim 1 or 2, further comprising: a via through a thickness of the first layer.

9. The apparatus of claim 1 or 2, further comprising: one or more organic build-up layers over the second layer and the third layer.

10. The apparatus of claim 9, further comprising: a die coupled to the one or more organic build-up layers; and a board coupled to the first layer.

11. An apparatus comprising: a substrate, wherein the substrate comprises a glass layer; a frame surrounding the substrate, wherein the frame comprises a dielectric layer, and wherein a gap is provided between an outer edge of the substrate and an inner edge of the frame; a fill layer in the gap; and a reinforcement tape over the frame and the substrate, wherein the reinforcement tape is over the gap.

12. The apparatus of claim 11, wherein, the reinforcement tape comprises a glass cloth prepreg.

13. The apparatus of claim 11 or 12, wherein, the reinforcement tape comprises copper.

14. The apparatus of claim 11 or 12, wherein, an edge of the reinforcement tape is set back from an outer edge of the frame.

15. The apparatus of claim 11 or 12, wherein, an edge of the reinforcement tape is substantially coplanar with an outer edge of the frame.

16. The apparatus of claim 11 or 12, wherein, the substrate is a panel-level substrate, a quarter-panel-level substrate, or a unit-level substrate.

17. A hybrid panel comprising: a substrate, wherein the substrate comprises a glass layer; a frame surrounding a perimeter of the substrate, wherein the frame comprises a dielectric layer, and wherein a gap is provided between an inner edge of the frame and an outer edge of the substrate; a fill layer over and under the substrate and the frame, wherein the fill layer at least partially fills the gap; and a reinforcement tape across the gap, and wherein the reinforcement tape is over both the substrate and the frame.

18. The hybrid panel of claim 17, wherein, the reinforcement tape comprises a glass fiber prepreg or a copper layer.

19. The hybrid panel according to claim 17 or 18, wherein, an outer portion of the frame is not covered by the fill layer.

20. The hybrid panel according to claim 17 or 18, wherein, an edge of the reinforcement tape is substantially coplanar with an outer edge of the frame.

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